Electrical connection unit

Abstract

The electrical connection unit includes an electronic component, a base member having an opening, a bus bar, a metal member, and a heat conductive member. The bus bar is supported by the base member and is electrically connected to an electronic component. The metal member has a main body portion and a protruding portion. The main body portion is located on the opposite side of the base member from the electronic component. The protruding portion protrudes from the main body portion through the inside of the opening and faces the electronic component. Alternatively, the protruding portion protrudes from the main body portion through the inside of the opening, and faces a connection member that connects the electronic component and the bus bar. The heat conduction component is arranged between the electronic component and the protruding part or between the connecting component and the protruding part.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to an electrical connection unit. BACKGROUND

[0002] An electrical connection unit having an electronic component and a bus bar electrically connected to the electronic component is known.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, an electrical connection unit is desired to have improved heat dissipation.

[0008] One embodiment provides an electrical connection unit capable of achieving improved heat dissipation.

[0009] MEANS FOR SOLVING THE PROBLEMS

[0010] An electrical connection unit according to one embodiment includes an electronic component, a base member having an opening, a bus bar, a metal member, and a thermally conductive member. The bus bar is supported by the base member and electrically connected to the electronic component. The metal member has a main body portion and a protruding portion. The main body portion is located on a side opposite to the electronic component with respect to the base member. The protruding portion protrudes from the main body portion through the opening and faces the electronic component. Alternatively, the protruding portion protrudes from the main body portion through the opening and faces a connecting member connecting the electronic component and the bus bar. The thermally conductive member is disposed between the electronic component and the protruding portion or between the connecting member and the protruding portion.

[0011] EFFECTS OF THE INVENTION

[0012] According to one embodiment, improved heat dissipation can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a cross-sectional view showing an electrical connection unit according to an embodiment.

[0014] Figure 2 is a perspective view for explaining a main body portion according to an embodiment.

[0015] Figure 3 is a perspective view for explaining one subunit according to an embodiment.

[0016] Figure 4 is a perspective view showing an electronic component and a connecting member according to an embodiment.

[0017] Figure 5 This is a perspective view of the wiring substrate used to illustrate the embodiments.

[0018] Figure 6 This is a perspective view showing a portion of the wiring substrate of the embodiment, disassembled.

[0019] Figure 7 This is a top view illustrating a sub-unit of an embodiment.

[0020] Figure 8 It is along Figure 7 The cross-sectional view of the structure shown along line F8-F8.

[0021] Figure 9 It is along Figure 7 The cross-sectional view of the structure shown along line F9-F9.

[0022] Figure 10 This is a top view illustrating a first shape example of a busbar in an embodiment.

[0023] Figure 11 This is a top view illustrating a second shape example of the busbar in the embodiment.

[0024] Figure 12 This is a perspective view showing other sub-units of the embodiment.

[0025] Figure 13 This is a front view illustrating the electronic components of an embodiment.

[0026] Figure 14 This is a perspective view of the base component of an embodiment.

[0027] Figure 15 This is a top view illustrating a sub-unit of an embodiment.

[0028] Figure 16 It is along Figure 15 The cross-sectional view of the structure shown along line F16-F16.

[0029] Figure 17 It is along Figure 15 The cross-sectional view of the structure shown along line F17-F17.

[0030] Figure 18 It is along Figure 15 The cross-sectional view of the structure shown along line F18-F18.

[0031] Figure 19 This is a perspective view showing the connection structure between multiple sub-units in an embodiment.

[0032] Figure 20 It is along Figure 15A cross-sectional view of the F20-F20 line of the structure shown.

[0033] Figure 21 A perspective view of a heat dissipation structure in one of the sub-units used to illustrate the embodiment. DETAILED DESCRIPTION

[0034] Embodiments will be described below with reference to the accompanying drawings. In the following description, structures having the same or similar functions are designated by the same reference numerals. Also, repeated description of these structures will be omitted at times. In addition, the structures described below do not limit the scope of the embodiments.

[0035] In the present disclosure, the terms are defined as follows. "Connection" is not limited to mechanical connection, and can include electrical connection. That is, "connection" is not limited to the case where two elements as connection objects are directly connected, and can include the case where two elements as connection objects are connected with other elements interposed therebetween. "Accommodation" is not limited to the case where the entirety of a component is accommodated, and can include the case where only a part of a component is accommodated (a state where another part of the component protrudes). "Facing" means that the imaginary projected images of two objects overlap each other in the case of being viewed from a particular direction. That is, "facing" is not limited to the case where two objects directly face each other, and can include the case where two objects face each other in a state where other components are present between the two objects. "Parallel", "orthogonal", or "identical" can respectively include the case of "approximately parallel", "approximately orthogonal", or "approximately identical".

[0036] In the present disclosure, the +X direction, the -X direction, the +Y direction, the -Y direction, the +Z direction, and the -Z direction are defined as follows. The +X direction is a direction from a first end portion 110e1 of a metal plate 110 described later toward a second end portion 110e2 (see Figure 2 ). The -X direction is a direction opposite to the +X direction. Hereinafter, in the case where the +X direction and the -X direction are not distinguished, it is simply referred to as the "X direction". The +Y direction and the -Y direction are directions intersecting (for example, orthogonal to) the X direction. The +Y direction is a direction from a third end portion 110e3 of the metal plate 110 described later toward a fourth end portion 110e4 (see Figure 2 ). The -Y direction is a direction opposite to the +Y direction. Hereinafter, in the case where the +Y direction and the -Y direction are not distinguished, it is simply referred to as the "Y direction". The +Z direction and the -Z direction are directions intersecting (for example, orthogonal to) the X direction and the Y direction. The +Z direction is a direction from the metal plate 110 described later toward a main body portion MU (see Figure 2 ). The -Z direction is a direction opposite to the +Z direction. Hereinafter, in the case where the +Z direction and the -Z direction are not distinguished, it is simply referred to as the "Z direction". The Z direction is an example of a "first direction". The Y direction is an example of a "second direction". The X direction is an example of a "third direction".

[0037] Hereinafter, sometimes referred to as "horizontal direction" without distinguishing the X direction and the Y direction. Hereinafter, sometimes referred to as "vertical direction" for the Z direction. In addition, hereinafter, sometimes referred to as "up" for the +Z direction side, and "down" for the -Z direction side. However, these expressions are expressions for convenience of explanation, and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0038] (Embodiment)

[0039] <1. Structure of Electrical Connection Unit>

[0040] Figure 1 is a cross-sectional view showing the electrical connection unit 1 of the embodiment. The electrical connection unit 1 is, for example, an on-vehicle device mounted on a vehicle such as an EV (Electric Vehicle), an HEV (Hybrid Electric Vehicle), or a PHEV (Plug-in Hybrid Electric Vehicle). The electrical connection unit 1 may, for example, also be referred to as an "electrical connection box" or a "junction box". However, the electrical connection unit 1 is not limited to a box-shaped device.

[0041] The electrical connection unit 1 has, for example, a frame 5, a main body portion MU, a metal plate 110, a plurality of heat conducting members 120 (refer to Figure 2 ), and a plurality of insulating covers 130 (refer to Figure 2 ).

[0042] <2. Frame>

[0043] First, the frame 5 will be described. The frame 5 forms the outer shape of the electrical connection unit 1. The frame 5 includes, for example, a base 6 (first member) and a cover 7 (second member). The base 6 is a member that covers the main body portion MU and the metal plate 110 from below. The base 6 is, for example, a plate shape in the horizontal direction or a bowl shape open to the +Z direction. The base 6 is, for example, made of synthetic resin. The cover 7 is a member that covers the main body portion MU and the metal plate 110 from above. The cover 7 is, for example, a bowl shape open to the -Z direction. The cover 7 is, for example, made of synthetic resin. In the present embodiment, the frame 5 in a box shape is formed by combining the base 6 and the cover 7. In addition, the shape of the frame 5 is not limited to the above example. For example, the metal plate 110 described later can also function as part or all of the base 6. In addition, the frame 5 can be omitted.

[0044] In the present embodiment, the electric connection unit 1 includes a first region (first space) R1 and a second region (second space) R2. The first region R1 is a region in which heat dissipation is emphasized. In the first region R1, for example, the electronic component 10S having a large amount of heat generation is disposed. On the other hand, the second region R2 is a region in which mountability is emphasized. In the second region R2, for example, the electronic component 10T having a smaller amount of heat generation than the electronic component 10S and / or requiring a more complex mounting structure than the electronic component 10S is disposed. However, these contents do not limit the contents of the electric connection unit 1 of the present disclosure. For example, the electronic component 10T can also have a larger amount of heat generation than the electronic component 10S.

[0045] <3. Main body portion>

[0046] Next, the main body portion MU will be described.

[0047] Figure 2 is a perspective view for illustrating the main body portion MU. The main body portion MU is a portion that assumes a main function (for example, switching of an electric connection state or overcurrent protection) of the electric connection unit 1. In the present embodiment, the main body portion MU is divided into a plurality of sub-units SU. The main body portion MU is formed, for example, by connecting the plurality of sub-units SU. In the present embodiment, the main body portion MU has two sub-units SU (sub-units SUS, SUT). Each sub-unit SU can also be referred to as a "circuit structure".

[0048] The sub-unit SUS has a first function in terms of electricity. The sub-unit SUS includes, for example, a plurality of electronic components 10S and a wiring substrate 40S. The plurality of electronic components 10S are electrically connected to the wiring substrate 40S. A base substrate 41S (to be described later) included in the sub-unit SUS is an example of a "first base component".

[0049] The sub-unit SUSB has a second function in terms of electricity. The second function can be the same function as the first function, or can be a different function from the first function. The sub-unit SUSB includes, for example, a plurality of electronic components 10S and a wiring substrate 40SB. The plurality of electronic components 10S are electrically connected to the wiring substrate 40SB. A base substrate 41SB (to be described later) included in the sub-unit SUSB is another example of a "first base component".

[0050] The sub-unit SUT has a second function in terms of electricity. The second function is, for example, a different function from the first function. The sub-unit SUTA includes, for example, a plurality of electronic components 10T and a wiring structure 40T. The plurality of electronic components 10T are electrically connected to the wiring structure 40T. A base component 41T (to be described later) included in the sub-unit SUT is an example of a "second base component".

[0051] In the present embodiment, the sub-unit SUS is a sub-unit SU that places importance on heat dissipation. The sub-unit SUS is disposed in the first region R1 of the above-described electric connection unit 1. The sub-unit SUS faces the first region A1 of the metal plate 110 described later in the Z direction.

[0052] On the other hand, the sub-unit SUT is a sub-unit SU that places importance on mountability. The sub-unit SUT is disposed, for example, on the +Y direction side with respect to the sub-unit SUS. The sub-unit SUT is disposed in the second region R2 of the above-described electric connection unit 1. The sub-unit SUT faces the second region A2 of the metal plate 110 described later in the Z direction. Hereinafter, in the case where the electronic component 10S and the electronic component 10T are not distinguished, the electronic component 10 is simply referred to as "electronic component 10".

[0053] Further, instead of the above-described example, the main body portion MU can not be divided into a plurality of sub-units SU. For example, the plurality of sub-units SU can be integrally formed. For example, the base plate 41S of the wiring substrate 40S and the base member 41T of the wiring structure 40T described later can be integrally formed by one piece of member.

[0054] <4. Configuration of sub-unit SUS>

[0055] Next, the structure of the sub-unit SUS will be described.

[0056] Figure 3 is a perspective view for explaining the sub-unit SUS. The sub-unit SUS includes, for example, a plurality of electronic components 10, a plurality of connection members 20, and a wiring substrate 40S. The connection member 20 is a member that forms a vertical power supply path. The connection member 20 can also be referred to as a "vertical wiring member".

