Annular vacuum chuck for carrying non-contact silicon wafers

Abstract

The invention relates to the field of silicon wafer carrying, in particular to a non-contact type silicon wafer carrying annular vacuum chuck which comprises a main cylinder, a first adsorption assembly used for adsorbing the circle center part of a silicon wafer is arranged on the main cylinder, the outer surface of the main cylinder is fixedly connected with connecting frames arranged in a circumferential array, and each connecting frame is provided with a guide groove. A first adsorption assembly used for adsorbing the edge of a silicon wafer is arranged in the main barrel, a second adsorption assembly used for adsorbing the edge of the silicon wafer is arranged in the auxiliary barrel, an annular adsorption structure formed by combining the first adsorption assembly of the main barrel and the second adsorption assembly of the auxiliary barrel is adopted, and the second adsorption assembly can synchronously adsorb the edge of the silicon wafer; according to the silicon wafer carrying device, the short adsorption force of the outer side area of the silicon wafer is made up, the stress of the silicon wafer is more uniform, the stability in the carrying process is greatly improved, the probability that the silicon wafer slides off and deviates due to unstable adsorption is effectively reduced, and the carrying requirement of the high-quality and pollution-free silicon wafer is met.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer handling technology, and more specifically to a ring-shaped vacuum chuck for non-contact silicon wafer handling. Background Technology

[0002] Vacuum chucks based on silicon wafer adsorption are devices that achieve adsorption and gripping by controlling airflow and adjusting local air pressure. Adsorption and handling of silicon wafers play a crucial role in their manufacturing process, and the performance of adsorption and handling has a significant impact on the quality of the silicon wafers. With the urgent industrial demand for high-quality, pollution-free silicon wafers, Bernoulli chucks, which can achieve low-damage and high-efficiency handling of silicon wafers under certain conditions, have gained widespread attention.

[0003] Chinese patent CN221102044U discloses a Bernoulli chuck assembly that can stably limit the semiconductor wafer in both the lateral and forward directions, avoiding damage to the semiconductor wafer during the adsorption process by the Bernoulli chuck, improving the finished product quality of the semiconductor wafer and reducing the defect rate.

[0004] Although the device uses a limiting cylinder to achieve lateral positioning on the adsorption surface, it still has some problems: First, although the lateral limiting cylinder can achieve the positioning effect, it is easy for the silicon wafer to collide with the limiting cylinder when adsorbing the silicon wafer, causing damage to the silicon wafer; Second, the method of adsorbing and fixing only the center of the silicon wafer will cause the gas flow rate on the outer part of the suction cup to decrease, that is, the area with too low flow rate cannot generate enough negative pressure to ensure the stability of the silicon wafer.

[0005] Therefore, the present invention provides an annular vacuum chuck for non-contact silicon wafer handling to solve the above-mentioned problems. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art, the present invention provides a ring-shaped vacuum chuck for non-contact silicon wafer handling. This solves the problems that, although the lateral limiting cylinder can achieve the limiting effect, it is easy for the silicon wafer to collide with the limiting cylinder during adsorption, causing damage to the silicon wafer. In addition, the method of adsorbing and fixing only the center of the silicon wafer will result in a decrease in the gas flow rate on the outer part of the chuck, that is, the area with too low a flow rate cannot generate enough negative pressure to ensure the stability of the silicon wafer.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A non-contact silicon wafer handling ring-shaped vacuum chuck includes a main cylinder, on which a first adsorption component for adsorbing the center of the silicon wafer is disposed. A connecting frame arranged in a circumferential array is fixedly connected to the outer surface of the main cylinder. Each connecting frame has a guide groove, and an auxiliary cylinder is slidably connected in each guide groove. A second adsorption component for adsorbing the edge of the silicon wafer is disposed in each auxiliary cylinder. An adjustment component and a driving component are disposed on the main cylinder. The driving component drives the adjustment component to adjust the position of the auxiliary cylinder in the guide groove, and the second adsorption component synchronously adjusts the adsorption position of the silicon wafer by changing the position of the auxiliary cylinder.

