Bus bar and electrical connection unit

Abstract

The bus bar is a bus bar including a plate portion. A surface of the plate portion has a heat dissipation structure including at least one of a plurality of recesses and a plurality of protrusions.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to a bus bar and an electrical connection unit. BACKGROUND

[0002] An electrical connection unit having an electronic component and a bus bar electrically connected to the electronic component is known.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, an improvement in heat dissipation performance of the electrical connection unit is desired.

[0008] One embodiment provides a bus bar and an electrical connection unit capable of achieving an improvement in heat dissipation performance.

[0009] MEANS FOR SOLVING THE PROBLEMS

[0010] The bus bar of one embodiment is a bus bar including a plate portion. A surface of the plate portion has a heat dissipation structure including at least one of a plurality of recesses and a plurality of protrusions.

[0011] EFFECTS OF THE INVENTION

[0012] According to one embodiment, an improvement in heat dissipation performance can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 FIG. 1 is a cross-sectional view illustrating an electrical connection unit of one embodiment.

[0014] Figure 2 FIG. 3 is a perspective view for describing a main body portion of one embodiment.

[0015] Figure 3 FIG. 5 is a perspective view for describing one subunit of one embodiment.

[0016] Figure 4 FIG. 7 is a perspective view illustrating an electronic component and a connection component of one embodiment.

[0017] Figure 5 FIG. 9 is a perspective view for describing a wiring substrate of one embodiment.

[0018] Figure 6 FIG. 11 is a perspective view in which a part of the wiring substrate of one embodiment is broken away.

[0019] Figure 7 FIG. 13 is a top view illustrating one subunit of one embodiment.

[0020] Figure 8 is a cross-sectional view taken along the line F8-F8 of the structure shown in FIG. 8. Figure 7

[0021] Figure 9 is a cross-sectional view taken along the line F9-F9 of the structure shown in FIG. 9. Figure 7

[0022] Figure 10 is a plan view for explaining a first shape example of the bus bar of the embodiment.

[0023] Figure 11 is a plan view for explaining a second shape example of the bus bar of the embodiment.

[0024] Figure 12 is a perspective view showing other subunits of the embodiment.

[0025] Figure 13 is a front view showing the electronic component of the embodiment.

[0026] Figure 14 is a perspective view showing the base member of the embodiment.

[0027] Figure 15 is a plan view showing the subunit of the embodiment.

[0028] Figure 16 is a cross-sectional view taken along the line F16-F16 of the structure shown in FIG. 16. Figure 15

[0029] Figure 17 is a cross-sectional view taken along the line F17-F17 of the structure shown in FIG. 17. Figure 15

[0030] Figure 18 is a cross-sectional view taken along the line F18-F18 of the structure shown in FIG. 18. Figure 15

[0031] Figure 19 is a perspective view showing a connection structure between a plurality of subunits of the embodiment.

[0032] Figure 20 is a cross-sectional view taken along the line F20-F20 of the structure shown in FIG. 20. Figure 15 DETAILED DESCRIPTION

[0033] Hereinafter, the embodiment will be described with reference to the drawings. In the following description, structures having the same or similar functions are designated by the same reference numerals. Also, sometimes repeated description of these structures is omitted. In addition, the structures described below do not limit the scope of the embodiment.

[0034] ​​​​​​In the present disclosure, the terms are defined as follows. "Connection" is not limited to mechanical connection, and can include electrical connection. That is, "connection" is not limited to the case where two elements as connection objects are directly connected, and can include the case where two elements as connection objects are connected with other elements interposed therebetween. "Accommodation" is not limited to the case where the entirety of a component is accommodated, and can include the case where only a part of a component is accommodated (a state where another part of the component protrudes). "Facing" means that the imaginary projected images of two objects overlap each other in the case of being observed from a particular direction. That is, "facing" is not limited to the case where two objects directly face each other, and can include the case where two objects face each other in a state where other components exist between the two objects. "Parallel", "orthogonal", or "identical" can include "approximately parallel", "approximately orthogonal", or "approximately identical", respectively.

[0035] In the present disclosure, the +X direction, the -X direction, the +Y direction, the -Y direction, the +Z direction, and the -Z direction are defined as follows. The +X direction is a direction from a first end portion 110e1 of a metal plate 110 described later toward a second end portion 110e2 (refer to FIG. 1). The -X direction is a direction opposite to the +X direction. Hereinafter, in the case where the +X direction and the -X direction are not distinguished, it is simply referred to as the "X direction". The +Y direction and the -Y direction are directions intersecting (for example, orthogonal to) the X direction. The +Y direction is a direction from a third end portion 110e3 of the metal plate 110 described later toward a fourth end portion 110e4 (refer to FIG. 1). The -Y direction is a direction opposite to the +Y direction. Hereinafter, in the case where the +Y direction and the -Y direction are not distinguished, it is simply referred to as the "Y direction". The +Z direction and the -Z direction are directions intersecting (for example, orthogonal to) the X direction and the Y direction. The +Z direction is a direction from the metal plate 110 described later toward a main body portion MU (refer to FIG. 1). The -Z direction is a direction opposite to the +Z direction. Hereinafter, in the case where the +Z direction and the -Z direction are not distinguished, it is simply referred to as the "Z direction". The Z direction is an example of a "first direction". The Y direction is an example of a "second direction". The X direction is an example of a "third direction". Figure 2 Figure 2 Figure 2

[0036] Hereinafter, in the case where the X direction and the Y direction are not distinguished, it is sometimes referred to as the "horizontal direction". Hereinafter, the Z direction is sometimes referred to as the "vertical direction". In addition, hereinafter, the +Z direction side is sometimes referred to as "up", and the -Z direction side is sometimes referred to as "down". However, these expressions are expressions for convenience of explanation, and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0037] (Embodiment)

[0038] <1. Structure of Electrical Connection Unit>

[0039] ​​​Figure 1 is a cross-sectional view showing an electrical connection unit 1 of an embodiment. The electrical connection unit 1 is, for example, an in-vehicle device mounted on a vehicle such as an EV (Electric Vehicle), an HEV (Hybrid Electric Vehicle), or a PHEV (Plug-in Hybrid Electric Vehicle). The electrical connection unit 1 can also be referred to as an "electrical connection box" or a "junction box", for example. However, the electrical connection unit 1 is not limited to a box-shaped device.

[0040] The electrical connection unit 1 has, for example, a frame 5, a main body portion MU, a metal plate 110, a plurality of heat conductive members 120 (see Figure 2 ), and a plurality of insulating covers 130 (see Figure 2 ).

[0041] <2. Frame>

[0042] First, the frame 5 will be described. The frame 5 forms the outer shape of the electrical connection unit 1. The frame 5 includes, for example, a base 6 (first member) and a cover 7 (second member). The base 6 is a member that covers the main body portion MU and the metal plate 110 from below. The base 6 is, for example, a plate shape in the horizontal direction or a bowl shape that is open in the +Z direction. The base 6 is, for example, made of synthetic resin. The cover 7 is a member that covers the main body portion MU and the metal plate 110 from above. The cover 7 is, for example, a bowl shape that is open in the -Z direction. The cover 7 is, for example, made of synthetic resin. In the present embodiment, the frame 5 is formed in a box shape by combining the base 6 and the cover 7. In addition, the shape of the frame 5 is not limited to the above example. For example, the metal plate 110 described later can also function as part or all of the base 6. In addition, the frame 5 can be omitted.

[0043] In the present embodiment, the electrical connection unit 1 includes a first region (first space) R1 and a second region (second space) R2. The first region R1 is a region that places importance on heat dissipation. In the first region R1, for example, an electronic component 10S that generates a large amount of heat is disposed. On the other hand, the second region R2 is a region that places importance on mountability. In the second region R2, for example, an electronic component 10T that generates a smaller amount of heat than the electronic component 10S and / or requires a more complex mounting structure than the electronic component 10S is disposed. However, these contents do not limit the contents of the electrical connection unit 1 of the present disclosure. For example, the electronic component 10T can also generate a larger amount of heat than the electronic component 10S.

[0044] <3. Main body portion>

[0045] Next, the main body portion MU will be described.

[0046] Figure 2is a perspective view for illustrating the main body portion MU. The main body portion MU is a portion that bears a main function (for example, switching of an electrical connection state or overcurrent protection) of the electrical connection unit 1. In the present embodiment, the main body portion MU is divided into a plurality of sub-units SU. The main body portion MU is formed, for example, by connecting a plurality of sub-units SU. In the present embodiment, the main body portion MU has two sub-units SU (sub-units SUS, SUT). Each sub-unit SU can also be referred to as a "circuit structure".

[0047] The sub-unit SUS has a first function in terms of electricity. The sub-unit SUS includes, for example, a plurality of electronic components 10S and a wiring substrate 40S. The plurality of electronic components 10S are electrically connected to the wiring substrate 40S. A base substrate 41S (described later) included in the sub-unit SUS is an example of a "first base member".

[0048] The sub-unit SUT has a second function in terms of electricity. The second function is, for example, a function different from the first function. The sub-unit SUT includes, for example, a plurality of electronic components 10T and a wiring structure 40T. The plurality of electronic components 10T are electrically connected to the wiring structure 40T. A base member 41T (described later) included in the sub-unit SUT is an example of a "second base member".

[0049] In the present embodiment, the sub-unit SUS is a sub-unit SU that places importance on heat dissipation. The sub-unit SUS is disposed in the first region R1 of the electrical connection unit 1 described above. The sub-unit SUS faces the first region A1 of the metal plate 110 described later in the Z direction.

[0050] On the other hand, the sub-unit SUT is a sub-unit SU that places importance on mountability. The sub-unit SUT is disposed, for example, on the +Y direction side with respect to the sub-unit SUS. The sub-unit SUT is disposed in the second region R2 of the electrical connection unit 1 described above. The sub-unit SUT faces the second region A2 of the metal plate 110 described later in the Z direction. Hereinafter, the electronic components 10S and the electronic components 10T are simply referred to as "electronic components 10" without distinction.

[0051] Further, instead of the example described above, the main body portion MU can not be divided into a plurality of sub-units SU. For example, a plurality of sub-units SU can be integrally formed. For example, the base substrate 41S of the wiring substrate 40S and the base member 41T of the wiring structure 40T described later can be integrally formed from one piece of member.

[0052] <4. Configuration of sub-unit SUS>

[0053] Next, the structure of the sub-unit SUS will be described.

[0054] Figure 3is a perspective view for explaining the subunit SUS. The subunit SUS includes, for example, a plurality of electronic components 10, a plurality of connection components 20, and a wiring substrate 40S. The connection component 20 is a component that forms a power supply path in the vertical direction. The connection component 20 can also be referred to as a "vertical wiring component".

[0055] <4.1 Electronic Component>

[0056] First, the electronic component 10 will be described. The electronic component 10 is an electronic component mounted according to a function required for each subunit SU. The electronic component 10 is, for example, also a connector, a fuse, a relay (for example, a mechanical relay or a semiconductor relay), a capacitor, a branch component, various sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of them are unified. However, the type of the electronic component 10 is not limited to the above examples. The electronic component 10 is, for example, a heat generating component that generates heat when power is supplied.

[0057] In the present embodiment, the plurality of electronic components 10 includes an electronic component 10S that generates a large amount of heat when power is supplied. The electronic component 10S is a relay (for example, a mechanical relay or a semiconductor relay), a fuse, or a current sensor (for example, a current sensor having a shunt resistor), or the like. However, the type of the electronic component 10S is not limited to the above examples.

[0058] Figure 4 is a perspective view showing the electronic component 10S and the connection component 20. The electronic component 10S is, for example, an electronic component in which a plurality of terminals 13 are arranged at one end portion of the electronic component 10S. The electronic component 10S has, for example, a housing 11, a component main body portion 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0059] (Housing)

[0060] The housing 11 is an outer member that forms a large part of the outer shape of the electronic component 10S. The housing 11 is, for example, made of synthetic resin and has insulating properties. The housing 11 accommodates the component main body portion 12. In addition, the housing 11 and the component main body portion 12 can be integrally formed.

