Automatic defect detection device and method for etching line of printed circuit board

Abstract

The invention discloses a printed circuit board etching line automatic defect detection device and method, and relates to the technical field of printed circuit board detection. The automatic defect detection device for the etching line of the printed circuit board comprises a shell, a conveyor and a visual detection module, the conveyor comprises a rack and a conveying roller, and an absorption mechanism used for absorbing and cleaning impurities on the upper surface of the printed circuit board is arranged above the rack; the absorption mechanism comprises a first rectangular pipe, the first rectangular pipe is connected with the top of the rack through a moving mechanism, and the bottom of the first rectangular pipe is connected with two second rectangular pipes through a swing mechanism. According to the automatic defect detection device and method for the etching line of the printed circuit board, impurities on the upper surface of the printed circuit board can be conveniently absorbed and cleaned, meanwhile, the lower surface of the printed circuit board is adsorbed and balanced, the printed circuit board is prevented from being deformed, the absorption and cleaning effect is guaranteed, meanwhile, the printed circuit board is prevented from being deformed, and the production efficiency is improved. And the accuracy of a detection result is ensured.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board inspection technology, specifically to an automatic defect detection device and method for etched lines on printed circuit boards. Background Technology

[0002] The core of the automatic defect detection device for etched lines of printed circuit boards is an online AOI (automatic optical inspection) system, which is equipped with high-precision optical acquisition, intelligent algorithms and production line linkage mechanisms. It can quickly identify core defects such as short circuits, open circuits and line width deviations after etching. It mainly includes a conveyor and a vision inspection module.

[0003] Publication No. CN101403709B discloses a printed circuit board (PCB) visual inspection machine, including a frame, a conveying mechanism on the frame, a board loading mechanism at the front end of the conveying mechanism, two scanning mechanisms within the conveying mechanism, a flipping mechanism between the two scanning mechanisms, and a sorting mechanism docked at the rear of the conveying mechanism. All mechanisms are coordinated and controlled by a control host. Employing full-line digital camera imaging technology, it can detect defects on PCBs such as impurities, exposed copper, solder paste application, scratches, poor gold plating, character errors, uneven green solder mask, uneven solder pads, uneven trench depth, residual copper, missing prints, and defects in the developed image. Automatic feeding and sorting of good and defective products improves the ease of operation and reliability. Furthermore, a powerful image processing and analysis software system provides multiple image processing and analysis systems, allowing for timely observation of board defects. The machine boasts high inspection speed and efficiency, and is safe, reliable, simple to operate, easy to learn, and meets human-machine interaction requirements. However, when using existing automatic defect detection devices and methods for etched lines on printed circuit boards, the visual characteristics of common impurities on the PCB surface after etching (such as etching solution residue, copper shavings, dry film residue, and dust) are highly similar to some etching defects, affecting the accuracy of the detection results. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic defect detection device and method for etched lines on printed circuit boards, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic defect detection device for etched lines of printed circuit boards, comprising a housing, a conveyor and a vision inspection module, wherein the conveyor comprises a frame and conveying rollers, and an absorption mechanism for absorbing and cleaning impurities on the upper surface of the printed circuit board is provided above the frame. The absorption mechanism includes a first rectangular tube, which is connected to the top of the frame via a moving mechanism. The bottom of the first rectangular tube is connected to two second rectangular tubes via a swing mechanism, and the bottom of each second rectangular tube is connected to multiple absorption tubes. The second rectangular tubes are connected to the first rectangular tubes via multiple first flexible tubes. An exhaust pipe is fixedly inserted into the side wall of the frame. The first rectangular tubes are connected to the exhaust pipe via second flexible tubes. A filter module and an exhaust fan are connected to the side wall of the exhaust pipe. The outlet of the exhaust fan is connected to an exhaust pipe. An adsorption mechanism for adsorbing the lower surface of the printed circuit board is provided on the side wall of the frame.

[0006] Preferably, the adsorption mechanism includes a fixed tube fixedly connected to the side wall of the frame, and the fixed tube is connected to the exhaust pipe. An annular guide rail is fixedly sleeved on the side wall of the fixed tube. A rotating tube is rotatably connected to the annular guide rail. A plurality of exhaust holes are opened on the side wall of the rotating tube. A strip-shaped opening is opened at the top of the fixed tube, and the exhaust holes can communicate with the strip-shaped opening.

