Pressing-plate-free surface mounting device for circuit board

Abstract

The invention discloses a pressing-plate-free surface mounting device for a circuit board, and relates to the technical field of integrated circuit manufacturing. Comprising a machine body, and further comprises a central column, a rotating shaft and a driving device, the tray is mounted in the machine body; the feeding mechanism comprises a second push rod, a placing frame is arranged outside the second push rod, a moving assembly is arranged in the placing frame, and the second push rod is used for controlling the placing frame and the moving assembly to enter and exit from the machine body; the adsorption mechanism is arranged above the tray, the adsorption mechanism comprises a disc, a lifting assembly is arranged outside the disc, and a replacement assembly is arranged below the lifting assembly; and the two backup plates are installed at the two ends of the center column correspondingly, and the backup plates are connected with the machine body. According to the pressing-plate-free surface mounting device for the circuit board, the feeding mechanism and the adsorption mechanism are arranged, so that the purpose of improving the use efficiency of equipment is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit manufacturing, in particular to a circuit board without pressure plate patch device. BACKGROUND

[0002] In the process of integrated circuit manufacturing, the circuit board is one of the most important electronic devices, from airplanes to cars, to mobile phones and watches, all of which have various sizes and styles of circuit boards installed inside, among which, according to the equipment to be installed and the functions to be achieved, the circuit board is divided into single-sided board, double-sided board, etc.

[0003] In the utility model patent with publication number CN218679517U, a kind of circuit board without pressure plate efficient patching equipment is disclosed, including transmission base frame, assembly frame, displacement adjusting mechanism, glue coating mechanism and adaptive mechanism, the upper portion of the transmission base frame is provided with assembly frame, and the middle portion of assembly frame is provided with displacement adjusting mechanism, the middle portion of displacement adjusting mechanism is provided with glue coating mechanism, the upper portion of the transmission base frame is distributed with adaptive mechanism, the glue coating mechanism includes connecting frame.The circuit board without pressure plate efficient patching equipment, in the above operation, the glue dropping operation of the point glue head above the electric element can be carried out by the telescopic structure of the first electric push rod.But when placing circuit board, the impurities on the bottom of the circuit board will affect the flatness of the bottom of the circuit board, and the flatness will affect the stability of the negative pressure adsorption, and then affect the accuracy of the patch position. SUMMARY

[0004] To overcome the problem that when placing circuit board, the impurities on the bottom of the circuit board will affect the flatness of the bottom of the circuit board, and the flatness will affect the stability of the negative pressure adsorption, and then affect the accuracy of the patch position, the present application provides a circuit board without pressure plate patch device, which comprises a body, and further comprises: a center column, which is installed inside the body; a tray, which is installed inside the body; a feeding mechanism, which is installed outside the center column, the feeding mechanism comprising a second push rod, the second push rod having a placing rack outside, the placing rack having a moving assembly inside, the second push rod being used to control the placing rack and the moving assembly to enter and exit the body; an adsorption mechanism, which is arranged above the tray, the adsorption mechanism comprising a disc, the disc having a lifting assembly outside, the lifting assembly having a replacement assembly below.

[0005] Preferably, the feeding mechanism further comprises: a backboard, two of which are installed at both ends of the center column, and the backboard is connected with the body; a first push rod, which is installed outside the backboard; A moving ring is connected with the telescopic end of the first push rod, and the moving ring is slidingly connected outside the central column, and the first push rod is used to control the relative position between the moving ring and the tray.

[0006] Preferably, the feeding mechanism further comprises: A first lifting rod is installed at the bottom of the moving ring; A connecting frame is connected with the telescopic end of the first lifting rod, and the second push rod is installed outside the connecting frame.

[0007] Preferably, the feeding mechanism further comprises: A first placing groove is formed in the inside of the placing frame, and two first placing grooves are symmetrically arranged; A second placing groove is formed in the inside of the placing frame, and the second placing groove is used for placing raw materials; A through groove is formed in the inside of the placing frame, and a third push rod is installed in the inside of the through groove, and the moving assembly is connected with the telescopic end of the third push rod.

[0008] Preferably, the moving assembly comprises: A sliding block is slidingly connected in the inside of the through groove, and the sliding block is connected with the telescopic end of the third push rod; A bent rod is installed outside the sliding block; An elastic rod is connected with the bent rod, and the elastic rod is used to protect the circuit board above the circuit board.

[0009] Preferably, the moving assembly further comprises: A connecting rod is installed outside the sliding block; A bottom disc is connected with the connecting rod, and a recess is formed in the inside of the bottom disc, and the bottom disc is used to receive impurities.

[0010] Preferably, the adsorption mechanism further comprises: A bottom box is installed at the bottom of the tray, and a motor is arranged in the inside of the bottom box; A channel is formed in the bottom of the bottom box; A fixed frame is installed at the bottom of the tray, and the replacement assembly is arranged in the inside of the fixed frame.

[0011] Preferably, the lifting assembly comprises: A lifting column is connected with the output end of the motor, and the lifting column is connected with a disc, and a ventilation pipe is installed outside the disc; A connecting box is installed outside the disc; A connecting plate is installed at the bottom of the connecting box, and the connecting plate is used to shield the adsorption head during slag removal. A connecting pipe is arranged through the inside of the connecting plate, and the top of the connecting pipe is provided with the adsorption head.