[0057] <4.1 Electronic component>

[0058] First, the electronic component 10 will be described. The electronic component 10 is an electronic component that is mounted according to the function required for each sub-unit SU. The electronic component 10 is, for example, also a connector, a fuse, a relay (for example, a mechanical relay or a semiconductor relay), a capacitor, a branch member, various sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of them are unified. However, the type of the electronic component 10 is not limited to the above-described example. The electronic component 10 is, for example, a heat generating member that generates heat when power is supplied.

[0059] In the present embodiment, the plurality of electronic components 10 includes an electronic component 10S that generates heat greatly when power is supplied. The electronic component 10S is a relay (for example, a mechanical relay or a semiconductor relay), a fuse, or a current sensor (for example, a current sensor having a shunt resistor), or the like. However, the type of the electronic component 10S is not limited to the above-described example.

[0060] Figure 4 FIG. 1 is a perspective view showing an electronic component 10 and a connecting component 20. The electronic component 10 is, for example, an electronic component in which a plurality of terminals 13 are arranged at one end portion of the electronic component 10. The electronic component 10 has, for example, a housing 11, a component main body portion 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0061] (Housing)

[0062] The housing 11 is an outer member that forms a large portion of the outer shape of the electronic component 10. The housing 11 is, for example, made of synthetic resin and has insulating properties. The housing 11 accommodates the component main body portion 12. In addition, the housing 11 and the component main body portion 12 can be integrally formed.

[0063] In the present embodiment, the housing 11 has an insulating rib 11a that protrudes in the horizontal direction (for example, the Y direction) and extends in the Z direction. The insulating rib 11a is, for example, plate-shaped in the horizontal direction (for example, the Y direction) and the Z direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z direction. The insulating rib 11a is arranged between the plurality of terminals 13 (terminals 13A and 13B described later). The insulating rib 11a electrically insulates the terminal 13A from the terminal 13B. In addition, in the present embodiment, a portion of the insulating rib 11a is arranged between the first portions 21 (described later) of the two connecting components 20 connected to the electronic component 10S. The insulating rib 11a electrically insulates the first portions 21 of the two connecting components 20 connected to the electronic component 10S from each other.

[0064] (Component main body portion)

[0065] The component main body portion 12 is a portion that bears the main function of the electronic component 10. For example, in the case where the electronic component 10 is a relay, the component main body portion 12 includes a switching portion (for example, a contact portion) that switches between the on state and the off state. For example, in the case where the electronic component 10 is a fuse, the component main body portion 12 includes a fuse portion that melts in the case where an overcurrent flows. For example, in the case where the electronic component 10 is a capacitor, the component main body portion 12 includes a portion that accumulates electric charge.

[0066] (Terminal)

[0067] The terminal 13 is an electric connection portion exposed to the outside of the case 11. The terminal 13 is electrically connected to the component main body portion 12 inside the case 11. In the present embodiment, the electronic component 10S includes a terminal 13A and a terminal 13B as the plurality of terminals 13. One of the terminal 13A and the terminal 13B is a positive electrode side terminal. The other of the terminal 13A and the terminal 13B is a negative electrode side terminal. One of the terminal 13A and the terminal 13B is an example of a "first terminal". The other of the terminal 13A and the terminal 13B is an example of a "second terminal".

[0068] Here, the electronic component 10S has a first end portion 10e1 and a second end portion 10e2. A plurality of terminals 13 connected to the bus bar 42 described later directly or via a connection component are provided at the first end portion 10e1. The second end portion 10e2 is located on the side opposite to the first end portion.

[0069] In the present embodiment, the terminal 13A and the terminal 13B are provided at one end portion of the electronic component 10S in the horizontal direction (for example, the Y direction). The terminal 13A and the terminal 13B are arranged side by side in the horizontal direction (for example, the X direction). The terminal 13A and the terminal 13B each face the horizontal direction (for example, the Y direction). Each of the terminals 13 has a mounting hole 13h in which a fastening component 71 (for example, a screw or a bolt) described later is to be mounted. The mounting hole 13h is open in the horizontal direction (for example, the Y direction). An inner peripheral surface of the mounting hole 13h of the electronic component 10S has a screw groove.

[0070] (Mounting portion)

[0071] The mounting portion 14 is a portion for fixing the electronic component 10S. The mounting portion 14 has a mounting hole 14h in which a fastening component 116 (for example, a screw or a bolt, refer to Figure 9 ) described later is to be mounted. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through-hole through which the fastening component 116 passes. The object to be fixed by the mounting portion 14 is described later.

[0072] <4.2 Connection component>

[0073] Next, the connection component 20 is described. The connection component 20 is a component that electrically connects the electronic component 10S and the wiring substrate 40S. The connection component 20 forms a part of the power supply path in the subunit SUS. The connection component 20 is made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy). The connection component 20 can also be referred to as a "metal component".

[0074] In the present embodiment, the connection component 20 electrically connects the electronic component 10S and the bus bar 42 included in the wiring substrate 40S (refer to Figure 3) electrically connected. In the present embodiment, the length L12 of the connecting member 20 in the longitudinal direction (for example, the Y direction) of the electronic component 10S is smaller than the length L11 of the electronic component 10S in the longitudinal direction. The connecting member 20 has, for example, a first portion 21 and a second portion 22.

[0075] (First portion)

[0076] The first portion 21 of the connecting member 20 is a portion connected to the terminal 13 of the electronic component 10S. The first portion 21 is a plate-shaped or cuboid-shaped portion extending in the Z direction. The first portion 21 extends in the Z direction along one end portion (for example, an end portion in the Y direction) of the electronic component 10S. The first portion 21 is a standing portion that stands in the Z direction with respect to the wiring substrate 40S (for example, with respect to the bus bar 42 described later). The first portion 21 is adjacent to the electronic component 10S in the horizontal direction (for example, the Y direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10S in the horizontal direction (for example, the Y direction), and is connected to the terminal 13 of the electronic component 10S in the horizontal direction (for example, the Y direction).

[0077] The first portion 21 of the connecting member 20 has a first mounting hole 21h through which a fastening member 71 (for example, a screw or a bolt) passes. The first mounting hole 21h is open in the horizontal direction (for example, the Y direction). The first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10S by the fastening member 71 passing through the first mounting hole 21h and engaging with the mounting hole 13h of the terminal 13 of the electronic component 10S.

[0078] (Second portion)

[0079] The second portion 22 of the connecting member 20 is a portion connected to the bus bar 42 (refer to Figure 3 ). The second portion 22 protrudes from the end portion of the first portion 21 on the -Z direction side toward the horizontal direction (for example, the Y direction). The second portion 22 is a plate portion along the horizontal direction. The second portion 22 is adjacent to the bus bar 42 in the Z direction, and is connected to the bus bar 42 in the Z direction. The second portion 22 of the connecting member 20 is mounted from the Z direction to the fastening member 43 (for example, a screw or a bolt, refer to Figure 8 ) protruding in the +Z direction from the bus bar 42, and is physically and electrically connected to the bus bar 42. In the present embodiment, the second portion 22 of the connecting member 20 has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The fastening member 43 passes through the second mounting hole 22h of the second portion 22. Also, the second portion 22 is physically and electrically connected to the bus bar 42 by the engaging member 44 (for example, a nut, refer to Figure 3) and the tip of the fastening member 43 passing through the second mounting hole 22h, and thereby the second portion 22 is fixed to the bus bar 42. In the present embodiment, the connection member 20 is formed in an L shape by the first portion 21 and the second portion 22.

[0080] In the present embodiment, the bus bar 42 is disposed at a position (for example, a position apart in the Z direction) apart from the terminal 13 of the electronic component 10S. The connection member 20 is disposed between the electronic component 10S and the bus bar 42. In the present disclosure, "the connection member is disposed between the electronic component and the bus bar" is not limited to the case where a part of the connection member is positioned between the electronic component and the bus bar when viewed in the X direction or the Y direction. "The connection member is disposed between the electronic component and the bus bar" can also correspond to the case where a part of the connection member is positioned between the electronic component and the bus bar when viewed in a direction inclined with respect to the X direction or the Y direction. The connection member 20 electrically connects the terminal 13 of the electronic component 10S and the bus bar 42.

[0081] <4.3 Wiring substrate>

[0082] Next, the wiring substrate 40S will be described.

[0083] Figure 5 is a perspective view for illustrating the wiring substrate 40S. The wiring substrate 40S is a member that forms at least a part of the power supply path between a plurality of electronic components 10 (for example, a plurality of electronic components 10S) and / or at least a part of the power supply path between an electronic component 10 (for example, an electronic component 10S) included in a subunit SUS and an electronic component 10 included in another subunit SU (for example, a subunit SUT). In the present disclosure, "wiring substrate" refers to a wiring structure of a substrate type. "Substrate type" refers to a board shape when viewed as a whole regardless of a fine shape. Note that in the present disclosure, "board shape", "sheet shape", or "plane" are not limited to the case where it is completely flat, and can include the case where a fixing structure, a rib, or the like that locally projects in the Z direction is present, the case where a concave-convex shape following the thickness of a bus bar is present on the surface, or the like. In the present embodiment, the wiring substrate 40S is a board shape along the X direction and the Y direction.

[0084] The wiring substrate 40S includes, for example, a base plate 41S, one or more busbars 42, and multiple fastening members 43. In this embodiment, the base plate 41S and the multiple busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert molded with the base plate 41S, thereby forming the wiring substrate 40S as a single piece. That is, the busbars 42 are integrated with the base plate 41S without using fastening members such as screws or bolts. Furthermore, the wiring substrate 40S can also be formed by other structures instead of insert molding. A variation of the wiring substrate 40S formed by another structure will be described later.

[0085] Figure 6 This is a perspective view showing a portion of the wiring substrate 40S exploded. Hereinafter, for ease of explanation, the substrate 41S, busbar 42, and fastening member 43 will be described with reference to the exploded view of a portion of the wiring substrate 40S.

[0086] <4.3.1 Base plate>

[0087] The substrate plate 41S is a support component that integrally supports a plurality of busbars 42 arranged horizontally at intervals. The substrate plate 41S is, for example, made of synthetic resin and has insulating properties. The substrate plate 41S provides electrical insulation between the plurality of busbars 42. The substrate plate 41S is an example of a "substrate component." The substrate plate 41S can also be referred to as an "insulating substrate." The substrate plate 41S, for example, has a planar portion 51, a frame portion 52, and a plurality of fixing portions 53 (see reference). Figure 9 ).

[0088] (Plane section)

[0089] The planar portion 51 is a plate-shaped portion formed in the base plate 41S. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main portion of the base plate 41S. The planar portion 51 forms the base (insulating base) of the base plate 41S. In this embodiment, the planar portion 51 extends throughout the entire width of the base plate 41S in the X direction and throughout the entire width of the base plate 41S in the Y direction, except for the frame portion 52 of the base plate 41S.

[0090] The planar portion 51 has a first surface 51a and a second surface 51b (see reference). Figure 9 The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces multiple electronic components 10 (e.g., multiple electronic components 10S). The second surface 51b is located on the opposite side of the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 110 (see reference). Figure 2) The thickness direction (plate thickness direction) of the flat portion 51 is the Z direction, which coincides with the direction of the opening of the base plate 41s at the opening 57. In the present embodiment, the thickness T11 of the flat portion 51 in the Z direction is smaller than the thickness T1 of the bus bar 42 in the Z direction (for example, the thickness of the horizontal plate portion 42p described later in the Z direction) (see FIG. 6). Note that the thickness T11 of the flat portion 51 in the Z direction can be the same as the thickness T1 of the bus bar 42 in the Z direction, or can be larger than the thickness T1 of the bus bar 42 in the Z direction. Figure 8 ) Note that the thickness T11 of the flat portion 51 in the Z direction can be the same as the thickness T1 of the bus bar 42 in the Z direction, or can be larger than the thickness T1 of the bus bar 42 in the Z direction.