[0007] Preferably, the moving mechanism includes a fixed plate fixedly connected to the top of the frame, and a connecting block is connected to the side wall of the fixed plate by a spring telescopic sleeve rod. The connecting block is fixed to the side wall of the first rectangular tube, and the movement of the first rectangular tube is driven by a first pushing mechanism.

[0008] Preferably, the first pushing mechanism includes a connecting rod fixedly connected to the side wall of the connecting block, and a pushing pin fixedly connected to the other end of the connecting rod. A mounting box is fixedly inserted into the side wall of the air outlet pipe, and a cam is connected to the mounting box through a rotating component, so that the end of the pushing pin can slide on the side wall of the cam.

[0009] Preferably, the rotating assembly includes a rotating rod rotatably connected inside the mounting box, with multiple blades fixedly connected to the side wall of the rotating rod, and a cam fixed to one end of the rotating rod.

[0010] Preferably, the swing mechanism includes a support plate fixedly connected to the bottom of the first rectangular tube, and the second rectangular tube is rotatably connected to the side wall of the support plate via a rotating shaft. A gear is fixedly sleeved on the side wall of the rotating shaft, and a movable frame is connected to the side wall of the support plate via a second pushing mechanism. Two racks are fixedly connected to the movable frame, and the racks are meshed with the gears. One of the racks is connected to the side wall of the support plate via a reset assembly.

[0011] Preferably, the reset assembly includes two fixing blocks fixedly connected to the side wall of the support plate, and two guide rods fixedly connected to the side wall of the fixing blocks. A slider is sleeved on the side wall of the guide rod, the slider is fixed to the side wall of the rack, and two springs are sleeved on the side wall of each guide rod.

[0012] Preferably, the second pushing mechanism includes a mounting bracket fixedly connected to the top of the frame, and a plurality of triangular blocks are fixedly connected to the side wall of the mounting bracket, so that one end of the movable frame can slide on the side wall of the triangular blocks.

[0013] Preferably, the frame is provided with a temperature regulating mechanism for regulating the temperature of the printed circuit board surface. The temperature regulating mechanism includes two blower hoods fixed to the frame by a bracket, and the printed circuit board is located between the two blower hoods. The side wall of the blower hood near the printed circuit board has multiple air outlets, and the two blower hoods are connected by a U-shaped tube. The U-shaped tube is connected to the air outlet tube through a connecting pipe, and a temperature control module is provided on the side wall of the U-shaped tube.

[0014] An automatic defect detection method for etched lines on printed circuit boards, using the aforementioned automatic defect detection device for etched lines on printed circuit boards, includes the following steps: S1: During inspection, the etched printed circuit board is placed on the conveyor roller for transport, and its defects are detected by the vision inspection module. Before inspection, the exhaust fan is started, and the exhaust operation is carried out through the exhaust pipe and the second hose. At this time, impurities on the surface of the printed circuit board can be absorbed through the absorption pipe. Then, after entering the second rectangular tube, it enters the first rectangular tube through the first hose, and then enters the filter module through the second hose and the exhaust pipe for filtration. The filtered air is discharged through the exhaust pipe, which facilitates the cleaning of the surface of the printed circuit board, making it more convenient and faster, and ensuring the accuracy of subsequent inspection. S2: At the same time, when the exhaust pipe is in operation, it can exhaust air through the strip opening of the fixed pipe. When the printed circuit board is being transported, it can push the rotating pipe to rotate along the annular guide rail. When the upper exhaust hole is in the open state, it can perform the exhaust operation, thereby adsorbing the lower surface of the printed circuit board. The exhaust hole, which is offset from the strip opening, can be sealed by the fixed pipe to ensure the adsorption effect. When the absorption pipe absorbs impurities on the upper surface of the printed circuit board, it can adsorb and balance the lower surface of the printed circuit board to prevent the printed circuit board from deforming. This ensures the absorption and cleaning effect while avoiding deformation of the printed circuit board. S3: During the absorption and cleaning process, when the filtered air is discharged through the exhaust pipe, it can enter the installation box and impact the surface of the blades, causing the rotating rod to rotate. At the same time, it drives the cam to rotate. When the tip of the cam abuts against the end of the push pin, it can push the connecting rod and the connecting block to move, and drive the first rectangular tube to move. The spring telescopic sleeve is stretched. When the tip of the cam passes the end of the push pin, the first rectangular tube can move back to its original position under the action of the spring telescopic sleeve. This process is repeated, which allows the first rectangular tube to move back and forth. Through the swing mechanism, the second rectangular tube and the absorption tube can move back and forth, resulting in higher absorption efficiency and better effect for impurities. S4: When the first rectangular tube moves back and forth, it drives the moving frame to move back and forth. When the end of the moving frame abuts against the triangular block, it pushes the rack to move. At the same time, the spring deforms and drives the two gears to rotate in opposite directions. When the end of the moving frame passes the triangular block, the two gears can rotate and reset under the action of the spring. By repeating this process, the two second rectangular tubes can be driven to move closer or further apart through the rotating shaft, and the absorption tube can be driven to swing back and forth. This makes it easy to change the absorption angle, so that the suction can cover the gaps on the surface of the printed circuit board, the gaps between the solder pads, the area around the component pins and other hidden places, avoiding the leakage of solder dross, dust, debris and other impurities, making the cleaning more efficient and effective. S5: After cleaning, the air discharged through the exhaust pipe can enter the connecting pipe. At the same time, the temperature control module is activated to regulate and control the air temperature. Then, the constant temperature air enters the blower hood through the U-shaped tube and blows onto the upper and lower surfaces of the printed circuit board through the air outlet. This helps to ensure that the temperature of the printed circuit board is constant, avoids the thermal expansion and contraction of the printed circuit board from affecting the test results, and ensures the accuracy of the test results.

