PCB (Printed Circuit Board) support plate defect detecting and marking system

Abstract

The invention provides a PCB carrier plate defect detection and marking system, the PCB carrier plate comprises a to-be-detected area and a waste area, x * y to-be-detected single particles are arranged in the to-be-detected area in an array, the PCB carrier plate defect detection and marking system comprises a code printing module, the code printing module is used for printing identification codes in the waste area of the PCB carrier plate, and the code printing module is used for printing the identification codes in the waste area of the PCB carrier plate; the identification code at least records the number of the PCB support plate and the number of the single to-be-detected pieces in the x direction and the y direction; the detection module at least comprises two defect detection devices which are respectively used for detecting different defects of the to-be-detected single particle; the storage module can store the information of the to-be-detected single piece recorded by the identification code and acquire all defect data uploaded by the detection module to generate a defect mark general table; and the conveying module is at least used for conveying the PCB carrier plates between the code printing module and the detection devices included in the detection module.

Description

Technical Field

[0001] This invention belongs to the field of PCB substrate manufacturing technology, and in particular relates to a PCB substrate defect detection and marking system. Background Technology

[0002] After PCB substrate production is completed, it is shipped in units of "sheets." A single PCB substrate contains multiple individual components (i.e., a circuit unit board that can be used independently). After the sheet substrate passes through the forming and sorting station, it sequentially enters multiple finished product inspection stations for defect detection. For example, it passes through electrical testing machines, AVI automatic inspection machines, and 3D Bump inspection machines to detect defects in all individual components within the substrate. If a defective component is detected at each inspection station, it will be marked accordingly. Finally, before shipment, a laser marking machine will be used according to customer requirements to identify defective components based on the previous markings and mark them uniformly with a specific image so that customers can distinguish defective products. Different inspection equipment records defects in different ways. For example, when an electrical testing machine detects a defective component, it will use its built-in CO2 laser marking machine to mark it at a fixed position. During visual inspection, it is necessary to manually draw an "X" at a fixed position with a needle-tip marking pen. However, this marking process requires careful attention during manual marking. Not only must the surface solder mask layer of the PCB substrate be broken to expose the underlying white tissue or copper, so that it can be identified during subsequent unified marking, but the marks from both laser marking and manual marking vary in depth and size. When marking the marks uniformly at the end, parameters need to be repeatedly adjusted to accommodate the differences in solder mask grayscale between different batches. If the parameters are not adjusted properly, there is a risk of missing markings of defective individual chips, leading to abnormalities for the customer. Summary of the Invention

[0003] In view of the problems existing in the prior art, the main objective of the present invention is to provide a PCB carrier board defect detection and marking system that does not require the use of other tools to mark any single chip to be inspected on the PCB carrier board. The defect data is directly stored in the storage module, which has strong traceability and facilitates retrieval and retrieval in subsequent processes. At the same time, it does not cause physical damage to the PCB carrier board and also improves work efficiency.

[0004] The objective of this invention is achieved through the following technical solution: This invention provides a PCB carrier board defect detection and marking system. The PCB carrier board includes an inspection area and a scrap area. The inspection area has x*y individual chips arranged in an array. The PCB carrier board defect detection and marking system includes: A coding module is used to print identification codes in the waste area of ​​the PCB carrier board. The identification codes record at least the number of the PCB carrier board and the number of individual chips to be inspected in the x-direction and the y-direction. The detection module includes at least two defect detection devices, which are used to detect different defects in the single piece to be inspected. The storage module can store the information of the single piece to be inspected recorded by the identification code, and obtain all defect data uploaded by the detection module to generate a defect mark summary table. A transfer module, which is at least used to transfer the PCB carrier between the various detection devices included in the marking module and the detection module.

[0005] As a further description of the above technical solution, the defect detection device includes an electrical testing machine, an AVI visual inspection machine, and a 3D Bump inspection machine.

[0006] As a further description of the above technical solution, each of the defect detection devices is equipped with a data acquisition unit. Before performing defect detection on the single chip to be inspected, the data acquisition unit collects the arrangement direction and number of the single chips to be inspected on the PCB carrier in real time, and compares them with the information of the single chip to be inspected recorded in the identification code stored in the storage module. If the comparison results are consistent, the defect detection device will perform defect detection on the single piece to be inspected. If the comparison results are inconsistent, the defect detection device will stop and issue an alarm.

[0007] As a further description of the above technical solution, the defect detection device performs defect detection on the individual chip to be inspected on the PCB carrier, and uploads the defective chip to the storage module in the form of coordinates.