[0091] The flat portion 51 has one or more (for example, a plurality of) accommodation portions 55 that accommodate the bus bar 42, respectively. The plurality of accommodation portions 55 are formed separately from each other in the X direction or the Y direction. Each accommodation portion 55 is, for example, a through-hole that penetrates the flat portion 51 in the Z direction. Note that the accommodation portion 55 can be a recess that is provided to the first face 51a or the second face 51b of the flat portion 51 and is recessed in the Z direction, instead of the through-hole. Note that in the present disclosure, “the accommodation portion penetrates the flat portion in the first direction (Z direction)” can include a case where a part of the entire length of the accommodation portion 55 penetrates the flat portion 51 in the Z direction (for example, the remaining part of the accommodation portion 55 can be a recess that is recessed in the Z direction, or can be a form in which the accommodation portion 55 is provided inside the base plate 41s without being exposed to the outside of the base plate 41s). Similarly, in the present disclosure, “the accommodation portion is recessed in the first direction (Z direction)” can include a case where a part of the entire length of the accommodation portion 55 is recessed in the Z direction (for example, the remaining part of the accommodation portion 55 can be a through-hole that penetrates the flat portion 51 in the Z direction, or can be a form in which the accommodation portion 55 is provided inside the base plate 41s without being exposed to the outside of the base plate 41s).

[0092] In addition, the flat portion 51 has one or more (for example, a plurality of) openings 57. The opening 57 penetrates the base plate 41s in the first direction (Z direction).

[0093] Each accommodation portion 55 has an outer shape that corresponds to the shape of the bus bar 42 accommodated therein, when viewed in the Z direction. The plurality of accommodation portions 55 include, for example, four accommodation portions 55A, 55B, 55C, and 55D. The accommodation portion 55A is provided in correspondence with the bus bar 42A described later, and accommodates at least a part of the bus bar 42A. The accommodation portion 55B is provided in correspondence with the bus bar 42B described later, and accommodates at least a part of the bus bar 42B. The accommodation portion 55C is provided in correspondence with the bus bar 42C described later, and accommodates at least a part of the bus bar 42C. The accommodation portion 55D is provided in correspondence with the bus bar 42D described later, and accommodates at least a part of the bus bar 42D.

[0094] (BOX PORTION)

[0095] The frame portion 52 is provided at the peripheral end portion of the base plate 41S. The frame portion 52 is a rib for reinforcement that protrudes upward and downward from the end portion of the planar portion 51 (see FIG. 2). The Z-directional width (thickness) H11 of the frame portion 52 is, for example, less than half of the Z-directional width (thickness) H12 of the electronic component 10 (see FIG. 2). The frame portion 52 can be omitted. Figure 8 ) The frame portion 52 is provided at the peripheral end portion of the base plate 41S. The frame portion 52 is a rib for reinforcement that protrudes upward and downward from the end portion of the planar portion 51 (see FIG. 2). The Z-directional width (thickness) H11 of the frame portion 52 is, for example, less than half of the Z-directional width (thickness) H12 of the electronic component 10 (see FIG. 2). The frame portion 52 can be omitted. Figure 8 ) The frame portion 52 is provided at the peripheral end portion of the base plate 41S. The frame portion 52 is a rib for reinforcement that protrudes upward and downward from the end portion of the planar portion 51 (see FIG. 2). The Z-directional width (thickness) H11 of the frame portion 52 is, for example, less than half of the Z-directional width (thickness) H12 of the electronic component 10 (see FIG. 2). The frame portion 52 can be omitted.

[0096] (Fixing portion)

[0097] The fixing portion 53 is a portion that is fixed to the metal plate 110 (see FIG. 2). The fixing portion 53 has a mounting hole 53h that penetrates the base plate 41S in the Z-direction. The fastening member 115 (e.g., a screw or a bolt) described later passes through the mounting hole 53h. This will be described later. Figure 9

[0098] As described above, the base plate 41S has at least one or more openings 57. For example, in the present disclosure, the base plate 41S has a plurality of openings 57 in the planar portion 51. The plurality of openings 57 includes openings 57A, 57B, 57C, and 57D. In a case where the thickness direction of the base plate 41S is the first direction (e.g., the Z-direction), the base plate 41S at the opening 57 is open in the Z-direction.

[0099] (Opening)

[0100] The base plate 41S will be described in more detail. In the following description, a representative opening 57 will be described in detail. In addition, the description will be made taking the subunit SUS as an example, but the other subunits SUT can also have the same opening.

[0101] As described above, the opening 57 penetrates the base plate 41S in the first direction (Z-direction). In addition, as described above, the electronic component 10S has a first end portion 10e1 and a second end portion 10e2. As shown in FIG. 2, the opening 57 in the present disclosure can be located closer to the first end portion 10e1 than the second end portion 10e2. Figures 5-7

[0102] The protruding portion 118 of the metal plate 110 is inserted into the opening 57.

[0103] ​​In the present disclosure, the opening 57A is located closer to the first end portion 10el than to the second end portion 10e2 in the electronic component 10A. The opening 57B is located closer to the first end portion 10el than to the second end portion 10e2 in the electronic component 10A. In addition, the opening 57B is closer to the connecting component 20S than to the electronic component 10A. The opening 57C is located closer to the first end portion 10el than to the second end portion 10e2 in the electronic component 10B. The opening 57D is located closer to the second end portion 10e2 than to the first end portion 10el in the electronic component 10C for the convenience of layout.

[0104] In addition, Figure 9 is a sectional view along the F9-F9 line of the structure shown in FIG. 9. Figure 7

[0105] The electric connection unit 1 of the present embodiment has a metal plate 80 that is disposed with a gap S1 from the base plate 41S, facing the second face 51b of the planar portion 51. A thermally conductive member 92 is present between the bus bar 42 and the metal plate 80.

[0106] The opening 57 penetrates the planar portion 51 in the Z direction, communicates with the gap S1 between the planar portion 51 and the metal plate 80, and air is able to pass through. The air of the gap S1 between the planar portion 51 and the metal plate 80, for example, moves upward of the planar portion 51 through the opening 57 according to being heated.

[0107] According to such a structure, between the base plate 41S and the metal plate 80, heat is not easily trapped in the gap S1. If heat is not easily trapped in the gap S1, the heat dissipation of the bus bar 42 is improved. When the heat dissipation of the bus bar 42 is improved, improvement of the heat dissipation of the electric connection unit 1 can be achieved.

[0108] <4.3.2 Bus Bar>

[0109] ​The bus bars 42 are wiring members (electrical connection members) included in the wiring substrate 40S. The bus bars 42 are, for example, wiring members for electrically connecting a plurality of electronic components (for example, a plurality of electronic components 10S). Alternatively, the bus bars 42 can be wiring members for electrically connecting the electronic component 10 (for example, the electronic component 10S) and an electronic component 10 included in another sub unit SU (for example, the sub unit SUT). The bus bars 42 are made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy) and have electrical conductivity. In the present embodiment, a plurality of bus bars 42, for example, four bus bars 42A, 42B, 42C, and 42D are included. The four bus bars 42A, 42B, 42C, and 42D are arranged in the horizontal direction at intervals from each other. The four bus bars 42A, 42B, 42C, and 42D include portions arranged on the same plane as each other. The four bus bars 42A, 42B, 42C, and 42D are supported by the planar portion 51 of the base plate 41S. Note that, in the present disclosure, "a bus bar is supported by a planar portion" is not limited to a case where the bus bar 42 is housed in the housing portion 55, but can include a case where the bus bar 42 is mounted on the first face 51a or the second face 51b of the planar portion 51, and the like.

[0110] At least a portion of each bus bar 42 is in a plate shape in the horizontal direction. At least a portion of each bus bar 42 is housed in the housing portion 55 and extends along the planar portion 51. That is, at least a portion of each bus bar 42 extends along the first face 51a of the planar portion 51. At least a portion of each bus bar 42 extends in the horizontal direction within the housing portion 55. Hereinafter, the portion of each bus bar 42 that extends in a plate shape in the horizontal direction will be sometimes referred to as a "horizontal plate portion 42p". The horizontal plate portion 42p is an example of a "plate portion". The bus bar 42 is a member that forms a current path in the horizontal direction. The bus bar 42 can also be referred to as a "horizontal wiring member".

[0111] Figure 7 Fig. 22 is a plan view of the sub unit SUS. Each bus bar 42 has, for example, a connection portion 61, a connection portion 62, and an extension portion 63.

[0112] The connection portion 61 is located at the middle of the bus bar 42 or at the first end portion of the bus bar 42. The connection portion 61 is a portion that is connected to the electronic component 10 (for example, the electronic component 10S) directly or via the connection member 20. The connection portion 61 includes, for example, a portion that overlaps the connection member 20 when viewed in the Z direction. The connection portion 61 is adjacent to the connection member 20 in the Z direction and is connected to the connection member 20 from the Z direction. Instead of the above example, the connection portion 61 can also be connected to the terminal 13 of the electronic component 10 directly from the Z direction, for example, while being adjacent to the terminal 13 of the electronic component 10 in the Z direction.

[0113] The connection portion 62 is located at the middle of the bus bar 42 or the second end portion of the bus bar 42. The connection portion 62 is a portion to which the other electronic component 10 is connected directly or via the other connection member 20. Instead of the above example, the connection portion 62 can be connected to another bus bar 42 (for example, a bus bar 42 included in another subunit SU) or a bus bar 76 for external connection (see Figure 15 ).

[0114] The extension portion 63 extends from the connection portion 61 in the X direction or the Y direction. The extension portion 63 is provided between the connection portion 61 and the connection portion 62. The extension portion 63 extends in a manner so as to cover the connection portion 61 and the connection portion 62. The extension portion 63 connects the connection portion 61 and the connection portion 62.

[0115] In the present embodiment, the horizontal plate portion 42p described above includes at least all of the connection portion 61 and a part of the extension portion 63. That is, at least all of the connection portion 61 and a part of the extension portion 63 are housed in the housing portion 55 and are located on the same plane.

[0116] In the present embodiment, the extension portions 63 of several bus bars 42 are housed in the housing portion 55 so as to extend in a manner so as to pass through the region R overlapping the electronic component 10 when viewed in the Z direction and across both sides of the region R. For example, the extension portion 63 extends in a manner so as to pass through the -Y direction side and the +Y direction side of the region R overlapping the electronic component 10 when viewed in the Z direction. That is, the bus bar 42 is housed in the housing portion 55 so as not to be hindered by the presence of the electronic component 10 and is easily routed in a better path (for example, a path in which the distance is shortened).

[0117] In addition, one or more bus bars 42 can have an extension portion 64 in addition to the connection portion 61, the connection portion 62, and the extension portion 63. The extension portion 64 is a portion in which the bus bar 42 is extended for the purpose of expanding the heat dissipation area and / or expanding the heat capacity for heat storage (heat absorption). The extension portion 64 is a portion not used for electrical connection. For example, the extension portion 64 is located on the side opposite the extension portion 63 with respect to the connection portion 61 (or the connection portion 62). The extension portion 64 is in the shape of a plate along the horizontal direction. The extension portion 64 is included in the horizontal plate portion 42p. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R overlapping the electronic component 10 when viewed in the Z direction and has an end portion 42el of the bus bar 42 at a position overlapping the electronic component 10 when viewed in the Z direction.

