Electrical connection unit

Abstract

The electrical connection unit has a support body, a first bus bar, a second bus bar, a first electronic component, and a second electronic component. The support body has a first surface and a second surface located on the opposite side of the first surface. The first bus bar is supported by the support body. The second bus bar is supported by the support body. The first electronic component faces the first surface of the support body and is electrically connected with the first bus bar. The second electronic component faces the second surface of the support body and is electrically connected with the second bus bar.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to an electrical connection unit. BACKGROUND

[0002] An electrical connection unit is known which has an electronic component and a bus bar connected to the electronic component.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, electrical connection units are expected to be downsized.

[0008] One embodiment provides an electrical connection unit which can be downsized.

[0009] TECHNICAL MEANS FOR SOLVING THE PROBLEMS

[0010] An electrical connection unit of one embodiment has a support body, a first bus bar, a second bus bar, a first electronic component, and a second electronic component. The support body has a first surface and a second surface on the side opposite to the first surface. The first bus bar is supported by the support body. The second bus bar is supported by the support body. The first electronic component faces the first surface of the support body and is electrically connected to the first bus bar. The second electronic component faces the second surface of the support body and is electrically connected to the second bus bar.

[0011] EFFECTS OF THE INVENTION

[0012] According to one embodiment, the downsizing of an electrical connection unit can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 FIG. 1 is a cross-sectional view illustrating an electrical connection unit of a first embodiment.

[0014] Figure 2 FIG. 3 is a perspective view for describing a main body portion of the first embodiment.

[0015] Figure 3 FIG. 5 is a perspective view for describing a subunit of the first embodiment.

[0016] Figure 4 FIG. 7 is a perspective view in which a part of the subunit of the first embodiment is disassembled.

[0017] Figure 5is a perspective view for illustrating the electronic component and the connecting component of the first embodiment.

[0018] Figure 6 is a perspective view for illustrating the electronic component and the connecting component of the first embodiment.

[0019] Figure 7 is a perspective view showing the connecting component of the first embodiment.

[0020] Figure 8 is a perspective view showing the wiring substrate of the first embodiment.

[0021] Figure 9 is a perspective view showing a part of the wiring substrate of the first embodiment.

[0022] Figure 10 is a plan view showing the wiring substrate of the first embodiment.

[0023] Figure 11 is a perspective view showing a part of the electric connection unit of the first embodiment.

[0024] Figure 12 is a bottom view showing the wiring substrate of the first embodiment.

[0025] Figure 13 is a sectional view along the F13-F13 line of the structure shown in Figure 10

[0026] is a plan view showing a part of the electric connection unit of the first embodiment. Figure 14

[0027] is a sectional view along the F15-F15 line of the structure shown in Figure 15 Figure 14 is a plan view showing a part of the electric connection unit of the first embodiment.

[0028] Figure 16 is a sectional view showing the electric connection unit of the first embodiment.

[0029] Figure 17 is a sectional view showing the electric connection unit of the first embodiment.

[0030] Figure 18 is a sectional view showing a part of the electric connection unit of the first embodiment.

[0031] Figure 19 is a sectional view along the F13-F13 line of the structure shown in

[0032] Figure 20 Figure 19 ​​A cross-sectional view of the F20-F20 line of the structure shown in FIG. 20.

[0033] Figure 21 A cross-sectional view of the F20-F20 line of the structure shown in FIG. 20.

[0034] Figure 22 A cross-sectional view of the F20-F20 line of the structure shown in FIG. 20.

[0035] Figure 23 A cross-sectional view of the F20-F20 line of the structure shown in FIG. 20. Figure 22 A cross-sectional view of the F23-F23 line of the structure shown in FIG. 23.

[0036] Figure 24 A cross-sectional view of the F23-F23 line of the structure shown in FIG. 23. Figure 22 A cross-sectional view of the F24-F24 line of the structure shown in FIG. 24.

[0037] Figure 25 A cross-sectional view of the F20-F20 line of the structure shown in FIG. 20.

[0038] Figure 26 A cross-sectional view of the F20-F20 line of the structure shown in FIG. 20.

[0039] Figure 27 A cross-sectional view of the F20-F20 line of the structure shown in FIG. 20. DETAILED DESCRIPTION

[0040] Embodiments will be described below with reference to the accompanying drawings. In the following description, structures having the same or similar functions are designated by the same reference numerals. Also, repeated description of these structures can be omitted. In addition, the structures described below do not limit the scope of the embodiments.

[0041] In the present disclosure, the terms are defined as follows. “Connection” is not limited to mechanical connection, and can include electrical connection. That is, “connection” is not limited to the case where two elements as connection targets are directly connected, and can include the case where two elements as connection targets are connected with other elements interposed therebetween. “Accommodation” is not limited to the case where the entirety of a component is accommodated, and can include the case where only a part of a component is accommodated (a state where another part of the component protrudes). “Facing” means that imaginary projected images of two objects overlap each other in the case of being observed from a particular direction. That is, “facing” is not limited to the case where two objects directly face each other, and can include the case where two objects face each other in a state where other components are present between the two objects. “Adjacent” is not limited to the case where two elements contact each other, and can include the case where two elements are arranged in a state of being separated from each other. “Parallel”, “orthogonal”, or “identical” can respectively include the case of “approximately parallel”, “approximately orthogonal”, or “approximately identical”.

[0042] In the present disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is a direction from a first end portion 80e1 of a metal plate 80 described later toward a second end portion 80e2 (see Figure 2 ). The -X direction is a direction opposite to the +X direction. Hereinafter, the +X direction and -X direction are simply referred to as the "X direction" without distinction. The +Y direction and -Y direction are directions intersecting (for example, orthogonal to) the X direction. The +Y direction is a direction from a third end portion 80e3 of the metal plate 80 described later toward a fourth end portion 80e4 (see Figure 2 ). The -Y direction is a direction opposite to the +Y direction. Hereinafter, the +Y direction and -Y direction are simply referred to as the "Y direction" without distinction. The +Z direction and -Z direction are directions intersecting (for example, orthogonal to) the X direction and Y direction. The +Z direction is a direction from a second surface 40s2 of a wiring substrate 40M described later toward a first surface 40s1 (see Figure 1 ). The -Z direction is a direction opposite to the +Z direction. Hereinafter, the +Z direction and -Z direction are simply referred to as the "Z direction" without distinction. The Z direction is an example of a "first direction". One of the X direction and Y direction is an example of a "second direction".

[0043] Hereinafter, the X direction and Y direction are sometimes referred to as the "horizontal direction" without distinction. Hereinafter, the Z direction is sometimes referred to as the "vertical direction". In addition, hereinafter, the +Z direction side is sometimes referred to as "up", and the -Z direction side is sometimes referred to as "down". However, these expressions are expressions for convenience of explanation, and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0044] (First Embodiment)

[0045] <1. Structure of Electrical Connection Unit>

[0046] Figure 1 is a cross-sectional view showing an electrical connection unit 1 of an embodiment. The electrical connection unit 1 is, for example, an in-vehicle device mounted on a vehicle such as an EV (Electric Vehicle), an HEV (Hybrid Electric Vehicle), or a PHEV (Plug-in Hybrid Electric Vehicle). The electrical connection unit 1 can also be referred to as an "electrical connection box" or a "junction box", for example. However, the electrical connection unit 1 is not limited to a box-type device.

[0047] The electrical connection unit 1 has, for example, a main body portion MU, a metal plate 80, insulating sheets 91A and 91B, a plurality of heat-conducting members 92, a plurality of heat-conducting portions 93, and an insulating cover 94.

[0048] <2. Main body portion>

[0049] First, the main body portion MU will be described.

[0050] Figure 2 is a perspective view for describing the main body portion MU. The main body portion MU is a portion that realizes a main function (for example, switching of an electrical connection state or overcurrent protection) of the electrical connection unit 1. In the present embodiment, the main body portion MU is divided into a plurality of sub-units SU. The main body portion MU is formed by joining the plurality of sub-units SU. In the present embodiment, the main body portion MU has three sub-units SU (sub-units SUX, SUY, SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0051] The sub-unit SUX has a first function in terms of electricity. The sub-unit SUX includes, for example, a plurality of electronic components 10X and a first wiring substrate 40X. The plurality of electronic components 10X are electrically connected to the first wiring substrate 40X. The plurality of electronic components 10X include, for example, one or more electronic components 10XU and one or more electronic components 10XL (refer to FIG. 6). Figure 1 ) The electronic component 10XU is disposed on the +Z direction side with respect to the first wiring substrate 40X (wiring substrate 40M). The electronic component 10XU faces the first surface 40s1 of the wiring substrate 40M. On the other hand, the electronic component 10XL is disposed on the -Z direction side with respect to the first wiring substrate 40X (wiring substrate 40M). The electronic component 10XL faces the second surface 40s2 of the wiring substrate 40M.

[0052] The sub-unit SUY has a second function in terms of electricity. The second function is a function different from the first function. The sub-unit SUY includes, for example, a plurality of electronic components 10Y and a second wiring substrate 40Y. The plurality of electronic components 10Y are electrically connected to the second wiring substrate 40Y. The plurality of electronic components 10Y include, for example, one or more electronic components 10YU and one or more electronic components 10YL (refer to FIG. 7). Figure 1 ) The electronic component 10YU is disposed on the +Z direction side with respect to the second wiring substrate 40Y (wiring substrate 40M). The electronic component 10YU faces the first surface 40s1 of the wiring substrate 40M. On the other hand, the electronic component 10YL is disposed on the -Z direction side with respect to the second wiring substrate 40Y (wiring substrate 40M). The electronic component 10YL faces the second surface 40s2 of the wiring substrate 40M.

[0053] The subunit SUZ has an electrical third function. The third function is a function different from the first function and the second function. The subunit SUZ includes, for example, a plurality of electronic components 10Z and a third wiring substrate 40Z. The plurality of electronic components 10Z are electrically connected to the third wiring substrate 40Z. The plurality of electronic components 10Z include, for example, one or more electronic components 10ZU and one or more electronic components 10ZL (see Figure 1 ). The electronic components 10ZU are disposed on the +Z direction side with respect to the third wiring substrate 40Z (wiring substrate 40M). The electronic components 10ZU face the first surface 40s1 of the wiring substrate 40M. On the other hand, the electronic components 10ZL are disposed on the -Z direction side with respect to the third wiring substrate 40Z (wiring substrate 40M). The electronic components 10ZL face the second surface 40s2 of the wiring substrate 40M.

[0054] In the present embodiment, the three subunits SUX, SUY, and SUZ are arranged in the X direction. For example, the subunit SUX is disposed on the +X direction side with respect to the subunit SUY. The subunit SUX and the subunit SUY are electrically connected via a plurality of link bus bars 75 that span the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, the subunit SUZ is disposed on the -X direction side with respect to the subunit SUY. The subunit SUZ and the subunit SUY are electrically connected via a plurality of link bus bars 75 (only one is illustrated in Figure 2 ) that span the third wiring substrate 40Z and the second wiring substrate 40Y. In addition, the link bus bars 75 can be disposed on the +Z direction side or on the -Z direction side with respect to the plurality of subunits SU.

[0055] In the present embodiment, the three wiring substrates 40X, 40Y, and 40Z included in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are disposed at the same height position in the Z direction. Therefore, the three wiring substrates 40X, 40Y, and 40Z form one large wiring substrate 40M.

[0056] The wiring substrate 40M has a first surface 40s1 and a second surface 40s2 (see Figure 1 ). The first surface 40s1 is a surface facing the +Z direction. The first surface 40s1 is formed by, for example, the first surface 51a (described later) of the planar portion 51 of the base plate 41 of the three wiring substrates 40X, 40Y, and 40Z. On the other hand, the second surface 40s2 is on the side opposite the first surface 40s1. The second surface 40s2 is a surface facing the -Z direction. The second surface 40s2 is formed by, for example, the second surface 51b (described later) of the planar portion 51 of the base plate 41 of the three wiring substrates 40X, 40Y, and 40Z.

[0057] In the present embodiment, the three sub-units SUX, SUY, and SUZ have the same or similar basic structure to each other. Therefore, hereinafter, one sub-unit SU will be described in detail as a representative. Hereinafter, without distinguishing the sub-units SUX, SUY, and SUZ, they will be simply referred to as "sub-unit SU". In addition, without distinguishing the electronic components 10X, 10Y, and 10Z, they will be simply referred to as "electronic component 10". Similarly, without distinguishing the electronic components 10XU, 10YU, and 10ZU, they will be simply referred to as "electronic component 10U". In addition, without distinguishing the electronic components 10XL, 10YL, and 10ZL, they will be simply referred to as "electronic component 10L". Furthermore, without distinguishing the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40". One sub-unit SU included in the three sub-units SUX, SUY, and SUZ is an example of a "first sub-unit". On the other hand, the other sub-units SU included in the three sub-units SUX, SUY, and SUZ are examples of a "second sub-unit".