[0061] In the present embodiment, the housing 11 has an insulating rib 11a that protrudes in the horizontal direction (e.g., the Y direction) and extends in the Z direction. The insulating rib 11a is, for example, plate-shaped in the horizontal direction (e.g., the Y direction) and the Z direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B described later). The insulating rib 11a electrically insulates between the terminal 13A and the terminal 13B. In addition, in the present embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of the two connection members 20 connected to the electronic component 10S. The insulating rib 11a electrically insulates between the first portions 21 of the two connection members 20 connected to the electronic component 10S.

[0062] (component main body portion)

[0063] The component main body portion 12 is a portion that bears the main function of the electronic component 10S. For example, in the case where the electronic component 10S is a relay, the component main body portion 12 includes a switching portion (e.g., a contact portion) that switches between an on state and an off state. For example, in the case where the electronic component 10S is a fuse, the component main body portion 12 includes a fuse portion that melts in the case where an overcurrent flows. For example, in the case where the electronic component 10S is a capacitor, the component main body portion 12 includes a portion that accumulates electric charge.

[0064] (terminal)

[0065] The terminal 13 is an electrical connection portion that is exposed to the outside of the housing 11. The terminal 13 is electrically connected to the component main body portion 12 inside the housing 11. In the present embodiment, the electronic component 10S includes a terminal 13A and a terminal 13B as a plurality of terminals 13. One of the terminal 13A and the terminal 13B is a positive electrode side terminal. The other of the terminal 13A and the terminal 13B is a negative electrode side terminal. One of the terminal 13A and the terminal 13B is an example of a "first terminal". The other of the terminal 13A and the terminal 13B is an example of a "second terminal".

[0066] In the present embodiment, the terminal 13A and the terminal 13B are provided at one end portion of the electronic component 10S in the horizontal direction (e.g., the Y direction). The terminal 13A and the terminal 13B are disposed side by side in the horizontal direction (e.g., the X direction). The terminal 13A and the terminal 13B each face the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h in which a fastening member 71 (e.g., a screw or a bolt) described later is installed. The mounting hole 13h is open in the horizontal direction (e.g., the Y direction). An inner peripheral surface of the mounting hole 13h of the electronic component 10S has a screw groove.

[0067] (mounting portion)

[0068] Mounting section 14 is a part used to fix electronic component 10S. Mounting section 14 has fastening components 116 (e.g., screws or bolts, see below) for fastening later. Figure 9 The mounting hole 14h is for installation. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through hole through which the fastening member 116 passes. The object to be fastened to the mounting part 14 will be described later.

[0069] <4.2 Connecting Components>

[0070] Next, the connecting member 20 will be described. The connecting member 20 is a member that electrically connects the electronic component 10S to the wiring substrate 40S. The connecting member 20 forms part of the power path in the sub-unit SUS. The connecting member 20 is made of metal (e.g., copper, copper alloy, aluminum, or aluminum alloy). The connecting member 20 may also be referred to as a "metal component".

[0071] In this embodiment, the connecting member 20 connects the electronic component 10S to the busbar 42 (see reference) included in the wiring substrate 40S. Figure 3 Electrical connection. In this embodiment, the length L12 of the connecting member 20 in the long side direction (e.g., the Y direction) of the electronic component 10S is smaller than the length L11 in the long side direction of the electronic component 10S. The connecting member 20 has, for example, a first portion 21 and a second portion 22.

[0072] (Part 1)

[0073] The first portion 21 of the connecting member 20 is the portion that connects to the terminal 13 of the electronic component 10S. The first portion 21 is a plate-shaped or cuboid portion extending along the Z direction. The first portion 21 extends along one end of the electronic component 10S (e.g., the end in the Y direction). The first portion 21 is an erected portion in the Z direction relative to the wiring substrate 40S (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10S in the horizontal direction (e.g., the Y direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10S in the horizontal direction (e.g., the Y direction) and connected to the terminal 13 of the electronic component 10S from the horizontal direction (e.g., the Y direction).

[0074] The first portion 21 of the connecting member 20 has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) passes. The first mounting hole 21h is open in a horizontal direction (e.g., the Y direction). The first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10S by engaging the fastening member 71 passing through the first mounting hole 21h with the mounting hole 13h of the terminal 13 of the electronic component 10S.

[0075] (Part Two)

[0076] The second portion 22 of the connection member 20 is a portion connected to the bus bar 42 (refer to Figure 3 ). The second portion 22 protrudes from the end portion of the first portion 21 on the -Z direction side in the horizontal direction (for example, the Y direction). The second portion 22 is a plate portion along the horizontal direction. The second portion 22 is adjacent to the bus bar 42 in the Z direction, and is connected to the bus bar 42 in the Z direction. The second portion 22 of the connection member 20 is mounted from the Z direction to a fastening member 43 (for example, a screw or a bolt, refer to Figure 8 ) protruding in the +Z direction from the bus bar 42, and is physically and electrically connected to the bus bar 42. In the present embodiment, the second portion 22 of the connection member 20 has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The fastening member 43 passes through the second mounting hole 22h of the second portion 22. Also, the second portion 22 is fixed to the bus bar 42 by engaging a member 44 (for example, a nut, refer to Figure 3 ) with the end portion of the fastening member 43 that passes through the second mounting hole 22h. In the present embodiment, the connection member 20 formed in an L shape by the first portion 21 and the second portion 22.

[0077] In the present embodiment, the bus bar 42 is disposed at a position (for example, a position apart in the Z direction) apart from the terminal 13 of the electronic component 10S. The connection member 20 is disposed between the electronic component 10S and the bus bar 42. In the present disclosure, "the connection member is disposed between the electronic component and the bus bar" is not limited to the case where a portion of the connection member is positioned between the electronic component and the bus bar when viewed in the X direction or the Y direction. "The connection member is disposed between the electronic component and the bus bar" can also correspond to the case where a portion of the connection member is positioned between the electronic component and the bus bar when viewed in a direction inclined with respect to the X direction or the Y direction. The connection member 20 electrically connects the terminal 13 of the electronic component 10S and the bus bar 42.

[0078] <4.3 Wiring Substrate>

[0079] Next, the wiring substrate 40S will be described.

[0080] Figure 5is a perspective view for explaining the wiring substrate 40S. The wiring substrate 40S is a component that forms at least a part of an electrical path between a plurality of electronic components 10 (for example, a plurality of electronic components 10S) and / or at least a part of an electrical path between an electronic component 10 (for example, an electronic component 10S) included in a subunit SUS and an electronic component 10 included in another subunit SU (for example, a subunit SUT). In the present disclosure, the "wiring substrate" refers to a wiring structure of a substrate type. The "substrate type" refers to a board shape in which the entirety is observed regardless of a fine shape. Note that, in the present disclosure, the "board shape", "sheet shape", or "plane" is not limited to a case where it is completely flat, and can include a case where a fixed structure, a rib, or the like that locally protrudes in the Z direction is present, a case where a concave-convex shape that follows the thickness of a bus bar is present on a surface, or the like. In the present embodiment, the wiring substrate 40S is a board shape along the X direction and the Y direction.

[0081] The wiring substrate 40S includes, for example, a base plate 41S, one or more (for example, a plurality of) bus bars 42, and a plurality of fastening components 43. In the present embodiment, the base plate 41S and the plurality of bus bars 42 are integrated by insert molding. For example, after the fastening components 43 are fixed to the bus bars 42, the bus bars 42 are insert molded with the base plate 41S, and thus the wiring substrate 40S is formed as a one-piece component. That is, the bus bars 42 are integrated with the base plate 41S without using fastening components such as screws or bolts. Furthermore, the wiring substrate 40S can be formed by another structure instead of insert molding. A modification example in which the wiring substrate 40S is formed by another structure will be described later.

[0082] Figure 6 is a perspective view that partially disassembles the wiring substrate 40S. Hereinafter, for convenience of explanation, the base plate 41S, the bus bar 42, and the fastening component 43 will be described with reference to a view that partially disassembles the wiring substrate 40S.

[0083] <4.3.1 Base Plate>

[0084] The base plate 41S is a support component that integrally supports a plurality of bus bars 42 arranged in the horizontal direction at intervals from each other. The base plate 41S is made of, for example, synthetic resin, and has insulating properties. The base plate 41S electrically insulates between the plurality of bus bars 42. The base plate 41S is an example of a "base component". The base plate 41S can also be referred to as an "insulating base material". The base plate 41S has, for example, a planar portion 51, a frame portion 52, and a plurality of fixing portions 53 (see FIG. 5). Figure 9

[0085] (planar portion)

[0086] ​The flat portion 51 is a portion formed in the base plate 41S in a plate shape. The flat portion 51 is in a plate shape along the horizontal direction. The flat portion 51 forms a main portion of the base plate 41S. The flat portion 51 forms a base portion (insulating base portion) of the base plate 41S. In the present embodiment, the flat portion 51 extends over the entire width in the X direction of the base plate 41S, and over the entire width in the Y direction of the base plate 41S, except for the frame portion 52 of the base plate 41S.

[0087] The flat portion 51 has a first surface 51a and a second surface 51b (see Figure 9 ). The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 (for example, the plurality of electronic components 10S). The second surface 51b is located on the side opposite the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 110 (see Figure 2 ). The thickness direction (plate thickness direction) of the flat portion 51 is the Z direction. In the present embodiment, the thickness T11 in the Z direction of the flat portion 51 is smaller than the thickness T1 in the Z direction of the bus bars 42 (for example, the thickness in the Z direction of the horizontal plate portion 42p described later) (see Figure 8 ). Note that the thickness T11 in the Z direction of the flat portion 51 can be the same as the thickness T1 in the Z direction of the bus bars 42, or can be larger than the thickness T1 in the Z direction of the bus bars 42.

[0088] The flat portion 51 has one or more (for example, a plurality of) housing portions 55 that house the bus bars 42, for example. The plurality of housing portions 55 are formed separately from each other in the X direction or the Y direction. Each housing portion 55 is a through-hole that penetrates the flat portion 51 in the Z direction, for example. Note that the housing portion 55 can be a recess provided to the first surface 51a or the second surface 51b of the flat portion 51 and recessed in the Z direction instead of a through-hole. Note that in the present disclosure, “the housing portion penetrates the flat portion in the first direction (Z direction)” can include a case where a part of the entire length of the housing portion 55 penetrates the flat portion 51 in the Z direction (for example, the remaining part of the housing portion 55 can be a recess recessed in the Z direction, or can be a form in which it is provided inside the base plate 41S without being exposed to the outside of the base plate 41S). Similarly, in the present disclosure, “the housing portion is recessed in the first direction (Z direction)” can include a case where a part of the entire length of the housing portion 55 is recessed in the Z direction (for example, the remaining part of the housing portion 55 can be a through-hole that penetrates the flat portion 51 in the Z direction, or can be a form in which it is provided inside the base plate 41S without being exposed to the outside of the base plate 41S).

[0089] Viewed from the Z-direction, each receiving section 55 has a shape corresponding to the shape of the received busbar 42. The plurality of receiving sections 55 includes, for example, four receiving sections 55A, 55B, 55C, and 55D. Receiving section 55A is provided corresponding to busbar 42A (described later) and receives at least a portion of busbar 42A. Receiving section 55B is provided corresponding to busbar 42B (described later) and receives at least a portion of busbar 42B. Receiving section 55C is provided corresponding to busbar 42C (described later) and receives at least a portion of busbar 42C. Receiving section 55D is provided corresponding to busbar 42D (described later) and receives at least a portion of busbar 42D.

