Method and device for rapidly detecting deformation of pumping source shell of semiconductor laser

Abstract

The invention belongs to the technical field of semiconductor laser packaging, and particularly relates to a rapid detection method and detection device for deformation of a pumping source shell of a semiconductor laser, and the method comprises the steps: clamping the pumping source shell through an L-shaped positioning block; identifying the contour of the shell by using a visual mechanism and setting a detection point; the shell is sequentially driven to complete contact type deformation data acquisition of the X-axis frame, the Y-axis frame and the Z-axis internal step; performing comprehensive analysis and qualification judgment on the multi-axis data by the touch control mechanism; and finally displaying a result and alarming when the result is abnormal. According to the invention, full-automatic and multi-dimensional deformation rapid detection is realized, visual guidance is combined with a replaceable positioning block, and the device is suitable for shells of different models. And through three-axis high-precision contact type measurement, data can be quantitatively evaluated to form and position errors such as flatness and step height. According to the invention, data processing and alarming are integrated, the quality and the equipment state are monitored in real time, and the reliability is improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor laser packaging technology, specifically relating to a method and device for rapid detection of deformation of semiconductor laser pump source housing. Background Technology

[0002] With the rapid development of laser technology, semiconductor laser pump sources, as the core component of laser systems, are seeing their single-module power continuously increase, leading to their increasingly widespread application in various fields such as industrial processing, laser medicine, and scientific research. The pump source housing, as a key structural component of the semiconductor laser pump source, undertakes a dual core function: on the one hand, it needs to precisely fix the laser chip and lens, ensuring the stability and accuracy of the optical path, directly affecting the laser's output performance; on the other hand, since the pump source generates a large amount of heat during operation, the housing is made of materials with excellent thermal conductivity, such as copper or aluminum, becoming the core channel for heat conduction and dissipation, which is crucial for maintaining the chip's operating temperature and preventing performance degradation caused by heat accumulation. In related technologies, the clamping and positioning methods for pump source housing deformation detection often involve using fixtures to securely clamp housings of specific dimensions. When changing to different housing models, the fixtures need to be disassembled and replaced, resulting in lengthy debugging times. Furthermore, the clamping method lacks precise structural limits, making the housing prone to positional shifts during testing. This leads to misalignment of subsequent testing points, affecting testing accuracy.

[0003] The moving adjustment mechanism for triaxial deformation detection of the pump source housing lacks precision, and the transmission clearance between the motor and the guide rail is large, making it impossible to achieve accurate alignment of the detection points. Some detection devices use a single-axis sequential movement method, which results in long detection point positioning time. In contact detection, the extension speed and contact pressure of the probe are not precisely controlled, which can easily lead to surface scratches or step deformation caused by hard contact between the probe and the housing, or data distortion due to poor contact. Furthermore, multi-axis detection data cannot be transmitted synchronously, affecting detection efficiency.

[0004] There is a lack of effective means for processing and judging the test data. The deformation judgment is judged by using a uniform tolerance range for the shell frame and internal steps. Since different parts have different precision requirements in the assembly of semiconductor lasers, the judgment results are prone to not matching the actual use requirements. Some judgment methods do not screen invalid data, which directly affects the accuracy of deformation judgment. Summary of the Invention

[0005] This invention provides a rapid detection device for the deformation of a semiconductor laser pump source housing. The device realizes automated detection of the deformation of the laser pump source housing, aligns, adjusts and records point by point, completes continuous detection of multiple detection points of the housing, shortens the detection time of a single piece, improves detection efficiency, and meets the needs of batch and large-scale production.

[0006] The detection device includes: a base, a movable adjustment structure, a pump source housing, an X-axis detection mechanism, a Y-axis detection mechanism, a Z-axis detection mechanism, a vision inspection mechanism, a touch control mechanism, a control box, and an alarm. The movable adjustment structure, touch control mechanism, and control box are respectively mounted on the base; The movable adjustment structure is equipped with an L-shaped positioning block, and the pump source housing is placed on the L-shaped positioning block for positioning; The X-axis detection mechanism is equipped with an X-axis detector; The Y-axis detection mechanism is equipped with a Y-axis detector, and the front end of the Y-axis detector is equipped with a probe. The Z-axis detection mechanism is located above the movable adjustment structure; the Z-axis detection mechanism is equipped with a Z-axis detector. The visual inspection mechanism is installed on one side of the Z-axis inspection mechanism.

[0007] According to another embodiment of this application, a method for rapid detection of deformation of a semiconductor laser pump source housing is provided, the method comprising: S1. Place the pump source housing to be tested on the L-shaped positioning block of the movable adjustment structure to complete the initial clamping and positioning; S2. The visual inspection mechanism acquires images of the pump source housing and sends the acquired image data to the touch control mechanism. The operator or the program in the touch control mechanism identifies the outline and structural features of the pump source housing based on the image data, and sets or selects the detection point coordinates and detection process corresponding to the current pump source housing model for the frame, fixed step I and fixed step II through the touch screen of the touch control mechanism. S3. According to the set detection point coordinates, control the X-axis motor and Y-axis motor of the moving adjustment structure to work together to drive the pump source housing to move along the X-axis direction, so that each set detection point of the side frame to be detected moves sequentially to the front of the X-axis detection probe of the X-axis detection mechanism. At each detection point, the X-axis moving platform is controlled to make the probe of the X-axis detector contact the side of the pump source housing, and the displacement data of the detection point in the X-axis direction is measured. The displacement data of all detection points are then sent to the touch control mechanism. S4. Control the moving adjustment structure to drive the pump source housing to move along the Y-axis direction, so that each set detection point on the other side frame moves sequentially to the front of the Y-axis detector probe of the Y-axis detection mechanism; at each detection point, control the Y-axis moving platform to make the probe of the Y-axis detector contact the side of the pump source housing, measure the displacement data of the detection point in the Y-axis direction, and send the displacement data of all detection points to the touch mechanism; S5. Control the moving adjustment structure to drive the fixed step I and fixed step II of the pump source housing to move sequentially to the Z-axis detector of the Z-axis detection mechanism directly below it; at each detection point, control the Z-axis motor of the Z-axis detection mechanism to drive the Z-axis detector to descend along the Z-axis guide rail, so that the probe contacts the surface of the step, measure the height data of the detection point, and send the height data of all detection points to the touch mechanism. S6. Receive and store the X-axis, Y-axis and Z-axis detection data, compare and analyze the detection data with the preset standard dimensions or tolerance range, and determine whether the deformation of the pump source housing at each detection point is qualified. S7. Display the deformation judgment result on the touch screen.

[0008] As can be seen from the above technical solutions, the present invention has the following advantages: The semiconductor laser pump source housing deformation rapid detection device provided by this invention features an L-shaped positioning block adapted to the pump source housing structure on the X-axis moving platform of the movable adjustment structure. This block is detachable and fixed with screws, enabling rapid housing clamping through structural limiting without complex fastening. Furthermore, the corresponding L-shaped positioning block can be replaced according to the housing size. This eliminates the need to disassemble special fixtures for clamping and adjusting housings of different sizes, shortening clamping time and ensuring positional stability during housing detection.

[0009] This invention employs a servo motor paired with a grating ruler for movement and adjustment. A touch-sensitive mechanism coordinates the control of the X and Y axis motors to achieve precise movement and alignment of the housing detection points. Each axis detection mechanism uses a micro-motion contact mode to precisely control the probe extension speed and contact pressure. The Z-axis detection mechanism uses a motor-driven detector to move up and down along a guide rail to complete step height detection. This invention eliminates the transmission gap between the motor and the guide rail, and the micro-motion contact and pressure control prevent probe damage to the housing. It enables continuous batch detection of multiple detection points on the housing frame and internal steps, accurately capturing minute deformations.