[0118] Hereinafter, several examples of arrangement of the bus bar 42 will be described. In addition, the plurality of electronic components 10S include three electronic components 10A, 10B, 10C. The plurality of connection members 20 include five connection members 20A, 20B, 20C, 20D, 20E.

[0119] The bus bar 42A has a connection portion 61, a connection portion 62, and an extension portion 63. The connection portion 61 is connected to the terminal 13A of the electronic component 10A via the connection member 20A. The connection portion 62 is disposed at the end portion on the +Y direction side of the sub unit SUS, and is connected to the bus bar 42 included in the other sub unit SU. The extension portion 63 extends across both sides of the region R in which the electronic component 10A is overlapped, by being housed in the housing portion 55.

[0120] The bus bar 42B has a connection portion 61, a connection portion 62, an extension portion 63, and an extension portion 64. The connection portion 61 is connected to the terminal 13B of the electronic component 10A via the connection member 20B. The connection portion 62 is connected to the terminal 13A of the electronic component 10B via the connection member 20C. The extension portion 64 extends to the region R in which the electronic component 10B is overlapped, as viewed in the Z direction, and has an end portion 42e1 of the bus bar 42 at a position in which the electronic component 10B is overlapped.

[0121] The bus bar 42C has a connection portion 61, a second connection portion 62, and an extension portion 63. The connection portion 61 is connected to the terminal 13B of the electronic component 10B via the connection member 20D. The second connection portion 62 is disposed at the end portion on the +Y direction side of the sub unit SUS, and is connected to the bus bar 42 included in the other sub unit SU.

[0122] The bus bar 42D has a connection portion 61, a connection portion 62, and an extension portion 63. The connection portion 61 is connected to the terminal 13A of the electronic component 10C via the connection member 20E. The connection portion 62 is disposed at the end portion on the +Y direction side of the sub unit SUS, and is connected to the bus bar 42 included in the other sub unit SU.

[0123] (Exposure structure on the upper surface side of each bus bar)

[0124] In the present embodiment, at least a portion of the bus bar 42 is exposed on the upper surface side of the base plate 41S. For example, the connection portion 61, the connection portion 62, and the extension portion 63 of the bus bar 42 are exposed to the outside of the base plate 41S on the upper surface side (the first face 51a side of the planar portion 51) of the base plate 41S. For example, the extension portion 63 of the bus bar 42 is exposed to the outside of the base plate 41S on the upper surface side of the base plate 41S at least over the entire length between the connection portion 61 and the connection portion 62.

[0125] (Exposure structure on the lower surface side of each bus bar)

[0126] In the present embodiment, at least a portion of the bus bar 42 is exposed on the lower surface side of the base plate 41S. For example, the entire connection portion 61 and at least a portion of the extension portion 63 are exposed on the lower surface side (the first surface 51b side of the planar portion 51) of the base plate 41S to the outside of the base plate 41S. As described above, in the present embodiment, a gap S1 (refer to Figure 8 ) is formed between the planar portion 51 of the base plate 41S and the metal plate 110. The bus bar 42 includes an exposed portion 42u (refer to Figure 8 ) exposed on the gap S1. The exposed portion 42u includes, for example, the entire connection portion 61 and at least a portion of the extension portion 63.

[0127] <4.3.3 Fastening member>

[0128] Next, the fastening member 43 will be described.

[0129] Figure 8 is a cross-sectional view along the F8-F8 line of the structure shown in Figure 7 . The fastening member 43 is a member for fixing the bus bar 42 and the connection member 20 corresponding to the bus bar 42. The fastening member 43 is, for example, a rivet bolt fixed to the bus bar 42. The fastening member 43 is an example of a "fastening portion".

[0130] In the present embodiment, at least one of the connection portion 61 and the connection portion 62 of the bus bar 42 has a through-hole 42h. The through-hole 42h penetrates the bus bar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head portion 43b. The peripheral surface of the shaft portion 43a has a screw groove. The diameter of the head portion 43b is larger than the diameter of the shaft portion 43a. The fastening member 43 is fixed to the bus bar 42 with the head portion 43b in a state where the shaft portion 43a passes through the through-hole 42h of the bus bar 42. By this fixing, the fastening member 43 is electrically and physically connected to the bus bar 42 in a state where the shaft portion 43a protrudes from the through-hole 42h of the bus bar 42 in the +Z direction. In addition, the fastening member 43 is not limited to rivet fixing, but can be fixed to the bus bar 42 by welding or other methods.

[0131] In the present embodiment, the connection member 20 is mounted to the fastening member 43 in a state where it is first fixed to the electronic member 10 by the fastening member 71. For example, the connection member 20 causes the shaft portion 43a of the fastening member 43 to be inserted into the second mounting hole 22h of the second portion 22. Then, the engagement member 44 (for example, a nut) is caused to engage with the shaft portion 43a of the fastening member 43 protruding from the second mounting hole 22h of the second portion 22 of the connection member 20. The engagement member 44 is mounted to the shaft portion 43a along the Z direction. By this engagement, the second portion 22 of the connection member 20 is fixed to the fastening member 43.

[0132] (Thermally conductive member)

[0133] Here, the heat-conducting component 120 will be described first.

[0134] The thermally conductive component 120 is a component used to transfer heat generated by the electronic component 10 (e.g., electronic component 10S) when energized and / or the heat (Joule heat) generated by the busbar 42 itself when energized to the metal plate 110. The thermally conductive component 120 is, for example, a resilient thermally conductive sheet (e.g., a thermally conductive silicone sheet). The thermally conductive component 120 is, for example, formed of a material with a higher thermal conductivity than the substrate plate 41S (or the substrate component 41T described later). However, the thermally conductive component 120 is not limited to the above examples and may also be a thermally conductive component formed of thermally conductive gel or other materials. In this embodiment, the thermally conductive component 120 is insulating.

[0135] The heat-conducting component 120 includes a first heat-conducting component 120A and a second heat-conducting component 120B. The first heat-conducting component 120A is disposed between the metal plate 110 and the busbar 42 or the metal part 90. The second heat-conducting component 120B is disposed between the protrusion 118 and the electronic component 10 or the connecting component 20.

[0136] In this embodiment, the first heat-conducting component 120A is partially disposed in the wiring substrate 40S (see reference). Figure 2 For example, when viewed from the Z direction, the first heat-conducting component 120A is positioned to overlap with a portion of the busbar 42. In this disclosure, the first heat-conducting component 120A is positioned between the busbar 42 and the planar portion 111 of the metal plate 110 (described later). For example, the heat-conducting component 120 is positioned between the exposed portion 42u of the busbar 42 and the planar portion 111 of the metal plate 110, contacting both the exposed portion 42u of the busbar 42 and the planar portion 111 of the metal plate 110. The heat-conducting component 120 transfers heat from the electronic component 10 (e.g., electronic component 10S) to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the planar portion 111 of the metal plate 110.

[0137] In the present embodiment, the first heat conductive member 120A is disposed at a position overlapping with a part of the bus bar 42 in the vicinity of the electronic component 10 (for example, the electronic component 10S) when viewed in the Z direction. In the present embodiment, the first heat conductive member 120A is disposed at a position overlapping with the connection member 20 when viewed in the Z direction. In other words, the first heat conductive member 120A is disposed at a position overlapping with the connection portion 61 or the connection portion 62 of the bus bar 42 when viewed in the Z direction. The first heat conductive member 120A transfers heat generated from the electronic component 10S to the planar portion 111 of the metal plate 110 in the first heat dissipation path. The first heat dissipation path is a heat dissipation path in which the electronic component 10, the connection member 20, the bus bar 42, and the planar portion 111 of the metal plate 110 are sequentially heat connected. According to the first heat dissipation path, the first heat conductive member 120A transfers heat moving from the electronic component 10 to the bus bar 42 via the connection member 20 from the bus bar 42 to the planar portion 111.

[0138] In the present embodiment, the second heat conductive member 120B is disposed between the electronic component 10 (for example, the electronic component 10S) and the protruding portion 118 or between the connection member 20 and the protruding portion 118. The second heat conductive member 120B transfers heat generated from the electronic component 10 to the planar portion 111 of the metal plate 110 in the second heat dissipation path. The second heat dissipation path will be described later.

[0139] <4.4 Wiring substrate and electronic component fixing structure>

[0140] Next, a fixing structure of the wiring substrate 40S and the electronic component 10 will be described.

[0141] As shown in FIG. 4, the metal plate 110 has, for example, in addition to the planar portion 111 described later, a fixing portion 112 and a fixing portion 113. Figure 9

[0142] The fixing portion 112 is a fixing portion for fixing the base substrate 41S to the metal plate 110. The fixing portion 112 is provided at a position corresponding to the fixing portion 53 of the base substrate 41S when viewed in the Z direction. The fixing portion 112 is a cylindrical or prismatic boss protruding in the +Z direction from the planar portion 111 of the metal plate 110. The fixing portion 112 has an engagement hole 112h opening in the +Z direction. An inner peripheral surface of the engagement hole 112h has a screw groove.

[0143] As described above, the fixing portion 53 of the base substrate 41S has a mounting hole 53h. A fastening member 115 (for example, a screw or a bolt) passes through the mounting hole 53h. When the fastening member 115 passing through the mounting hole 53h of the fixing portion 53 of the base substrate 41S engages with the engagement hole 112h of the fixing portion 112 of the metal plate 110, the base substrate 41S is fixed to the metal plate 110.​

[0144] The fixing portion 113 is a fixing portion for fixing the electronic component 10 (for example, the electronic component 10S) directly to the metal plate 110 without passing through the base plate 41S. The fixing portion 113 is provided at a position corresponding to the mounting portion 14 of the electronic component 10 when viewed in the Z direction. The fixing portion 113 is a cylindrical or prismatic boss protruding in the +Z direction from the planar portion 111. The fixing portion 113 has an engagement hole 113h which is open in the +Z direction. The inner peripheral surface of the engagement hole 113h has a threaded groove.

[0145] In the present embodiment, the planar portion 51 of the base plate 41S has a through-hole 51h. The through-hole 51h penetrates the planar portion 51 in the Z direction. The through-hole 51h is provided at a position corresponding to the fixing portion 113 of the metal plate 110 when viewed in the Z direction. The fixing portion 113 of the metal plate 110 protrudes through the through-hole 51h of the base plate 41S to the same position as the first face 51a of the planar portion 51 or a position on the +Z direction side from the first face 51a of the planar portion 51. The mounting portion 14 of the electronic component 10 contacts the fixing portion 113 at the same position as the first face 51a of the planar portion 51 or a position on the +Z direction side from the first face 51a of the planar portion 51.

[0146] The fastening member 116 (for example, a screw or a bolt) passes through the mounting hole 14h of the mounting portion 14 of the electronic component 10 from the +Z direction side. When the fastening member 116 passing through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engagement hole 113h of the fixing portion 113 of the metal plate 110, the electronic component 10 is fixed to the metal plate 110 without passing through the base plate 41S. In addition, instead of the above-described example, the electronic component 10 can be fixed to a fixing portion provided at the base plate 41S.

[0147] <5. Shape example of bus bar>

[0148] Next, a shape example of the bus bar 42 will be described.

