Resin composition, layer-adding film, preparation method of layer-adding film and FC-BGA (Fiber Channel-Ball Grid Array) support plate

Abstract

The invention relates to a resin composition, a layer-adding film, a preparation method of the layer-adding film and an FC-BGA carrier plate. The resin composition comprises the following components in parts by mass: 10-30 parts of a functional material; 10 to 40 parts of epoxy resin; 10 to 40 parts of cyanate ester resin; 100 to 300 parts of an inorganic filler; and 1-5 parts of a curing accelerator; the functional material comprises a modified hydrocarbon resin prepolymer, and preparation raw materials of the modified hydrocarbon resin prepolymer comprise an allyl benzoxazine nitrile compound and hydrocarbon resin. The modified hydrocarbon resin prepolymer taking the allyl benzoxazine nitrile compound and the hydrocarbon resin as preparation raw materials is used as a functional material and interacts with the epoxy resin, the cyanate ester resin, the inorganic filler and the curing accelerator according to a proper proportion, so that the high-temperature modulus and the dielectric property of the resin composition can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a resin composition, a build-up film, a preparation method thereof and an FC-BGA carrier plate. BACKGROUND

[0002] FC-BGA (flip chip ball grid array) carrier plate is a kind of carrier plate, which is characterized by the fact that a chip is turned upside down and attached to the surface of the carrier plate with the functional surface facing down, and the direct electrical connection and signal transmission between the chip and the carrier plate are realized through solder balls. This technology has been widely used in many fields such as computers, communications, consumer electronics, medical treatment and industrial control due to its high speed, high density and high reliability.

[0003] In the manufacturing process of FC-BGA carrier plate, semi-additive process (SAP) has become the current mainstream technology due to its ability to realize fine line processing and effectively improve the wiring density of the carrier plate. The performance of the build-up film, which is the core material in the SAP process, directly determines the final quality of the FC-BGA carrier plate. A high-quality build-up film not only provides stable and reliable insulation support for the carrier plate, but also helps the carrier plate to achieve higher integration, smaller packaging size, better use reliability and lower power consumption. However, traditional build-up films generally have two technical problems: insufficient high-temperature modulus and poor dielectric performance. Insufficient high-temperature modulus can easily cause the substrate to deform during subsequent processing, which can damage the process stability. Poor dielectric performance can cause large dielectric loss in high-frequency and high-speed application scenarios, accompanied by a large amount of heat accumulation, which can seriously affect the actual application effect of the build-up film.

[0004] Therefore, it is necessary to improve the traditional technology. SUMMARY

[0005] Based on this, the present application provides a resin composition with good high-temperature modulus and dielectric performance, a build-up film, a preparation method thereof and an FC-BGA carrier plate.

[0006] The technical solution of the present application to solve the above technical problems is as follows.

[0007] The first aspect of the present application provides a resin composition, which comprises the following components by mass fraction:

[0008] 10-30 parts of functional material;

[0009] 10-40 parts of epoxy resin;

[0010] 10-40 parts of cyanate ester resin;

[0011] 100-300 parts of inorganic filler; and

[0012] 1-5 parts of curing accelerator;

[0013] The functional material includes a modified hydrocarbon resin prepolymer, and a raw material for preparing the modified hydrocarbon resin prepolymer includes an allyl benzoxazine nitrile-based compound and a hydrocarbon resin.

[0014] In some embodiments, the resin composition satisfies at least one of the following characteristics:

[0015] (1) the mass ratio of the functional material to the epoxy resin is 0.25-1.8:1;

[0016] (2) the mass ratio of the cyanate ester resin to the epoxy resin is 0.25-2:1;

[0017] (3) the mass ratio of the inorganic filler to the epoxy resin is 4-10:1.

[0018] In some embodiments, the resin composition includes at least one of polybutadiene, epoxidized polybutadiene, a butadiene and styrene copolymer, and a butadiene and acrylic acid copolymer.

[0019] In some embodiments, the resin composition includes an allyl benzoxazine nitrile-based compound having a structure as shown in Formula (I):

[0020]

[0021] wherein R is selected from -CHR1-, -CR2R3-, -SO2-, -O-, a dicyclopentadiene ring, a naphthalene ring, a biphenyl ring, a fluorene ring, or an anthracene ring; R1, R2, and R3 are each independently selected from -H or -CH3.

[0022] In some embodiments, the resin composition includes a modified hydrocarbon resin prepolymer, and a raw material for preparing the modified hydrocarbon resin prepolymer includes an allyl benzoxazine nitrile-based compound and a hydrocarbon resin.

[0023] The allyl benzoxazine nitrile-based compound and the hydrocarbon resin are mixed, and a prepolymerization reaction is performed at 100-250°C to produce the modified hydrocarbon resin prepolymer.