[0010] This invention uses a touch-sensitive mechanism to automatically receive triaxial detection data via a communication module, complete data integrity verification and classification storage, and simultaneously retrieve preset standard dimension data. It sets differentiated tolerance ranges for the assembly accuracy requirements of the shell frame, fixed step I, and fixed step II, and automatically calculates deformation through formulas to complete the qualification judgment, thereby improving the accuracy of deformation judgment.

[0011] This invention features an automated detection mode for the touch-sensitive mechanism and a manual control mode for the control box. The automated mode performs full-process batch testing of conventional housings, while the manual control mode allows for targeted testing of individual detection points or housings with special structures via control buttons, eliminating the need to readjust the overall device parameters. A movable adjustment structure precisely moves the housing step detection point directly below the Z-axis detection mechanism, and the Z-axis motor drives the detector to automatically rise and fall to complete the step height detection, achieving non-contact automated operation. This invention enables continuous batch testing of multiple detection points on internal steps within the housing, improving the efficiency and accuracy of step height detection. Attached Figure Description

[0012] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 Schematic diagram of a rapid detection device for the deformation of a semiconductor laser pump source housing; Figure 2 Top view of a rapid deformation detection device for semiconductor laser pump source housing; Figure 3 Front view of a rapid deformation detection device for semiconductor laser pump source housing; Figure 4 A three-dimensional view of a device for rapid detection of deformation of a semiconductor laser pump source housing. Figure 5 This is a schematic diagram of a partial three-dimensional structure; Figure 6 This is a schematic diagram of the three-dimensional structure of a visual inspection mechanism; Figure 7 This is a schematic diagram of the three-dimensional structure of the detector; Figure 8 This is a schematic diagram of the pump source housing.

[0014] Explanation of reference numerals in the attached figures: 1. Base; 2. Adjustable moving structure; 201. Y-axis motor; 202. Y-axis guide rail; 203. Y-axis moving platform; 204. X-axis motor; 205. Slider; 206. X-axis moving platform; 207. L-shaped positioning block; 3. Pump source housing; 301. Frame; 302. Fixed step I; 303. Fixed step II; 4. X-axis detection mechanism; 401. X-axis detector; 402. Fixed base I; 5. Y-axis detection mechanism; 501. Fixed... 502. Y-axis measuring instrument, 503. Probe, 6. Z-axis measuring mechanism, 601. Z-axis motor, 602. Z-axis guide rail, 603. Z-axis measuring instrument, 604. Fixed bracket, 7. Vision inspection mechanism, 701. CCD industrial camera, 702. Ring light, 703. CCD fixing block, 704. Fixing plate, 8. Touch control mechanism, 801. Touch screen, 802. Switch, 9. Control box, 901. Control button, 10. Alarm. Detailed Implementation

[0015] The following describes in detail the rapid deformation detection device for the pump source housing of a semiconductor laser according to this application. Specific details, such as particular system structures and technologies, are presented for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application can also be implemented in other embodiments without these specific details.

[0016] It should be understood that, when used in this specification, the term "comprising" indicates the presence of the described feature, integral, step, operation, element, and / or component, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0017] It should be understood that "one or more" as mentioned in this application refers to one, two, or more, and "multiple" as mentioned in this application refers to two or more. In the description of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B. The "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0018] The terms "one embodiment" or "some embodiments" used in this application mean that one or more embodiments of this application include the specific features, structures, or characteristics described in that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this application do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1 to 8 The diagram shown is a schematic of a semiconductor laser pump source housing deformation rapid detection device in a specific embodiment. The device includes: a base 1, a movable adjustment structure 2, an X-axis detection mechanism 4, a Y-axis detection mechanism 5, a Z-axis detection mechanism 6, a vision detection mechanism 7, a touch control mechanism 8, a control box 9, and an alarm 10.

[0021] In some embodiments, the base 1 is the base of the inspection device. A moving adjustment mechanism 2 is provided in the middle of the base 1. The moving adjustment mechanism 2 is composed of a Y-axis motor 201, a Y-axis guide rail 202, a Y-axis moving platform 203, a slider 205, an X-axis motor 204, an X-axis guide rail 208, an X-axis moving platform 206, an L-shaped positioning block 207, etc. The Y-axis motor 201 is located at the lower end of the moving adjustment mechanism 2. A Y-axis guide rail 202 is provided on one side of the Y-axis motor 201. A Y-axis moving platform 203 is provided on the upper end of the Y-axis guide rail 202. The Y-axis motor 201 can control the rotation of the Y-axis guide rail 202, thereby driving the Y-axis moving platform 203 to move back and forth. An X-axis guide rail 208 is provided on the upper end of the Y-axis moving platform 203. An X-axis motor 204 is provided on one side of the X-axis guide rail 208. The X-axis motor 204 and the Y-axis motor 201 are high-precision servo motors. The upper end of the X-axis guide rail 208 is equipped with a slider 205, and the upper end of the slider 205 is equipped with an X-axis moving platform 206. The slider 205 is used to connect the X-axis guide rail 208 and the X-axis moving platform 206. The X-axis motor 204 drives the X-axis guide rail 208, thereby controlling the slider 205 and the X-axis moving platform 206 to move left and right. An L-shaped positioning block 207 is provided on one side of the upper end of the X-axis moving platform 206.

[0022] In some embodiments, the moving adjustment mechanism 2 is composed of a Y-axis motor 201, a Y-axis guide rail 202, a Y-axis moving platform 203, a slider 205, an X-axis motor 204, an X-axis guide rail 208, an X-axis moving platform 206, an L-shaped positioning block 207, and other structures. The moving adjustment mechanism 2 is used to fix the laser pump source housing 3 and to precisely move the laser pump source housing 3 in the X-axis and Y-axis directions when the laser pump source housing 3 is subjected to deformation detection.

[0023] In some embodiments, the L-shaped positioning block 207 is used to quickly position the laser pump source housing 3 in the X-axis and Y-axis directions. The L-shaped positioning block 207 is fixed to the X-axis moving platform 206 by screws. The L-shaped positioning block 207 has a detachable structure. The shape and structure of the L-shaped positioning block 207 are adapted to the shape and structure of the laser pump source housing 3. The corresponding L-shaped positioning block 207 can be assembled according to the structure of the laser pump source housing 3 of different sizes.

[0024] The X-axis detection mechanism 4 is located at the middle rear side of the base 1. The X-axis detection mechanism 4 consists of an X-axis detector 401 and a fixed base I 402. The fixed base I 402 is located at the lower end of the X-axis detection mechanism 4, and the X-axis detector 401 is provided at the upper end of the fixed base I 402.

[0025] In some embodiments, the X-axis detection mechanism 4 is mounted on the base 1 and consists of an X-axis detector 401 and a fixed base Ⅰ 402. The X-axis detection mechanism 4 is used to detect the frame 301 of the laser pump source housing 3, specifically detecting the deformation of the frame 301 on the front and rear sides of the pump source housing 3. When performing X-axis direction detection on the laser pump source housing 3, the moving adjustment structure 2 moves the pump source housing 4 to the front end of the X-axis detection mechanism 4, so that the probe at the front end of the X-axis detector 401 contacts the rear side of the laser pump source housing 3. The moving adjustment mechanism 2 drives the pump source housing 3 to move left and right. The X-axis detector 401 accurately detects the positions of multiple phase transitions on the frame 301 of the laser pump source housing 3 and transmits the detection data to the touch mechanism 8. The touch mechanism 8 automatically processes and stores the detection data.