[0149] <5.1 First shape example of bus bar>

[0150] Figure 10 is a plan view for illustrating a first shape example of the bus bar 42. In the present embodiment, the bus bar 42A is an example of a "first bus bar". The connecting portion 61 of the bus bar 42A is an example of a "first connecting portion". The extension portion 63 of the bus bar 42A includes a first straight portion 63a extending in the Y direction from the connecting portion 61 of the bus bar 42A and a second straight portion 63b bent from the first straight portion 63a and extending in the X direction. The first straight portion 63a of the bus bar 42A is an example of a "first extension portion". The connecting member 20A is an example of a "first connecting member".

[0151] The X-direction width W11 of the connecting portion 61 of the bus bar 42A is larger than the X-direction width W12 (for example, the X-direction width W12 of the first straight portion 63a) of the extending portion 63 of the bus bar 42A. In the present embodiment, the connecting portion 61 and the first straight portion 63a of the extending portion 63 are housed in the housing portion 55. Also, inside the housing portion 55, the X-direction width W11 of the connecting portion 61 of the bus bar 42A is larger than the X-direction width W12 of the extending portion 63 of the bus bar 42A. The width W11 is, for example, the minimum X-direction width of the connecting portion 61. The width W12 is, for example, the minimum X-direction width of the extending portion 63 (for example, the minimum X-direction width of the first straight portion 63a).

[0152] In the present embodiment, the X-direction width W12 of the extending portion 63 of the bus bar 42A (for example, the X-direction width W12 of the first straight portion 63a) is the same as or smaller than the X-direction width W13 (refer to FIG. 6) of the connecting member 20A. On the other hand, the X-direction width W11 of the connecting portion 61 is larger than the X-direction width W13 of the connecting member 20A. The width W13 is, for example, the minimum X-direction width of the connecting member 20A. Figure 7 ) of the connecting member 20A. On the other hand, the X-direction width W11 of the connecting portion 61 is larger than the X-direction width W13 of the connecting member 20A. The width W13 is, for example, the minimum X-direction width of the connecting member 20A.

[0153] The connecting portion 61 has an edge 61e1 extending in the Y-direction and an edge 61e2 extending in the Y-direction on the side opposite the edge 61e1 in the X-direction. The edge 61e1 is an example of a “first edge”. The edge 61e2 is an example of a “second edge”.

[0154] The extending portion 63 (for example, the first straight portion 63a) has an edge 63e1 extending in the Y-direction and an edge 63e2 extending in the Y-direction on the side opposite the edge 63e1 in the X-direction. The edge 63e1 is an example of a “third edge”. The edge 63e2 is an example of a “fourth edge”.

[0155] In the present embodiment, the edge 61e1 of the connecting portion 61 and the edge 63e1 of the extending portion 63 are continuous in a straight line in the Y-direction. On the other hand, there is a step 42st in the X-direction between the edge 61e2 of the connecting portion 61 and the edge 63e2 of the extending portion 63.

[0156] Also, in the present embodiment, the bus bar 42B is an example of a “second bus bar”. The connecting portion 61 of the bus bar 42B is an example of a “second connecting portion”. The extending portion 63 of the bus bar 42B includes a first straight portion 63a extending in the Y-direction from the connecting portion 61 of the bus bar 42B and a second straight portion 63b bent from the first straight portion 63a and extending in the X-direction. The first straight portion 63a of the extending portion 63 of the bus bar 42B is an example of a “second extending portion”. The connecting member 20B is an example of a “second connecting member”.

[0157] In this embodiment, the width W21 of the connecting portion 61 of the busbar 42B in the X direction is larger than the width W22 of the extension portion 63 of the busbar 42B in the X direction (e.g., the width W22 of the first straight portion 63a in the X direction). In this embodiment, the connecting portion 61 and the first straight portion 63a of the extension portion 63 are housed in the housing portion 55. Furthermore, inside the housing portion 55, the width W21 of the connecting portion 61 of the busbar 42B in the X direction is larger than the width W22 of the extension portion 63 of the busbar 42B in the X direction. The width W21 is, for example, the minimum width of the connecting portion 61 in the X direction. The width W22 is, for example, the minimum width of the extension portion 63 in the X direction (e.g., the minimum width of the first straight portion 63a in the X direction).

[0158] like Figure 10 As shown, the connecting portion 61 of busbar 42A and the connecting portion 61 of busbar 42B are adjacent in the X direction. The first straight portion 63a of the extension portion 63 of busbar 42A and the first straight portion 63a of the extension portion 63 of busbar 42B are adjacent in the X direction. Furthermore, in this embodiment, the connecting portion 61 of busbar 42A protrudes relative to the first straight portion 63a of the extension portion 63 of busbar 42A towards the side opposite to busbar 42B (-X direction side). On the other hand, the connecting portion 61 of busbar 42B protrudes relative to the first straight portion 63a of the extension portion 63 of busbar 42B towards the side opposite to busbar 42A (+X direction side).

[0159] In this embodiment, the width W11 of the connecting portion 61 of busbar 42A in the X direction is the same as the width W21 of the connecting portion 61 of busbar 42B in the X direction. On the other hand, the width W12 of the extension portion 63 of busbar 42A in the X direction is smaller than the width W22 of the extension portion 63 of busbar 42B in the X direction. Busbar 42B, for example, has greater heat dissipation or heat storage capacity compared to busbar 42A.

[0160] In this embodiment, the first heat-conducting component 120A has a size that extends across the connecting portion 61 of busbar 42A and the connecting portion 61 of busbar 42B. For example, when viewed from the Z direction, the first heat-conducting component 120A overlaps with the connecting portion 61 of busbar 42A and the connecting portion 61 of busbar 42B. The first heat-conducting component 120A thermally connects busbar 42A and busbar 42B. Therefore, when the temperature of busbar 42B is lower than the temperature of busbar 42A, a portion of the heat from busbar 42A moves to busbar 42B via the first heat-conducting component 120A. With this structure, the heat dissipation performance of the electrical connection unit 1 can be further improved by homogenizing the heat of the multiple busbars 42.

[0161] <5.2 Example of the second shape of the busbar>

[0162] Figure 11 is a plan view for explaining a second shape example of the bus bar 42. In the present embodiment, the electronic component 10A is an example of the "first electronic component". The electronic component 10B is an example of the "second electronic component". The connecting portion 61 of the bus bar 42B is an example of the "first connecting portion". The connecting portion 62 of the bus bar 42B is an example of the "second connecting portion". In the present embodiment, the extension portion 63 of the bus bar 42B has, for example, a first straight portion 63a, a second straight portion 63b, and a third straight portion 63c.

[0163] The first straight portion 63a extends from the connecting portion 61 in a direction different from a direction in which the connecting portion 61 faces the connecting portion 62 at the shortest distance from the connecting portion 61 of the bus bar 42B. The first straight portion 63a extends, for example, in the Y direction. The first straight portion 63a is an example of the "first extension portion".

[0164] The first straight portion 63a includes a first end portion (first part) 63aa connected to the connecting portion 61 and a second end portion (second part) 63ab located on the side opposite to the first end portion 63aa. For example, the first end portion 63aa is located on the -Y direction side with respect to the connecting portion 62 in the extension direction (Y direction) of the first straight portion 63a. On the other hand, the second end portion 63ab is located on the side opposite to the first end portion 63aa (+Y direction side) with respect to the connecting portion 62 in the extension direction (Y direction) of the first straight portion 63a.

[0165] In the present embodiment, at least a part of the first straight portion 63a overlaps the electronic component 10A in the Z direction. For example, a region R in which the first straight portion 63a overlaps the electronic component 10A when viewed from the Z direction extends across the -Y direction side and the +Y direction side of the region R.

[0166] The second straight portion 63b extends from the second end portion 63ab of the first straight portion 63a toward the connecting portion 62. However, the second straight portion 63b extends, for example, from the second end portion 63ab in a direction different from a direction in which the second end portion 63ab of the first straight portion 63a faces the connecting portion 62 of the bus bar 42B at the shortest distance. The second straight portion 63b, for example, bends from the first straight portion 63a and extends in the X direction. The second straight portion 63b is an example of the "second extension portion". The second straight portion 63b does not overlap any electronic component 10 when viewed from the Z direction.

[0167] The third straight portion 63c extends from the second straight portion 63b toward the connecting portion 62 of the bus bar 42B. The third straight portion 63c extends, for example, in the Y direction. In other words, the third straight portion 63c extends in parallel with the first straight portion 63a. The third straight portion 63c is an example of the "third extension portion".

[0168] In the present embodiment, the connection portion 61, the connection portion 62, the first straight portion 63a, the second straight portion 63b, and the third straight portion 63c of the bus bar 42B are included in the horizontal plate portion 42p and are located on the same plane. The connection portion 61, the connection portion 62, the first straight portion 63a, the second straight portion 63b, and the third straight portion 63c of the bus bar 42B are, for example, housed in the housing portion 55.

[0169] In the present embodiment, the width W23 in the Y direction of the second straight portion 63b of the bus bar 42B is larger than the width W22 in the X direction of the first straight portion 63a of the bus bar 42B. The width W22 is, for example, the width in the X direction of a portion of the bus bar 42B that, when viewed in the Z direction, is located in the region R that overlaps the electronic component 10A. The width W22 is, for example, the minimum width in the X direction of the first straight portion 63a. The width W23 is, for example, the minimum width in the Y direction of the second straight portion 63b.

[0170] In the present embodiment, at least a portion (for example, all) of the first straight portion 63a and at least a portion (for example, all) of the second straight portion 63b are housed in the housing portion 55. Also, inside the housing portion 55, the width W23 in the Y direction of the second straight portion 63b is larger than the width W22 in the X direction of the first straight portion 63a.

[0171] In another viewpoint, in the present embodiment, the width W23 in the Y direction of the second straight portion 63b of the bus bar 42B is larger than the width W13 (refer to Figure 7 ) in the X direction of the connection member 20B.

[0172] <6. Structure of sub-unit SUT>

[0173] Next, the structure of the sub-unit SUT will be described.

[0174] Figure 12 is a perspective view showing the sub-unit SUT. The sub-unit SUT includes, for example, a plurality of electronic components 10, a wiring structure body 40T, an auxiliary base member 101 (refer to Figure 16 ), and a metal portion 90 (refer to Figure 14 ).

[0175] <6.1 Electronic component>

[0176] First, the electronic component 10 will be described. The plurality of electronic components 10 includes a plurality of electronic components 10TA (only one is illustrated in Figure 12 ) and a plurality of electronic components 10TB (only one is illustrated in Figure 12 ). Furthermore, the plurality of electronic components 10 can have only either of the electronic components 10TA and 10TB.

[0177] The electronic component 10TA is an example of the electronic component 10T described above. The electronic component 10TA is an electronic component having a smaller amount of heat generation at the time of energization than the electronic component 10S. On the other hand, the electronic component 10TB is another example of the electronic component 10T described above. The electronic component 10TB is an electronic component having poor mountability (for example, requiring a complicated implementation structure) compared to the electronic component 10S. The electronic component 10TB, for example, has a terminal 13 protruding in the -Z direction toward the planar portion 111 of the metal plate 110 (refer to FIG. 10A). Figure 16 ) The electronic component 10TB, for example, has a smaller amount of heat generation at the time of energization than the electronic component 10S.

[0178] Hereinafter, without distinguishing between the electronic component 10TA and the electronic component 10TB, the electronic component 10T will be simply referred to as "electronic component 10T". The electronic component 10T is also, for example, a connector, a fuse, a capacitor, a branch component, various sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of them are unified. However, the type of the electronic component 10T is not limited to the above examples.

