Machining method for deep groove control of metal substrate

Abstract

The invention relates to the technical field of printed circuit boards, in particular to a metal substrate deep control groove processing method which comprises the steps that a first deep control groove is formed in a metal substrate through deep control processing, the length and the width of the first deep control groove are both smaller than the size of a target groove, and the depth of the first deep control groove is consistent with the depth of the target groove; a second depth control groove is formed in the metal substrate through depth control processing, a groove control area of the second depth control groove is located at the position of the target groove, the size of the first depth control groove is consistent with that of the target groove, and the depth of the first depth control groove is consistent with that of the target groove; the first depth control groove and the second depth control groove are overlapped to form a target groove; the first milling cutter with the large diameter larger than two times of the R angle and the milling cutter with the two times of the R angle are used for processing step by step, the feeding speed is obviously increased, and the machining efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit board, and particularly relates to a processing method of a depth control groove of a metal substrate. BACKGROUND

[0002] At present, when a depth control groove of a metal substrate is processed in the industry of PCB, the rule for selecting the diameter of a milling cutter is to select the diameter of the milling cutter as twice the R angle (the R angle is the circular transition angle between two intersecting surfaces on the part), so that the R angle limits the size of the diameter of the milling cutter. In the process of metal depth control, the size of the diameter of the milling cutter directly affects the processing efficiency. The larger the diameter of the milling cutter is, the less likely the milling cutter is to break, the longer the service life is, and the less frequent the tool changing is. Conversely, the smaller the diameter of the milling cutter is, the more likely the milling cutter is to break, the shorter the service life is, and the more frequent the tool changing is.

[0003] The current rule for selecting the diameter of the milling cutter limits the diameter of the milling cutter, which indirectly affects the processing efficiency. For example, when the R angle is 0.5 mm, the maximum diameter of the milling cutter selected is 1.0 mm. The milling cutter with a diameter of 1.0 mm is applied in the process of processing the depth control groove of the metal substrate, and the milling cutter is extremely easy to break at a slow feed speed, which shortens the service life and seriously affects the processing efficiency of the product. SUMMARY

[0004] In view of this, the purpose of the present application is to provide a processing method of a depth control groove of a metal substrate to solve the problem of affecting the processing efficiency of the product.

[0005] In order to achieve the above purpose, the present application provides a processing method of a depth control groove of a metal substrate, which comprises the following steps. Step one: forming a first depth control groove on a metal substrate by depth control processing, the length and width of the first depth control groove are smaller than the size of a target groove, and the depth of the first depth control groove is consistent with the depth of the target groove; Step two: forming a second depth control groove on the metal substrate by depth control processing, the groove control area of the second depth control groove is located at the position of the target groove, the size of the first depth control groove is consistent with the size of the target groove, and the depth of the first depth control groove is consistent with the depth of the target groove; Step three: forming the target groove by stacking the first depth control groove and the second depth control groove on the metal substrate by depth control processing.

[0006] Optionally, the area of the first depth control groove is between 88% and 92% of the area of the target groove.

[0007] Optionally, the area of the first depth control groove is 90%, 91% or 92% of the area of the target groove.

[0008] Optionally, the side of the slot of the first depth control groove is chamfered.

[0009] Optionally, the chamfering forms a concave groove.

[0010] Optionally, before forming the first depth-controlled groove, a pre-depth-controlled groove is formed on a metal substrate through depth control processing. The length and width of the pre-depth-controlled groove are both smaller than the target groove size, and also smaller than the length and width of the first depth-controlled groove.

[0011] Optionally, the depth of the pre-controlled deep groove may be less than or equal to the depth of the target groove.

[0012] Optionally, a pre-milling cutter is used to machine the pre-controlled deep groove, the width of which is the same as the diameter of the pre-milling cutter.