[0026] In some embodiments, the fixing base I 402 is located at the lower end of the X-axis detection mechanism 4, and the upper end of the fixing base I 402 is provided with an X-axis detector 401. The fixing base I 402 is used to fix the X-axis detector 401. The X-axis detector 401 adopts a high-precision contact digital display height gauge with a detection resolution of less than 0.05μm. The displacement signal is obtained by the probe at the front end of the X-axis detector 401 contacting the laser pump source housing 3. The displacement signal detected by the X-axis detector 401 is analyzed and processed by the software system of the touch mechanism 8 to determine the deformation of the frame 301 of the pump source housing 3 in the X-axis direction.

[0027] In some embodiments, the Y-axis detection mechanism 5 is disposed on the base 1. The Y-axis detection mechanism 5 consists of a Y-axis detector 502 and a fixed seat II 501. The fixed seat II 501 is located at the lower end of the Y-axis detection mechanism 5, and the Y-axis detector 502 is disposed at the upper end of the fixed seat II 501. The Z-axis detection mechanism 6 is located at the upper end of the moving adjustment mechanism 2. The Z-axis detection mechanism 6 is mainly composed of a Z-axis motor 601, a Z-axis guide rail 602, a Z-axis detector 603, a fixed frame 604, etc. The fixed frame 604 is located at the lower end of the Z-axis detection mechanism 6. The Z-axis guide rail 602 is disposed on one side of the fixed frame 604. The Z-axis motor 601 is disposed at the upper end of the Z-axis guide rail 602. The Z-axis detector 603 is disposed on one side of the Z-axis guide rail 602. The visual detection mechanism 7 is located on one side of the Z-axis detection mechanism 6.

[0028] In some embodiments, the Y-axis detection mechanism 5 is located on the right side of the base 1. The Y-axis detection mechanism 5 consists of a Y-axis detector 502 and a fixed base II 501. The fixed base II 501 is located at the lower end of the Y-axis detection mechanism 5, and the Y-axis detector 502 is provided at the upper end of the fixed base II 501. The fixed base II 501 is used to fix the Y-axis detector 502. The Y-axis detection mechanism 5 is used to detect the deformation of the left and right side frames 301 of the laser pump source housing 3. When detecting the Y-axis direction of the laser pump source housing 301, the moving adjustment structure 2 moves the laser pump source housing 3 to the front end of the Y-axis detection mechanism 5, so that the probe 503 at the front end of the Y-axis detector 502 contacts the side frame 301 on the right side of the laser pump source housing 3. The moving adjustment mechanism 2 drives the pump source housing 3 to move back and forth. The Y-axis detector 502 accurately detects multiple detection points on the right side frame 301 of the laser pump source housing 3 and transmits the detection data to the touch mechanism 8. The touch mechanism 8 automatically processes and stores the detection data. The structure and accuracy parameters of the Y-axis measuring instrument 502 are the same as those of the X-axis measuring instrument 401 and the Z-axis measuring instrument 603.

[0029] In some embodiments, the Z-axis detection mechanism 6 is located at the upper end of the moving adjustment mechanism 2. The Z-axis detection mechanism 6 is mainly composed of a Z-axis motor 601, a Z-axis guide rail 602, a Z-axis detector 603, a fixed frame 604, and other structures. The fixed frame 604 is located at the lower end of the Z-axis detection mechanism 6. The Z-axis guide rail 602 is provided on one side of the fixed frame 604. The Z-axis motor 601 is provided at the upper end of the Z-axis guide rail 602. The Z-axis detector 603 is provided on one side of the Z-axis guide rail 602. The Z-axis motor 601 can control the Z-axis guide rail 602 to move up and down, thereby controlling the Z-axis detector 603 to move up and down. Z-axis detection mechanism 6 is used to detect the deformation of the laser pump source housing 3 in the Z-axis direction. When detecting the deformation of the laser pump source housing 3 in the Z-axis direction, the moving adjustment mechanism 2 moves the laser pump source housing 3 to the lower end of the Z-axis detection mechanism 6. The Z-axis motor 601 drives the Z-axis detector 603 to move up and down. The probe at the lower end of the Z-axis detector 603 sequentially detects the height of the fixed step I 302, fixed step II 303 and other areas inside the laser pump source housing 3, and transmits the detection data to the touch mechanism 8.

[0030] In some embodiments, the visual inspection mechanism 7 mainly consists of a CCD industrial camera 701, a CCD fixing block 703, a ring light 702, a fixing plate 704, etc. The CCD fixing block 703 is located at the upper end of the visual inspection mechanism 7. One end of the CCD fixing block 703 is provided with the CCD industrial camera 701, and the lower end of the CCD industrial camera 701 is provided with the fixing plate 704. The lower end of the fixing plate 704 is provided with the ring light 702.

[0031] The vision inspection mechanism 7 is located on one side of the Z-axis inspection mechanism 6. The vision inspection mechanism 7 mainly consists of a CCD industrial camera 701, a CCD fixing block 703, a ring light 702, and a fixing plate 704. The vision inspection mechanism 7 mainly performs image scanning inspection on the laser pump source housing 3 placed on the moving adjustment mechanism 2, and transmits the scanned image data to the touch control mechanism 8. Through the analysis of the image data by the touch control mechanism 8, the size, outline and internal structure of the laser pump source housing 3 to be inspected can be recorded and judged. The operator can set the corresponding inspection points and inspection programs for the pump source housing 3 through the touch control mechanism 8 based on the image of the laser pump source housing 3 inspected by the vision inspection mechanism 7. This makes it easy to accurately set the position of the variable area of ​​the laser pump source housing 3 with different structures, so that the inspection mechanism can quickly and accurately find the inspection point for inspection, thereby improving the inspection efficiency and accuracy.

[0032] In some embodiments, a CCD fixing block 703 is located at the upper end of the vision inspection mechanism 7. A CCD industrial camera 701 is mounted at one end of the CCD fixing block 703. The CCD fixing block 703 is mainly used to fix the CCD industrial camera 701. The preferred model of the CCD industrial camera 701 is MV-CE050-30GMCCD. While meeting the high-precision appearance inspection requirements of the laser pump source housing 3, it can also clearly detect micron-level scratches, pinholes, stains, and other defects on the surface of the pump source housing. A fixing plate 704 is located at the lower end of the CCD industrial camera 701. A ring light 702 is located at the lower end of the fixing plate 704. The fixing plate 704 is used to fix the ring light 702. When the vision inspection mechanism 7 inspects the laser pump source housing 3, the ring light 702 automatically supplements the CCD industrial camera 701 according to the light intensity, thereby making the detected image of the laser pump source housing 3 clearer.

[0033] In some embodiments, the touch mechanism 8 is located on the right rear side of the base 1, and the touch mechanism 8 consists of a switch 802 and a touch screen 801. The control box 9 is located on the right front side of the base 1, and the upper end of the control box 9 is provided with N control buttons 901. The alarm 10 is located on the left rear side of the base 1.

[0034] The touch mechanism 8 is located on the right rear side of the base 1. The touch mechanism 8 is used to control the operation of the X-axis detection mechanism 4, Y-axis detection mechanism 5, Z-axis detection mechanism 6, movement adjustment mechanism 2, vision detection mechanism 7 and other structures of the device, and to process and store various detection data. The parameters of the device can also be set through the touch mechanism 8.

[0035] In some embodiments, the control box 9 is located on the right front side of the base 1. The control box 9 is provided with N control buttons 901 on its upper end. The control box 9 is used to manually control the operation of the detection device. When performing deformation detection on a small number of laser pump source housings 3 or those with special structures, or when performing individual detection on a certain detection point of the laser pump source 3, and when an automatic self-detection mode is not required, the detection device can be manually controlled through the control box 9 for detection.