[0179] Figure 13 is a front view illustrating the electronic component 10TA. The electronic component 10TA is, for example, an electronic component in which a plurality of terminals 13 are separately arranged at both ends in the horizontal direction of the electronic component 10TA. In the present embodiment, the terminal 13A and the terminal 13B are separately arranged at both ends in the Y direction of the electronic component 10TA. The terminal 13A and the terminal 13B protrude from the central portion in the Z direction of the housing 11 in the horizontal direction (for example, the +Y direction or the -Y direction). Each terminal 13 has a mounting hole 13h through which a fastening member 43 (for example, a screw or a bolt) passes. The mounting hole 13h is open in the Z direction.

[0180] <6.2 Wiring Structure>

[0181] Next, the wiring structure 40T will be described with reference to Figure 12 The wiring structure 40T is a component that forms at least a portion of an energization path between a plurality of electronic components 10 (for example, a plurality of electronic components 10T) and / or at least a portion of an energization path between an electronic component 10 (for example, an electronic component 10T) included in a subunit SUT and an electronic component 10 included in another subunit SU (for example, a subunit SUS). The wiring structure 40T, for example, includes a base member 41T, one or more (for example, a plurality) of bus bars 42, and a plurality of fastening members 43. In addition, with regard to the fastening member 43, since the content is the same as that of the fastening member 43 described in the subunit SUS, the overlapping description is omitted.

[0182] <6.2.1 Base Member>

[0183] Figure 14 This is a perspective view showing the base component 41T. The base component 41T is a support component that integrally supports a plurality of busbars 42 arranged horizontally and spaced apart from each other. The base component 41T is made of, for example, synthetic resin and has insulating properties. The base component 41T electrically insulates the plurality of busbars 42, for example, by ribs (not shown). The base component 41T can also be referred to as an "insulating substrate". The base component 41T has a three-dimensional structure that is thicker in the Z direction than the base plate 41S included in the subunit SUS. The base component 41T includes, for example, a support wall 81, a frame portion 85 (peripheral wall portion), and a fixing portion 87.

[0184] (Supporting wall)

[0185] The support wall 81 is, for example, a plate-like wall section along the horizontal direction. Multiple busbars 42 are disposed on the support wall 81 and supported from below by the support wall 81 (see reference). Figure 12 Furthermore, the support wall 81 supporting the busbar 42 is not limited to a wall portion along the horizontal direction, but may also be a grid-like wall portion formed by multiple ribs extending in the Z direction. In this embodiment, a fastening member 43 is installed on the support wall 81. The fastening member 43 protrudes from the support wall 81 in the +Z direction.

[0186] (The housing section that contains electronic components)

[0187] In this embodiment, the base component 41T has a receiving portion 84A that opens towards the +Z direction. The receiving portion 84A is, for example, a recess in the Z direction of a part of the support wall 81, or a through hole that penetrates the support wall 81 in the Z direction. When viewed from the Z direction, the receiving portion 84A has a shape corresponding to the shape of the housing 11 (i.e., the main body portion 12) of the electronic component 10 (e.g., the electronic component 10T). At least a portion of the electronic component 10 (e.g., the electronic component 10T) (e.g., at least a portion of the main body portion 12) is received in the receiving portion 84A. At least a portion of the electronic component 10 received in the receiving portion 84A is located on the -Z direction side compared to the support wall 81.

[0188] (The containment department of the metal containment unit)

[0189] In this embodiment, the base component 41T has a receiving portion 84B that opens towards the +Z direction. The receiving portion 84B is, for example, a recess in the Z direction of a portion of the support wall 81, or a through hole extending through the support wall 81 in the Z direction. When viewed from the Z direction, the receiving portion 84B has a shape corresponding to the shape of the metal portion 90 described later. At least a portion of the metal portion 90 is received in the receiving portion 84B. The at least portion of the metal portion 90 received in the receiving portion 84B is located on the -Z direction side compared to the support wall 81.

[0190] (frame portion)

[0191] The frame portion 85 is provided at the peripheral end portion of the base member 41T. The frame portion 85 is a rib (peripheral wall portion) that extends in the Z direction at the peripheral end portion of the base member 41T. The width (thickness) H21 of the frame portion 85 (peripheral wall portion) in the Z direction is, for example, one-half or more of the width (thickness) H22 of the electronic component 10 (for example, the electronic component 10TA) in the Z direction (refer to Figure 16 ). Note that the frame portion 85 can be omitted.

[0192] (fixing portion)

[0193] The fixing portion 87 is a portion that is fixed to the metal plate 110 (refer to Figure 16 ). The fixing portion 87 faces the fixing portion 112 of the metal plate 110 in the Z direction. The fixing portion 87 has a mounting hole 87h that penetrates the base member 41T in the Z direction. The fastening member 115 (for example, a screw or a bolt) passes through the mounting hole 87h. When the fastening member 115 that passes through the mounting hole 87h is engaged with the engagement hole 112h of the fixing portion 112 of the metal plate 110, the base member 41T is fixed to the metal plate 110.

[0194] <6.2.2 Bus Bar>

[0195] Next, the bus bar 42 included in the wiring structure 40T will be described.

[0196] Figure 15 is a plan view that shows the wiring structure 40T. The bus bar 42 is a wiring member (electrical connection member) included in the wiring structure 40T. The bus bar 42 is, for example, a wiring member for electrically connecting a plurality of electronic components 10 (for example, a plurality of electronic components 10T). Alternatively, the bus bar 42 can be a wiring member for connecting the electronic component 10 (for example, the electronic component 10T) to an electronic component 10 included in another subunit SU (for example, the subunit SUS). In the present embodiment, a plurality of bus bars 42 are supported by the base member 41T from below and are disposed at positions away from the metal plate 110. The bus bar 42 is disposed, for example, directly below the terminal 13 of the electronic component 10. The bus bar 42 overlaps the component main body portion 12 of the electronic component 10 when viewed in the X direction or the Y direction (refer to Figure 17 ).

[0197] The plurality of bus bars 42 includes, for example, four bus bars 42E, 42F, 42G, and 42I. The four bus bars 42E, 42F, 42G, and 42I are arranged in the horizontal direction at intervals from each other. The four bus bars 42E, 42F, 42G, and 42I include portions arranged on the same plane. At least a portion of each bus bar 42 is a horizontal plate portion 42p. In the present embodiment, each bus bar 42 is plate-shaped along the horizontal direction throughout the entire length. The horizontal plate portion 42p of each bus bar 42 includes a connection portion 61, a connection portion 62, and an extension portion 63. In the present embodiment, the sub unit SUT has the electronic component 10D as one of the plurality of electronic components 10T.

[0198] The connection portion 61 of the bus bar 42E is connected to the bus bar 42 included in the sub unit SUS. Likewise, the connection portion 61 of the bus bar 42F is connected to the bus bar 42 included in the sub unit SUS. The connection portion 62 of the bus bar 42F is physically and electrically connected to the terminal 13A of the electronic component 10D. For example, the terminal 13A of the electronic component 10D is placed on the horizontal plate portion 42p of the bus bar 42F, thereby being connected to the connection portion 62 of the bus bar 42F.

[0199] The connection portion 61 of the bus bar 42G is physically and electrically connected to the terminal 13B of the electronic component 10D. For example, the terminal 13B of the electronic component 10D is connected to the connection portion 61 of the bus bar 42G by being placed on the horizontal plate portion 42p of the bus bar 42G. The connection portion 61 of the bus bar 42G is an example of the "first connection portion". The connection portion 62 of the bus bar 42G is physically and electrically connected to the bus bar 76 for external connection. The connection portion 62 of the bus bar 42G is connected to an external device via the bus bar 76. The connection portion 62 of the bus bar 42G is an example of the "second connection portion". The bus bar 76 is an example of the "external connection component". In addition, the connection portion 62 of the bus bar 42G can be physically and electrically connected to the terminal 13 of another electronic component 10 instead of the bus bar 76.

[0200] The connection portion 61 of the bus bar 42I is connected to the bus bar 42 included in the sub unit SUS. The connection portion 62 of the bus bar 42I is physically and electrically connected to the terminal 13A of the electronic component 10T not shown.

[0201] <6.3 Auxiliary base component>

[0202] Next, the auxiliary base component 101 will be described.

[0203] Figure 16 is along Figure 15A sectional view of the F16-F16 line of the structure shown. The auxiliary base member 101 is made of, for example, a synthetic resin, and has insulating properties. A plurality of wirings 102 are provided on the surface of the auxiliary base member 101. The wiring 102 is, for example, a conductive layer (metal layer) provided on the surface of the auxiliary base member 101. The auxiliary base member 101 is disposed between the base member 41T and the planar portion 111 of the metal plate 110 in the Z direction. The auxiliary base member 101 faces the electronic component 10TB from the -Z direction side. The terminal 13 of the electronic component 10TB is electrically connected to the wiring 102 provided on the auxiliary base member 101 at a position between the base member 41T and the planar portion 111 of the metal plate 110. The auxiliary base member 101 is an example of a "third base member".

[0204] <6.4 Metal portion>

[0205] Next, with reference to Figure 14 The metal portion 90 is described. The metal portion 90 is, for example, a structure that reduces thermal interference from an external device on the electronic component 10 included in the subunit SUT.

[0206] The metal portion 90 is, for example, a heat conducting portion that transmits a portion of heat from an external device toward the electronic component 10 (for example, the electronic component 10T) via the bus bar 76 to the planar portion 111 of the metal plate 110 described later. Instead of the above, the metal portion 90 can also be a heat conducting portion that transmits at least a portion of heat emitted by the electronic component 10 and / or at least a portion of heat emitted by the bus bar 42 itself to the planar portion 111 of the metal plate 110. The planar portion 111 of the metal plate 110 is disposed separately from the bus bar 42 in the Z direction. The planar portion 111 of the metal plate 110 faces the bus bar 42 in the Z direction. The planar portion 111 of the metal plate 110 is an example of an "opposite portion".

[0207] The metal portion 90 is, for example, a heat storage member (heat absorbing member) that increases the heat capacity of the energization path included in the subunit SUT. The metal portion 90, for example, stores (absorbs) a portion of heat from an external device toward the electronic component 10 (for example, the electronic component 10T) via the bus bar 76. Instead of the above, the metal portion 90 can also store (absorb) at least a portion of heat emitted by the electronic component 10 and / or at least a portion of heat emitted by the bus bar 42 itself. In the case of using the metal portion 90 as a heat storage member, the metal portion 90 can not be thermally connected to the metal plate 110.

[0208] Figure 17 is a sectional view of the F17-F17 line of the structure shown. Figure 15 is a sectional view of the F17-F17 line of the structure shown. Figure 18 is a sectional view of the F17-F17 line of the structure shown. Figure 15A sectional view of the F18-F18 line of the structure shown. In this embodiment, the metal portion 90 is provided separately from the metal plate 110. The metal portion 90 is, for example, a solid metal block. In addition, the shape of the metal portion 90 is not limited to the above example. The metal portion 90 can also be a member having a cross-sectional shape of an I-shape, an L-shape, or a C-shape. The metal portion 90 can also be formed integrally with the base member 41T by insert molding.

[0209] The thickness H31 of the metal portion 90 in the Z direction is thicker than the thickness T1 of the horizontal plate portion 42p of the bus bar 42 in the Z direction. For example, the thickness H31 of the metal portion 90 in the Z direction is 2 times or more the thickness T1 of the horizontal plate portion 42p of the bus bar 42 in the Z direction.

[0210] In this embodiment, the width W31 of the metal portion 90 in the X direction is larger than the width W32 of the electronic component 10 in the X direction (refer to Figure 15 ). In other views, the width W31 of the metal portion 90 in the X direction (refer to Figure 15 ) is larger than the thickness H31 of the metal portion 90 in the Z direction (refer to Figure 18 ).

