Etching spraying device and method

Abstract

The invention discloses an etching spraying device and method, the etching spraying device comprises a transmission line, an upper spraying assembly and a side spraying assembly, the upper spraying assembly comprises an upper spraying head, and the side spraying assembly comprises a side spraying head; the upper spraying head is located over the transmission line, and the included angle between the liquid spraying direction of the upper spraying head and the plane where a PCB in the transmission line is located is 90 degrees. The side spraying head is located on the side edge of the upper spraying assembly, and the included angle a between the liquid spraying direction of the side spraying head and the plane where the PCB in the transmission line is located is larger than 0 degree and smaller than 90 degrees. The etching liquid sprayed by the side spraying head can remove the etching accumulated liquid on the upper surface of the PCB, and due to the fact that the etching liquid in the side spraying head and the etching liquid in the upper spraying head are the same in component, the etching liquid on the upper surface of the PCB can be supplemented in time; the exchange speed of the etching liquid on the upper surface of the PCB is increased, it is ensured that the etching liquid is fully exchanged on the upper surface of the PCB, and the problem of incomplete etching is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of etching spray device, and particularly relates to an etching spray device and method. BACKGROUND

[0002] In the process of making inner and outer layer patterns of PCB, the PCB is usually pasted with film, and then the patterns are transferred to the PCB by an exposure machine, followed by developing, and finally etching the PCB by etching chemicals to remove the excess copper to form the required circuit pattern. In the etching process, the concentration of the chemicals affects the etching effect.

[0003] The conventional etching production line has one nozzle above and one nozzle below, and when the PCB flows through, the etching chemicals are sprayed to react with the PCB. However, in the processing, the chemicals sprayed by the upper nozzle gather on the surface of the PCB, and after the reaction with the copper, the chemicals cannot be timely exchanged with new chemicals, and the chemicals remaining on the upper surface no longer have etching effect, resulting in incomplete etching. SUMMARY

[0004] The present application aims to at least partially solve one of the problems in the related art. To this end, one of the purposes of the present application is to provide an etching spray device, the etching liquid sprayed by the side spray head can remove the etching liquid accumulated on the upper surface of the PCB, and since the etching liquid in the side spray head and the upper spray head is the same, the etching liquid on the upper surface of the PCB can also be timely supplemented; the exchange speed of the etching liquid on the upper surface of the PCB is improved, the etching liquid on the upper surface of the PCB is ensured to be fully exchanged, and the problem of incomplete etching is avoided.

[0005] An etching spray device, comprising a transmission line, an upper spray assembly and a side spray assembly, the transmission line is used for transmitting a PCB to be etched, the upper spray assembly comprises an upper spray head, and the side spray assembly comprises a side spray head; The upper spray head is located directly above the transmission line, and the angle between the liquid spraying direction of the upper spray head and the plane of the PCB in the transmission line is 90°; the side spray head is located at the side of the upper spray assembly, the angle a between the liquid spraying direction of the side spray head and the plane of the PCB in the transmission line is greater than 0° and less than 90°; the etching liquid sprayed by the side spray head is used to timely flush away the etching liquid remaining on the upper surface of the PCB and replace it with new etching liquid.

[0006] Further, the angle a between the liquid spraying direction of the side spray head and the plane of the PCB in the transmission line is 30°-45°.

[0007] Further, the spraying range of the side spray head on the PCB completely covers the spraying range of the upper spray head on the PCB.

[0008] Furthermore, both the upper spray head and the side spray head include a circular liquid outlet surface. The intersection point of the spray axis of the upper spray head and the spray axis of the side spray head is located in the transmission plane of the transmission line. The diameter of the side spray head is greater than or equal to the diameter of the upper spray head × sin a.

[0009] Furthermore, the etching spraying device also includes a lower spraying assembly, which includes a lower spraying head located directly below the transmission line, and the angle between the lower spraying head and the plane where the PCB board is located in the transmission line is 90°.

