Silk screen cleaning process and silk screen cleaning system
By employing a two-step cleaning process and a wire mesh cleaning method involving friction with a lint-free cloth and airflow drying, the problem of mesh clogging during storage and transportation has been solved, achieving comprehensive cleaning and performance restoration of the wire mesh.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHENGDU LINGYI TECHNOLOGY CO LTD
- Filing Date
- 2026-01-09
- Publication Date
- 2026-04-10
AI Technical Summary
During storage, transportation, and loading, wire mesh is easily contaminated with fine dust and particles from the environment, leading to mesh blockage and affecting the performance of die-cut products.
A two-step cleaning process is adopted. First, the wire mesh surface is cleaned with a first cleaning medium and vibration frequency. Then, it is transferred to a second cleaning medium for vibration cleaning of the mesh openings. Combined with lint-free cloth friction and airflow drying, the mesh openings are ensured to be thoroughly cleaned.
It effectively removes impurities that clog the mesh, restores the permeability and filtration performance of the wire mesh, prevents the mesh from clogging again, and ensures the quality of die-cut products.
Smart Images
Figure CN121820286A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of screen cleaning, in particular to a screen cleaning process and a screen cleaning system. BACKGROUND
[0002] The die-cutting industry is a key supporting industry in the fields of electronics, printing, packaging, etc., and its products are widely used in various consumer electronic products, such as precision components for dust prevention, heat dissipation, acoustics, etc. In these products, the screen material plays a crucial role. The screen, also known as the mesh, is an industrial product with a uniform mesh structure made of metal wires, synthetic fiber wires, etc. through a specific weaving process. Its performance parameters, such as mesh count, wire diameter, and open area percentage, directly determine its filtering, permeability, or barrier efficiency. In the die-cutting production process, the screen material is prone to contamination with fine dust and particles from the environment during storage, transportation, and feeding. When dust accumulates and clogs the mesh, it can severely affect the final performance of the die-cutting product. SUMMARY
[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application proposes, in a first aspect, a screen cleaning process capable of cleaning the screen surface and mesh.
[0004] The present application further proposes, in a second aspect, a screen cleaning system.
[0005] According to the screen cleaning process of the first aspect of the present application, the following steps are included: placing the screen in a first cleaning medium; applying a first frequency of vibration to the surface of the screen to disperse impurities on the surface into the first cleaning medium and expose each mesh of the screen; transferring the screen from the first cleaning medium to a second cleaning medium; applying a second frequency of vibration to the wall of the mesh to disperse impurities in the mesh into the second cleaning medium to achieve cleaning of the screen.
[0006] According to the screen cleaning process of the present application, at least the following technical effects are achieved: In the screen cleaning process of the present application, the screen to be cleaned is first fully immersed in the first cleaning medium, then the screen surface immersed in the cleaning medium is vibrated at a first frequency to make the impurities attached to the screen surface peel off from the screen surface and disperse into the first cleaning medium, so that the larger particles blocked at the entrances of the screen holes can be separated from the screen, and each independent screen hole on the screen is exposed, then the screen after the preliminary cleaning is removed from the first cleaning medium and transferred to the second cleaning medium, and finally the screen hole wall is vibrated at a second frequency in the second cleaning medium, and the vibration energy directly acts on the inside of the screen hole, so that the small and stubborn impurities embedded in the hole wall or stuck in the hole channel are completely loosened and fall off and disperse in the second cleaning medium, thereby realizing comprehensive and deep cleaning of the screen from the screen surface to the inside of the screen hole. It can be known from the above that the screen surface is first cleaned by the first cleaning medium to ensure that all screen hole entrances are opened, and then the screen hole is precisely cleaned by the second cleaning medium, which can effectively remove the particles blocking the screen hole.
[0007] According to the screen cleaning process of the first aspect of the present application, the screen is transferred from the first cleaning medium to the second cleaning medium, comprising the following steps: The screen is taken out of the first cleaning medium; The screen is sprayed to further remove impurities on the screen surface and expose each screen hole on the screen; The screen is placed in the second cleaning medium.
[0008] According to the screen cleaning process of the first aspect of the present application, before the screen is placed in the first cleaning medium, the following steps are further included: The screen surface is rubbed with a dust-free cloth to initially loosen the impurities covering the screen surface.
