Circuit board with embedded chip and processing method

Abstract

The invention discloses a circuit board with a built-in chip and a processing method. The circuit board comprises a core board and a layer board. The core board comprises a core board body, a heat conduction block and a packaging chip, the core board body is provided with an installation through hole penetrating through the core board body in the thickness direction of the core board body, the heat conduction block is arranged in the installation through hole, and a chip containing groove is formed in one side, in the thickness direction of the core board, of the heat conduction block. The packaging chip is arranged in the chip accommodating groove, and first conductive layers are arranged on the two sides of the core plate body in the thickness direction; the laminated plate is stacked on the core plate in the thickness direction of the core plate, the laminated plate comprises a prepreg and a second conductive layer, and the second conductive layer is connected to the side, away from the core plate, of the prepreg.

Description

Technical Field

[0001] This invention relates to the field of circuit boards, and in particular to a circuit board with an embedded chip and a processing method thereof. Background Technology

[0002] Some existing circuit boards with embedded chips include a core board and layers. The core board consists of a core board body and a packaged chip. A chip receiving slot is formed on one side of the core board body along its thickness direction, and the packaged chip is installed within this slot. Layers are stacked on one or both sides of the core board to form a multi-layer board. Embedding chips can improve the integration, signal integrity, and reliability of the circuit board. However, during operation, the packaged chip generates relatively large amounts of heat, which is not easily dissipated directly through the core board and layers, resulting in poor heat dissipation. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a circuit board with an embedded chip, which can improve heat dissipation.

[0004] The present invention also proposes a processing method for circuit boards with embedded chips as described above.

[0005] According to a first aspect of the present invention, a circuit board with an embedded chip includes a core board and a layer board. The core board includes a core board body, a heat-conducting block, and a packaged chip. The core board body has a mounting through-hole extending through the core board body along its thickness direction. The heat-conducting block is disposed in the mounting through-hole. A chip receiving groove is disposed on one side of the heat-conducting block along the thickness direction of the core board. The packaged chip is disposed within the chip receiving groove. The core board body has first conductive layers on both sides along its thickness direction. The layer board is stacked on the core board along its thickness direction. The layer board includes a prepreg and a second conductive layer, the second conductive layer being connected to the side of the prepreg facing away from the core board.

[0006] The circuit board with an embedded chip according to the first aspect of the present invention has at least the following beneficial effects: when the circuit board is working, the heat emitted by the chip can be directly transferred to the heat-conducting block. Since the packaged chip is located in the chip receiving groove of the heat-conducting block, the heat-conducting block is similar to being wrapped around a part of the packaged chip. Therefore, the surface area of ​​the heat-conducting block is significantly larger than that of the packaged chip, so that the heat of the packaged chip can be transferred to the core board body and the layer board more efficiently through the heat-conducting block, and finally achieve faster heat dissipation, thereby improving the heat dissipation effect.

[0007] According to some embodiments of the present invention, at least two layers are provided, and the core board is stacked with the layers on both sides along the thickness direction. At least two prepregs are provided and respectively configured as a first prepreg and a second prepreg, wherein the thermal conductivity of the second prepreg is greater than that of the first prepreg.

[0008] According to some embodiments of the present invention, all of the second prepreg sheets are located on one side of the core board along the thickness direction, and all of the first prepreg sheets are located on the other side of the core board along the thickness direction.

[0009] According to some embodiments of the present invention, at least two layers are stacked on the side of the core board away from the packaged chip along the thickness direction, located in each of the prepregs on the side of the core board away from the packaged chip along the thickness direction, wherein the first prepreg is located between the second prepreg and the core board.

[0010] According to some embodiments of the present invention, both the first conductive layer and the second conductive layer are configured as copper foil, at least two layers are provided, the layers are stacked on both sides of the core board along the thickness direction, the circuit board further includes a first insulating heat transfer body, the first insulating heat transfer body is located on the side of the core board away from the packaged chip along the thickness direction, the first insulating heat transfer body passes through the prepreg, one end of the first insulating heat transfer body is connected to the heat-conducting block, and the other end of the first insulating heat transfer body is connected to the second conductive layer.