[0036] The alarm 10 is located on the left rear side of the base 1. When the device malfunctions or an abnormality is detected in the housing 3 of the laser pump source instrument, the touch control mechanism 8 sends an alarm command to the alarm 10. The alarm 10 alerts the operator to handle the abnormality through sound and light alarm.

[0037] The following are embodiments of a method for rapid detection of semiconductor laser pump source housing deformation provided in this disclosure. This method belongs to the same inventive concept as the rapid detection device for semiconductor laser pump source housing deformation described in the above embodiments. Details not fully described in the embodiments of the rapid detection method for semiconductor laser pump source housing deformation can be found in the embodiments of the rapid detection device for semiconductor laser pump source housing deformation described above. The method includes the following steps: S1. Place the pump source housing 3 to be tested on the L-shaped positioning block 207 of the movable adjustment structure 2 to complete the initial clamping and positioning.

[0038] In some embodiments, the operator holds the pump source housing 3 to be tested and places it against the positioning surface of the L-shaped positioning block 207 of the movable adjustment structure 2 to ensure that the side of the pump source housing 3 is tightly fitted with the vertical surface of the L-shaped positioning block 207, and the fitting gap is controlled within 0.03μm.

[0039] Furthermore, the L-shaped positioning block 207 is fixed to the X-axis moving platform 206 with M3 screws. No additional tightening is required during clamping; initial positioning is achieved solely through the structural limitation of the L-shaped positioning block 207. If the pump source housing 3 does not match the current L-shaped positioning block 207, the screws can be removed to replace it with a suitable model. After replacement, it should be repositioned to ensure a tight fit without looseness. The L-shaped positioning block 207 is removable and replaceable, adaptable to pump source housings 3 of different sizes, expanding the applicability of the device. The stability of the initial positioning reduces positional shifts during adjustment and lowers detection errors.

[0040] S2. Start the vision inspection mechanism 7, and use its CCD industrial camera 701 to acquire images of the pump source housing 3, and send the acquired image data to the touch control mechanism 8; the operator or the program in the touch control mechanism 8 identifies the outline and structural features of the pump source housing 3 according to the image data, and sets or selects the detection point coordinates and detection process corresponding to the current pump source housing 3 model for the frame 301, fixed step I 302 and fixed step II 303 through the touch screen 801 of the touch control mechanism 8.

[0041] In some embodiments, the operator activates the vision inspection mechanism 7 via the switch 802 of the touch mechanism 8, and the industrial camera 701, model MV-CE050-30GMCCD, acquires images of the pump source housing 3.

[0042] Furthermore, during the acquisition process, the ring light 702 automatically adjusts the brightness of the supplementary light according to the ambient light intensity, and the supplementary light range covers the entire surface of the pump source housing 3 to avoid image blurring due to insufficient light.

[0043] The acquired image data is sent in real time to the embedded processing unit of the touch mechanism 8 via the data transmission line. After the processing unit performs noise reduction and grayscale processing on the image, the built-in program automatically identifies the outline of the frame 301, the fixed step I 302 and the fixed step II 303 of the pump source housing 3. If there is a deviation in the program identification, the operator can manually correct the outline and feature position through the touch screen 801. Then, the operator selects the preset detection parameters that match the current pump source housing 3 model, or manually sets the number and coordinates of the detection points of the frame 301, the fixed step I 302 and the fixed step II 303. After setting, the detection process is saved and sent to each actuator.

[0044] S3. According to the detection point coordinates set in step S2, the touch mechanism 8 controls the X-axis motor 204 and Y-axis motor 201 of the moving adjustment structure 2 to work together to drive the pump source housing 3 to move along the X-axis direction, so that each set detection point of the side frame 301 to be detected moves sequentially to the front of the probe of the X-axis detector 401 of the X-axis detection mechanism 4; at each detection point, the X-axis moving platform 206 is controlled to move slightly so that the probe of the X-axis detector 401 contacts the side of the pump source housing 3, the displacement data of the point in the X-axis direction is measured, and the displacement data of all detection points is sent to the touch mechanism 8.

[0045] S31: The touch mechanism 8 calls the stored set of detection point coordinates of the side frame 301 of the pump source housing 3 to be detected, and extracts the X-axis target coordinates of the first detection point.

[0046] In some embodiments, the embedded storage unit of the touch mechanism 8 retrieves the list of detection point coordinates generated by the visual inspection mechanism 7 in step S2, specifically including the X and Y axis absolute coordinates of 12 preset detection points on the side frame 301 to be detected. The system automatically extracts the X-axis coordinate value X1 of the first detection point, and this coordinate value is pre-mapped with the motion coordinate system of the motion adjustment structure 2.

[0047] S32: The touch mechanism 8 sends a pulse control signal to the X-axis motor 204 of the moving adjustment structure 2, driving the X-axis moving platform 206 to move along the X-axis guide rail 208 until the X-axis coordinate of the first detection point of the pump source housing 3 coincides with the X-axis reference coordinate of the probe of the X-axis detector 401.

[0048] In some embodiments, the motion control unit of the touch mechanism 8 sends a pulse control signal to the X-axis motor 204. The X-axis motor 204 drives the ball screw of the X-axis guide rail 208 to rotate through the coupling. The ball screw drives the slider 205 and the X-axis moving platform 206 to move linearly along the guide rail. During the movement, the grating ruler provides real-time feedback on the actual position. When the deviation between the actual position and the target coordinates is less than 0.02μm, the motion control unit sends a stop signal.

[0049] In this embodiment, the frequency of the pulse signal determines the motor speed, the number of pulses determines the moving distance, and the closed-loop feedback of the grating ruler calculates the position deviation and compensates for it. The specific execution method is: ΔX = Xtarget - Xactual. When ΔX < 0.02μm, the movement stops to ensure that the positioning accuracy of the detection point reaches the micrometer level.

[0050] S33: The touch mechanism 8 sends a fine-tuning pulse signal to the Y-axis motor 201 of the moving adjustment structure 2, driving the Y-axis moving platform 203 to move slightly along the Y-axis guide rail 202, so that the side frame 301 of the pump source housing 3 to be tested is kept parallel and aligned with the probe of the X-axis detector 401.

[0051] In some embodiments, the number of fine-tuning pulses received by the Y-axis motor 201 corresponds to a movement of 0.01 μm. During the fine-motion process, the CCD industrial camera 701 of the vision inspection mechanism 7 acquires the frame image in real time, and stops the fine-motion when the pixel straightness deviation of the frame is less than 1 pixel.

[0052] S34: The touch mechanism 8 sends a trigger signal to the X-axis detector 401 to control the probe of the X-axis detector 401 to extend until the probe contacts the surface of the side frame 301 of the pump source housing 3 to be detected, and collects the X-axis displacement data of that point.

[0053] S35: The touch mechanism 8 receives and stores the displacement data transmitted by the X-axis detector 401, and repeats steps S31 to S34 until the X-axis displacement data acquisition of all detection points of the side frame 301 to be detected is completed.

[0054] In some embodiments, the system automatically switches to the next detection point coordinates and repeats the process of moving, aligning, and detecting. All detection points, including detection point number, coordinates, displacement value, and acquisition time data, are stored in the database of the touch mechanism 8.

[0055] S4. The touch mechanism 8 controls the moving adjustment structure 2 to drive the pump source housing 3 to move along the Y-axis direction, so that each set detection point on the other side frame 301 moves sequentially to the front of the probe 503 of the Y-axis detector 502 of the Y-axis detection mechanism 5; at each detection point, the Y-axis moving platform 203 is controlled to move slightly so that the probe 503 of the Y-axis detector 502 contacts the side of the pump source housing 3, and the displacement data of the point in the Y-axis direction is measured, and the displacement data of all detection points is sent to the touch mechanism 8.

