Education intelligent all-in-one machine device integrated with multidisciplinary simulation experiment system

Abstract

The invention relates to the technical field of educational experiment equipment, and discloses an educational intelligent all-in-one machine device integrated with a multidisciplinary simulation experiment system. Comprising a core processing system, an intelligent backboard bus system, at least one standardized hardware resource module, an integrated case and a multidisciplinary experiment management software platform running on the core processing system, the intelligent backboard bus system is connected with the core processing system through a high-speed system bus, and at least one standardized hardware resource module is connected to a standardized module slot provided by the intelligent backboard bus system in a pluggable mode. According to the technical scheme, switching among completely different subject scenes such as electronic circuit experiments, automatic control experiments, biological signal measurement and physical phenomenon simulation can be achieved by replacing different basic resource modules, the equipment utilization rate and the rate of return on investment are extremely high, and multi-subject hardware resource sharing is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of educational experimental equipment, in particular to an educational intelligent all-in-one machine device integrating a multi-disciplinary simulation experiment system. BACKGROUND

[0002] Currently, the experimental teaching equipment in colleges and universities generally faces the dual dilemma of function solidification and discipline isolation. Specifically, the existing solutions mainly fall into four categories, all of which have significant limitations: first, the special experiment box for specific courses (such as single-chip microcomputer, computer composition principle), its function is strictly bound to the course content, resulting in the need for repeated purchase of a large number of single-function equipment in electronic, control, communication and other professional laboratories, causing serious waste of resources and space occupation. Second, the function integrated experiment system using the "core board + extension board" mode, although it realizes partial modularization within a single discipline, its architecture is essentially a fixed "core-peripheral" topology, the module function is predefined and cannot be reorganized across disciplines, only solving physical integration, not realizing flexible configuration of logic and resources. Third, the pure software simulation system can simulate multiple experimental scenarios, but students' operation is completely divorced from real sensors, signals and actuators, and cannot cultivate key engineering practice abilities such as measurement, debugging and error analysis of the physical world. Fourth, the simulation training system for engineering training focuses on operation process training and safety control, and its functional modules are mostly black-boxed complete subsystems, which are closed internally and cannot interact and reconfigure the underlying signals. These devices generally have poor connection reliability, invisible state, high maintenance cost and other problems, which makes the valuable energy in the teaching process often consumed in equipment debugging rather than principle exploration, seriously restricting the effectiveness and efficiency of experimental teaching.

[0003] Currently, the existing technology lacks the ability to integrate multiple disciplines, there are barriers between hardware and data of different disciplines, the experimental process relies on tedious manual operation and offline processing, and the system level does not have the ability to define and automatically execute cross-disciplinary logic chains, which fundamentally limits the development of innovative experimental design involving multi-disciplinary knowledge intersection and real-time inquiry learning. SUMMARY

[0004] Technical problems to be solved In view of the deficiencies of the prior art, the present application provides an educational intelligent all-in-one machine device integrating a multi-disciplinary simulation experiment system, which solves the problem that there are barriers between hardware and data of different disciplines, the experimental process relies on tedious manual operation and offline processing, and the system level does not have the ability to define and automatically execute cross-disciplinary logic chains, which fundamentally limits the development of innovative experimental design involving multi-disciplinary knowledge intersection and real-time inquiry learning.

[0005] Technical scheme In order to achieve the above-mentioned purpose, the present application provides the following technical scheme: an intelligent integrated machine device for integrated multi-disciplinary simulation experiment system education, comprising a core processing system, an intelligent backplane bus system, at least one standardized hardware resource module, an integrated case and a multi-disciplinary experiment management software platform running on the core processing system; The intelligent backplane bus system is fixedly installed on the framework inside the integrated case and connected with the core processing system through a high-speed system bus; The at least one standardized hardware resource module is pluggably connected to the standardized module slot provided by the intelligent backplane bus system; The multi-disciplinary experiment management software platform is configured to: Recognize the inserted standardized hardware resource module and provide a graphical interface for a user to define a cross-disciplinary simulation experiment logic, the experiment logic realizes automatic collection, conversion, calculation and cooperation of multi-disciplinary data by calling different hardware resource modules and built-in discipline models.