[0008] In some embodiments, the first adsorption assembly includes a main disc fixedly connected to the bottom surface of the main cylinder and a first jetting component fixedly connected to the main cylinder. The bottom surface of the main disc is provided with a first air outlet ring groove, and one end of the first jetting component penetrates the main disc and extends into the first air outlet ring groove.

[0009] In some embodiments, a first air inlet connector is installed on the main cylinder, a first conical surface and a second conical surface are formed inside the first jet component, and a conical cavity is formed by the first conical surface and the second conical surface. A first air outlet in a circular array is formed at one end of the first jet component located in the first air outlet ring groove. The first air outlet and the first air inlet connector are both connected to the conical cavity. A first silicone sheet in a circular array is fixedly connected to the bottom surface of the main disc, and a gap is left between adjacent first silicone sheets.

[0010] In some embodiments, the second adsorption component includes an auxiliary disc fixedly connected to the bottom surface of the auxiliary cylinder and a second jet member fixedly connected to the auxiliary cylinder. The bottom surface of the auxiliary disc is provided with a second air outlet ring groove, and one end of the second jet member passes through the auxiliary disc and extends into the second air outlet ring groove.

[0011] In some embodiments, a second air inlet connector is installed on the auxiliary cylinder, a third conical surface and a fourth conical surface are provided inside the second jet component, and a conical cavity is formed by the third conical surface and the fourth conical surface. A second air outlet in a circular array is provided at one end of the second jet component located in the second air outlet ring groove. The second air outlet and the second air inlet connector are both connected to the conical cavity. A second silicone sheet in a circular array is fixedly connected to the bottom surface of the auxiliary disc, and a gap is left between adjacent second silicone sheets.

[0012] In some embodiments, the adjustment assembly includes a connecting seat fixedly connected to the auxiliary cylinder and a rotating cylinder rotatably connected to the main cylinder. A turntable is fixedly connected to the rotating cylinder, and a series of hinged rods arranged in a circular array are rotatably connected to the turntable. The ends of the hinged rods away from the turntable are rotatably connected to the connecting seat. Two limiting rings are fixedly connected to the auxiliary cylinder, and the two limiting rings are located above and below the connecting frame, respectively.

[0013] In some embodiments, the drive assembly includes a control box, in which a worm gear is rotatably connected, and a worm wheel is fixedly connected to the outer surface of the rotating drum, with the worm wheel meshing with the worm gear.

[0014] In some embodiments, one end of the worm gear passes through the control box and is fixedly connected to a screw block.

[0015] In some embodiments, a motor is mounted on the control box, and the output shaft of the motor is mounted on a worm gear via a coupling.

[0016] In some embodiments, a connecting assembly is also included, which includes a fixed base fixedly connected to the main cylinder and an mounting plate disposed above the fixed base. The upper surface of the control box is fixedly connected to the fixed base, and two sets of connecting columns are fixedly connected to the upper surface of the fixed base. The mounting plate is mounted on the connecting columns, and the mounting plate is provided with a first mounting hole, a second mounting hole, and a weight reduction groove.

[0017] In some embodiments, one side of the mounting plate is welded to the end of the connecting post away from the fixing seat.

[0018] In some embodiments, each of the connecting posts is fixedly connected to a screw, and the mounting plate has a through hole that matches the screw. The end of the screw away from the connecting post passes through the through hole and is threaded with a lock nut.

[0019] The beneficial effects of this invention are as follows: 1. The present invention adopts a ring adsorption structure combining the first adsorption component of the main cylinder and the second adsorption component of the auxiliary cylinder. The second adsorption component can simultaneously adsorb the edge of the silicon wafer, making up for the short adsorption force in the outer area of ​​the silicon wafer, making the silicon wafer more uniformly stressed, greatly improving the stability during the handling process, effectively reducing the probability of the silicon wafer slipping or shifting due to unstable adsorption, and ensuring the handling requirements of high-quality, pollution-free silicon wafers.