[0008] As a further description of the above technical solution, the defect data uploaded by any of the detection modules to the storage module do not overwrite or eliminate each other.

[0009] As a further description of the above technical solution, when the upstream defect detection device detects a defect in a single piece to be inspected, the downstream defect detection device skips the defect detection of that single piece.

[0010] As a further description of the above technical solution, the storage module receives the defect detection data of the single chip to be inspected that has defects on the PCB carrier board, compares it with the first defect threshold corresponding to each defect detection device, and stores the comparison result. The defect detection device uploads the defect data to the storage module and accumulates it; when the accumulated data exceeds the second defect threshold preset by the storage module, the defect detection device stops and issues an alarm.

[0011] As a further description of the above technical solution, it also includes a marking module, which is used to uniformly mark the defective individual particles to be inspected according to the defect marking summary table.

[0012] As a further description of the above technical solution, the marking module uses laser etching to uniformly mark the defective individual particles to be inspected.

[0013] As a further description of the above technical solution, the identification code is a Data Matrix code.

[0014] By employing the above technical solutions, the outstanding effects of this invention are as follows: The PCB carrier board defect detection and marking system provided by this invention includes a marking module, a detection module, a storage module, and a conveying module. Before the PCB carrier board is shipped, the marking module first prints identification codes on the scrap area of ​​the PCB carrier board. The identification codes record at least the PCB carrier board number and the number of individual chips to be inspected in the x-direction and y-direction. Then, the conveying module transports the marked PCB carrier board to the detection module for defect detection. The detection module includes at least two defect detection devices to detect different defects in the individual chips to be inspected. The storage module stores the information of the individual chips to be inspected recorded in the identification codes and obtains the defect data uploaded by the detection module to generate a defect marking summary table. Therefore, there is no need to use other tools to mark any individual chip to be inspected on the PCB carrier board for defects. The defect data is directly stored in the storage module, which has strong traceability and facilitates retrieval and retrieval in subsequent processes. At the same time, it does not cause physical damage to the PCB carrier board and improves work efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the PCB carrier board in an embodiment of the present invention; Figure 2 This is a partial structural diagram of the PCB carrier board defect detection and marking system in an embodiment of the present invention.

[0016] Explanation of icon numbers: 1. PCB carrier board; 11. Inspection area; 12. Scrap area; 2. Single chip; 3. Identification code; 4. Storage module; 5. Defect detection device; 6. Identification point. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be noted that the terms "upper," "middle," "lower," "inner," "outer," "front," "rear," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The embodiments of this invention will now be described according to its overall structure.

[0019] Please see Figures 1 to 2 This embodiment discloses a PCB carrier board defect detection and marking system. The PCB carrier board 1 includes an inspection area 11 and a scrap area 12. The inspection area 11 has x*y individual chips 2 to be inspected arranged in an array. The PCB carrier board defect detection and marking system includes: The coding module is used to print identification code 3 in the waste area 12 of the PCB carrier board 1. The identification code 3 records at least the number of the PCB carrier board 1 and the number of the single piece 2 to be inspected in the x direction and the number in the y direction. The detection module includes at least two defect detection devices 5, which are used to detect different defects in the single piece 2 to be inspected. Storage module 4, which can store the information of the single piece 2 to be inspected recorded in the identification code 3, and obtain all defect data uploaded by the detection module to generate a defect mark summary table; A transmission module, which is at least used to transmit the PCB carrier board 1 between the marking module and the various detection devices included in the detection module.

[0020] In the above configuration, the PCB carrier board 1 still includes an inspection area 11 and a scrap area 12. The individual chips 2 to be inspected in the inspection area 11 are arranged in an x*y array. Before the inspection operation, the marking module can first print an identification code 3 on the scrap area 12 of the PCB carrier board 1. The identification code 3 records at least the number of the PCB carrier board 1 and the number of individual chips 2 to be inspected in the x direction and the y direction. Then, the conveying module conveys the marked PCB carrier board 1 to the inspection module for defect detection. The inspection module includes at least two defect detection devices 5 to detect different defects of the individual chips 2 to be inspected. The storage module 4 is used to store the information of the individual chips 2 to be inspected recorded by the identification code and to obtain the defect data uploaded by the inspection module to generate a defect marking summary table. Therefore, without the need for other tools to mark any defect on any single chip 2 to be inspected on the PCB carrier 1, the defect data is directly stored in the storage module 4, which has strong traceability and is convenient for subsequent processes to find and call. At the same time, it will not cause physical damage to the PCB carrier 1 and also improves work efficiency.