[0024] In some embodiments, the resin composition satisfies at least one of the following characteristics:

[0025] (1) the epoxy resin includes at least one of a naphthalene-type epoxy resin, a bisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, a phosphorus-containing epoxy resin, an unsaturated epoxy resin, a phenol aldehyde-type epoxy resin, an alicyclic epoxy resin, a resorcinol epoxy resin, a rubber-modified epoxy resin, a biphenyl epoxy resin, a silicone-modified epoxy resin, and a dicyclopentadiene epoxy resin;

[0026] (2) the cyanate ester resin is selected from at least one of bisphenol A type cyanate ester resin, phenol-aldehyde type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol M type cyanate ester resin, bisphenol E type cyanate ester resin, naphthalene type cyanate ester resin, biphenyl type cyanate ester resin, bisphenol S type cyanate ester resin and dicyclopentadiene bisphenol type cyanate ester resin;

[0027] (3) the curing accelerator comprises at least one of tertiary amine type accelerator, imidazole type accelerator, peroxide type accelerator, organic phosphorus type accelerator and transition metal carboxylate type accelerator;

[0028] (4) the inorganic filler comprises at least one of zirconium vanadate, zirconium tungstate, hafnium tungstate, microcrystalline glass, lithium feldspar, silicon dioxide, mica powder, titanium dioxide, magnesium oxide, magnesium hydroxide, talc powder, aluminum oxide, silicon carbide, boron nitride, aluminum nitride, molybdenum oxide, barium sulfate, zinc molybdate, zinc borate, zinc stannate, zinc oxide, strontium titanate, barium titanate, calcium titanate, clay and kaolin.

[0029] In some embodiments, the resin composition further comprises an organic filler, which satisfies at least one of the following characteristics:

[0030] (1) the organic filler is 10-30 parts by mass in the resin composition;

[0031] (2) the organic filler comprises at least one of silicone particles, rubber particles and olefin elastomer particles.

[0032] In some embodiments, the resin composition further comprises 1-5 parts by mass of an auxiliary agent, which comprises at least one of dispersing agent, leveling agent, defoaming agent and coupling agent.

[0033] The second aspect of the present application provides a build-up film, and the raw material for preparing the build-up film comprises the resin composition provided in the first aspect.

[0034] The third aspect of the present application provides a method for preparing a build-up film, which comprises the following steps:

[0035] The resin composition provided in the first aspect is arranged on a support, and the build-up film is formed on the support after heat treatment.

[0036] In some embodiments, the temperature of the heat treatment is 80-160℃ and the time is 2-15 min in the method for preparing the build-up film.

[0037] The fourth aspect of the present application provides an FC-BGA carrier plate, which comprises the build-up film provided in the second aspect or the build-up film prepared by the method provided in the third aspect.

[0038] The resin composition of the present application, a modified hydrocarbon resin prepolymer using an allyl benzoxazine nitrile-based compound and a hydrocarbon resin as a raw material, grafts an allyl benzoxazine and a nitrile group to a hydrocarbon resin in the form of a prepolymer, and interacts with an epoxy resin, a cyanate ester resin, an inorganic filler, and a curing accelerator in a suitable ratio, thereby effectively improving the high-temperature modulus and dielectric properties of the resin composition. DETAILED DESCRIPTION

[0039] The present application will be further described below in connection with embodiments and examples. It should be understood that these embodiments and examples are only used to explain the present application and not used to limit the scope of the present application, and the purpose of providing these embodiments and examples is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0040] It should also be understood that the present application can be implemented in many different forms and is not limited to the embodiments and examples described herein, and those skilled in the art can make various modifications or changes without departing from the spirit of the present application, and the equivalent forms obtained thereby also fall within the protection scope of the present application. For example, features described or illustrated as part of one embodiment can be combined in another embodiment in a suitable manner to produce a new embodiment. In addition, in the following description, a large number of specific details are given in order to provide a more complete understanding of the present application, and it should be understood that the present application can be implemented without one or more of these details.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the specification of the present application herein is only for the purpose of describing the embodiments and examples and is not intended to limit the present application.

[0042] Unless otherwise stated or contradictory, the terms or phrases used herein have the following meanings:

[0043] In the present application, "a plurality of", "a plurality of kinds", "a plurality of times", and the like, unless specifically limited, refer to more than two or equal to two in number. For example, "one or more" means one or more than two.

[0044] As used herein, "combinations thereof", "any combination thereof", "any combination manner thereof", and the like, include all suitable combination manners of any two or more of the listed items.

[0045] As used herein, "suitable", "suitable", "any suitable manner", and the like, are subject to the ability to implement the technical solutions of the present application, solve the technical problems of the present application, and achieve the intended technical effects of the present application.