[0090] (Frame)

[0091] The frame portion 52 is provided at the peripheral end of the base plate 41S. The frame portion 52 is a reinforcing rib that protrudes upward and downward from the end of the flat portion 51 (see reference). Figure 8 The width (thickness) H11 in the Z direction of the frame 52 is, for example, less than half the width (thickness) H12 in the Z direction of the electronic component 10 (see reference). Figure 8 Alternatively, the frame 52 can be omitted.

[0092] (Fixed part)

[0093] The fixing part 53 is the part that is fixed to the metal plate 110 (see reference). Figure 9 The fixing part 53 has a mounting hole 53h that penetrates the base plate 41S in the Z direction. The fastening member 115 (e.g., a screw or bolt), described later, passes through the mounting hole 53h. This will be explained later.

[0094] <4.3.2 Busbar>

[0095] Busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40S. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components (e.g., multiple electronic components 10S). Alternatively, busbar 42 can also be a wiring component for electrically connecting electronic components 10 (e.g., electronic components 10S) to electronic components 10 included in other sub-units SU (e.g., sub-units SUT). Busbar 42 is made of metal (e.g., copper, copper alloy, aluminum, or aluminum alloy) and is conductive. In this embodiment, multiple busbars 42 are included, for example, four busbars 42A, 42B, 42C, and 42D. The four busbars 42A, 42B, 42C, and 42D are arranged horizontally with a gap between them. The four busbars 42A, 42B, 42C, and 42D include portions arranged on the same plane. The four busbars 42A, 42B, 42C, and 42D are supported by the flat portion 51 of the base plate 41S. It should be noted that in this disclosure, "the busbars are supported by the flat portion" is not limited to the case where the busbars 42 are housed in the housing portion 55, but may also include cases where the busbars 42 are mounted on the first surface 51a or the second surface 51b of the flat portion 51.

[0096] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is housed in a housing portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing portion 55. Hereinafter, the portion of each busbar 42 that extends horizontally in a plate-like shape is sometimes referred to as a "horizontal plate portion 42p". The horizontal plate portion 42p is an example of a "plate portion". The busbar 42 is a component that forms a horizontal power path. The busbar 42 can also be referred to as a "horizontal wiring component".

[0097] The plate portion (e.g., horizontal plate portion 42p) of the busbar 42 has a first surface 42a1 and a second surface 42a2 (see reference). Figure 8-9 The first surface 42a1 is an upward (+Z direction) surface in the thickness direction. The first surface 42a1 is a plane along the horizontal direction. The first surface 42a1 faces multiple electronic components 10 (e.g., multiple electronic components 10S) and / or connecting components 20. When the first surface 42a1 faces multiple electronic components 10 (e.g., multiple electronic components 10S) and connecting components 20, the second surface 42a2 is located on the opposite side of the first surface 42a1, facing the heat-conducting component 120 (see reference). Figure 8For example, in the present disclosure, the first face 42a1 faces the plurality of electronic components 10 (for example, the plurality of electronic components 10S) and the connecting component 20. The second face 42a2 is a face that faces downward in the plate thickness direction (-Z direction). The second face 42a2 is a plane along the horizontal direction. The second face 42a2 faces the metal plate 110 (refer to Figure 2 ) Further, the thickness direction (plate thickness direction) of the horizontal plate portion 42p is the Z direction, which coincides with the first direction.

[0098] Figure 7 is a plan view that shows the sub-unit SUS. Each bus bar 42 has, for example, a connecting portion 61, a connecting portion 62, and an extension portion 63.

[0099] The connecting portion 61 is located at the middle of the bus bar 42 or the first end portion of the bus bar 42. The connecting portion 61 is a portion that is connected to the electronic component 10 (for example, the electronic component 10S) directly or via the connecting component 20. The connecting portion 61 includes, for example, a portion that overlaps the connecting component 20 when viewed in the Z direction. The connecting portion 61 is adjacent to the connecting component 20 in the Z direction and is connected to the connecting component 20 from the Z direction. Instead of the above example, the connecting portion 61 can also be adjacent to the terminal 13 of the electronic component 10 in the Z direction and be connected to the terminal 13 of the electronic component 10 directly from the Z direction, for example.

[0100] The connecting portion 62 is located at the middle of the bus bar 42 or the second end portion of the bus bar 42. The connecting portion 62 is a portion that is connected to another electronic component 10 directly or via another connecting component 20. Instead of the above example, the connecting portion 62 can be connected to another bus bar 42 (for example, a bus bar 42 included in another sub-unit SU) or a bus bar 76 for external connection (refer to Figure 15 ).

[0101] The extension portion 63 extends from the connecting portion 61 in the X direction or the Y direction. The extension portion 63 is provided between the connecting portion 61 and the connecting portion 62. The extension portion 63 extends in a manner that covers the connecting portion 61 and the connecting portion 62. The extension portion 63 connects the connecting portion 61 and the connecting portion 62.

[0102] In the present embodiment, the above-described horizontal plate portion 42p includes at least all of the connecting portion 61 and a part of the extension portion 63. That is, at least all of the connecting portion 61 and a part of the extension portion 63 are housed in the housing portion 55 and are located on the same plane.

[0103] In the present embodiment, the extension portions 63 of the several bus bars 42 are housed in the housing portions 55, thereby extending through the region R overlapping the electronic component 10 when viewed in the Z direction and across both sides of the region R. For example, the extension portions 63 extend across the -Y direction side and the +Y direction side of the region R overlapping the electronic component 10 when viewed in the Z direction. That is, the bus bars 42 are housed in the housing portions 55, thereby not being hindered by the presence of the electronic component 10 and being easily routed in a better path (e.g., a path with a shorter distance).

[0104] In addition, one or more bus bars 42 can have an extension portion 64 in addition to the connection portion 61, the connection portion 62, and the extension portion 63. The extension portion 64 is a portion in which the bus bar 42 is extended for the purpose of expanding the heat dissipation area and / or expanding the heat capacity for heat storage (heat absorption). The extension portion 64 is a portion that is not used for electrical connection. For example, the extension portion 64 is located on the side opposite the extension portion 63 with respect to the connection portion 61 (or the connection portion 62). The extension portion 64 is in a plate shape along the horizontal direction. The extension portion 64 is included in the horizontal plate portion 42p. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R overlapping the electronic component 10 when viewed in the Z direction, and has an end portion 42e1 of the bus bar 42 at a position overlapping the electronic component 10 when viewed in the Z direction.

[0105] (Heat dissipation structure of bus bar)

[0106] Here, the heat dissipation structure of the bus bar 42 is described in more detail. Furthermore, the bus bar 42 included in the sub unit SUS is described as an example, but the same bus bar can be included in the other sub unit SUT.

[0107] The surface of the horizontal plate portion 42p has a heat dissipation structure 42HDS including at least one of a plurality of recesses and a plurality of protrusions. For example, the heat dissipation structure 42HDS in the present disclosure includes a plurality of recesses. Here, when the heat dissipation structure 42HDS includes a plurality of recesses, the bus bar 42 can effectively utilize the wall retreat portion generated when the recesses are provided. The heat dissipation structure 42HDS includes a plurality of grooves each extending in a straight line as the plurality of recesses. The grooves in the present disclosure extend in a straight line along the horizontal direction (e.g., the X direction) intersecting the plate thickness direction. The heat dissipation structure 42HDS includes a first heat dissipation structure 42HDS1 and a second heat dissipation structure 42HDS2. The first heat dissipation structure 42HDS1 is provided to the first face 42a1. The second heat dissipation structure 42HDS2 is provided to the second face 42a2.

[0108] For example, in the present disclosure, the first heat dissipation structure 42HDS1 includes a plurality of recesses, and the second heat dissipation structure 42HDS2 includes a plurality of recesses.

[0109] Further, in the extension portion 64, the heat dissipation structure 42HDS (first heat dissipation structure 42HDS1, second heat dissipation structure 42HDS2) including at least one of the plurality of recesses and the plurality of protrusions can be provided.

[0110] The heat dissipation structure 42HDS is provided to the surface of the horizontal plate portion 42p by plastically deforming a part of the horizontal plate portion 42p in the plate thickness direction by press working or the like. When the first heat dissipation structure 42HDS1 is provided to the first face 42a1, a part of the horizontal plate portion 42p is plastically deformed toward the -Z direction by press working or the like. By the plastic deformation, the plurality of recesses described above are formed in the first face 42a1. When the second heat dissipation structure 42HDS2 is provided to the second face 42a2, a part of the horizontal plate portion 42p is plastically deformed toward the +Z direction by press working or the like. By the plastic deformation, the plurality of recesses described above are formed in the second face 42a2.

[0111] When the plurality of recesses described above are formed in the surface of the horizontal plate portion 42p, a force in which the base material in the bus bar 42 moves in the plate thickness direction is generated by press working or the like. If it is press working, since a die (or also called "lower die") opposing the press die exists, the base material is difficult to move in the plate thickness direction in a part of the bus bar 42 abutting against the die. Therefore, when the plurality of recesses are formed in the surface of the horizontal plate portion 42p, a wall retreat portion of the base material is caused in a direction intersecting the plate thickness direction.

[0112] The horizontal plate portion 42p has a first region 42R1 and a second region 42R2. The first region 42R1 is a region in which the plurality of recesses are provided. For example, the heat dissipation structure 42HDS (first heat dissipation structure 42HDS1, second heat dissipation structure 42HDS2) is located in the first region 42R1 in the present disclosure. The second region 42R2 is a region adjacent to the first region 42R1 in either of the second direction described above or the third direction described above and in which the plurality of recesses described above are not provided.

[0113] Further, the first region 42R1 is a region in which the plurality of recesses are provided and is a region including the wall retreat portion described above. Here, in a case where the extension direction of the extension portion 63 coincides with the second direction and a direction intersecting the first direction and the second direction is the third direction, the following relationship is established between the first region 42R1 and the second region 42R2. In the other of the second direction described above and the third direction described above, the width of the first region 42R1 is greater than the width of the second region 42R2. For example, in the first region 42R1 in the present disclosure, in the X direction, the width of the first region 42R1 is greater than the width of the second region 42R2.

[0114] In addition, the heat dissipation structure 42HDS (first heat dissipation structure 42HDS1, second heat dissipation structure 42HDS2) in the present disclosure is provided in the first surface 42a1 and the second surface 42a2, respectively. The first heat dissipation structure 42HDS1 can or can not overlap the electronic component 10 when viewed from the plate thickness direction. The second heat dissipation structure 42HDS2 is in contact with the thermally conductive member 120.

[0115] The first heat dissipation structure 42HDS1 is, for example, in a portion of the horizontal plate portion 42p that overlaps the electronic component 10 when viewed from the plate thickness direction (refer to Figure 7 ). The second heat dissipation structure 42HDS2 is, for example, in contact with the connection member 20 and the thermally conductive member 120 when viewed from the plate thickness direction (refer to Figure 7 and Figure 8 ).

[0116] Hereinafter, several arrangement examples of the bus bar 42 will be described. In addition, the plurality of electronic components 10S includes three electronic components 10A, 10B, 10C. The plurality of connection members 20 includes five connection members 20A, 20B, 20C, 20D, 20E.

[0117] The bus bar 42A has a connection portion 61, a connection portion 62, and an extension portion 63. The connection portion 61 is connected to the terminal 13A of the electronic component 10A via the connection member 20A. The connection portion 62 is disposed at the end portion on the +Y direction side of the sub unit SUS, and is connected to the bus bar 42 included in the other sub unit SU. The extension portion 63 extends across both sides of the region R in which the electronic component 10A is overlapped when viewed from the Z direction, by being housed in the housing portion 55.

[0118] The first heat dissipation structure 42HDS1 is, for example, in the extension portion 63 in the bus bar 42A (refer to Figure 7 ). The second heat dissipation structure 42HDS2 is, for example, in the first connection portion 61 in the bus bar 42A (refer to Figure 7 and Figure 8 ).