[0013] The beneficial effects of this invention are as follows: This invention provides a method for machining controlled-depth grooves on metal substrates, which significantly improves machining efficiency. It effectively increases machining efficiency by using a large-diameter first milling cutter with a radius greater than twice the radius and a second milling cutter with a radius greater than twice the radius for step-by-step processing, resulting in a significant increase in feed rate. It can effectively reduce milling cutter costs, and the use of a large-diameter first milling cutter significantly increases milling cutter life. It can effectively improve the quality pass rate and reduce the risk of milling cutter breakage. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Fig. 1 This is a schematic diagram of the circuit board structure of the present invention; Fig. 2 This is a schematic diagram of the structure of the first depth control groove and the second depth control groove of the present invention.

[0016] In the figure: 100, metal substrate; 200, first depth control trench; 300, second depth control trench. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0018] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this invention should have the ordinary meaning understood by those skilled in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0019] like Figs. 1-2 As shown, a method for processing a depth-controlled trench on a metal substrate includes: Step 1: A first depth control groove 200 is formed on the metal substrate 100 by controlled depth processing. The length and width of the first depth control groove 200 are both smaller than the target groove size, and the depth of the first depth control groove 200 is the same as the depth of the target groove. Step 2: A second depth control groove 300 is formed on the metal substrate 100 by controlled depth processing. The groove control area of ​​the second depth control groove 300 is located at the position of the target groove. The size of the first depth control groove 200 is the same as the size of the target groove, and the depth of the first depth control groove 200 is the same as the depth of the target groove. Step 3: On the metal substrate 100, a first depth control groove 200 and a second depth control groove 300 are formed by depth control processing and then superimposed to form the target groove.

[0020] In the metal substrate 100, a first controlled depth groove 200 is formed by controlled depth machining in the area of ​​the target groove. Since the first controlled depth groove 200 is not the final target groove, the selection of the milling cutter does not need to be performed according to twice the radius angle. A first milling cutter with a larger diameter can be selected for machining, thereby improving machining efficiency. On the other hand, when machining the second controlled depth groove 300, the selection of the milling cutter needs to be performed according to the second milling cutter with twice the radius angle. Since part of the target groove has already been machined by the first controlled depth groove 200, the second controlled depth groove 300 only needs to machine the remaining part. The target groove is formed by two superpositions, which improves machining efficiency.

[0021] The machining of 100mm deep grooves on metal substrates has significantly improved efficiency. By using a large-diameter first end mill with a radius greater than twice that of a second end mill, and processing the material in stages with a radius greater than twice that of a second end mill, the feed rate is significantly increased. This effectively reduces the cost of end mills, and the use of a large-diameter first end mill significantly extends the end mill life. It also effectively improves the quality pass rate and reduces the risk of end mill breakage.

[0022] Before forming the first controlled depth groove 200, a pre-controlled depth groove is formed on the metal substrate 100 through controlled depth machining. The length and width of the pre-controlled depth groove are both smaller than the target groove size and also smaller than the length and width of the first controlled depth groove 200. The depth of the pre-controlled depth groove can be less than or equal to the depth of the target groove. The pre-controlled depth groove is machined using a pre-milling cutter. The diameter of the pre-milling cutter is greater than twice the radius diameter. The diameter of the pre-milling cutter is greater than the diameter of the first milling cutter. The width of the pre-controlled depth groove is the same as the diameter of the pre-milling cutter. Further step processing is performed to increase the feed rate and thus improve machining efficiency.

[0023] The area of ​​the first depth control tank 200 is between 88% and 92% of the area of ​​the target tank.

[0024] The area of ​​the first depth control trench 200 is 90%, 91%, or 92% of the area of ​​the target trench.

[0025] In the metal substrate 100, a first controlled depth groove 200 is formed by controlled depth machining in the area of ​​the target groove. Since the first controlled depth groove 200 is not the final target groove, the selection of the milling cutter does not need to be performed according to twice the radius angle. A larger diameter first milling cutter can be selected for machining, thereby improving machining efficiency. On the other hand, when machining the second controlled depth groove 300, the selection of the milling cutter needs to be performed according to the second milling cutter with twice the radius angle. Since 90% of the target groove has been machined away by the first controlled depth groove 200, the second controlled depth groove 300 only needs to machine the remaining part. The target groove is formed by two superpositions, which improves machining efficiency.