[0046] In the present application, “preferably”, “more preferably”, “even more preferably”, “suitably”, “more suitably”, “even more suitably” are used to describe the better effect of the embodiments or examples, and should be understood as not limiting the scope of protection of the present application. If there are multiple “preferably” in a technical solution, and there is no contradictory or mutually restrictive relationship, each “preferably” is independent.

[0047] In the present application, “further”, “even further”, “in particular” and the like are used to describe the difference in content, but should not be understood as limiting the scope of protection of the present application.

[0048] In the present application, “optionally”, “optional” and “may” mean that it can or can not exist, that is, it means to select any one of the two parallel schemes of “yes” or “no”. If there are multiple “optionally” in a technical solution, and there is no contradictory or mutually restrictive relationship, each “optionally” is independent.

[0049] In the present application, in the terms “first aspect”, “second aspect”, “third aspect”, “fourth aspect” and the like, the terms “first”, “second”, “third”, “fourth” and the like are only used for description purposes, and cannot be understood as indicating or implying relative importance or quantity, nor can it be understood as implying the importance or quantity of the indicated technical features. Moreover, “first”, “second”, “third”, “fourth” and the like only serve the purpose of non-exhaustive enumeration description, and should be understood as not constituting a closed limitation on the quantity.

[0050] In the present application, in the technical features described in an open manner, both the closed technical solution composed of the listed features and the open technical solution containing the listed features are included.

[0051] In the present application, with respect to the numerical interval (i.e. numerical range), if not otherwise specified, the distribution of the optional values in the numerical interval is considered to be continuous, and includes both numerical endpoints (i.e. the minimum value and the maximum value) of the numerical interval, as well as every value between the two numerical endpoints. If not otherwise specified, when the numerical interval only points to the integers in the numerical interval, including the two endpoint integers of the numerical range and every integer between the two endpoints, it is equivalent to directly listing each integer. When multiple numerical ranges are provided to describe a feature or characteristic, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical range disclosed herein should be understood to include any and all sub-ranges encompassed therein. The “numerical value” in the numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. The “numerical interval” is allowed to broadly include numerical interval types such as percentage interval, ratio interval, ratio interval, etc.

[0052] The temperature parameters in the present application, if not particularly limited, allow for both constant temperature treatment and for variations within a certain temperature range. It is to be understood that the constant temperature treatment allows for fluctuations within the accuracy of the instrument control. Fluctuations within a range of, for example, ±5°C, ±4°C, ±3°C, ±2°C, ±1°C are allowed.

[0053] In the present application, the term "room temperature" or "ambient temperature" generally refers to 4°C to 35°C, for example 20°C ± 5°C. In some embodiments of the present application, "room temperature" or "ambient temperature" refers to 10°C to 30°C. In some embodiments of the present application, "room temperature" or "ambient temperature" refers to 20°C to 30°C.

[0054] In the present application, units relating to data ranges, if only the right end point is followed by a unit, mean that the units of the left end point and the right end point are the same. For example, 3 to 5 h means that the units of the left end point "3" and the right end point "5" are both h (hours).

[0055] The mass or weight of the relevant components mentioned in the present application embodiment specification can not only refer to the specific content of each component, but also represent the proportional relationship between the mass or weight of each component. Therefore, as long as the content of the relevant components in the present application embodiment specification is enlarged or reduced in proportion, it is within the scope disclosed in the present application embodiment specification. Specifically, the mass or weight described in the present application embodiment specification can be μg, mg, g, kg and other units commonly known in the chemical industry.

[0056] An embodiment of the present application provides a resin composition comprising the following components by mass fraction:

[0057] 10 to 30 parts of a functional material;

[0058] 10 to 40 parts of an epoxy resin;

[0059] 10 to 40 parts of a cyanate ester resin;

[0060] 100 to 300 parts of an inorganic filler; and

[0061] 1 to 5 parts of a curing accelerator;

[0062] The functional material comprises a modified hydrocarbon resin prepolymer, and the raw materials for preparing the modified hydrocarbon resin prepolymer comprise an allyl benzoxazine nitrile compound and a hydrocarbon resin.

[0063] It can be understood that the modified hydrocarbon resin prepolymer is obtained by pre-polymerizing the allyl benzoxazine nitrile compound and the hydrocarbon resin.

[0064] The allyl benzoxazine and nitrile group are grafted onto the hydrocarbon resin in the form of prepolymer to form a modified hydrocarbon resin prepolymer, and the modified hydrocarbon resin prepolymer is used as a functional material to cooperate with the epoxy resin. The benzoxazine ring in the modified hydrocarbon resin prepolymer crosslinks with the epoxy resin, effectively improving the crosslinking density of the resin composition. The hardness of the inorganic filler is relatively high, and the cyanate resin solidifies the epoxy resin, which can effectively improve the high-temperature modulus of the resin composition in multiple ways. The dielectric properties of the hydrocarbon resin and the inorganic filler are good. The modified hydrocarbon resin prepolymer is combined with the inorganic filler, and the cyanate resin solidifies the epoxy resin, which can effectively improve the dielectric properties of the resin composition.

