Heating film, light-emitting device and motor vehicle
By designing a heating film with a transparent insulating base layer and a low-resistance busbar section, the problems of low heating efficiency and high cost of vehicle lights were solved, achieving efficient de-icing without affecting the functions of vehicle lights and radar, and reducing energy consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2026-04-10
AI Technical Summary
Existing headlight heating structures have low heating efficiency, affecting the normal function of headlights and are costly. They also cannot effectively remove ice coverings, affecting driving safety.
Design a heating film including a base layer and a heating circuit layer. The resistance of the bus section is lower than that of the heating wire section. The bus section receives external power signals and transmits them to the heating wire section to achieve efficient heating. The base layer is made of transparent insulating material to ensure that it does not affect the vehicle headlight function, and the heating circuit layer is compatible with radar signals.
It achieves efficient de-icing, reduces energy consumption, maintains the normal function of vehicle lights and radar detection devices, and reduces manufacturing costs.
Smart Images
Figure CN121842875A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of lighting technology, and more specifically, to a heating film, a light-emitting device, and a motor vehicle. Background Technology
[0002] In the field of lighting technology, various lighting or signaling devices are known for providing light for illumination or signal indication. For example, vehicle lights are used in motor vehicles to provide lighting or signaling functions to ensure safe driving or to provide decorative functions.
[0003] However, in cold weather, when the headlight surface is covered with ice, the headlights cannot function effectively. The applicant has known that headlights can be equipped with heating functions to remove ice from the headlight surface and ensure driving safety. However, existing heating structures are not very efficient, often affecting the normal function of the headlights, and are also costly to manufacture.
[0004] Therefore, how to develop a heating film that can be used for efficient heating and de-icing without affecting the normal function of vehicle lights, while also taking into account the advantage of low cost, is a technical problem that urgently needs to be solved. Summary of the Invention
[0005] One objective of this application is to overcome at least one of the problems and defects existing in the prior art.
[0006] A first aspect of this application provides a heating film comprising:
[0007] The base layer includes a first side and a second side disposed opposite to each other; and
[0008] A heating circuit layer is disposed on the second side of the base layer, wherein the heating circuit layer includes an electrically connected bus section and a heating wire section, and the resistance of the bus section is less than 1 / 2 of the resistance of the heating wire section.
[0009] In some embodiments, the bus section is configured to receive an external power signal, and the heating wire section is configured to generate heat according to the external power signal received by the bus section;
[0010] The power consumed by the busbar section is less than 1 / 2 of the power consumed by the heating wire section.
[0011] In some embodiments, the resistance of the busbar portion is less than 1 / 3 of the resistance of the heating wire portion, or the resistance of the busbar portion is less than 1 / 10 of the resistance of the heating wire portion.
[0012] In some embodiments, the base layer is made of a colorless and transparent insulating material, the material of which includes at least one of polycarbonate and polyethylene terephthalate;
[0013] The heating circuit layer is transparent and radar compatible.
[0014] In some embodiments, the heating circuit layer includes a first circuit layer and a second circuit layer.
[0015] The first circuit layer is disposed on the second side of the base layer, and the first circuit layer includes an electrically connected busbar and a heating wire;
[0016] The second circuit layer is disposed on the side of the busbar of the first circuit layer away from the base layer, and the second circuit layer includes only the busbar;
[0017] The busbar of the second circuit layer and the busbar of the first circuit layer are directly electrically connected to form the busbar section, and the heating wire of the first circuit layer forms the heating wire section.
[0018] In some embodiments, the first circuit layer is a conductive metal layer or other conductive layer, and the first circuit layer is formed on the second side of the substrate by a physical vapor deposition process;
[0019] The second circuit layer is a silver paste layer, which is formed on the side of the busbar of the first circuit layer away from the base layer by screen printing.
[0020] In some embodiments, the heating circuit layer includes a first circuit layer, a second circuit layer, and a conductive adhesive layer.