[0009] According to the screen cleaning process of the first aspect of the present application, the screen surface is rubbed with a dust-free cloth, comprising the following steps: The screen is unwound by the unwinding roller to drive the screen through the dust-free cloth to realize the relative friction between the screen surface and the dust-free cloth.
[0010] According to the screen cleaning process of the first aspect of the present application, the following steps are further included: The screen is taken out of the second cleaning medium; The residual second cleaning medium on the screen is removed.
[0011] According to the screen cleaning process of the first aspect of the present application, the residual second cleaning medium on the screen is removed, comprising the following steps: Air flow is applied to the screen to initially remove the residual second cleaning medium on the screen; The screen is heated and dried to completely remove the second cleaning medium remaining on the screen.
[0012] According to the screen cleaning process of the first aspect of the present application, the screen is subjected to airflow, comprising the following steps: The screen is subjected to a first airflow flowing along the screen surface to remove the second cleaning medium remaining on the screen surface. The screen is subjected to a second airflow flowing along the screen holes to remove the second cleaning medium remaining in the screen holes.
[0013] According to the screen cleaning process of the first aspect of the present application, the temperature of the first cleaning medium is 20-35°C.
[0014] According to the screen cleaning process of the first aspect of the present application, the first frequency is 27.4HZ.
[0015] According to the screen cleaning system of the second aspect of the present application, the screen cleaning process of the first aspect of the present application is implemented.
[0016] Additional aspects and advantages of the present application will be in part apparent and in part pointed out below in the description of the application. BRIEF DESCRIPTION OF DRAWINGS
[0017] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the accompanying drawings, in which: Figure 1 Flowchart of the screen cleaning process of one embodiment of the present application; Figure 2 Flowchart of the screen cleaning process of one embodiment of the present application; Figure 1 Flowchart of the screen cleaning process of one embodiment of the present application; Figure 3 Flowchart of the screen cleaning process of one embodiment of the present application; Figure 1 Flowchart of the screen cleaning process of one embodiment of the present application; Figure 4 Flowchart of the screen cleaning process of one embodiment of the present application; Figure 3 Flowchart of the screen cleaning process of one embodiment of the present application. DETAILED DESCRIPTION
[0018] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, in which the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be understood as limiting the present application.
[0019] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, left, right, front, back and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0020] In the description of the present application, if the first, second, etc. are described, they are only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.
[0021] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.
[0022] The following refers to Figures 1 to 4 A screen cleaning process according to the first embodiment of the present application is described in detail.
[0023] Referring to Figure 1 The screen cleaning process according to the first embodiment of the present application specifically includes but is not limited to steps S200, S300, S400 and S500: Step S200, placing the screen in a first cleaning medium; Step S300, applying a first frequency vibration to the screen surface of the screen to disperse the impurities on the screen surface in the first cleaning medium, and to expose each mesh hole of the screen; Step S400, transferring the screen from the first cleaning medium to a second cleaning medium; Step S500, applying a second frequency vibration to the hole wall of the mesh hole to disperse the impurities in the mesh hole in the second cleaning medium, to achieve cleaning of the screen.
[0024] In the screen cleaning process of the present application, first, the screen to be cleaned is completely immersed in the first cleaning medium, then the screen surface immersed in the cleaning medium is vibrated at a first frequency to make the impurities attached to the screen surface peel off from the screen surface and disperse into the first cleaning medium, so that the larger particles blocked at the entrances of the screen holes can be detached from the screen, and each independent screen hole on the screen is exposed, then the screen after preliminary cleaning is removed from the first cleaning medium and transferred to the second cleaning medium, and finally, in the second cleaning medium, the screen hole wall is vibrated at a second frequency, and the vibration energy directly acts on the inside of the screen hole, so that the small and stubborn impurities embedded in the hole wall or stuck in the hole are completely loosened and fall off and disperse in the second cleaning medium, thereby realizing comprehensive and deep cleaning of the screen from the screen surface to the inside of the screen hole. As can be seen from the above, the screen surface is first cleaned by the first cleaning medium to ensure that all screen hole entrances are open, and then the screen hole is precisely cleaned by the second cleaning medium, which can effectively remove the particles blocking the screen hole, thereby restoring the original permeability and filtering performance of the screen, which is crucial for screen materials with high precision requirements in the die-cutting industry.