[0065] It can be understood that in the resin composition, the mass fraction of the functional material includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts; the mass fraction of the epoxy resin includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts; the mass fraction of the cyanate resin includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts; the mass fraction of the inorganic filler includes but is not limited to 100 parts, 110 parts, 120 parts, 130 parts, 140 parts, 150 parts, 160 parts, 170 parts, 180 parts, 190 parts, 200 parts, 210 parts, 220 parts, 230 parts, 240 parts, 250 parts, 260 parts, 270 parts, 280 parts, 290 parts, 300 parts; the mass fraction of the curing accelerator includes but is not limited to 1 part, 2 parts, 3 parts, 4 parts, 5 parts. In some examples, any two of these point values can form a range as an end value, and the same applies below.

[0066] It can be understood that in the resin composition, the mass ratio of the functional material to the epoxy resin is 0.25-3:1. It can be understood that the mass ratio of the functional material to the epoxy resin includes but is not limited to 0.25:1, 0.3:1, 0.4:1, 0.5:1, 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1:1, 1.1:1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, 1.6:1, 1.7:1, 1.8:1, 1.9:1, 2:1, 2.1:1, 2.2:1, 2.3:1, 2.4:1, 2.5:1, 2.6:1, 2.7:1, 2.8:1, 2.9:1, 3:1. In some of the examples, the mass ratio of the functional material to the epoxy resin in the resin composition is 0.25-1.8:1. By controlling the mass ratio of the functional material to the epoxy resin, the crosslinking density of the resin composition can be controlled, thereby further improving the high-temperature modulus and dielectric properties of the resin composition.

[0067] It is appreciated that the mass ratio of the cyanate ester resin to the epoxy resin in the resin composition is 0.25-4:1. It is appreciated that the mass ratio of the cyanate ester resin to the epoxy resin includes, but is not limited to, 0.25:1, 0.3:1, 0.4:1, 0.5:1, 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1:1, 1.1:1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, 1.6:1, 1.7:1, 1.8:1, 1.9:1, 2:1, 2.1:1, 2.2:1, 2.3:1, 2.4:1, 2.5:1, 2.6:1, 2.7:1, 2.8:1, 2.9:1, 3:1, 3.1:1, 3.2:1, 3.3:1, 3.4:1, 3.5:1, 3.6:1, 3.7:1, 3.8:1, 3.9:1, 4:1. In some examples, the mass ratio of the cyanate ester resin to the epoxy resin in the resin composition is 0.25-2:1. By controlling the mass ratio of the cyanate ester resin to the epoxy resin, the cyanate ester resin can be facilitated to cure the epoxy resin, thereby further improving the high temperature modulus and dielectric properties of the resin composition, while also effectively improving the heat resistance of the resin composition.

[0068] It is appreciated that the mass ratio of the inorganic filler to the epoxy resin in the resin composition is 2.5-30:1. It is appreciated that the mass ratio of the inorganic filler to the epoxy resin includes, but is not limited to, 2.5:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1, 10:1, 11:1, 12:1, 13:1, 14:1, 15:1, 16:1, 17:1, 18:1, 19:1, 20:1, 21:1, 22:1, 23:1, 24:1, 25:1, 26:1, 27:1, 28:1, 29:1, 30:1. In some examples, the mass ratio of the inorganic filler to the epoxy resin in the resin composition is 4-10:1. By controlling the mass ratio of the inorganic filler to the epoxy resin, the high temperature modulus and dielectric properties of the resin composition can be further improved.

[0069] In some examples, the hydrocarbon resin in the resin composition includes a polybutadiene-based resin.

[0070] In some examples, the hydrocarbon resin in the resin composition includes at least one of a polybutadiene, an epoxidized polybutadiene, a butadiene and styrene copolymer, and a butadiene and acrylic acid copolymer.

[0071] In some examples, the allylbenzoxazinone-based compound in the resin composition has a structural formula as shown in Formula (I):

[0072]

[0073] wherein R is selected from -CHR1-, -CR2R3-, -SO2-, -O-, a dicyclopentadiene ring, a naphthalene ring, a biphenyl ring, a fluorene ring, or an anthracene ring; R1, R2, and R3are each independently selected from -H or -CH3.

[0074] In some examples, the modified hydrocarbon resin prepolymer is prepared by mixing the allyl benzoxazinone nitrile compound and the hydrocarbon resin at a temperature of 100°C to 250°C to form a prepolymer.

[0075] In some examples, the modified hydrocarbon resin prepolymer is prepared by mixing the allyl benzoxazinone nitrile compound and the hydrocarbon resin at a temperature of 100°C to 250°C to form a prepolymer.