[0010] Furthermore, the spray pressure of the upper spray head on the PCB board is 2.0-2.4 kg / cm². 2 The spray pressure of the side spray head on the PCB board is 0.5-1.0 kg / cm². 2 .

[0011] Furthermore, when the copper thickness of the pattern to be etched in the PCB board is 0.5 oz, the transmission speed of the transmission line is 10-11 m / min; when the copper thickness of the pattern to be etched in the PCB board is 1 oz, the transmission speed of the transmission line is 5.3 m / min.

[0012] Furthermore, an adjustment clamp is provided on the side of the transmission line, which is used to clamp and limit the two ends of the PCB board.

[0013] Furthermore, there are two adjusting clamps, and the two adjusting clamps are symmetrically arranged along the transmission center of the transmission line; The adjusting clamp includes a spring and a clamping plate. One end of the spring is fixed to the side of the transmission line, and the other end of the spring is fixed to the rear end of the clamping plate. The front end of the clamping plate abuts against the PCB board.

[0014] This application also provides an etching spraying method, implemented based on an etching spraying apparatus as described above, comprising: The PCB board to be etched is placed in the transmission line; The upper spray head and the side spray head are turned on. The etching solution sprayed by the upper spray head is used to etch the pattern on the upper surface of the PCB board. The etching solution sprayed by the side spray head is used to rinse away the etching solution remaining on the surface of the PCB board in time and replace it with new etching solution.

[0015] Compared with the prior art, the above-mentioned technical solution provided in this application has the following advantages: The etching spraying device provided in this application includes a transmission line, an upper spraying assembly, and a side spraying assembly. The transmission line is used to transmit the PCB board to be etched. The upper spraying assembly includes an upper spraying head, and the side spraying assembly includes a side spraying head. The upper spraying head is located directly above the transmission line, and the angle between the spraying direction of the upper spraying head and the plane where the PCB board is located in the transmission line is 90°. The side spraying head is located on the side of the upper spraying assembly, and the angle α between the spraying direction of the side spraying head and the plane where the PCB board is located in the transmission line is greater than 0° and less than 90°. The etching liquid sprayed by the side spraying head is used to promptly wash away the etching liquid remaining on the surface of the PCB board and replace it with new etching liquid. In this application, the etching solution sprayed from the upper spray head is vertically released directly above the PCB board on the transmission line; this ensures uniform spraying across the entire surface of the PCB board, guaranteeing consistent etching. Simultaneously, the etching solution sprayed from the side spray head removes accumulated etching solution from the surface of the PCB board. Since the etching solution in the side spray head and the upper spray head has the same composition, it can also replenish the etching solution on the surface of the PCB board in a timely manner; this increases the exchange rate of the etching solution on the surface of the PCB board, ensuring sufficient exchange of etching solution on the surface of the PCB board and avoiding the problem of incomplete etching.

[0016] This application also provides an etching spraying method, comprising: placing a PCB board to be etched in a transmission line; opening an upper spray head and a side spray head, wherein the etching solution sprayed by the upper spray head is used to etch the pattern on the upper surface of the PCB board; and the etching solution sprayed by the side spray head is used to promptly flush away the etching solution remaining on the upper surface of the PCB board and replace it with new etching solution. In this application, the etching solution sprayed from the upper spray head is released vertically directly above the PCB board on the transmission line; this ensures uniform spraying across the upper surface of the PCB board, ensuring consistent etching; simultaneously, the etching solution sprayed from the side spray head can remove the accumulated etching solution on the upper surface of the PCB board. Since the etching solution in the side spray head and the upper spray head has the same composition, it can also promptly replenish the etching solution on the upper surface of the PCB board; increasing the exchange rate of the etching solution on the upper surface of the PCB board, ensuring sufficient exchange of the etching solution on the upper surface of the PCB board, and avoiding the problem of incomplete etching. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] In the attached image: Figure 1 This is a schematic diagram of the structure of the spray assembly in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the adjusting clamp in the embodiments of this application; Figure 3 This is a side view of the side spray head and the top spray head in the embodiments of this application.