[0015] Compared with the prior art, the beneficial effects of the present invention are: (1) This automatic defect detection device and method for etched lines of printed circuit boards, by setting up an absorption mechanism and an adsorption mechanism, etc., during the detection, the etched printed circuit board is placed on a conveyor roller for conveying, and its defects are detected by a vision inspection module. Before the detection, the exhaust fan is started, and the exhaust operation is performed through the exhaust pipe and the second hose. At this time, the impurities on the surface of the printed circuit board can be absorbed through the absorption pipe. Then, after entering the second rectangular tube, it enters the first rectangular tube through the first hose, and then enters the filter module for filtration through the second hose and the exhaust pipe. The filtered air is discharged through the exhaust pipe, which facilitates the cleaning of the surface of the printed circuit board, making it more convenient and faster, and ensuring To ensure the accuracy of subsequent testing, the system also allows for air extraction through the slotted opening of the fixed tube during ventilation. When the printed circuit board (PCB) is being transported, the rotating tube is pushed along the annular guide rail, opening the upper exhaust port for ventilation. This allows for adsorption of the PCB's lower surface. The exhaust port, offset from the slotted opening, is sealed by the fixed tube to maintain the adsorption effect. While the absorption tube absorbs impurities from the upper surface of the PCB, it also balances the adsorption on the lower surface, preventing deformation and ensuring effective cleaning while avoiding deformation of the PCB.

[0016] (2) This automatic defect detection device and method for etched lines of printed circuit boards, by setting a moving mechanism and a swinging mechanism, allows filtered air to enter the mounting box when it is discharged through the exhaust pipe during absorption cleaning, and impacts the surface of the blades, causing the rotating rod to rotate. At the same time, it drives the cam to rotate. When the tip of the cam abuts against the end of the push pin, it can push the connecting rod and the connecting block to move, and drive the first rectangular tube to move. The spring telescopic sleeve is stretched. When the tip of the cam passes the end of the push pin, the first rectangular tube can move and reset under the action of the spring telescopic sleeve. This process is repeated, so that the first rectangular tube can move back and forth, and the swinging mechanism drives the second rectangular tube and the absorption tube to move back and forth, so that impurities are detected. The absorption efficiency is higher and the effect is better. When the first rectangular tube moves back and forth, it can drive the moving frame to move back and forth. When the end of the moving frame abuts against the triangular block, it can push the rack to move. At the same time, the spring deforms and drives the two gears to rotate in opposite directions. When the end of the moving frame passes the triangular block, the two gears can rotate and reset under the action of the spring. By repeating this process, the two second rectangular tubes can be driven to move closer or further apart through the rotating shaft, and the absorption tube can be driven to swing back and forth. This makes it easy to change the absorption angle, so that the suction can cover the gaps on the surface of the printed circuit board, the gaps between the solder pads, the area around the component pins and other hidden places, avoiding the leakage of solder dross, dust, debris and other impurities, making the cleaning efficiency higher and the effect better.