[0058] Furthermore, instead of the above-described example, the main body portion MU can not be divided into a plurality of sub-units SU. That is, the main body portion MU can be formed of a plurality of electronic components 10 and one wiring substrate 40. In addition, two or more sub-units SU are not limited to sub-units SU having different functions, and can be sub-units SU having the same function.

[0059] <3. Structure of sub-unit>

[0060] Next, the structure of the sub-unit SU will be described.

[0061] Figure 3 is a perspective view for illustrating the sub-unit SU. Figure 4 is a perspective view showing a part of the sub-unit SU. The sub-unit SU includes, for example, a plurality of electronic components 10, a plurality of connection components 20 for component connection, a plurality of connection components 30 for external connection, and a wiring substrate 40. The connection components 20 and 30 are components that form a power supply path in the vertical direction. The connection components 20 and 30 can also be referred to as "vertical wiring components".

[0062] <3.1 Electronic component and connection component for component connection>

[0063] First, the electronic component 10 and the connection component 20 for component connection will be described.

[0064] The electronic component 10 is an electronic component mounted in accordance with a function required by the subunit SU. The electronic component 10 is, for example, a connector, a fuse, a relay (for example, a mechanical relay or a semiconductor relay), a capacitor, a branching component, various sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of them are unified. In addition, the kind of the electronic component 10 is not limited to the above examples. The electronic component 10 is, for example, a heat generating component that generates heat when energized. Hereinafter, as examples of the electronic component 10, a first type of electronic component 10M and a second type of electronic component 10N will be described.

[0065] The connection component 20 is a component that electrically connects the electronic component 10 and the wiring substrate 40. The connection component 20 forms a part of an energization path in the subunit SU. The connection component 20 is made of metal (for example, copper or a copper alloy). The connection component 20 can also be referred to as a "metal component". Hereinafter, as examples of the connection component 20, a first type of connection component 20M and a second type of connection component 20N will be described.

[0066] <3.1.1 First Type of Electronic Component>

[0067] Figure 5 is a perspective view showing the first type of electronic component 10M and the first type of connection component 20M. In addition, in Figure 5 , for ease of explanation, the electronic component 10M and the connection component 20M are illustrated in the posture of the electronic component 10 (the electronic component 10U) arranged on the +Z direction side with respect to the wiring substrate 40. The first type of electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged and disposed at one end portion of the electronic component 10M. The electronic component 10M has, for example, a housing 11, a component main body portion 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0068] (Housing)

[0069] The housing 11 is an outer contour component that forms most of the outer shape of the electronic component 10M. The housing 11 is, for example, made of synthetic resin and has insulating properties. The housing 11 houses the component main body portion 12. In addition, the housing 11 and the component main body portion 12 can be integrally formed.

[0070] In the present embodiment, the housing 11 has an insulating rib 11a that protrudes in the horizontal direction (e.g., the X direction) and extends in the Z direction. The insulating rib 11a is, for example, plate-shaped in the horizontal direction (e.g., the X direction) and the Z direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B described later). The insulating rib 11a electrically insulates between the terminal 13A and the terminal 13B. In addition, in the present embodiment, a portion of the insulating rib 11a is disposed between first portions 21 (described later) of two connection members 20M connected to the electronic component 10M. The insulating rib 11a electrically insulates between the first portions 21 of the two connection members 20M connected to the electronic component 10M.

[0071] (component main body portion)

[0072] The component main body portion 12 is a portion that realizes the main function of the electronic component 10M. For example, in the case where the electronic component 10M is a relay, the component main body portion 12 includes a switching portion (e.g., a contact portion) that switches between an on state and an off state. For example, in the case where the electronic component 10M is a fuse, the component main body portion 12 includes a fuse portion that melts in the case where an overcurrent flows. For example, in the case where the electronic component 10M is a capacitor, the component main body portion 12 includes a portion that accumulates electric charge.

[0073] (terminal)

[0074] The terminal 13 is an electrical connection portion that is exposed to the outside of the housing 11. The terminal 13 is electrically connected to the component main body portion 12 inside the housing 11. In the present embodiment, the electronic component 10M includes a terminal 13A and a terminal 13B as a plurality of terminals 13. One of the terminal 13A and the terminal 13B is a positive electrode side terminal. The other of the terminal 13A and the terminal 13B is a negative electrode side terminal. One of the terminal 13A and the terminal 13B is an example of a "first terminal". The other of the terminal 13A and the terminal 13B is an example of a "second terminal".

[0075] In the present embodiment, the terminal 13A and the terminal 13B are provided at one end portion of the electronic component 10M in the horizontal direction (e.g., the X direction). The terminal 13A and the terminal 13B are disposed side by side in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h in which a fastening member 71 (e.g., a screw or a bolt) described later is installed. The mounting hole 13h is open in the horizontal direction (e.g., the X direction). An inner peripheral surface of the mounting hole 13h of the electronic component 10M has a screw groove.

[0076] (mounting portion)

[0077] The mounting portion 14 is a portion for fixing the electronic component 10M. The mounting portion 14 has a mounting hole 14h for mounting a fastening member 112 (e.g., a screw or a bolt, refer to Figure 11 ) described later. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through-hole for the fastening member 112 to pass through. The fixing object of the mounting portion 14 is described later.

[0078] <3.1.2 First Type of Connection Member>

[0079] The first type of connection member 20M is a member that electrically connects between the first type of electronic component 10M and the wiring substrate 40. In the present embodiment, the connection member 20M electrically connects the electronic component 10M and the bus bar 42 (refer to Figure 8 ) included in the wiring substrate 40. In the present embodiment, the width L12 of the connection member 20M in the long direction (e.g., the X direction) of the electronic component 10M is smaller than the width L11 of the electronic component 10M in the long direction. The connection member 20M has, for example, a first portion 21 and a second portion 22.

[0080] (First Portion)

[0081] The first portion 21 of the connection member 20M is a portion that connects with the terminal 13 of the electronic component 10M. The first portion 21 is a plate-shaped or cuboid-shaped portion that extends in the Z direction. The first portion 21 extends in the Z direction along one end portion (e.g., an end portion in the X direction) of the electronic component 10M. The first portion 21 is a standing portion that stands in the Z direction with respect to the wiring substrate 40 (e.g., with respect to the bus bar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (e.g., the X direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10M in the horizontal direction (e.g., the X direction), and is connected with the terminal 13 of the electronic component 10M from the horizontal direction (e.g., the X direction).

[0082] The first portion 21 of the connection member 20M has a first mounting hole 21h for the fastening member 71 (e.g., a screw or a bolt) to pass through. The first mounting hole 21h is open in the horizontal direction (e.g., the X direction). In addition, the first portion 21 has a recess 25 around the first mounting hole 21h. The recess 25 is a housing portion that houses the head of the fastening member 71 inserted into the first mounting hole 21h. By causing the fastening member 71 that passes through the first mounting hole 21h to engage with the mounting hole 13h of the terminal 13 of the electronic component 10M, the first portion 21 is physically and electrically connected with the terminal 13 of the electronic component 10M. In addition, the first portion 21 can not have the recess 25.

[0083] (Second Portion)

[0084] The second portion 22 of the connection member 20M is a portion connected to the bus bar 42 (refer to Figure 8 ). The second portion 22 protrudes in the horizontal direction (for example, the X direction) from the end portion of the first portion 21 on the -Z direction side. The second portion 22 is a plate portion along the horizontal direction. The second portion 22 is adjacent to the bus bar 42 in the Z direction, and is connected to the bus bar 42 from the Z direction. The second portion 22 of the connection member 20M is mounted from the Z direction to a fastening member 43 (for example, a screw or a bolt, refer to Figure 8 ) protruding in the +Z direction from the bus bar 42, and is physically and electrically connected to the bus bar 42. In the present embodiment, the second portion 22 of the connection member 20M has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The second mounting hole 22h of the second portion 22 is passed through by the fastening member 43. Also, by causing a fitting member 44 (for example, a nut, refer to Figure 3 ) to fit to the end portion of the fastening member 43 that passes through the second mounting hole 22h, the second portion 22 is fixed to the bus bar 42. In the present embodiment, one piece of the connection member 20M in the L shape is formed by the first portion 21 and the second portion 22.

[0085] <3.1.3 Second Type of Electronic Component>

[0086] Figure 6 is a perspective view showing a second type of electronic component 10N and a second type of connection member 20N. Also, in Figure 6 , for convenience of explanation, the electronic component 10N and the connection member 20N are illustrated in the posture of the electronic component 10 (the electronic component 10U) disposed on the +Z direction side with respect to the wiring substrate 40. The second type of electronic component 10N is an electronic component in which two terminals 13 are disposed separately at both end portions in the horizontal direction of the electronic component 10N. The electronic component 10N has, for example, a housing 11, a component main body portion 12, and a plurality of terminals 13. Also, in the structure of the electronic component 10N, the same reference numerals are attached to the structures having the same functions as those of the electronic component 10M. In this case, the explanation of the electronic component 10N can be made by replacing "electronic component 10M" in the above explanation of the electronic component 10M with "electronic component 10N".

[0087] In the electronic component 10N, the terminal 13A and the terminal 13B are arranged separately at both ends in the horizontal direction (for example, the X direction) of the electronic component 10N. Each terminal 13 has a mounting hole 13h in which a fastening member 72 (for example, a screw or a bolt) described later is installed. The mounting hole 13h is open in the Z direction. For example, the mounting hole 13h of the electronic component 10N is a through hole through which the fastening member 72 passes. One of the terminal 13A and the terminal 13B is an example of a "first terminal". The other of the terminal 13A and the terminal 13B is an example of a "second terminal".

[0088] <3.1.4 Second Type of Connection Member>

[0089] The second type of connection member 20N is a member that electrically connects the second type of electronic component 10N and the wiring substrate 40. In the present embodiment, the connection member 20N electrically connects the electronic component 10N and the bus bar 42 (refer to Figure 8 ) included in the wiring substrate 40. In the present embodiment, the width L12 of the connection member 20N in the longitudinal direction (for example, the X direction) of the electronic component 10N is smaller than the width L11 of the electronic component 10N in the longitudinal direction. The connection member 20N has, for example, a first portion 21, a second portion 22, and a third portion 23.

[0090] (First Portion)

[0091] The first portion 21 of the connection member 20N is a portion that is connected to the terminal 13 of the electronic component 10N. The first portion 21 is a portion that is a rectangular parallelepiped shape extending in the Z direction. The first portion 21 is a standing portion that stands in the Z direction with respect to the wiring substrate 40 (for example, with respect to the bus bar 42). The first portion 21 is adjacent to the terminal 13 of the electronic component 10N in the Z direction, and is connected to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connection member 20N has a first mounting hole 21h in which the fastening member 72 is engaged. The first mounting hole 21h is open in the Z direction. The inner peripheral surface of the first mounting hole 21h of the connection member 20N has a screw groove. By engaging the fastening member 72 that passes through the mounting hole 13h of the terminal 13 of the electronic component 10N with the mounting hole 21h of the first portion 21, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10N.

[0092] (Second Portion)

[0093] The second portion 22 of the connection member 20N is a portion that is connected to the bus bar 42 (refer to Figure 8) connected part. The second part 22 protrudes from the end of the first part 21 on the -Z direction side in the horizontal direction (for example, the X direction). The second part 22 is a plate portion in the horizontal direction. The second part 22 is adjacent to the bus bar 42 in the Z direction, and is connected to the bus bar 42 in the Z direction. The second part 22 of the connection member 20N is mounted from the Z direction to a fastening member 43 (for example, a screw or a bolt, refer to Figure 8 ), which protrudes from the bus bar 42 in the +Z direction, and is physically and electrically connected to the bus bar 42. In the present embodiment, the second part 22 of the connection member 20N has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. In the second part 22, the fastening member 43 described later passes through the second mounting hole 22h. Also, by causing a fitting member 44 (for example, a nut, refer to Figure 3 ) to fit with the tip end portion of the fastening member 43 that passes through the second mounting hole 22h, the second part 22 is fixed to the bus bar 42.

[0094] (Third Part)

[0095] The third part 23 is a standing wall (a side wall) that stands up in the +Z direction from both ends of the second part 22 in the horizontal direction. The third part 23 is a wall in the Z direction. The third part 23 is connected to the first part 21, and is connected to the second part 22. The third part 23, for example, extends obliquely in such a way as to widen in the X direction as it goes in the -Z direction. In addition, the third part 23 can also be provided to the connection member 20M described above. On the other hand, the connection member 20N can also not have the third part 23.

[0096] <3.1.5 Structure Related to Connection Member>

[0097] In the present embodiment, the connection member 20 (for example, the connection member 20M and the connection member 20N) is a heat storage member (a heat absorbing member) that increases the heat capacity of the power supply path of the electrical connection unit 1. The connection member 20, for example, stores (absorbs) at least a portion of the heat emitted by the electronic component 10. Instead of or in addition to this, the connection member 20 can also store (absorb) at least a portion of the heat emitted by the bus bar 42 itself due to the passage of electricity. The connection member 20 can also be referred to as a "heat storage member" or a "heat absorbing member".