[0011] According to some embodiments of the present invention, the circuit board further includes a second insulating heat transfer body, at least two of the layers are stacked on the side of the core board away from the packaged chip along the thickness direction, the core board has at least two of the prepregs on the side of the core board away from the packaged chip along the thickness direction, the second insulating heat transfer body passes through the prepregs, and the two ends of the second insulating heat transfer body are respectively connected to two adjacent second conductive layers in a one-to-one correspondence.

[0012] According to some embodiments of the present invention, the projections of the first insulating heat transfer body and the second insulating heat transfer body along the thickness direction of the core plate are both located within the range of the heat-conducting block.

[0013] According to some embodiments of the present invention, both the first insulating heat transfer body and the second insulating heat transfer body are frustoconical in shape, with the end of the first insulating heat transfer body near the heat-conducting block being configured as a small end, and the end of the second insulating heat transfer body near the heat-conducting block being configured as a small end.

[0014] According to some embodiments of the present invention, the heat-conducting block is configured as a copper block; the thickness direction of the core plate is configured as a vertical direction; a plurality of the first insulating heat transfer bodies are arranged in an array along the horizontal direction; and a plurality of the second insulating heat transfer bodies are arranged in an array along the horizontal direction.

[0015] According to a second aspect of the present invention, a method for processing a circuit board with an embedded chip, applicable to the aforementioned circuit board with an embedded chip, includes the following steps: Core board fabrication: obtaining a core board body, a heat-conducting block, and a packaged chip; machining mounting through holes in the core board body along its thickness direction; machining a chip receiving groove on one side of the heat-conducting block; then embedding the packaged chip into the chip receiving groove; and then embedding the heat-conducting block into the mounting through holes; Board lamination: obtaining a prepreg and a second conductive layer; alternately stacking the prepreg and the second conductive layer on the core board along its thickness direction to form a laminate; Hot pressing: hot pressing the laminate along the thickness direction of the core board.

[0016] The circuit board with embedded chip according to the second aspect of the present invention has at least the following advantages: the above-described processing method can produce a circuit board with embedded chip, which has strong processability and low production cost.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a cross-sectional schematic diagram of the circuit board according to the first embodiment of the present invention; Figure 2 This is the first embodiment of the present invention. Figure 1 A magnified view of a portion of point G; Figure 3 This is an exploded view of the circuit board according to an embodiment of the present invention; Figure 4 This is a top view of the heat-conducting block and the packaged chip according to an embodiment of the present invention.

[0020] Figure label: Core board 100, core board body 110, mounting through hole 111, first conductive layer 112, heat conduction block 120, chip receiving groove 121, packaged chip 130; Layer 200, prepreg 210, first prepreg 211, second prepreg 212, second conductive layer 220; First insulating heat transfer element 300; Second insulating heat transfer element 400. Detailed Implementation

[0021] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0023] In the description of this invention, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features or their sequential relationship.

[0024] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0025] Reference Figures 1 to 4 The circuit board for embedding a chip according to an embodiment of the present invention includes a core board 100 and a layer board 200. The core board 100 includes a core board body 110, a heat-conducting block 120, and a packaged chip 130. The core board body 110 is provided with a mounting through hole 111 extending through the core board body 110 along its thickness direction. The heat-conducting block 120 is disposed in the mounting through hole 111. The heat-conducting block 120 is provided with a chip receiving groove 121 on one side along the thickness direction of the core board 100. The packaged chip 130 is disposed in the chip receiving groove 121. The core board body 110 has a first conductive layer 112 on both sides along the thickness direction. The layer board 200 is stacked on the core board 100 along the thickness direction of the core board 100. The layer board 200 includes a prepreg 210 and a second conductive layer 220. The second conductive layer 220 is connected to the side of the prepreg 210 away from the core board 100.

[0026] When the circuit board is working, the heat generated by the chip can be directly transferred to the heat-conducting block 120. Since the packaged chip 130 is located in the chip receiving groove 121 of the heat-conducting block 120, the heat-conducting block 120 is similar to wrapping around the local outer side of the packaged chip 130. Therefore, the surface area of ​​the heat-conducting block is significantly larger than that of the packaged chip 130, which allows the heat of the packaged chip 130 to be transferred to the core board body 110 and the layer board 200 more efficiently through the heat-conducting block 120, ultimately achieving faster heat dissipation and thus improving the heat dissipation effect.

