Wafer transfer box clamping structure

Abstract

The embodiment of the invention provides a wafer transfer box clamping structure, a wafer transfer box comprises an upper box body and a lower box body which can be separated, the clamping structure comprises a fixing part, the fixing part is installed on the lower box body, and the fixing part abuts against the first side of a wafer; the first adjusting part comprises a first mounting part and a first sliding part, the first mounting part is mounted on the lower box body, and the first sliding part can move relative to the first mounting part, so that the distance between the first sliding part and the fixing part is changed, and it is guaranteed that the first sliding part abuts against the second side, opposite to the first side, of the wafer all the time. Through mutual cooperation of the fixing part and the first adjusting part, the wafer is clamped from two opposite sides of the wafer, so that the wafer can be effectively prevented from displacement or damage caused by shaking, collision and the like in the transfer process, and the stability of the wafer in the transfer process is ensured. The first sliding piece can move relative to the first installation part, and it is guaranteed that the clamping structure can adapt to wafers of different sizes and specifications.

Description

Technical Field

[0001] This specification relates to the field of semiconductor technology, specifically to a wafer transfer box clamping structure. Background Technology

[0002] In the highly precise and technology-intensive field of semiconductor manufacturing, wafers, as the core basic material for manufacturing silicon semiconductor integrated circuits, occupy a pivotal position. In the semiconductor production process, wafers undergo numerous complex and delicate processes, including photolithography, etching, thin film deposition, and ion implantation. To ensure the continuity and efficiency of the production process, wafers need to be frequently transferred between different production equipment and process stations, and also require proper storage in specific environments. Wafer cassettes, as indispensable key auxiliary equipment in semiconductor production, primarily undertake the important task of placing and transporting wafers.

[0003] However, traditional wafer transport boxes currently exhibit several problems in practical applications that urgently need to be addressed. The most prominent of these is their severely insufficient protection of the wafers. During transport, due to the inadequate structural design of traditional wafer boxes and the lack of effective cushioning and securing mechanisms, wafers are highly susceptible to shaking within the box when subjected to external vibrations, bumps, or improper handling. This shaking not only causes collisions and friction between the wafer and the inner wall of the box or other wafers, but also, with prolonged and repeated shaking, can cause irreversible damage to the wafer's surface flatness and crystal structure. Once scratches, cracks, or crystal defects appear on the wafer surface, it directly renders the wafer unusable, leading to waste of raw materials and increased production costs. Summary of the Invention

[0004] In view of this, embodiments of this specification provide a wafer transfer box clamping structure.

[0005] This specification provides the following technical solution in its embodiments: a wafer transfer box clamping structure, wherein the wafer transfer box includes a separable upper box body and a lower box body, the upper box body and the lower box body cooperate to form a receiving space for placing wafers, and the clamping structure is disposed within the receiving space for clamping and fixing the wafers, the clamping structure comprising:

[0006] A fixing part is mounted on the lower housing and abuts against the first side of the wafer;

[0007] The first adjustment part includes a first mounting part and a first sliding member. The first mounting part is mounted on the lower housing. The first sliding member can move relative to the first mounting part to realize the change of distance between the first sliding member and the fixed part, ensuring that the first sliding member is always in contact with the second side opposite to the first side of the wafer.

[0008] Preferably, the first mounting part includes a first mounting block, which is mounted on the lower housing. The first sliding member is disposed on the side of the first mounting block near the fixed part. A first screw passes through the first mounting block, and the end of the first screw near the fixed part passes through the first mounting block and contacts the first sliding member.

[0009] Preferably, the first mounting part further includes a first cover and a first elastic member. A first baffle is formed on the side of the first mounting block away from the fixed part. The first cover is mounted on the first baffle. A first opening is provided on the side of the first cover near the fixed part for the first sliding member to pass through. The first elastic member is disposed inside the cover. The two ends of the first elastic member abut against the inner wall of the first cover and the side of the first sliding member near the fixed part, respectively. The first elastic member always has the tendency to push the first sliding member toward the direction away from the fixed part.

[0010] Preferably, the first sliding member includes a first sliding part and a first contact part. The first sliding part is disposed inside the first housing and can move inside the first housing. The first contact part is disposed on the side of the first sliding part near the fixed part. After passing through the first opening, the first contact part abuts against the second side of the wafer.