[0021] Please see Figure 1Specifically, in this embodiment, the PCB carrier 1 includes an inspection area 11 and a waste area 12 surrounding the inspection area 11. The inspection area 11 has 12*4 individual components 2 to be inspected arranged in an array. Before performing defect detection on all individual components 2 to be inspected, identification codes 3 can be printed on the waste area 12 using the coding module. The identification codes 3 are unique and identifiable, for example, DataMatrix codes. The reason for using DataMatrix codes as identification codes 3 is that their physical form is small, and they can provide high-density data in a very small size, making them more suitable for marking individual product components under limited space conditions. Of course, in other embodiments, other types of identification codes 3 can also be used. Furthermore, the identification code 3 printed on a PCB carrier 1 can correspondingly record the batch number of the PCB carrier 1, its number in this batch, and the necessary information such as the number of all individual components 2 to be inspected in the x-direction and the number in the y-direction. It can be set to include other information according to actual needs. More specifically, when feeding the entire substrate (to be formed into multiple PCB carrier boards 1), a laser drilling machine can be used to engrave a pre-identification code containing the batch number and piece number in the waste area 12 corresponding to each PCB carrier board 1. After forming a solder resist layer on the copper foil surface, a laser marking machine can be used to integrate the bar number information into the pre-identification code to form an identification code 3, which is then stamped on the solder resist layer surface of the waste area 12 of the PCB carrier board 1. In addition, at least three marking points 6 can be set on the waste area 12 (located at the upper left corner, lower left corner, and lower right corner of the waste area 12 of each PCB carrier board 1, respectively), so as to establish a coordinate system for the individual test pieces 2 subsequently formed on each PCB carrier board 1 and arranged in an array, thereby making it easier to convert the position data of the individual test pieces 2 arranged in an array into coordinates. For example, in this embodiment, eight identical marker points 6 are set on the waste area 12: three marker points 6 are equidistantly arranged on both sides of the width direction of the inspection area 11, and three marker points 6 are equidistantly arranged on both sides of the length direction. The marker points 6 at the corners overlap, so a total of eight marker points 6 are provided in the waste area 12 surrounding the inspection area 11. The distance between each marker point 6 and the inspection area 11 is greater than 4 mm. It should be understood that the distance between two adjacent marker points 6 can be adaptively adjusted according to the length and width specifications of the PCB substrate. The marker points 6 can be formed simultaneously with the exposure and etching process during substrate production, and then the solder resist layer is exposed and developed to remove the ink. Each marker point 6 can be, for example, a circle of 1.6 mm ± 0.1 mm. There should be no other interfering designs (such as solder pads, copper foil, silkscreen, etc.) within 4 mm around it to form a perimeter clearance area to ensure that it can be effectively identified and assist in establishing a coordinate system. Specifically, it can also be surface-plated with gold to create a high contrast with the surrounding matte dark green solder mask layer for easy identification.Meanwhile, the design of the marker point 6 can also confirm whether the PCB carrier board 1 is misaligned during the inspection process, and whether the front and back sides are incorrect.

[0022] Specifically, in this embodiment, both the coding module and the detection module are communicatively connected to the storage module 4. Thus, the identification code 3 printed by the coding module and the defect data detected by the detection module can be uploaded to the storage module 4 for storage. Before the detection module performs defect detection on a single PCB substrate 1, it can also download the identification code 3 information from the storage module 4 to verify whether the identification code 3 information of the PCB substrate 1 sent to the detection module is consistent with it, thereby determining whether it is the PCB substrate 1 to be detected this time.

[0023] Please see Figure 2 Specifically, in this embodiment, the defect detection device 5 includes, but is not limited to, an electrical testing machine, an AVI visual inspection machine, and a 3D Bump inspection machine, which can respectively perform different types of defect detection on the individual chip 2 to be inspected on the PCB carrier board 1. The electrical testing machine is used to detect defects such as short circuits and open circuits on the individual chip 2 to be inspected; the AVI visual inspection machine is used to inspect the appearance of the individual chip 2 to be inspected; and the 3D Bump inspection machine is used to inspect the bumps (including the diameter, height, and coplanarity of the bumps) on the individual chip 2 to be inspected.

