Object erecting device

Abstract

The invention provides an object erecting device capable of erecting a cylindrical object more efficiently. An article erecting device (16) is provided with: a turntable (24) having a flat surface section (28) on which a cylindrical conductive pin (P) is placed, and an inclined section (30) provided on the outer periphery of the flat surface section (28); and a turntable rotation motor (26) that rotates the turntable (24). A groove (30A) is formed in the inclined part (30), a plurality of holes (30B) are arranged at the lower end of the groove (30A), and conductive pins (P) moving along the groove (30A) along with the rotation of the turntable (24) are loaded in the holes (30B) and stand upright.

Description

TECHNICAL FIELD

[0001] The present application relates to an article erecting device that erects a cylindrical article. BACKGROUND

[0002] A substrate lamination technique is known in which metal posts (pins) are used to electrically connect two semiconductor mounting substrates (Patent Literature 1). In Patent Literature 1, a plurality of metal conductive posts 10 are housed in a plurality of housing holes 23 provided in a housing container 22, and the conductive posts 10 are picked up by an assembly head 26 to be mounted on a surface electrode 13a of a substrate 11.

[0003] PRIOR ART DOCUMENT PATENT LITERATURE Patent Literature 1: Japanese Patent Application Publication No. 2016-32033 SUMMARY

[0004] PROBLEMS TO BE SOLVED BY THE INVENTION However, in the structure of Patent Literature 1, a preparation operation of filling the conductive posts, which are cylindrical articles, into a dedicated housing container is required before mounting, and the assembly head needs to be reciprocated between the housing container and the mounting position a plurality of times when mounting the conductive posts, so the mounting operation requires a large amount of time.

[0005] The present application relates to an article erecting device that erects a cylindrical article.

[0006] TECHNICAL SOLUTION FOR SOLVING THE PROBLEMS The article erecting device of the first application of the present application is characterized by including: a turntable having a flat portion on which a cylindrical article is placed and an inclined portion provided to an outer periphery of the flat portion; and a turntable rotating unit that rotates the turntable, a plurality of grooves are formed in the inclined portion, a hole corresponding to each groove is provided to an outer peripheral portion of the flat portion, and the article moving along the grooves is filled in the hole by its own weight to be erected as the turntable rotates.

[0007] The article erecting device of the second application of the present application is characterized in that, in the first application, the cylindrical article is a conductive pin.

[0008] EFFECT OF THE INVENTION According to the present application, an article erecting device that can more efficiently erect a cylindrical article can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 is a perspective view of a conductive pin mounting device of an embodiment of the present application as viewed from above.

[0010] Figure 2 is a perspective view of the conductive pin mounting device viewed from below.

[0011] Figure 3 is a partial cutaway perspective view of the conductive pin mounting device viewed from above.

[0012] Figure 4 is Figure 3 is an enlarged view of the periphery of the object upstanding device of the partial cutaway perspective view of

[0013] Figure 5 is a longitudinal sectional view of the conductive pin mounting device.

[0014] Figure 6 is a perspective view of the turntable of the present embodiment viewed from above.

[0015] Figure 7 is a plan view and a bottom view of the turntable.

[0016] Figure 8 is a longitudinal sectional view through the center of rotation of the turntable.

[0017] Figure 9 is an enlarged sectional view showing the structure of the periphery of the slot and hole of the turntable.

[0018] Figure 10 is a side view showing an example of a semiconductor package to which a conductive pin is mounted. DETAILED DESCRIPTION

[0019] Hereinafter, an embodiment of the present application will be described with reference to the drawings. Figure 1 is a perspective view of the conductive pin mounting device of an embodiment of the present application viewed from above, Figure 2 is a perspective view viewed from below. Figure 3 is a perspective view of Figure 1 , Figure 2 is a partial cutaway perspective view of the conductive pin mounting device of Figure 4 is Figure 3 is an enlarged view of the periphery of the object upstanding device of the partial cutaway perspective view of Figure 5 is a longitudinal sectional view of the conductive pin mounting device.

[0020] The conductive pin mounting device 10 of the present embodiment is a device that mounts, for example, a conductive pin (a pillar, a post, a pin, or the like formed of a conductive material such as metal) for multilayering of a semiconductor chip in a semiconductor package to an electronic circuit substrate, and in the present embodiment, a conductive pin P that is a cylindrical article is mounted. The conductive pin mounting device 10 is provided with a mounting head 12 that is relatively movable with respect to an electronic circuit substrate that is a processing target by a driving mechanism not shown. In the present embodiment, the electronic circuit substrate is moved in front and back and left and right with respect to the fixed mounting head 12.