[0006] As a further description of the above technical scheme, the core processing system comprises an embedded industrial mainboard, the embedded industrial mainboard is integrated with a central processing unit, a memory and a storage, an on-board management and communication module and a mainboard expansion interface, the embedded industrial mainboard is electrically connected with the intelligent backplane bus system through a PCIe data channel; the core processing system is further connected with a touch display screen integrated in the front panel of the integrated case and an external expansion interface group arranged on the rear panel of the case; The on-board management and communication module further comprises: Two gigabit Ethernet controllers, one of which is used to access an external local area network or the Internet, connect a teacher machine, a cloud platform and a student terminal, and the other is used to connect the intelligent backplane bus system to form an independent device management network; A wireless communication module is used to provide Wi-Fi and Bluetooth connection; A security chip is used for system security start and data encryption; The mainboard expansion interface further comprises: A slot is used as the high-speed system bus and directly connected with the intelligent backplane bus system through a PCIe data channel to form a core data path; A plurality of USB interfaces and video output interfaces are arranged on the rear panel of the integrated case to form an external expansion interface group and used to connect external devices, storage devices and auxiliary displays; An internal display interface is connected with the touch display screen integrated in the front panel of the integrated case through an internal cable.

[0007] As a further description of the above technical scheme, the intelligent backplane bus system comprises a multi-layer printed circuit board, and N module slots with consistent physical specifications are arranged on the multi-layer printed circuit board, and each module slot corresponds to a composite electrical connector female head; The intelligent backplane bus system is further divided into three functional sub-layers, comprising: A power distribution sub-layer is connected with a built-in switching power supply of an integrated case and provides independent controllable multi-channel direct-current power supply for each module slot; A high-speed data exchange sub-layer is integrated with a PCIe exchange chip and provides independent PCIe data link for each module slot and is connected to the core processing system through the PCIe data channel; A management and control sub-layer is integrated with a backplane management microcontroller, connects a management interface of each module slot through an I2C bus, and is connected with a temperature sensor array and a fan PWM control circuit.

[0008] As a further description of the above technical scheme, in the power distribution sub-layer, a smart power switch chip configured for each module slot is controlled through an I2C bus of the management and control sub-layer to realize independent switching, soft starting, and overcurrent, overvoltage, short circuit protection and monitoring of the power supply of each slot.

[0009] As a further description of the above technical scheme, the standardized hardware resource module comprises a module shell, a front panel discipline professional interface located at the front end of the shell, a core function circuit board, a module intelligent management unit, and a composite electrical connector male head located at the back of the shell; The core function circuit board realizes the specific hardware function of the module and is connected with the front panel discipline professional interface and the composite electrical connector male head through internal wiring; The module intelligent management unit contains a non-volatile memory storing module identity and parameters and communicates with the management and control sub-layer of the intelligent backplane bus system through specified pins of the composite electrical connector male head.

[0010] As a further description of the above technical scheme, the module shell is integrated with a mechatronic connection mechanism, which comprises a guide structure for guiding and positioning and a mechanical locking mechanism linked with the guide structure, and the mechanism is used for pressing the composite electrical connector male head on the composite electrical connector female head; Further comprising a mechanical encoder arranged at the back of the module shell and a spectrum temperature sensing RGB LED lamp controlled by the module intelligent management unit.

[0011] As a further description of the above technical solution, the management and control sublayer of the intelligent backplane bus system is connected with a sensor array cooperating with the mechanical encoder, for realizing physical anti-misplug identification of the module, and the color of the spectral temperature sensing RGB LED lamp dynamically changes according to the internal temperature monitored by the module intelligent management unit.

[0012] As a further description of the above technical solution, the multidisciplinary experiment management software platform comprises: a graphical experiment designer, for generating a unified effect description language script describing cross-disciplinary data flow and causal relationship through the way of dragging components and connecting lines; a parsing and verification engine, for parsing and executing the script, the parsing and verification engine comprising: a physical quantity manager, for maintaining the standardized definition and unit conversion relationship of physical quantities; a publish-subscribe message bus, as a hub for data exchange between components in the system; a hardware abstraction layer, for encapsulating the operation of the standardized hardware resource module as a unified application programming interface; a discipline model plug-in library, for dynamically loading and executing computational models in the fields of physics, chemistry and biology; The hardware abstraction layer converts the data collected by the hardware into standard physical quantities and publishes them to the publish-subscribe message bus, the discipline model plug-in subscribing to the relevant physical quantities is triggered to calculate, and the calculation results are published as new physical quantities again, so as to realize automatic flow and fusion of cross-disciplinary data.

[0013] As a further description of the above technical solution, the integrated case is internally provided with a plurality of heat dissipation air ducts independently regulated in speed based on the temperature data of the management and control sublayer, constituting a layered intelligent heat dissipation system.

