Circuit board golden finger uncovering method and circuit board

Abstract

The invention discloses a method for uncovering golden fingers of a circuit board, which comprises the following steps of: before a multilayer board and an outer-layer board are laminated to form the circuit board, additionally arranging a protective plate on the multilayer board, forming a protective groove matched with a golden finger area in shape on the protective plate, covering the protective plate on the outer side of the golden finger area, and enabling the protective groove to face adhesive paper, so that the golden fingers are uncovered by the protective plate. In the subsequent uncovering process, the position, corresponding to the golden finger area, of the surface of the circuit board can be milled inwards to the protection groove in a depth-controlled manner, so that the multilayer board located on the outer side of the golden finger area is removed, the gummed paper is exposed, the gummed paper can be exposed only by penetrating through the bottom wall of the protection groove without being milled downwards to the gummed paper on the surface of the golden finger area in the whole process, and the production efficiency is improved. At the moment, the milling cutter is not in direct contact with the golden finger area, so that the golden finger area can be protected, and the golden finger is prevented from being damaged in the cover opening process. In addition, the invention further discloses the circuit board formed by the golden finger cover opening method of the circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a method for opening the gold fingers of a circuit board and the circuit board itself. Background Technology

[0002] When processing circuit boards, the inner layer circuitry is typically created first through etching, and then multiple gold fingers are formed by creating separation grooves at the edges. Adhesive tape is then applied to each gold finger, and the boards are laminated together to form the circuit board. After lamination, the surface of the circuit board is opened to expose the gold fingers, and the adhesive tape is removed. However, current technology generally uses a router to mechanically cut downwards from the surface of the circuit board to remove the copper layer on the outside of the gold fingers and expose them. During this mechanical process, the router can easily scratch the gold fingers, affecting the electrical performance of the circuit board and even rendering it unusable. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a method for opening the gold finger cover of a circuit board, which can protect the gold finger area and avoid damage to the gold finger during the opening process.

[0004] The present invention also proposes a circuit board formed by the above-mentioned gold finger opening method of the circuit board.

[0005] A method for opening the gold fingers of a circuit board according to a first aspect embodiment of the present invention includes the following steps: S1: Provide a multilayer board, the multilayer board being formed by stacking and pressing multiple inner layer boards, the surface of the multilayer board having a gold finger area for setting gold fingers, the gold finger area extending to the edge of the multilayer board; S2: Apply adhesive tape to the surface of the gold finger area; S3: Provide a protective plate, the protective plate having a protective groove adapted to the shape of the gold finger area, the protective plate is placed on the outside of the gold finger area, and the protective groove faces the adhesive paper; S4: Multiple outer layer boards are stacked on both sides of the multilayer board and pressed together to form a circuit board, and an outer layer circuit pattern is made on the surface of the circuit board; S5: Open the cover, and drill inward from the position on the surface of the circuit board corresponding to the gold finger area to the protective groove, remove the multilayer board located outside the gold finger area and expose the adhesive paper; S6: Remove the protective plate and peel off the adhesive tape.

[0006] The method for opening the gold fingers of a circuit board according to an embodiment of the present invention has at least the following beneficial effects: In the circuit board gold finger unpacking method of this invention embodiment, before the circuit board is formed by laminating the multilayer board and the outer layer board, a protective plate is first added to the multilayer board. The protective plate has a protective groove adapted to the shape of the gold finger area. The protective plate is placed on the outside of the gold finger area, with the protective groove facing the adhesive tape. Thus, in the subsequent unpacking process, the depth can be controlled from the position on the circuit board surface corresponding to the gold finger area to the protective groove, thereby removing the multilayer board located outside the gold finger area and exposing the adhesive tape. The whole process does not require drilling down to the adhesive tape on the surface of the gold finger area. It is only necessary to penetrate the bottom wall of the protective groove to expose the adhesive tape. At this time, the router does not directly contact the gold finger area, thus protecting the gold finger area and avoiding damage to the gold fingers during the unpacking process. In addition, since the depth only needs to be controlled to the protective groove when unpacking, the protective groove can provide a certain error margin for the depth control router, thus reducing the accuracy requirements of the depth control router during unpacking, making the unpacking process more convenient and simple.