[0056] S5. The touch mechanism 8 controls the moving adjustment structure 2 to drive the pump source housing 3, so that the set detection points of the fixed step I 302 and fixed step II 303 inside it move sequentially to directly below the Z-axis detector 603 of the Z-axis detection mechanism 6; at each detection point, the Z-axis motor 601 of the Z-axis detection mechanism 6 drives the Z-axis detector 603 to descend along the Z-axis guide rail 602, so that its probe contacts the surface of the step, measures the height data of the point, and sends the height data of all detection points to the touch mechanism 8.

[0057] S6. The touch mechanism 8 receives and stores the X-axis, Y-axis, and Z-axis detection data from steps S3, S4, and S5, and compares and analyzes the detection data with the preset standard dimensions or tolerance range to determine whether the deformation of the pump source housing 3 at each detection point is qualified.

[0058] S7. The touch mechanism 8 displays or stores the deformation judgment result in step S6 on the touch screen 801. If the judgment result is unqualified or the device malfunctions during the detection process, the touch mechanism 8 controls the alarm 10 to start and perform an audible and visual alarm.

[0059] In some embodiments, the touch mechanism 8 summarizes all comparison results of S6 and generates a judgment list containing the detection point number, detection location, deformation, tolerance range, and pass / fail status. The list is displayed in sections on the touch screen 801, with pass / fail detection points marked in green and fail / fail detection points marked in red with the amount exceeding the tolerance.

[0060] Furthermore, during the testing process, the touch control mechanism 8 monitors the operating status of each actuator in real time. If a fault occurs, such as motor jamming, no data feedback from the detector, or excessive movement deviation, or if the S6 judgment result is unqualified, a trigger signal is immediately sent to the alarm 10. The alarm 10 emits an audible and visual alarm at a frequency of 2Hz, and the light flashes red until the operator presses the reset button on the touch screen 801, at which point the alarm stops. At the same time, the touch screen 801 displays the fault type or the location of the unqualified test point.

[0061] The visual display of the judgment results in this embodiment allows operators to quickly grasp the testing situation without having to query the original data one by one. Historical data storage facilitates quality traceability and production process optimization.

[0062] In one embodiment of the present invention, based on step S4, the following is a possible embodiment and its specific implementation will be described in a non-limiting manner. S4 specifically includes the following steps: S41: The touch mechanism reads the set of detection point coordinates (Py1, Py2, ..., Pym) for the pump source housing frame. Based on the fixed position Yprobe of the Y-axis detector probe in the device coordinate system, the coordinates of each detection point Pyj are transformed to calculate the target position Ytargetj of the Y-axis moving platform required to align the detection point with the probe in the Y-axis direction. To achieve alignment, the matching position Xcompj that the X-axis moving platform needs to move to is calculated. Coordinated motion commands for the Y-axis and X-axis are generated according to the sequence (Ytarget1, Xcomp1)...(Ytargetm, Xcompm).

[0063] In some embodiments, since the Y-axis measuring instrument 502 and its probe 503 are fixedly installed in space, the Y-axis mechanical coordinate Yprobe of its probe tip is a known constant value. For each workpiece measuring point Pyj, its theoretical Y-axis coordinate Ypartj is known.

[0064] Furthermore, to align this point with the probe along the Y-axis, the workpiece needs to be moved so that Ypartj moves to the same position as Yprobe. This relationship is described as: Ytargetj = Yprobe - Ypartj + C. Here, C is a system offset compensation constant. This is because the probe needs to contact a specific X-axis position on the right side of the workpiece. A corresponding X-axis moving platform mating position Xcompj needs to be calculated for each detection point; this position is directly taken from the X component of the detection point's coordinates. Finally, a motion path consisting of a series of (Xcomp, Ytarget) coordinate pairs is planned, and the velocity and acceleration curves of each axis motor moving between points are calculated to ensure smooth and efficient motion from the current X-axis detection end position to the first Y-axis detection point, and during movement between Y-axis detection points.

[0065] S42: Based on the generated instructions, the touch mechanism controls the X-axis and Y-axis motors to drive the pump source housing to move near the first target point, so that the detection point Py1 is a preset radial safety gap δsafe between itself and the probe tip of the Y-axis detector in the Y-axis direction. The Y-axis moving platform is controlled to radially approach the probe at a low speed (Vylow) along the negative Y-axis direction.

[0066] In some embodiments, for rapid positioning, the motion controller of the touch mechanism sends the calculated first target position command (Xcomp1, Ytarget1) to the servo drivers of the X-axis motor 204 and the Y-axis motor 201. The two axes work together to drive the workpiece to move rapidly.

[0067] The sign that the positioning is completed is that the difference between the Y coordinate of the detection point Py1 on the workpiece and the Y coordinate Yprobe of the probe, that is, the radial distance, is less than or equal to the preset δsafe.

[0068] This safety gap is usually set to 0.2 - 0.3 mm, aiming to be within the elastic deformation range of the probe and absolutely avoid collisions. Once entering the safety window, the system switches to the precise approach stage. At this time, the touch mechanism 8 issues an instruction to the Y-axis motor 201, causing it to drive the Y-axis moving platform 203 to move along the negative Y-axis direction, which is the direction to press the side of the workpiece against the probe, and start moving at a constant speed Vylow. This movement is a single-axis, controlled radial feed, which continues until the probe sensor senses contact and triggers the next interruption signal.

[0069] S43: When the change amount of the signal generated by the Y-axis detector probe contacting the pump source housing reaches the contact threshold ΔSth, the touch mechanism determines that the contact is effective. The system immediately captures the displacement reading Dyj output by the Y-axis detector at this moment through the high-speed data interface, and synchronously records the real-time encoder position Ystagej of the Y-axis moving platform. The data group (Dyj, Ystagej, j) is stored.

[0070] In some embodiments, a signal change amount threshold ΔSth is preset. This threshold represents that a certain and stable contact has occurred. When the change amount |U(t) - U0| of the monitored signal U(t) relative to the initial free state value U0 first exceeds ΔSth, an interruption is executed. The first operation of the interruption response is to latch the displacement reading Dyj on the digital display of the Y-axis detector at the current moment. This reading Dyj is the compression amount of the probe relative to its internal zero point. The absolute position Ystagej of the current Y-axis moving platform is read from the encoder feedback loop of the Y-axis motor 201. The displacement data Dyj, the platform position Ystagej, and the detection point serial number j are bound into a data packet and written into the memory array or directly stored in a file. After these are completed, a feedback signal of contact completion is sent to the motion controller.

[0071] S44: After the single-point measurement is completed, the touch mechanism controls the Y-axis moving platform to move a retraction distance δretract along the positive Y-axis direction to separate the probe from the workpiece. The system queries the relationship between the current detection point index j and the total number of points m. If j < m, the process continues; if j = m, the Y-axis detection sequence is completed, and the process flag is set.

[0072] In some embodiments, after successful acquisition of measurement data, the touch mechanism sends a new position command to the Y-axis motor, instructing the Y-axis moving platform to move a fixed retract distance along the positive Y-axis direction, i.e., away from the probe. This retraction distance is greater than the sum of the maximum stroke compressed by the probe during this measurement and the system calculation error, to ensure complete disengagement. Once the retraction is complete, the system's internal control logic begins sequence state evaluation. It accesses the variable j storing the detection point index and compares it with the total number of points m read from the configuration file. If the comparison result is less than, the flow control flag is set to continue looping, and index j is automatically incremented by 1, pointing to the next test point. If the result is equal to, it means that the preset Y-axis detection task list has been fully executed. At this point, a status flag representing the completion of Y-axis detection is set, and the progress display on the user interface is updated.