[0014] The application also provides a method for realizing multidisciplinary simulation experiment, comprising the following steps: S1: the user defines the simulation experiment logic involving at least two different disciplines through the graphical experiment designer, and generates an experiment description script; S2: the system automatically identifies and configures the required standardized hardware resource module according to the script, and initializes the hardware parameters through the hardware abstraction layer; S3: the experiment runtime engine is started, and a data flow pipeline based on the publish-subscribe message bus is established; S4: the hardware abstraction layer drives the specified hardware resource module to collect data at a set period during the experiment execution, and publishes the standardized data to the publish-subscribe message bus; The discipline model plug-in library subscribed to the data is triggered automatically, performs calculation and publishes the result as new data, and the process is chained until the complete cross-disciplinary effect chain defined by the script is completed, the visualization component subscribes to the final data, and real-time chart updating is realized. S5: The experimental data is synchronously recorded and stored, and an analysis report can be generated.

[0015] Advantages Compared with the prior art, the present application provides an intelligent all-in-one machine device for integrated multi-disciplinary simulation experiment system education, which has the following advantages: 1. The intelligent all-in-one machine provided by the technical solution can switch between completely different discipline scenes such as electronic circuit experiment, automatic control experiment, biological signal measurement and physical phenomenon simulation by replacing different basic resource modules, the utilization rate and return on investment of the equipment are extremely high, and multi-disciplinary hardware resource sharing is realized.

[0016] 2. Through software definition and EDL, users can easily build complex experiments involving multiple discipline causal chains, and shift the focus of experiment design from tedious hardware wiring and programming to thinking about scientific problems themselves and cross-disciplinary logic, providing experiment design flexibility.

[0017] 3. The new connection mechanism solves the pain point of easy damage during device plugging in the education scene, the intelligent state indication makes the system working state clear at a glance, the automated resource management and error checking greatly reduce the operation threshold, and the system reliability and usability are ensured.

[0018] 4. The technical solution adopts standardized hardware interface and plug-in software architecture, allows third-party developers to develop new hardware modules or discipline models, continuously expands the capability boundary of the system, makes it a continuously evolving ecosystem, and builds an open scientific research and innovation platform. DETAILED DESCRIPTION

[0019] Figure 1 It is the overall hardware architecture diagram of the system of the present application; Figure 2 It is the internal hierarchical structure diagram of the intelligent backplane bus; Figure 3 It is a detailed composition diagram of the core processing system subsystem; Figure 4 It is a general internal structure diagram of the standardized hardware resource module; Figure 5 It is a software system architecture diagram for realizing multi-disciplinary integration; Figure 6 It is a cross-disciplinary real-time data flow schematic diagram taking photosynthesis experiment as an example; Figure 7The four-parameter real-time change curve (normalized value) of the photosynthesis multidisciplinary exploration experiment. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0021] EMBODIMENT The present application aims to provide a brand-new intelligent all-in-one machine device for integrated multidisciplinary simulation experiment system education, and the core purpose is not only the integration of hardware devices, but also to build an open innovation platform supporting on-demand allocation of hardware resources, dynamic invocation of multidisciplinary models and software-defined experimental processes. The system enables students and researchers to freely combine hardware resources and computational models of different disciplines like building blocks, quickly build and run complex cross-disciplinary simulation experiments, and thus completely change the traditional experimental teaching mode.

[0022] As Figures 1-4 shown, to achieve the above-mentioned purpose, the present application proposes a full-stack solution of "hardware resource pooling, software-defined process and discipline model plug-in". The technical solution is jointly constituted by a tightly coupled hardware architecture and a software architecture.

[0023] First part: hierarchical and standardized hardware system architecture The hardware system of the present application adopts a clear three-layer structure, ensuring the flexibility, reliability and expandability of the foundation.

[0024] Core processing system: as the brain and sensory organ of the system, responsible for global control, data processing and human-computer interaction. Its core is a high-performance embedded industrial mainboard, which carries a multi-core processor, not less than 8GB of memory and high-speed solid state storage, and its key role and connection mode are as follows: Core control: the embedded industrial mainboard is directly connected with the Pcle3.0 / 4.0 exchange chip of the intelligent backboard bus system through a PCIe x4 or higher bandwidth dedicated channel, builds a system core data backbone network, and ensures that the communication delay with all hardware resource modules is lower than the millisecond level.

[0025] Network interconnection: the embedded industrial mainboard integrates a dual-gigabit Ethernet controller and a Wi-Fi 6 / Bluetooth 5.2 module. One network connection is connected with the laboratory local area network and the Internet, realizing communication with the teacher machine and the cloud platform; the other network is directly connected with the backboard management network.

[0026] Human-computer interaction: the mainboard drives the 10.1-inch or above high-resolution capacitive touch screen integrated on the front panel of the device through the LVDS interface, as the local main interaction interface, and provides multiple USB3.0 and HDMI interfaces on the rear of the integrated case for connecting keyboard, mouse, extended display and VR / AR equipment.

[0027] The software carrier running the unified experimental management operating system has the core software framework of the application deployed thereon, including device drivers, resource schedulers, multidisciplinary experiment engines and the like.