[0011] Preferably, the first sliding part includes a first sliding rod, a notch is provided on the side of the first sliding rod near the fixed part, protrusions are formed on both sides of the notch, the first elastic element abuts against the inner wall of the notch, and the first contact part includes at least an elastic body disposed at the notch and the protrusions on both sides.

[0012] Preferably, the fixing part is provided with a fixing contact part corresponding to the first contact part on the side of the fixing part facing the first adjusting part, and the fixing contact part is a thermoplastic polyester elastomer.

[0013] Preferably, the clamping structure further includes a second adjustment portion disposed on both sides of the first side of the wafer. The second adjustment portion includes a second mounting portion and a second sliding member. The second mounting portion is mounted on the lower housing, and the second sliding member can move relative to the second mounting portion to ensure that the second sliding member is always in contact with the third and fourth sides of the wafer beside the first side.

[0014] Preferably, the second mounting part includes a second mounting block, a second cover, and a second elastic member. The second mounting block is mounted on the lower housing. The second sliding member is disposed on the side of the second mounting block near the wafer. A second screw passes through the second mounting block. The end of the second screw near the wafer passes through the second mounting block and contacts the second sliding member. A second baffle is formed on the side of the second mounting block away from the wafer. The second cover is mounted on the second baffle. A second opening is provided on the side of the second cover near the wafer for the second sliding member to pass through. The second elastic member is disposed inside the second cover. The two ends of the second elastic member abut against the inner wall of the cover and the side of the second sliding member near the wafer, respectively. The second elastic member always has a tendency to push the second sliding member away from the fixed part.

[0015] Preferably, the second sliding member includes a second sliding part and a second contact part. The second sliding part is disposed inside the second housing and can move inside the second housing. The second contact part is disposed on the side of the second sliding part near the wafer. After passing through the second opening, the second contact part abuts against the second side of the wafer.

[0016] Preferably, the fixing part, the first adjusting part, and the two sets of second adjusting parts together form an area for placing the wafer, and the fixing part, the first adjusting part, and the two sets of second adjusting parts are distributed around the wafer.

[0017] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0018] By cooperating with the fixing part and the first adjusting part, the wafer is clamped from two opposite sides, effectively preventing displacement or damage due to shaking or collision during transport, thus ensuring the stability of the wafer during transport. The first sliding member can move relative to the first mounting part, adjusting the distance between it and the fixing part. This allows the clamping structure to adapt to wafers of different sizes. Regardless of the size of the wafer, the position of the first sliding member can be adjusted to cooperate with the fixing part, achieving reliable clamping of the wafer and improving the versatility and flexibility of the clamping structure. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the wafer transfer box provided in this application;

[0021] Figure 2 This is a schematic diagram of the wafer transfer box clamping structure provided in this application;

[0022] Figure 3 This is a schematic diagram of the first adjustment part of the wafer transfer box clamping structure provided in this application;

[0023] Figure 4 This is a schematic diagram of the second adjustment section of the wafer transfer box clamping structure provided in this application.

[0024] In the figure, 1 is the upper box body; 2 is the lower box body; 3 is the fixing part; 31 is the fixing contact part; 4 is the first adjusting part; 41 is the first cover; 42 is the first contact part; 43 is the first mounting block; 44 is the first sliding member; 45 is the first screw; 46 is the first baffle; 47 is the first elastic member; 48 is the notch; 49 is the protrusion; 5 is the wafer; 6 is the second adjusting part; 61 is the second cover; 62 is the second mounting block; 63 is the second sliding member; 64 is the second baffle; 65 is the second screw; 66 is the second contact part; and 67 is the second elastic member. Detailed Implementation

[0025] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0026] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0028] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0029] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0030] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0031] like Figures 1-2 As shown, a wafer transfer box clamping structure is disclosed. The wafer transfer box includes a separable upper box body 1 and a lower box body 2. The upper box body 1 and the lower box body 2 cooperate to form a receiving space for placing a wafer 5. The clamping structure is disposed within the receiving space for clamping and fixing the wafer 5. The clamping structure includes:

[0032] Fixing part 3 is mounted on the lower housing 2 and abuts against the first side of the wafer 5;

[0033] The first adjustment part 4 includes a first mounting part and a first sliding member 44. The first mounting part is mounted on the lower housing 2. The first sliding member 44 can move relative to the first mounting part to realize the change of distance between the first sliding member 44 and the fixed part 3, so as to ensure that the first sliding member 44 is always in contact with the second side opposite to the first side of the wafer 5.