[0020] Reference numerals: 11. Transmission line; 12. PCB board; 13. Upper spray head; 14. Side spray head; 15. Lower spray head; 16. Spring; 17. Clamping plate. Detailed Implementation

[0021] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the referred mechanism or element must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0022] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0023] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0024] Example 1 like Figure 1 As shown, this application discloses an etching spraying device, including a transmission line 11, an upper spraying assembly, and a side spraying assembly. The transmission line 11 is used to transport a PCB board 12 to be etched. The upper spraying assembly includes an upper spray head 13, and the side spraying assembly includes a side spray head 14. The upper spray head 13 is located directly above the transmission line 11, and the spraying direction of the upper spray head 13 forms a 90° angle with the plane where the PCB board 12 is located in the transmission line 11. The side spray head 14 is located on the side of the upper spraying assembly, and the spraying direction of the side spray head 14 forms an angle α with the plane where the PCB board 12 is located in the transmission line 11 that is greater than 0° and less than 90°.

[0025] In this application, the upper spray head 13 is used to etch the copper layer on the upper surface of the PCB board 12. The upper spray head 13 sprays vertically onto the upper surface of the PCB board 12, which can ensure that the spraying is consistent throughout the upper surface of the PCB board 12, improving the etching uniformity. In this application, the etching solution sprayed by the side spray head 14 is used to promptly rinse away the etching solution remaining on the upper surface of the PCB board 12 and replace it with new etching solution. The new etching solution can come from either the upper spray head 13 or the side spray head 14. In this application, the main function of the side spray head 14 is to remove the accumulated liquid on the upper surface of the PCB board 12. Since its spray solution is the same as that of the upper spray head 13, the side spray head 14 also has a certain etching effect, but the etching effect is secondary; the etching effect is mainly achieved by etching with the etching solution sprayed by the upper spray head 13.

[0026] This application provides a water storage tank at the bottom of the transmission line 11 to recover and promptly drain the etchant after spraying; the water storage tank is equipped with a water outlet to ensure that the etchant in the water storage tank is cleaned regularly and in a timely manner.

[0027] In this application, the side spray head is set on one side. If it is set on both sides, the upper surface of the PCB board will be subjected to two forces in two different horizontal directions, which cannot ensure that the accumulated liquid is cleaned up in time.

[0028] If the side spray head in this application is replaced with a blower assembly, although the accumulated liquid can be cleaned up in time, the etching solution cannot be replenished in time, which will affect the etching effect.

[0029] In this application, the etching solution sprayed from the upper spray head 13 is vertically released directly above the PCB board 12 on the transmission line 11. This ensures uniform spraying across the upper surface of the PCB board 12, guaranteeing consistent etching. Simultaneously, the etching solution sprayed from the side spray head 14 removes accumulated etching solution from the upper surface of the PCB board 12. Since the etching solution in the side spray head 14 and the upper spray head 13 has the same composition, it can also replenish the etching solution on the upper surface of the PCB board 12 in a timely manner. This increases the exchange rate of the etching solution on the upper surface of the PCB board 12, ensuring sufficient exchange of etching solution on the upper surface of the PCB board 12 and avoiding incomplete etching.

[0030] This application also provides an etching spraying method, comprising: placing a PCB board 12 to be etched in a transmission line 11; opening an upper spray head 13 and a side spray head 14, wherein the etching solution sprayed by the upper spray head 13 is used to etch the pattern on the upper surface of the PCB board 12; and the etching solution sprayed by the side spray head 14 is used to promptly flush away the etching solution remaining on the upper surface of the PCB board 12 and replace it with new etching solution. In this application, the etching solution sprayed from the upper spray head 13 is released vertically above the PCB board 12 on the transmission line 11; this ensures uniform spraying on all parts of the upper surface of the PCB board 12, ensuring consistent etching; at the same time, the etching solution sprayed from the side spray head 14 can remove the accumulated etching solution on the upper surface of the PCB board 12. Since the etching solution in the side spray head 14 and the upper spray head 13 has the same composition, it can also promptly replenish the etching solution on the upper surface of the PCB board 12; increasing the exchange rate of the etching solution on the upper surface of the PCB board 12, ensuring sufficient exchange of the etching solution on the upper surface of the PCB board 12, and avoiding the problem of incomplete etching.