[0028] The intelligent backboard bus system is a customized multi-layer PCB board vertically fixed to the central internal framework of the integrated case, providing N (such as 8) completely identical standardized module slots, each corresponding to a 104Pin composite electrical connector female seat, and the pins are precisely divided according to functions: Power distribution sublayer: the intelligent backboard is connected with a 600W 80Plus gold certified high-density switching power supply, and the power output is multiple DC such as +12V, +5V and +3.3V, which is not simply connected in parallel, but independently controlled and monitored through a series of intelligent power switch chips (such as TPS series of TI). Each power supply of each module slot has independent overcurrent, overvoltage, short circuit protection and current sampling circuit, and the related state is reported to the backboard management MCU (STM32H7) through the I2C bus. This design allows the system to power on, power off or limit the power consumption of a single module slot.

[0029] High-speed data exchange sublayer: the backboard integrates a PCIe3.0 / 4.0 switching chip. The chip is connected with the PCIe channel of the core mainboard, and provides independent PCIe x2 or x4 link for each slot. All high-speed equal-length differential wires are strictly controlled in impedance and designed in equal length to ensure signal integrity (<5mil error), which enables each hardware resource module to exchange high-speed data with the core processor in a "straight-through" manner, with exclusive bandwidth and no interference.

[0030] Management and control sublayer: the sublayer takes a high-performance MCU (STM32H7) as the core. The MCU is connected with the "management pin" of each slot through the I2C bus, and realizes the following functions: Hot plug detection: sensing the insertion and removal of the module; Identity authentication: reading the unique ID and digital signature stored in the EEPROM in the module; State monitoring: collecting temperature sensor data of each slot; Mechanical control: Recognize the 8-bit mechanical code dial status beside the slot, realize the anti-misplug logic; Receive the Hall sensor signal of the module locking mechanism, design a precise stainless steel conical guide pillar and T-shaped locking groove around the electrical connector, and cooperate with the corresponding structure of the module shell to realize "blind insertion" guidance. The integrated case is internally provided with a plurality of heat dissipation air ducts for realizing independent speed regulation based on temperature data of the management and control sublayer, and constitutes a layered intelligent heat dissipation system.

[0031] All functional modules are designed in accordance with unified standard module specifications to ensure complete compatibility with the intelligent backboard.

[0032] A standard hardware resource module is composed of the following parts: Core function circuit board: Carries the specific function of the module, for example: For the "24-bit high-precision data acquisition module", the core is ADS127L01 ADC chip and front-end instrument amplifier; For the "wideband signal generation module", the core is AD9164 DAC chip and waveform synthesis FPGA.

[0033] Module intelligent management unit: This is a small subsystem independent of but integrated with the core function circuit board, which is built around a low-power microcontroller (such as STM32G0 series of STMicroelectronics) and is responsible for the "identity" and "health" management of the module: Identity storage and authentication: Connect a EEPROM or secure authentication chip (such as DS28E15) with password protection function through I2C interface. The chip stores the global unique ID, model code, hardware version, production calibration data, security key and rated power consumption parameters of the module.

[0034] Environmental monitoring: The ADC channel of the management unit is connected to a patch digital temperature sensor (such as TMP117) deployed near the core chip to monitor the internal hotspot temperature of the module in real time.

[0035] Communication and instruction analysis: Connect with the I2C bus of the management and control sublayer of the intelligent backboard bus system through the specified pins of the backboard connector. It is responsible for responding to the polling of the backboard management MCU, reporting identity and status information, and receiving configuration instructions from the upper software Standardized backboard interface: The module back is equipped with a 104Pin composite electrical connector male corresponding to the backboard female, whose pin definition is completely consistent with the backboard, realizing plug and play.

[0036] Hardware resource modules mainly include the following 1. Measurement and perception High-precision data acquisition module: Multi-channel synchronous sampling ADC for general electrical signal measurement.

[0037] Dynamic signal analysis module: high-speed ADC and DSP for vibration, acoustic, etc. signal acquisition and analysis.

[0038] Sensor conditioning module: integrated instrumentation amplifier and bridge, directly connected to strain gauges, thermistors, etc. sensors.

[0039] High-speed digitizer module: high sampling rate ADC for capturing transient and high-frequency signals.

[0040] 2. Signal generation class Arbitrary waveform generator module: high-resolution DAC, output standard and custom waveforms.

[0041] Programmable power supply module: voltage / current accurately adjustable DC power supply.

[0042] RF signal source module: generates high-frequency sine wave for communication circuit testing.

[0043] Pulse generator module: generates adjustable parameter digital pulse sequence.

[0044] 3. Control and drive class Multi-axis motor drive module: integrated multi-channel servo / stepping driver, with built-in current sampling.