[0007] According to some embodiments of the present invention, in step S3, when the protective plate is placed on the outside of the gold finger area, the periphery of the protective groove is arranged around the outer periphery of the gold finger area, so that the protective groove covers the gold finger area.

[0008] According to some embodiments of the present invention, step S1 includes: S1.1: Provide multiple inner layer boards, and fabricate inner layer circuit patterns on the surface of the inner layer boards; S1.2: Multiple inner layer boards are pressed together using a prepreg to form the multilayer board, and a secondary outer layer circuit pattern is formed on the surface of the multilayer board, wherein the secondary outer layer circuit pattern is located on one side of the gold finger area.

[0009] According to some embodiments of the present invention, step S1.2 further includes: opening a plurality of partition grooves in the gold finger area to form a plurality of spaced gold fingers in the gold finger area; In step S2, the adhesive tape is applied to the surface of each gold finger.

[0010] According to some embodiments of the present invention, in step S6, after removing the protective plate and peeling off the adhesive paper, a plurality of partition grooves are machined downward from the surface of the gold finger area to form a plurality of spaced gold fingers in the gold finger area.

[0011] According to some embodiments of the present invention, step S2 includes: S2.1: Apply the adhesive tape to the surface of the multilayer board so that the adhesive tape covers the gold finger area; S2.2: Remove the adhesive tape portion extending beyond the gold finger area using a laser.

[0012] According to some embodiments of the present invention, step S1.2 includes: S1.2.1: Multiple inner layer boards are stacked and pressed together using prepreg to form the multilayer board; S1.2.2: Cutting the edges of the multilayer board according to the preset size to remove excess edges; S1.2.3: The outermost layer circuit pattern is created on the surface of the multilayer board by full-board electroplating, pattern transfer, and etching; S1.2.4: Inspect the multilayer board; S1.2.5: Perform browning treatment on the multilayer board; S1.2.6: Bake the multilayer board.

[0013] According to some embodiments of the present invention, step S4 includes: S4.1: The circuit board is formed by stacking and pressing multiple outer layers with prepreg on both sides of the multilayer board; S4.2: Trim the edges of the circuit board according to the preset dimensions; S4.3: Drill functional holes and / or non-functional holes on the circuit board; S4.4: Perform copper plating and board electroplating on the circuit board; S4.5: The outer layer circuit pattern is created on the surface of the circuit board by full-board electroplating, pattern transfer, and etching.

[0014] According to some embodiments of the present invention, the following steps are further included after step S6: S7.1: Perform browning treatment on the circuit board; S7.2: A protective film is pressed onto the surface of the circuit board; S7.3: Edge trimming, trimming the edges of the circuit board; S7.4: Perform immersion gold treatment on the circuit board; S7.5: Print characters on the surface of the circuit board; S7.6: Gong plate; S7.7: Perform AVI visual inspection on the circuit board; S7.8: Package the circuit board.

[0015] The circuit board according to a second aspect of the present invention is formed by the gold finger opening method of the circuit board described in any of the above embodiments.

[0016] The circuit board according to embodiments of the present invention has at least the following beneficial effects: By using the gold finger opening method of the circuit board according to any of the above embodiments, the gold finger area can be protected, avoiding damage to the gold finger area during the opening process, thereby improving the processing quality of the circuit board.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a flowchart of a method for opening the gold fingers of a circuit board according to an embodiment of the present invention. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0021] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0022] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0023] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] Reference Figure 1 An embodiment of the present invention provides a method for opening the gold fingers of a circuit board, comprising the following steps: S1: Provides a multilayer board, which is formed by laminating multiple inner layers. The surface of the multilayer board has a gold finger area for setting gold fingers, which extends to the edge of the multilayer board. S2: Apply adhesive tape to the surface of the gold finger area; S3: Provide a protective plate with a protective groove that matches the shape of the gold finger area. Cover the outside of the gold finger area with the protective plate and make the protective groove face the adhesive paper. S4: Multiple outer layer boards are stacked on both sides of the multilayer board and pressed together to form a circuit board, and outer layer circuit patterns are made on the surface of the circuit board. S5: Open the cover, and from the position on the circuit board surface corresponding to the gold finger area, drill inward to the protective groove, remove the multilayer board located outside the gold finger area and expose the adhesive tape. S6: Remove the protective board and peel off the adhesive tape.