[0034] The wafer transfer box consists of a separable upper box body 1 and a lower box body 2, which together form a receiving space for placing wafers 5. A clamping structure is installed within this receiving space, specifically for clamping and fixing the wafers 5 to ensure their stability during transfer. A fixing part 3 is mounted on the lower box body 2. When the wafer 5 is placed in the receiving space, the fixing part 3 abuts against the first side of the wafer 5, providing a fixed support point and restricting movement of the wafer 5 on that side. The first mounting part of the first adjusting part 4 is also mounted on the lower box body 2, and the first sliding member 44 can move relative to the first mounting part. By adjusting the position of the first sliding member 44 relative to the first mounting part, the distance between the first sliding member 44 and the fixing part 3 can be changed. Since the fixing part 3 is already abutting against the first side of the wafer 5, adjusting the distance between the first sliding member 44 and the fixing part 3 ensures that the first sliding member 44 is always abutting against the second side opposite to the first side of the wafer 5. In this way, the wafer 5 is fixed on the first side by the fixing part 3 and abutted by the first sliding member 44 on the second side, thereby being constrained in two opposite directions and realizing the clamping and fixing of the wafer 5.

[0035] By cooperating with the fixing part 3 and the first adjusting part 4, the wafer 5 is clamped from two opposite sides, effectively preventing displacement or damage to the wafer 5 during transport due to shaking, collision, or other reasons, thus ensuring the stability of the wafer 5 during transport. The first sliding member 44 can move relative to the first mounting part, adjusting the distance between it and the fixing part 3. This allows the clamping structure to adapt to wafers 5 of different sizes. Regardless of the size of the wafer 5, the position of the first sliding member 44 can be adjusted to cooperate with the fixing part 3, achieving reliable clamping of the wafer 5 and improving the versatility and flexibility of the clamping structure. This clamping method involves contact between the two sides of the wafer 5, avoiding excessive pressure on the surface of the wafer 5 or creating sharp contact points. This reduces the possibility of scratches, breakage, or other damage to the surface of the wafer 5 caused by clamping operations, thus protecting the quality and performance of the wafer 5.

[0036] like Figures 2-3 As shown, in some embodiments, the first mounting part includes a first mounting block 43, which is mounted on the lower housing 2. The first sliding member 44 is disposed on the side of the first mounting block 43 near the fixing part 3. A first screw 45 passes through the first mounting block 43, and the end of the first screw 45 near the fixing part 3 passes through the first mounting block 43 and contacts the first sliding member 44.

[0037] The first mounting block 43, serving as the foundation component of the first mounting section, is securely mounted on the lower housing 2, providing a fixed mounting position and support base for the entire first adjustment section 4, ensuring a stable reference for the installation and movement of subsequent components. The first sliding member 44 is positioned on the side of the first mounting block 43 closest to the fixed part 3. At this point, there is an initial distance between the first sliding member 44 and the fixed part 3, determined according to design requirements and the expected initial placement position of the wafer 5, leaving space for subsequent adjustments. The first screw 45 passes through the first mounting block 43, with its end closest to the fixed part 3 contacting the first sliding member 44 after passing through the first mounting block 43. When the first screw 45 is rotated, due to the threaded engagement between the first screw 45 and the first mounting block 43, the first screw 45 will move linearly along its axial direction. When the first screw 45 rotates forward toward the fixed part 3, it pushes the first sliding member 44, which is in contact with it, to move toward the fixed part 3. Conversely, when the first screw 45 rotates backward away from the fixed part 3, the first sliding member 44 will move away from the fixed part 3 under the action of other possible reset mechanisms (such as springs), or remain in its current position and wait for the next adjustment, thereby achieving precise adjustment of the distance between the first sliding member 44 and the fixed part 3.