[0021] The first circuit layer is disposed on the second side of the base layer, and the first circuit layer includes an electrically connected busbar and a heating wire;
[0022] The second circuit layer is disposed on the side of the busbar of the first circuit layer away from the base layer, and the second circuit layer includes only the busbar;
[0023] The adhesive layer is disposed between the first circuit layer and the second circuit layer. The adhesive layer includes only busbars and is configured to electrically connect and bond the busbars of the second circuit layer and the busbars of the first circuit layer together.
[0024] The busbar of the first circuit layer, the busbar of the second circuit layer, and the busbar of the adhesive layer are electrically connected to form the busbar portion, and the heating wire of the first circuit layer forms the heating wire portion.
[0025] In some embodiments, the first circuit layer is a conductive metal layer or other conductive layer, and the first circuit layer is formed on the second side of the substrate by a physical vapor deposition process;
[0026] The adhesive layer is an ACP film;
[0027] The second circuit layer is a metal foil layer, and the second circuit layer is bonded to the side of the busbar of the first circuit layer away from the base layer by the adhesive layer.
[0028] In some embodiments, the thickness of the first circuit layer is less than 1 μm;
[0029] The thickness of the adhesive layer is less than 50 μm;
[0030] The metal foil layer includes copper foil, and the thickness of the metal foil layer is less than 150 μm, or the thickness of the metal foil layer is between 12 μm and 70 μm.
[0031] In some embodiments, the heating circuit layer includes a first circuit layer and an insulating adhesive layer, wherein the first circuit layer is a metal foil layer, and the metal foil layer is bonded to the second side of the base layer through the adhesive layer;
[0032] The metal foil layer includes a busbar and a heating wire, wherein the busbar of the metal foil layer forms the busbar portion and the heating wire of the metal foil layer forms the heating wire portion.
[0033] In some embodiments, the metal foil layer comprises copper foil, and the thickness of the metal foil layer is less than 150 μm, or between 12-70 μm;
[0034] The thickness of the adhesive layer is less than 30 μm, or between 15 and 30 μm.
[0035] A second aspect of this application provides a light-emitting device comprising a heating film as provided in the first aspect and the embodiments described above.
[0036] In some embodiments, the light-emitting device further includes: a front lens, a rear lens, an inner lens, and a light source assembly;
[0037] The heating film is disposed between the front lens and the rear lens, and the heating film is configured to generate heat when energized to heat the front lens;
[0038] The light source assembly is used to emit light, the inner lens is configured to guide the light to the front lens, and the front lens is configured to emit the light toward the front side of the front lens.
[0039] A third aspect of this application provides a motor vehicle that includes a light-emitting device as provided in the second aspect and the embodiments described above.
[0040] In some embodiments, the motor vehicle further includes:
[0041] A radar detection device, wherein the radar detection device is disposed behind the light-emitting device, and transmits and receives radar signals through the light-emitting device; and
[0042] A camera device is disposed behind the light-emitting device and captures video or images through the light-emitting device. Attached Figure Description
[0043] Figure 1a A front view of the heating film provided in the first embodiment of this application is shown;
[0044] Figure 1b It shows Figure 1a An exploded view of the heating film shown;
[0045] Figure 2 An exploded view of the heating film provided in the second embodiment of this application is shown;
[0046] Figure 3 An exploded view of the heating film provided in the third embodiment of this application is shown;
[0047] Figure 4a A front perspective view of the light-emitting device provided in an embodiment of this application is shown;
[0048] Figure 4b It shows Figure 4a Rear-view perspective view of the light-emitting device shown;
[0049] Figure 4c It shows Figure 4a The diagram shows a cross-sectional view of the light-emitting device (AA section).