[0076] It is understood that the temperature of the prepolymerization reaction includes, but is not limited to, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, 180°C, 190°C, 200°C, 210°C, 220°C, 230°C, 240°C, 250°C.

[0077] Optionally, the prepolymerization reaction is performed for a time period of 120 minutes to 300 minutes. It is understood that the time period of the prepolymerization reaction includes, but is not limited to, 120 minutes, 130 minutes, 140 minutes, 150 minutes, 160 minutes, 170 minutes, 180 minutes, 190 minutes, 200 minutes, 210 minutes, 220 minutes, 230 minutes, 240 minutes, 250 minutes, 260 minutes, 270 minutes, 280 minutes, 290 minutes, 300 minutes.

[0078] Optionally, in some examples, the allyl benzoxazinone nitrile compound is first melted and then the hydrocarbon resin is added to the melted allyl benzoxazinone nitrile compound to form the prepolymer.

[0079] In some examples, the allyl benzoxazinone nitrile compound and the hydrocarbon resin are mixed in a mass ratio of 0.5:1 to 1:1. It is understood that the mass ratio of the allyl benzoxazinone nitrile compound and the hydrocarbon resin includes, but is not limited to, 0.5:1, 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1.0:1.

[0080] In some examples, the epoxy resin includes at least one of a naphthalene type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phosphorus-containing epoxy resin, an unsaturated epoxy resin, a phenolic type epoxy resin, an alicyclic epoxy resin, a resorcinol epoxy resin, a rubber-modified epoxy resin, a biphenyl epoxy resin, a silicone-modified epoxy resin, and a dicyclopentadiene epoxy resin. It is understood that the phenolic type epoxy resin includes, but is not limited to, at least one of an o-cresylic phenolic epoxy resin and a bisphenol A phenolic epoxy resin.

[0081] In some examples, the cyanate ester resin in the resin composition is selected from at least one of bisphenol A type cyanate ester resin, phenol-aldehyde type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol M type cyanate ester resin, bisphenol E type cyanate ester resin, naphthalene type cyanate ester resin, biphenyl type cyanate ester resin, bisphenol S type cyanate ester resin, and dicyclopentadiene bisphenol type cyanate ester resin.

[0082] In some examples, the curing accelerator in the resin composition includes at least one of tertiary amine type accelerator, imidazole type accelerator, peroxide type accelerator, organic phosphorus type accelerator, and transition metal carboxylate type accelerator.

[0083] In some examples, the inorganic filler in the resin composition includes at least one of zirconium vanadate, zirconium tungstate, hafnium tungstate, microcrystalline glass, lithium feldspar, silica, mica powder, titanium dioxide, magnesium oxide, magnesium hydroxide, talc powder, aluminum oxide, silicon carbide, boron nitride, aluminum nitride, molybdenum oxide, barium sulfate, zinc molybdate, zinc borate, zinc stannate, zinc oxide, strontium titanate, barium titanate, calcium titanate, clay, and kaolin. It can be understood that the silica can be quartz.

[0084] In some examples, the resin composition further includes an organic filler.

[0085] Optionally, the organic filler in the resin composition is 10-30 parts by mass. It can be understood that the parts by mass of the organic filler in the resin composition includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts.

[0086] It can be understood that the mass ratio of the organic filler to the inorganic filler is about 0.03-0.3:1. It can be understood that the mass ratio of the organic filler to the inorganic filler includes but is not limited to 0.03:1, 0.04:1, 0.05:1, 0.06:1, 0.07:1, 0.08:1, 0.09:1, 0.1:1, 0.11:1, 0.12:1, 0.13:1, 0.14:1, 0.15:1, 0.16:1, 0.17:1, 0.18:1, 0.19:1, 0.2:1, 0.21:1, 0.22:1, 0.23:1, 0.24:1, 0.25:1, 0.26:1, 0.27:1, 0.28:1, 0.29:1, 0.3:1. Optionally, the mass ratio of the organic filler to the inorganic filler is 0.08-0.2:1. Further, the mass ratio of the organic filler to the inorganic filler is 0.1-0.15:1.

[0087] Optionally, the organic filler includes at least one of silicone particles, rubber particles, and olefin elastomer particles. It can be understood that the rubber particles can be core-shell structure.

[0088] In some examples, the resin composition further comprises an additive in an amount of 1-5 parts by mass. It can be understood that the additive in the resin composition includes but is not limited to 1 part, 2 parts, 3 parts, 4 parts, 5 parts by mass. Optionally, the additive includes at least one of a dispersing agent, a leveling agent, a defoaming agent, and a coupling agent.

[0089] An embodiment of the present application provides a build-up film, and a raw material for preparing the build-up film includes the resin composition.

[0090] Optionally, the build-up film has a thickness of 10-150 μm.