[0045] Power switch output module: multi-channel relay / solid-state relay, controls high-power load.

[0046] PID controller module: hardware implementation of fast closed-loop control loop.

[0047] Piezoelectric drive module: high-voltage output, drives piezoelectric ceramics and other special loads.

[0048] 4. Computing and processing class FPGA module: programmable logic resources for hardware acceleration and custom digital circuits.

[0049] Embedded processor module: general-purpose computing unit running an operating system.

[0050] DSP module: dedicated digital signal processor for complex mathematical operations.

[0051] 5. Communication interface class Industrial bus gateway module: integrated CAN, RS-485, Modbus, etc. industrial interfaces.

[0052] High-speed interconnection module: provides Gigabit Ethernet, USB3.0, fiber, etc. high-speed interfaces.

[0053] Wireless communication module: integrates Wi-Fi, Bluetooth, LoRa, etc. wireless protocols.

[0054] 6. Discipline-specific classes Bioelectric acquisition module: high-impedance bioelectric amplifier, connected to ECG / EEG electrodes.

[0055] Environmental monitoring module: integrated temperature and humidity, light, CO2, etc. sensors.

[0056] Chemical analysis interface module: provides pH, conductivity, ion-selective electrode interface.

[0057] Machine vision light source module: programmable LED light source controller, supporting vision systems.

[0058] All the above modules have the following mandatory standards: Unified physical interface: standard size and 104-pin backplane connector.

[0059] Intelligent identity management: built-in unique ID chip (such as DS28E15) and auxiliary MCU.

[0060] Mechatronics design: blind insertion guidance, one-key locking, anti-misplug coding, and spectral temperature sensing status light.

[0061] This list is an example of core modules, and the system architecture supports extension based on the same specifications.

[0062] Mechatronics shell: the module shell is made of aluminum alloy material, integrating three major innovative mechanical structures: "One-key" mechanical locking, further applying additional axial compression force (≥50N) to the composite electrical connector, ensuring the absolute reliability of electrical connection.

[0063] Spectral temperature sensing status indication: design RGB LED light, whose color is dynamically controlled by the module management chip according to internal temperature sensor data (blue→green→yellow→red flashing), realizing intuitive visualization of working status.

[0064] Mechanical anti-misplug coding: the back of the shell is equipped with an 8-bit binary code switch, corresponding to the microswitch array next to the backplane slot. Only when the coding matches, the backplane MCU allows the module to be powered on.

[0065] Part II: Software architecture for realizing multidisciplinary deep integration For example Figure 5 The core goal of the software system of the present invention is to realize the declarative description and automated execution of interdisciplinary experimental logic.

[0066] Unified effect description language and graphical experiment designer: To shield the complexity of underlying hardware and disciplines, the invention defines a unified effect description language. Teachers or students can complete experiment design by dragging icons representing "physical quantities", "hardware resources", "disciplinary models" in a graphical experiment designer, and defining the causal relationship between them with a connection line. The graphical experiment designer automatically generates an EDL script in the background. For example, an EDL fragment describing "light intensity affects glucose synthesis rate" will be defined as follows: "the measured value of the biological module sensor channel A (physical quantity: light intensity, unit: lux)" is converted to "physical quantity: photon energy (unit: J / mol)" through "physical model: photon energy converter", and then is input to "chemical model: C3 plant photosynthesis kinetics simulator", and finally outputs "physical quantity: glucose synthesis rate (unit: mg / s)".

[0067] Real-time data flow execution engine: The EDL script is processed by the parsing and compiling engine, and is converted into a scheduling plan executable by the real-time data flow execution engine. The engine is the core of the entire software system, which includes the following core components: Physical quantity management registry center: maintains the standardized definition of all physical quantities involved in the experiment, units and their conversion relationships (such as the conversion between lux and μmol / m² / s).

[0068] Publish-subscribe message bus: This is a high-throughput, low-latency internal communication system. All data, whether raw sensor readings from hardware or intermediate results from model calculations, are packaged into time-stamped "physical quantity update" messages and published to specific topics. Disciplinary model plugins subscribe to the physical quantity topics they are interested in according to the EDL description.

[0069] Disciplinary model plugin framework: the computational models of physics, chemistry, biology, engineering, etc. are packaged into standard plugins, each providing initialization and execution interfaces, and declaring their input and output physical quantities through configuration files. Model plugins can be dynamically loaded on demand.

[0070] The technical solution of the invention builds a unified platform for deep hardware-software collaboration through "resource pooling" and "intelligent connection" at the hardware layer, and "declarative description" and "real-time data flow driving" at the software layer. It fundamentally changes the functional solidification mode of traditional experimental equipment, enabling cross-disciplinary hardware resources and computational models to be freely combined and automatically coordinated like Lego blocks, thereby enabling unprecedented comprehensive and innovative experimental teaching and scientific research.