[0026] In this embodiment, with a depth of 2.0 mm and a groove size of 30 mm * 30 mm for the metal substrate 100, the radius (R) of the target depth-controlled groove is 0.5 mm. The processing method of the depth-controlled groove for the metal substrate 100 is described. A first end mill with a diameter of 2.0 mm is used to machine the first depth-controlled groove 200, and a second end mill with a diameter of 1.0 mm is used to machine the second depth-controlled groove 300. The first depth-controlled groove 200 is machined using the first end mill at a rotational speed of 32 kr / min, a cutting speed of 10 mm / s, a depth of control of 2.0 mm, and a feed rate of 25 mm / s. Then, the second end mill with a diameter of 1.0 mm is used to machine the second depth-controlled groove 300 at a rotational speed of 35 kr / min, a cutting speed of 5 mm / s, a depth of control of 2.0 mm, and a feed rate of 6 mm / s. In this embodiment, by machining the first depth-controlled groove 200 first, about 90% of the work of the target groove can be completed, reducing the amount of work required for the second depth-controlled groove 300 and improving the machining efficiency.

[0027] The side of the opening of the first depth control groove 200 is chamfered to form a concave groove, which reduces the amount of machining required for the remaining part of the second depth control groove 300 and improves the machining efficiency.

[0028] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention is limited to these examples. The invention is not limited to the above-described embodiments, that is, it does not mean that the invention must rely on the above methods and structures to be implemented. Under the concept of the invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in the details for the sake of brevity.

[0029] The embodiments of this invention are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for processing a depth-controlled trench on a metal substrate, characterized in that, include: Step 1: A first depth-controlled groove is formed on a metal substrate by controlled depth processing. The length and width of the first depth-controlled groove are both smaller than the target groove size, and the depth of the first depth-controlled groove is the same as the depth of the target groove. Step 2: A second depth-controlled groove is formed on the metal substrate by controlled depth processing. The groove control area of ​​the second depth-controlled groove is located at the position of the target groove. The size of the first depth-controlled groove is the same as the size of the target groove, and the depth of the first depth-controlled groove is the same as the depth of the target groove. Step 3: On the metal substrate, a first depth control groove and a second depth control groove are formed by depth control processing and then superimposed to form the target groove.

2. The method for processing a depth-controlled trench on a metal substrate according to claim 1, characterized in that, The area of ​​the first depth-controlled trench is between 88% and 92% of the area of ​​the target trench.

3. The method for processing a depth-controlled trench on a metal substrate according to claim 2, characterized in that, The area of ​​the first depth-controlled trench is 90%, 91%, or 92% of the area of ​​the target trench.

4. The method for processing a depth-controlled trench on a metal substrate according to claim 1, characterized in that, The sides of the opening of the first depth control groove are chamfered.

5. The method for processing a depth-controlled trench on a metal substrate according to claim 4, characterized in that, The chamfering process creates a concave groove.

6. The method for processing a depth-controlled trench on a metal substrate according to claim 1, characterized in that, Before forming the first depth-controlled groove, a pre-deep-controlled groove is formed on the metal substrate by depth control processing. The length and width of the pre-deep-controlled groove are both smaller than the target groove size, and also smaller than the length and width of the first depth-controlled groove.

7. The method for processing a depth-controlled trench on a metal substrate according to claim 6, characterized in that, The depth of the pre-controlled deep trench is less than or equal to the depth of the target trench.

8. The method for processing a depth-controlled trench on a metal substrate according to claim 6, characterized in that, A pre-milling cutter is used to machine the pre-controlled deep groove, and the width of the pre-controlled deep groove is the same as the diameter of the pre-milling cutter.

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