[0098] In the present embodiment, the bus bar 42 is arranged at a position (for example, a position apart in the Z direction) apart from the terminal 13 of the electronic component 10. The connection component 20 is arranged between the electronic component 10 and the bus bar 42. In the present disclosure, "the connection component is arranged between the electronic component and the bus bar" is not limited to a case where a part of the connection component is positioned between the electronic component and the bus bar when viewed in the X direction or the Y direction. "The connection component is arranged between the electronic component and the bus bar" can also correspond to a case where a part of the connection component is positioned between the electronic component and the bus bar when viewed in a direction inclined with respect to the X direction or the Y direction. The connection component 20 electrically connects the terminal 13 of the electronic component 10 and the bus bar 42.

[0099] In the present embodiment, the thickness of at least a part of the connection component 20 is greater than the plate thickness (thickness in the Z direction) T3 of the bus bar 42 (refer to Figure 13 For example, the thickness T1 in the X direction of at least a part of the connection component 20 is greater than the plate thickness T3 of the bus bar 42. In the present embodiment, the thickness T1 in the X direction of the first portion 21 of the connection component 20 is greater than the plate thickness T3 of the bus bar 42. In the present embodiment, the first portion 21 has the thickness T1 greater than the plate thickness T3 of the bus bar 42 as the thickness in the X direction throughout the entire length in the Z direction of the first portion 21. The thickness T1 in the X direction of the first portion 21 of the connection component 20 is, for example, two times or more the plate thickness T3 of the bus bar 42. In addition, from another viewpoint, the thickness T2 in the Z direction of the second portion 22 of the connection component 20 can also be greater than the plate thickness T3 of the bus bar 42.

[0100] In the present embodiment, the thickness T1 in the X direction of the first portion 21 of the connection component 20 is greater than the thickness T2 in the Z direction of the second portion 22 of the connection component 20. In the present embodiment, the first portion 21 has the thickness T1 greater than the thickness T2 in the Z direction of the second portion 22 as the thickness in the X direction throughout the entire length in the Z direction of the first portion 21.

[0101] <3.2 Connection Component for External Connection>

[0102] Next, the connection component 30 for external connection will be described.

[0103] Figure 7 is a perspective view showing the connection component 30 for external connection. The connection component 30 is a component that electrically connects the bus bar 76 for external connection and the bus bar 42 included in the wiring substrate 40 (refer to Figure 8) electrically connected. The external connection bus bar 76 is electrically connected to an external device. In the present disclosure, the "external device" refers to an electrical device existing outside the electric connection unit 1. The external device is, for example, a battery unit mounted on a vehicle, or an inverter for driving a motor of the vehicle, but is not limited to these examples. The connection member 30 has, for example, a first portion 31, a second portion 32, and a third portion 33.

[0104] (First portion)

[0105] The first portion 31 is a portion connected to the external connection bus bar 76. The first portion 31 is a portion in a cuboid shape extending in the Z direction. The first portion 31 is a standing portion standing in the Z direction with respect to the wiring substrate 40 (for example, with respect to the bus bar 42). The first portion 31 is adjacent to the external connection bus bar 76 in the Z direction, and is connected to the external connection bus bar 76 from the Z direction. The first portion 31 has a first mounting hole 31h through which a fastening member 73 (for example, a screw or a bolt) passes. The first mounting hole 31h is open in the Z direction. An inner peripheral surface of the first mounting hole 31h has a screw groove. By engaging the fastening member 73 passing through the mounting hole 76h of the external connection bus bar 76 with the mounting hole 31h of the first portion 31, the first portion 31 is physically and electrically connected to the external connection bus bar 76.

[0106] (Second portion)

[0107] The second portion 32 is a portion connected to the bus bar 42 (see Figure 8 ). The second portion 32 protrudes in the horizontal direction (for example, the X direction) from the end portion of the first portion 31 on the -Z direction side. The second portion 32 is a plate portion in the horizontal direction. The second portion 32 is adjacent to the bus bar 42 in the Z direction, and is connected to the bus bar 42 from the Z direction. The second portion 32 is mounted to the fastening member 43 (for example, a screw or a bolt, see Figure 8 ) protruding in the +Z direction from the bus bar 42 from the Z direction, and is physically and electrically connected to the bus bar 42. In the present embodiment, the second portion 32 has a second mounting hole 32h through which the fastening member 43 passes. The second mounting hole 32h is open in the Z direction. In the second portion 32, the fastening member 43 described later passes through the second mounting hole 32h. And, by engaging the engaging member 44 (for example, a nut, see Figure 3 ) with the tip portion of the fastening member 43 passing through the second mounting hole 32h, the second portion 32 is fixed to the bus bar 42.

[0108] (Third portion)

[0109] The third portion 33 is a standing wall (a side wall) that stands in the +Z direction from both end portions in the horizontal direction of the second portion 32. The third portion 33 is a wall in the Z direction. The third portion 33 is connected to the first portion 31 and to the second portion 32. The third portion 33 extends obliquely, for example, in a manner that widens in the X direction (or the Y direction) as it goes in the -Z direction. In addition, the connection member 30 can also not have the third portion 33.

[0110] In addition, the dimensional relationships (for example, the dimensional relationships related to the thicknesses T1, T2, T3) related to the above-described connection member 20 and the bus bar 42 are the same in the connection member 30 to which the external connection bus bar 76 is connected. For example, regarding the description of the connection member 30, in the above-described description regarding the connection member 20, replace "connection member 20" with "connection member 30", replace "first portion 21" with "first portion 31", and replace "second portion 22" with "second portion 32".

[0111] <3.3 Wiring substrate>

[0112] Next, the wiring substrate 40 will be described.

[0113] Figure 8 is a perspective view that shows the wiring substrate 40. The wiring substrate 40 is a member that forms at least a portion of a power supply path between a plurality of electronic components 10 and / or at least a portion of a power supply path between the electronic component 10 and an external device. In the present disclosure, the "wiring substrate" refers to a wiring structure body of a substrate type. The "substrate type" refers to a board shape in the case of viewing as a whole, regardless of the fine shape. Note that in the present disclosure, the "board shape", "sheet shape", or "plane" are not limited to the case of being completely flat, and can include cases where a fixed structure, a rib, or the like that protrudes in the Z direction is present locally, cases where a concave-convex shape that follows the thickness of the bus bar is present on the surface, and the like. In the present embodiment, the wiring substrate 40 is a board shape in the X direction and the Y direction.

[0114] The wiring substrate 40 includes, for example, a base plate 41, one or more (for example, a plurality of) bus bars 42, and a plurality of fastening members 43. In the present embodiment, the base plate 41 and the plurality of bus bars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the bus bars 42, the bus bars 42 are insert molded with the base plate 41, thereby forming the wiring substrate 40 as one sheet-shaped member. That is, the bus bars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. In addition, the wiring substrate 40 can also be formed by other structures instead of insert molding. Variations in which the wiring substrate 40 is formed by other structures will be described later.

[0115] Figure 9is a perspective view showing a part of the wiring substrate 40 exploded. Hereinafter, for convenience of explanation, the base substrate 41, the bus bar 42, and the fastening member 43 are described with reference to the drawing in which the wiring substrate 40 is partially exploded.

[0116] <3.3.1 Base substrate>

[0117] The base substrate 41 is a holding member that integrally holds (supports) the plurality of bus bars 42 arranged in the horizontal direction at intervals from each other. The base substrate 41 is made of, for example, synthetic resin, and has insulating properties. The base substrate 41 electrically insulates between the plurality of bus bars 42. The base substrate 41 is an example of a "base member". The base substrate 41 can also be referred to as an "insulating base material". In the present embodiment, the base substrate 41 is formed with a support body SB that is disposed between the plurality of electronic components 10U, 10L. In the present embodiment, the support body SB is formed by one insulating member (base substrate 41). The base substrate 41 has, for example, a flat portion 51, a plurality of fixing portions 52, and a plurality of fixing portions 53. Here, the flat portion 51 and the fixing portions 53 are described. The fixing portions 52 will be described later.

[0118] <Flat portion>

[0119] The flat portion 51 is a portion formed in the shape of a plate in the base substrate 41. The flat portion 51 is in the shape of a plate along the horizontal direction. The flat portion 51 forms a main portion of the base substrate 41. The flat portion 51 forms a base portion (insulating base portion) of the base substrate 41. In the present embodiment, the flat portion 51 extends over the entire range in the X direction of the base substrate 41, and over the entire range in the Y direction of the base substrate 41, except for the four corner portions of the base substrate 41.

[0120] The flat portion 51 has a first face 51a and a second face 51b. The first face 51a is a surface facing the +Z direction. The first face 51a is a plane along the horizontal direction. The first face 51a forms at least a part of the first face 41s1 of the above-described wiring substrate 40M. The first face 51a faces one or more (for example, a plurality of) electronic components 10U, and faces the insulating cover 94 of the electric connection unit 1 (refer to Figure 1 ). The second face 51b is located on the side opposite to the first face 51a. The second face 51b is a surface facing the -Z direction. The second face 51b is a plane along the horizontal direction. The second face 51b forms at least a part of the second face 41s2 of the above-described wiring substrate 40M. The second face 51b faces one or more (for example, a plurality of) electronic components 10L, and faces the metal plate 80 (refer to Figure 1 ). The thickness direction (plate thickness direction) of the flat portion 51 is the Z direction.

[0121] The flat portion 51 has, for example, one or more (for example, a plurality of) accommodation portions 55 that accommodate the bus bars 42, respectively. The plurality of accommodation portions 55 are formed separately from each other in the X direction or the Y direction. Each of the accommodation portions 55 is, for example, a through-hole that penetrates the flat portion 51 (penetrates the base plate 41) in the Z direction. Note that the accommodation portion 55 can not be a through-hole but can be a recess that is provided to the first face 51a or the second face 51b of the flat portion 51 and is recessed in the Z direction. For example, the accommodation portion 55 can be a recess that is recessed in the -Z direction from the first face 51a of the flat portion 51, or can be a recess that is recessed in the +Z direction from the second face 51b of the flat portion 51. Note that in the present disclosure, “the accommodation portion penetrates the flat portion in the first direction (Z direction)” can include a case where a part of the entire length of the accommodation portion 55 penetrates the flat portion 51 in the Z direction (for example, the remaining part of the accommodation portion 55 can be a recess that is recessed in the Z direction, or can be a form in which the accommodation portion 55 is provided inside the base plate 41 and does not protrude to the outside of the base plate 41). Also, in the present disclosure, “the accommodation portion is recessed in the first direction (Z direction)” can include a case where a part of the entire length of the accommodation portion 55 is recessed in the Z direction (for example, the remaining part of the accommodation portion 55 can be a through-hole that penetrates the flat portion 51 in the Z direction, or can be a form in which the accommodation portion 55 is provided inside the base plate 41 and does not protrude to the outside of the base plate 41).

[0122] Each of the accommodation portions 55 has an outer shape that corresponds to the shape of the bus bar 42 accommodated therein, when viewed in the Z direction. In the present embodiment, the flat portion 51 includes, for example, five accommodation portions 55A, 55B, 55C, 55D, and 55E as the plurality of accommodation portions 55. The accommodation portion 55A is provided corresponding to the bus bar 42A described later and accommodates the bus bar 42A. The accommodation portion 55B is provided corresponding to the bus bar 42B described later and accommodates the bus bar 42B. The accommodation portion 55C is provided corresponding to the bus bar 42C described later and accommodates the bus bar 42C. The accommodation portion 55D is provided corresponding to the bus bar 42D described later and accommodates the bus bar 42D. The accommodation portion 55E is provided corresponding to the bus bar 42E described later and accommodates the bus bar 42E.

[0123] (Fixing portion)

[0124] The fixing portion 53 is a fixing portion that mounts the electronic component 10. The fixing portion 53 is, for example, a boss that protrudes in the Z direction from the flat portion 81. The fixing portion 53 faces the mounting portion 14 of the electronic component 10 in the Z direction. The fixing portion 53 has an engagement hole 53h that is open in the +Z direction. An inner peripheral surface of the engagement hole 53h has a screw groove. The fixing portion 53 is formed, for example, by embedding a metal member having the engagement hole 53h in the flat portion 51 of the base plate 41.

[0125] In the mounting hole 14h of the mounting portion 14 of the electronic component 10, a fastening member 112 (e.g., a screw or a bolt) is passed in the Z direction. When the fastening member 112 passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 is engaged with the engagement hole 53h of the fixing portion 53, the electronic component 10 is fixed to the base plate 41.