[0031] Example 2 like Figure 1 As shown, this application provides an etching spraying device, including a transmission line 11, an upper spraying assembly, and a side spraying assembly. The transmission line 11 is used to transport a PCB board 12 to be etched. The upper spraying assembly includes an upper spray head 13, and the side spraying assembly includes a side spray head 14. The upper spray head 13 is located directly above the transmission line 11, and the angle between the spraying direction of the upper spray head 13 and the plane where the PCB board 12 is located in the transmission line 11 is 90°. The side spray head 14 is located on the side of the upper spraying assembly, and the angle α between the spraying direction of the side spray head 14 and the plane where the PCB board 12 is located in the transmission line 11 is greater than 0° and less than 90°. The etching solution sprayed by the side spray head 14 is used to promptly wash away the etching solution remaining on the upper surface of the PCB board 12 and replace it with new etching solution.

[0032] Furthermore, such as Figure 3 As shown, the angle α between the spray direction of the side spray head 14 and the plane where the PCB board 12 is located in the transmission line 11 is 30°-45°. In this application, if α is too large, the removal effect of the accumulated liquid on the upper surface of the PCB board 12 will be insignificant; if the angle is too small, the etching solution will be washed away before the etching reaction occurs in some areas on the upper surface of the PCB board 12, which also leads to insufficient etching reaction. This application sets the angle α between the spray direction of the side spray head 14 and the plane where the PCB board 12 is located in the transmission line 11 to 30°-45°, which can ensure that the etching solution maintains sufficient reaction and timely exchange during the etching process on the upper surface of the PCB board 12, improve the etching effect, and avoid the problem of incomplete etching.

[0033] Furthermore, the spray range of the side spray head 14 on the PCB board 12 completely covers the spray range of the upper spray head 13 on the PCB board 12. During the spraying process, the PCB board 12 will move along the transmission line 11. Regardless of how the PCB board 12 moves, it is necessary to ensure that the spray range of the side spray head 14 completely covers the spray range of the upper spray head 13. This complete coverage can be greater than or equal to the coverage, ensuring that any area sprayed by the upper spray head 13 can be promptly flushed and replaced by the scouring force of the side spray head 14. If the side spray head 14 cannot completely cover the spray range of the upper spray head 13, there will be local areas where the etching solution is not cleaned in time, and uniform etching cannot be ensured.

[0034] Furthermore, both the upper spray head 13 and the side spray head 14 include a circular liquid outlet surface. The intersection point of the spray axis of the upper spray head 13 and the spray axis of the side spray head 14 is located within the transmission plane of the transmission line 11, and the diameter of the side spray head 14 is greater than or equal to the diameter of the upper spray head 13 × sin a. The spray axis refers to the center line of the circular liquid outlet surface. The intersection of the spray axes of the upper spray head 13 and the side spray head 14 within the transmission plane ensures that the projected center lines of the upper spray head 13 and the side spray head 14 coincide in the transmission plane. Thus, it is only necessary to ensure that the projected area of ​​the side spray head 14 in the transmission plane is greater than or equal to the projected area of ​​the upper spray head 13 in the transmission plane. Correspondingly, this application sets the diameter of the side spray head 14 to be greater than or equal to the diameter of the upper spray head 13 × sin a, which satisfies the above-mentioned projected area requirement.

[0035] Furthermore, the etching spraying device also includes a lower spraying assembly, which includes a lower spray head 15. The lower spray head 15 is located directly below the transmission line 11, and the angle between the lower spray head 15 and the plane containing the PCB board 12 on the transmission line 11 is 90°. The etching solution sprayed from the lower spray head 15 is released vertically below the PCB board 12 on the transmission line 11, and falls back down under gravity to replenish the solution. This ensures uniform spraying across the lower surface of the PCB board 12, guaranteeing consistent etching.