[0025] In the circuit board gold finger unpacking method of this invention embodiment, before the circuit board is formed by laminating the multilayer board and the outer layer board, a protective plate is first added to the multilayer board. The protective plate has a protective groove adapted to the shape of the gold finger area. The protective plate is placed on the outside of the gold finger area, with the protective groove facing the adhesive tape. Thus, in the subsequent unpacking process, the depth can be controlled from the position on the circuit board surface corresponding to the gold finger area to the protective groove, thereby removing the multilayer board located outside the gold finger area and exposing the adhesive tape. The whole process does not require drilling down to the adhesive tape on the surface of the gold finger area. It is only necessary to penetrate the bottom wall of the protective groove to expose the adhesive tape. At this time, the router does not directly contact the gold finger area, thus protecting the gold finger area and avoiding damage to the gold fingers during the unpacking process. In addition, since the depth only needs to be controlled to the protective groove when unpacking, the protective groove can provide a certain error margin for the depth control router, thus reducing the accuracy requirements of the depth control router during unpacking, making the unpacking process more convenient and simple.

[0026] In some embodiments, in step S3, when the protective plate is placed on the outside of the gold finger area, the periphery of the protective groove is surrounded around the outer periphery of the gold finger area, so that the protective groove covers the gold finger area, thereby providing all-round protection for the gold finger area and further reducing the risk of damage to the gold finger area.

[0027] In some embodiments, step S1 includes: S1.1: Provide multiple inner layer boards and fabricate inner layer circuit patterns on the surface of the inner layer boards; S1.2: Multiple inner layer boards are pressed together using a prepreg to form a multilayer board, and a secondary outer layer circuit pattern is made on the surface of the multilayer board. The secondary outer layer circuit pattern is located on one side of the gold finger area.

[0028] By adopting the above steps, it is possible to easily create inner layer circuit patterns and secondary outer layer circuit patterns, and reserve a gold finger area on one side of the secondary outer layer circuit pattern.

[0029] It is understandable that step S1.1 specifically includes the following sub-steps: S1.1.1: Cutting materials to obtain multiple inner layer boards; S1.1.2: The inner layer circuit pattern is created on the surface of the inner layer board by exposure and etching; S1.1.3: Perform AOI inspection on each inner layer board; S1.1.4: Perform browning treatment on each inner layer board; By adopting the above steps, the fabrication of the inner layer circuit patterns can proceed smoothly. After the inner layer circuit patterns are fabricated, AOI optical inspection is performed on each inner layer board. This allows for the timely detection and screening of defective inner layer boards, preventing defective products from affecting the normal production and processing of the circuit board in subsequent processes, thereby improving the processing quality of the circuit board. Furthermore, after AOI inspection, browning treatment is applied to each inner layer board, which improves the bonding force between the inner layer board and the prepreg during subsequent lamination, ensuring the reliability of subsequent inner layer board lamination, and also improving the heat resistance and stability of the inner layer boards.

[0030] In some embodiments, step S1.2 further includes: opening a plurality of partition grooves in the gold finger area to form a plurality of spaced gold fingers in the gold finger area; In step S2, adhesive tape is applied to the surface of each gold finger.

[0031] By using the above method, after multiple inner layer boards are pressed together to form a multilayer board using a prepreg, the surface of the multilayer board is divided into a circuit area and a gold finger area. A secondary outer layer circuit pattern is made on the circuit area, and multiple partition grooves are opened in the gold finger area to form multiple spaced gold fingers. When applying adhesive tape, adhesive tape is applied to each gold finger to protect the gold fingers.

[0032] It is understood that when creating the partition groove in the gold finger area, the partition groove can be processed by mechanical processing or chemical processing, and the present invention does not specifically limit this.

[0033] It is understood that the processing of the gold fingers can be carried out in step S1.2 or step S6. Specifically, in some embodiments, in step S6, after removing the protective plate and peeling off the adhesive paper, a deep milling is performed from the surface of the gold finger area downward to process multiple partition grooves, so as to form multiple spaced gold fingers in the gold finger area.