[0021] The mounting head 12 has a drop port 14 for simultaneously dropping a plurality of conductive pins P, an article standing device (standing unit) 16 that stands the dropped conductive pins P, a punch shaft 18 that punches the stood conductive pins P, and a punch shaft driving motor (driving section) 20 that drives the punch shaft 18. A punch nozzle 22 is provided below the punch shaft 18, and the punch shaft 18 punches the conductive pins P stood by the article standing device 16 via the punch nozzle 22 and mounts the conductive pins P to a given position of the electronic circuit substrate.

[0022] The article standing device 16 is provided with a turntable 24 that drops the conductive pins P dropped from the drop port 14 and a turntable rotating motor (turntable rotating unit) 26 that rotates the turntable 24. The turntable 24 is provided with a disc-shaped flat portion 28 on which the dropped conductive pins P are placed and an inclined portion 30 that is provided in a mortar shape to the outer periphery of the flat portion 28.

[0023] A hole portion 28B is provided in the center of the flat portion 28, and a lower end portion of a rotating shaft 28A that extends upward in the vertical direction is mounted. The rotating shaft 28A is supported by the main body of the mounting head 12 by passing through an upper and lower pair of bearings 31, for example. The upper end portion of the rotating shaft 28A is connected to a rotating shaft 26A of the turntable rotating motor 26, and the turntable 24 is intermittently rotated by the turntable rotating motor 26.

[0024] In the inclined portion 30, a plurality of grooves 30A along a generatrix are formed at a given interval along the circumferential direction, and the plurality of grooves 30A can accommodate the conductive pins P. In the flat portion 28 outer periphery portion adjacent to the inclined portion 30 corresponding to the lower end of the grooves 30A, a vertical hole 30B that can accommodate the conductive pins P from the grooves 30A is formed, respectively.

[0025] The lower surface of the turntable 24 is supported by the bottom surface 12A of the main body of the mounting head 12 in a manner of surrounding the rotating shaft 28A, and the punch nozzle 22 is provided at a position (flat portion 28 outer periphery portion) of the bottom surface 12A corresponding to the hole 30B. The punch shaft 18 that can be pushed out to the punch nozzle 22 by passing through the hole 30B is vertically arranged above the punch nozzle 22, and the upper end portion of the punch shaft 18 is supported by a shaft holding portion 32.

[0026] The shaft holding portion 32 is fitted in the hollow ejection rod 34 which is open downward, and is held so as to be able to be raised and lowered with respect to the ejection rod 34. The upper end portion of the shaft holding portion 32 is caught in a step portion formed in the inner peripheral portion of the ejection rod 34, and is prevented from falling off from the ejection rod 34. The lower end portion of the shaft holding portion 32 extends downward from the lower end open portion of the ejection rod 34, and the punch shaft 18 further extends downward from the lower end of the shaft holding portion 32. On the other hand, an ejection head 34A is installed at the upper end of the ejection rod 34, and a coil spring 36 is fitted in the ejection rod 34 between the ejection head 34A and the upper end of the shaft holding portion 32. Thus, the shaft holding portion 32 held in the ejection rod 34 is forced downward with respect to the ejection rod 34.

[0027] In addition, the ejection rod 34 is arranged so as to be able to be raised and lowered in a hole 38 provided in the main body of the mounting head 12, and a coil spring 40 is wound on the outside of the hole 38. The coil spring 40 is sandwiched between the hole 38 and the ejection head 34A, and the ejection rod 34 is forced upward with respect to the main body of the mounting head 12 by the coil spring 40. An eccentric cam (drive portion) 42 which rotates around a horizontal axis is abutted against the top surface of the ejection head 34A, and the rotation axis of the eccentric cam 42 is connected to the rotation axis 20A of the punch shaft drive motor 20.

[0028] That is, if the eccentric cam 42 is rotated by the punch shaft drive motor 20, the ejection head 34A (ejection rod 34) is pressed down against the force of the coil spring 40, and the shaft holding portion 32 and the punch shaft 18 are lowered together with the ejection rod 34. The lowering of the ejection rod 34 by the punch shaft drive motor 20 is performed in a state in which any one of the holes 30B of the turret 24 is positioned directly above the punch nozzle 22 by the turret rotation motor 26.

[0029] That is, if one of the holes 30B is positioned at the punch nozzle 22, the rotation of the turret 24 is stopped, the ejection rod 34 is pressed down, and the punch shaft 18 is pushed out to the punch nozzle 22 through the hole 30B. Thus, the conductive pin P housed in the hole 30B in a vertical posture from the slot 30A is punched from the punch nozzle 22. Furthermore, the rotational position of the turret 24 is detected by the encoder 29 provided to the rotation axis 28A, for example, above the turret 24. In addition, according to the resistance of the conductive pin P which is punched, the shaft holding portion 32 can be raised in the ejection rod 34 against the force of the coil spring 36, and excessive force is prevented from being applied to the conductive pin P.