[0036] Furthermore, the spray pressure of the upper spray head 13 on the PCB board 12 is 2.0-2.4 kg / cm². 2 The spray pressure of the side spray head 14 on the PCB board 12 is 0.5-1.0 kg / cm². 2 In this application, the upper spray head 13 mainly serves to etch the upper surface of the PCB board 12, while the side spray head 14 mainly serves to promptly flush the liquid on the upper surface of the PCB board 12. Therefore, the spraying speed of the upper spray head 13 is relatively high, and the corresponding spraying pressure is also relatively high.

[0037] Furthermore, when the copper thickness of the pattern to be etched in the PCB board 12 is 0.5 oz, the transmission speed of the transmission line 11 is 10-11 m / min; when the copper thickness of the pattern to be etched in the PCB board 12 is 1 oz, the transmission speed of the transmission line 11 is 5.3 m / min. In this application, the greater the copper thickness, the lower the transmission speed of the transmission line 11, resulting in a longer etching time for the etching solution on the PCB board 12.

[0038] Furthermore, an adjusting clamp is provided on the side of the transmission line 11, which is used to clamp and limit the two ends of the PCB board 12. Since a side spray head 14 is added, to prevent the PCB board 12 from shifting due to the horizontal force exerted by the side spray head 14 on the PCB board 12 during transmission, an adjusting clamp is provided on the side of the transmission line 11. The adjusting clamp is used to fix the PCB board 12 in the transmission line 11, preventing the PCB board 12 from shifting position under the action of the side spray head 14.

[0039] Furthermore, such as Figure 2 As shown, there are two adjusting clamps, symmetrically arranged along the transmission center of the transmission line 11. Each adjusting clamp includes a spring 16 and a clamping plate 17. One end of the spring 16 is fixed to the side of the transmission line 11, and the other end is fixed to the rear end of the clamping plate 17. The front end of the clamping plate 17 abuts against the PCB board 12. When the PCB board 12 is fixed in the adjusting clamp, the spring 16 is in a slightly compressed state. Since the springs 16 and clamping plates 17 on both sides are identical, the PCB board 12 can be fixed at the middle position of the transmission line 11. Furthermore, the spring 16 in this application expands the applicability of the adjusting clamp, enabling clamping and fixing of PCB boards 12 of different sizes.

[0040] Example 3 like Figures 1-3As shown, this application provides an etching spraying device, including a transmission line 11, an upper spraying assembly, a lower spraying assembly, a side spraying assembly, and adjusting clamps. The transmission line 11 is used to transport the PCB board 12 to be etched. Adjusting clamps are provided on the side of the transmission line 11; there are two adjusting clamps, symmetrically arranged along the transmission center of the transmission line 11. Each adjusting clamp includes a spring 16 and a clamping plate 17. One end of the spring 16 is fixed to the side of the transmission line 11, and the other end is fixed to the rear end of the clamping plate 17. The front end of the clamping plate 17 abuts against the PCB board 12. When the PCB board 12 is fixed in the adjusting clamp, the spring 16 is in a slightly compressed state. Since the springs 16 and clamping plates 17 on both sides are identical, the PCB board 12 can be fixed at the middle position of the transmission line 11. The inclusion of springs 16 in this application expands the applicability of the adjusting clamp, enabling clamping and fixing of PCB boards 12 of different sizes.

[0041] The upper spray assembly includes an upper spray head 13 and an upper spray pipe connected to the upper spray head 13. The upper spray head 13 is located directly above the transmission line 11, and the spray direction of the upper spray head 13 forms a 90° angle with the plane where the PCB board 12 is located in the transmission line 11, that is, the spray direction of the upper spray head 13 is vertically downward. It is used to spray etching solution onto the upper surface of the PCB board 12 in the transmission line 11.