[0211] In this embodiment, the base member 41T is disposed between the bus bar 42 and the planar portion 111 of the metal plate 110. The base member 41T has a housing portion 84B that is open in the Z direction. At least a portion of the metal portion 90 is housed in the housing portion 84B.

[0212] The metal portion 90 is disposed between the bus bar 42 and the planar portion 111 of the metal plate 110 in the Z direction. The metal portion 90 faces the bus bar 42 from the Z direction and is thermally connected to the bus bar 42.

[0213] In this embodiment, the metal portion 90 is disposed, for example, between the extension portion 63 of the bus bar 42 and the planar portion 111 of the metal plate 110. The metal portion 90 faces the extension portion 63 of the bus bar 42 from the Z direction and is thermally connected to the extension portion 63 of the bus bar 42.

[0214] In this embodiment, the metal portion 90 has an engagement hole 90h that is open in the +Z direction. The inner peripheral surface of the engagement hole 90h has a threaded groove. The extension portion 63 of the bus bar 42 has a through-hole 42h that opposes the engagement hole 90h. A fastening member 117 (for example, a screw or a bolt) passes through the through-hole 42h of the bus bar 42 from the +Z direction side. When the fastening member 117 that has passed through the through-hole 42h of the bus bar 42 engages with the engagement hole 90h of the metal portion 90, the extension portion 63 of the bus bar 42 is fixed to the metal portion 90.

[0215] In the present embodiment, the first heat conductive member 120A is arranged between the metal portion 90 and the planar portion 111 of the metal plate 110. Instead of or in addition to the above example, the first heat conductive member 120A can be arranged between the metal portion 90 and the bus bar 42.

[0216] As shown in FIG. 12, the metal portion 90 is arranged between the terminal 13B of the electronic component 10 and the bus bar 76 for external connection, in a case where viewed from the Z direction. Thus, heat from the bus bar 76 toward the electronic component 10 through the bus bar 42 is easily moved to the metal portion 90 before reaching the electronic component 10. Figure 15

[0217] The metal portion 90 includes, for example, a first portion 91 and a second portion 92. The first portion 91 is located on the +Y direction side with respect to the terminal 13B of the electronic component 10, in a case where viewed from the Z direction. The second portion 92 is located on the -X direction side or the +X direction side with respect to the terminal 13B of the electronic component 10, in a case where viewed from the Z direction. The first portion 91 and the second portion 92 are integrally formed. According to such a structure, it is easy to secure a larger volume of the metal portion 90, compared with a cuboid-shaped metal portion 90.

[0218] <7. Connection structure of sub-units>

[0219] Next, the connection structure between the plurality of sub-units SU is described.

[0220] Figure 19 FIG. 13 is a perspective view showing the connection structure of the sub-unit SUS and the sub-unit SUT. In the present embodiment, a step ST based on the difference in the Z-direction height of the base plate 41S of the sub-unit SUS and the base member 41T of the sub-unit SUT is formed between the sub-unit SUS and the sub-unit SUT. Further, with the step ST, a crossing structure in which the bus bar 42 included in the sub-unit SUS and the bus bar 42 included in the sub-unit SUT are three-dimensionally crossed is realized.

[0221] For example, the bus bars 42E, 42F, 42I included in the sub-unit SUT maintain the Z-direction height supported by the base member 41T, and extend to a position overlapping the base plate 41S of the sub-unit SUS in the Z direction, to the -Y direction. The connection portions 61 of the bus bars 42E, 42F, 42I each are away from the base plate 41S of the sub-unit SUS in the Z direction, and face the base plate 41S of the sub-unit SUS in the Z direction.

[0222] ​On the other hand, the connecting portion 62 of the bus bar 42A included in the sub unit SUS is raised in the +Z direction with respect to the extension portion 63 of the bus bar 42A, and contacts the connecting portion 61 of the bus bar 42E from the -Z direction side. The connecting portion 62 of the bus bar 42A and the connecting portion 61 of the bus bar 42E are fixed by the fastening member 43 and the engagement member 44.

[0223] Similarly, the connecting portion 62 of the bus bar 42C included in the sub unit SUS is raised in the +Z direction with respect to the extension portion 63 of the bus bar 42C, and contacts the connecting portion 61 of the bus bar 42I from the -Z direction side. The connecting portion 62 of the bus bar 42C and the connecting portion 61 of the bus bar 42I are fixed by the fastening member 43 and the engagement member 44.

[0224] The extension portion 63 of the bus bar 42D included in the sub unit SUS extends in the X direction between the planar portion 111 of the metal plate 110 and the bus bar 42I. For example, the extension portion 63 of the bus bar 42D passes through a region overlapping the bus bar 42I when viewed from the Z direction, and extends across the +X direction side and the -X direction side of the bus bar 42I. The connecting portion 62 of the bus bar 42D is raised in the +Z direction with respect to the extension portion 63 of the bus bar 42D, and contacts the connecting portion 61 of the bus bar 42F from the -Z direction side. The connecting portion 62 of the bus bar 42D and the connecting portion 61 of the bus bar 42F are fixed by the fastening member 43 and the engagement member 44.

[0225] Further, between the sub unit SUS and the sub unit SUT, a sufficient space in which air easily flows is ensured above the wiring substrate 40S by the difference in the height in the Z direction between the first base member (for example, the base plate 41S) of the sub unit SUS and the second base member (for example, the base member 41T) of the sub unit SUT. Thus, air of the heated gap S1 easily moves above the planar portion 51 through the opening 57.

[0226] In addition, since there is a difference in the height in the Z direction between the first base member and the second base member between the sub unit SUS and the sub unit SUT, the through opening 57 is easily provided in the sub unit SUS. When the opening 57 is easily provided, the protruding portion 118 described later is easily exposed, and the heat dissipation of the electrical connection unit 1 in the first region R1 is improved.

[0227] <8. Extension structure of bus bar>

[0228] Figure 20 is along Figure 15A sectional view of the F20-F20 line of the structure shown. In this embodiment, 1 bus bar 42 (bus bar 42K) is arranged between the base member 41T and the planar portion 111 of the metal plate 110, extending in the Y direction in the gap S2 between the base member 41T and the planar portion 111 of the metal plate 110. The bus bar 42K extends, for example, across the -Y direction side and the +Y direction side of the base member 41T. The connection portion 61 of the bus bar 42K is physically and electrically connected to the bus bar 42 included in the sub unit SUS. The connection portion 62 of the bus bar 42K is physically and electrically connected to the bus bar 76 for external connection. The bus bar 42K is an example of a "third bus bar".

[0229] <9. Metal plate and insulating cover>

[0230] Next, the metal plate 110 and the insulating cover 130 will be described. Figure 2

[0231] <9.1 Metal plate>

[0232] The metal plate 110 is a member that ensures the rigidity of the electrical connection unit 1 and improves the heat dissipation property of the electrical connection unit 1. The metal plate 110 is made of metal (for example, made of aluminum or an aluminum alloy). The metal plate 110 is an example of a "rigid member". The metal plate 110 can also be referred to as a "metal member" or a "heat dissipation member".

[0233] The metal plate 110 is rectangular in shape along the X direction and the Y direction. The metal plate 110 has a first end portion 110e1, a second end portion 110e2, a third end portion 110e3, and a fourth end portion 110e4. The first end portion 110e1 and the second end portion 110e2 are a pair of end portions in the long side direction of the metal plate 110, separated in the X direction. The third end portion 110e3 and the fourth end portion 110e4 are a pair of end portions in the short side direction of the metal plate 110, separated in the Y direction. The metal plate 110 includes, for example, the planar portion 111, the plurality of fixing portions 112 described above (refer to Figure 9 ), the plurality of fixing portions 113 described above (refer to Figure 9 ), and at least one protruding portion 18. The planar portion 111 is an example of a "main body portion".

[0234] The planar portion 111 is a portion of the metal plate 110 formed in a plate shape. The planar portion 111 is a plate shape in the horizontal direction. The planar portion 111 forms a main portion of the metal plate 110. The planar portion 111 forms a base portion (metal base portion) of the metal plate 110. The planar portion 111 has a size that covers two sub units SU from below.

[0235] The planar portion 111 in the present disclosure is located on the side opposite the electronic component 10 with respect to the base plate 41S.

[0236] ​As described above, the metal plate 110 in the present disclosure is provided with a plurality of protruding portions 118 at the planar portion 111. The plurality of protruding portions 118 include protruding portions 118A, 118B, 118C, 118D. In the following description, a representative protruding portion 118 is described in detail.

[0237] The protruding portion 118 protrudes from the planar portion 111 through inside the opening 57, facing the electronic component 10. Alternatively, the protruding portion 118 protrudes from the planar portion 111 through inside the opening 57, facing the connecting component 20 that connects the electronic component 10 and the bus bar 42. When viewed from the first direction (for example, the direction), the protruding portion 118 is a plate shape that extends along a part of the approximate shape of the electronic component 10.

[0238] As described above, the second heat conductive component 120B is arranged between the protruding portion 118 and the electronic component 10. The heat conductive component 120B faces the electronic component 10 or the connecting component 20 from a direction (for example, the direction) that intersects the first direction. For example, the heat conductive component 120B in the present disclosure is formed in a plate shape.

[0239] In the present disclosure, the protruding portion 118A protrudes from the planar portion 111 through inside the opening 57A, facing the connecting component 20. The protruding portion 118B protrudes from the planar portion 111 through inside the opening 57B, facing the electronic component 10 (the electronic component 10S, 10A). The protruding portion 118C protrudes from the planar portion 111 through inside the opening 57C, facing the electronic component 10 (the electronic component 10S, 10B). The protruding portion 118D protrudes from the planar portion 111 through inside the opening 57D, facing the electronic component 10 (the electronic component 10S, 10C). According to the above, the openings 57 in the present disclosure are inserted through the protruding portions 118 that the metal plate 110 has. Further, the protruding portions 118 can also have a curved line. For example, the protruding portion 118B has a curved line in order to make the second heat conductive component 120B contact the second portion 22 of the connecting component 20.

[0240] In the present embodiment, the planar portion 111 has a first region A1 and a second region A2. The first region A1 is, for example, a region of the -Y direction side in the planar portion 111. When viewed from the Z direction, the above-described sub unit SUS faces the first region A1 of the planar portion 111. That is, the plurality of electronic components 10S and the base plate 41S included in the sub unit SUS face the first region A1 of the planar portion 111 in the Z direction.

[0241] The second region A2 is, for example, a region of the +Y direction side in the planar portion 111. When viewed from the Z direction, the above-described sub unit SUT faces the second region A2 of the planar portion 111. That is, the plurality of electronic components 10T and the base component 41T included in the sub unit SUT face the second region A2 of the planar portion 111 in the Z direction.

[0242] <9.2 Insulating cover>

[0243] The insulating cover 130 is a member for preventing a finger from coming into contact with the energization path of the sub unit SU. The insulating cover 130 is, for example, made of synthetic resin, and has insulating properties. The insulating cover 130 is, for example, a box shape with the -Z direction side being open. The insulating cover 130 has a plurality of air holes 130h. The insulating cover 130 covers a part or all of the corresponding sub unit SU. In addition, the insulating cover 130 is not limited to a box-shaped member, and can be a sheet-shaped member that covers the energization path of the main body portion MU. In addition, the insulating cover 130 can be omitted.

[0244] <10. Heat dissipation structure via protruding portion>

[0245] Next, the heat dissipation structure via the protruding portion 118 will be described.