[0119] The bus bar 42B has a connection portion 61, a connection portion 62, an extension portion 63, and an extension portion 64. The connection portion 61 is connected to the terminal 13B of the electronic component 10A via the connection member 20B. The connection portion 62 is connected to the terminal 13A of the electronic component 10B via the connection member 20C. The extension portion 64 extends to the region R in which the electronic component 10B is overlapped when viewed from the Z direction, and has an end portion 42e1 of the bus bar 42 at a position in which the electronic component 10B is overlapped.

[0120] For example, in the bus bar 42B, the first heat dissipation structure 42HDS1 is located at the extension 63 and the extension 64. In the bus bar 42B, the second heat dissipation structure 42HDS2 is located at the first connection 61 and the second connection 62.

[0121] The bus bar 42C has the connection 61, the second connection 62, and the extension 63. The connection 61 is connected with the terminal 13B of the electronic component 10B via the connection member 20D. The connection 62 is arranged at the end portion on the +Y direction side of the sub unit SUS, and is connected with the bus bar 42 included in the other sub unit SU.

[0122] For example, in the bus bar 42C, the first heat dissipation structure 42HDS1 is located at the extension 64. In the bus bar 42C, the second heat dissipation structure 42HDS2 is located at the first connection 61 and the second connection 62.

[0123] The bus bar 42D has the connection 61, the connection 62, and the extension 63. The connection 61 is connected with the terminal 13A of the electronic component 10C via the connection member 20E. The connection 62 is arranged at the end portion on the +Y direction side of the sub unit SUS, and is connected with the bus bar 42 included in the other sub unit SU.

[0124] For example, in the bus bar 42D, the first heat dissipation structure 42HDS1 is located at the extension 63. In the bus bar 42D, the second heat dissipation structure 42HDS2 is located at the first connection 61 and the second connection 62.

[0125] In addition, in the above-described arrangement example, the following relationship is established between the first region 42R1 and the second region 42R2 in each bus bar 42. In the third direction (for example, the X direction), the width of the first region 42R1 in which the heat dissipation structure 42HDS (the first heat dissipation structure 42HDS1, the second heat dissipation structure 42HDS2) is located is larger than the width of the second region 42R2.

[0126] (Exposure structure of the upper surface side of each bus bar)

[0127] In the present embodiment, at least a part of the bus bar 42 is exposed on the upper surface side of the base plate 41S. For example, the connection 61, the connection 62, and the extension 63 of the bus bar 42 are exposed to the outside of the base plate 41S on the upper surface side (the first face 51a side of the planar portion 51) of the base plate 41S. For example, the extension 63 of the bus bar 42 is exposed to the outside of the base plate 41S on the upper surface side of the base plate 41S at least over the entire length between the connection 61 and the connection 62.

[0128] (Exposure structure of the lower surface side of each bus bar)

[0129] In the present embodiment, at least a portion of the bus bar 42 is exposed on the lower surface side of the base plate 41S. For example, the entire connection portion 61 and at least a portion of the extension portion 63 are exposed on the lower surface side (the second face 51b side of the planar portion 51) of the base plate 41S to the outside of the base plate 41S. In the present embodiment, a gap S1 (refer to Figure 8 ) is formed between the planar portion 51 of the base plate 41S and the metal plate 110. The bus bar 42 includes an exposed portion 42u (refer to Figure 8 ) exposed on the gap S1. The exposed portion 42u includes, for example, the entire connection portion 61 and at least a portion of the extension portion 63.

[0130] <4.3.3 Fastening member>

[0131] Next, the fastening member 43 will be described.

[0132] Figure 8 is a cross-sectional view along the F8-F8 line of the structure shown in Figure 7 . The fastening member 43 is a member for fixing the bus bar 42 and the connection member 20 corresponding to the bus bar 42. The fastening member 43 is, for example, a rivet bolt fixed to the bus bar 42. The fastening member 43 is an example of a "fastening portion".

[0133] In the present embodiment, at least one of the connection portion 61 and the connection portion 62 of the bus bar 42 has a through-hole 42h. The through-hole 42h penetrates the bus bar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head portion 43b. The peripheral surface of the shaft portion 43a has a screw groove. The diameter of the head portion 43b is larger than the diameter of the shaft portion 43a. The fastening member 43 is fixed to the bus bar 42 with the head portion 43b in a state where the shaft portion 43a passes through the through-hole 42h of the bus bar 42. By this fixing, the fastening member 43 is electrically and physically connected to the bus bar 42 in a state where the shaft portion 43a protrudes from the through-hole 42h of the bus bar 42 in the +Z direction. In addition, the fastening member 43 is not limited to rivet fixing, but can be fixed to the bus bar 42 by welding or other methods.

[0134] In the present embodiment, the connection member 20 is mounted to the fastening member 43 in a state where it is first fixed to the electronic member 10 by the fastening member 71. For example, the connection member 20 causes the shaft portion 43a of the fastening member 43 to be inserted into the second mounting hole 22h of the second portion 22. Then, the engagement member 44 (for example, a nut) is caused to engage with the shaft portion 43a of the fastening member 43 protruding from the second mounting hole 22h of the second portion 22 of the connection member 20. The engagement member 44 is mounted to the shaft portion 43a along the Z direction. By this engagement, the second portion 22 of the connection member 20 is fixed to the fastening member 43.

[0135] (Thermally conductive member)

[0136] Here, the heat-conducting component 120 will be described first.

[0137] The thermally conductive component 120 is a component used to transfer heat generated by the electronic component 10 (e.g., electronic component 10S) when energized and / or the heat (Joule heat) generated by the busbar 42 itself when energized to the metal plate 110. The thermally conductive component 120 is, for example, a resilient thermally conductive sheet (e.g., a thermally conductive silicone sheet). The thermally conductive component 120 is, for example, formed of a material with a higher thermal conductivity than the substrate plate 41S (or the substrate component 41T described later). However, the thermally conductive component 120 is not limited to the above examples and may also be a thermally conductive component formed of thermally conductive gel or other materials. In this embodiment, the thermally conductive component 120 is insulating.

[0138] In this embodiment, the heat-conducting component 120 is partially disposed in the wiring substrate 40S (see reference). Figure 2 For example, the heat-conducting component 120 is positioned to overlap a portion of the busbar 42 when viewed from the Z-direction. The heat-conducting component 120 is disposed between the busbar 42 and the planar portion 111 of the metal plate 110 (described later). For example, the heat-conducting component 120 is disposed between the exposed portion 42u of the busbar 42 and the planar portion 111 of the metal plate 110, and contacts both the exposed portion 42u of the busbar 42 and the planar portion 111 of the metal plate 110. The heat-conducting component 120 transfers heat from the electronic component 10 (e.g., electronic component 10S) to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the planar portion 111 of the metal plate 110.

[0139] In this embodiment, the heat-conducting component 120, when viewed from the Z direction, is positioned near the electronic component 10 (e.g., electronic component 10S) at a location overlapping a portion of the busbar 42. In this embodiment, the heat-conducting component 120, when viewed from the Z direction, is positioned at a location overlapping the connecting component 20. In other words, the heat-conducting component 120, when viewed from the Z direction, is positioned at a location overlapping the connecting portion 61 or connecting portion 62 of the busbar 42. The heat-conducting component 120 transfers heat moving from the electronic component 10S to the busbar 42 via the connecting component 20 from the busbar 42 to the planar portion 111 of the metal plate 110. As described above, the second heat dissipation structure 42HDS2 in the horizontal plate portion 42p of the busbar 42 overlaps with the connecting component 20 and the heat-conducting component 120 when viewed from the Z direction. At this time, the heat-conducting component 120 is in contact with the second heat dissipation structure HDS2.

[0140] <4.4 Wiring substrate and electronic component mounting structure>

[0141] Next, the fixing structure of the wiring substrate 40S and the electronic component 10 will be described.

[0142] Figure 9 is a sectional view along the F9-F9 line of the structure shown in FIG. 9. The metal plate 110 has, for example, in addition to the flat portion 111 described later, a fixing portion 112 and a fixing portion 113. Figure 7

[0143] The fixing portion 112 is a fixing portion for fixing the base plate 41S to the metal plate 110. The fixing portion 112 is provided at a position corresponding to the fixing portion 53 of the base plate 41S when viewed in the Z direction. The fixing portion 112 is a cylindrical or prismatic boss protruding in the +Z direction from the flat portion 111 of the metal plate 110. The fixing portion 112 has an engagement hole 112h opening in the +Z direction. The inner peripheral surface of the engagement hole 112h has a screw groove.

[0144] As described above, the fixing portion 53 of the base plate 41S has the mounting hole 53h. The fastening member 115 (for example, a screw or a bolt) passes through the mounting hole 53h. When the fastening member 115 passing through the mounting hole 53h of the fixing portion 53 of the base plate 41S engages with the engagement hole 112h of the fixing portion 112 of the metal plate 110, the base plate 41S is fixed to the metal plate 110.

[0145] The fixing portion 113 is a fixing portion for directly fixing the electronic component 10 (for example, the electronic component 10S) to the metal plate 110 without passing through the base plate 41S. The fixing portion 113 is provided at a position corresponding to the mounting portion 14 of the electronic component 10 when viewed in the Z direction. The fixing portion 113 is a cylindrical or prismatic boss protruding in the +Z direction from the flat portion 111. The fixing portion 113 has an engagement hole 113h opening in the +Z direction. The inner peripheral surface of the engagement hole 113h has a screw groove.

[0146] In the present embodiment, the flat portion 51 of the base plate 41S has a through-hole 51h. The through-hole 51h penetrates the flat portion 51 in the Z direction. The through-hole 51h is provided at a position corresponding to the fixing portion 113 of the metal plate 110 when viewed in the Z direction. The fixing portion 113 of the metal plate 110 protrudes through the through-hole 51h of the base plate 41S to the same position as the first face 51a of the flat portion 51 or a position on the +Z direction side from the first face 51a of the flat portion 51. The mounting portion 14 of the electronic component 10 contacts the fixing portion 113 at the same position as the first face 51a of the flat portion 51 or a position on the +Z direction side from the first face 51a of the flat portion 51.

[0147] ​The fastening member 116 (e.g., a screw or a bolt) passes through the mounting hole 14h of the mounting portion 14 of the electronic component 10 from the +Z direction side. When the fastening member 116 that passes through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engagement hole 113h of the fixing portion 113 of the metal plate 110, the electronic component 10 is fixed to the metal plate 110 without passing through the base plate 41S. In addition, instead of the example described above, the electronic component 10 can be fixed to the fixing portion provided in the base plate 41S.

[0148] <5. Shape example of bus bar>

[0149] Next, a shape example of the bus bar 42 will be described.

[0150] <5.1 First shape example of bus bar>

[0151] Figure 10 is a plan view for illustrating a first shape example of the bus bar 42. In the present embodiment, the bus bar 42A is an example of a "first bus bar". The connection portion 61 of the bus bar 42A is an example of a "first connection portion". The extension portion 63 of the bus bar 42A includes a first straight portion 63a extending in the Y direction from the connection portion 61 of the bus bar 42A and a second straight portion 63b bent from the first straight portion 63a and extending in the X direction. The first straight portion 63a of the bus bar 42A is an example of a "first extension portion". The connection member 20A is an example of a "first connection member".

[0152] The X-direction width W11 of the connection portion 61 of the bus bar 42A is larger than the X-direction width W12 (e.g., the X-direction width of the first straight portion 63a) of the extension portion 63 of the bus bar 42A. In the present embodiment, the connection portion 61 and the first straight portion 63a of the extension portion 63 are housed in the housing portion 55. Also, inside the housing portion 55, the X-direction width W11 of the connection portion 61 of the bus bar 42A is larger than the X-direction width W12 of the extension portion 63 of the bus bar 42A. The width W11 is, for example, the minimum X-direction width of the connection portion 61. The width W12 is, for example, the minimum X-direction width (e.g., the minimum X-direction width of the first straight portion 63a) of the extension portion 63.