[0091] The build-up film provided by the present application has good high-temperature modulus and dielectric properties.

[0092] An embodiment of the present application provides a method for preparing a build-up film, including the following steps:

[0093] The resin composition is arranged on a support, and a build-up film is formed on the support after heat treatment.

[0094] The method for preparing the build-up film provided by the present application uses the resin composition, and can effectively improve the high-temperature modulus and dielectric properties of the build-up film.

[0095] In some examples, the method for preparing the build-up film has a heat treatment temperature of 80-160 °C and a heat treatment time of 2-15 min. It can be understood that the heat treatment temperature includes but is not limited to 80 °C, 90 °C, 100 °C, 110 °C, 120 °C, 130 °C, 140 °C, 150 °C, 160 °C, and the heat treatment time includes but is not limited to 2 min, 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min, 10 min, 11 min, 12 min, 13 min, 14 min, 15 min. By controlling the heat treatment temperature and time, the cross-linking density and cross-linking network structure of the resin component in the build-up film are regulated, and the interface bonding between the inorganic filler and the organic matrix is promoted, so that the high-temperature modulus and dielectric properties of the build-up film can be further improved.

[0096] It can be understood that the resin composition is arranged on the support in the form of coating. The resin composition is coated on the support to form a resin composition coating layer, and the build-up film is prepared after heat treatment.

[0097] In some examples, the method for preparing the build-up film has a support selected from at least one of a plastic film and a metal film.

[0098] Optionally, the plastic film includes, but is not limited to, at least one of polyethylene terephthalate (PET), polycarbonate (PC), and polymethyl methacrylate (PMMA), etc.

[0099] Optionally, the metal film includes, but is not limited to, at least one of copper foil and aluminum foil, etc.

[0100] Optionally, the thickness of the support body is 3 μm to 105 μm.

[0101] An embodiment of the present application provides an FC-BGA (flip chip ball grid array) carrier plate including the build-up film or the build-up film prepared by the preparation method of the build-up film.

[0102] The FC-BGA carrier plate of the present application includes the build-up film or the build-up film prepared by the preparation method of the build-up film, and thus has at least the same advantages as the build-up film or the build-up film prepared by the preparation method of the build-up film.

[0103] The present application will be further described in detail below with reference to specific embodiments, but the embodiments of the present application are not limited thereto.

[0104] Some components in the examples and comparative examples are from the following sources:

[0105] Preparation of allyl benzoxazine nitrile-based compound: diallyl bisphenol S (0.1 mol), paraformaldehyde (0.44 mol), 4-(4-aminophenoxy) phthalonitrile (0.2 mol), and 300 mL of toluene were added into a 500 mL single-necked flask, the reaction mixture was stirred and heated under reflux for 5 hours; the reaction mixture was washed with 3 mol / L NaOH aqueous solution and distilled water for 3 times, respectively; after the solvent was removed by a rotary evaporator, column chromatography was performed; the liquid product was vacuum dried at 60°C for 48 hours (the yield was about 83%). The structural formula is as follows:

[0106]

[0107] Preparation of modified hydrocarbon resin prepolymer A: 80 parts of allylated benzoxazine nitrile-based compound were heated to a molten state, 100 parts of hydrocarbon resin (SBS) were added, and after pre-polymerization at 150°C for 120 min, the mixture was cooled to room temperature to obtain modified hydrocarbon resin prepolymer A.

[0108] Preparation of modified polyphenyl ether prepolymer B: 80 parts of allylated benzoxazine nitrile-based compound were heated to a molten state, 100 parts of bismaleimide resin were added, and after pre-polymerization at 150°C for 120 min, the mixture was cooled to room temperature to obtain modified polyphenyl ether prepolymer B.

[0109] Hydrocarbon resin (SBS): Kravos R100;

[0110] Naphthalene type epoxy resin: DIC HP-5000;

[0111] Cyanate ester resin: Lonza BA-230S;

[0112] Imidazole accelerator: Shikoku Chemicals 2-MI;

[0113] Spherical silica: Wacker SO-C1;

[0114] Defoamer: BYK-Chemie BYK-141;

[0115] Core-shell rubber particles: Zeon Chemicals CSR.

[0116] Example 1

[0117] In the order of 30 parts of modified hydrocarbon resin prepolymer A, 25 parts of naphthalene type epoxy resin, 25 parts of bisphenol A type cyanate ester resin, 3 parts of imidazole accelerator, 100 parts of spherical silica, 3 parts of defoamer and 10 parts of core-shell rubber particles were dissolved in 80 parts of mixed solvent of methyl ketone, toluene and propylene glycol methyl ether, wherein methyl ketone, toluene and propylene glycol methyl ether were mixed in a mass ratio of 1:1:1, and after being fully stirred and uniformly mixed, they were sprayed on the surface of a PET support with a thickness of 38 μm, and then baked at 110°C for 5 min to obtain a build-up film with a thickness of 50 μm.