[0020] 2. Through the coordinated design of the drive component and the adjustment component, the drive component can be selected from manual tightening or motor drive to adapt to different production operation scenarios. The meshing of the worm gear has self-locking properties, which can firmly lock the position of the auxiliary cylinder after adjustment to prevent displacement during transportation. The adjustment component, with the help of the transmission structure of turntable, hinge rod and connecting seat, can drive multiple auxiliary cylinders to move synchronously closer to or away from the main cylinder along the guide groove, thereby adapting to the edge adsorption requirements of silicon wafers of different sizes. There is no need to replace the special suction cup structure, which improves the versatility and adaptability of the equipment and reduces the equipment investment cost of enterprises.

[0021] 3. By using conical cavities for both the first and second adsorption components, the gradually narrowing structure of the cavity exhaust end accelerates the airflow rate. Combined with the arc-shaped exhaust ring groove, a stable and uniform air pressure difference is formed after the pressurized gas is discharged, ensuring the reliability of non-contact adsorption. The silicone sheets on the bottom surfaces of the main and auxiliary disks enhance the adhesion to the silicon wafer without scratching the surface of the silicon wafer. The gaps between adjacent silicone sheets ensure smooth airflow and further optimize the air pressure distribution in the adsorption area. Attached Figure Description

[0022] Figure 1 The three-dimensional representation of the present invention Figure 1 .

[0023] Figure 2 The three-dimensional representation of the present invention Figure 2 .

[0024] Figure 3 This is a schematic diagram of the installation of the auxiliary cylinder in the guide groove in this invention.

[0025] Figure 4 This is a cross-sectional view of the main cylinder in this invention.

[0026] Figure 5 This is a schematic diagram of the structure of the second adsorption component in this invention.

[0027] Figure 6 This is a schematic diagram of the structure after the connecting components are removed in this invention.

[0028] Figure 7 This is a schematic diagram of the connecting component in this invention.

[0029] In the picture: 1. Main cylinder; 2. Connecting frame; 3. Guide groove; 4. Auxiliary cylinder; 5. First adsorption component; 51. Main disc body; 52. First air outlet ring groove; 53. First jet component; 54. First air outlet; 55. First silicone sheet; 56. First air inlet connector; 57. First conical surface; 58. Second conical surface; 6. Second adsorption component; 61. Auxiliary disc body; 62. Second air outlet ring groove; 63. Second jet component; 64. Second air outlet; 65. Second silica gel sheet; 66. Second air inlet connector; 67. Third conical surface; 68. Fourth conical surface; 7. Adjustment assembly; 71. Connecting seat; 72. Hinge rod; 73. Turntable; 74. Rotary drum; 75. Limit ring; 8. Drive assembly; 81. Control box; 82. Worm gear; 83. Worm; 9. Connecting component; 91. Fixing base; 92. Connecting column; 93. Screw; 94. Locking nut; 95. Mounting plate; 96. First mounting hole; 97. Second mounting hole; 98. Weight reduction groove. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0031] Example 1 Please see Figure 1 , Figure 2 , Figure 3 and Figure 6 This invention provides a non-contact silicon wafer handling ring-shaped vacuum chuck, comprising a main cylinder 1, a first adsorption component 5 for adsorbing the center of the silicon wafer on the main cylinder 1, a connecting frame 2 arranged in a circumferential array fixedly connected to the outer surface of the main cylinder 1, a guide groove 3 on each connecting frame 2, an auxiliary cylinder 4 slidably connected in each guide groove 3, a second adsorption component 6 for adsorbing the edge of the silicon wafer in each auxiliary cylinder 4, an adjustment component 7 and a driving component 8 on the main cylinder 1, the driving component 8 driving the adjustment component 7 to adjust the position of the auxiliary cylinder 4 in the guide groove 3, and the second adsorption component 6 synchronously adjusting the adsorption position of the silicon wafer by changing the position of the auxiliary cylinder 4.

[0032] Both the first adsorption component 5 and the second adsorption component 6 can be Bernoulli chucks, which can perform non-contact adsorption of silicon wafers.