[0027] Specifically, the heat-conducting block 120 is configured as a copper block, which has good thermal conductivity and excellent processing performance. Since a chip receiving groove 121 is opened on one side of the heat-conducting block 120, that is, the heat-conducting block 120 is similar to wrapping the packaged chip 130 through the chip receiving groove 121, the size of the heat-conducting block 120 is larger than that of the packaged chip 130, and therefore the surface area is also larger than that of the packaged chip 130.

[0028] Reference Figure 2 In the embodiment, at least two layers 200 are provided, and layers 200 are stacked on both sides of the core board 100 along the thickness direction. At least two semi-cured sheets 210 are provided and are respectively configured as a first semi-cured sheet 211 and a second semi-cured sheet 212. The thermal conductivity of the second semi-cured sheet 212 is greater than that of the first semi-cured sheet 211.

[0029] Specifically, the first prepreg 211 is a conventional prepreg 210, which has a lower material cost, while the second prepreg 212 is a high thermal conductivity prepreg 210, which has a higher material cost. In the multiple layers 200 of the circuit board, some prepregs 210 are selected from the first prepreg 211, while others are selected from the second prepreg 212. This can enhance the heat dissipation effect of the layer 200 within a suitable range without increasing the cost excessively.

[0030] Specifically, the circuit board of this embodiment has four layers 200, with two layers 200 stacked on each side of the core board 100 along its thickness direction. It is conceivable that the circuit board may also have one, two, three, or other numbers of layers 200, which can be selected by those skilled in the art according to actual needs. It should be understood that in some embodiments, the layers 200 may also be entirely stacked on one side of the core board 100, in which case one side of the heat-conducting block 120 is exposed, and the circuit board still has good heat dissipation performance.

[0031] Furthermore, when the circuit board is installed in the equipment, sometimes one side of the circuit board along its thickness is closer to components with high operating temperature requirements, while the other side is farther away from these components. If the overall heat dissipation effect of the circuit board's outer surface is relatively uniform, the heat dissipated by the circuit board may have some impact on the components. Therefore, the following improvements are made: In the second embodiment, all the second prepreg sheets 212 are located on one side of the core board 100 along the thickness direction, and all the first prepreg sheets 211 are located on the other side of the core board 100 along the thickness direction. Since the thermal conductivity of the second prepreg sheets 212 is greater than that of the first prepreg sheets 211, when the circuit board is operating, the heat emitted by the packaged chip 130 enters the heat-conducting block 120 and is mainly dissipated through the layer 200 where the second prepreg sheets 212 are located. That is, one side of the circuit board along the thickness direction is responsible for the main heat dissipation, and the temperature rise is relatively significant; the other side dissipates less heat and the temperature rise is less, achieving directional heat dissipation on one side of the circuit board. At this time, the side with less heat dissipation can be directed towards components with higher operating temperature requirements, reducing the impact on the components. Furthermore, a cooler can be arranged on the side of the circuit board with greater heat dissipation to further improve the directional heat dissipation effect, eliminating the need to arrange coolers on both sides of the circuit board.

[0032] Reference Figure 2 In the first embodiment, at least two layers 200 are stacked on the side of the core board 100 away from the packaged chip 130 along the thickness direction. In each of the semi-cured sheets 210 located on the side of the core board 100 away from the packaged chip 130 along the thickness direction, the first semi-cured sheet 211 is located between the second semi-cured sheet 212 and the core board 100.

[0033] The circuit board mentioned above, namely the second prepreg 212, and the layer 200 located on the surface of the circuit board, make full use of the surface area of ​​the circuit board for heat dissipation and have a certain directional heat dissipation effect; the prepreg 210 between the second prepreg 212 and the core board 100 uses the first prepreg 211, which can reduce material costs and the overall effect is relatively moderate.