[0024] Specifically, in this embodiment, each of the defect detection devices 5 is equipped with a data acquisition unit. Before performing defect detection on the single chip 2 to be inspected, the data acquisition unit collects the arrangement direction and quantity (length and width specifications) of the single chip 2 to be inspected on the PCB carrier board 1 in real time, and compares it with the information of the single chip 2 to be inspected recorded in the identification code 3 stored in the storage module 4. If the comparison result is consistent, the defect detection device 5 performs defect detection on the single chip 2 to be inspected. If the comparison result is inconsistent, the defect detection device 5 stops and issues an alarm. More specifically, when the PCB carrier board 1 is transmitted to any of the defect detection devices 5, the data acquisition unit reads the information recorded on the identification code 3 on the PCB, and then downloads the corresponding content file from the storage module based on this information. The detection device then uses the data acquisition unit to collect in real time the arrangement direction and quantity (and length and width specifications) of the individual chips 2 to be inspected on the PCB carrier board 1, and compares this with the downloaded information. If the arrangement direction and quantity comparison results are consistent, and the length and width specification error is less than 3%, the defect detection device 5 performs defect detection on the individual chip 2 to be inspected; if the comparison results are inconsistent, the defect detection device 5 stops and issues an alarm. The data acquisition unit may include a barcode reader for reading the identification code 3, and a CCD camera that can scan the PCB carrier board 1 to obtain the arrangement direction and quantity of the individual chips 2 to be inspected. The reason for simultaneously comparing the length and width specification information is to prevent coordinate system distortion caused by the CCD camera lens, which could lead to inaccurate subsequent defect detection results. It should be understood that before scanning the PCB carrier board 1 to obtain the arrangement direction, quantity (and length and width specifications) of the individual chips 2 to be inspected, the data acquisition unit can first scan the PCB carrier board with a CCD camera to establish an actual image analysis of each marker point 6 obtained from the scan. This image is then compared with the preset image stored in the storage module 4 to determine whether the PCB carrier board's expansion and contraction performance is qualified. If it is qualified, the next step of information acquisition and comparison will proceed; if it is unqualified, the machine will stop and an alarm will be triggered directly, thereby preventing the PCB carrier board from failing the expansion and contraction performance test after shipment. The specific parameters and reference points for determining whether the expansion and contraction performance is qualified can be set according to actual production needs.

[0025] Specifically, in this embodiment, the defect detection device 5 performs defect detection on the individual chips 2 to be inspected on the PCB carrier board 1. If a defect is detected in an individual chip 2 to be inspected, the chip 2 to be inspected will be uploaded to the storage module 4 in coordinate form. Of course, when the chip 2 to be inspected is uploaded in coordinate form, the corresponding defect name (or corresponding defect code) can also be attached after the coordinates for traceability. In addition, during the process of the PCB carrier board 1 undergoing defect detection of the corresponding type by any defect detection device 5, the usage code of the defect detection device 5 will also be uploaded to the storage module 4. This makes it easy to verify whether the PCB carrier board 1 has been defect-detected by the corresponding number of upstream defect detection devices 5 before the downstream defect detection device 5 detects the PCB carrier board 1. This avoids the possibility of missing the detection of individual chips 2 to be inspected on the PCB carrier board 1 (i.e., the individual chip 2 to be inspected has only one type of defect, but has not been detected by the corresponding defect detection device 5), which would lead to the final omission of labeling.

[0026] Specifically, in this embodiment, the defect data uploaded by any of the detection modules to the storage module 4 do not overlap or eliminate each other, thereby ultimately forming a complete defect marking summary table for each PCB carrier board 1 / batch.

[0027] Specifically, in this embodiment, when the upstream defect detection device 5 detects a defect in a single piece 2 to be inspected, the downstream defect detection device 5 directly skips the defect detection of the single piece 2 to be inspected. That is, if a defect has been detected in a single piece 2 to be inspected, it will no longer detect whether there is another defect, thereby effectively saving detection time.

[0028] Specifically, in this embodiment, the storage module 4 receives defect detection data of the single chip to be inspected on the PCB carrier 1 that has defects, compares it with a first defect threshold corresponding to each of the defect detection devices 5, and stores the comparison result; the defect data uploaded by the defect detection device to the storage module 4 is accumulated; when the accumulated data exceeds a second defect threshold preset by the storage module 4, the defect detection device 5 stops and issues an alarm. More specifically, each defect detection device 5 has a corresponding first defect threshold. When the defect value detected by the defect detection device 5 on the PCB carrier 1 is transmitted to the storage module 4, it is compared with the first defect threshold, and the comparison result can be recorded in the storage module 4 for future reference. If the single chip to be inspected exceeds the defect limit and is detected by the corresponding defect detection device 5, the fault of the machine used to process the part of the single chip to be inspected that has the defect can also be analyzed. Furthermore, the individual chip to be inspected on the PCB carrier 1 is inspected for different types of defects by multiple defect detection devices 5. The detected defect data is accumulated. If the accumulated value exceeds the second defect threshold preset by the storage module 4, the defect detection device 5 will stop and alarm. In other words, it means that the defect rate of the individual chip to be inspected on the PCB carrier 1 no longer meets the shipping standards.