[0071] Embodiment one: Photosynthesis multi-disciplinary exploration experiment; For example, Figure 5 andFigure 6 This experiment aims to explore the effects of environmental factors on plant photosynthesis, involving three disciplines: biological measurement, physical energy conversion, and chemical kinetics simulation.

[0072] Step 1: Hardware configuration and physical connection The teacher inserts three standardized hardware modules into any vacant slots of the all-in-one machine (e.g., slots 1, 2, 3).

[0073] Module A (biological sensing module): inserted into slot 1, with its front panel connected to a high-precision light intensity sensor and a patch temperature sensor for measuring light and leaf temperature, respectively.

[0074] Module B (general computing module): inserted into slot 2, this module will run the physical energy conversion model.

[0075] Module C (high-performance processor module): inserted into slot 3, this module will run the chemical kinetics simulation model.

[0076] The system automatically recognizes the newly inserted modules, and the backplane management MCU reads the module IDs. The core software platform automatically loads the corresponding drivers and registers the three modules in the resource pool.

[0077] Step 2: Software-defined experiment logic The teacher opens the graphical experiment designer. From the left resource pool, drag and drop three icons onto the design canvas, representing "light intensity / temperature sensor," "photon energy calculator," and "photosynthesis simulator." Connect these icons in order with connection lines to define the data flow.

[0078] Configure parameters for each icon: Sensor icon: bound to hardware "Module A," specify channel 1 as light intensity (unit: lux) and channel 2 as temperature (unit: °C), with a sampling rate of 10 Hz.

[0079] Physical model icon: select the "photon energy calculation" model, specify using hardware "Module B" to execute, and set the photosynthetically active radiation center wavelength to 680 nm.

[0080] Chemical model icon: select the "C3 plant photosynthesis kinetics" model, specify using hardware "Module C" to execute, and set the initial CO2 concentration to 400 ppm.

[0081] The designer generates a structured EDL script file in the background based on the above graphical operations.

[0082] Step 3: Experiment execution and real-time collaboration The student clicks the "Start" button, and the system enters automatic operation: Data acquisition cycle starts: Real-time data flow engine sends acquisition command to module A through hardware abstraction layer every 100 ms. Module A's ADC converts sensor analog signal to digital value and uploads through PCIe channel.

[0083] Data publishing: Data adapter receives raw code value, converts it to light intensity = 15000 lux and temperature = 25.0 °C using module A's pre-stored calibration coefficients, and immediately publishes it as a message to bus's " / sensors / light" and " / sensors / temp" topics with accurate time stamp.

[0084] Physical model triggers calculation: "Photon energy calculation" model plugin (running on module B) subscribed to " / sensors / light" topic is woken up by new message. Plugin gets light intensity value, executes internal code: first calls unit conversion function to convert lux to photon flux in μmol / m² / s, then calculates photon energy according to formula E = (hc / λ)•Φ. After calculation, it publishes result photon energy = 85 J / mol as a new message to " / physics / photon_energy" topic.

[0085] Chemical model triggers simulation: "Photosynthesis simulation" model plugin (running on module C) subscribed to " / physics / photon_energy" and " / sensors / temp" topics is triggered. It gets photon energy and temperature data, substitutes them into its built-in enzyme kinetics differential equation set for numerical solution. Solution result glucose synthesis rate = 0.152 mg / s is published to " / chemistry / glucose_rate" topic.

[0086] Real-time visualization and logging: Dashboard component subscribes to all above-mentioned key physical quantity topics to refresh four real-time graphs on screen at 10 times per second. Meanwhile, all data is written to database.

[0087] Step 4: Student interaction and exploration.

[0088] As Figure 7 , student observes real-time graphs and proposes hypothesis: "Increasing environmental temperature will first promote then inhibit photosynthesis rate". He (student) directly changes temperature input of chemical model from "real-time sensor reading" to "manual setting" in software interface's "parameter adjustment area" and inputs a gradually increasing temperature sequence. System will immediately re-simulate glucose synthesis rate based on new temperature parameters, student can observe curve changes in real time, quickly verify hypothesis, complete a complete scientific exploration cycle.

[0089] Example 2: Intelligent Robot Vision Servo Control Comprehensive Experiment This experiment demonstrates the application of the system in the intersection of engineering and information science, involving machine vision, real-time computing, and motion control.

[0090] Step 1: Hardware Configuration 1) Insert the machine vision module (with high-definition camera, slot 1).

[0091] 2) Insert the FPGA accelerated computing module (slot 2) for running image processing algorithms.

[0092] 3) Insert the multi-axis servo drive module (slot 3) for driving robot joints.