[0017] (3) The automatic defect detection device and method for etched lines of printed circuit boards, by setting a temperature adjustment mechanism, allows the air discharged through the air outlet to enter the connecting pipe. At the same time, the temperature control module is activated to adjust and control the temperature of the air. Then, the constant temperature air enters the blower hood through the U-shaped tube and blows onto the upper and lower surfaces of the printed circuit board through the air outlet, thereby ensuring that the temperature of the printed circuit board is constant, avoiding the influence of thermal expansion and contraction of the printed circuit board on the detection results, and ensuring the accuracy of the detection results. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the absorption mechanism in this invention; Figure 3 This is a schematic diagram of the overall structure of the absorption mechanism, adsorption mechanism and temperature regulation mechanism in this invention; Figure 4 This is a partial cross-sectional view of the rotating tube in this invention; Figure 5 This is a partial cross-sectional view of the mounting box in this invention; Figure 6 This is a schematic diagram showing the position of the swing mechanism in this invention; Figure 7 This is a schematic diagram of the swing mechanism in this invention; Figure 8 This is a schematic diagram of the reset component in this invention; Figure 9 for Figure 2 Enlarged structural diagram at point A; Figure 10 for Figure 5 A magnified structural diagram at point B in the middle.

[0019] In the diagram: 101, Housing; 102, Frame; 103, Vision Inspection Module; 104, Conveyor Roller; 201, Fixed Pipe; 202, Circular Guide Rail; 203, Rotating Pipe; 204, Exhaust Hole; 205, Strip Opening; 301, Fixed Plate; 302, Spring Telescopic Sleeve Rod; 303, Connecting Block; 401, Connecting Rod; 402, Push Pin; 403, Cam; 501, Mounting Box; 502, Rotating Rod; 503, Blade; 601, Support Plate; 602, Rotating Shaft; 603, Gear; 604, Moving Frame; 605. Rack; 701, Fixing block; 702, Guide rod; 703, Slider; 704, Spring; 801, Mounting bracket; 802, Triangular block; 901, Blower hood; 902, Air outlet; 903, Bracket; 904, Connecting pipe; 905, U-shaped pipe; 906, Temperature control module; 1001, First rectangular pipe; 1002, Second rectangular pipe; 1003, Absorption pipe; 1004, First flexible hose; 1005, Second flexible hose; 1006, Exhaust pipe; 1007, Filter module; 1008, Exhaust fan; 1009, Air outlet pipe. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figures 1-10 The present invention provides an automatic defect detection device for etched lines of printed circuit boards, including a housing 101, a conveyor and a vision inspection module 103. The conveyor includes a frame 102 and a conveying roller 104, both of which are known technologies in this field and will not be described in detail here. An absorption mechanism for absorbing and cleaning impurities on the upper surface of the printed circuit board is provided above the frame 102. The absorption mechanism includes a first rectangular tube 1001, which is connected to the top of the frame 102 via a moving mechanism. Two second rectangular tubes 1002 are connected to the bottom of the first rectangular tube 1001 via a swing mechanism. Multiple absorption tubes 1003 are connected to the bottom of each second rectangular tube 1002. The second rectangular tubes 1002 are connected to the first rectangular tube 1001 via multiple first flexible hoses 1004. An exhaust pipe 1006 is fixedly inserted into the side wall of the frame 102. The first rectangular tube 1001 is connected to the exhaust pipe via a second flexible hose 1005. Pipe 1006 is connected, and the side wall of exhaust pipe 1006 is connected to filter module 1007 and exhaust fan 1008. The outlet of exhaust fan 1008 is connected to exhaust pipe 1009. The side wall of frame 102 is provided with an adsorption mechanism for adsorbing the lower surface of printed circuit board, which facilitates the absorption and cleaning of impurities on the upper surface of printed circuit board. At the same time, it performs adsorption balance on the lower surface of printed circuit board to avoid deformation of printed circuit board. While ensuring the absorption and cleaning effect, it avoids deformation of printed circuit board, thereby ensuring the accuracy of test results.