[0118] Example 2

[0119] In the order of 10 parts of modified hydrocarbon resin prepolymer A, 40 parts of naphthalene type epoxy resin, 10 parts of bisphenol A type cyanate ester resin, 1 part of imidazole accelerator, 200 parts of spherical silica, 1 part of defoamer and 20 parts of core-shell rubber particles were dissolved in 80 parts of mixed solvent of methyl ketone, toluene and propylene glycol methyl ether, wherein methyl ketone, toluene and propylene glycol methyl ether were mixed in a mass ratio of 1:1:1, and after being fully stirred and uniformly mixed, they were sprayed on the surface of a PET support with a thickness of 38 μm, and then baked at 110°C for 5 min to obtain a build-up film with a thickness of 50 μm.

[0120] Example 3

[0121] In the order of 20 parts of modified hydrocarbon resin prepolymer A, 10 parts of naphthalene type epoxy resin, 40 parts of bisphenol A type cyanate ester resin, 5 parts of imidazole accelerator, 300 parts of spherical silica, 5 parts of defoamer and 30 parts of core-shell rubber particles were dissolved in 80 parts of mixed solvent of methyl ketone, toluene and propylene glycol methyl ether, wherein methyl ketone, toluene and propylene glycol methyl ether were mixed in a mass ratio of 1:1:1, and after being fully stirred and uniformly mixed, they were sprayed on the surface of a PET support with a thickness of 38 μm, and then baked at 110°C for 5 min to obtain a build-up film with a thickness of 50 μm.

[0122] Example 4

[0123] The same as Example 1 except that the core-shell rubber particles in Example 1 were omitted and the amount of spherical silica was increased to 110 parts.

[0124] Example 5

[0125] The same as Example 1 except that the amount of modified hydrocarbon resin prepolymer A was 23 parts, the amount of naphthalene-type epoxy resin was 32 parts, and the mass ratio of modified hydrocarbon resin prepolymer A to naphthalene-type epoxy resin was about 0.7:1.

[0126] Comparative Example 1

[0127] 50 parts of modified hydrocarbon resin prepolymer A, 25 parts of naphthalene-type epoxy resin, 25 parts of bisphenol A cyanate ester resin, 3 parts of imidazole accelerator, 100 parts of spherical silica, 3 parts of defoaming agent, and 10 parts of core-shell rubber particles were sequentially dissolved in 80 parts of a mixed solvent of methyl ketone, toluene, and propylene glycol methyl ether, wherein the methyl ketone, toluene, and propylene glycol methyl ether were mixed in a mass ratio of 1:1:1, and after being fully stirred and uniformly mixed, the mixture was sprayed onto the surface of a PET support with a thickness of 38 μm, and then baked at 110°C for 5 min to obtain a build-up film with a thickness of 50 μm.

[0128] Comparative Example 2

[0129] The same as Example 1 except that the modified hydrocarbon resin prepolymer A in Example 1 was replaced with an equal amount of hydrocarbon resin (SBS).

[0130] Comparative Example 3

[0131] The same as Example 1 except that the bisphenol A cyanate ester resin was omitted and the amount of modified hydrocarbon resin prepolymer A was increased to 55 parts.

[0132] Comparative Example 4

[0133] The same as Example 1 except that the modified hydrocarbon resin prepolymer A in Example 1 was replaced with an equal amount of modified hydrocarbon resin prepolymer B.

[0134] The composition of the resin composition in the above examples and comparative examples is shown in Table 1 below.

[0135] Table 1

[0136]

[0137] The build-up films prepared in the above examples and comparative examples were tested, and the testing methods were as follows:

[0138] The build-up film obtained above (without PET film side) was laminated with 10 layers of copper foil with a thickness of 12 μm by a vacuum laminator, and then the PET film was removed and a copper foil with a thickness of 12 μm was laminated thereon. The laminated product was placed in a programmable temperature and pressure controlled vacuum press, and cured completely under a vacuum condition (vacuum parameter <10 mBar) at a pressure of 8 kgf / cm 2 for 180°C*30 min + 210°C*150 min.

[0139] DMA test: tested according to IPC-TM-650 2.4.24.4;

[0140] Dielectric property test: tested according to IPC-TM-650 2.5.5.2;

[0141] The test results are shown in Table 2.

[0142] Table 2

[0143]

[0144] As shown in Table 2, the build-up film prepared in the examples has better high temperature modulus and dielectric property than the comparative examples.

[0145] The technical features of the above-described examples can be combined in any manner. In order to make the description concise, all possible combinations of the technical features in the above-described examples are not described, however, as long as the combinations of the technical features do not contradict each other, they should be considered as falling within the scope of the present disclosure.