[0029] Specifically, this embodiment also includes a marking module, which is used to uniformly mark the defective single-piece 2 to be inspected according to the defect marking master table. It should be understood that during the uniform marking process, if the defective single-piece 2 to be inspected has different defects, only one marking is performed. That is, before marking the defective single-piece 2 to be inspected according to the defect marking master table, the marking module will also check whether the defective single-piece 2 to be inspected has already been marked. If it has been marked, a second marking will not be performed. In actual production, the user (i.e., the customer) of the single-piece 2 to be inspected may not purchase equipment capable of reading the defect marking master table stored in the storage module 4. Therefore, before shipment, the marking module can be used to uniformly mark the defective single-piece 2 to be inspected according to the defect marking master table as required by the user, and then the entire PCB carrier board 1 can be shipped to the user as the smallest shipping unit. This method of uniformly marking defects based on the coordinates of individual defects recorded in the defect marking table eliminates the need for parameters such as image grayscale, size, and area. It allows direct reading of the defect marking table and avoids the risk of missing individual defects.

[0030] Specifically, in this embodiment, the marking module uses laser etching to uniformly mark the defective individual particles 2 to be inspected.

[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any changes, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A PCB carrier board defect detection and marking system, wherein the PCB carrier board includes an inspection area and a scrap area, and the inspection area is arrayed with x*y individual chips to be inspected, characterized in that, The PCB carrier board defect detection and marking system includes: A coding module is used to print identification codes in the waste area of ​​the PCB carrier board. The identification codes record at least the number of the PCB carrier board and the number of individual chips to be inspected in the x-direction and the y-direction. The detection module includes at least two defect detection devices, which are used to detect different defects in the single piece to be inspected. The storage module can store the information of the single piece to be inspected recorded by the identification code, and obtain all defect data uploaded by the detection module to generate a defect mark summary table. A transfer module, which is at least used to transfer the PCB carrier between the various detection devices included in the marking module and the detection module.

2. The PCB carrier board defect detection and marking system according to claim 1, characterized in that, The defect detection device includes an electrical testing machine, an AVI visual inspection machine, and a 3D Bump inspection machine.

3. The PCB carrier board defect detection and marking system according to claim 2, characterized in that, Each of the aforementioned defect detection devices is equipped with a data acquisition unit. Before performing defect detection on the single chip to be inspected, the data acquisition unit collects the arrangement direction and number of the single chips to be inspected on the PCB carrier in real time, and compares them with the information of the single chip to be inspected recorded in the identification code stored in the storage module. If the comparison results are consistent, the defect detection device will perform defect detection on the single piece to be inspected. If the comparison results are inconsistent, the defect detection device will stop and issue an alarm.

4. The PCB carrier board defect detection and marking system according to claim 3, characterized in that, The defect detection device performs defect detection on the individual chip to be inspected on the PCB carrier, and uploads the detected defective chip to the storage module in the form of coordinates.

5. The PCB carrier board defect detection and marking system according to claim 3, characterized in that, The defect data uploaded by any of the detection modules to the storage module do not overwrite or eliminate each other.

6. The PCB carrier board defect detection and marking system according to claim 5, characterized in that, When the upstream defect detection device detects a defect in a single piece to be inspected, the downstream defect detection device skips the defect detection of that single piece.

7. The PCB carrier board defect detection and marking system according to claim 6, characterized in that, The storage module receives the defect detection data of the single chip to be inspected on the PCB carrier board that has defects, compares it with the first defect threshold corresponding to each defect detection device, and stores the comparison result. The defect data uploaded by the defect detection device to the storage module is accumulated; When the accumulated data exceeds the second defect threshold preset by the storage module, the defect detection device stops and issues an alarm.

8. The PCB carrier board defect detection and marking system according to claim 1, characterized in that, It also includes a marking module, which is used to uniformly mark the defective individual particles to be inspected according to the defect marking summary table.

9. The PCB carrier board defect detection and marking system according to claim 7, characterized in that, The marking module uses laser etching to uniformly mark the defective individual particles to be inspected.

10. The PCB carrier board defect detection and marking system according to claim 1, characterized in that, The identifier is a Data Matrix code.

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