[0022] Please see Figures 2-4 and Figure 9 The adsorption mechanism includes a fixed pipe 201 fixedly connected to the side wall of the frame 102, and the fixed pipe 201 is connected to the exhaust pipe 1006. An annular guide rail 202 is fixedly sleeved on the side wall of the fixed pipe 201, and a rotating pipe 203 is rotatably connected to the annular guide rail 202. Multiple exhaust holes 204 are opened on the side wall of the rotating pipe 203. A strip-shaped opening 205 is opened at the top of the fixed pipe 201, and the exhaust holes 204 can communicate with the strip-shaped opening 205. When the exhaust fan 1008 is started, exhaust operation is performed through the exhaust pipe 1006 and the second flexible hose 1005. When the exhaust pipe 1006 is performing exhaust, air can pass through the strip-shaped opening 205 of the fixed pipe 201. 5. Ventilation is performed. When the printed circuit board is being transported, the rotating tube 203 is driven to rotate along the annular guide rail 202. When the upper vent 204 is in the open state, ventilation can be performed, thereby adsorbing the lower surface of the printed circuit board. The vent 204, which is offset from the strip opening 205, can be sealed by the fixing tube 201 to ensure the adsorption effect. When the absorption tube 1003 absorbs impurities on the upper surface of the printed circuit board, it can also adsorb and balance the lower surface of the printed circuit board to prevent deformation of the printed circuit board. This ensures the absorption and cleaning effect while avoiding deformation of the printed circuit board.

[0023] Please see Figure 9The moving mechanism includes a fixed plate 301 fixedly connected to the top of the frame 102, and a connecting block 303 is connected to the side wall of the fixed plate 301 through a spring telescopic sleeve 302. The connecting block 303 is fixed to the side wall of the first rectangular tube 1001, and the movement of the first rectangular tube 1001 is driven by a first pushing mechanism. The first pushing mechanism drives the first rectangular tube 1001 to move, and it can be reset under the action of the spring telescopic sleeve 302. By repeating this process, the first rectangular tube 1001 can move back and forth, and the swing mechanism drives the second rectangular tube 1002 and the absorption tube 1003 to move back and forth, so that the absorption efficiency of impurities is higher and the effect is better.

[0024] Please see Figure 9 and Figure 10 The first pushing mechanism includes a connecting rod 401 fixedly connected to the side wall of the connecting block 303, and a push pin 402 fixedly connected to the other end of the connecting rod 401. A mounting box 501 is fixedly inserted into the side wall of the air outlet pipe 1009, and a cam 403 is connected to the mounting box 501 through a rotating assembly, so that the end of the push pin 402 can slide on the side wall of the cam 403. When the filtered air is discharged through the air outlet pipe 1009, the cam 403 can be rotated by the rotating mechanism. When the tip of the cam 403 abuts against the end of the push pin 402, the connecting rod 401 and the connecting block 303 can be pushed to move, and the first rectangular tube 1001 can be moved. The spring telescopic sleeve 302 is stretched. When the tip of the cam 403 passes the end of the push pin 402, the first rectangular tube 1001 can move and reset under the action of the spring telescopic sleeve 302. This process is repeated to make the first rectangular tube 1001 move back and forth.

[0025] Please see Figure 10 The rotating assembly includes a rotating rod 502 rotatably connected inside the mounting box 501. Multiple blades 503 are fixedly connected to the side wall of the rotating rod 502, and a cam 403 is fixed to one end of the rotating rod 502. When the filtered air is discharged through the air outlet pipe 1009, it can enter the mounting box 501 and impact the surface of the blades 503, causing the rotating rod 502 to rotate, and at the same time, driving the cam 403 to rotate.

[0026] Please see Figure 7 and Figure 8The swing mechanism includes a support plate 601 fixedly connected to the bottom of the first rectangular tube 1001, and a second rectangular tube 1002 rotatably connected to the side wall of the support plate 601 via a rotating shaft 602. A gear 603 is fixedly sleeved on the side wall of the rotating shaft 602, and a movable frame 604 is connected to the side wall of the support plate 601 via a second pushing mechanism. Two racks 605 are fixedly connected to the movable frame 604, and the racks 605 are meshed with the gears 603. One of the racks 605 is connected to the side wall of the support plate 601 via a reset assembly. When the first rectangular tube 1001 moves back and forth, the gear 603 can be rotated back and forth through the second pushing mechanism and the reset component. The rotating shaft 602 drives the two second rectangular tubes 1002 to rotate closer or further apart, and drives the absorption tube 1003 to swing back and forth. This makes it easy to change the absorption angle, so that the suction can cover the gaps on the surface of the printed circuit board, the gaps between the solder pads, the area around the component pins and other hidden locations. This avoids missing solder dross, dust, debris and other impurities, making the cleaning more efficient and effective.