[0034] By adopting the above steps, a whole gold finger area is reserved on one side of the outermost layer circuit pattern during multilayer board fabrication. At this point, the gold finger area is a copper foil area. Adhesive tape is applied to the entire gold finger area, and after covering it with a protective plate, the multilayer board and outer layer board are pressed together. After opening the cover and removing the protective plate and adhesive tape, multiple separator grooves for separating the gold fingers are machined in the gold finger area using a depth-controlled milling machine, thus forming multiple spaced gold fingers in the gold finger area. Since the separator grooves and gold fingers are machined after the multilayer board and outer layer board are pressed together, it avoids adhesive overflow during the pressing process, preventing adhesive from flowing into the separator grooves. Furthermore, when applying the adhesive tape, only a whole piece of tape needs to be applied to the gold finger area, greatly simplifying the tape application process and shortening the application time, which is beneficial for improving the processing efficiency of the gold fingers.

[0035] In some embodiments, step S2 includes: S2.1: Apply adhesive tape to the surface of the multilayer board so that the tape covers the gold finger area; S2.2: Remove the adhesive tape extending beyond the gold finger area using a laser.

[0036] This allows the adhesive tape to precisely cover the entire gold finger area without extending beyond it, thus preventing adhesive overflow onto other parts of the circuit board during subsequent lamination. This helps ensure the cleanliness of the circuit board and the quality of lamination.

[0037] In some embodiments, step S1.2 may specifically include the following steps: S1.2.1: Multiple inner layer boards are stacked and pressed together using prepreg to form a multilayer board; S1.2.2: Trim the edges of the multilayer board to remove excess edges and maintain the preset shape of the multilayer board; S1.2.3: The outermost layer circuit pattern is created on the surface of a multilayer board through full-board electroplating, pattern transfer, and etching; S1.2.4: Inspect the multilayer boards to promptly identify and screen out defective multilayer boards, preventing defective products from affecting the normal production and processing of circuit boards in subsequent processes; S1.2.5: Browning treatment of multilayer boards can improve the bonding force between the multilayer board and the prepreg during subsequent lamination, ensuring the reliability of subsequent multilayer board lamination, and at the same time improving the heat resistance and stability of the multilayer board. S1.2.6: Bake the multilayer board to dry off excess moisture inside the multilayer board.

[0038] It is understood that when it is necessary to process the gold fingers in step S1.2, the processing of the gold fingers can be placed in step S1.2.3, that is, to make the outermost layer circuit pattern on the surface of the multilayer board and process the gold fingers in the gold finger area. As for the order of making the outermost layer circuit and the gold fingers in step S1.2.3, the present invention does not make specific limitations.

[0039] In some embodiments, step S4 includes: S4.1: A circuit board is formed by stacking and pressing multiple outer layers with prepreg on both sides of a multilayer board; S4.2: Trim the edges of the circuit board according to the preset size, removing the excess parts extending outside the circuit board, so that the circuit board maintains the preset shape; S4.3: Drill functional holes and / or non-functional holes on the circuit board, wherein the functional holes and non-functional holes can be set as blind holes or through holes as needed; S4.4: Apply copper plating and board electroplating to the circuit board to attach a copper layer to the inner wall of functional holes and / or non-functional holes. S4.5: The outer layer circuit pattern is created on the surface of the circuit board through full-board electroplating, pattern transfer, and etching.

[0040] In some embodiments, the following steps are included after step S6: S7.1: Apply browning treatment to the circuit board; S7.2: A protective film is laminated onto the surface of the circuit board. The browning treatment can improve the bonding force between the circuit board and the protective film during the lamination process, so that the protective film can more stably cover the surface of the circuit board. S7.3: Edge trimming: Trim the edges of the circuit board to cut it into the required size and shape; S7.4: Apply immersion gold plating to the circuit board; S7.5: Print characters on the surface of the circuit board; S7.6: Gong plate; S7.7: Perform AVI visual inspection on the circuit board. Through AVI visual inspection, the appearance defects of the circuit board 100 can be accurately identified, such as line gaps, burrs, blurred characters, misaligned characters, missing characters and other appearance defects. S7.8: Package the circuit board.

[0041] A second aspect of the present invention also provides a circuit board, which is formed by processing the gold finger opening method of the circuit board of any of the above embodiments.

[0042] By using the gold finger opening method of the circuit board according to any of the above embodiments, the gold finger area can be protected, avoiding damage to the gold finger area during the opening process, thereby improving the processing quality of the circuit board.