[0033] Based on the above embodiments, the adjustment component 7 includes a connecting seat 71 fixedly connected to the auxiliary cylinder 4 and a rotating cylinder 74 rotatably connected to the main cylinder 1. A turntable 73 is fixedly connected to the rotating cylinder 74, and a series of hinge rods 72 arranged in a circular array are rotatably connected to the turntable 73. The end of the hinge rod 72 away from the turntable 73 is rotatably connected to the connecting seat 71. Two limiting rings 75 are fixedly connected to the auxiliary cylinder 4, and the two limiting rings 75 are located above and below the connecting frame 2, respectively.

[0034] To accommodate silicon wafers of different sizes, the rotating cylinder 74 can be rotated on the auxiliary cylinder 4. After the turntable 73 on the rotating cylinder 74 rotates, the hinge rod 72 can drive the auxiliary cylinder 4 to slide inside the guide groove 3 through the connecting seat 71, so that multiple auxiliary cylinders 4 can simultaneously approach or move away from the main cylinder 1, so that the auxiliary cylinders 4 can be placed at the edge of the silicon wafer for adsorption, ensuring the stability of silicon wafer adsorption and transportation.

[0035] Furthermore, the auxiliary cylinder 4 is made stable within the guide groove 3 by means of two limiting rings 75.

[0036] Furthermore, the drive assembly 8 includes a control box 81, a worm gear 83 is rotatably connected inside the control box 81, and a worm wheel 82 is fixedly connected to the outer surface of the rotating drum 74, with the worm wheel 82 meshing with the worm gear 83.

[0037] Because the meshing of the worm gear 82 and the worm 83 is self-locking, the rotation of the worm 83 can drive the worm gear 82 to rotate, thereby providing rotational power to the rotating drum 74.

[0038] There are two ways to provide rotational driving force for the worm gear 83.

[0039] One end of the worm gear 83 passes through the control box 81 and is fixedly connected to a screw block.

[0040] The user holds the screw block with their hand and rotates it according to the size of the silicon wafer to adjust the position of the auxiliary cylinder 4.

[0041] Alternatively, a motor may be installed on the control box 81, and the output shaft of the motor may be mounted on the worm gear 83 via a coupling.

[0042] The motor is started by the controller, which causes its output shaft to drive the worm gear 83 to rotate through the coupling, thereby realizing the electric control of the worm gear 83.

[0043] The working principle of this embodiment is as follows: When using the worm gear 83 to pick up and move silicone of different sizes, the user can choose to operate it manually or electrically according to the actual size of the silicone wafer.

[0044] If the manual mode is selected, the screw block is rotated directly to make the worm gear 83 drive the worm wheel 82 to rotate, which in turn drives the rotating drum 74 to rotate. The turntable 73 on the rotating drum 74 rotates accordingly. Through the linkage between the hinge rod 72 and the connecting seat 71, the auxiliary cylinder 4 is pushed to slide in the guide groove 3. After being adjusted to a suitable position, the second adsorption component 6 on the auxiliary cylinder 4 can adsorb the edge of the silicon wafer.

[0045] If the electric mode is selected, the motor is started via the controller, and the motor's output shaft drives the worm gear 83 to rotate via the coupling, thus adjusting the position of the auxiliary cylinder 4. After adjustment, the first adsorption component 5 on the main cylinder 1 and the second adsorption component 6 on the auxiliary cylinder 4 work simultaneously to perform non-contact adsorption of the silicon wafers, ensuring the stability and safety of the silicon wafers during handling.

[0046] Example 2 The difference between this embodiment and Embodiment 1 is that: Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the first adsorption component 5 includes a main disc body 51 fixedly connected to the bottom surface of the main cylinder 1 and a first jet member 53 fixedly connected inside the main cylinder 1. The bottom surface of the main disc body 51 is provided with a first air outlet ring groove 52, and one end of the first jet member 53 passes through the main disc body 51 and extends into the first air outlet ring groove 52.

[0047] The inner wall of the first air outlet ring groove 52 is arc-shaped, and the bottom surface of the first jet member 53 is on the same horizontal plane as the bottom surface of the main disc body 51. Sufficient space is left between the outer surface of the first jet member 53 and the inner wall of the first air outlet ring groove 52 for airflow.