[0030] On the other hand, as described above, conductive pins P on multiple turntables 24 are simultaneously supplied from the inlet 14. The inlet 14 has an inverted pyramidal opening, and for example, 1000 to 2000 conductive pins P are simultaneously inserted in a random posture. A conductive pin supply path 44 is provided inside the mounting head 12 body, which connects the inlet 14 to the top of the turntable 24. The conductive pins P inserted into the inlet 14 fall within the conductive pin supply path 44 due to their own weight and are supplied to the flat portion 28 of the turntable 24.

[0031] Figure 6 This is a perspective view of the turntable 24 in this embodiment, viewed from above. Figure 7 (a) is a top view of turntable 24. Figure 7 (b) is a bottom view. Additionally, Figure 8 This is a longitudinal sectional view passing through the center of rotation of turntable 24. Figure 9 It is an enlarged sectional view showing the structure around a slot 30A and a hole 30B.

[0032] like Figures 6-8 As shown, the turntable 24 is shaped such that a disc-shaped planar portion 28 is surrounded by a mortar-shaped inclined portion 30. Grooves 30A, suitable for the size of the conductive pin P, are formed at given intervals along the generatrix of the inclined portion 30. Holes 30B, perpendicular to the planar portion 28, are provided in the planar portion 28 at positions corresponding to the lower ends of each groove 30A (along the periphery of the planar portion 28 of the inclined portion 30). The lower end of the groove 30A connects to the upper end of the hole 30B. Additionally, a hole 28B is provided in the center of the planar portion 28 for mounting the rotating shaft 28A.

[0033] The conductive pins P, dropped into the flat portion 28 through the inlet 14, are randomly distributed on the turntable 24 and are pushed radially outward as the turntable 24 rotates. The conductive pins P are pressed against the inclined portion 30 by centrifugal force or the like on the outer periphery of the flat portion 28, and a portion of them stand upright and fill the groove 30A. For example... Figure 9 As shown, the conductive pin P, which is filled in the groove 30A, slides down along the groove 30A due to its own weight, falls into the hole 30B, and is filled in an upright state. Alternatively, the filling of the conductive pin P into the groove 30A can be facilitated by blowing air supplied from an air supply source (not shown) onto the conductive pin P, which is pressed and concentrated into the inclined portion 30.

[0034] Based on the signal from the encoder 29, when any one of the holes 30B is positioned directly above the press nozzle 22, the rotation of the turntable 24 is stopped, and the press shaft 18 is lowered. By this, the conductive pin P charged in the hole 30B is pushed out of the press nozzle 22 by the press shaft 18, and is mounted to the desired position of the electronic circuit substrate. Further, in order to position the press nozzle 22 of the mounting head 12 to the desired position of the electronic circuit substrate, the electronic circuit substrate is moved by a control mechanism, a driving mechanism, not shown, during the rotation of the turntable 24.

[0035] Figure 10 is a side view showing an example of a semiconductor package in which the conductive pins P are mounted. Figure 10 The illustrated semiconductor package is, for example, a package in which electronic circuit substrates S1, S2 of substantially the same size are overlapped in two layers. A semiconductor chip C1 is mounted on the upper surface of the electronic circuit substrate S1, and a semiconductor chip C2 is mounted on the upper surface of the electronic circuit substrate S2. A plurality of solder balls W are provided on the lower surface of the electronic circuit substrate S1, and a plurality of conductive pins P are mounted on the upper surface of the electronic circuit substrate S1 in a manner of surrounding the semiconductor chip C1 by the conductive pin mounting apparatus 10 of the present embodiment. The electronic circuit substrate S2 is mounted on the conductive pins P.

[0036] As described above, according to the conductive pin mounting apparatus of the present embodiment, by the article upstanding apparatus provided in the mounting head, a large number of cylindrical articles (conductive pins) charged into the mounting head can be sequentially charged into the holes for press of the conductive pins in an upstanding state, and thus the upstanding processing of the cylindrical conductive pins is highly efficient. By this, the mounting process is highly efficient, and the time can be greatly shortened.

[0037] BRIEF DESCRIPTION OF THE DRAWINGS 10 conductive pin mounting apparatus 12 mounting head 14 charging port 16 article upstanding apparatus 18 press shaft 20 press shaft driving motor (driving portion) 22 press nozzle 24 turntable 30 inclined portion 30A slot 30B hole 42 eccentric cam (driving portion) C1, C2 semiconductor chip P conductive pin (cylindrical article) S1, S2 electronic circuit substrate

Claims

1. An object-standing device for uprighting a cylindrical object, characterized in that it comprises: A turntable having a flat portion and an inclined portion, the flat portion supporting the object, and the inclined portion disposed on the outer periphery of the flat portion; and A turntable rotation unit that rotates the turntable. Multiple grooves are formed in the inclined portion, and holes corresponding to each groove are arranged on the outer periphery of the flat portion. As the turntable rotates, the object moving along the grooves fills the holes due to its own weight and stands upright.

2. The object uprighting device according to claim 1, characterized in that, The cylindrical object is a conductive pin.

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