[0038] By rotating the first screw 45 to push or pull the first sliding member 44, the distance between the first sliding member 44 and the fixed part 3 can be controlled very precisely. This precise adjustment capability allows the clamping structure to adapt to wafers 5 of different sizes. Whether the wafer 5 is of standard size or has a certain error range, the first screw 45 can be finely adjusted to ensure that the first sliding member 44 and the fixed part 3 clamp the wafer 5 precisely, ensuring the accuracy and reliability of clamping. The threaded engagement between the first screw 45 and the first mounting block 43 is a mature and stable mechanical connection method that can withstand a certain amount of external force without easily loosening or being damaged. During the transfer of the wafer 5, even if it encounters a certain amount of vibration or impact, the first screw 45 can maintain its adjusted position, ensuring that the distance between the first sliding member 44 and the fixed part 3 remains unchanged, thereby continuously and stably clamping the wafer 5 and improving the reliability and stability of the entire clamping structure.

[0039] like Figures 2-3As shown, in some embodiments, the first mounting part further includes a first cover 41 and a first elastic member 47. A first baffle 46 is formed on the side of the first mounting block 43 away from the fixing part 3. The first cover 41 is mounted on the first baffle 46. A first opening is provided on the side of the first cover 41 near the fixing part 3 for the first sliding member 44 to pass through. The first elastic member 47 is disposed inside the cover. The two ends of the first elastic member 47 abut against the inner wall of the first cover 41 and the side of the first sliding member 44 near the fixing part 3, respectively. The first elastic member 47 always has the tendency to push the first sliding member 44 toward the direction away from the fixing part 3.

[0040] The first mounting block 43 is mounted on the lower housing 2, and a first baffle 46 is formed on the side away from the fixing part 3. The first cover 41 is mounted on the first baffle 46, forming a relatively closed spatial structure. The first opening on the side of the first cover 41 near the fixing part 3 provides a channel for the movement of the first slider 44, allowing the first slider 44 to partially extend out of the first cover 41 and contact the wafer 5. The first elastic member 47 is placed inside the first cover 41, with its two ends abutting against the inner wall of the first cover 41 and the side of the first slider 44 near the fixing part 3, respectively. In the initial state, the first elastic member 47 is in a certain pre-compressed state, and according to its characteristics, it always has a tendency to push the first slider 44 away from the fixing part 3. When it is necessary to clamp the wafer 5, the first screw 45 is rotated to push the first sliding member 44 towards the fixing part 3. The first sliding member 44 overcomes the elastic force of the first elastic member 47 and moves towards the fixing part 3, gradually reducing the distance between it and the fixing part 3 until it contacts the wafer 5 and applies a suitable clamping force, stably clamping the wafer 5 between the fixing part 3 and the first sliding member 44. When it is necessary to remove the wafer 5 or adjust the clamping state, the first screw 45 is rotated in the opposite direction, reducing the pushing force of the first screw 45 on the first sliding member 44. At this time, since the first elastic member 47 always has the tendency to push the first sliding member 44 away from the fixing part 3, it will push the first sliding member 44 to move away from the fixing part 3, increasing the distance between the first sliding member 44 and the fixing part 3, loosening the clamping of the wafer 5, and facilitating the removal or readjustment of the wafer 5.

[0041] The presence of the first elastic element 47 enables the first sliding element 44 to automatically reset. After the wafer 5 clamping operation is completed, when it is necessary to release the wafer 5, there is no need for complicated operations to manually pull back the first sliding element 44. Simply adjust the first screw 45, and the first elastic element 47 will automatically push the first sliding element 44 away from the fixing part 3, achieving rapid release and improving operational efficiency and convenience. During the clamping process of the wafer 5, the first elastic element 47 can act as a buffer. When the first sliding element 44 contacts the wafer 5 and applies clamping force, the first elastic element 47 will be further compressed, and its elastic force will gradually increase, thereby avoiding excessive compression of the wafer 5 due to excessive pushing force of the first screw 45, and preventing damage to the wafer 5. At the same time, the elastic force of the first elastic element 47 enables the first sliding element 44 to apply a relatively stable and gentle clamping force to the wafer 5, ensuring that the wafer 5 will not easily loosen due to vibration or other reasons during transportation, thus improving the stability of clamping. Due to the function of the first elastic element 47, the clamping structure has a certain adaptability to the dimensional errors and placement deviations of the wafer 5. Even if the thickness of the wafer 5 has a certain error or the placement position is not precise enough, the first elastic element 47 can adjust the position of the first sliding element 44 through its own elastic deformation, still enabling the first sliding element 44 to cooperate with the fixing part 3 to effectively clamp the wafer 5, thus improving the fault tolerance and versatility of the entire clamping structure. The first elastic element 47 can absorb and disperse some of the vibration and impact forces generated during the transfer of the wafer 5, reducing the direct effect of these external forces on components such as the first sliding element 44, the first screw 45, and the first mounting part, reducing the risk of damage to components due to excessive force, thereby extending the service life of the entire clamping structure.