[0050] Figure 4d It shows Figure 4a An exploded view of the light-emitting device shown. Detailed Implementation
[0051] The embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be understood that the embodiments of this application are primarily intended to illustrate possible implementations of the technical solutions of this application and should not be construed as limiting the technical solutions of this application. In this specification, identical or similar components are indicated by identical or similar reference numerals.
[0052] Figure 1a A front view of the heating film 100 provided in the first embodiment of this application is shown; Figure 1b It shows Figure 1a An exploded view of the heating film 100 shown.
[0053] like Figures 1a-1bAs shown, the first embodiment of this application provides a heating film 100, which can be integrated into a light-emitting device. The light-emitting device can be used as a vehicle lamp. The heating film 100 can heat the light-emitting device when energized, thus de-icing the light-emitting device. The heating film 100 includes a base layer 10 and a heating circuit layer 20, with the heating circuit layer 20 disposed on the base layer 10. The base layer 10 serves to support the heating circuit layer 20 and also facilitates the shaping of the heating film 100 according to requirements. Specifically, the base layer 10 includes a first side 11 and a second side 12 disposed opposite to each other, with the first side 11 facing outward and the second side 12 facing inward. The heating circuit layer 20 is disposed on the second side 12 of the base layer 10. The heating circuit layer 20 includes an electrically connected busbar portion 20a and a heating wire portion 20b. The resistance of the busbar portion 20a is much smaller than the resistance of the heating wire portion; for example, the resistance of the busbar portion 20a is less than half the resistance of the heating wire portion 20b. Even more preferably, the resistance of the busbar section 20a is less than 1 / 3 of the resistance of the heating wire section 20b, or the resistance of the busbar section 20a is less than 1 / 10 of the resistance of the heating wire section 20b. It is worth noting that the resistance of the heating wire section 20b here refers to the overall resistance of the heating wire section 20b. In some embodiments, the heating wire section 20b may include many heating wires, up to dozens or even more than 100, which can be connected in parallel. The overall resistance of the connected heating wire section 20b satisfies the above-mentioned relationship.
[0054] In this first embodiment, the bus section 20a is configured to receive an external power signal, such as a voltage signal or a current signal, and the heating wire section 20b is configured to emit heat according to the external power signal received by the bus section 20a to achieve the de-icing function. By setting the resistance of the bus section 20a to be much smaller than the resistance of the heating wire 20b, the power consumed by the bus section 20a is much smaller than the power consumed by the heating wire 20b. For example, the power consumed by the bus section 20a is less than half the power consumed by the heating wire 20b, thereby reducing the energy consumed by the bus section 20a and improving the heating efficiency of the heating wire section 20b.
[0055] In this first embodiment, the base layer 10 may be made of a colorless, transparent, and insulating material, thereby ensuring that the base layer 10 does not affect the normal light-emitting function of the light-emitting device. The material of the base layer 10 may include at least one of polycarbonate (PC) and polyethylene terephthalate (PET), which have high light transmittance, thereby ensuring the optical performance of the light-emitting device. Moreover, the heating circuit layer 20 also appears transparent, thereby preventing the heating circuit layer 20 from affecting the normal function of the light-emitting device.
[0056] Currently, an increasing number of motor vehicles are incorporating cameras and radar detection devices (such as millimeter-wave radar or lidar) into Advanced Driver Assistance Systems (ADAS). One feasible solution is to integrate the cameras and radar detection devices into the headlights. However, in cold weather, when the headlight surface is covered with ice, the functionality of the cameras and radar detection devices will be interfered with. In this case, it is necessary to install heaters for the cameras and radar detection devices to remove ice. The heaters known to the applicant mostly use wire heating for de-icing, but these heaters often affect the headlight design and may even affect the normal operation of the cameras and radar detection devices.
[0057] The heating film 100 of this first embodiment is entirely transparent, so it does not affect the camera's shooting function. Furthermore, the heating circuit layer 20 can be made radar-compatible to prevent the heating wires therein from interfering with radar signals. Specifically, the heating wire portion 20b is generally mesh-like, and the heating wire portion 20a can face both the radar window and the camera window. The transparent heating wire portion 20a ensures the camera's normal shooting function, while the radar-compatible heating wire portion 20a ensures the radar detection device's normal signal transmission and reception function.