[0025] It should be noted that when cleaning the screen hole, if the screen is still placed in the first cleaning medium, since the first cleaning medium has dispersed impurities peeled off during cleaning of the screen surface, these impurities are easy to block the screen hole, thereby affecting the peeling of impurities in the hole.
[0026] It can be understood that in the screen cleaning process of the present application, after the screen surface is cleaned to expose each screen hole on the screen, the screen is transferred from the first cleaning medium to the second cleaning medium, and the screen hole is cleaned in the second cleaning medium, thereby avoiding the probability of the screen hole being blocked by impurities again, so that the impurities in the screen hole can be shaken out smoothly under the vibration of the second frequency, improving the cleaning effect of the screen hole.
[0027] Specifically, the first cleaning medium and the second cleaning medium both use pure water. It can be understood that pure water as a neutral medium has mild chemical properties and will not corrode or damage the fiber structure of the polyester screen like some strong acids, strong bases or organic solvents, which helps to maintain the original physical performance stability and dimensional stability of the screen.
[0028] Reference Figure 1 and Figure 2 In some embodiments of the present application, step S400 specifically includes but is not limited to the following steps: Step S410, taking the screen out of the first cleaning medium; Step S420, spraying the screen to further remove impurities on the screen surface and completely expose each screen hole on the screen; Step S430, placing the screen in the second cleaning medium.
[0029] It can be understood that, in the process of transferring the screen from the first cleaning medium to the second cleaning medium, first, the screen is taken out of the first cleaning medium, and then the screen is sprayed before it enters the second cleaning medium. The spray can use high-pressure spray head, atomizing nozzle and other devices, using clean water or a kind of transition cleaning liquid to flush the surface of the screen. Through the spray, the residual impurities that have been loosened but may still adhere to the screen surface or the edge of the mesh hole in the first cleaning stage are further taken away. At the same time, the water flow of strong spray can completely wash away the residual liquid film and dregs at the entrance of the mesh hole, ensuring that each mesh hole is in a completely exposed and unobstructed state. Finally, the screen with completely exposed mesh holes after spraying is placed in the second cleaning medium. Through the spray, the screen can effectively prevent the impurities in the first cleaning medium from being brought into the second cleaning medium, maintain the cleanliness of the second cleaning medium, prolong its service life, and improve the final cleaning effect. And the spray can further ensure that the mesh hole is completely exposed before the second stage of hole wall vibration cleaning, so that the second cleaning medium can more fully soak into each mesh hole, and the vibration energy can also act more directly on the hole wall without the interference of the entrance blockage, thereby significantly improving the removal efficiency of the impurities in the mesh hole.
[0030] Reference Figure 1 In some embodiments of the present application, step S200 specifically further includes but is not limited to the following steps: Step S100, rubbing the screen surface with a dust-free cloth to preliminarily loosen the impurities covered on the screen surface.
[0031] It can be understood that, before placing the screen in the first cleaning medium, the screen surface is first rubbed with a dust-free cloth to preliminarily remove a part of the dry clumps, large sticky or firmly attached impurities covered on the screen surface, avoid a large amount of impurities on the screen entering the first cleaning medium, to reduce the pressure of subsequent vibration cleaning, and the rubbing of the screen surface with a dust-free cloth can loosen the impurities on the screen surface, so that the impurities on the screen surface can be more easily removed in the first cleaning medium. And using a dust-free cloth instead of a brush or other tools to preliminarily clean the screen can avoid damaging the screen, thereby affecting the performance of the screen.
[0032] As shown in Figure 1 In some embodiments, step S100 specifically includes but is not limited to the following steps: Step S110, unwinding the screen through the unwinding roller to drive the screen to pass through the dust-free cloth to realize the relative friction between the screen surface and the dust-free cloth.
[0033] It can be understood that the automatic relative friction between the screen and the lint-free cloth is realized by the unwinding roller. Specifically, the screen in a roll is installed on the unwinding roller, the screen is driven to be conveyed at a certain speed, and passes through the lint-free cloth. During the conveying of the screen, the screen surface keeps in contact with the lint-free cloth and generates relative sliding friction, so that the screen surface is automatically and continuously preliminarily cleaned. Moreover, the application can realize accurate control of the friction degree and uniformity by controlling the unwinding speed and the pressure of the lint-free cloth, and avoid inconsistency of manual operation and possible local damage to the screen.