[0126] In the present embodiment, the fixing portion 53 that fixes the electronic component 10U protrudes from the planar portion 51 of the base plate 41 in the +Z direction. The mounting portion 14 of the electronic component 10U is fixed to the fixing portion 53 from the +Z direction side. On the other hand, the fixing portion 53 that fixes the electronic component 10L protrudes from the planar portion 51 of the base plate 41 in the -Z direction. The mounting portion 14 of the electronic component 10L is fixed to the fixing portion 53 from the -Z direction side.

[0127] <3.3.2 Bus Bars>

[0128] The bus bar 42 is a wiring member (an electrically connecting member) included in the wiring substrate 40. The bus bar 42 is, for example, a wiring member for electrically connecting a plurality of electronic components 10. Alternatively, the bus bar 42 can be a wiring member for connecting the electronic component 10 with an external device. The bus bar 42 is made of metal (e.g., copper or a copper alloy), and has electrical conductivity. In the present embodiment, the wiring substrate 40 has, for example, five bus bars 42A, 42B, 42C, 42D, 42E as the plurality of bus bars 42. The five bus bars 42A, 42B, 42C, 42D, 42E are arranged in the horizontal direction at intervals from each other. The five bus bars 42A, 42B, 42C, 42D, 42E include portions arranged on the same plane. The five bus bars 42A, 42B, 42C, 42D, 42E are adjacent to each other at least in part in the X direction or the Y direction. The five bus bars 42A, 42B, 42C, 42D, 42E are supported by the planar portion 51 of the base plate 41.

[0129] The five bus bars 42A, 42B, 42C, 42D, 42E are respectively housed in the housing portions 55, and are exposed at least in part on the first face 51a of the base plate 41 and at least in part on the second face 51b of the base plate 41. In addition, the five housing portions 55A, 55B, 55C, 55D, 55E corresponding to the five bus bars 42 can each be a recessed portion recessed toward the -Z direction from the first face 51a of the planar portion 51 instead of a through-hole that penetrates the base plate 41 in the Z direction, or can be a recessed portion recessed toward the +Z direction from the second face 51b of the planar portion 51.

[0130] (Wiring structure of bus bar)

[0131] At least a portion of each bus bar 42 is plate-shaped in the horizontal direction. At least a portion of each bus bar 42 is housed in the housing portion 55 and extends along the planar portion 51. That is, at least a portion of each bus bar 42 extends along the first face 51a of the planar portion 51. At least a portion of each bus bar 42 extends in the horizontal direction within the housing portion 55. In the present embodiment, each bus bar 42 is plate-shaped in the horizontal direction throughout the entirety of the bus bar 42. Each bus bar 42 is housed in the housing portion 55 and extends along the planar portion 51 throughout the entire length of the bus bar 42. Hereinafter, the portion of each bus bar 42 that is housed in the housing portion 55 and extends along the planar portion 51 will sometimes be referred to as a "plate portion 42p". The bus bar 42 is a component that forms a power supply path in the horizontal direction. The bus bar 42 can also be referred to as a "horizontal wiring component".

[0132] Figure 10 FIG. 4 is a plan view that shows the wiring substrate 40. The plate portion 42p of each bus bar 42 has, for example, a first connection portion 61, a second connection portion 62, and an extension portion 63.

[0133] The first connection portion 61 is a portion that contacts one connection component 20 (hereinafter referred to as a "first connection component 20"). The first connection component 20 is a connection component that connects one electronic component 10 (hereinafter referred to as a "first electronic component 10") to the bus bar 42. The first connection portion 61 is a portion of the bus bar 42 that overlaps the first connection component 20 when viewed in the Z direction. The first connection portion 61 is adjacent to the first connection component 20 in the Z direction and is connected to the first connection component 20 from the Z direction.

[0134] The second connection portion 62 is a portion that contacts another connection component 20 (hereinafter referred to as a "second connection component 20"). The second connection component 20 is a connection component that connects another electronic component 10 (hereinafter referred to as a "second electronic component 10") included in the plurality of electronic components 10 to the bus bar 42. The second connection portion 62 is a portion of the bus bar 42 that overlaps the second connection component 20 when viewed in the Z direction. The second connection portion 62 is adjacent to the second connection component 20 in the Z direction and is connected to the second connection component 20 from the Z direction.

[0135] In addition, the second connection portion 62 can instead be a portion that contacts another connection component 30 (hereinafter referred to as a "second connection component 30"), as in the above example. The connection component 30 is a connection component for connecting an external device to the bus bar 42. In this case, the second connection portion 62 is a portion of the bus bar 42 that overlaps the second connection component 30 when viewed in the Z direction. The second connection portion 62 is adjacent to the second connection component 30 in the Z direction and is connected to the second connection component 30 from the Z direction.

[0136] Further, the second connection portion 62 can also be a portion that is in contact with the link bus bar 75 for connection with other sub-units SU, without being in contact with the connection members 20, 30. In this case, the second connection portion 62 is a portion of the bus bar 42 that overlaps the link bus bar 75 when viewed in the Z direction. The second connection portion 62 is adjacent to the link bus bar 75 in the Z direction, and is connected to the link bus bar 75 from the Z direction.

[0137] The extension portion 63 extends from the first connection portion 61 in the X direction or the Y direction. The extension portion 63 is provided between the first connection portion 61 and the second connection portion 62. The extension portion 63 extends so as to straddle the first connection portion 61 and the second connection portion 62. The extension portion 63 connects the first connection portion 61 and the second connection portion 62.

[0138] In the present embodiment, the first connection portion 61, the second connection portion 62, and the extension portion 63 are plate-shaped in the horizontal direction. In the present embodiment, each bus bar 42 is housed in the housing portion 55 and extends along the planar portion 51 at least over the first connection portion 61 and the second connection portion 62. For example, the first connection portion 61, the second connection portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0139] In the present embodiment, the extension portion 63 of some of the bus bars 42 is housed in the housing portion 55, so as to extend through the region R that overlaps the electronic component 10 when viewed in the Z direction and across both sides of the region R. For example, the extension portion 63 extends in a straight line in the X direction. The extension portion 63 extends so as to pass through the region R that overlaps the electronic component 10 when viewed in the Z direction and across the +X direction side and the -X direction side of the region R. That is, the bus bar 42, by being housed in the housing portion 55, is not hindered by the presence of the electronic component 10, and is easily routed in a better path (for example, a path with a shorter distance).

[0140] Further, one or more of the bus bars 42 can have an extension portion 64 in addition to the first connection portion 61, the second connection portion 62, and the extension portion 63. The extension portion 64 is a portion in which the bus bar 42 is extended for the purpose of expanding the heat dissipation area and / or expanding the heat capacity for heat storage (heat absorption). The extension portion 64 is a portion that is not used for electrical connection. For example, the extension portion 64 is located on the side opposite the extension portion 63 with respect to the first connection portion 61 (or the second connection portion 62). The extension portion 64 is plate-shaped in the horizontal direction. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R that overlaps the electronic component 10 when viewed in the Z direction, and has an end portion 42el of the bus bar 42 at a position that overlaps the electronic component 10 when viewed in the Z direction.

[0141] The following describes several wiring examples of the bus bars 42. In addition, the plurality of electronic components 10 includes three electronic components 10A, 10B, 10C. The electronic component 10A and the electronic component 10B are, for example, electronic components 10M of the first type. The electronic component 10C is, for example, an electronic component 10N of the second type. In addition, the types of the electronic components 10 are not limited to the above examples.

[0142] In the present embodiment, the electronic components 10A, 10B are each an example of an electronic component 10 (electronic component 10U) disposed on the +Z direction side with respect to the base plate 41. The electronic components 10A, 10B face the first surface 51a (first surface 40s1 of the wiring substrate 40M) of the planar portion 51 of the base plate 41 from the +Z direction side. The electronic components 10A and 10B are each an example of a "first electronic component". In addition, in other viewpoints, the electronic component 10A is an example of a "first electronic component", and the electronic component 10B is an example of a "third electronic component".

[0143] On the other hand, the electronic component 10C is an example of an electronic component 10 (electronic component 10L) disposed on the -Z direction side with respect to the base plate 41. The electronic component 10C faces the second surface 51b (second surface 40s2 of the wiring substrate 40M) of the planar portion 51 of the base plate 41 from the -Z direction side. The electronic component 10C is an example of a "second electronic component".

[0144] In the present embodiment, the electronic component 10B (electronic component 10U) and the electronic component 10C (electronic component 10L) at least partially overlap when viewed in the Z direction. For example, the electronic component 10B and the terminal 13A of the electronic component 10C overlap when viewed in the Z direction.

[0145] The plurality of connection components 20 includes six connection components 20A, 20B, 20C, 20D, 20E, 20F. The plurality of connection components 30 includes two connection components 30A, 30B. The plurality of link bus bars 75 includes two link bus bars 75A, 75B. The plurality of external connection bus bars 76 includes two external connection bus bars 76A, 76B.

[0146] (First wiring example)

[0147] First, a wiring example related to the bus bar 42A will be described. The bus bar 42A has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is located on the +X direction side with respect to the electronic component 10A when viewed from the Z direction. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10A via the connecting member 20A as the first connecting member 20. The second connecting portion 62 is located on the -X direction side with respect to the electronic component 10A when viewed from the Z direction. The second connecting portion 62 is electrically connected to the other sub unit SU via the bus bar 75A.

[0148] The extension portion 63 extends across both sides of the region R overlapping the electronic component 10A when viewed from the Z direction by being housed in the housing portion 55. For example, the extension portion 63 extends in a straight line shape in the X direction. The extension portion 63 extends across the +X direction side and the -X direction side of the region R overlapping the electronic component 10A when viewed from the Z direction. The bus bar 42A is, for example, a bus bar included in the positive line PL possessed by the electric connection unit 1. The bus bar 42A is an example of the "first bus bar". The housing portion 55A is an example of the "first housing portion".

[0149] (Second wiring example)

[0150] Next, a wiring example related to the bus bar 42B will be described. The bus bar 42B has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10A via the connecting member 20B as the first connecting member 20. The second connecting portion 62 is electrically connected to the bus bar 76A for external connection via the connecting member 30A as the second connecting member 30. The extension portion 64 extends to the region R overlapping the electronic component 10A when viewed from the Z direction, and has an end portion 42el of the bus bar 42 on the position overlapping the electronic component 10A. Further, the bus bar 42B can have the extension portion 63 extending across both sides of the region R overlapping the electronic component 10 when viewed from the Z direction in the same manner as the bus bar 42A. The bus bar 42B is, for example, a bus bar included in the positive line PL possessed by the electric connection unit 1.

[0151] (Third wiring example)

[0152] Next, a wiring example related to the bus bar 42C will be described. The bus bar 42C has a first connecting portion 61, a second connecting portion 62, an extension portion 63, and an extension portion 64. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10B via the connecting member 20C as the first connecting member 20. The second connecting portion 62 is electrically connected to the other sub unit SU via the bus bar 75B. The extension portion 64 extends to the region R overlapping the electronic component 10B when viewed in the Z direction, and has the end portion 42e1 of the bus bar 42 at a position overlapping the electronic component 10B when viewed in the Z direction. The bus bar 42C is, for example, a bus bar included in the negative line NL of the electrical connection unit 1. The bus bar 42C is another example of the "first bus bar". The housing portion 55C is another example of the "first housing portion".

[0153] (Fourth wiring example)

[0154] Next, a wiring example related to the bus bar 42D will be described. The bus bar 42D has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to the terminal 13A of the electronic component 10B via the connecting member 20D as the first connecting member 20. The second connecting portion 62 is electrically connected to the terminal 13A of the electronic component 10C via the connecting member 20E as the second connecting member 20. The bus bar 42D is, for example, a bus bar included in the negative line NL of the electrical connection unit 1. The bus bar 42D is an example of the "second bus bar". The housing portion 55D is an example of the "second housing portion".

[0155] (Fifth wiring example)

[0156] Next, a wiring example related to the bus bar 42E will be described. The bus bar 42E has a first connecting portion 61, a second connecting portion 62, and an extension portion 63. The first connecting portion 61 is electrically connected to the terminal 13B of the electronic component 10C via the connecting member 20F as the first connecting member 20. The second connecting portion 62 is electrically connected to the external connection bus bar 76B via the connecting member 30B as the second connecting member 30. The bus bar 42E is, for example, a bus bar included in the negative line NL of the electrical connection unit 1.

[0157] (Exposure structure of bus bar)

[0158] Next, the exposure structure of the bus bar 42 will be described.

[0159] Reference Signs Figure 8 and Figure 9The exposed structure of the bus bar 42 will be described. In the present embodiment, at least a part of the extension 63 of the bus bar 42 is exposed to the outside of the base plate 41 on the upper surface side and the lower surface side. For example, at least a part of the extension 63 of the bus bar 42 in a region R (see FIG. 6) that overlaps the electronic component 10 when viewed in the Z direction is exposed to the outside of the base plate 41 on the upper surface side and the lower surface side. Figure 10 ) of the bus bar 42 is exposed to the outside of the base plate 41 on the upper surface side and the lower surface side.