[0058] The specific structure of the heating circuit layer 20 is described in detail below.
[0059] like Figure 1b As shown, the heating circuit layer 20 includes a first circuit layer 21 and a second circuit layer 22. The first circuit layer 21 is disposed on the second side 12 of the base layer 10, and includes an electrically connected busbar 21a and a heating wire 21b. The second circuit layer 22 is disposed on the side of the busbar 21a of the first circuit layer 21 facing away from the base layer 10, and the second circuit layer 22 includes only the busbar 22a. The busbar 22a of the second circuit layer 22 and the busbar 21a of the first circuit layer 21 are directly electrically connected to form the busbar portion 20a of the heating circuit layer 20, and the heating wire 21b of the first circuit layer 21 forms the heating wire portion 20b of the heating circuit layer 20.
[0060] The first circuit layer 21 is a conductive metal layer or other conductive layer, formed on the second side 12 of the base layer 10 using a physical vapor deposition (PVD) process. The second circuit layer 22 is also a silver paste layer, formed on the side of the busbar 21a of the first circuit layer 21 away from the base layer 10 using a screen printing process. Generally, the resistance values of the busbar 21a and the heating wire 21b formed by the PVD process are similar, therefore the busbar 21a consumes more power. By screen printing the second circuit layer 22, the resistance of the busbar portion 20a is reduced, thereby improving the heating efficiency of the heating wire portion 20b.
[0061] Figure 2 An exploded view of the heating film 100 provided in the second embodiment of this application is shown. Figure 2 As shown, the second embodiment of this application provides another heating film 100. This heating film 100 also includes a base layer 10 and a heating circuit layer 20. The features of the base layer 10 are the same as those in the first embodiment and will not be repeated here. The heating circuit layer 20, which differs from the first embodiment, will be described in detail below.
[0062] In this second embodiment, the heating circuit layer 20 includes a first circuit layer 21, a second circuit layer 22, and a conductive adhesive layer 23. The first circuit layer 21 is identical to the first circuit layer 21 in the first embodiment, both being disposed on the second side 12 of the base layer 10. The first circuit layer 21 includes an electrically connected busbar 21a and a heating wire 21b. The second circuit layer 22 is disposed on the side of the first circuit layer 21 facing away from the base layer 10, and the second circuit layer 22 includes only the busbar 22a. The adhesive layer 23 is disposed between the first circuit layer 21 and the second circuit layer 22, i.e., the first circuit layer 21, the adhesive layer 23, and the second circuit layer 22 are stacked sequentially. The adhesive layer 23 includes only the busbar 23a and is configured to electrically connect and bond the busbar 22a of the second circuit layer 22 and the busbar 21a of the first circuit layer 21 together. The busbar 21a of the first circuit layer 21, the busbar 22a of the second circuit layer 22, and the busbar 23a of the adhesive layer 23 are electrically connected to form a busbar section 20a, and the heating wire 21b of the first circuit layer 21 forms a heating wire section 20b.
[0063] Similar to the first embodiment, in the second embodiment, the first circuit layer 21 is a conductive metal layer or other conductive layer, formed on the second side 12 of the substrate 10 by physical vapor deposition. The thickness of the first circuit layer is very small, for example, less than 1 μm. The adhesive layer 23 is an ACP (Anisotropic Conductive Paste) film, and its thickness can be less than 50 μm. The second circuit layer 22 is a metal foil layer, bonded to the side of the busbar 21a of the first circuit layer 21 away from the substrate 10 by the adhesive layer 23. The metal foil layer can be a pre-prepared separate thin-layer structure, such as copper foil, with a thickness of less than 150 μm, and preferably between 12 μm and 70 μm.