[0146] The above-described examples only express several embodiments of the present application, and facilitate the specific and detailed understanding of the technical solutions of the present application, but should not be understood as limiting the scope of the patent protection. It should be noted that, for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments on the basis of the technical solutions provided in the present application are all within the scope of the appended claims of the present application. Therefore, the scope of protection of the present patent should be based on the contents of the appended claims, and the description can be used to explain the contents of the claims.

Claims

1. A resin composition, characterized in that, By mass parts, it includes the following components: 10-30 parts of functional materials; 10-40 parts epoxy resin; 10-40 parts of cyanate ester resin; Inorganic filler 100-300 parts; and 1-5 parts of curing accelerator; The functional material includes a modified hydrocarbon resin prepolymer, the raw materials for which the modified hydrocarbon resin prepolymer is prepared include allylbenzoxazine nitrile compounds and hydrocarbon resins.

2. The resin composition according to claim 1, characterized in that, The resin composition satisfies at least one of the following characteristics: (1) The mass ratio of the functional material to the epoxy resin is 0.25~1.8:1; (2) The mass ratio of the cyanate ester resin to the epoxy resin is 0.25~2:1; (3) The mass ratio of the inorganic filler to the epoxy resin is 4~10:

1.

3. The resin composition according to claim 1, characterized in that, The hydrocarbon resin includes at least one of polybutadiene, epoxidized polybutadiene, butadiene and styrene copolymer, and butadiene and acrylic acid copolymer.

4. The resin composition according to claim 1, characterized in that, The structural formula of the allylbenzoxazine nitrile compound is shown in formula (I): Wherein, R is selected from -CHR1-, -CR2R3-, -SO2-, -O-, dicyclopentadiene ring, naphthalene ring, biphenyl ring, fluorene ring or anthracene ring; R1, R2 and R3 are each independently selected from -H or -CH3.

5. The resin composition according to claim 4, characterized in that, The preparation of the modified hydrocarbon resin prepolymer includes the following steps: The allylbenzoxazine nitrile compound and the hydrocarbon resin are mixed and subjected to a prepolymerization reaction at 100°C to 250°C to obtain the modified hydrocarbon resin prepolymer.

6. The resin composition according to any one of claims 1 to 5, characterized in that, The resin composition satisfies at least one of the following characteristics: (1) The epoxy resin includes at least one of the following: naphthalene-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phosphorus-containing epoxy resin, unsaturated epoxy resin, phenolic epoxy resin, alicyclic epoxy resin, resorcinol epoxy resin, rubber-modified epoxy resin, biphenyl epoxy resin, organosilicon-modified epoxy resin, and dicyclopentadiene epoxy resin; (2) The cyanate resin is selected from at least one of bisphenol A type cyanate resin, phenolic type cyanate resin, bisphenol F type cyanate resin, bisphenol M type cyanate resin, bisphenol E type cyanate resin, naphthalene type cyanate resin, biphenyl type cyanate resin, bisphenol S type cyanate resin and dicyclopentadiene bisphenol type cyanate resin; (3) The curing accelerator includes at least one of tertiary amine accelerators, imidazole accelerators, peroxide accelerators, organophosphorus accelerators and transition metal carboxylates; (4) The inorganic filler includes at least one of zirconium vanadate, zirconium tungstate, hafnium tungstate, microcrystalline glass, nepheline, silicon dioxide, mica powder, titanium dioxide, magnesium oxide, magnesium hydroxide, talc, aluminum oxide, silicon carbide, boron nitride, aluminum nitride, molybdenum oxide, barium sulfate, zinc molybdate, zinc borate, zinc stannate, zinc oxide, strontium titanate, barium titanate, calcium titanate, clay, and kaolin.

7. The resin composition according to any one of claims 1 to 5, characterized in that, The resin composition further includes an organic filler that satisfies at least one of the following characteristics: (1) In the resin composition, the organic filler is 10 to 30 parts by weight; (2) The organic filler includes at least one of organosilicon particles, rubber particles, and olefin elastomer particles.

8. The resin composition according to any one of claims 1 to 5, characterized in that, The resin composition further includes 1 to 5 parts by weight of an additive, which includes at least one of a dispersant, a leveling agent, an antifoaming agent, and a coupling agent.

9. A layering film, characterized in that, The raw materials for preparing the layered film include the resin composition as described in any one of claims 1 to 8.

10. A method for preparing a layered film, characterized in that, Includes the following steps: The resin composition as described in any one of claims 1 to 8 is disposed on a support, and the layered film is formed on the support by heat treatment.

11. The method for preparing the layered film as described in claim 10, characterized in that, The heat treatment temperature is 80℃~160℃, and the time is 2 min~15 min.

12. An FC-BGA carrier board, characterized in that, This includes the laminated membrane as described in claim 9 or the laminated membrane prepared by the method described in any one of claims 10-11.

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