[0160] In the present embodiment, the bus bar 42 is housed in the housing portion 55 at least over the entire length between the first connecting portion 61 and the second connecting portion 62 and extends along the first face 51a of the planar portion 51. The bus bar 42 is exposed to the outside of the base plate 41 on the upper surface side and the lower surface side at least over the entire length between the first connecting portion 61 and the second connecting portion 62.

[0161] In the present embodiment, the bus bar 42 is housed in the housing portion 55 over the entire length of the bus bar 42 and extends along the first face 51a of the planar portion 51. The bus bar 42 is exposed to the outside of the base plate 41 on the upper surface side and the lower surface side over the entire length of the bus bar 42.

[0162] <3.3.3 Fastening Component>

[0163] Next, the fastening component 43 will be described again with reference to Figure 9 The fastening component 43 is a component for fixing the bus bar 42 and a connecting object component (the connecting component 20, the connecting component 30, or the link bus bar 75) of the bus bar 42. The fastening component 43 is, for example, a rivet bolt fixed to the bus bar 42. The fastening component 43 is an example of a "fastening portion".

[0164] In the present embodiment, the first connecting portion 61 and the second connecting portion 62 of the bus bar 42 each have a through-hole 42h. The through-hole 42h penetrates the bus bar 42 in the Z direction. The fastening component 43 is, for example, a bolt having a shaft portion 43a and a head portion 43b. The peripheral surface of the shaft portion 43a has a screw groove. The diameter of the head portion 43b is larger than the diameter of the shaft portion 43a. The fastening component 43 is fixed to the bus bar 42 with the head portion 43b in a state where the shaft portion 43a passes through the through-hole 42h of the bus bar 42. By this fixing, the fastening component 43 is electrically and physically connected to the bus bar 42 in a state where the shaft portion 43a protrudes from the through-hole 42h of the bus bar 42 in the Z direction. Note that the fastening component 43 is not limited to being fixed by riveting, but can be fixed to the bus bar 42 by welding or another method.

[0165] In the present embodiment, the connecting member 20 is attached to the fastening member 43 from the Z direction in a state where it is fixed to the electronic member 10 by the fastening member 71 or the fastening member 72. For example, the connecting member 20 has the shaft portion 43a of the fastening member 43 inserted into the attachment hole 22h of the second portion 22. Then, the engaging member 44 (e.g., a nut) is engaged with the shaft portion 43a of the fastening member 43 protruding from the attachment hole 22h of the second portion 22 of the connecting member 20. The engaging member 44 is attached to the shaft portion 43a, for example, along the Z direction. By this engagement, the second portion 22 of the connecting member 20 is fixed to the fastening member 43.

[0166] In the present embodiment, the bus bar 42 has a first surface 42s1 and a second surface 42s2 (see FIG. 6). The first surface 42s1 is a surface facing the +Z direction. On the other hand, the second surface 42s2 is located on the side opposite to the first surface 42s1. The second surface 42s2 is a surface facing the -Z direction. Figure 13 )· The first surface 42s1 is a surface facing the +Z direction. On the other hand, the second surface 42s2 is located on the side opposite to the first surface 42s1. The second surface 42s2 is a surface facing the -Z direction.

[0167] In the present embodiment, the fastening member 43 for the connecting member 20 corresponding to the electronic member 10U protrudes from the first surface 42s1 of the bus bar 42 to the +Z direction side. The connecting member 20 corresponding to the electronic member 10U is attached to the bus bar 42 from the +Z direction side in such a manner that the shaft portion 43a of the fastening member 43 is inserted into the attachment hole 22h of the connecting member 20. The connecting member 20 corresponding to the electronic member 10U is fixed to the bus bar 42 in a state where it is in contact with the first surface 42s1 of the bus bar 42 from the +Z direction side, for example, by the engaging member 44.

[0168] On the other hand, the fastening member 43 for the connecting member 20 corresponding to the electronic member 10L protrudes from the second surface 42s2 of the bus bar 42 to the -Z direction side. The connecting member 20 corresponding to the electronic member 10L is attached to the bus bar 42 from the -Z direction side in such a manner that the shaft portion 43a of the fastening member 43 is inserted into the attachment hole 22h of the connecting member 20. The connecting member 20 corresponding to the electronic member 10L is fixed to the bus bar 42 in a state where it is in contact with the second surface 42s2 of the bus bar 42 from the -Z direction side, for example, by the engaging member 44.

[0169] <4. Metal plate, insulating sheet, heat conducting member, and insulating cover>

[0170] Next, the metal plate 80, the insulating sheets 91A and 91B, the heat conducting member 92, the heat conducting member 93, and the insulating cover 94 will be described.

[0171] <4.1 Metal plate>

[0172] Figure 11is a perspective view showing a part of the electrical connection unit 1 broken down. The metal plate 80 is a member for ensuring rigidity of the electrical connection unit 1 and improving heat dissipation of the electrical connection unit 1. The metal plate 80 is made of metal (for example, aluminum or an aluminum alloy). The metal plate 80 is an example of a “rigid member”. The metal plate 80 can also be referred to as a “metal member” or a “heat dissipation member”. In the present embodiment, the metal plate 80 is disposed on the side opposite to the wiring substrate 40M with respect to the electronic component 10L, and the wiring substrate 40 is fixed thereto.

[0173] The metal plate 80 is a rectangular shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end portion 80e1, a second end portion 80e2, a third end portion 80e3, and a fourth end portion 80e4 (see FIG. 8). The first end portion 80e1 and the second end portion 80e2 are a pair of end portions in the long side direction of the metal plate 80, and are separated in the X direction. The third end portion 80e3 and the fourth end portion 80e4 are a pair of end portions in the short side direction of the metal plate 80, and are separated in the Y direction. The metal plate 80 includes, for example, a flat portion 81 and a plurality of fixing portions 82. Figure 2 ) The first end portion 80e1 and the second end portion 80e2 are a pair of end portions in the long side direction of the metal plate 80, and are separated in the X direction. The third end portion 80e3 and the fourth end portion 80e4 are a pair of end portions in the short side direction of the metal plate 80, and are separated in the Y direction. The metal plate 80 includes, for example, a flat portion 81 and a plurality of fixing portions 82.

[0174] The flat portion 81 is a portion formed in a plate shape in the metal plate 80. The flat portion 81 is in a plate shape along the horizontal direction. The flat portion 81 forms a main portion of the metal plate 80. The flat portion 81 forms a base portion (metal base portion) of the metal plate 80. In the present embodiment, the flat portion 81 has a size to cover the three sub-units SU from below. The flat portion 81 faces the wiring substrates 40 of the three sub-units SU. In the present embodiment, the metal plate 80 leaves a space S1 (see FIG. 8) between the flat portion 81 and the second face 51b of the flat portion 51 of each sub-unit SU, and faces the second face 51b of the flat portion 51 of each sub-unit SU. The electronic component 10L is housed in the space S1. That is, the electronic component 10L is disposed between the wiring substrate 40M and the metal plate 80 in the Z direction. Figure 13

[0175] The fixing portion 82 is a fixing portion for fixing the base plate 41 of each sub-unit SU to the metal plate 80. When viewed from the Z direction, the fixing portion 82 is provided at a position corresponding to the fixing portion 52 of the base plate 41 of each sub-unit SU. The fixing portion 82 is a cylindrical or prismatic boss that protrudes from the flat portion 81 of the metal plate 80 in the +Z direction. The fixing portion 82 faces the fixing portion 52 of the base plate 41 in the Z direction. The fixing portion 82 has an engagement hole 82h that is open in the +Z direction. An inner peripheral surface of the engagement hole 82h has a screw groove.

[0176] ​The base plate 41 has a fixing portion 52 fixed to a fixing portion 82 of the metal plate 80. The fixing portion 52 has an insertion hole 52h facing a fitting hole 82h of the fixing portion 82 of the metal plate 80. A fastening member 111 (e.g., a screw or a bolt) passes through the insertion hole 52h. When the fastening member 111 after passing through the insertion hole 52h of the fixing portion 52 of the base plate 41 is fitted to the fitting hole 82h of the fixing portion 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80.

[0177] <4.2 Insulating sheet>

[0178] The insulating sheets 91A, 91B are insulating members for electrically insulating the metal plate 80 from the wiring substrate 40M. The insulating sheets 91A, 91B are, for example, synthetic resin such as polyester or polyimide, and have insulating properties.

[0179] The insulating sheet 91A is a rectangular shape along the planar portion 81 of the metal plate 80. The insulating sheet 91A is a sheet shape in the horizontal direction. The insulating sheet 91A is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each sub-unit SU. In the present embodiment, the insulating sheet 91A has an opening through which a heat conducting portion 93 described later passes. In addition, the insulating sheet 91A can be omitted in a case where necessary insulating properties are ensured by other means.

[0180] The insulating sheet 91B is a rectangular shape along the upper surface of the heat conducting portion 93. The insulating sheet 91B is a sheet shape in the horizontal direction. The insulating sheet 91B is disposed between the heat conducting portion 93 and the heat conducting member 92. In addition, the insulating sheet 91B can be disposed between the wiring substrate 40 of each sub-unit SU and the plurality of heat conducting members 92 instead of the above example. In addition, the insulating sheet 91B can be omitted in a case where necessary insulating properties are ensured by other means. For example, the insulating sheet 91B can be omitted in a case where the heat conducting member 92 has insulating properties and necessary insulating properties are ensured by the heat conducting member 92.

[0181] <4.3 Heat conducting member>

[0182] The heat conducting member 92 is a member for transferring heat emitted from the electronic component 10 at the time of energization and / or heat (Joule heat) emitted from the bus bar 42 itself at the time of energization to the metal plate 80. The heat conducting member 92 is, for example, a heat conducting sheet (e.g., a heat conducting silicone sheet) having elasticity. The heat conducting member 92 is, for example, formed of a material having a higher thermal conductivity than the base plate 41. However, the heat conducting member 92 is not limited to the above example, and can be a heat conducting member formed of a heat conducting gel or another material.

[0183] Figure 12is a bottom view of the wiring substrate 40. In the present embodiment, the plurality of heat conductive members 92 are partially provided in the wiring substrate 40. For example, the plurality of heat conductive members 92 are disposed at positions overlapping a portion of the bus bar 42 when viewed in the Z direction. Further, the plurality of heat conductive members 92 are disposed at positions overlapping a portion of the bus bar 42 in the vicinity of the electronic component 10 (e.g., the electronic components 10A, 10B) when viewed in the Z direction. In the present embodiment, the plurality of heat conductive members 92 are disposed at positions overlapping the connection member 20 when viewed in the Z direction. Note that the disposition positions of the heat conductive members 92 are not limited to the above examples. For example, the heat conductive members 92 can be disposed at positions not overlapping the connection member 20 when viewed in the Z direction, or can be disposed at positions not overlapping the electronic component 10.

[0184] Figure 13 is a cross-sectional view along the F13-F13 line of the structure shown in Figure 10 In the present embodiment, a portion of the heat conductive member 92 is in contact with the bus bar 42 at a position overlapping the connection member 20 when viewed in the Z direction. In this case, the heat conductive member 92 easily transfers heat transferred from the terminal 13 of the electronic component 10 to the connection member 20 to the metal plate 80 from the connection member 20 via the bus bar 42. Further, a portion of the heat conductive member 92 can be in contact with the bus bar 42 at a position overlapping the connection member 30 when viewed in the Z direction instead of / in addition to the above example. In this case, the heat conductive member 92 easily transfers heat transferred from the external device to the connection member 30 to the metal plate 80 from the connection member 30 via the bus bar 42.

[0185] Further, in the present embodiment, a portion of the heat conductive member 92 is disposed at a position overlapping the head 43b of the fastening member 43 when viewed in the Z direction, and is in contact with the head 43b of the fastening member 43. In this case, the heat conductive member 92 easily transfers heat transferred from the terminal 13 of the electronic component 10 to the connection member 20 to the metal plate 80 from the fastening member 43. Further, when a portion of the heat conductive member 92 is in contact with the head 43b of the fastening member 43, the heat conductive member 92 easily transfers heat transferred from the external device to the connection member 30 to the metal plate 80 from the fastening member 43.

[0186]

[0187] ​A portion of the thermally conductive member 92 can also be in contact with the bus bar 42 at a position overlapping the electronic component 10 when viewed in the Z direction. In this case, the thermally conductive member 92 easily transfers heat transferred from the electronic component 10 to the bus bar 42 from the bus bar 42 to the metal plate 80. In addition, a thermally conductive member can also be provided between the bus bar 42 and the electronic component 10.

[0188] In the present embodiment, in the region in which the connection member 20 mounted to the electronic component 10L overlaps the electronic component 10U in the Z direction, the electronic component 10U is not in contact with the bus bar 42. That is, in the region in which the connection member 20 mounted to the electronic component 10L overlaps the electronic component 10U in the Z direction, an air layer AS is provided between the electronic component 10U and the bus bar 42. If the air layer AS is provided between the electronic component 10U and the bus bar 42, transfer of heat transferred from the electronic component 10L to the bus bar 42 to the electronic component 10U from the bus bar 42 can be suppressed.