[0073] S45: For the next detection point Pyj+1, repeat the operation process from S42 to S44 until all the set detection points of the border have completed the acquisition of displacement data in the Y-axis direction.

[0074] The cyclic execution mechanism extends single-point precision measurement capabilities to automated scanning and inspection. Through programmed repetition, it enables the execution of inspection scales from 1 to N without any manual intervention, meeting the rapid inspection cycle requirements of the production line.

[0075] In one embodiment of the present invention, based on step S5, the following is a possible embodiment and its specific implementation will be described in a non-limiting manner. S5 specifically includes the following steps: S51: After the touch mechanism retrieves the current locked coordinates yend and xend of the Y-axis moving platform and the X-axis moving platform after step S4, it retrieves the Z-axis detection point coordinate array R{(x k ,y k ,z k ),...,(x p ,y p ,z p The verticality error matrix Ψ of the fixed bracket; Send target position commands to the Y-axis motor and X-axis motor to drive the Y-axis moving platform to slide along the Y-axis guide rail and the X-axis moving platform to slide together along the X-axis guide rail, so that the center of the area to be measured of the fixed step I and fixed step II is displaced to below the vertical axis of the Z-axis detector. The Z-axis motor drives the Z-axis measuring instrument to rise along the Z-axis guide rail to the mechanical origin, establishing the Z-axis measurement reference height H0.

[0076] S52: The touch mechanism parses the (x) corresponding to the current index k. k ,y k ,z k), calculate the current X reading of the X-axis moving platform and x k The difference Δx k Current Y-axis reading and y-axis movement platform k The difference Δy k Based on the X-axis motor pulse frequency and Y-axis motor pulse frequency Generate pulse frequency; v zx ,v zy This corresponds to the normalized velocity along the X and Y axes; After receiving pulses, the X-axis motor and Y-axis motor drive the X-axis guide rail and Y-axis guide rail respectively, so that the pump source housing approaches the target vertical line in the horizontal plane along the radial direction. The grating ruler provides real-time feedback until the residual is less than the threshold ε.

[0077] In some embodiments, the touch mechanism outputs a zero-reset pulse to the Z-axis motor, which drives the Z-axis guide rail to move the Z-axis detector upward to the Z-axis mechanical origin. This position is determined by the upper limit switch and recorded as the reference height.

[0078] Calculate the pulse frequencies along the X and Y axes respectively, where v zx With v zy This is the normalized speed coefficient. After receiving their respective pulse sequences, the servo drivers of the X-axis and Y-axis motors drive the X-axis and Y-axis guideways to rotate, respectively. This rotation is converted into linear displacement of the X-axis and Y-axis moving platforms through their respective lead screw and nut pairs. The resultant velocity of the two axes always points towards the target vertical line, and its magnitude is constant. When √(Δxk² + Δyk²) is less than the threshold ε, horizontal positioning is considered complete, and the current X and Y coordinates are latched.

[0079] S53: After horizontal positioning is completed, the touch mechanism... Calculate the initial descent speed of the Z-axis motor. vz 0 represents the initial velocity reference value along the Z-axis. λ The exponential decay coefficient is... zk The theoretical Z-coordinate of the current detection point; A pulse command is sent to the Z-axis motor to drive the Z-axis measuring instrument to fall along the Z-axis guide rail; after the lower probe of the Z-axis measuring instrument contacts the surface of fixed step I or fixed step II, the internal piezoelectric sensor outputs a charge signal Q, which is converted into a voltage Uz=Q / C by a charge amplifier. f C f For feedback capacitor; when U z Exceeding threshold U zt At that time, the touch mechanism latches the Z-axis guide rail grating ruler reading z. m and the initial reading s of the Z-axis measuring instrument z0 .

[0080] In some embodiments, after horizontal positioning is completed, the initial descent speed v of the Z-axis motor is calculated. zk , where v z0 Let λ be the initial velocity, λ be the attenuation coefficient, and |zk-H0| be the distance difference between the current detection point and the reference height. The Z-axis detector descends rapidly when moving away from the step and automatically decelerates when approaching it. When the probe at the lower end of the Z-axis detector contacts the surface of fixed step I or fixed step II, the probe experiences an upward reaction force. The internal piezoelectric ceramic sensor generates a piezoelectric effect, outputting a charge signal Q proportional to the force. This charge signal is converted into a voltage signal U by a charge amplifier. z =Q / C f C f This is the feedback capacitance value. When Uz exceeds the preset threshold Uzt, the hardware capture circuit of the touch mechanism immediately latches the current reading z of the grating ruler on the Z-axis guide rail. m This serves as the macroscopic height coordinate of the point, and the initial reading s of the displacement sensor inside the Z-axis measuring instrument is recorded. z0 .

[0081] S54: The touch mechanism reads the displacement change Δs of the Z-axis measuring instrument. z ,based on Calculate the actual height, where φ is the installation angle between the Z-axis guide rail and the plumb line, ζ is the coefficient of thermal expansion, and T is the current ambient temperature; calculate the height deviation δ. z =Z r -z k ; the quadruple (x k ,y k Z r ,δ z Write to the stack storage area of ​​the touch mechanism; According to δ z The absolute value of the magnitude is determined by... Calculate the data retention time at this point. τ As the reference time constant, η This is the sensitivity coefficient.

[0082] In some embodiments, after contact stabilization, the touch mechanism sends a read command to the Z-axis detector to obtain the displacement change Δsz, which represents the compression of the probe relative to its free state. The actual height Zr of the detection point on fixed step I or fixed step II in the device coordinate system is calculated, where the cosφ term corrects the projection error caused by the inclination angle φ between the Z-axis guide rail mounting axis and the vertical line, and the ζ·T term compensates for the influence of the ambient temperature T on the thermal expansion of the Z-axis guide rail and the pump source housing. The height deviation δz is obtained by subtracting Zr from the theoretical coordinate zk. The quadruple (xk, yk, Zr, δz) is written into the stack storage area of ​​the touch mechanism, which adopts a last-in-first-out structure. According to the absolute value of δz, the data retention time Δtk of the point is calculated by formula (11), where τ is the reference time and η is the sensitivity coefficient. The larger the deviation, the longer the retention time.

[0083] S55: The touch mechanism sends a reverse pulse to the Z-axis motor, driving the Z-axis detector to rise a distance H along the Z-axis guide rail. s The probe is disengaged from either fixed step I or fixed step II; index k is incremented by 1; if k ≤ p, the process returns to step S52; if k > p, the touch mechanism encodes the p groups of quadruplets in the stack into a Z-axis deformation dataset Dz, transmits it to the database, and clears the stack pointer.

[0084] In one embodiment of the present invention, based on step S6, the following is a possible embodiment and its specific implementation will be described in a non-limiting manner. S6 specifically includes the following steps: S61: The touch mechanism receives data packets from the X-axis, Y-axis, and Z-axis detectors. Each data packet contains a measurement value, a detection point index, and a raw timestamp. Based on the detection point index and a preset detection sequence logic, timestamp alignment and matching are performed on data from the three axes belonging to the same physical detection point, forming a data record (Indexi, XDatai, YDataj, ZDatak, ti). The measurement value in each data record is validated to check whether it is within the sensor's measurement range, whether the rate of change is abnormal, and suspicious data is marked.

[0085] S62: For each valid detection point data record, the touch mechanism calls the corresponding standard 3D model. The standard 3D model contains the preset coordinates (Xnomi, Ynomi, Znomi) and vector information of all detection points of the pump source housing in the preset state.