[0042] like Figure 3 As shown, the side spray assembly includes a side spray head 14 and a side spray pipe connected to the side spray head 14; the side spray head 14 is located on the side of the upper spray assembly, and the angle α between the spray direction of the side spray head 14 and the plane where the PCB board 12 is located in the transmission line 11 is 30°-45°. Specifically, both the upper spray head 13 and the side spray head 14 include a circular liquid outlet surface. The intersection point of the spray axis of the upper spray head 13 and the spray axis of the side spray head 14 is located in the transmission plane of the transmission line 11, and the diameter of the side spray head 14 is greater than or equal to the diameter of the upper spray head 13 × sin a. This ensures that the projection center lines of the upper spray head 13 and the side spray head 14 in the transmission plane coincide, and the projection area of ​​the side spray head 14 in the transmission plane is greater than or equal to the projection area of ​​the upper spray head 13 in the transmission plane. This further ensures that the spray range of the side spray head 14 on the PCB board 12 completely covers the spray range of the upper spray head 13 on the PCB board 12, ensuring that any area sprayed by the upper spray head 13 can be flushed and replaced by the scouring force of the side spray head 14 in a timely manner. The main function of the side spray head 14 in this application is not to participate in the etching reaction, but to improve the degree of chemical exchange. The side blowing device can remove the liquid on the upper surface, but the etching process is not instantaneous and has a certain reaction time. Therefore, it is necessary to provide new chemical solution while removing the old liquid on the surface. The side blowing cannot achieve timely replenishment of chemical solution.

[0043] The lower spray assembly includes a lower spray head 15 and a lower spray pipe connected to the lower spray head 15. The lower spray head 15 is located directly below the transmission line 11, and the angle between the lower spray head 15 and the plane containing the PCB board 12 in the transmission line 11 is 90°. The etching solution sprayed from the lower spray head 15 is released vertically below the PCB board 12 on the transmission line 11, and falls back down under gravity to replenish the solution. This ensures uniform spraying across the lower surface of the PCB board 12, ensuring consistent etching.

[0044] In this application, the transmission line 11 is located inside a water storage tank. An outlet is provided at the bottom of the water storage tank. The etching solution sprayed during the etching process is stored in the water storage tank and periodically cleaned through the outlet. A filter screen is installed at the outlet to filter out impurities that fall into the water storage tank.

[0045] Along the transmission direction of the transmission line 11, this application can provide one or more sets of spray devices. Each spray device includes an upper spray head 13, a lower spray head 15, and a side spray head 14. The upper spray head 13 and the lower spray head 15 are symmetrically arranged relative to the transmission line 11, and the upper spray head 13 and the lower spray head 15, perpendicular to the transmission direction, need to completely cover the dimensions of the PCB board 12. Multiple sets of spray devices can operate with only one set spraying, or multiple sets can spray simultaneously. Figure 1 As shown, two sets of spray devices are provided. The copper layer in the PCB board 12 after passing through the first spray device is not completely etched and needs to pass through the second set of spray devices to continue etching. In this application, the number of spray devices needs to be set in accordance with the transmission speed of the transmission line 11. When there are more spray devices, it means that the number of etching times increases, and the transmission speed of the transmission line 11 can be increased accordingly.

[0046] This application also provides an etching spraying method, including: The PCB board 12 to be etched is placed in the transmission line 11; when the copper thickness of the pattern to be etched in the PCB board 12 is 0.5 oz, the transmission speed of the transmission line 11 is 10-11 m / min, and when the copper thickness of the pattern to be etched in the PCB board 12 is 1 oz, the transmission speed of the transmission line 11 is 5.3 m / min, to ensure sufficient reaction between the copper layer and the chemical.

[0047] The upper spray head 13, side spray head 14, and lower spray head 15 are opened simultaneously. The etching solution sprayed by the upper spray head 13 is used to etch the patterns on the upper surface of the PCB board 12. The etching solution sprayed by the side spray head 14 is used to rinse away the etching solution remaining on the upper surface of the PCB board 12 and replace it with fresh etching solution. The etching solution sprayed by the lower spray head 15 is used to etch the patterns on the lower surface of the PCB board 12.