[0153] By the wall retreat portion included in the heat dissipation structure HDS, the width of the connection portion 61 (or the connection portion 62) connected to the electronic component 10 is expanded, and the heat dissipation property of the connection portion 61 (or the connection portion 62) is improved. By this structure, compared to the extension portion 63, it is possible to suppress a local temperature rise in the connection portion 61 (or the connection portion 62), and it is possible to achieve an improvement in the thermal characteristics of the electrical connection unit.

[0154] In the present embodiment, the X-direction width W12 of the extension 63 of the bus bar 42A (for example, the X-direction width W12 of the first straight portion 63a) is the same as or smaller than the X-direction width W13 of the connection member 20A (refer to Figure 7 ). On the other hand, the X-direction width W11 of the connection 61 is larger than the X-direction width W13 of the connection member 20A. The width W13 is, for example, the minimum width of the connection member 20A in the X-direction.

[0155] The connection 61 has an edge 61el extending in the Y-direction and an edge 61e2 located on the side opposite to the edge 61el in the X-direction and extending in the Y-direction. The edge 61el is an example of the "first edge". The edge 61e2 is an example of the "second edge".

[0156] The extension 63 (for example, the first straight portion 63a) has an edge 63el extending in the Y-direction and an edge 63e2 located on the side opposite to the edge 63el in the X-direction and extending in the Y-direction. The edge 63el is an example of the "third edge". The edge 63e2 is an example of the "fourth edge".

[0157] In the present embodiment, the edge 61el of the connection 61 and the edge 63el of the extension 63 are continuous in the Y-direction in a straight line shape. On the other hand, there is a step 42st in the X-direction between the edge 61e2 of the connection 61 and the edge 63e2 of the extension 63.

[0158] Here, the second heat dissipation structure 42HDS2 located at the connection 61 (or the connection 62) and / or the first heat dissipation structure 41HDS1 located at the extension 63 (or the extension 64) can include a plurality of recesses or a plurality of protrusions in a manner of bridging between the edges 61e2 (or the edges of the connection 62 in the X-direction) of the connection 61 and the edges 63e2 (or the edges of the extension 64 in the X-direction) of the extension 63. In the case where the bus bar 42 has a heat dissipation structure including a plurality of recesses or a plurality of protrusions in a manner of bridging between the edges, the heat dissipation area of the portion exposed to the outside (for example, the stepped portion formed between the edges like the step 42st) is easily expanded. In the case where the above-described stepped portion is not in the position overlapping with the electronic component 10 when viewed from the plate thickness direction, the heat dissipation of the bus bar 42 is easily promoted at the above-described stepped portion.

[0159] For example, the bus bar 42B has 2 first heat dissipation structures 42HDS1 including a plurality of recesses in a manner of bridging between the edges. The bus bar 42C has 1 second heat dissipation structure 42HDS2 including a plurality of recesses in a manner of bridging between the edges.

[0160] In this embodiment, busbar 42B is an example of a "second busbar". The connecting portion 61 of busbar 42B is an example of a "second connecting portion". The extension portion 63 of busbar 42B includes a first straight portion 63a extending from the connecting portion 61 of busbar 42B in the Y direction and a second straight portion 63b bent from the first straight portion 63a and extending in the X direction. The first straight portion 63a of the extension portion 63 of busbar 42B is an example of a "second extension". The connecting member 20B is an example of a "second connecting member".

[0161] In this embodiment, the width W21 of the connecting portion 61 of the busbar 42B in the X direction is larger than the width W22 of the extension portion 63 of the busbar 42B in the X direction (e.g., the width W22 of the first straight portion 63a in the X direction). In this embodiment, the connecting portion 61 and the first straight portion 63a of the extension portion 63 are housed in the housing portion 55. Furthermore, inside the housing portion 55, the width W21 of the connecting portion 61 of the busbar 42B in the X direction is larger than the width W22 of the extension portion 63 of the busbar 42B in the X direction. The width W21 is, for example, the minimum width of the connecting portion 61 in the X direction. The width W22 is, for example, the minimum width of the extension portion 63 in the X direction (e.g., the minimum width of the first straight portion 63a in the X direction).

[0162] like Figure 10 As shown, the connecting portion 61 of busbar 42A and the connecting portion 61 of busbar 42B are adjacent in the X direction. The first straight portion 63a of the extension portion 63 of busbar 42A and the first straight portion 63a of the extension portion 63 of busbar 42B are adjacent in the X direction. Furthermore, in this embodiment, the connecting portion 61 of busbar 42A protrudes relative to the first straight portion 63a of the extension portion 63 of busbar 42A towards the side opposite to busbar 42B (-X direction side). On the other hand, the connecting portion 61 of busbar 42B protrudes relative to the first straight portion 63a of the extension portion 63 of busbar 42B towards the side opposite to busbar 42A (+X direction side).

[0163] In this embodiment, the width W11 of the connecting portion 61 of busbar 42A in the X direction is the same as the width W21 of the connecting portion 61 of busbar 42B in the X direction. On the other hand, the width W12 of the extension portion 63 of busbar 42A in the X direction is smaller than the width W22 of the extension portion 63 of busbar 42B in the X direction. Busbar 42B, for example, has greater heat dissipation or heat storage capacity compared to busbar 42A.

[0164] In the present embodiment, the thermally conductive member 120 has a size that overlaps the connection portion 61 of the bus bar 42A and the connection portion 61 of the bus bar 42B. For example, the thermally conductive member 120 overlaps the connection portion 61 of the bus bar 42A and the connection portion 61 of the bus bar 42B when viewed in the Z direction. The thermally conductive member 120 thermally connects the bus bar 42A and the bus bar 42B. Thus, in a case where the temperature of the bus bar 42B is lower than the temperature of the bus bar 42A, a part of the heat of the bus bar 42A moves to the bus bar 42B via the thermally conductive member 120. According to such a structure, by the heat equalization of the plurality of bus bars 42, further improvement of the heat dissipation performance of the electrical connection unit 1 can be achieved.

[0165] <5.2 Second Shape Example of Bus Bar>

[0166] Figure 11 is a plan view for illustrating a second shape example of the bus bar 42. In the present embodiment, the electronic component 10A is one example of a "first electronic component". The electronic component 10B is one example of a "second electronic component". The connection portion 61 of the bus bar 42B is an example of a "first connection portion". The connection portion 62 of the bus bar 42B is an example of a "second connection portion". In the present embodiment, the extension portion 63 of the bus bar 42B has, for example, a first straight portion 63a, a second straight portion 63b, and a third straight portion 63c.

[0167] The first straight portion 63a extends from the connection portion 61 in a direction different from a direction in which the connection portion 61 of the bus bar 42B faces the connection portion 62 at the shortest distance. The first straight portion 63a extends, for example, in the Y direction. The first straight portion 63a is an example of a "first extension portion".

[0168] The first straight portion 63a includes a first end portion (first part) 63aa connected to the connection portion 61 and a second end portion (second part) 63ab located on the side opposite to the first end portion 63aa. For example, the first end portion 63aa is located on the -Y direction side with respect to the connection portion 62 in the extension direction (Y direction) of the first straight portion 63a. On the other hand, the second end portion 63ab is located on the side opposite to the first end portion 63aa (+Y direction side) with respect to the connection portion 62 in the extension direction (Y direction) of the first straight portion 63a.

[0169] In the present embodiment, at least a part of the first straight portion 63a overlaps the electronic component 10A in the Z direction. For example, the first straight portion 63a extends across the -Y direction side and the +Y direction side of the region R in which the first straight portion 63a overlaps the electronic component 10A when viewed in the Z direction.

[0170] The second straight portion 63b extends from the second end portion 63ab of the first straight portion 63a in a direction approaching the connecting portion 62. However, the second straight portion 63b extends, for example, from the second end portion 63ab in a direction different from a direction in which the connecting portion 62 of the bus bar 42B is oriented at the shortest distance from the second end portion 63ab of the first straight portion 63a. The second straight portion 63b is bent, for example, from the first straight portion 63a and extends in the X direction. The second straight portion 63b is an example of a "second extension portion". In a case where viewed from the Z direction, the second straight portion 63b does not overlap any electronic component 10.

[0171] The third straight portion 63c extends from the second straight portion 63b toward the connecting portion 62 of the bus bar 42B. The third straight portion 63c extends, for example, in the Y direction. In other words, the third straight portion 63c extends in parallel with the first straight portion 63a. The third straight portion 63c is an example of a "third extension portion".

[0172] In the present embodiment, the connecting portion 61, the connecting portion 62, the first straight portion 63a, the second straight portion 63b, and the third straight portion 63c of the bus bar 42B are included in the horizontal plate portion 42p and are located on the same plane. The connecting portion 61, the connecting portion 62, the first straight portion 63a, the second straight portion 63b, and the third straight portion 63c of the bus bar 42B are housed, for example, in the housing portion 55.

[0173] In the present embodiment, the width W23 in the Y direction of the second straight portion 63b of the bus bar 42B is greater than the width W22 in the X direction of the first straight portion 63a of the bus bar 42B. The width W22 is, for example, the width in the X direction of a portion of the bus bar 42B that, in a case where viewed from the Z direction, is located in the region R overlapping the electronic component 10A. The width W22 is, for example, the minimum width in the X direction of the first straight portion 63a. The width W23 is, for example, the minimum width in the Y direction of the second straight portion 63b.

[0174] In the present embodiment, at least a portion (for example, all) of the first straight portion 63a and at least a portion (for example, all) of the second straight portion 63b are housed in the housing portion 55. Also, inside the housing portion 55, the width W23 in the Y direction of the second straight portion 63b is greater than the width W22 in the X direction of the first straight portion 63a.

[0175] In another viewpoint, in the present embodiment, the width W23 in the Y direction of the second straight portion 63b of the bus bar 42B is greater than the width W13 (refer to Figure 7 ) in the X direction of the connecting member 20B.

[0176] <6. Structure of sub-unit SUT>

[0177] Next, the structure of the sub-unit SUT will be described.

[0178] Figure 12 is a perspective view showing the sub unit SUT. The sub unit SUT includes, for example, a plurality of electronic components 10, a wiring structure body 40T, an auxiliary base member 101 (refer to Figure 16 ), and a metal member 90 (refer to Figure 14 ).

[0179] <6.1 Electronic Component>

[0180] First, the electronic component 10 will be described. The plurality of electronic components 10 includes a plurality of electronic components 10TA (only one is illustrated in Figure 12 ) and a plurality of electronic components 10TB (only one is illustrated in Figure 12 ). Further, the plurality of electronic components 10 can have only either of the electronic components 10TA and the electronic components 10TB.

[0181] The electronic component 10TA is one example of the electronic component 10T described above. The electronic component 10TA is an electronic component having a smaller amount of heat generation at the time of energization than the electronic component 10S. On the other hand, the electronic component 10TB is another example of the electronic component 10T described above. The electronic component 10TB is an electronic component having poor mountability (for example, requiring a complicated implementation structure) compared to the electronic component 10S. The electronic component 10TB has, for example, a terminal 13 (refer to Figure 16 ) projecting in the -Z direction toward the planar portion 111 of the metal plate 110. The electronic component 10TB has, for example, a smaller amount of heat generation at the time of energization than the electronic component 10S.

[0182] Hereinafter, without distinguishing between the electronic component 10TA and the electronic component 10TB, the electronic component 10T will be simply referred to. The electronic component 10T is, for example, also a connector, a fuse, a capacitor, a branch component, various sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit in which two or more of them are unitized. However, the type of the electronic component 10T is not limited to the above examples.