[0086] Based on the visual positioning results, the measurement data are subjected to coordinate system one, and the deformation components of each detection point in three directions are calculated: ΔXi = XDatai - Xnomi; ΔYj = YDataj - Ynomi; ΔZk = ZDatak - Znomi. For the detection points of the border, ΔXi and ΔYj are analyzed; for the step detection points...

[0087] In some embodiments, for the pump source housing currently being inspected, the corresponding model data is retrieved according to the model. Based on the set detection point, the preset coordinates (Xnom, Ynom, Znom) and the feature type of that point are retrieved. Directly subtracting Xnom from the measured XDatai is inaccurate because the position and angle of the workpiece in the platform coordinate system change slightly each time it is clamped. Therefore, it is necessary to reconstruct the measurement reference first. Using several key feature points obtained by visual inspection in S2, a transformation matrix Tadj is calculated through least squares fitting. This matrix describes the translation and rotation relationship between the current actual workpiece coordinate system and the standard model coordinate system. The measured data of all measurement points are transformed to the same unified coordinate system through Tadj, and then the difference is calculated. For the border point, the deviation ΔXi in its normal direction is calculated; for the step point, the deviation ΔZk in the Z direction is calculated. For example: [ΔXi, ΔYi, ΔZi] T =[Xdatai,Ydatai,Zdatai] T -Tadj*[Xnomi,Ynomi,Znomi] T This eliminates systematic errors caused by inconsistent clamping.

[0088] S63: Calculate the standard deviation σxy of all detection points ΔX or ΔY on the border plane to evaluate flatness fluctuation; for border step features, calculate the average value μz of all detection points ΔZ to evaluate overall sinking or upturning, and the range Rz to evaluate the flatness of the step surface.

[0089] The calculated parameters (ΔXi, ΔYj, ΔZk) and (σxy, μz, Rz) are synchronously compared with the preset multi-dimensional tolerance thresholds.

[0090] In some embodiments, a comprehensive evaluation is performed from points to feature surfaces. For a side frame plane, assuming it consists of n detection points, after obtaining ΔX for all points, it is checked whether each ΔXi exceeds the single-point limit deviation ±δlim. The statistical characteristics of these n ΔXi are calculated: the average value μx may be close to zero, indicating no overall tilt. However, a large σx value means that the frame surface is uneven, and even if all individual points do not exceed ±δlim, the wavy appearance may affect the laser assembly.

[0091] Here, σx is compared with the threshold of the flatness fluctuation tolerance φflat. For the step surface, the average value μz of ΔZk at all step inspection points is calculated, which reflects whether the overall height of the step is too high or too low; the range Rz = max(ΔZk) - min(ΔZk) is calculated, which reflects the flatness of the step surface. The judgment is based on the following relationship: a feature is considered qualified if all its single-point deviations and morphological parameters are within the tolerance zone. The tolerance threshold is stored in the database as a preset process standard.

[0092] S64: According to the comparison results, if all single-point deformation components and all morphological parameters are within the corresponding tolerance zone, the pump source housing is deemed qualified. If only a few non-critical points have slightly out-of-tolerance single-point components, but the morphological parameters are acceptable, it is considered critically acceptable; if any critical point or any morphological parameter is out of tolerance, it is considered unacceptable.

[0093] The judgment results include deformation data, calculated parameters, differences from tolerances, and final judgment grades for each test point. These are structured into a data report and stored in a database.

[0094] In some embodiments, a simple pass / fail dichotomy is too simplistic and may discard many products with minor defects that do not affect their usability, resulting in waste. "Instead of simply discarding products, the process can be adjusted based on the proportion and defect patterns of products in that grade."

[0095] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0096] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for rapid detection of deformation of a semiconductor laser pump source housing, characterized in that the method... include: S1. Place the pump source housing (3) to be tested on the L-shaped positioning block (207) of the movable adjustment structure (2) to complete the initial clamping and positioning; S2. The visual inspection mechanism (7) acquires images of the pump source housing (3) and sends the acquired image data to the touch control mechanism (8). The operator or the program in the touch control mechanism (8) identifies the outline and structural features of the pump source housing (3) based on the image data, and sets or selects the detection point coordinates and detection process corresponding to the current pump source housing (3) model, for the frame (301), fixed step I (302) and fixed step II (303). S3. According to the set detection point coordinates, control the X-axis motor (204) and Y-axis motor (201) of the moving adjustment structure (2) to work together to drive the pump source housing (3) to move along the X-axis direction, so that each set detection point of the side frame (301) to be detected moves sequentially to the front of the X-axis detector (401) probe of the X-axis detection mechanism (4). At each detection point, the X-axis moving platform (206) is controlled to move slightly so that the probe of the X-axis detector (401) contacts the side of the pump source housing (3), and the displacement data of the detection point in the X-axis direction is measured. The displacement data of all detection points are then sent to the touch mechanism (8). S4. Control the moving adjustment structure (2) to drive the pump source housing (3) to move along the Y-axis direction, so that each set detection point on the other side frame (301) moves sequentially to the front of the probe (503) of the Y-axis detector (502) of the Y-axis detection mechanism (5); At each detection point, the Y-axis moving platform (203) is controlled to move slightly so that the probe (503) of the Y-axis detector (502) contacts the side of the pump source housing (3), and the displacement data of the detection point in the Y-axis direction is measured. The displacement data of all detection points are then sent to the touch mechanism (8). S5. Control the moving adjustment structure (2) to drive the fixed step I (302) and fixed step II (303) of the pump source housing (3) to move sequentially to the Z-axis detector (603) of the Z-axis detection mechanism (6) directly below it; at each detection point, control the Z-axis motor (601) of the Z-axis detection mechanism (6) to drive the Z-axis detector (603) to descend along the Z-axis guide rail (602) so that the probe contacts the step surface, measures the height data of the detection point, and sends the height data of all detection points to the touch mechanism (8). S6. Receive and store X-axis, Y-axis and Z-axis detection data, compare and analyze the detection data with the preset standard size or tolerance range, and determine whether the deformation of the pump source housing (3) at each detection point is qualified. S7. Display the deformation judgment result on the touch screen (801).

2. The method for rapid detection of semiconductor laser pump source housing deformation according to claim 1, characterized in that, S3 specifically includes the following steps: S31: The touch mechanism calls the stored set of detection point coordinates of the side frame of the pump source housing to be detected, and extracts the X-axis target coordinates of the first detection point; S32: The touch mechanism sends a pulse control signal to the X-axis motor of the moving adjustment structure, driving the X-axis moving platform to move along the X-axis guide rail until the X-axis coordinate of the first detection point of the pump source housing coincides with the X-axis reference coordinate of the X-axis detector probe; S33: The touch mechanism sends a fine-tuning pulse signal to the Y-axis motor of the moving adjustment structure, driving the Y-axis moving platform to move slightly along the Y-axis guide rail, so that the side frame of the pump source housing to be tested is kept parallel and aligned with the probe of the X-axis detector; S34: The touch mechanism sends a trigger signal to the X-axis detector, controlling the probe of the X-axis detector to extend until the probe contacts the surface of the side frame to be detected of the pump source housing, and collects the X-axis displacement data at that point; S35: The touch mechanism receives and stores the displacement data transmitted by the X-axis detector, and repeats steps S31 to S34 until the X-axis displacement data acquisition of all detection points on the side frame to be detected is completed.

3. The method for rapid detection of semiconductor laser pump source housing deformation according to claim 1, characterized in that, S4 specifically includes the following steps: S41: Calculate the target platform position required for each detection point and generate coordinated motion commands; S42: After driving the pump source housing to the safe gap position of the first detection point, control the Y-axis moving platform to approach the probe at low speed; S43: When the probe makes effective contact with the pump source housing, the displacement reading is collected and the platform position data is recorded simultaneously; S44: After the control probe separates from the workpiece, determine whether the current detection point is the last point in the sequence; S45: Repeat the approach, acquisition, separation and judgment operations for subsequent detection points until the data acquisition of all detection points is completed.