[0064] In this second embodiment, the metal foil layer 22 is a pre-prepared, separate thin-layer structure, which is then bonded to the first circuit layer 21 via a conductive adhesive layer 23. Compared to forming the busbar 22a using a physical vapor deposition process, the busbar 22a in this embodiment is a pre-prepared, separate metal foil layer, which significantly improves the production efficiency of the heating film 100. Compared to thickening the busbar portion 20a with silver paste, the metal foil layer 22 in this embodiment is relatively inexpensive and also avoids the silver paste corroding the heating wire 21b.
[0065] Figure 3 An exploded view of the heating film 100 provided in the third embodiment of this application is shown. Figure 3 As shown, the third embodiment of this application provides another heating film 100. This heating film 100 also includes a base layer 10 and a heating circuit layer 20. The features of the base layer 10 are the same as those in the first embodiment and will not be repeated here. The heating circuit layer 20, which differs from the first embodiment, will be described in detail below.
[0066] In this second embodiment, the heating circuit layer 20 includes a first circuit layer 21 and an insulating adhesive layer 24. The first circuit layer 21 is a metal foil layer, which is bonded to the second side surface 12 of the base layer 10 via the adhesive layer 24. The metal foil layer includes a busbar 21a and a heating wire 21b. The busbar 21a of the metal foil layer forms the busbar portion 20a of the heating circuit layer 20, and the heating wire 21b of the metal foil layer forms the heating wire portion 20b of the heating circuit layer 20.
[0067] In the heating film 100 of this third embodiment, the metal foil layer 21 is a pre-prepared, separate thin-layer structure, which is then bonded to the base layer 10 via the adhesive layer 24. The metal foil layer 21 generates heat when energized to heat the light-emitting device. Compared to forming the busbar portion 20a and the heating wire portion 20b using a physical vapor deposition process, this embodiment significantly improves the production efficiency of the heating film 100. Compared to thickening the busbar portion 20a with silver paste, the metal foil layer 21 in this embodiment is relatively inexpensive and also avoids the silver paste corroding the heating wire.
[0068] In this embodiment, the metal foil layer can be copper foil, and the thickness of the metal foil layer 21 is very small, for example, less than 150 μm, preferably between 12-70 μm. The adhesive layer 22 can be a non-conductive adhesive layer, for example, using common glue or adhesive as the adhesive layer 22. The thickness of the adhesive layer 24 is less than 30 μm, preferably between 15-30 μm. The metal foil layer 21 is directly bonded to the second side 12 of the base layer 10 via the adhesive layer 24 through a lamination process.
[0069] In some embodiments, such as Figure 1b , 2As shown in Figure 3, the heating film 100 also includes a marking layer 30, which can be formed by printing or spraying, for example, by spraying a layer of translucent or semi-translucent white paint or ink and a layer of opaque black paint or ink. A marking structure 35 is provided on the marking layer 30, which can be the white paint portion not covered by the black paint. The marking layer 30 can be located on the first side 11 of the base layer 10. The marking structure 35 of the marking layer 30 is transparent, while the other parts of the marking layer 30 are opaque. When light shines on the heating film 100, the light can illuminate the marking structure 35. Furthermore, to achieve a better light-shielding effect, a protective layer 40 can be provided on the side of the heating circuit layer 20 facing away from the base layer 10. The protective layer 40 can also be a white paint layer in the middle and a black paint layer on the outer periphery, which protects the heating circuit layer 20.
[0070] Figure 4a A front perspective view of the light-emitting device 200 provided in an embodiment of this application is shown; Figure 4b It shows Figure 4a Rear perspective view of the light-emitting device 200 shown; Figure 4c It shows Figure 4a A cross-sectional view of the light-emitting device 200 shown in Figure AA; Figure 4d It shows Figure 4a An exploded view of the light-emitting device 200 shown.