[0027] Please see Figure 8 The reset assembly includes two fixing blocks 701 fixedly connected to the side wall of the support plate 601, and two guide rods 702 fixedly connected to the side wall of the fixing blocks 701. A slider 703 is sleeved on the side wall of the guide rod 702. The slider 703 is fixed to the side wall of the rack 605. Two springs 704 are sleeved on the side wall of each guide rod 702, which guide and reset the movement of the rack 605 and the moving frame 604.

[0028] Please see Figure 9 The second pushing mechanism includes a mounting bracket 801 fixedly connected to the top of the frame 102, and a plurality of triangular blocks 802 are fixedly connected to the side wall of the mounting bracket 801, so that one end of the moving frame 604 can slide on the side wall of the triangular block 802. When the end of the moving frame 604 abuts against the triangular block 802, it can push the rack 605 to move, and at the same time, the spring 704 deforms.

[0029] Please see Figure 2 , Figure 3 and Figure 5The frame 102 is equipped with a temperature regulating mechanism for adjusting the temperature of the printed circuit board surface. The temperature regulating mechanism includes two blower covers 901 fixed to the frame 102 by brackets 903, and the printed circuit board is located between the two blower covers 901. Multiple air outlets 902 are opened on the side wall of the blower cover 901 near the printed circuit board, and the two blower covers 901 are connected by a U-shaped tube 905. The U-shaped tube 905 is connected to the air outlet pipe 1009 through a connecting pipe 904, and a temperature control module 906 is provided on the side wall of the U-shaped tube 905. The air discharged through the air outlet pipe 1009 can enter the connecting pipe 904. At the same time, the temperature control module 906 is activated to regulate and control the temperature of the air. Then, the constant temperature air enters the blower cover 901 through the U-shaped tube 905 and is blown onto the upper and lower surfaces of the printed circuit board through the air outlets 902, thereby ensuring that the temperature of the printed circuit board is constant, avoiding the influence of thermal expansion and contraction of the printed circuit board on the test results, and ensuring the accuracy of the test results.