[0034] Reference Figure 2 In this embodiment, the first conductive layer 112 and the second conductive layer 220 are both configured as copper foil. At least two layer plates 200 are provided. Layer plates 200 are stacked on both sides of the core plate 100 along the thickness direction. The circuit board also includes a first insulating heat transfer body 300. The first insulating heat transfer body 300 is located on the side of the core plate 100 away from the packaged chip 130 along the thickness direction. The first insulating heat transfer body 300 passes through the prepreg 210. One end of the first insulating heat transfer body 300 is connected to the heat-conducting block 120, and the other end of the first insulating heat transfer body 300 is connected to the second conductive layer 220.

[0035] A first insulating heat transfer element 300 is inserted into the prepreg 210. Since one end of the first insulating heat transfer element 300 is connected to the heat-conducting block 120 and the other end is connected to the second conductive layer 220, the heat inside the heat-conducting block 120 can be directly transferred to the second conductive layer 220 of the layer 200 through the first insulating heat transfer element 300, thereby improving the interlayer heat transfer efficiency and thus improving the heat dissipation effect. Copper foil has good thermal conductivity and can also accelerate heat dissipation or accelerate the heat transfer between the prepregs 210.

[0036] Reference Figure 2 In this embodiment, the circuit board further includes a second insulating heat transfer element 400. At least two layers 200 are stacked on the side of the core board 100 away from the packaged chip 130 along its thickness direction. The core board 100 has at least two prepreg sheets 210 on the side away from the packaged chip 130 along its thickness direction. The second insulating heat transfer element 400 passes through the prepreg sheets 210, and its two ends are respectively connected to two adjacent second conductive layers 220. The second insulating heat transfer element 400 passes through some of the prepreg sheets 210, thereby accelerating heat transfer between adjacent second conductive layers 220. In conjunction with the first insulating heat transfer element 300, this further accelerates the efficiency of heat transfer to the surface of the circuit board, further improving the heat dissipation effect.

[0037] Reference Figure 2 In this embodiment, the projections of the first insulating heat transfer element 300 and the second insulating heat transfer element 400 along the thickness direction of the core plate 100 are both located within the range of the heat-conducting block 120. This arrangement of the first insulating heat transfer element 300 and the second insulating heat transfer element 400 helps to shorten the heat transfer path between the heat-conducting block 120 and the surface of the circuit board, thereby improving heat dissipation efficiency.

[0038] Reference Figure 2 In the embodiment, both the first insulating heat transfer body 300 and the second insulating heat transfer body 400 are frustoconical in shape. The end of the first insulating heat transfer body 300 near the heat-conducting block 120 is configured as the small end, and the end of the second insulating heat transfer body 400 near the heat-conducting block 120 is configured as the small end.

[0039] Specifically, before circuit board production, tapered through-holes can be machined into the corresponding prepreg 210. Then, an insulating heat-conducting fluid is injected into the tapered through-holes. After the fluid solidifies, it forms a first insulating heat transfer body 300 or a second insulating heat transfer body 400. The tapered structure facilitates alignment and fluid injection. Alternatively, a solid first insulating heat transfer body or second insulating heat transfer body 400 can be directly embedded into the tapered through-hole. The tapered structure also facilitates alignment and mounting. Furthermore, the first insulating heat transfer body 300 and the second insulating heat transfer body 400 are frustoconical in shape, with the smaller end facing the heat-conducting block 120, while the larger end connects to the copper foil. This allows for faster heat transfer to the thinner copper foil, improving heat transfer efficiency.

[0040] Specifically, the first insulating heat transfer body 300 and the second insulating heat transfer body 400 can be made of, for example, high thermal conductivity insulating ceramic materials or polymer-based insulating thermal conductive composite materials, containing insulating and thermal conductive components such as alumina.

[0041] Reference Figure 2 In this embodiment, the heat-conducting block 120 is configured as a copper block; the thickness direction of the core plate 100 is configured as vertical; multiple first insulating heat transfer bodies 300 are arranged in a horizontal array; and multiple second insulating heat transfer bodies 400 are arranged in a horizontal array. The array of multiple first insulating heat transfer bodies 300 facilitates the efficient transfer of heat from the heat-conducting block 120 to the adjacent second conductive layer 220; the array of multiple second insulating heat transfer bodies 400 facilitates the improvement of the heat transfer efficiency between adjacent second conductive layers 220.