[0042] like Figures 2-3 As shown, in some embodiments, the first sliding member 44 includes a first sliding part and a first contact part 42. The first sliding part is disposed inside the first cover 41 and can move inside the first cover 41. The first contact part 42 is disposed on the side of the first sliding part near the fixed part 3. After passing through the first opening, the first contact part 42 abuts against the second side of the wafer 5.

[0043] The first sliding member 44 consists of a first sliding portion and a first contact portion 42. The first sliding portion is disposed inside the first housing 41, which provides it with a relatively stable and guiding spatial environment. The first contact portion 42 is disposed on the side of the first sliding portion near the fixing portion 3 and can extend through the first opening in the first housing 41 to the outside of the first housing 41 to contact the wafer 5. When a force is applied to the first sliding member 44 by rotating the first screw 45, since the first sliding portion is located inside the first housing 41 and can move therein, the first screw 45 pushes the first sliding portion to move in a specific direction (towards the fixing portion 3) within the first housing 41. As the first sliding portion moves, the first contact portion 42 disposed thereon also moves synchronously. After passing through the first opening, the first contact portion 42 gradually approaches the second side of the wafer 5 and finally abuts against the second side of the wafer 5, cooperating with the fixing portion 3 to perform a clamping operation on the wafer 5. When it is necessary to release the wafer 5, the first screw 45 is rotated in the opposite direction, and the thrust of the first screw 45 on the first sliding part is reduced. At this time, the first elastic element 47 plays a role, pushing the first sliding part to move away from the fixed part 3. The first contact part 42 also moves away from the second side of the wafer 5, thereby releasing the clamping of the wafer 5.

[0044] The first sliding member 44 is divided into a first sliding part and a first contact part 42, achieving functional partitioning. The first sliding part is mainly responsible for sliding within the first housing 41. Its shape and size can be optimized according to the internal structure of the first housing 41 to ensure smooth and stable movement. The first contact part 42 is specifically designed to contact the wafer 5. Its material and surface treatment can be selected according to the requirements of contacting the wafer 5, such as using soft, wear-resistant materials that will not damage the wafer 5. This design makes the structure of the entire first sliding member 44 more reasonable and better able to meet different functional needs. The first contact part 42 is specifically designed to abut against the second side of the wafer 5. Its shape and size can be designed to match the surface of the wafer 5, thereby achieving more precise clamping. The part in contact with the wafer 5 can be made relatively rounded and smooth to avoid scratching or abrasion on the surface of the wafer 5 during clamping, effectively protecting the quality and performance of the wafer 5. Meanwhile, by precisely controlling the movement of the first sliding part, the clamping force of the first contact part 42 on the wafer 5 can be adjusted to ensure that the clamping force is moderate, neither too small and causing the wafer 5 to loosen, nor too large and damaging. Since the first sliding part 44 adopts a split design, if the first contact part 42 wears or is damaged during long-term contact with the wafer 5, only the first contact part 42 needs to be replaced, rather than the entire first sliding part 44. This design reduces maintenance costs, improves component replaceability, and facilitates daily maintenance and upkeep of the clamping structure. The first sliding part moves within the first housing 41, which provides a clear movement guide. The inner wall of the first housing 41 restricts the movement direction of the first sliding part, ensuring it can only move along a specific straight line, preventing deviation or wobbling during movement. This ensures that the first contact part 42 accurately contacts the second side of the wafer 5, improving the stability and reliability of the entire clamping structure when clamping the wafer 5.

[0045] like Figures 2-3 As shown, in some embodiments, the first sliding part includes a first sliding rod, a notch 48 is provided on the side of the first sliding rod near the fixed part 3, protrusions 49 are formed on both sides of the notch 48, the first elastic member 47 abuts against the inner wall of the notch 48, and the first contact part 42 includes at least an elastic body disposed at the notch 48 and the protrusions 49 on both sides.