[0183] Figure 13 is a front view showing the electronic component 10TA. The electronic component 10TA is, for example, an electronic component in which a plurality of terminals 13 are separately arranged at both ends in the horizontal direction of the electronic component 10TA. In the present embodiment, the terminal 13A and the terminal 13B are separately arranged at both ends in the Y direction of the electronic component 10TA. The terminal 13A and the terminal 13B project from the central portion in the Z direction of the housing 11 in the horizontal direction (for example, the +Y direction or the -Y direction). Each terminal 13 has a mounting hole 13h through which a fastening member 43 (for example, a screw or a bolt) passes. The mounting hole 13h is open in the Z direction.

[0184] <6.2 Wiring structure>

[0185] Next, the wiring structure 40T will be described. Figure 12 The wiring structure 40T is a component that forms at least a part of a power supply path between a plurality of electronic components 10 (for example, a plurality of electronic components 10T) and / or at least a part of a power supply path between an electronic component 10 (for example, an electronic component 10T) included in the sub unit SUT and an electronic component 10 included in another sub unit SU (for example, the sub unit SUS). The wiring structure 40T includes, for example, a base component 41T, one or more (for example, a plurality of) bus bars 42, and a plurality of fastening components 43. In addition, regarding the fastening component 43, the same content as that of the fastening component 43 described in the sub unit SUS is omitted from the description.

[0186] <6.2.1 Base component>

[0187] Figure 14 is a perspective view illustrating the base component 41T. The base component 41T is a support component that integrally supports a plurality of bus bars 42 arranged in the horizontal direction at intervals from each other. The base component 41T is made of, for example, synthetic resin, and has insulating properties. The base component 41T electrically insulates the plurality of bus bars 42 from each other, for example, by ribs or the like not shown. The base component 41T can also be referred to as an "insulating base material". The base component 41T has a three-dimensional structure thicker in the Z direction than the base plate 41S included in the sub unit SUS. The base component 41T has, for example, a support wall 81, a frame portion 85 (a peripheral wall portion), and a fixing portion 87.

[0188] (Support wall)

[0189] The support wall 81 is, for example, a plate-shaped wall portion in the horizontal direction. The plurality of bus bars 42 is arranged on the support wall 81, and is supported from below by the support wall 81 (see Figure 12 ). In addition, the support wall 81 that supports the bus bar 42 is not limited to a wall portion in the horizontal direction, and can be, for example, a lattice-shaped wall portion formed by a plurality of ribs extending in the Z direction. In the present embodiment, the fastening component 43 is attached to the support wall 81. The fastening component 43 protrudes in the +Z direction from the support wall 81.

[0190] (Housing portion that houses electronic component)

[0191] In this embodiment, the base component 41T has a receiving portion 84A that opens towards the +Z direction. The receiving portion 84A is, for example, a recess in the Z direction of a part of the support wall 81, or a through hole that penetrates the support wall 81 in the Z direction. When viewed from the Z direction, the receiving portion 84A has a shape corresponding to the shape of the housing 11 (i.e., the main body portion 12) of the electronic component 10 (e.g., the electronic component 10T). At least a portion of the electronic component 10 (e.g., the electronic component 10T) (e.g., at least a portion of the main body portion 12) is received in the receiving portion 84A. At least a portion of the electronic component 10 received in the receiving portion 84A is located on the -Z direction side compared to the support wall 81.

[0192] (The containment department of the metal containment unit)

[0193] In this embodiment, the base component 41T has a receiving portion 84B that opens towards the +Z direction. The receiving portion 84B is, for example, a recess in the Z direction of a portion of the support wall 81, or a through hole extending through the support wall 81 in the Z direction. When viewed from the Z direction, the receiving portion 84B has a shape corresponding to the shape of the metal portion 90 described later. At least a portion of the metal portion 90 is received in the receiving portion 84B. The at least portion of the metal portion 90 received in the receiving portion 84B is located on the -Z direction side compared to the support wall 81.

[0194] (Frame)

[0195] A frame portion 85 is provided at the peripheral end of the base member 41T. The frame portion 85 is a rib (peripheral wall portion) extending in the Z direction at the peripheral end of the base member 41T. The width (thickness) H21 of the frame portion 85 (peripheral wall portion) in the Z direction is, for example, more than half of the width (thickness) H22 in the Z direction of the electronic component 10 (e.g., electronic component 10TA) (see reference). Figure 16 Additionally, the frame 85 can also be omitted.

[0196] (Fixed part)

[0197] The fixing part 87 is the part that is fixed to the metal plate 110 (see reference). Figure 16 The fixing part 87 faces the fixing part 112 of the metal plate 110 in the Z direction. The fixing part 87 has a mounting hole 87h that passes through the base member 41T in the Z direction. The fastening member 115 (e.g., a screw or bolt) passes through the mounting hole 87h. When the fastening member 115 passing through the mounting hole 87h engages with the engaging hole 112h of the fixing part 112 of the metal plate 110, the base member 41T is fixed to the metal plate 110.

[0198] <6.2.2 Busbar>

[0199] Next, the busbar 42 included in the wiring structure 40T will be described.

[0200] Figure 15 FIG. 18 is a plan view showing the wiring structure 40T. The bus bars 42 are wiring members (electrical connection members) included in the wiring structure 40T. The bus bars 42 are, for example, wiring members for electrically connecting a plurality of electronic components 10 (e.g., a plurality of electronic components 10T). Alternatively, the bus bars 42 can be wiring members for connecting the electronic components 10 (e.g., the electronic components 10T) to electronic components 10 included in other sub-units SU (e.g., the sub-unit SUS). In the present embodiment, a plurality of bus bars 42 are supported from below by the base member 41T and are arranged at positions away from the metal plate 110. The bus bars 42 are, for example, arranged directly below the terminals 13 of the electronic components 10. The bus bars 42 overlap the component main body portions 12 of the electronic components 10 when viewed in the X direction or the Y direction (see FIG. 18). Figure 17 ).

[0201] The plurality of bus bars 42 include, for example, four bus bars 42E, 42F, 42G, and 42I. The four bus bars 42E, 42F, 42G, and 42I are arranged in the horizontal direction at intervals from each other. The four bus bars 42E, 42F, 42G, and 42I include portions arranged on the same plane. At least a portion of each bus bar 42 is a horizontal plate portion 42p. In the present embodiment, each bus bar 42 is plate-shaped along the horizontal direction over the entire length. The horizontal plate portion 42p of each bus bar 42 includes a connection portion 61, a connection portion 62, and an extension portion 63. In the present embodiment, the sub-unit SUT has the electronic component 10D as one of the plurality of electronic components 10T.

[0202] The connection portion 61 of the bus bar 42E is connected to a bus bar 42 included in the sub-unit SUS. Similarly, the connection portion 61 of the bus bar 42F is connected to a bus bar 42 included in the sub-unit SUS. The connection portion 62 of the bus bar 42F is physically and electrically connected to the terminal 13A of the electronic component 10D. For example, the terminal 13A of the electronic component 10D is placed on the horizontal plate portion 42p of the bus bar 42F, and thereby connected to the connection portion 62 of the bus bar 42F.

[0203] The connection portion 61 of the bus bar 42G is physically and electrically connected to the terminal 13B of the electronic component 10D. For example, the terminal 13B of the electronic component 10D is connected to the connection portion 61 of the bus bar 42G by being placed on the horizontal plate portion 42p of the bus bar 42G. The connection portion 61 of the bus bar 42G is an example of the "first connection portion". The connection portion 62 of the bus bar 42G is physically and electrically connected to the bus bar 76 for external connection. The connection portion 62 of the bus bar 42G is connected to an external device via the bus bar 76. The connection portion 62 of the bus bar 42G is an example of the "second connection portion". The bus bar 76 is an example of the "external connection component". In addition, the connection portion 62 of the bus bar 42G can be physically and electrically connected to the terminal 13 of another electronic component 10 instead of the bus bar 76.

[0204] The connection portion 61 of the bus bar 42I is connected to the bus bar 42 included in the sub unit SUS. The connection portion 62 of the bus bar 42I is physically and electrically connected to the terminal 13A of the electronic component 10T not shown.

[0205] <6.3 Auxiliary base component>

[0206] Next, the auxiliary base component 101 will be described.

[0207] Figure 16 is a cross-sectional view along the F16-F16 line of the structure shown in Figure 15 The auxiliary base component 101 is, for example, made of synthetic resin and has insulating properties. A plurality of wirings 102 are provided on the surface of the auxiliary base component 101. The wiring 102 is, for example, a conductive layer (metal layer) provided on the surface of the auxiliary base component 101. The auxiliary base component 101 is disposed in the Z direction between the base component 41T and the planar portion 111 of the metal plate 110. The auxiliary base component 101 faces the electronic component 10TB from the -Z direction side. The terminal 13 of the electronic component 10TB is electrically connected to the wiring 102 provided on the auxiliary base component 101 at a position between the base component 41T and the planar portion 111 of the metal plate 110. The auxiliary base component 101 is an example of the "third base component".

[0208] <6.4 Metal portion>

[0209] Next, with reference to Figure 14 The metal portion 90 will be described. The metal portion 90 is, for example, a structure that reduces thermal interference from an external device on the electronic component 10 included in the sub unit SUT.

[0210] The metal portion 90 is, for example, a heat-conducting portion that transfers a portion of the heat from an external device via the busbar 76 toward the electronic component 10 (e.g., electronic component 10T) to the planar portion 111 of the metal plate 110, described later. Alternatively, the metal portion 90 may also be a heat-conducting portion that transfers at least a portion of the heat emitted by the electronic component 10 and / or at least a portion of the heat emitted by the busbar 42 itself to the planar portion 111 of the metal plate 110. The planar portion 111 of the metal plate 110 is disposed separately from the busbar 42 in the Z direction. The planar portion 111 of the metal plate 110 faces the busbar 42 in the Z direction. The planar portion 111 of the metal plate 110 is an example of an "opposite portion".

[0211] The metal part 90 is, for example, a heat storage component (heat absorption component) that increases the heat capacity of the electrical path included in the subunit SUT. The metal part 90, for example, stores (absorbs) a portion of the heat from an external device via the busbar 76 toward the electronic component 10 (e.g., electronic component 10T). Alternatively, the metal part 90 may also store (absorb) at least a portion of the heat emitted by the electronic component 10 and / or at least a portion of the heat emitted by the busbar 42 itself. When using the metal part 90 as a heat storage component, the metal part 90 may not be thermally connected to the metal plate 110.

[0212] Figure 17 It is along Figure 15 The cross-sectional view of the structure shown along line F17-F17. Figure 18 It is along Figure 15 The diagram shows a cross-sectional view along line F18-F18 of the structure. In this embodiment, the metal part 90 and the metal plate 110 are separate components. The metal part 90 is, for example, a solid metal block. Furthermore, the shape of the metal part 90 is not limited to the example described above. The metal part 90 can also be a component with an I-shaped, L-shaped, or C-shaped cross-sectional shape. The metal part 90 can also be integrally formed with the base component 41T by insert molding.

[0213] The thickness H31 of the metal part 90 in the Z direction is greater than the thickness T1 of the horizontal plate part 42p of the busbar 42 in the Z direction. For example, the thickness H31 of the metal part 90 in the Z direction is more than twice the thickness T1 of the horizontal plate part 42p of the busbar 42 in the Z direction.

[0214] In this embodiment, the width W31 of the metal part 90 in the X direction is larger than the width W32 of the electronic component 10 in the X direction (see reference). Figure 15 In other viewpoints, the width W31 in the X direction of the metal part 90 (see reference) Figure 15 The thickness H31 in the Z direction of the metal part 90 is greater than that of the metal part 90 (refer to...). Figure 18 ).

[0215] In this embodiment, the base component 41T is disposed between the busbar 42 and the planar portion 111 of the metal plate 110. The base component 41T has a receiving portion 84B that opens in the Z direction. At least a portion of the metal portion 90 is received in the receiving portion 84B.

[0216] The metal part 90 is disposed in the Z direction between the busbar 42 and the flat part 111 of the metal plate 110. The metal part 90 faces the busbar 42 from the Z direction and is thermally connected to the busbar 42.