[0042] Specifically, the first insulating heat transfer element 300 can be provided in one, two, three or more forms, which can be selected by those skilled in the art according to actual needs. The second insulating heat transfer element 400 can be provided in one, two, three or more forms, which can be selected by those skilled in the art according to actual needs.

[0043] Specifically, in this embodiment, a chip receiving groove 121 is provided on the upper side of the heat-conducting block 120. Two layers 200 are stacked on the upper side of the core board 100, and the prepreg 210 of these two layers 200 is configured as the first prepreg 211. Two layers 200 are also stacked on the lower side of the core board 100. Among these two layers 200, the prepreg 210 closer to the core board 100 is the first prepreg, in which a first insulating heat transfer element 300 is inserted; the prepreg 210 farther from the core board 100 is the second prepreg 212, which can make full use of the larger area on the lower side of the circuit board to accelerate heat dissipation. In addition, the second prepreg 212 is in which a second insulating heat transfer element 400 is inserted to facilitate the rapid heat transfer between adjacent copper foils.

[0044] Reference Figure 2 Furthermore, in the embodiment, the first insulating heat transfer body 300 and the second insulating heat transfer body 400 are staggered in the horizontal direction, so that the composite structure of the layer 200 is relatively stable and not prone to structural defects.

[0045] Furthermore, in the embodiment, thermally conductive adhesive can be filled between the chip receiving groove 121 and the packaged chip 130. The thermally conductive adhesive can adhere and fix the packaged chip 130 in the chip receiving groove 121, thereby improving the installation strength of the packaged chip 130. In addition, the thermally conductive adhesive can fill the gap between the packaged chip 130 and the chip receiving groove 121, thereby improving the thermal conductivity between the two.

[0046] Specifically, the thermally conductive adhesive can be, for example, silicone thermally conductive adhesive or epoxy thermally conductive adhesive, and those skilled in the art can choose according to actual needs.

[0047] Specifically, when the heat-conducting block 120 is installed into the mounting through hole 111 of the core board body 110, there may be gaps between them. During the hot pressing process of the circuit board, the resin of the prepreg 210 can fill these gaps, and after curing, the heat-conducting block 120 can be fixed relative to the core board body 110.

[0048] Reference Figure 2 and Figure 4 Specifically, when the length of the copper block is A, the width of the copper block is B, the thickness of the copper block is C, the length of the packaged chip 130 is D, the width of the packaged chip 130 is E, and the thickness of the packaged chip 130 is F, and 1mm≤AD≤3mm, 1mm≤BE≤3mm, and 1mm≤CF≤3mm, heat dissipation efficiency, compact space and reduced weight are taken into account, and the thermal conductivity gain is high.

[0049] Specifically, the side of the packaged chip 130 facing away from the heat-conducting block 120 is exposed relative to the heat-conducting block 120 and has conductive pads. The other second conductive layer 220 can be connected to the conductive pads through conductive via structures to achieve electrical signal conduction between the second conductive layer 220 and the packaged chip 130.

[0050] It should be understood that the heat-conducting block 120 and the first conductive layer 112 are mutually insulated.

[0051] This application also discloses a method for fabricating a circuit board with an embedded chip, comprising the following steps: Core board 100 fabrication: Obtain core board body 110, heat conduction block 120 and packaged chip 130. Machining mounting through hole 111 in core board body 110 along its thickness direction, machining chip receiving groove 121 on one side of heat conduction block 120, then embedding packaged chip 130 into chip receiving groove 121, and then embedding heat conduction block 120 into mounting through hole 111; Board lamination: Obtain the prepreg 210 and the second conductive layer 220, and alternately stack the prepreg 210 and the second conductive layer 220 on the core board 100 along the thickness direction to form a laminate; Hot pressing: The composite is hot pressed along the thickness direction of the core plate 100.

[0052] The above processing method can produce circuit boards with embedded chips, which has strong processability and low production cost.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board with an embedded chip, characterized in that, include: A core board (100) includes a core board body (110), a heat-conducting block (120), and a packaged chip (130). The core board body (110) is provided with a mounting through hole (111) that extends through the core board body (110) along its thickness direction. The heat-conducting block (120) is disposed in the mounting through hole (111). The heat-conducting block (120) is provided with a chip receiving groove (121) on one side along the thickness direction of the core board (100). The packaged chip (130) is disposed in the chip receiving groove (121). The core board body (110) has a first conductive layer (112) on both sides along the thickness direction. A layer (200) is stacked on the core plate (100) along the thickness direction. The layer (200) includes a prepreg (210) and a second conductive layer (220). The second conductive layer (220) is connected to the side of the prepreg (210) away from the core plate (100).