[0189] The same is true in the case in which the correspondence relation of the electronic component 10U and the electronic component 10L is reversed. In the region in which the connection member 20 mounted to the electronic component 10U overlaps the electronic component 10L in the Z direction, the electronic component 10L is not in contact with the bus bar 42. That is, in the region in which the connection member 20 mounted to the electronic component 10U overlaps the electronic component 10L in the Z direction, an air layer AS is provided between the electronic component 10L and the bus bar 42.

[0190] <4.4 Thermally conductive portion>

[0191] The thermally conductive portion 93 is a structure for filling the space S1 between the planar portion 81 of the metal plate 80 and the thermally conductive member 92 and transferring heat from the thermally conductive member 92 to the planar portion 81 of the metal plate 80. The thermally conductive portion 93 is an example of a protruding portion protruding from the metal plate 80 toward the wiring substrate 40M. The thermally conductive portion 93 is, for example, a block member made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy). The thermally conductive portion 93 is formed of a material having a higher thermal conductivity than the thermally conductive member 92. The thermally conductive portion 93 is formed of a rigid member that is less likely to deform than the thermally conductive member 92. The thermally conductive portion 93 is disposed at a position overlapping the thermally conductive member 92 when viewed in the Z direction. For example, the thermally conductive portion 93 has the same area as the thermally conductive member 92 when viewed in the Z direction. The thickness of the thermally conductive portion 93 in the Z direction is greater than the thickness of the thermally conductive member 92 in the Z direction.

[0192] The heat conducting portion 93 is fixed to the flat portion 81 of the metal plate 80 and protrudes from the flat portion 81 of the metal plate 80 toward the heat conducting member 92. In the present embodiment, the heat conducting member 92 is compressed and held between the bus bar 42 and the heat conducting portion 93. The fixation of the heat conducting portion 93 with respect to the metal plate 80 is performed, for example, using a fastening member (screw or bolt). However, the fixation method of the heat conducting portion 93 with respect to the metal plate 80 is not limited to the above example, and can be achieved by means of an adhesive or welding, etc.

[0193] <4.5 Insulating Cover>

[0194] Back Figure 1 An insulating cover 94 will be described. The insulating cover 94 is a member for preventing a finger from contacting a power supply path of the main body portion MU. The insulating cover 94 is made of, for example, synthetic resin and has insulating properties. The insulating cover 94 is, for example, a box shape open on the -Z direction side. The insulating cover 94 has a plurality of air holes 94h. The insulating cover 94 is mounted with respect to the metal plate 80 along the Z direction. In addition, the insulating cover 94 is not limited to a box-shaped member, and can be a sheet-shaped member covering the power supply path of the main body portion MU.

[0195] <5. Advantages>

[0196] As a first comparative example, a configuration in which electronic components are provided only on the +Z direction side of the wiring substrate 40 is considered. In the structure of this first comparative example, since it is necessary to provide a plurality of electronic components only on one side of the wiring substrate 40 while avoiding interference between the electronic components, it is sometimes difficult to achieve miniaturization (for example, reduction in area when viewed in the Z direction) of the electrical connection unit.

[0197] As a second comparative example, a module in which electronic components are provided only on the +Z direction side of the wiring substrate 40 and a rigid member (for example, the metal plate 80) is provided on the -Z direction side of the wiring substrate 40 is considered. Also, an electrical connection unit formed by overlapping a plurality of such modules in the Z direction is considered. In the structure of this second comparative example, there are a plurality of rigid members arranged apart in the Z direction, and it is sometimes difficult to achieve thinness of the electrical connection unit.

[0198] On the other hand, in the present embodiment, the electric connection unit 1 has a support body (for example, the base plate 41), a first bus bar (for example, the bus bar 42C), a second bus bar (for example, the bus bar 40D), a first electronic component (for example, the electronic component 10B), and a second electronic component (for example, the electronic component 10C). The support body has a first surface (for example, the first surface 51a) and a second surface (for example, the second surface 51b) on the side opposite to the first surface. The first bus bar is supported by the support body. The second bus bar is supported by the support body. The first electronic component is disposed facing the first surface of the support body and is electrically connected to the first bus bar. The second electronic component is disposed facing the second surface of the support body and is electrically connected to the second bus bar.

[0199] According to such a structure, since the plurality of electronic components 10 are disposed separately on the +Z direction side and the -Z direction side of the support body, the plurality of electronic components 10 are less likely to interfere with each other, and the plurality of electronic components 10 can be disposed close to each other when viewed in the Z direction. Therefore, compared to a case where the plurality of electronic components 10 are disposed on only one side (for example, only the +Z direction side) of the support body, for example, the electric connection unit 1 can be made smaller (for example, the area when viewed in the Z direction can be reduced).

[0200] In addition, according to another viewpoint, in addition to the above-described structure, the electric connection unit 1 has a rigid member (for example, the metal plate 80) disposed on the -Z direction side with respect to the support body and the plurality of electronic components 10. The support body is fixed to the rigid member. According to such a structure, in a structure where the plurality of electronic components 10 are disposed separately on the +Z direction side and the -Z direction side of the support body, the strength required for the electric connection unit 1 can be easily ensured by one rigid member. Therefore, compared to a case where a plurality of rigid members are disposed separately in the Z direction, for example, the electric connection unit 1 can be made thinner.

[0201] In the present embodiment, the first electronic component and the second electronic component at least partially overlap when viewed in the Z direction. According to such a structure, the plurality of electronic components 10 can be disposed closer to each other when viewed in the Z direction. Therefore, the electric connection unit 1 can be made smaller (for example, the area when viewed in the Z direction can be further reduced).

[0202] In the present embodiment, the above support body has a first housing portion (for example, housing portion 55C) recessed from the above first face or the above second face or penetrating the above support body in the Z direction and a second housing portion (for example, 55D) recessed from the above first face or the above second face or penetrating the above support body in the Z direction. At least a portion of the above first bus bar is housed in the above first housing portion. At least a portion of the above second bus bar is housed in the above second housing portion. According to such a structure, compared with a case where the bus bars are placed on the surface of the support body, thinning of the structure in which the support body and the bus bars are integrated can be achieved. Thus, further thinning of the electrical connection unit 1 can be achieved.

[0203] In the present embodiment, the above second bus bar is at least partially exposed on the above first face and is at least partially exposed on the above second face. According to such a structure, both the electronic component 10U arranged on the +Z direction side of the above support body and the electronic component 10L arranged on the -Z direction side of the above support body are easily connected to the above second bus bar. Thus, the degree of freedom of the wiring path or the component arrangement of the electrical connection unit 1 is increased. Thus, further miniaturization of the electrical connection unit 1 can be achieved.

[0204] In the present embodiment, the above first bus bar and the above second bus bar are at least partially adjacent in the X direction or the Y direction. According to such a structure, compared with a case where the first bus bar is arranged on the first face (+Z direction side surface) of the above support body and the above second bus bar is arranged on the second face (-Z direction side surface) of the above support body, thinning of the structure in which the support body and the bus bars are integrated can be achieved. Thus, further thinning of the electrical connection unit 1 can be achieved.

[0205] In the present embodiment, the above first electronic component is electrically connected to the above second bus bar in addition to the above first bus bar. According to such a structure, the degree of freedom of the wiring path or the component arrangement of the electrical connection unit 1 is increased. Thus, further miniaturization of the electrical connection unit 1 can be achieved.

[0206] In the present embodiment, the above support body is formed of one or more insulating members (for example, base plate 41). According to such a structure, it is easy to electrically connect a plurality of electronic components 10 arranged separately on the +Z direction side and the -Z direction side of the support body by a simple structure. Thus, further miniaturization of the electrical connection unit 1 can be achieved.

[0207] <6. Modified Examples>

[0208] Next, several modified examples will be described. In each of the modified examples, the structures other than the following description are the same as those of the first embodiment.

[0209] (First Modified Example)

[0210] Figure 14 Fig. 21 is a plan view showing a part of the electric connection unit 1 of the first modification example. The electric connection unit 1 of this modification example has the electronic component 10A, the electronic component 10B, the electronic component 10C, and the electronic component 10D as the electronic components 10 (the electronic components 10U) arranged on the +Z direction side with respect to the base plate 41. The electric connection unit 1 has the electronic component 10E as the electronic component 10 (the electronic component 10L) arranged on the -Z direction side with respect to the base plate 41. The electronic component 10A is an example of the "first component". The electronic component 10E is an example of the "second component". In this embodiment, the electronic component 10A and the electronic component 10E at least partially overlap each other when viewed in the Z direction. For example, the component main body part 12 of the electronic component 10A and the component main body part 12 of the electronic component 10E at least partially overlap each other when viewed in the Z direction.

[0211] In this modification example, the electric connection unit 1 includes the seven bus bars 42A, 42B, 42C, 42D, 42E, 42F, 42G as the plurality of bus bars 42. The seven bus bars 42A, 42B, 42C, 42D, 42E, 42F, 42G are at least partially adjacent to each other in the X direction or the Y direction. The seven bus bars 42A, 42B, 42C, 42D, 42E, 42F, 42G are at least partially exposed on the first face 51a of the base plate 41 and at least partially exposed on the second face 51b of the base plate 41, respectively.

[0212] In this modification example, the electric connection unit 1 includes the connection components 20A, 20B, 20C, 20D, 20E, 20F, 20H, 20I, 20J as the plurality of connection components 20. In addition, the electric connection unit 1 includes the link bus bars 75A, 75B, 75C as the plurality of link bus bars 75. Here, the connection relationship of the bus bars 42B, 42C, 42D, 42E and the electronic components 10A, 10B, 10C is the same as that of the first embodiment. Therefore, the description about these connection relationships is omitted.

[0213] The first connection part 61 of the bus bar 42A is electrically connected to the terminal 13A of the electronic component 10A via the connection component 20A. The second connection part 62 of the bus bar 42A is electrically connected to the terminal 13A of the electronic component 10D via the connection component 20G. The bus bar 42A is an example of the "first bus bar".

[0214] The bus bar 42B includes a first connecting portion 61, a second connecting portion 62, and a third connecting portion 65. The first connecting portion 61 of the bus bar 42B is electrically connected to the terminal 13B of the electronic component 10A via the connecting member 20A. The second connecting portion 62 of the bus bar 42B is electrically connected to the connecting member 30A. The third connecting portion 65 of the bus bar 42B is electrically connected to the terminal 13A of the electronic component 10E via the connecting member 20I. The bus bar 42B is an example of the "second bus bar".

[0215] The first connecting portion 61 of the bus bar 42F is electrically connected to the terminal 13B of the electronic component 10D via the connecting member 20H. The second connecting portion 62 of the bus bar 42F is electrically connected to the bus bar 75A. The bus bar 42F is an example of the "first current passage".

[0216] The first connecting portion 61 of the bus bar 42G is electrically connected to the terminal 13B of the electronic component 10E via the connecting member 20J. The second connecting portion 62 of the bus bar 42G is electrically connected to the bus bar 75C. The bus bar 42G is an example of the "second current passage".

[0217] Figure 15 is a cross-sectional view taken along the F15-F15 line of the structure shown in FIG. 15. In the present modification example, the electronic component 10A and the connecting members 20A and 20B are disposed on the +Z direction side with respect to the base plate 41. The electronic component 10E and the connecting members 20I and 20J are disposed on the -Z direction side with respect to the base plate 41. Figure 14 is a cross-sectional view taken along the F15-F15 line of the structure shown in FIG. 15. In the present modification example, the electronic component 10A and the connecting members 20A and 20B are disposed on the +Z direction side with respect to the base plate 41. The electronic component 10E and the connecting members 20I and 20J are disposed on the -Z direction side with respect to the base plate 41.

[0218] In the present modification example, the thermally conductive member 92 is in contact with the extension portion 63 of the bus bar 42G connecting the electronic component 10E from the -Z direction side. An insulating sheet 91B and a thermally conductive portion 93 are provided between the thermally conductive member 92 and the planar portion 81 of the metal plate 80. A part of the heat transferred from the electronic component 10E to the bus bar 42G is transferred to the metal plate 80 via the thermally conductive member 92 and the thermally conductive portion 93.

[0219] According to such a structure, as with the first embodiment, miniaturization of the electrical connection unit 1 can be achieved. In addition, in the present modification example, in the electrical connection unit in which the first current passage and the second current passage can be switched, the electronic component 10A electrically connected to the first current passage and the electronic component 10E electrically connected to the second current passage can be disposed close to each other. Thus, as compared with the case where the electronic component 10A and the electronic component 10E are disposed on one side of the support body, miniaturization of the electrical connection unit 1 (for example, reduction in area when viewed from the Z direction) is easily achieved.