[0071] like Figures 4a-4d As shown, embodiments of this application also provide a light-emitting device 200, which emits light along the main light-emitting direction D. This light-emitting device 200 can be used as a vehicle lamp, such as a logo light, headlight, and taillight. The light-emitting device 200 may include the heating film 100 described in any of the above embodiments.
[0072] Furthermore, the light-emitting device 200 may also include a front lens 210, a rear lens 220, an inner lens 230, and a light source assembly 240. Along the main light emission direction D, the front lens 210 is disposed on the outermost side, and a heating film 100 is disposed between the front lens 210 and the rear lens 220. The heating film 100 is configured to generate heat when energized to heat the front lens 210, thereby melting any ice formed on the outer side of the front lens 210. The light source assembly 240 is used to emit light. The inner lens 230 is disposed on the outer periphery of the rear lens 220. The inner lens 230 is configured to guide the light emitted from the light source assembly 240 to the rear lens 220, and then into the front lens 210. The front lens 210 is configured to direct the light outwards.
[0073] Furthermore, the light source assembly 240 includes a circuit board 241 and a plurality of light-emitting diodes 242 arranged around the circuit board. The circuit board 241 has a spatial opening 241a, which avoids the radar detection device 300 and the camera 400, facilitating the implementation of radar and camera functions. The light source assembly 240 is mounted within the housing 260 via a shape-matched heat sink 250. A camera window 221 is provided on the rear lens 220. To prevent light leakage from the camera window 221, a light-shielding ring 270 can be provided inside the camera window 221. The components in the light-emitting device 200 are connected to each other via screws 280.
[0074] Embodiments of this application also provide a motor vehicle that may include the light-emitting device 200 described according to any of the above embodiments. Furthermore, as... Figures 4a-4d As shown, the vehicle also includes a radar detection device 300 and a camera device 400. The radar detection device 300 can be mounted on the rear side of the light-emitting device 100 via a radar mounting bracket 310, and transmits and receives radar signals through the light-emitting device 100. The camera device 400 can be mounted on the rear side of the light-emitting device 100 via a camera mounting bracket 410, and captures video or images through the light-emitting device 200.
[0075] Although this application has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of this application and should not be construed as limiting this application. The dimensions and proportions in the drawings are merely illustrative and should not be construed as limiting this application.
[0076] While some embodiments of the general concept of this application have been shown and described, those skilled in the art will understand that this application may include many other equivalent embodiments without departing from the general inventive concept of this application, and the scope of protection of this application is defined by the claims.
Claims
1. A heating film (100), characterized in that, include: The base layer (10) includes a first side (11) and a second side (12) disposed opposite to each other; as well as A heating circuit layer (20) is disposed on the second side of the base layer, wherein the heating circuit layer includes an electrically connected bus section (20a) and a heating wire section (20b), and the resistance of the bus section is less than 1 / 2 of the resistance of the heating wire section.
2. The heating film according to claim 1, wherein, The bus section is configured to receive an external power signal, and the heating wire section is configured to generate heat according to the external power signal received by the bus section; The power consumed by the busbar section is less than 1 / 2 of the power consumed by the heating wire section.
3. The heating film according to claim 1, wherein, The resistance of the busbar section is less than 1 / 3 of the resistance of the heating wire section, or the resistance of the busbar section is less than 1 / 10 of the resistance of the heating wire section.
4. The heating film according to claim 1, wherein, The base layer is made of a colorless and transparent insulating material, and the material of the base layer includes at least one of polycarbonate and polyethylene terephthalate; The heating circuit layer is transparent and radar compatible.
5. The heating film according to claim 1, wherein, The heating circuit layer includes a first circuit layer (21) and a second circuit layer (22). The first circuit layer (21) is disposed on the second side of the base layer, and the first circuit layer includes an electrically connected bus (21a) and a heating wire (21b); The second circuit layer (22) is disposed on the side of the busbar of the first circuit layer away from the base layer, and the second circuit layer includes only the busbar (22a); The busbar (22a) of the second circuit layer and the busbar (21a) of the first circuit layer are directly electrically connected to form the busbar section (20a), and the heating wire (21b) of the first circuit layer forms the heating wire section (20b).