2. The circuit board with an embedded chip according to claim 1, characterized in that: At least two layers (200) are provided, and the core plate (100) is stacked with the layers (200) on both sides along the thickness direction. At least two prepregs (210) are provided and are respectively configured as a first prepreg (211) and a second prepreg (212). The thermal conductivity of the second prepreg (212) is greater than that of the first prepreg (211).

3. The circuit board with an embedded chip according to claim 2, characterized in that: All of the second prepreg sheets (212) are located on one side of the core plate (100) along the thickness direction, and all of the first prepreg sheets (211) are located on the other side of the core plate (100) along the thickness direction.

4. The circuit board with an embedded chip according to claim 2, characterized in that: At least two layers (200) are stacked on the side of the core board (100) away from the packaged chip (130) along the thickness direction, located in each of the prepregs (210) on the side of the core board (100) away from the packaged chip (130) along the thickness direction, with the first prepreg (211) located between the second prepreg (212) and the core board (100).

5. The circuit board with an embedded chip according to claim 1, characterized in that: Both the first conductive layer (112) and the second conductive layer (220) are configured as copper foil. At least two layers (200) are provided. The core board (100) is stacked on both sides along the thickness direction of the layers (200). The circuit board also includes a first insulating heat transfer body (300). The first insulating heat transfer body (300) is located on the side of the core board (100) away from the packaged chip (130) along the thickness direction. The first insulating heat transfer body (300) passes through the prepreg (210). One end of the first insulating heat transfer body (300) is connected to the heat-conducting block (120), and the other end of the first insulating heat transfer body (300) is connected to the second conductive layer (220).

6. The circuit board with an embedded chip according to claim 5, characterized in that: The circuit board further includes a second insulating heat transfer body (400). At least two layers (200) are stacked on the side of the core board (100) away from the packaged chip (130) along the thickness direction. The core board (100) has at least two prepregs (210) on the side of the core board (100) away from the packaged chip (130) along the thickness direction. The second insulating heat transfer body (400) passes through the prepregs (210). The two ends of the second insulating heat transfer body (400) are respectively connected to two adjacent second conductive layers (220) one by one.

7. The circuit board with an embedded chip according to claim 6, characterized in that: The projections of the first insulating heat transfer body (300) and the second insulating heat transfer body (400) along the thickness direction of the core plate (100) are both located within the range of the heat-conducting block (120).

8. The circuit board with an embedded chip according to claim 6, characterized in that: Both the first insulating heat transfer body (300) and the second insulating heat transfer body (400) are frustoconical in shape. The end of the first insulating heat transfer body (300) near the heat-conducting block (120) is configured as the small end, and the end of the second insulating heat transfer body (400) near the heat-conducting block (120) is configured as the small end.

9. The circuit board with an embedded chip according to claim 6, characterized in that: The heat-conducting block (120) is configured as a copper block; the thickness direction of the core plate (100) is configured as the vertical direction; the first insulating heat transfer body (300) is provided in a plurality of arrays arranged in the horizontal direction; and the second insulating heat transfer body (400) is provided in a plurality of arrays arranged in the horizontal direction.

10. A method for fabricating a circuit board with an embedded chip, characterized in that, Includes the following steps: Core board fabrication: Obtain a core board body (110), a heat-conducting block (120), and a packaged chip (130). A mounting through hole (111) is machined in the core board body (110) along its thickness direction. A chip receiving groove (121) is machined on one side of the heat-conducting block (120). The packaged chip (130) is then embedded in the chip receiving groove (121). The heat-conducting block (120) is then embedded in the mounting through hole (111). Board stacking: Obtain a prepreg (210) and a second conductive layer (220), and alternately stack the prepreg (210) and the second conductive layer (220) on the core board (100) along the thickness direction to form a stack; Hot pressing: The composite body is hot pressed along the thickness direction of the core plate (100).

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