[0034] Reference Figure 1 In some embodiments of the application, the screen cleaning process specifically further includes but is not limited to steps S600 and S700: Step S600, taking out the screen from the second cleaning medium; Step S700, removing the residual second cleaning medium on the screen.
[0035] It can be understood that after the hole wall vibration cleaning in the second cleaning medium is completed, the screen is taken out from the second cleaning medium, and then the residual second cleaning medium on the screen is removed, which can avoid the second cleaning impurities from being attached to the screen hole or screen surface again to form new pollution.
[0036] As shown in Figure 1 and Figure 3 In some embodiments, step S700 specifically includes but is not limited to the following steps: Step S710, applying air flow to the screen to preliminarily remove the residual second cleaning medium on the screen; Step S720, heating and drying the screen to completely remove the residual second cleaning medium on the screen.
[0037] It can be understood that first, high-speed air flow is applied to the taken-out wet screen, the air flow can blow off most of the liquid droplets attached to the surface of the screen, realizing preliminary rapid dehydration, and then the screen treated by the air flow is heated and dried. The two-stage drying method of "air flow preliminary removal + heating complete drying" can reduce the formation of water stains, at the same time, can reduce the time required for drying, so as to avoid long-term drying of the screen, thereby affecting the material and performance of the screen.
[0038] Specifically, the drying temperature is 95-105℃, the heating can be realized by an oven, a hot air circulating device or an infrared heater, etc. The residual medium permeating into the gaps of the screen and the inner wall of the screen hole is evaporated by using heat, so as to realize complete and thorough drying.
[0039] As shown in Figure 3 and Figure 4As shown, in one embodiment, step S710 specifically includes, but is not limited to, the following steps: Step S711: Apply a first airflow along the surface of the wire mesh to remove the second cleaning medium remaining on the surface of the wire mesh; Step S712: Apply a second airflow along the mesh openings to the wire mesh to remove the second cleaning medium remaining in the mesh openings.
[0040] Understandably, applying a first airflow along the surface of the wire mesh, for example by setting air knives or slotted nozzles on one or both sides of the mesh, with the airflow direction parallel to the mesh surface, can effectively blow away the liquid film accumulated over a large area on the mesh surface. Then, applying a second airflow along the mesh openings, for example by applying positive pressure on one side of the mesh and negative pressure on the other side, forms an airflow passing through the mesh openings. This airflow, passing vertically or obliquely through the mesh openings, can produce an effect similar to an air gun, blowing out tiny droplets and impurities trapped inside the mesh openings. This application first removes the second cleaning medium on the mesh surface with tangential airflow, and then removes the cleaning medium from the mesh openings with normal airflow. This avoids the second cleaning medium on the mesh surface flowing into the mesh openings when directly outputting normal airflow, thus affecting the removal effect. This results in a better removal effect of the second cleaning medium on the wire mesh, and less second cleaning medium remains on the wire mesh before drying. Consequently, the drying time of the wire mesh is shorter, and the time the wire mesh is in the drying environment is shorter, reducing the damage to the wire mesh caused by the high temperature in the drying environment.
[0041] In some embodiments of the present invention, the temperature of the first cleaning medium is 20°C to 35°C.
[0042] Understandably, controlling the temperature within the normal range avoids the decrease in cleaning agent activity and slow reaction caused by excessively low temperatures, and also avoids excessively high temperatures that may cause the cleaning agent to evaporate too quickly, decompose its components, or cause thermal damage to certain wire mesh materials, thus ensuring the stability and safety of the process.
[0043] Specifically, the temperature of the second cleaning medium is 20°C to 35°C. Controlling the pure water temperature within this relatively mild range of 20-35°C helps reduce fluctuations in pure water quality caused by drastic temperature changes, ensuring that the medium conditions encountered by each batch of wire mesh cleaning are basically consistent, thereby guaranteeing the repeatability of the cleaning process and the stability of the cleaning quality.