[0030] An automatic defect detection method for etched lines on printed circuit boards, using the aforementioned automatic defect detection device for etched lines on printed circuit boards, includes the following steps: S1: During inspection, the etched printed circuit board is placed on the conveyor roller 104 for conveying, and its defects are detected by the vision inspection module 103. Before inspection, the exhaust fan 1008 is started, and the exhaust operation is performed through the exhaust pipe 1006 and the second hose 1005. At this time, the impurities on the surface of the printed circuit board can be absorbed through the absorption pipe 1003. Then, after entering the second rectangular tube 1002, it enters the first rectangular tube 1001 through the first hose 1004, and enters the filter module 1007 through the second hose 1005 and the exhaust pipe 1006 for filtration. The filtered air is discharged through the exhaust pipe 1009, which facilitates the cleaning of the surface of the printed circuit board, making it more convenient and faster, and ensuring the accuracy of subsequent inspection. S2: At the same time, when the exhaust pipe 1006 is ventilating, it can ventilate through the strip opening 205 of the fixed pipe 201. When the printed circuit board is being transported, it can drive the rotating pipe 203 to rotate along the annular guide rail 202. When the upper exhaust hole 204 is in the open state, it can perform the ventilating operation, thereby adsorbing the lower surface of the printed circuit board. The exhaust hole 204, which is offset from the strip opening 205, can be sealed by the fixed pipe 201 to ensure the adsorption effect. When the absorption pipe 1003 absorbs impurities on the upper surface of the printed circuit board, it can adsorb and balance the lower surface of the printed circuit board to avoid deformation of the printed circuit board. While ensuring the absorption and cleaning effect, it can also avoid deforming the printed circuit board. S3: During the absorption and cleaning process, when the filtered air is discharged through the air outlet 1009, it can enter the mounting box 501 and impact the surface of the blades 503, causing the rotating rod 502 to rotate. At the same time, it drives the cam 403 to rotate. When the tip of the cam 403 abuts against the end of the push pin 402, it can push the connecting rod 401 and the connecting block 303 to move, and drive the first rectangular tube 1001 to move. The spring telescopic sleeve 302 is stretched. When the tip of the cam 403 passes the end of the push pin 402, the first rectangular tube 1001 can move and reset under the action of the spring telescopic sleeve 302. This process is repeated, so that the first rectangular tube 1001 can move back and forth, and through the swing mechanism, it can drive the second rectangular tube 1002 and the absorption tube 1003 to move back and forth, making the absorption efficiency of impurities higher and the effect better. S4: When the first rectangular tube 1001 reciprocates, it drives the moving frame 604 to reciprocate. When the end of the moving frame 604 abuts against the triangular block 802, it pushes the rack 605 to move. At the same time, the spring 704 deforms and drives the two gears 603 to rotate in opposite directions. When the end of the moving frame 604 passes the triangular block 802, the two gears 603 can rotate and reset under the action of the spring 704. By reciprocating in this way, the two second rectangular tubes 1002 can be driven to move closer or further apart through the rotating shaft 602, and the absorption tube 1003 can be driven to swing back and forth. This makes it easy to change the absorption angle, so that the suction can cover the gaps on the surface of the printed circuit board, the gaps between the solder pads, the area around the component pins and other hidden places, avoiding the leakage of solder dross, dust, debris and other impurities, making the cleaning more efficient and effective. S5: After cleaning, the air discharged through the air outlet 1009 can enter the connecting pipe 904. At the same time, the temperature control module 906 is activated to regulate and control the air temperature. Then, the constant temperature air enters the blower hood 901 through the U-shaped tube 905 and is blown onto the upper and lower surfaces of the printed circuit board through the air outlet 902. This helps to ensure that the temperature of the printed circuit board is constant, avoids the thermal expansion and contraction of the printed circuit board from affecting the test results, and ensures the accuracy of the test results.

[0031] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0032] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A printed circuit board etching line automatic defect detection device, comprising a shell (101), a conveyor and a visual detection module (103), and the conveyor comprises a rack (102) and a conveying roller (104), characterized in that: The upper part of the frame (102) is provided with an absorption mechanism for absorbing and cleaning impurities on the upper surface of the printed circuit board. The absorption mechanism comprises a first rectangular tube (1001), and the first rectangular tube (1001) is connected with the top of the frame (102) through a moving mechanism. The bottom of the first rectangular tube (1001) is connected with two second rectangular tubes (1002) through a swing mechanism. The bottom of each second rectangular tube (1002) is communicated with a plurality of absorption tubes (1003). The second rectangular tubes (1002) are communicated with the first rectangular tube (1001) through a plurality of first flexible pipes (1004). The sidewall of the frame (102) is fixedly provided with an air extraction pipe (1006). The first rectangular tube (1001) is communicated with the air extraction pipe (1006) through a second flexible pipe (1005). The sidewall of the air extraction pipe (1006) is communicated with a filter module (1007) and an air extractor (1008). The outlet of the air extractor (1008) is communicated with an air outlet pipe (1009). The sidewall of the frame (102) is provided with an adsorption mechanism for adsorbing the lower surface of the printed circuit board.

2. The printed circuit board etch line automatic defect detection apparatus of claim 1, wherein: The adsorption mechanism comprises a fixed tube (201) fixedly connected to the sidewall of the frame (102), and the fixed tube (201) is communicated with the air extraction pipe (1006). The sidewall of the fixed tube (201) is fixedly sleeved with an annular guide rail (202). The annular guide rail (202) is rotatably connected with a rotating tube (203). The sidewall of the rotating tube (203) is provided with a plurality of air extraction holes (204). The top of the fixed tube (201) is provided with a strip-shaped opening (205), and the air extraction holes (204) can be communicated with the strip-shaped opening (205).

3. The printed circuit board etch line automatic defect detection apparatus of claim 2, wherein: The moving mechanism comprises a fixed plate (301) fixedly connected to the top of the frame (102). The sidewall of the fixed plate (301) is connected with a connecting block (303) through a spring telescopic sleeve rod (302). The connecting block (303) is fixedly connected with the sidewall of the first rectangular tube (1001). The movement of the first rectangular tube (1001) is pushed by the first pushing mechanism.