[0048] Preferably, a first air inlet connector 56 is installed on the main cylinder 1, and a first conical surface 57 and a second conical surface 58 are provided in the first jet member 53, and a conical cavity is formed by the first conical surface 57 and the second conical surface 58. A first air outlet 54 in a circular array is provided at one end of the first jet member 53 located in the first air outlet ring groove 52. The first air outlet 54 and the first air inlet connector 56 are both connected to the conical cavity. A first silicone sheet 55 in a circular array is fixedly connected to the bottom surface of the main disc 51, and a gap is left between adjacent first silicone sheets 55.

[0049] The first air inlet connector 56 is connected to an external positive pressure air source. Pressurized gas is delivered to the conical cavity through the first air inlet connector 56. As the exhaust end of the conical cavity becomes narrower and narrower, the flow rate of the air in the conical cavity can be accelerated. After the gas is discharged through the first air outlet 54, a pressure difference exists between the upper and lower parts of the silicon wafer, thereby completing the adsorption of the silicon wafer and realizing the adsorption and reinforcement of the middle part of the silicon wafer.

[0050] Furthermore, the second adsorption component 6 includes an auxiliary disc 61 fixedly connected to the bottom surface of the auxiliary cylinder 4 and a second jet member 63 fixedly connected inside the auxiliary cylinder 4. The bottom surface of the auxiliary disc 61 is provided with a second air outlet ring groove 62, and one end of the second jet member 63 passes through the auxiliary disc 61 and extends into the second air outlet ring groove 62.

[0051] The inner wall of the second exhaust ring groove 62 is arc-shaped, and the bottom surface of the second jet member 63 is on the same horizontal plane as the bottom surface of the auxiliary disc body 61. Sufficient space is left between the outer surface of the second jet member 63 and the inner wall of the second exhaust ring groove 62 to allow airflow.

[0052] Preferably, a second air inlet connector 66 is installed on the auxiliary cylinder 4, and a third conical surface 67 and a fourth conical surface 68 are provided inside the second jet member 63, forming a conical cavity through the third conical surface 67 and the fourth conical surface 68. A second air outlet 64 in a circular array is provided at one end of the second jet member 63 located in the second air outlet ring groove 62. The second air outlet 64 and the second air inlet connector 66 are both connected to the conical cavity. A second silicone sheet 65 in a circular array is fixedly connected to the bottom surface of the auxiliary disc 61, and a gap is left between adjacent second silicone sheets 65.

[0053] The second air inlet connector 66 is connected to an external positive pressure air source. Pressurized gas is delivered into the conical cavity through the second air inlet connector 66. As the exhaust end of the conical cavity becomes narrower and narrower, the flow rate of the airflow in the conical cavity can be accelerated. After the gas is discharged through the second air outlet 64, a pressure difference exists between the upper and lower parts of the silicon wafer, thereby completing the adsorption of the silicon wafer and reinforcing the adsorption at the edge of the silicon wafer.

[0054] The usage process in this embodiment is as follows: During operation, the first air inlet connector 56 and the second air inlet connector 66 are first connected to an external positive pressure air source. When it is necessary to adsorb and transport the silicon wafer, the pressurized gas enters the conical cavity of the first jet component 53 through the first air inlet connector 56. Due to the special design of the conical cavity, the gas flow rate is accelerated and discharged through the first air outlet 54, forming a pressure difference between the upper and lower parts of the silicon wafer, so that the first silicone sheet 55 is tightly attached to the middle of the silicon wafer, completing the middle adsorption.

[0055] At the same time, pressurized gas enters the conical cavity of the second jet 63 through the second air inlet 66, which also creates a pressure difference, causing the second silicone sheet 65 to fit tightly against the edge of the silicon wafer, thus completing edge adsorption.

[0056] It can ensure that silicon wafers remain stable during handling, avoiding slippage or damage caused by uneven adsorption.

[0057] Furthermore, depending on the size of the silicon wafer, the position of the auxiliary cylinder 4 can be adjusted by the driving component 8 described in Embodiment 1, so that the second adsorption component 6 is always in the optimal adsorption position, thereby further improving the accuracy and stability of adsorption.