[0217] In this embodiment, the metal part 90 is disposed, for example, between the extension 63 of the busbar 42 and the planar part 111 of the metal plate 110. The metal part 90 faces the extension 63 of the busbar 42 from the Z direction and is thermally connected to the extension 63 of the busbar 42.

[0218] In this embodiment, the metal part 90 has a locking hole 90h opening in the +Z direction. The inner circumferential surface of the locking hole 90h has a threaded groove. The extension 63 of the busbar 42 has a through hole 42h opposite to the locking hole 90h. A fastening member 117 (e.g., a screw or bolt) passes through the through hole 42h of the busbar 42 from the +Z direction side. When the fastening member 117 passing through the through hole 42h of the busbar 42 engages with the locking hole 90h of the metal part 90, the extension 63 of the busbar 42 is fixed to the metal part 90.

[0219] In this embodiment, a heat-conducting member 120 is disposed between the metal part 90 and the planar part 111 of the metal plate 110. Alternatively, the heat-conducting member 120 may be disposed between the metal part 90 and the busbar 42.

[0220] like Figure 15 As shown, when viewed from the Z direction, the metal part 90 is disposed between the terminal 13B of the electronic component 10 and the busbar 76 for external connection. Therefore, heat from the busbar 76 toward the electronic component 10 via the busbar 42 can easily move to the metal part 90 before reaching the electronic component 10.

[0221] The metal portion 90 includes, for example, a first portion 91 and a second portion 92. Viewed from the Z direction, the first portion 91 is located on the +Y direction side relative to the terminal 13B of the electronic component 10. Viewed from the Z direction, the second portion 92 is located on the -X direction side or the +X direction side relative to the terminal 13B of the electronic component 10. The first portion 91 and the second portion 92 are integrally formed. With this structure, it is easier to ensure a larger volume of the metal portion 90 compared to a cuboid shape.

[0222] <7. Connection Structure of Sub-units>

[0223] Next, the connection structure between the plurality of sub-units SU will be described.

[0224] Figure 19 is a perspective view showing the connection structure of the sub-unit SUS and the sub-unit SUT. In the present embodiment, a step ST is formed between the sub-unit SUS and the sub-unit SUT based on the difference in the height in the Z direction of the base plate 41S of the sub-unit SUS and the base member 41T of the sub-unit SUT. Also, with the step ST, a cross structure is realized in which the bus bars 42 included in the sub-unit SUS and the bus bars 42 included in the sub-unit SUT cross three-dimensionally.

[0225] For example, the bus bars 42E, 42F, 42I included in the sub-unit SUT maintain the height in the Z direction supported by the base member 41T, and extend to a position overlapping the base plate 41S of the sub-unit SUS in the Z direction in the -Y direction. The connection portions 61 of the bus bars 42E, 42F, 42I each are distanced from the base plate 41S of the sub-unit SUS in the Z direction, and face the base plate 41S of the sub-unit SUS in the Z direction.

[0226] On the other hand, the connection portion 62 of the bus bar 42A included in the sub-unit SUS is raised in the +Z direction with respect to the extension portion 63 of the bus bar 42A, and contacts the connection portion 61 of the bus bar 42E from the -Z direction side. The connection portion 62 of the bus bar 42A and the connection portion 61 of the bus bar 42E are fixed by the fastening member 43 and the engagement member 44.

[0227] Similarly, the connection portion 62 of the bus bar 42C included in the sub-unit SUS is raised in the +Z direction with respect to the extension portion 63 of the bus bar 42C, and contacts the connection portion 61 of the bus bar 42I from the -Z direction side. The connection portion 62 of the bus bar 42C and the connection portion 61 of the bus bar 42I are fixed by the fastening member 43 and the engagement member 44.

[0228] The extension portion 63 of the bus bar 42D included in the sub-unit SUS extends in the X direction between the planar portion 111 of the metal plate 110 and the bus bar 42I. For example, the extension portion 63 of the bus bar 42D passes through a region overlapping the bus bar 42I when viewed in the Z direction, and extends across the +X direction side and the -X direction side of the bus bar 42I. The connection portion 62 of the bus bar 42D is raised in the +Z direction with respect to the extension portion 63 of the bus bar 42D, and contacts the connection portion 61 of the bus bar 42F from the -Z direction side. The connection portion 62 of the bus bar 42D and the connection portion 61 of the bus bar 42F are fixed by the fastening member 43 and the engagement member 44.

[0229] Further, between the sub-units SUS and SUT, because of the difference in the height in the Z direction of the first base member (for example, the base plate 41S) of the sub-unit SUS and the second base member (for example, the base member 41T) of the sub-unit SUT, a sufficient space in which air easily flows is ensured above the wiring substrate 40S (the wiring substrate 40SB). At this time, by providing the heat dissipation structure 42HDS to the bus bar 42 included in the wiring substrate 40S, the heat dissipation property of the electrical connection unit 1 in the first region R1 is improved.

[0230] <8. Extension structure of bus bar>

[0231] Figure 20 is along Figure 15 a cross-sectional view of the F20-F20 line of the structure shown in FIG. 20. In the present embodiment, one bus bar 42 (bus bar 42K) is disposed between the base member 41T and the planar portion 111 of the metal plate 110, and extends in the Y direction in the gap S2 between the base member 41T and the planar portion 111 of the metal plate 110. The bus bar 42K extends, for example, across the -Y direction side and the +Y direction side of the base member 41T. The connection portion 61 of the bus bar 42K is physically and electrically connected to the bus bar 42 included in the sub-unit SUS. The connection portion 62 of the bus bar 42K is physically and electrically connected to the bus bar 76 for external connection. The bus bar 42K is an example of a "third bus bar".

[0232] <9. Metal plate and insulating cover>

[0233] Next, returning to Figure 2 , the metal plate 110 and the insulating cover 130 will be described.

[0234] <9.1 Metal plate>

[0235] The metal plate 110 is a member that ensures the rigidity of the electrical connection unit 1 and improves the heat dissipation property of the electrical connection unit 1. The metal plate 110 is made of metal (for example, made of aluminum or an aluminum alloy). The metal plate 110 is an example of a "rigid member". The metal plate 110 can also be referred to as a "metal member" or a "heat dissipation member". The metal plate 110 faces the bus bar 42 from the side opposite to the connection member 20.

[0236] The metal plate 110 is rectangular in the X direction and the Y direction. The metal plate 110 has a first end portion 110e1, a second end portion 110e2, a third end portion 110e3, and a fourth end portion 110e4. The first end portion 110e1 and the second end portion 110e2 are a pair of end portions in the long side direction of the metal plate 110 and are separated in the X direction. The third end portion 110e3 and the fourth end portion 110e4 are a pair of end portions in the short side direction of the metal plate 110 and are separated in the Y direction. The metal plate 110 includes, for example, a flat portion 111, the plurality of fixing portions 112 described above (refer to Figure 9 ), and the plurality of fixing portions 113 described above (refer to Figure 9 ).

[0237] The flat portion 111 is a portion of the metal plate 110 that is formed in a plate shape. The flat portion 111 is a plate shape in the horizontal direction. The flat portion 111 forms a main portion of the metal plate 110. The flat portion 111 forms a base portion (metal base portion) of the metal plate 110. The flat portion 111 has a size that covers both of the sub-units SU from below.

[0238] In the present embodiment, the flat portion 111 has a first region A1 and a second region A2. The first region A1 is, for example, a region on the -Y direction side in the flat portion 111. The sub-unit SU described above faces the first region A1 of the flat portion 111 when viewed in the Z direction. That is, the plurality of electronic components 10S and the base plate 41S included in the sub-unit SU face the first region A1 of the flat portion 111 in the Z direction.

[0239] The second region A2 is, for example, a region on the +Y direction side in the flat portion 111. The sub-unit ST described above faces the second region A2 of the flat portion 111 when viewed in the Z direction. That is, the plurality of electronic components 10T and the base portion 41T included in the sub-unit ST face the second region A2 of the flat portion 111 in the Z direction.

[0240] <9.2 Insulating cover>

[0241] The insulating cover 130 is a member for preventing a finger from contacting a power supply path of the sub-unit SU. The insulating cover 130 is, for example, made of synthetic resin and has insulating properties. The insulating cover 130 is, for example, a box shape that is open on the -Z direction side. The insulating cover 130 has a plurality of air holes 130h. The insulating cover 130 covers a part or all of the corresponding sub-unit SU. In addition, the insulating cover 130 is not limited to a box-shaped member and can be a sheet-shaped member that covers the power supply path of the main body portion MU. In addition, the insulating cover 130 can be omitted.

[0242] <10. Advantage>

[0243] <A. Advantage regarding provision of a heat dissipation structure to the bus bar of the electrical connection unit>

[0244] As a comparative example, a structure in which heat generated by an electronic component is transmitted to a heat dissipation component via a bus bar is considered. In such a structure, sometimes the bus bar is heated during transmission of heat to the heat dissipation component, and sometimes improvement in heat dissipation of the bus bar is required.

[0245] On the other hand, the bus bar 42 of the present embodiment is a bus bar including a plate portion (for example, a horizontal plate portion 42p). A surface of the above-described plate portion has a heat dissipation structure 42HDS (a first heat dissipation structure 42HDS1, a second heat dissipation structure 42HDS2) including at least one of a plurality of recesses and a plurality of protrusions.

[0246] According to such a structure, by the surface of the above-described plate portion having the heat dissipation structure 42HDS, it is easy to expand the heat dissipation area of the bus bar 42. Therefore, it is possible to provide a bus bar capable of achieving improvement in heat dissipation.

[0247] In the present embodiment, the heat dissipation structure 42HDS includes a plurality of grooves each extending in a straight line as the above-described plurality of recesses. According to such a structure, it is possible to effectively utilize the lower surface of the electronic component 10 or the like placed on the bus bar 42.

[0248] In the present embodiment, the above-described plate portion includes a connection portion 61 connected to the electronic component 10 directly or via the connection component 20 and an extension portion 63 extending from the connection portion 61. In a case where a thickness direction of the above-described plate portion is set as a first direction (for example, a Z direction), an extension direction of the extension portion 63 is set as a second direction (for example, a Y direction), and a direction intersecting the first direction and the second direction is set as a third direction (for example, an X direction), the following relationship is established between the first region 42R1 and the second region 42R2. The above-described plate portion has: the first region 42R1 provided with the above-described plurality of recesses; and the second region 42R2 adjacent to the first region 42R1 in either one of the second direction or the third direction (for example, the Y direction), not provided with the above-described plurality of recesses. In either another one of the second direction or the third direction (for example, the X direction), the width of the first region 42R1 is greater than the width of the second region 42R2. According to such a structure, the first region 42R1 is a region provided with a plurality of recesses and is a region including the above-described wall retreat portion, and thus the cross-sectional area of the plate portion is not easily changed before and after the above-described recesses are provided to the plate portion. Therefore, the resistance of the bus bar 42 is not easily changed, and it is easy to replace the bus bar 42 from an existing bus bar.

[0249] In the present embodiment, the electric connection unit 1 is provided with the above-described bus bar 42 and the electronic component 10 electrically connected to the bus bar 42. According to such a structure, by the surface of the above-described plate portion having the heat dissipation structure 42HDS, it is easy to expand the heat dissipation area of the bus bar 42. Therefore, it is possible to provide an electric connection unit capable of achieving improvement in heat dissipation.