[0043] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A method for opening the gold fingers of a circuit board, characterized in that, Includes the following steps: S1: Provide a multilayer board, the multilayer board being formed by stacking and pressing multiple inner layer boards, the surface of the multilayer board having a gold finger area for setting gold fingers, the gold finger area extending to the edge of the multilayer board; S2: Apply adhesive tape to the surface of the gold finger area; S3: Provide a protective plate, the protective plate having a protective groove adapted to the shape of the gold finger area, the protective plate is placed on the outside of the gold finger area, and the protective groove faces the adhesive paper; S4: Multiple outer layer boards are stacked on both sides of the multilayer board and pressed together to form a circuit board, and an outer layer circuit pattern is made on the surface of the circuit board; S5: Open the cover, and drill inward from the position on the surface of the circuit board corresponding to the gold finger area to the protective groove, remove the multilayer board located outside the gold finger area and expose the adhesive paper; S6: Remove the protective plate and peel off the adhesive tape.

2. The method for opening the gold fingers of a circuit board according to claim 1, characterized in that, In step S3, when the protective plate is placed on the outside of the gold finger area, the periphery of the protective groove is arranged around the outer periphery of the gold finger area, so that the protective groove covers the gold finger area.

3. The method for opening the gold fingers of a circuit board according to claim 1, characterized in that, Step S1 includes: S1.1: Provide multiple inner layer boards, and fabricate inner layer circuit patterns on the surface of the inner layer boards; S1.2: Multiple inner layer boards are pressed together using a prepreg to form the multilayer board, and a secondary outer layer circuit pattern is formed on the surface of the multilayer board, wherein the secondary outer layer circuit pattern is located on one side of the gold finger area.

4. The method for opening the gold fingers of a circuit board according to claim 3, characterized in that, Step S1.2 further includes: opening multiple partition grooves in the gold finger area to form multiple spaced gold fingers in the gold finger area; In step S2, the adhesive tape is applied to the surface of each gold finger.

5. The method for opening the gold fingers of a circuit board according to claim 3, characterized in that, In step S6, after removing the protective plate and peeling off the adhesive paper, a plurality of partition grooves are machined downward from the surface of the gold finger area to form a plurality of spaced gold fingers in the gold finger area.

6. The method for opening the gold fingers of a circuit board according to claim 5, characterized in that, Step S2 includes: S2.1: Apply the adhesive tape to the surface of the multilayer board so that the adhesive tape covers the gold finger area; S2.2: Remove the adhesive tape portion extending beyond the gold finger area using a laser.

7. The method for opening the gold fingers of a circuit board according to claim 3, characterized in that, Step S1.2 includes: S1.2.1: Multiple inner layer boards are stacked and pressed together using prepreg to form the multilayer board; S1.2.2: Cutting the edges of the multilayer board according to the preset size to remove excess edges; S1.2.3: The outermost layer circuit pattern is created on the surface of the multilayer board by full-board electroplating, pattern transfer, and etching; S1.2.4: Inspect the multilayer board; S1.2.5: Perform browning treatment on the multilayer board; S1.2.6: Bake the multilayer board.

8. The method for opening the gold fingers of a circuit board according to claim 1, characterized in that, Step S4 includes: S4.1: The circuit board is formed by stacking and pressing multiple outer layers with prepreg on both sides of the multilayer board; S4.2: Trim the edges of the circuit board according to the preset dimensions; S4.3: Drill functional holes and / or non-functional holes on the circuit board; S4.4: Perform copper plating and board electroplating on the circuit board; S4.5: The outer layer circuit pattern is created on the surface of the circuit board by full-board electroplating, pattern transfer, and etching.

9. The method for opening the gold fingers of a circuit board according to claim 1, characterized in that, The following steps are included after step S6: S7.1: Perform browning treatment on the circuit board; S7.2: A protective film is pressed onto the surface of the circuit board; S7.3: Edge trimming, trimming the edges of the circuit board; S7.4: Perform immersion gold treatment on the circuit board; S7.5: Print characters on the surface of the circuit board; S7.6: Gong plate; S7.7: Perform AVI visual inspection on the circuit board; S7.8: Package the circuit board.

10. A circuit board, characterized in that, It is formed by the gold finger opening method of the circuit board as described in any one of claims 1 to 9.

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