[0058] Example 3 The difference between this embodiment and Embodiment 1 is that: Figure 1 , Figure 2 and Figure 7As shown, the system includes a connecting component 9, which includes a fixed base 91 fixedly connected to the main cylinder 1 and a mounting plate 95 disposed above the fixed base 91. The upper surface of the control box 81 is fixedly connected to the fixed base 91. Two sets of connecting columns 92 are fixedly connected to the upper surface of the fixed base 91, and the mounting plate 95 is mounted on the connecting columns 92. The mounting plate 95 has a first mounting hole 96, a second mounting hole 97, and a weight reduction groove 98.

[0059] The weight reduction groove 98 can reduce the weight of the mounting plate 95, and the first mounting hole 96 and the second mounting hole 97 can be connected to the external robotic arm by bolts.

[0060] There are two ways to connect the connecting column 92 to the mounting plate 95.

[0061] One side of the mounting plate 95 is welded to the end of the connecting column 92 away from the fixed seat 91.

[0062] In this connection method, the mounting plate 95 is fixedly connected to the connecting post 92, forming a fixed frame structure.

[0063] Alternatively, each connecting post 92 is fixedly connected to a screw 93, and the mounting plate 95 has a through hole that matches the screw 93. The end of the screw 93 away from the connecting post 92 passes through the through hole and is threaded with a locking nut 94.

[0064] In this connection method, the connecting post 92 and the mounting plate 95 are detachably connected, and the connection between the connecting post 92 and the mounting plate 95 is completed by locking nut 94 and screw 93.

[0065] The usage process in this embodiment is as follows: During installation, choose the appropriate connection method based on your actual needs.

[0066] If structural stability is desired, one side of the mounting plate 95 can be welded to the end of the connecting column 92 away from the fixed seat 91, so that the entire structure forms a stable frame, providing a solid foundation for subsequent adsorption and handling work.

[0067] If easy disassembly and maintenance are required, a connecting screw 93 is fixed on each connecting post 92, and a through hole matching the screw 93 is made on the mounting plate 95. The end of the screw 93 away from the connecting post 92 is passed through the through hole and then threaded to the locking nut 94. In this way, when the equipment needs to be repaired or parts replaced, the mounting plate 95 can be easily removed from the connecting post 92 by simply unscrewing the locking nut 94, which is convenient and quick.

[0068] It should be noted that in the description of this invention, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0069] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0070] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A ring-shaped vacuum chuck for non-contact silicon wafer handling, characterized in that, It includes a main cylinder (1), at least four connecting frames (2), a first adsorption assembly (5), a second adsorption assembly (6), an adjustment assembly (7), and a drive assembly (8); The first adsorption component (5) is disposed on the main cylinder (1) and is used to adsorb the center of the silicon wafer; The connecting frame (2) is circumferentially fixed to the outer surface of the main cylinder (1). Each connecting frame (2) is provided with a guide groove (3), and an auxiliary cylinder (4) is slidably connected in each guide groove (3). The second adsorption component (5) is disposed on the auxiliary cylinder (4) and is used to adsorb the edge of the silicon wafer; The adjustment component (7) and the driving component (8) are both disposed on the main cylinder (1). The driving component (8) drives the adjustment component (7) to adjust the position of the auxiliary cylinder (4) in the guide groove (3). The second adsorption component (6) adjusts the adsorption position of the silicon wafer synchronously by changing the position of the auxiliary cylinder (4).

2. The annular vacuum chuck for non-contact silicon wafer handling according to claim 1, characterized in that, The first adsorption component (5) includes a main disk (51) fixedly connected to the bottom surface of the main cylinder (1) and a first jet component (53) fixedly connected inside the main cylinder (1). The bottom surface of the main plate (51) is provided with a first air outlet groove (52); One end of the first jet component (53) penetrates the main disc body (51) and extends into the first exhaust ring groove (52).