4. The printed circuit board etch line automatic defect detection apparatus of claim 3, wherein: The first pushing mechanism comprises a connecting rod (401) fixedly connected to the sidewall of the connecting block (303). The other end of the connecting rod (401) is fixedly connected with a pushing pin (402). The sidewall of the air outlet pipe (1009) is fixedly provided with a mounting box (501). The mounting box (501) is connected with a cam (403) through a rotating assembly, so that the end of the pushing pin (402) can slide on the sidewall of the cam (403).

5. The printed circuit board etch line automatic defect detection apparatus of claim 4, wherein: The rotating assembly comprises a rotating rod (502) rotatably connected in the mounting box (501). The sidewall of the rotating rod (502) is fixedly connected with a plurality of blades (503). The cam (403) is fixedly connected with one end of the rotating rod (502).

6. The printed circuit board etch line automatic defect detection apparatus of claim 1, wherein: The swing mechanism comprises a support plate (601) fixedly connected to the bottom of the first rectangular tube (1001), and the second rectangular tube (1002) is rotationally connected to the side wall of the support plate (601) through a rotating shaft (602), the side wall of the rotating shaft (602) is fixedly sleeved with a gear (603), the side wall of the support plate (601) is connected with a moving frame (604) through a second pushing mechanism, two racks (605) are fixedly connected to the moving frame (604), and the racks (605) are meshingly arranged with the gear (603); one of the racks (605) is connected to the side wall of the support plate (601) through a reset assembly.

7. The printed circuit board etch line automatic defect detection apparatus of claim 6, wherein: The reset assembly comprises two fixed blocks (701) fixedly connected to the side wall of the support plate (601), the side wall of the fixed block (701) is fixedly connected with two guide rods (702), the side wall of the guide rod (702) is sleeved with a sliding block (703), the sliding block (703) is fixed to the side wall of the rack (605), and the side wall of each guide rod (702) is sleeved with two springs (704).

8. The printed circuit board etch line automatic defect detection apparatus of claim 6, wherein: The second pushing mechanism comprises a mounting frame (801) fixedly connected to the top of the rack (102), and the side wall of the mounting frame (801) is fixedly connected with a plurality of triangular blocks (802), so that one end of the moving frame (604) can slide on the side wall of the triangular block (802).

9. The printed circuit board etch line automatic defect detection apparatus of claim 1, wherein: The rack (102) is provided with a temperature adjusting mechanism for adjusting the temperature of the surface of the printed circuit board, the temperature adjusting mechanism comprises two blow covers (901) fixed to the rack (102) through a support (903), and the printed circuit board is located between the two blow covers (901), a plurality of air outlets (902) are formed in the side wall of the blow cover (901) close to the printed circuit board, the two blow covers (901) are communicated through a U-shaped pipe (905), the U-shaped pipe (905) is communicated with an air outlet pipe (1009) through a connecting pipe (904), and the side wall of the U-shaped pipe (905) is provided with a temperature control module (906).

10. A method for automatic defect detection of printed circuit board etching lines, using the apparatus for automatic defect detection of printed circuit board etching lines according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: Start the air extractor (1008), and absorb the impurities on the upper surface of the printed circuit board through the absorption pipe (1003), and the impurities enter the filter module (1007) through the second rectangular tube (1002), the first hose (1004), the first rectangular tube (1001), the second hose (1005) and the air extraction pipe (1006); At the same time of absorbing the impurities, the lower surface of the printed circuit board is adsorbed through the adsorption mechanism, and the adsorption mechanism realizes selective suction through cooperation of the strip-shaped opening (205) of the fixed pipe (201) and the air extraction hole (204) on the rotating pipe (203); The first rectangular tube (1001) is driven to reciprocate by the airflow discharged from the air outlet pipe (1009), and the second rectangular tube (1002) and the absorption pipe (1003) are swung through the swing mechanism; The surface of the printed circuit board is temperature-adjusted through the temperature adjusting mechanism, and the airflow adjusted through the temperature control module (906) is blown to the upper and lower surfaces of the printed circuit board. After cleaning and temperature conditioning, the printed circuit board is subjected to defect detection by a vision inspection module (103). After cleaning and temperature conditioning, the printed circuit board is subjected to defect detection by a vision inspection module (103).

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