[0246] Figure 21 is a perspective view showing the heat dissipation structure via the protruding portion 118 in one sub unit (for example, the sub unit SUS). In the present embodiment, two heat dissipation paths (first heat dissipation path, second heat dissipation path) are provided between the electronic component 10 and the metal plate 110. The first heat dissipation path is as described above.

[0247] The second heat dissipation path is a heat dissipation path that is thermally connected in the order of the electronic component 10, the flat portion 111 of the metal plate 110. As one example of another second heat dissipation path, the second heat dissipation path is a heat dissipation path that is thermally connected in the order of the electronic component 10S, the connecting member 20, the bus bar 42, the flat portion 111 of the metal plate 110. That is, the second heat dissipation path differs from the first heat dissipation path in that the bus bar 42 is not passed through in the heat dissipation path. According to the second heat dissipation path, the second thermally conductive member 120B moves heat from the electronic component 10S to the protruding portion 118, and transmits heat to the flat portion 111. Therefore, the second heat dissipation path is a shorter heat dissipation path than the first heat dissipation path.

[0248] <11. Advantages>

[0249] (A. Advantages related to newly providing a heat dissipation path in the electrical connection unit)

[0250] As a comparative example, a structure in which heat generated by an electronic component is transmitted to a metal member via a bus bar is considered. In such a structure, when the bus bar is heated, sometimes heat generated by the electronic component is difficult to move to the metal member.

[0251] On the other hand, the electric connection unit 1 of the present embodiment includes the electronic component 10, a base member (e.g., the base plate 41S, etc.) having the opening 57, the bus bar 42, a metal member (e.g., the metal plate 110), and the thermally conductive member 120B. The bus bar 42 is supported by the base member and is electrically connected to the electronic component 10. The metal member has a main body portion (e.g., the flat portion 111) and the protruding portion 118. The main body portion is located on the side opposite to the electronic component 10 with respect to the base member. The protruding portion 118 protrudes from the main body portion through the opening 57 and faces the electronic component 10. Alternatively, the protruding portion 118 protrudes from the main body portion through the opening 57 and faces the connection member 20 that connects the electronic component 10 and the bus bar 42. The thermally conductive member 120B is disposed between the electronic component 10 and the protruding portion 118 or between the connection member 20 and the protruding portion 118.

[0252] According to such a structure, a heat dissipation path (second heat dissipation path) via the protruding portion 118 of the base member is newly provided in the electric connection unit 1. The release of heat generated from the electronic component 10 can be promoted without passing through the bus bar 42. Therefore, an electric connection unit capable of achieving an improvement in heat dissipation performance can be provided.

[0253] In the present embodiment, in a case where the thickness direction of the base member is set as a first direction (e.g., the Z direction), the base member at the opening 57 is open in the first direction. In addition, the connection member 20 and the electronic component 10 are adjacent in a direction (e.g., the horizontal direction) intersecting the first direction. The thermally conductive member 120 faces the electronic component 10 or the connection member 20 from the direction intersecting the first direction. According to such a structure, the heat dissipation path (second heat dissipation path) via the protruding portion 118 is provided so as to bypass the heat dissipation path (e.g., the first heat dissipation path) via the bus bar 42 to the metal member.

[0254] In the present embodiment, the base member has the housing portion 55 that is open in the first direction. At least a portion of the bus bar 42 is housed in the housing portion 55. According to such a structure, the heat dissipation path (first heat dissipation path) via the bus bar 42 to the metal member 110 can be easily shortened, and the heat dissipation in the first heat dissipation path can be promoted.

[0255] In the present embodiment, in a case where the protruding portion 118 is viewed from the first direction, the protruding portion 118 is a plate shape extending along a portion of the approximate shape of the electronic component 10. In addition, the thermally conductive member 120 is a plate shape. According to such a structure, compared to a case where the protruding portion 118 extends in the first direction, the second heat dissipation path can be easily shortened, and the heat dissipation in the second heat dissipation path can be promoted.

[0256] In the present embodiment, the electronic component 10 has a first end portion 10el provided with the terminal 13 connected to the bus bar 42 directly or via the connection component 20, and a second end portion 10e2 located on the side opposite to the first end portion 10el. In addition, the opening 57 is located closer to the first end portion 10el than to the second end portion 10e2. According to such a structure, the temperature is less likely to locally rise at the connection portion 61 connected to the electronic component, and the improvement of the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0257] <B. Advantages related to the division of regions in the electrical connection unit>

[0258] As a comparative example, a structure in which an electronic component that should be prioritized in terms of heat dissipation and an electronic component that should be prioritized in terms of mountability are mounted to one base component is considered. In such a structure, in the case where a base component having a prescribed thickness is employed, it is sometimes difficult to achieve an improvement in heat dissipation performance.

[0259] On the other hand, the electrical connection unit (for example, the electrical connection unit 1) of the present embodiment includes a rigid component (for example, the metal plate 110), a first electronic component (for example, the electronic component 10S), a first base component (for example, the base plate 41S), and a first bus bar (for example, the bus bars 42A, 42B, 42C, 42D). A second electronic component (for example, the electronic component 10T), a second base component (for example, the base component 41T), and a second bus bar (for example, the bus bars 42E, 42F, 42G, 42I) are included. The above-described rigid component includes a first region (for example, the first region Al) and a second region (for example, the second region A2). The above-described first electronic component faces the above-described first region in a first direction. The above-described first base component faces the above-described first region in the above-described first direction, has a planar portion (for example, the planar portion 51), and is insulative. The above-described first bus bar is supported by the above-described planar portion and is electrically connected to the above-described first electronic component. The above-described second electronic component faces the above-described second region in the above-described first direction and has a smaller heat generation amount than the above-described first electronic component. The above-described second base component has a three-dimensional structure that faces the above-described second region in the above-described first direction and is thicker than the above-described first base component in the above-described first direction, and is insulative. The above-described second bus bar is supported by the above-described second base component and is electrically connected to the above-described second electronic component.

[0260] According to such a structure, by utilizing the first base component having a planar portion, it is possible to arrange the first electronic component that values heat dissipation performance in the vicinity of the rigid component and promote the release of heat using the rigid component as a heat dissipation component. On the other hand, by utilizing the second base component having a three-dimensional structure that is thicker in the first direction, it is possible to appropriately mount the second electronic component that values mountability. By using such regions in a divided manner, it is possible to provide an electrical connection unit that achieves a balance between mountability and an improvement in heat dissipation performance.

[0261] <12. Modification>

[0262] Next, several modifications will be described. In each modification, the structures other than those described below are the same as those of the above-described embodiment.

[0263] (First Modification)

[0264] The wiring substrate 40S is not limited to the structure in which the base plate 41S and the bus bar 42 are integrated by insert molding. For example, the bus bar 42 can be disposed in the housing portion 55 after the base plate 41S provided with the housing portion 55 that houses the bus bar 42 is molded. In this case, the bus bar 42 can be fixed to the housing portion 55 by fitting or can be fixed to the housing portion 55 by an adhesive or other fixing means. In these cases, potting that fills the gap between the bus bar 42 and the housing portion 55 can be performed.

[0265] (Second Modification)

[0266] The base member of the wiring substrate 40S is not limited to the base plate 41S having the flat portion 51 in a plate shape. The wiring substrate 40S can be a base member (for example, an insulating sheet) having a flat portion 51 in a sheet shape. In this case, a portion of the flat portion 51 can be formed into the housing portion 55 so as to follow the outer shape of the bus bar 42. Note that in the present disclosure, “sheet shape” or “sheet” is not limited to a member having a thickness of 1 mm or more, and can be a member (so-called film) having a thickness of less than 1 mm.

[0267] (Third Modification)

[0268] The base plate 41S of the wiring substrate 40S can include a plurality of members (plate members or sheet members). The plurality of members are disposed so as to sandwich a plurality of bus bars 42 arranged in the horizontal direction. For example, the plurality of members are integrated by sandwiching the plurality of bus bars 42 by lamination molding. The plurality of members form the flat portion 51. In this case, the housing portion 55 can be formed in a hollow shape inside the base plate 41S (between the plurality of members). The plurality of members can be a plurality of plate members, a plurality of sheet members, or a combination of plate members and sheet members. The sheet members can be, for example, sheet members having flexibility. The flat portion 51 formed by the plurality of members has an opening that exposes at least the first connection portion 61 and the second connection portion 62 of the bus bar 42.

[0269] (Fourth Modification)

[0270] The connection of the electronic component 10 to the bus bar 42 is not limited to the connection via the connection member 20. The electronic component 10 can be directly connected to the bus bar 42 using a fastening member (for example, a bolt, a screw), welding, or the like.

[0271] (Fifth Modification)

[0272] The opening 57 described above can also be provided not in the wiring substrate 40S but in the wiring structure 40T.

[0273] The above describes several embodiments and modifications. However, the embodiments and modifications are not limited to the examples described above. For example, the above-described multiple modifications can be combined with each other to be implemented.

[0274] Explanation of Reference Signs

[0275] 1 … Electric connection unit

[0276] SU, SUS … Sub unit

[0277] 10, 10S, 10T, 10TA, 10TB … Electronic component

[0278] 13, 13A, 13B … Terminal

[0279] 20 … Connection component

[0280] 40S … Wiring substrate

[0281] 40T … Wiring structure

[0282] 41S … Base plate

[0283] 41T … Base component

[0284] 42 … Bus bar

[0285] 51 … Flat portion

[0286] 52 … Frame portion

[0287] 55 … Housing portion

[0288] 57 … Opening

[0289] 61 … Connection portion

[0290] 62 … Connection portion

[0291] 63 … Extension portion

[0292] 63a … First straight portion

[0293] 63aa … First end portion (first part)

[0294] 63ab … Second end portion (second part)

[0295] 63b … Second straight portion

[0296] 63c … Third straight portion

[0297] 84A, 84B … housing portions

[0298] 85 … frame portion

[0299] 90 … metal portion

[0300] 101 … auxiliary base member

[0301] 102 … wiring

[0302] 110 … metal plate (rigid member, metal member, heat dissipation member)

[0303] 111 … flat portion (opposite portion)

[0304] 118 … protruding portion

[0305] 120 … heat dissipation member

[0306] 120A … first heat dissipation member

[0307] 120B … second heat dissipation member

[0308] R … region

Claims

1. An electrical connection unit, characterized in that, have: Electronic components; A base component having an opening; A busbar, which is supported by the base component and electrically connected to the electronic component; A metal component, the metal component having: a main body portion, the main body portion being located on the side opposite to the electronic component relative to the base component; and a protrusion that protrudes from the main body through the opening and faces the electronic component or the connecting component that connects the electronic component to the busbar; as well as A heat-conducting component is disposed between the electronic component and the protrusion, or between the connecting component and the protrusion.

2. The electrical connection unit according to claim 1, characterized in that, When the thickness direction of the base component is set as the first direction, The base component at the opening opens in the first direction. The connecting component is adjacent to the electronic component in a direction intersecting the first direction. The heat-conducting component faces the electronic component or the connecting component from a direction intersecting the first direction.

3. The electrical connection unit according to claim 2, characterized in that, The base component has a receiving portion that opens in the first direction. At least a portion of the busbar is housed in the housing section.

4. The electrical connection unit according to claim 2 or 3, characterized in that, Viewed from the first direction, the protrusion is a plate-like structure extending along a portion of the general shape of the electronic component. The heat-conducting component is plate-shaped.

5. The electrical connection unit according to any one of claims 1 to 3, characterized in that, The electronic component has: a first end portion having a terminal that is directly connected to or connected via the busbar; and a second end portion located on the side opposite to the first end portion. The opening is located closer to the first end than the second end.

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