6. The heating film according to claim 5, wherein, The first circuit layer is a conductive metal layer or other conductive layer, and the first circuit layer is formed on the second side of the substrate by a physical vapor deposition process; The second circuit layer is a silver paste layer, which is formed on the side of the busbar of the first circuit layer away from the base layer by screen printing.
7. The heating film according to claim 1, wherein, The heating circuit layer includes a first circuit layer (21), a second circuit layer (22), and a conductive adhesive layer (23). The first circuit layer (21) is disposed on the second side of the base layer, and the first circuit layer includes an electrically connected bus (21a) and a heating wire (21b); The second circuit layer (22) is disposed on the side of the busbar of the first circuit layer away from the base layer, and the second circuit layer includes only the busbar (22a); The adhesive layer (23) is disposed between the first circuit layer and the second circuit layer. The adhesive layer (23) includes only a busbar (23a). The adhesive layer is configured to electrically connect and bond the busbar (22a) of the second circuit layer and the busbar (21a) of the first circuit layer together. The busbar (21a) of the first circuit layer, the busbar (22a) of the second circuit layer and the busbar (23a) of the adhesive layer are electrically connected to form the busbar portion (20a), and the heating wire (21b) of the first circuit layer forms the heating wire portion (20b).
8. The heating film according to claim 7, wherein, The first circuit layer is a conductive metal layer or other conductive layer, and the first circuit layer is formed on the second side of the substrate by a physical vapor deposition process; The adhesive layer (23) is an ACP film; The second circuit layer is a metal foil layer, and the second circuit layer is bonded to the side of the busbar of the first circuit layer away from the base layer by the adhesive layer.
9. The heating film according to claim 8, wherein, The thickness of the first circuit layer is less than 1 μm; The thickness of the adhesive layer is less than 50 μm; The metal foil layer includes copper foil, and the thickness of the metal foil layer is less than 150 μm, or the thickness of the metal foil layer is between 12 μm and 70 μm.
10. The heating film according to claim 1, wherein, The heating circuit layer includes a first circuit layer (21) and an insulating adhesive layer (24). The first circuit layer is a metal foil layer, and the metal foil layer is bonded to the second side of the base layer through the adhesive layer. The metal foil layer includes a busbar (21a) and a heating wire (21b), wherein the busbar of the metal foil layer forms the busbar portion and the heating wire of the metal foil layer forms the heating wire portion.
11. The heating film according to claim 10, wherein, The metal foil layer includes copper foil, and the thickness of the metal foil layer is less than 150 μm, or between 12-70 μm; The thickness of the adhesive layer is less than 30 μm, or between 15 and 30 μm.
12. A light-emitting device (200), characterized in that, The light-emitting device includes a heating film according to any one of claims 1-11.
13. The light-emitting device according to claim 12, wherein, The light-emitting device further includes: a front lens (210), a rear lens (220), an inner lens (230), and a light source assembly (240); The heating film (100) is disposed between the front lens and the rear lens, and the heating film is configured to generate heat when energized to heat the front lens; The light source assembly is used to emit light, the inner lens is configured to guide the light to the front lens, and the front lens is configured to emit the light toward the front side of the front lens.
14. A motor vehicle, characterized in that, The motor vehicle includes a light-emitting device (200) according to any one of claims 12-13.
15. The motor vehicle according to claim 14, wherein, The motor vehicle also includes: A radar detection device (300), wherein the radar detection device is disposed behind the light-emitting device and transmits and receives radar signals through the light-emitting device; and A camera device (400) is disposed on the rear side of the light-emitting device and captures video or images through the light-emitting device.