[0046] The first slide bar, as the core component of the first sliding part, is housed within the first housing 41 and can move in a specific direction (usually towards or away from the fixing part 3). A notch 48 on the side of the first slide bar near the fixing part 3 provides specific space for the subsequent installation of the elastic body and the interaction of the first elastic element 47. The first elastic element 47 is placed within the first housing 41, with one end abutting against the inner wall of the first housing 41 and the other end abutting against the inner wall of the notch 48. In the initial state, the first elastic element 47 is under a certain pre-compression and, according to its characteristics, always has a tendency to push the first slide bar towards the direction away from the fixing part 3. When it is necessary to clamp the wafer 5, the first slide bar is pushed towards the fixing part 3 by rotating the first screw 45. The first slide bar overcomes the elastic force of the first elastic element 47 and moves towards the fixing part 3. During this process, the elastic bodies located at the notch 48 and the protrusion 49 also move towards the fixing part 3. As the first slide bar moves, the elastic body gradually approaches the second side of the wafer 5. When it reaches the appropriate position, the elastic body abuts against the second side of the wafer 5. Because the elastic body has a certain elastic deformation capability, it will produce a certain elastic deformation when it contacts the wafer 5, thereby applying a soft and stable clamping force to the wafer 5, which, together with the fixing part 3, stably clamps the wafer 5.

[0047] like Figures 2-3 As shown, in some embodiments, the fixing part 3 is provided with a fixing contact part 31 corresponding to the first contact part 42 on the side of the fixing part 3 facing the first adjusting part 4, and the fixing contact part 31 is a thermoplastic polyester elastomer.

[0048] When it is necessary to clamp the wafer 5, the first sliding member 44 is pushed toward the fixing part 3 by operating the first adjusting part 4 (such as rotating the first screw 45). The first contact part 42 on the first sliding member 44 then moves closer to the fixing part 3. As the first contact part 42 continues to move, it eventually contacts the wafer 5 placed between the fixing part 3 and the first contact part 42, and continues to apply pressure. At the same time, the fixed contact part 31, which is provided on the side of the fixing part 3 facing the first adjusting part 4, is fixed in position. Under the push of the first contact part 42, the wafer 5 is tightly clamped between the first contact part 42 and the fixed contact part 31.

[0049] Thermoplastic polyester elastomer possesses excellent elasticity. When clamping wafer 5, the fixed contact portion 31 can undergo elastic deformation, acting as a buffer to absorb and disperse some of the pressure applied to wafer 5 by the first contact portion 42. This elastic buffering effect can prevent damage to wafer 5, such as scratches or cracks, caused by excessive clamping force or uneven local stress. This is especially beneficial for wafers with high surface quality requirements and fragile textures, effectively protecting their integrity and performance. During the transfer and clamping of wafer 5, the fixed contact portion 31 will experience relative friction with the surface of wafer 5. Thermoplastic polyester elastomer has good wear resistance, maintaining its shape and performance stability during prolonged friction and resisting wear. This not only ensures the continuous and effective clamping of wafer 5 by the fixed contact portion 31 but also reduces the cost and time consumption caused by frequent replacement of the fixed contact portion 31, extending the service life of the entire clamping structure.

[0050] The structure of the second adjustment part 6 is similar to that of the first adjustment part 4, except that the two sets of second adjustment parts 6 are respectively located on the third and fourth sides beside the first side of the wafer 5. For the specific clamping process, please refer to the clamping of the first adjustment part 4 described above, which will not be described in detail below:

[0051] like Figure 2 and Figure 4As shown, in some embodiments, the clamping structure further includes second adjustment portions 6 disposed on both sides of the first side of the wafer 5. The second adjustment portion 6 includes a second mounting portion and a second sliding member 63. The second mounting portion is mounted on the lower housing 2, and the second sliding member 63 can move relative to the second mounting portion to ensure that the second sliding member 63 is always in contact with the third and fourth sides of the first side of the wafer 5. The second mounting part includes a second mounting block 62, a second cover 61, and a second elastic member 67. The second mounting block 62 is mounted on the lower housing 2. The second sliding member 63 is disposed on the side of the second mounting block 62 near the wafer 5. A second screw 65 passes through the second mounting block 62. The end of the second screw 65 near the wafer 5 passes through the second mounting block 62 and contacts the second sliding member 63. A second baffle 64 is formed on the side of the second mounting block 62 away from the wafer 5. The second cover 61 is mounted on the second baffle 64. A second opening is opened on the side of the second cover 61 near the wafer 5 for the second sliding member 63 to pass through. The second elastic member 67 is disposed inside the second cover 61. The two ends of the second elastic member 67 abut against the inner wall of the cover and the side of the second sliding member 63 near the wafer 5, respectively. The second elastic member 67 always has a tendency to push the second sliding member 63 toward the direction away from the fixed part 3. The second sliding member 63 includes a second sliding part and a second contact part 66. The second sliding part is disposed inside the second housing 61 and can move inside the second housing 61. The second contact part 66 is disposed on the side of the second sliding part near the wafer 5. After passing through the second opening, the second contact part 66 abuts against the second side of the wafer 5.