[0048] In this application, the spray pressure of the lower spray head 15 on the PCB board 12 is 2.2 kg / cm². 2 The spray pressure of the upper spray head 13 on the PCB board 12 is less than 2.0-2.2 kg / cm². 2 The spray pressure of the side spray head 14 on the PCB board 12 is 0.5-1.0 kg / cm². 2 Furthermore, the spray pressure of the side spray head 14 × sin a = lower spray pressure - upper spray pressure, that is, the upper spray pressure plus the vertical pressure of the side spray head 14 equals the lower spray pressure; in this way, the spray pressure on the upper and lower surfaces of the PCB board 12 is the same, and under the action of the side spray head 14, the upper and lower surfaces can achieve timely and effective etchant renewal, ensuring uniform and consistent etching on the upper and lower surfaces of the PCB board 12.

[0049] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. An etching spraying device, characterized in that, It includes a transmission line, an upper spray assembly, and a side spray assembly. The transmission line is used to transport the PCB board to be etched. The upper spray assembly includes an upper spray head, and the side spray assembly includes a side spray head. The upper spray head is located directly above the transmission line, and the spray direction of the upper spray head forms a 90° angle with the plane where the PCB board is located in the transmission line; the side spray head is located on the side of the upper spray assembly, and the spray direction of the side spray head forms an angle α with the plane where the PCB board is located in the transmission line greater than 0° and less than 90°; the etching solution sprayed by the side spray head is used to promptly wash away the etching solution remaining on the surface of the PCB board and replace it with new etching solution.

2. The etching spraying device according to claim 1, characterized in that, The angle α between the spray direction of the side spray head and the plane where the PCB board is located in the transmission line is 30°-45°.

3. The etching spraying device according to claim 1, characterized in that, The side spray head's spray range on the PCB board completely covers the spray range of the top spray head on the PCB board.

4. The etching spraying device according to claim 3, characterized in that, Both the upper spray head and the side spray head have a circular liquid outlet surface. The intersection point of the spray axis of the upper spray head and the spray axis of the side spray head is located in the transmission plane of the transmission line. The diameter of the side spray head is greater than or equal to the diameter of the upper spray head × sin a.

5. The etching spraying device according to claim 1, characterized in that, The etching spraying device further includes a lower spraying assembly, which includes a lower spraying head located directly below the transmission line, and the angle between the lower spraying head and the plane of the PCB board in the transmission line is 90°.

6. The etching spraying device according to claim 1, characterized in that, The spray pressure of the upper spray head on the PCB board is 2.0-2.4 kg / cm². 2 The spray pressure of the side spray head on the PCB board is 0.5-1.0 kg / cm². 2 .

7. The etching spraying device according to claim 6, characterized in that, When the copper thickness of the pattern to be etched in the PCB board is 0.5 oz, the transmission speed of the transmission line is 10-11 m / min; when the copper thickness of the pattern to be etched in the PCB board is 1 oz, the transmission speed of the transmission line is 5.3 m / min.

8. The etching spraying device according to claim 1, characterized in that, An adjustment clamp is provided on the side of the transmission line, which is used to clamp and limit the two ends of the PCB board.

9. An etching spraying device according to claim 8, characterized in that, There are two adjustment clamps, and the two adjustment clamps are symmetrically arranged along the transmission center of the transmission line; The adjusting clamp includes a spring and a clamping plate. One end of the spring is fixed to the side of the transmission line, and the other end of the spring is fixed to the rear end of the clamping plate. The front end of the clamping plate abuts against the PCB board.

10. An etching spraying method, characterized in that, An etching spray apparatus according to any one of claims 1-9 is implemented, comprising: The PCB board to be etched is placed in the transmission line; The upper spray head and the side spray head are turned on. The etching solution sprayed by the upper spray head is used to etch the pattern on the upper surface of the PCB board. The etching solution sprayed by the side spray head is used to rinse away the etching solution remaining on the surface of the PCB board in time and replace it with new etching solution.

Images