3. The annular vacuum chuck for non-contact silicon wafer handling according to claim 2, characterized in that, The first adsorption component (5) includes a first air inlet connector (56), a first conical surface (57) and a second conical surface (58) formed on the first jet component (53), and a first silicone sheet (55) fixedly connected to the bottom surface of the main disk body (51) in a circumferential array. One end of the first air inlet connector (56) is installed on the main cylinder (1); The first jet component (53) forms a conical cavity through a first conical surface (57) and a second conical surface (58); The first jet component (53) has a first air outlet (54) arranged in a circular array at one end within the first air outlet ring groove (52). Both the first air outlet (54) and the first air inlet connector (56) are connected to the conical cavity. A gap is left between adjacent first silicone sheets (55).

4. The annular vacuum chuck for non-contact silicon wafer handling according to claim 1, characterized in that, The second adsorption component (6) includes an auxiliary disc (61) fixedly connected to the bottom surface of the auxiliary cylinder (4) and a second jet component (63) fixedly connected inside the auxiliary cylinder (4). The bottom surface of the auxiliary plate (61) is provided with a second air outlet ring groove (62). One end of the second jet (63) passes through the auxiliary disc body (61) and extends into the second exhaust ring groove (62).

5. The annular vacuum chuck for non-contact silicon wafer handling according to claim 4, characterized in that, The second adsorption component (6) includes a second air inlet connector (66), a third conical surface (67) and a fourth conical surface (68) opened in the second jet component (63), and a second silicone sheet (65) fixedly connected to the bottom surface of the auxiliary disk body (61) in a circumferential array. One end of the second air inlet connector (66) is installed on the auxiliary cylinder (4); The second jet (63) forms a conical cavity through the third conical surface (67) and the fourth conical surface (68). The second jet (63) is provided with a second air outlet (64) arranged in a circular array at one end in the second air outlet ring groove (62). The second air outlet (64) and the second air inlet (66) are both connected to the conical cavity. A gap is left between adjacent second silicone sheets (65).

6. The annular vacuum chuck for non-contact silicon wafer handling according to claim 1, characterized in that, The adjustment assembly (7) includes a connecting seat (71) fixedly connected to the auxiliary cylinder (4), a rotating cylinder (74) rotatably connected to the main cylinder (1), and two limiting rings (75) fixedly connected to the auxiliary cylinder (4). A turntable (73) is fixedly connected to the rotating cylinder (74), and a series of hinge rods (72) arranged in a circular array are rotatably connected to the turntable (73), with one end of the hinge rod (72) away from the turntable (73) rotatably connected to the connecting seat (71). The two limiting rings (75) are located above and below the connecting frame (2), respectively.

7. The annular vacuum chuck for non-contact silicon wafer handling according to claim 6, characterized in that, The drive assembly (8) includes a control box (81) and a worm gear (82) fixedly connected to the outer surface of the drum (74). The control box (81) is rotatably connected to a worm gear (83), and the worm wheel (82) meshes with the worm gear (83).

8. The annular vacuum chuck for non-contact silicon wafer handling according to claim 7, characterized in that, One end of the worm gear (83) passes through the control box (81) and is fixedly connected to a screw block; Alternatively, a motor may be installed on the control box (81), and the output shaft of the motor may be mounted on the worm gear (83) via a coupling.

9. The annular vacuum chuck for non-contact silicon wafer handling according to claim 7, characterized in that, It also includes a connecting component (9), which includes a fixed seat (91) fixedly connected to the main cylinder (1) and a mounting plate (95) disposed above the fixed seat (91). The upper surface of the control box (81) is fixedly connected to the fixed base (91), and two sets of connecting columns (92) are fixedly connected to the upper surface of the fixed base (91), and the mounting plate (95) is installed on the connecting columns (92); The mounting plate (95) is provided with a first mounting hole (96), a second mounting hole (97), and a weight reduction groove (98).

10. The annular vacuum chuck for non-contact silicon wafer handling according to claim 9, characterized in that, One side of the mounting plate (95) is welded to the end of the connecting column (92) away from the fixed seat (91); Alternatively, each of the connecting posts (92) may be fixedly connected with a screw (93), and the mounting plate (95) may have a through hole that matches the screw (93). The end of the screw (93) away from the connecting post (92) passes through the through hole and is threaded with a lock nut (94).

Images