[0052] The second mounting block 62 is securely mounted on the lower housing 2, providing basic support for the entire second adjustment section 6. The second cover 61 is mounted on the second baffle 64 formed on the side of the second mounting block 62 away from the wafer 5. A second opening on the side of the second cover 61 near the wafer 5 provides a channel for the movement of the second sliding member 63. The second elastic member 67 is placed inside the second cover 61, with its two ends abutting against the inner wall of the cover and the side of the second sliding member 63 near the wafer 5, respectively. In the initial state, the second elastic member 67 is in a certain pre-compressed or naturally extended state, always tending to push the second sliding member 63 away from the fixed part 3. The second sliding member 63 consists of a second sliding part and a second contact part 66. The second sliding part is located inside the second cover 61 and can move within it. The second contact part 66 is located on the side of the second sliding part near the wafer 5, ready to pass through the second opening and contact the wafer 5. Simultaneously, the second screw 65 passes through the second mounting block 62, with its end near the wafer 5 contacting the second sliding member 63.

[0053] When clamping the wafer 5 is required, the second screw 65 is rotated. Under the action of the threads on the second mounting block 62, the second screw 65 moves towards the wafer 5. Since the end of the second screw 65 closest to the wafer 5 is in contact with the second sliding member 63, as the second screw 65 moves, it pushes the second sliding member 63 to overcome the elastic force of the second elastic member 67 and move towards the wafer 5. The second sliding part slides within the second housing 61, and the second contact part 66 moves along with the second sliding part, passing through the second opening and gradually approaching the third and fourth sides beside the first side of the wafer 5. After the second contact part 66 contacts the wafer 5, the second screw 65 continues to rotate, and the second sliding member 63 applies a certain pressure to the wafer 5. Combined with the clamping action of the fixing part 3 and the first adjusting part 4 on the other side of the wafer 5, the wafer 5 is stably clamped in the middle.

[0054] like Figure 2 As shown, in some embodiments, the fixing part 3, the first adjusting part 4, and the two sets of second adjusting parts 6 together form an area for placing the wafer 5, and the fixing part 3, the first adjusting part 4, and the two sets of second adjusting parts 6 are distributed around the wafer 5.

[0055] The fixing part 3 is in a relatively fixed position, serving as the basic positioning part of the entire clamping structure. The first adjusting part 4 is located on a specific side of the wafer 5, and moves closer to or away from the wafer 5 by the movement of components such as the first sliding member 44 inside it, realizing the clamping or loosening operation on one side of the wafer 5. Two sets of second adjusting parts 6 are located on both sides of the first side of the wafer 5, and the second sliding member 63 in each set of second adjusting parts 6 can move closer to or away from the wafer 5 under the action of components such as the second screw 65. When these components are installed according to the design, the fixing part 3, the first adjusting part 4, and the two sets of second adjusting parts 6 naturally form an area for placing the wafer 5, and they are distributed around the wafer 5, forming a comprehensive surrounding situation for the wafer 5.

[0056] Because the fixing part 3, the first adjusting part 4, and the two sets of second adjusting parts 6 are distributed around the wafer 5, clamping forces are applied to the wafer 5 from multiple directions, effectively restricting the six degrees of freedom (three translational degrees of freedom and three rotational degrees of freedom) of the wafer 5. This all-around clamping method ensures that the wafer 5 will not wobble, shift, or rotate during transport, greatly improving the positional accuracy and stability of the wafer 5. This distribution method has a certain degree of flexibility and versatility. For wafers 5 of different shapes (such as round, square, etc.) and sizes, the clamping force and range can be changed by adjusting the moving distance of the sliding parts in the first adjusting part 4 and the second adjusting part 6, thereby adapting to the clamping requirements of wafers 5 of different specifications. There is no need to design a unique clamping structure for each type of wafer 5.