[0093] 4) Insert the high-precision data acquisition module (slot 4) for reading motor encoder feedback.

[0094] Step 2: Software Logic Construction The teacher constructs a control logic containing a feedback loop in the experiment designer: Define physical quantities: image frames, target object pixel coordinates (X, Y), target object world coordinates (X, Y, Z), joint control instructions, encoder feedback values.

[0095] Drag and connect function blocks: Vision acquisition block: obtain image frames from module A.

[0096] Target recognition block: run neural networks on FPGA in module B to extract target object pixel coordinates from image frames.

[0097] Coordinate transformation block: convert pixel coordinates to world coordinates on CPU in module B according to camera calibration parameters.

[0098] PID control block: calculate the deviation between world coordinates and desired position to generate joint control instructions.

[0099] Drive and feedback block: send control instructions to module C to drive motors; at the same time, read encoder feedback values from module D and send them back to the PID control block to form a closed loop.

[0100] Step 3: System Automatic Cooperative Operation After the experiment starts, the system automatically manages the entire pipeline: the camera collects images at 30fps, each frame of image is transmitted to the FPGA module at high speed through the PCIe channel for accelerated processing, the processing result triggers the coordinate transformation and control algorithm calculation on the CPU, the calculation result is sent to the driving module for execution in real time, and the feedback data is synchronously collected for closed-loop correction. All steps are completed under strict real-time scheduling, the delay is controllable, the deep cooperation across four hardware modules is realized, and a typical interdisciplinary (computer vision, automatic control, robotics) comprehensive experiment is completed.

[0101] Conclusion: The present application realizes the "one machine for multiple use" of the equipment, and the "one key fusion" of the experimental logic, and provides a powerful basic tool for cultivating interdisciplinary innovative talents.

[0102] The present application realizes the "one machine for multiple use" of the equipment, and the "one key fusion" of the experimental logic, and provides a powerful basic tool for cultivating interdisciplinary innovative talents.

[0103] It should be noted that the term "comprising" or any other variant is intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles or devices. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0104] Although embodiments of the present application have been shown and described, it will be understood by those having ordinary skill in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the present application, the scope of which is defined by the following claims and their equivalents.

Claims

1. An intelligent all-in-one educational device integrating a multidisciplinary simulation experiment system, characterized in that, include: The system includes a core processing system, an intelligent backplane bus system, at least one standardized hardware resource module, an integrated chassis, and a multidisciplinary experimental management software platform running on the core processing system. The intelligent backplane bus system is fixedly installed on the frame inside the integrated chassis and is connected to the core processing system via a high-speed system bus. The at least one standardized hardware resource module can be plugged into a standardized module slot provided by the intelligent backplane bus system. The multidisciplinary experimental management software platform is configured as follows: The system identifies the inserted standardized hardware resource modules and provides a graphical interface for users to define cross-disciplinary simulation experiment logic. The experiment logic realizes the automatic acquisition, transformation, calculation and collaboration of multi-disciplinary data by calling different hardware resource modules and built-in subject models.

2. The educational intelligent all-in-one machine device integrating a multi-disciplinary simulation experiment system according to claim 1, characterized in that, The core processing system includes an embedded industrial motherboard, which integrates a central processing unit, memory and storage, onboard management and communication modules and motherboard expansion interfaces. The embedded industrial motherboard is electrically connected to the intelligent backplane bus system through a PCIe data channel. The core processing system is also connected to a touch display screen integrated on the front panel of the integrated chassis and an external expansion interface group located on the rear panel of the chassis. The onboard management and communication module further includes: Two gigabit Ethernet controllers, one of which is used to access an external local area network or the Internet to connect the teacher's computer, cloud platform and student terminal, and the other gigabit Ethernet controller is dedicated to connecting the intelligent backplane bus system to form an independent device management network. A wireless communication module is used to provide Wi-Fi and Bluetooth connectivity; Security chips are used for secure system startup and data encryption; The motherboard expansion interface further includes: The slot, serving as the high-speed system bus, is directly connected to the intelligent backplane bus system via the PCIe data channel, forming a core data path. Multiple USB ports and video output ports are located on the rear panel of the integrated chassis, forming an external expansion interface group for connecting peripherals, storage devices and auxiliary displays. An internal display interface is connected to the touch screen integrated on the front panel of the integrated chassis via an internal cable.