[0220] (Second Modification Example)

[0221] Figure 16is a plan view showing a part of the electric connection unit 1 of the second modification example. In the present modification example, the electric connection unit 1 has the electronic component 10A as the electronic component 10 (the plurality of electronic components 10U) arranged on the +Z direction side with respect to the base plate 41. The electric connection unit 1 has the electronic components 10B, 10C as the electronic components 10 (the electronic components 10L) arranged on the -Z direction side with respect to the base plate 41. The electronic component 10A is an example of the "first component". The electronic component 10B is an example of the "second component". In the present embodiment, the electronic component 10A and the electronic component 10B at least partially overlap each other when viewed from the Z direction. For example, the component main body part 12 of the electronic component 10A and the component main body part 12 of the electronic component 10B at least partially overlap each other when viewed from the Z direction.

[0222] In the present modification example, the electric connection unit 1 includes the five bus bars 42A, 42B, 42C, 42D, 42E as the plurality of bus bars 42. The connection relationship of these five bus bars 42A, 42B, 42C, 42D, 42E with the electronic components 10A, 10B, 10C is the same as that of the first embodiment. Therefore, the description about these connection relationships is omitted.

[0223] In the present modification example, the electronic component 10A and the connection components 20A, 20B are arranged on the +Z direction side with respect to the base plate 41. On the other hand, the electronic component 10B and the connection components 20C, 20D are arranged on the +Z direction side with respect to the base plate 41. In addition, the electronic component 10C and the connection components 20E, 20F are arranged on the +Z direction side with respect to the base plate 41.

[0224] According to such a structure, as in the first embodiment, the miniaturization of the electric connection unit 1 can be achieved. In addition, in the present modification example, in the electric connection unit having the positive electrode line PL and the negative electrode line NL, the electronic component 10A associated with the positive electrode line PL and the electronic component 10B associated with the negative electrode line NL can be arranged close to each other. Thus, compared with the case where the electronic component 10A and the electronic component 10B are arranged on one side of the support body, the miniaturization of the electric connection unit 1 (for example, the reduction of the area when viewed from the Z direction) is easily achieved.

[0225] (Third Modification Example)

[0226] Figure 17is a cross-sectional view showing the electric connection unit 1 of the third modification example. In the above-described first embodiment, the heat conducting portion 93 is formed separately from the metal plate 80. On the other hand, in the present modification example, the heat conducting portion 93 and the metal plate 80 are provided integrally as one piece. That is, the heat conducting portion 93 is provided as a part of the metal plate 80, and is formed integrally with the flat portion 81. The heat conducting portion 93 is a protruding portion protruding from a part of the flat portion 81 in the +Z direction. The heat conducting portion 93 is, for example, a cuboid. The shape of the heat conducting portion 93 is the same as that of the heat conducting portion 93 of the first embodiment.

[0227] According to such a structure, as with the first embodiment, miniaturization of the electric connection unit 1 can be achieved. In addition, in the present modification example, the heat conducting portion 93 and the metal plate 80 are provided as one piece. According to such a structure, compared with the case where the heat conducting portion 93 and the flat portion 81 are separate, it is easy to improve the heat conductivity between the heat conducting portion 93 and the flat portion 81.

[0228] (Fourth Modification Example)

[0229] Figure 18 is a cross-sectional view showing the electric connection unit 1 of the fourth modification example. In the above-described third modification example, the heat conducting portion 93 is a cuboid. On the other hand, in the present modification example, the heat conducting portion 93 is formed by deforming a part of the flat portion 81 in the +Z direction side by press working or the like. In the present modification example, the heat conducting portion 93 is also provided as a part of the metal plate 80, and is formed integrally with the flat portion 81. The heat conducting portion 93 is a protruding portion protruding from a part of the flat portion 81 in the +Z direction. In such a structure, compared with the case where the heat conducting portion 93 and the flat portion 81 are separate, it is also easy to improve the heat conductivity between the heat conducting portion 93 and the flat portion 81.

[0230] (Fifth Modification Example)

[0231] Figure 19 is a perspective view showing the electric connection unit 1 of the fifth modification example. Figure 20 is a cross-sectional view along the F20-F20 line of the structure shown in Figure 19 the first embodiment. If the electronic component 10L generates heat at the time of energization, there can be a case where heat accumulates in the space S1.

[0232] In the present modification example, the flat portion 51 of the base plate 41 has an opening 121 for heat dissipation. The opening 121 penetrates the flat portion 51 in the Z direction, and communicates with the space S1 between the wiring substrate 40 and the metal plate 80. The opening 121 is able to pass air. The air in the space S1 between the wiring substrate 40 and the metal plate 80, for example, rises in correspondence with being heated, and is able to move to the upper side of the wiring substrate 40 through the opening 121.

[0233] According to such a structure, heat is less likely to accumulate in the space S1 between the wiring substrate 40 and the metal plate 80. If heat is less likely to fill the space S1, the heat dissipation of the bus bar 42 improves. When the heat dissipation of the bus bar 42 improves, further improvement of the heat dissipation of the electrical connection unit 1 can be achieved.

[0234] (Second Embodiment)

[0235] Next, a second embodiment will be described. The second embodiment differs from the first embodiment in that the bus bar 42 is arranged in a double-layer structure in the wiring substrate 40M. Further, the structures described below are the same as those of the first embodiment.

[0236] Figure 21 is a cross-sectional view showing the electrical connection unit 1 of the second embodiment. In the present embodiment, the wiring substrate 40M includes one or more base plates 41 (refer to Figure 22 ) and a plurality of bus bars 42. The plurality of bus bars 42 includes one or more bus bars 42U and one or more bus bars 42L.

[0237] The wiring substrate 40M (wiring substrate 40) includes, for example, a first wiring layer 40Ma, a second wiring layer 40Mb, and an insulating layer 40Mc. The first wiring layer 40Ma, the second wiring layer 40Mb, and the insulating layer 40Mc each extend in a plate shape in the horizontal direction. The first wiring layer 40Ma, the second wiring layer 40Mb, and the insulating layer 40Mc are stacked in the Z direction.

[0238] A surface of the first wiring layer 40Ma is exposed on the +Z direction side to form a first surface 40s1 of the wiring substrate 40M. A surface of the second wiring layer 40Mb is exposed on the -Z direction side to form a second surface 40s2 of the wiring substrate 40M. The insulating layer 40Mc is arranged between the first wiring layer 40Ma and the second wiring layer 40Mb in the Z direction. A portion of the insulating layer 40Mc is located between the bus bar 42U and the bus bar 42L in the Z direction. The insulating layer 40Mc electrically insulates the bus bar 42U and the bus bar 42L.

[0239] In the present embodiment, the first wiring layer 40Ma, the second wiring layer 40Mb, and the insulating layer 40Mc are integrally formed from one insulating member. Alternatively, the first wiring layer 40Ma, the second wiring layer 40Mb, and the insulating layer 40Mc can be stacked after being formed separately from each other. Further, in a case where the insulating property between the bus bar 42U and the bus bar 42L described later is ensured by other means, the insulating layer 40Mc can be omitted.

[0240] The bus bar 42U is the bus bar 42 of which one half or more is disposed on the first wiring layer 40Ma. At least a portion of the bus bar 42U is housed in the housing portion 55 provided in the first wiring layer 40Ma and extends in the horizontal direction along the first wiring layer 40Ma. At least a portion of the bus bar 42U is exposed on the first surface 40s1 of the wiring substrate 40M. In addition, a portion of the bus bar 42U can also be bent to be positioned on the second wiring layer 40Mb. The bus bar 42U can be electrically connected to the electronic component 10U or to the electronic component 10L.

[0241] The bus bar 42L is the bus bar 42 of which one half or more is disposed on the second wiring layer 40Mb. At least a portion of the bus bar 42L is housed in the housing portion 55 provided in the second wiring layer 40Mb and extends in the horizontal direction along the second wiring layer 40Mb. At least a portion of the bus bar 42L is exposed on the second surface 40s2 of the wiring substrate 40M. In addition, a portion of the bus bar 42L can also be bent to be positioned on the first wiring layer 40Ma. The bus bar 42L can be electrically connected to the electronic component 10U or to the electronic component 10L.

[0242] Figure 22 Fig. 23 is a perspective view showing a portion of the electrical connection unit 1. Figure 23 Fig. 24 is a cross-sectional view taken along the line F24-F24 of the structure shown in Fig. 23. Figure 22 Fig. 23 is a perspective view showing a portion of the electrical connection unit 1. Figure 24 Fig. 24 is a cross-sectional view taken along the line F24-F24 of the structure shown in Fig. 23. Figure 22 Fig. 24 is a cross-sectional view taken along the line F24-F24 of the structure shown in Fig. 23. The electrical connection unit 1 has, for example, a base plate 41 and a plurality of bus bars 42 (bus bars 42A, 42B).

[0243] The base plate 41 includes a first layer 41a, a second layer 41b, and a third layer 41c. The first layer 41a forms at least a portion of the first wiring layer 40Ma of the wiring substrate 40M. The second layer 41b forms at least a portion of the second wiring layer 40Mb of the wiring substrate 40M. The third layer 41c forms at least a portion of the insulating layer 40Mc of the wiring substrate 40M. In addition, as described above, the first layer 41a, the second layer 41b, and the third layer 41c can be integrally formed from one insulating member or can be laminated after being formed separately from one another.

[0244] The bus bar 42A is an example of the bus bar 42U described above. At least a portion of the bus bar 42A is housed in the housing portion 55 provided in the first layer 41a of the base plate 41 and extends in the horizontal direction.

[0245] The bus bar 42B is an example of the bus bar 42L described above. At least a portion of the bus bar 42B is housed in the housing portion 55 provided in the second layer 41b of the base plate 41 and extends in the horizontal direction.

[0246] In this embodiment, when viewed from the Z direction, busbar 42A and busbar 42B at least partially overlap. For example, when viewed from the Z direction, the extension 63 of busbar 42A located in the first layer 41a and the extension 63 of busbar 42B located in the second layer 41b extend intersectingly in a state of separation in the Z direction.

[0247] Next, return Figure 21 The heat dissipation structure of the second embodiment will be described below. In this embodiment, the wiring substrate 40M has an opening 40g that exposes at least a portion of the busbar 42U towards the -Z direction. Furthermore, in this embodiment, the plurality of heat-conducting components 92 include one or more heat-conducting components 92U in contact with the busbar 42U and one or more heat-conducting components 92L in contact with the busbar 42L. The plurality of heat-conducting portions 93 include one or more heat-conducting portions 93U corresponding to the busbar 42U and one or more heat-conducting portions 93L corresponding to the busbar 42L.

[0248] A heat-conducting component 92U is inserted into an opening 40g provided in the wiring substrate 40M, and contacts the busbar 42U from the -Z direction side inside the wiring substrate 40M. The heat-conducting component 92U contacts the busbar 42U in a state where it is disposed inside the opening 40g. The heat-conducting portion 93U protrudes more significantly in the +Z direction compared to the heat-conducting portion 93L. The heat-conducting component 92U is compressed and held between the busbar 42U and the heat-conducting portion 93U. On the other hand, the heat-conducting component 92L contacts the busbar 42L from the -Z direction side outside the wiring substrate 40M. The heat-conducting component 92L is compressed and held between the busbar 42L and the heat-conducting portion 93L.

[0249] Based on this structure, compared to the structure of the first embodiment, it is easier to form a structure in which multiple busbars 42 intersect in a three-dimensional manner. Therefore, in a structure where multiple electronic components 10 are separately arranged on the +Z and -Z direction sides of the support, the degree of freedom in the wiring layout of the busbars 42 can be increased. This allows for further miniaturization of the electrical connection unit 1 (e.g., a reduction in area when viewed from the Z direction).

[0250] (Third Embodiment)

[0251] Next, the third embodiment will be described. The difference between the third embodiment and the first embodiment is that a plurality of wiring substrates 40M are separately arranged on the +Z direction side and the -Z direction side of the metal plate 80. Otherwise, the structure described below is the same as that of the first embodiment.

[0252] Figure 25is a cross-sectional view showing the electrical connection unit 1 of the third embodiment. In the present embodiment, the support body SB includes a plurality of wiring substrates 40M (wiring substrates 40MU, 40ML) and a metal plate 80.

[0253] The wiring substrate 40MU is arranged on the +Z direction side with respect to the metal plate 80. A first surface 40s1 of the wiring substrate 40MU facing the +Z direction is an example of the "first surface of the support body". A base plate 41 included in the wiring substrate 40MU is an example of the "first insulating member". A first face 51a of the base plate 41 is formed on at least a portion of the first face 40s1 of the wiring substrate 40MU facing the +Z direction.

[0254] The plurality of electronic components 10U are arranged on the +Z direction side with respect to the wiring substrate 40MU. The plurality of electronic components 10U face the first surface 40s1 of the wiring substrate 40MU. The plurality of electronic components 10U are electrically connected to one or more bus bars 42 included in the wiring substrate 40MU. The bus bar 42 included in the wiring substrate 40MU is an example of the "first bus bar".