[0057] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0058] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer transfer box clamping structure, the wafer transfer box comprising a separable upper box body and a lower box body, the upper box body and the lower box body cooperating to form a receiving space for placing wafers, the clamping structure being disposed within the receiving space for clamping and fixing the wafers, characterized in that, The clamping structure includes: A fixing part is mounted on the lower housing and abuts against the first side of the wafer; The first adjustment part includes a first mounting part and a first sliding member. The first mounting part is mounted on the lower housing. The first sliding member can move relative to the first mounting part to realize the change of distance between the first sliding member and the fixed part, ensuring that the first sliding member is always in contact with the second side opposite to the first side of the wafer.

2. The wafer transfer box clamping structure according to claim 1, characterized in that, The first mounting part includes a first mounting block, which is mounted on the lower housing. The first sliding member is disposed on the side of the first mounting block near the fixed part. A first screw passes through the first mounting block, and the end of the first screw near the fixed part passes through the first mounting block and contacts the first sliding member.

3. The wafer transfer box clamping structure according to claim 2, characterized in that, The first mounting part further includes a first cover and a first elastic member. A first baffle is formed on the side of the first mounting block away from the fixed part. The first cover is mounted on the first baffle. A first opening is provided on the side of the first cover near the fixed part for the first sliding member to pass through. The first elastic member is disposed inside the cover. The two ends of the first elastic member abut against the inner wall of the first cover and the side of the first sliding member near the fixed part, respectively. The first elastic member always has the tendency to push the first sliding member toward the direction away from the fixed part.

4. The wafer transfer box clamping structure according to claim 3, characterized in that, The first sliding member includes a first sliding part and a first contact part. The first sliding part is disposed inside the first housing and can move inside the first housing. The first contact part is disposed on the side of the first sliding part near the fixed part. After passing through the first opening, the first contact part abuts against the second side of the wafer.

5. The wafer transfer box clamping structure according to claim 4, characterized in that, The first sliding part includes a first sliding rod, a notch is provided on the side of the first sliding rod near the fixed part, and protrusions are formed on both sides of the notch. The first elastic element abuts against the inner wall of the notch, and the first contact part includes at least an elastic body disposed at the notch and the protrusions on both sides.

6. The wafer transfer box clamping structure according to claim 4, characterized in that, The fixing part is provided with a fixing contact part corresponding to the first contact part on the side facing the first adjustment part, and the fixing contact part is a thermoplastic polyester elastomer.

7. The wafer transfer box clamping structure according to any one of claims 1-6, characterized in that, The clamping structure further includes a second adjustment portion disposed on both sides of the first side of the wafer. The second adjustment portion includes a second mounting portion and a second sliding member. The second mounting portion is mounted on the lower housing. The second sliding member can move relative to the second mounting portion to ensure that the second sliding member is always in contact with the third and fourth sides of the wafer beside the first side.

8. The wafer transfer box clamping structure according to claim 7, characterized in that, The second mounting part includes a second mounting block, a second cover, and a second elastic member. The second mounting block is mounted on the lower housing. The second sliding member is disposed on the side of the second mounting block near the wafer. A second screw passes through the second mounting block. The end of the second screw near the wafer passes through the second mounting block and contacts the second sliding member. A second baffle is formed on the side of the second mounting block away from the wafer. The second cover is mounted on the second baffle. A second opening is provided on the side of the second cover near the wafer for the second sliding member to pass through. The second elastic member is disposed inside the second cover. The two ends of the second elastic member abut against the inner wall of the cover and the side of the second sliding member near the wafer, respectively. The second elastic member always has a tendency to push the second sliding member away from the fixed part.

9. The wafer transfer box clamping structure according to claim 8, characterized in that, The second sliding member includes a second sliding part and a second contact part. The second sliding part is disposed inside the second housing and can move inside the second housing. The second contact part is disposed on the side of the second sliding part near the wafer. After passing through the second opening, the second contact part abuts against the second side of the wafer.

10. The wafer transfer box clamping structure according to claim 7, characterized in that, The fixing part, the first adjusting part, and the two sets of second adjusting parts together form an area for placing the wafer, and the fixing part, the first adjusting part, and the two sets of second adjusting parts are distributed around the wafer.

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