[0250] In the present embodiment, the connecting member 20, the heat dissipation member (for example, the metal plate 110), and the heat conductive member 120 having elasticity are further provided to connect the electronic component 10 and the bus bar 42. The heat dissipation member faces the bus bar 42 from the opposite side of the connecting member 20. The heat conductive member 120 is arranged between the heat dissipation member and the bus bar. The plate portion has a first surface 42a1 and a second surface 42a2. The first surface 42a1 faces the connecting member 20. The second surface 42a2 is located on the side opposite to the first surface 42a1 and faces the heat conductive member 120. The heat dissipation structure 42HDS (for example, the second heat dissipation structure 42HDS2) is provided to the second surface 42a2 and contacts the heat conductive member 120. According to such a structure, the heat conductive member 120 contacts the second heat dissipation structure HDS2. The second heat dissipation structure HDS2 easily expands the contact area with the heat conductive member 120 by including at least one of a plurality of recesses and a plurality of protrusions. Therefore, the heat conductive member 120 easily transfers heat transferred from the electronic component 10 to the bus bar 42 and / or heat emitted from the bus bar 42 from the bus bar 42 to the heat dissipation member.

[0251] In the present embodiment, the connecting member 20, the heat dissipation member (for example, the metal plate 110), and the heat conductive member 120 having elasticity are further provided to connect the electronic component 10 and the bus bar 42. The heat dissipation member faces the bus bar 42 from the opposite side of the connecting member 20. The heat conductive member 120 is arranged between the heat dissipation member and the bus bar. The plate portion has a first surface 42a1 and a second surface 42a2. The first surface 42a1 faces the connecting member 20. The second surface 42a2 is located on the side opposite to the first surface 42a1 and faces the heat conductive member 120. The heat dissipation structure 42HDS (for example, the second heat dissipation structure 42HDS2) is provided to the second surface 42a2 and contacts the heat conductive member 120. According to such a structure, the heat conductive member 120 contacts the second heat dissipation structure HDS2. The second heat dissipation structure HDS2 easily expands the contact area with the heat conductive member 120 by including at least one of a plurality of recesses and a plurality of protrusions. Therefore, the heat conductive member 120 easily transfers heat transferred from the electronic component 10 to the bus bar 42 and / or heat emitted from the bus bar 42 from the bus bar 42 to the heat dissipation member.

[0252] In the present embodiment, the plate portion has the first surface 42a1 facing the electronic component 10. The heat dissipation structure 42HDS (for example, the first heat dissipation structure 42HDS1) is provided to the first surface 42a1. According to such a structure, expansion of the heat dissipation area of the bus bar 42 using the first surface 42a1 on the side of the electronic component 10 is easily performed.

[0253] In the present embodiment, the plate portion extends through the region R overlapping the electronic component 10 when viewed in the first direction (for example, the Z direction) that is the thickness direction of the plate portion. The heat dissipation structure 42HDS (for example, the first heat dissipation structure 42HDS1) is provided to the plate portion in a portion overlapping the electronic component 10 when viewed in the first direction. According to such a structure, expansion of the heat dissipation area of the bus bar 42 using the lower surface of the electronic component 10 is easily performed.

[0254] <B. Advantages regarding the division of the plurality of regions in the electrical connection unit>

[0255] As a comparative example, consider a structure in which an electronic component that should be prioritized in terms of heat dissipation and an electronic component that should be prioritized in terms of mounting are mounted to one base member. In such a structure, in the case where a base member having a prescribed thickness is employed, it is sometimes difficult to achieve an improvement in heat dissipation.

[0256] On the other hand, the electrical connection unit (for example, electrical connection unit 1) of the present embodiment includes a rigid member (for example, metal plate 110), a first electronic component (for example, electronic component 10S), a first base member (for example, base plate 41S), a first bus bar (for example, bus bars 42A, 42B, 42C, 42D), a second electronic component (for example, electronic component 10T), a second base member (for example, base member 41T), and a second bus bar (for example, bus bars 42E, 42F, 42G, 42I). The above-described rigid member includes a first region (for example, first region Al) and a second region (for example, second region A2). The above-described first electronic component faces the above-described first region in a first direction. The above-described first base member faces the above-described first region in the above-described first direction, has a planar portion (for example, planar portion 51), and is insulative. The above-described first bus bar is supported by the above-described planar portion and is electrically connected to the above-described first electronic component. The above-described second electronic component faces the above-described second region in the above-described first direction, and has a smaller heat generation amount than the above-described first electronic component. The above-described second base member has a three-dimensional structure that faces the above-described second region in the above-described first direction and is thicker than the above-described first base member in the above-described first direction, and is insulative. The above-described second bus bar is supported by the above-described second base member and is electrically connected to the above-described second electronic component.

[0257] According to such a structure, by utilizing the first base member having a planar portion, it is possible to arrange the first electronic component, which prioritizes heat dissipation, in the vicinity of the rigid member, and to promote the release of heat using the rigid member as a heat dissipation member. On the other hand, by utilizing the second base member having a three-dimensional structure that is thicker in the first direction, it is possible to appropriately mount the second electronic component, which prioritizes mounting. By using such regions in a differentiated manner, it is possible to provide an electrical connection unit that achieves a balance between mounting and an improvement in heat dissipation.

[0258] <11. Modified example>

[0259] Next, several modified examples will be described. In each of the modified examples, the structures described below are the same as those of the above-described embodiment.

[0260] (First modified example)

[0261] The wiring substrate 40S is not limited to the structure in which the base plate 41S and the bus bars 42 are integrated by insert molding. For example, the bus bars 42 can be disposed in the housing portions 55 of the base plate 41S after the base plate 41S is formed with the housing portions 55 that house the bus bars 42. In this case, the bus bars 42 can be fixed to the housing portions 55 by fitting or can be fixed to the housing portions 55 by an adhesive or other fixing means. In these cases, potting that fills gaps between the bus bars 42 and the housing portions 55 can be performed.

[0262] (Second Modification)

[0263] The base member of the wiring substrate 40S is not limited to the base plate 41S having the flat portion 51 in a plate shape. The wiring substrate 40S can be a base member (for example, an insulating sheet) having a flat portion 51 in a sheet shape. In this case, a portion of the flat portion 51 can be formed into the housing portion 55 following the outer shape of the bus bar 42. Note that, in the present disclosure, "sheet shape" or "sheet" is not limited to a member having a thickness of 1 mm or more and can be a member (so-called film) having a thickness of less than 1 mm.

[0264] (Third Modification)

[0265] The base plate 41S of the wiring substrate 40S can include a plurality of members (plate members or sheet members). The plurality of members are disposed so as to sandwich a plurality of bus bars 42 arranged in the horizontal direction. For example, the plurality of members are integrated by sandwiching the plurality of bus bars 42 by lamination molding. The plurality of members form the flat portion 51. In this case, the housing portion 55 can be formed in a hollow shape inside the base plate 41S (between the plurality of members). The plurality of members can be a plurality of plate members, a plurality of sheet members, or a combination of plate members and sheet members. The sheet members can be, for example, sheet members having flexibility. The flat portion 51 formed by the plurality of members has an opening that exposes at least the first connection portion 61 and the second connection portion 62 of the bus bar 42.

[0266] When the plurality of members sandwich the plurality of bus bars 42 and are integrated by lamination molding, for example, a synergistic effect with the heat dissipation structure 42HDS of the bus bar 42 in the present disclosure can be expected. Specifically, the recesses or protrusions provided in the first region 42R1 of the heat dissipation structure 42HDS are likely to be caught in the plurality of members. Therefore, it is easy to restrict the position of the bus bar 42 in the horizontal direction. Thus, the wiring substrate 40S is likely to ensure insulation between the plurality of bus bars 42.

[0267] (Fourth Modification)

[0268] The connection of the electronic component 10 to the bus bar 42 is not limited to the connection via the connection component 20. The electronic component 10 can also be directly connected to the bus bar 42 using a fastening component (e.g., a bolt, a screw), or welding, or the like.

[0269] (Fifth Modification)

[0270] The bus bar 42 having the heat dissipation structure 42HDS described above can also be provided to the wiring structure 40T instead of the wiring substrate 40S.

[0271] (Sixth Modification)

[0272] In the heat dissipation structure 42HDS described above, the first heat dissipation structure 42HDS1 includes a plurality of recesses, and the second heat dissipation structure 42HDS2 includes a plurality of recesses. In contrast, in the present modification, either one of the first heat dissipation structure 42HDS1 and the second heat dissipation structure 42HDS2 can include a plurality of recesses, and the other one of the first heat dissipation structure 42HDS1 and the second heat dissipation structure 42HDS2 can include a plurality of protrusions.

[0273] The above describes several embodiments and modifications. However, the embodiments and modifications are not limited to the examples described above. For example, the above-described modifications can be combined with each other.

[0274] Explanation of Reference Numerals

[0275] 1… electric connection unit

[0276] SU, SUS, SUT… sub unit

[0277] 10, 10S, 10T, 10TA, 10TB… electronic component

[0278] 13, 13A, 13B… terminal

[0279] 20… connection component

[0280] 40S… wiring substrate

[0281] 40T… wiring structure

[0282] 41S… base plate

[0283] 41T… base component

[0284] 42… bus bar

[0285] 42HDS… heat dissipation structure

[0286] 42HDS1… first heat dissipation structure

[0287] 42HDS2… second heat dissipation structure

[0288] 42R1 first region

[0289] 42R2 second region

[0290] 42a1 first surface

[0291] 42a2 second surface

[0292] 51 flat portion

[0293] 52 frame portion

[0294] 55 housing portion

[0295] 61 connecting portion

[0296] 62 connecting portion

[0297] 63 extending portion

[0298] 63a first linear portion

[0299] 63aa first end portion (first part)

[0300] 63ab second end portion (second part)

[0301] 63b second linear portion

[0302] 63c third linear portion

[0303] 84A, 84B housing portion

[0304] 85 frame portion

[0305] 90 metal portion

[0306] 101 auxiliary base member

[0307] 102 wiring

[0308] 110 metal plate (rigid member, metal member, heat dissipation member)

[0309] 111 flat portion (opposite part)

[0310] 120 heat conductive member

Claims

1. A busbar, characterized in that, The busbar includes a plate portion. The surface of the plate has a heat dissipation structure, which includes at least one of a plurality of recesses and a plurality of protrusions.

2. The busbar according to claim 1, characterized in that, The heat dissipation structure includes multiple grooves extending in a straight line as multiple recesses.

3. The busbar according to claim 1 or 2, characterized in that, The board portion includes: a connecting portion, which is directly connected to or connected via an electronic component; and an extension portion, which extends from the connecting portion. When the thickness direction of the plate portion is set as the first direction, the extension direction of the extension portion is set as the second direction, and the direction intersecting the first direction and the second direction is set as the third direction, The plate portion has: a first region having a plurality of recesses; and a second region adjacent to the first region in either the second direction or the third direction, and without the plurality of recesses. In either the second direction or the third direction, the width of the first region is greater than the width of the second region.

4. An electrical connection unit, characterized in that, have: The busbar as described in claim 1 or 2; and An electronic component that is electrically connected to the busbar.

5. The electrical connection unit according to claim 4, characterized in that, It also has: A connecting component that connects the electronic components to the busbar; A heat dissipation component, which faces the busbar from the side opposite to the connecting component; as well as A heat-conducting component, disposed between the heat dissipation component and the busbar, and having elasticity. The plate portion has a first surface facing the connecting component and a second surface located on the opposite side of the first surface and facing the heat-conducting component. The heat dissipation structure is disposed on the second surface and is in contact with the heat-conducting component.

6. The electrical connection unit according to claim 5, characterized in that, When viewed from the thickness direction of the plate, i.e., the first direction, the connecting component, the heat-conducting component, and the heat dissipation structure overlap.

7. The electrical connection unit according to claim 4, characterized in that, The plate portion has a first surface facing the electronic component. The heat dissipation structure is disposed on the first surface.

8. The electrical connection unit according to claim 7, characterized in that, Viewed from the thickness direction of the plate portion, i.e., the first direction, the plate portion extends through the area overlapping with the electronic component. The heat dissipation structure is disposed in the portion of the plate that overlaps with the electronic component when viewed from the first direction.

Images