[0255] On the other hand, the electronic components 10 are not arranged between the wiring substrate 40MU and the metal plate 80. The thermally conductive member 92 is arranged between the wiring substrate 40MU and the metal plate 80.

[0256] The wiring substrate 40ML is arranged on the -Z direction side with respect to the metal plate 80. A second face 40s2 of the wiring substrate 40ML facing the -Z direction is an example of the "second surface of the support body". A base plate 41 included in the wiring substrate 40ML is an example of the "second insulating member". A second face 51b of the base plate 41 is formed on at least a portion of the second face 40s2 of the wiring substrate 40ML facing the -Z direction.

[0257] The plurality of electronic components 10L are arranged on the -Z direction side with respect to the wiring substrate 40ML. The plurality of electronic components 10L face the second face 40s2 of the wiring substrate 40ML. The plurality of electronic components 10L are electrically connected to one or more bus bars 42 included in the wiring substrate 40ML. The bus bar 42 included in the wiring substrate 40ML is an example of the "second bus bar".

[0258] On the other hand, the electronic components 10 are not arranged between the wiring substrate 40ML and the metal plate 80. The thermally conductive member 92 is arranged between the wiring substrate 40ML and the metal plate 80.

[0259] In the present embodiment, the electric connection unit 1 has the insulating cover 94U and the insulating cover 94L as the plurality of insulating covers 94. The insulating cover 94U is, for example, a box shape open on the -Z direction side. The insulating cover 94U is mounted on the metal plate 80 from the +Z direction side, and covers the plurality of electronic components 10U and the wiring substrate 40MU. The insulating cover 94L is, for example, a box shape open on the +Z direction side. The insulating cover 94L is mounted on the metal plate 80 from the -Z direction side, and covers the plurality of electronic components 10L and the wiring substrate 40ML.

[0260] Figure 26 Fig. 17 is a perspective view showing a part of the electric connection unit 1 of the third embodiment. Figure 27 Fig. 18 is a sectional view showing a part of the electric connection unit 1 of the third embodiment. In the present embodiment, the metal plate 80 includes the flat portion 81, the plurality of fixing portions 82, and the plurality of fixing portions 83.

[0261] The plurality of fixing portions 82 include the plurality of fixing portions 82 protruding from the flat portion 81 toward the +Z direction and the plurality of fixing portions 82 protruding from the flat portion 81 toward the -Z direction. The fixing portions 52 of the wiring substrate 40MU are fixed to the plurality of fixing portions 82 protruding from the flat portion 81 toward the +Z direction. The fixing portions 52 of the wiring substrate 40ML are fixed to the plurality of fixing portions 82 protruding from the flat portion 81 toward the -Z direction.

[0262] The fixing portion 83 is a fixing portion for fixing the electronic component 10 directly to the metal plate 80 without passing through the base plate 41. The fixing portion 83 is provided at a position corresponding to the mounting portion 14 of the electronic component 10 when viewed from the Z direction. The fixing portion 83 is a cylindrical or prismatic boss protruding from the flat portion 81 toward the Z direction. The plurality of fixing portions 83 include the plurality of fixing portions 83 protruding from the flat portion 81 toward the +Z direction and the plurality of fixing portions 83 protruding from the flat portion 81 toward the -Z direction.

[0263] In the present embodiment, the through hole 51h is provided in the flat portion 51 of the base plate 41. The through hole 51h penetrates the base plate 41 in the Z direction. The fixing portion 83 is inserted into the through hole 51h of the flat portion 51 of the base plate 41. The fixing portion 83 faces the mounting portion 14 of the electronic component 10 in the Z direction. The fixing portion 83 has the engagement hole 83h open in the Z direction. The inner peripheral surface of the engagement hole 83h has a screw groove.

[0264] In the mounting hole 14h of the mounting portion 14 of the electronic component 10, the fastening member 112 (for example, a screw or a bolt) passes through in the Z direction. When the fastening member 112 passing through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engagement hole 83h of the fixing portion 83 of the metal plate 80, the electronic component 10 is fixed to the metal plate 80 without passing through the base plate 41.

[0265] Next, returningFigure 25 A heat dissipation structure of the third embodiment will be described. In the present embodiment, the metal plate 80 has one or more (for example, a plurality of) heat dissipation portions 101U and one or more (for example, a plurality of) heat dissipation portions 101L.

[0266] The heat dissipation portion 101U is a heat dissipation portion for facilitating heat dissipation of the metal plate 80. The heat dissipation portion 101U is, for example, a protrusion or a fin made of metal. The heat dissipation portion 101U can be integrally formed with the metal plate 80 from a piece of metal member, or can be attached to the metal plate 80 after being formed separately from the metal plate 80.

[0267] In the present embodiment, at least one heat dissipation portion 101U overlaps the thermally conductive member 92 that is in contact with the bus bar 42 included in the wiring substrate 40ML when viewed in the Z direction. That is, at least one heat dissipation portion 101U overlaps the thermally conductive member 92 for transferring heat of the electronic component 10L to the metal plate 80 when viewed in the Z direction. In addition, the configuration of the heat dissipation portion 101U is not limited to the above example.

[0268] The base plate 41 of the wiring substrate 40MU has an opening 41h at a position corresponding to the heat dissipation portion 101U. The opening 41h penetrates the base plate 41 of the wiring substrate 40MU in the Z direction. The heat dissipation portion 101U passes through the opening 41h of the base plate 41 of the wiring substrate 40MU. The heat dissipation portion 101U protrudes to the +Z direction side beyond at least a portion of the base plate 41 of the wiring substrate 40MU from the planar portion 81 of the metal plate 80. The heat dissipation portion 101U is exposed in the space Al between the insulating cover 94U and the wiring substrate 40MU. The heat dissipation portion 101U releases a portion of the heat transferred from the electronic component 10U or the electronic component 10L to the metal plate 80 to the space Al between the insulating cover 94U and the wiring substrate 40MU.

[0269] The heat dissipation portion 101L is a heat dissipation portion for facilitating heat dissipation of the metal plate 80. The heat dissipation portion 101L is, for example, a protrusion or a fin made of metal. The heat dissipation portion 101L can be integrally formed with the metal plate 80 from a piece of metal member, or can be attached to the metal plate 80 after being formed separately from the metal plate 80.

[0270] In the present embodiment, at least one heat dissipation portion 101L overlaps the thermally conductive member 92 that is in contact with the bus bar 42 included in the wiring substrate 40MU when viewed in the Z direction. That is, at least one heat dissipation portion 101L overlaps the thermally conductive member 92 for transferring heat of the electronic component 10U to the metal plate 80 when viewed in the Z direction. In addition, the configuration of the heat dissipation portion 101L is not limited to the above example.

[0271] The base plate 41 of the wiring substrate 40ML has an opening 41h at a position corresponding to the heat dissipation portion 101L. The opening 41h penetrates the base plate 41 of the wiring substrate 40ML in the Z direction. The heat dissipation portion 101L passes through the opening 41h of the base plate 41 of the wiring substrate 40ML. The heat dissipation portion 101L protrudes to the -Z direction side beyond at least a portion of the base plate 41 of the wiring substrate 40ML from the planar portion 81 of the metal plate 80. The heat dissipation portion 101L is exposed in the space A2 between the insulating cover 94L and the wiring substrate 40ML. The heat dissipation portion 101U releases a portion of the heat transmitted from the electronic component 10U or the electronic component 10L to the metal plate 80 to the space A2 between the insulating cover 94L and the wiring substrate 40ML.

[0272] According to such a structure, as with the first embodiment, miniaturization (for example, reduction in area when viewed in the Z direction) of the electrical connection unit can be sought. In addition, according to the present embodiment, one metal plate 80 can be shared by a plurality of wiring substrates 40M. Thus, compared with a structure in which, for example, one metal plate 80 is provided with respect to one wiring substrate 40M and a plurality of modules are arranged in the Z direction, thinning of the electrical connection unit 1 can be achieved.

[0273] The above describes several embodiments and modifications. However, the embodiments and modifications are not limited to the above examples. For example, several embodiments and modifications can be combined with each other.

[0274] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the bus bar 42 are integrated by insert molding. For example, the bus bar 42 can be arranged in the housing portion 55 after the base plate 41 provided with the housing portion 55 that houses the bus bar 42 is molded. In this case, the bus bar 42 can be fixed to the housing portion 55 by fitting, or can be fixed to the housing portion 55 by an adhesive or other fixing means. In these cases, potting that fills the gap between the bus bar 42 and the housing portion 55 can also be implemented.

[0275] The base plate 41 of the wiring substrate 40 is not limited to a base plate 41 having a planar portion 51 that is plate-shaped. The wiring substrate 40 can also be a base member (for example, an insulating sheet) having a planar portion 51 that is sheet-shaped. In this case, the housing portion 55 can also be formed by causing a portion of the planar portion 51 to follow the outer shape of the bus bar 42. Note that, in the present application, "sheet-shaped" or "sheet" is not limited to a member having a thickness of 1 mm or more, and can also be a member (so-called film) having a thickness of less than 1 mm.

[0276] The base plate 41 of the wiring substrate 40 can include a plurality of members (plate members or sheet members). The plurality of members are provided in a manner of sandwiching the plurality of bus bars 42 arranged in the horizontal direction. For example, the plurality of members are integrated by sandwiching the plurality of bus bars 42, for example, by lamination molding. The plurality of members form the planar portion 51. In this case, the accommodation portion 55 can also be formed in a hollow shape inside the base plate 41 (between the plurality of members). The plurality of members can be a plurality of plate members, a plurality of sheet members, or a combination of plate members and sheet members. The sheet members can be, for example, sheet members having flexibility. The planar portion 51 formed by the plurality of members has an opening that exposes at least the first connection portion 61 and the second connection portion 62 of the bus bar 42.

[0277] The connection of the electronic component 10 to the bus bar 42 is not limited to the connection via the connection member 20. The electronic component 10 can be directly connected to the bus bar 42 using a fastening member (for example, a bolt, a screw), welding, or the like.

[0278] REFERENCE NUMERALS

[0279] 1 electric connection unit

[0280] SU subunit

[0281] 10 electronic component

[0282] 13, 13A, 13B terminal

[0283] 20 connection member

[0284] 30 connection member

[0285] 40 wiring substrate

[0286] 41 base plate

[0287] 42 bus bar

[0288] 51 planar portion

[0289] 51a first surface

[0290] 51b second surface

[0291] 55 accommodation portion

[0292] 80 metal plate (rigid member)

[0293] 101U heat dissipation portion

[0294] 101L heat dissipation portion

[0295] SB support body

Claims

1. An electrical connection unit, characterized in that, have: A support having a first surface and a second surface located on the side opposite to the first surface; The first busbar is supported by the support body; The second busbar is supported by the support body; A first electronic component, the first electronic component facing the first surface of the support body, and electrically connected to the first busbar; as well as The second electronic component faces the second surface of the support and is electrically connected to the second busbar.

2. The electrical connection unit according to claim 1, characterized in that, The direction from the first surface toward the second surface is taken as the first direction, and when viewed from the first direction, the first electronic component and the second electronic component at least partially overlap.

3. The electrical connection unit according to claim 1 or 2, characterized in that, When the direction from the first surface to the second surface is defined as the first direction, The support body has: a first receiving portion, which is recessed from the first surface or the second surface or extends through the support body in the first direction; and a second receiving portion, which is recessed from the first surface or the second surface or extends through the support body in the first direction. At least a portion of the first busbar is housed in the first housing section. At least a portion of the second busbar is housed in the second housing section.

4. The electrical connection unit according to claim 1 or 2, characterized in that, The second busbar is exposed at least partially on the first surface and at least partially on the second surface.

5. The electrical connection unit according to claim 1 or 2, characterized in that, When the direction from the first surface to the second surface is defined as the first direction, and the direction intersecting the first direction is defined as the second direction... The first busbar and the second busbar are at least partially adjacent in the second direction.

6. The electrical connection unit according to claim 1 or 2, characterized in that, In addition to being electrically connected to the first busbar, the first electronic component is also electrically connected to the second busbar.

7. The electrical connection unit according to claim 1 or 2, characterized in that, The electrical connection unit also includes a third electronic component facing the first surface of the support and electrically connected to the second busbar.

8. The electrical connection unit according to claim 1 or 2, characterized in that, The electrical connection unit also includes a rigid component, which is disposed on the side opposite to the support body relative to the second electronic component and fixes the support body.

9. The electrical connection unit according to claim 1 or 2, characterized in that, The support body includes: Rigid components; A first insulating member, located on a first side relative to the rigid member, having the first surface, and supporting the first busbar; and The second insulating component is located on a second side opposite to the first side relative to the rigid component, has the second surface, and supports the second busbar.

10. The electrical connection unit according to claim 9, characterized in that, The electrical connection unit also includes a heat dissipation section that protrudes from the rigid member beyond at least a portion of the first insulating member toward the first side.

Images