3. The educational intelligent all-in-one machine device integrating a multi-disciplinary simulation experiment system according to claim 1, characterized in that, The intelligent backplane bus system includes a multi-layer printed circuit board, on which N module slots with identical physical specifications are provided, and each module slot corresponds to a composite electrical connector female head. The intelligent backplane bus system is further divided into three functional sub-layers, including: The power distribution sublayer connects to the integrated switching power supply within the chassis and provides each module slot with an independently controllable multi-channel DC power supply. The high-speed data exchange sublayer integrates a PCIe switching chip, providing an independent PCIe data link for each module slot and connecting to the core processing system through the PCIe data channel. The management and control sublayer integrates a backplane management microcontroller, which connects to the management interface of each module slot via an I2C bus, and is also connected to a temperature sensor array and a fan PWM control circuit.

4. The educational intelligent all-in-one machine device integrating a multi-disciplinary simulation experiment system according to claim 3, characterized in that, In the power distribution sublayer, the intelligent power switch chip configured for each module slot is controlled via the I2C bus of the management and control sublayer, enabling independent switching, soft start, and overcurrent, overvoltage, and short-circuit protection and monitoring of the power supply for each slot.

5. The educational intelligent all-in-one machine device integrating a multidisciplinary simulation experiment system according to claim 4, characterized in that, The standardized hardware resource module includes a module shell, a front panel subject-specific interface located at the front of the shell, a core functional circuit board, a module intelligent management unit, and a composite electrical connector male head located at the back of the shell. The core functional circuit board implements the specific hardware functions of the module and is connected to the front panel subject-specific interface and the composite electrical connector male head through internal wiring. The module intelligent management unit includes a non-volatile memory that stores module identity and parameters, and communicates with the management and control sublayer of the intelligent backplane bus system through designated pins of the male connector of the composite electrical connector.

6. The educational intelligent all-in-one machine device integrating a multi-disciplinary simulation experiment system according to claim 5, characterized in that, The module housing integrates an electromechanical connection mechanism, which includes a guide structure for guiding alignment and a mechanical locking mechanism linked to the guide structure. This mechanism is used to press the male head of the composite electrical connector onto the female head of the composite electrical connector. It also includes a mechanical encoder located on the back of the module housing, and a spectral temperature-sensitive RGB LED controlled by the module's intelligent management unit.

7. The educational intelligent all-in-one machine device integrating a multidisciplinary simulation experiment system according to claim 6, characterized in that, The management and control sublayer of the intelligent backplane bus system is connected to a sensor array that works with the mechanical encoder to achieve physical anti-misinsertion identification of the module. The color of the spectral temperature-sensing RGB LED changes dynamically according to the internal temperature monitored by the module's intelligent management unit.

8. The educational intelligent all-in-one machine device integrating a multi-disciplinary simulation experiment system according to claim 1, characterized in that, The multidisciplinary experimental management software platform includes: A graphical experiment designer for generating unified effect description language scripts that describe interdisciplinary data flows and causal relationships by dragging and dropping components and connecting lines; A parsing and verification engine is used to parse and execute the script, the parsing and verification engine comprising: The physical quantity manager maintains the standardized definitions and unit conversion relationships of physical quantities. The publish-subscribe message bus serves as the central hub for data exchange between various components within the system. The hardware abstraction layer encapsulates the operations of the standardized hardware resource modules into a unified application programming interface; A subject-specific model plugin library for dynamically loading and executing computational models in the fields of physics, chemistry, and biology; The hardware abstraction layer converts the data collected by the hardware into standard physical quantities and publishes them to the publish-subscribe message bus. Subject model plugins that subscribe to the relevant physical quantities are triggered to perform calculations, and the calculation results are published again as new physical quantities, thereby realizing the automatic flow and fusion of cross-disciplinary data.

9. An educational intelligent all-in-one machine device integrating a multidisciplinary simulation experiment system according to any one of claims 1-8, characterized in that, The integrated chassis is equipped with multiple heat dissipation air ducts that can be independently speed-adjusted based on the temperature data of the management and control sub-layer, forming a layered intelligent heat dissipation system.

10. A method for realizing multidisciplinary simulation experiments based on the device described in claim 1, characterized in that, Includes the following steps: S1: The user defines the simulation experiment logic involving at least two different disciplines through the graphical experiment designer and generates an experiment description script; S2: The system automatically identifies and configures the required standardized hardware resource modules according to the script, and initializes the hardware parameters through the hardware abstraction layer; S3: During the experiment, the engine starts and a data flow pipeline based on the publish-subscribe message bus is established. S4: During the experiment, the hardware abstraction layer drives the specified hardware resource modules to collect data according to a set cycle, and publishes the standardized data to the publish-subscribe message bus. The subject model plugin library that subscribes to the data is automatically triggered to perform calculations and publish the results as new data. This process is passed in a chain until the complete interdisciplinary effect chain defined by the script is completed. The visualization component subscribes to the final data to achieve real-time chart updates. S5: Experimental data is recorded and stored synchronously, and analysis reports can be generated.

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