[0044] In some embodiments of the present invention, the first frequency is 27.4 Hz.
[0045] It can be understood that the first frequency of 27.4HZ is a frequency that can produce better resonance with the attachment state of the screen surface dirt, and a smaller energy input can produce a larger amplitude of the screen surface, thereby more efficiently making the impurities fall off, especially for the effect of loosening the blockage of the mesh entrance.
[0046] According to the second aspect of the present application, a screen cleaning system is provided for implementing the screen cleaning process as described above. The screen cleaning system comprises a winding roller, an unwinding roller, a dust-free cloth cleaning mechanism, a first cleaning mechanism, a spraying mechanism, a second cleaning mechanism, a wind cutting mechanism and a drying mechanism. The screen web is first output by the unwinding roller, and then passes through the dust-free cloth cleaning mechanism to rub the screen surface. Then, the screen passes through the first cleaning mechanism, and the first cleaning medium of the first cleaning mechanism cleans the screen surface at the first frequency. Then, the screen passes through the spraying mechanism to further clean the surface impurities and the first cleaning medium. Then, the screen passes through the second cleaning mechanism, and the second cleaning medium of the second cleaning mechanism cleans the screen mesh at the second frequency. Then, the screen passes through the wind cutting mechanism to preliminarily remove the second cleaning medium on the screen surface and the screen mesh. Finally, the screen is dried in the drying mechanism to complete the cleaning of the screen, and then is wound by the winding roller for subsequent die cutting. The screen cleaning system of the present application can clean the impurities in the screen surface and the screen mesh, and avoid the influence of the impurities in the screen on the performance of the die-cut product.
[0047] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.
Claims
1. A wire mesh cleaning process, characterized in that, It includes the following steps: Place the wire mesh in the first cleaning medium; Vibration at a first frequency is applied to the surface of the wire mesh to disperse impurities on the surface of the mesh into the first cleaning medium and to expose each mesh opening of the wire mesh. The wire mesh is transferred from the first cleaning medium to the second cleaning medium; A second frequency vibration is applied to the mesh wall to disperse impurities within the mesh into the second cleaning medium, thereby cleaning the wire mesh.
2. The wire mesh cleaning process according to claim 1, characterized in that, The step of transferring the wire mesh from the first cleaning medium to the second cleaning medium includes the following steps: Remove the wire mesh from the first cleaning medium; The wire mesh is sprayed to further remove impurities from the mesh surface and to completely expose each of the mesh openings. The wire mesh is placed in the second cleaning medium.
3. The wire mesh cleaning process according to claim 1, characterized in that, Before placing the wire mesh in the first cleaning medium, the method further includes the following steps: The mesh surface is rubbed with a lint-free cloth to initially loosen the impurities covering the mesh surface.
4. The wire mesh cleaning process according to claim 3, characterized in that, The step of rubbing the mesh surface with a lint-free cloth includes the following steps: The wire mesh is unwound by an unwinding roller to drive it through the cleanroom cloth, thereby achieving relative friction between the mesh surface and the cleanroom cloth.
5. The wire mesh cleaning process according to claim 1, characterized in that, It also includes the following steps: Remove the wire mesh from the second cleaning medium; Remove the second cleaning medium remaining on the wire mesh.
6. The wire mesh cleaning process according to claim 5, characterized in that, The removal of the second cleaning medium remaining on the wire mesh includes the following steps: An airflow is applied to the wire mesh to initially remove the second cleaning medium remaining on the wire mesh; The wire mesh is heated and dried to completely remove any remaining second cleaning medium from the wire mesh.
7. The wire mesh cleaning process according to claim 6, characterized in that, Applying airflow to the wire mesh includes the following steps: A first airflow is applied to the wire mesh to remove the second cleaning medium remaining on the wire mesh surface; A second airflow is applied to the wire mesh to remove the second cleaning medium remaining in the mesh.
8. The wire mesh cleaning process according to claim 1, characterized in that, The temperature of the first cleaning medium is 20°C to 35°C.
9. The wire mesh cleaning process according to claim 1, characterized in that, The first frequency is 27.4 Hz.
10. A wire mesh cleaning system, characterized in that, Used to implement the wire mesh cleaning process as described in any one of claims 1 to 9.