4. The method for rapid detection of semiconductor laser pump source housing deformation according to claim 1, characterized in that, S5 specifically includes the following steps: S51: After the touch mechanism retrieves the current locked coordinates of the Y-axis moving platform and the X-axis moving platform after step S4, it retrieves the Z-axis detection point coordinate array and the verticality error matrix of the fixed bracket. Send target position commands to the Y-axis motor and X-axis motor to drive the Y-axis moving platform to slide along the Y-axis guide rail and the X-axis moving platform to slide together along the X-axis guide rail, so that the center of the area to be measured of the fixed step I and fixed step II is displaced to below the vertical axis of the Z-axis detector. The Z-axis motor is driven to raise the Z-axis measuring instrument along the Z-axis guide rail to the mechanical origin, establishing the Z-axis measurement reference height H0; S52: The touch mechanism parses the (x) corresponding to the current index k. k ,y k ,z k ), calculate the current X reading of the X-axis moving platform and x k The difference Δx k Current Y-axis reading and y-axis movement platform k The difference Δy k Based on the X-axis motor pulse frequency and Y-axis motor pulse frequency Generate pulse frequency; v zx ,v zy This corresponds to the normalized velocity along the X and Y axes; After receiving pulses, the X-axis motor and Y-axis motor drive the X-axis guide rail and Y-axis guide rail respectively, so that the pump source housing approaches the target vertical line in the horizontal plane along the radial direction. The grating ruler provides real-time feedback until the residual is less than the threshold ε. S53: After horizontal positioning is completed, the touch mechanism... Calculate the initial descent speed of the Z-axis motor. vz 0 represents the initial velocity reference value along the Z-axis. λ The exponential decay coefficient is... zk The theoretical Z-coordinate of the current detection point; Send pulse commands to the Z-axis motor to drive the Z-axis detector to fall along the Z-axis guide rail; After the probe of the Z-axis measuring instrument contacts the surface of fixed step I or fixed step II, the internal piezoelectric sensor outputs a charge signal Q, which is converted into a voltage Uz=Q / C by a charge amplifier. f C f For feedback capacitor; when U z Exceeding threshold U zt At that time, the touch mechanism latches the Z-axis guide rail grating ruler reading z. m and the initial reading s of the Z-axis measuring instrument z0 ; S54: The touch mechanism reads the displacement change Δs of the Z-axis measuring instrument. z ,based on Calculate the actual height, where φ is the installation angle between the Z-axis guide rail and the plumb line, ζ is the coefficient of thermal expansion, and T is the current ambient temperature; calculate the height deviation δ. z =Z r -z k ; the quadruple (x k ,y k Z r ,δ z Write to the stack storage area of ​​the touch mechanism; According to δ z The absolute value of the magnitude is determined by... Calculate the data retention time at this point. τ As the reference time constant, η This is the sensitivity coefficient; S55: The touch mechanism sends a reverse pulse to the Z-axis motor, driving the Z-axis detector to rise a distance H along the Z-axis guide rail. s The probe is disengaged from either fixed step I or fixed step II; index k is incremented by 1; if k ≤ p, the process returns to step S52; if k > p, the touch mechanism encodes the p groups of quadruplets in the stack into a Z-axis deformation dataset Dz, transmits it to the database, and clears the stack pointer.

5. The method for rapid detection of semiconductor laser pump source housing deformation according to claim 1, characterized in that, S6 specifically includes the following steps: S61: Receives multi-axis detection data and performs matching and verification to form valid data records; S62: Based on the valid data records, call the standard model to calculate the deformation components of each detection point; S63: Calculate the morphology parameters based on the deformation components, and compare each parameter with the preset tolerance threshold; S64: Perform a classification determination based on the comparison results and generate a result report.

6. A rapid detection device for deformation of a semiconductor laser pump source housing, characterized in that, The apparatus is used to implement the rapid detection method for semiconductor laser pump source housing deformation as described in any one of claims 1 to 5; The device includes: a base (1), a movable adjustment structure (2), a pump source housing (3), an X-axis detection mechanism (4), a Y-axis detection mechanism (5), a Z-axis detection mechanism (6), a vision detection mechanism (7), a touch control mechanism (8), a control box (9), and an alarm (10). The movable adjustment structure (2), the touch control mechanism (8), and the control box (9) are respectively installed on the base (1); The movable adjustment structure (2) is equipped with an L-shaped positioning block (207), and the pump source housing (3) is placed on the L-shaped positioning block (207) for positioning; The X-axis detection mechanism (4) is equipped with an X-axis detector (401). The Y-axis detection mechanism (5) is equipped with a Y-axis detector (502), and a probe (503) is installed at the front end of the Y-axis detector (502). The Z-axis detection mechanism (6) is located above the movable adjustment structure (2); the Z-axis detection mechanism (6) is equipped with a Z-axis detector (603); The visual inspection mechanism (7) is installed on one side of the Z-axis inspection mechanism (6).

7. The rapid detection device for semiconductor laser pump source housing deformation according to claim 6, characterized in that, The movable adjustment structure (2) is also equipped with a Y-axis motor (201), the bottom of the Y-axis motor (201) is fixedly connected to the base (1), and a Y-axis guide rail (202) is provided on the Y-axis motor (201). The Y-axis guide rail (202) is slidably connected to the Y-axis moving platform (203). The Y-axis moving platform (203) is equipped with an X-axis guide rail (208). A slider (205) is provided on the X-axis guide rail (208); an X-axis moving platform (206) is provided on the slider (205); and an X-axis motor (204) is connected to the X-axis guide rail (208). An X-axis moving platform (206) is mounted on the slider (205); The L-shaped positioning block (207) is fixed to the X-axis moving platform (206) by screws.

8. The rapid detection device for semiconductor laser pump source housing deformation according to claim 6, characterized in that, A frame (301) is provided on the outside of the pump source housing (3). The frame (301) is provided with fixed step I (302) and fixed step II (303).

9. The rapid detection device for semiconductor laser pump source housing deformation according to claim 6, characterized in that, The X-axis detection mechanism (4) is located near the center of the base (1); The X-axis detection mechanism (4) is also provided with a fixed seat I (402), which is fixed on the first side of the base (1), and one end of the fixed seat I (402) is connected to the X-axis detector (401). The Y-axis detection mechanism (5) is also equipped with a fixed seat II (501); One end of the fixed base II (501) is installed on the second side of the base (1), and the other end of the fixed base II (501) is connected to the Y-axis measuring instrument (502); The Z-axis detection mechanism (6) is provided with a fixed bracket (604). One end of the fixed bracket (604) is fixedly installed on the base (1). The other end of the fixed bracket (604) is provided with a Z-axis guide rail (602). A Z-axis motor (601) is installed at the top of the Z-axis guide rail (602). A Z-axis detector (603) is slidably connected to the Z-axis guide rail (602).

10. The rapid detection device for semiconductor laser pump source housing deformation according to claim 6, characterized in that, The visual inspection mechanism (7) is equipped with a CCD fixing block (703) and a fixing plate (704). One end of the CCD fixing block (703) is connected to a ring light (702) and a CCD industrial camera (701). The CCD industrial camera (701) is mounted on the Z-axis inspection mechanism (6) through the CCD fixing block (703). The touch mechanism (8) is equipped with a touch screen (801) and a switch (802); The control box (9) is equipped with control buttons (901).

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