[0012] Preferably, the replacement assembly comprises: A first outer frame is slidingly connected in the inside of the fixed frame. A second lifting rod is connected at the telescopic end of the first outer frame. A first sliding plate is installed below the second lifting rod and is slidingly connected in the inside of the bottom box. A second outer frame is slidingly connected in the inside of the fixed frame. A third lifting rod is connected at the telescopic end of the second outer frame. A second sliding plate is installed below the third lifting rod and is slidingly connected in the inside of the bottom box.

[0013] The present application provides a circuit board without pressure plate patching device. It has the following advantages: 1. The circuit board without pressure plate patching device, by setting the adsorption mechanism, the impurities on the bottom of the circuit board are treated before the negative pressure adsorption. When placing the circuit board, the impurities on the bottom of the circuit board will affect the flatness of the bottom of the circuit board, and the flatness will affect the stability of the negative pressure adsorption, and then affect the accuracy of the patching position. Therefore, the adsorption mechanism is set to remove the impurities on the bottom of the circuit board, so as to prevent the placement of the circuit board from being affected by the impurities.

[0014] 2. The circuit board without pressure plate patching device, by setting the feeding mechanism, the circuit board is placed in the second placing groove, and the bottom of the circuit board is fixed by the adsorption mechanism. The position of the circuit board is fixed without the pressure plate, so as to avoid the interference between the pressure plate and the patching work. And in the process of removing the impurities on the bottom of the circuit board by the adsorption mechanism, the moving assembly is used to limit the circuit board above the circuit board.

[0015] 3. The circuit board without pressure plate patching device, by setting the moving assembly, when the adsorption mechanism is used to remove the impurities on the bottom of the circuit board, two third push rods drive two moving assemblies to move above and below the circuit board. The sliding block drives the elastic rod to move above the circuit board, so as to prevent the circuit board from moving upward and separating from the second placing groove; at the same time, the sliding block drives the connecting rod and the bottom disc to move at the bottom of the circuit board, so as to connect and adhere most of the impurities, and reduce the blockage of the adsorption mechanism by the downward movement of the impurities.

[0016] 4. The circuit board without pressing plate paster device, through the setting lift assembly, carries out air supply treatment to the impurity on the bottom of the circuit board before negative pressure adsorption, under the cooperation of the moving assembly, promotes the impurity to separate from the bottom of the circuit board, so as to avoid the existence of impurity, resulting in the uneven bottom of the circuit board. After negative pressure adsorption on the bottom of the circuit board, whether the four corners of the circuit board are fixed and stable is detected by air supply.

[0017] 5. The circuit board without pressing plate paster device, by setting the replacement assembly, after long-term use of the adsorption head, the internal blockage of the adsorption head may occur, resulting in unstable fixation of the adsorption head and the circuit board, and such phenomenon is difficult to find before paster. Through the setting of the lift assembly and the replacement assembly, whether the adsorption head and the circuit board are fixed and stable is detected by air supply, and then the replacement assembly is used to replace the connecting pipe and the adsorption head at the unstable position, so as to solve the above problems. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the overall structure schematic diagram of the present application; Figure 2 It is the structure schematic diagram of another view of the present application; Figure 3 It is the structure schematic diagram of the feeding mechanism of the present application; Figure 4 It is the structure schematic diagram of the placing rack of the present application; Figure 5 It is the structure schematic diagram of the moving assembly of the present application; Figure 6 It is the structure schematic diagram of the adsorption mechanism of the present application; Figure 7 It is the structure schematic diagram of the bottom box of the present application; Figure 8 It is the structure schematic diagram of the lift assembly of the present application; Figure 9 It is the structure schematic diagram of the replacement assembly of the present application.

[0019] As shown in the figure: 1, the body; 2, the center column; 3, the feeding mechanism; 301, the back plate; 302, the first push rod; 303, the moving ring; 304, the first lifting rod; 305, the connecting frame; 306, the second push rod; 307, the placing rack; 308, the moving assembly; 3081, the sliding block; 3082, the bent rod; 3083, the elastic rod; 3084, the connecting rod; 3085, the chassis; 3086, the groove; 309, the first placing groove; 310, the through groove; 311, the second placing groove; 312, the third push rod; 4, the tray; 5, the suction mechanism; 501, the bottom box; 502, the disc; 503, the lifting assembly; 5031, the lifting column; 5032, the connecting box; 5033, the connecting plate; 5034, the suction head; 5035, the connecting pipe; 504, the channel; 505, the fixed frame; 506, the replacement assembly; 5061, the first outer frame; 5062, the second outer frame; 5063, the second lifting rod; 5064, the first sliding plate; 5065, the third lifting rod; 5066, the second sliding plate. DETAILED DESCRIPTION

[0020] The application will be further described below in conjunction with the drawings and specific embodiments. The embodiments of the application are given for illustrative and descriptive purposes only, and are not exhaustive or limiting to the application disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are chosen and described in order to best explain the principles of the application and its practical application, and to enable others skilled in the art to understand the application in order to design various embodiments with various modifications for specific uses.

[0021] As Figures 1-9 shown, the application provides a technical solution: a circuit board without pressure plate paster device is described as follows.

[0022] It comprises a body 1, which is set as a paster machine, and further comprises: a center column 2, which is installed inside the body 1; a tray 4, which is installed inside the body 1; a feeding mechanism 3, which is installed outside the center column 2, and comprises a second push rod 306, which is set as an electric push rod, and the outside of the second push rod 306 is provided with a placing rack 307, and the inside of the placing rack 307 is provided with a moving assembly 308, and the second push rod 306 is used to control the placing rack 307 and the moving assembly 308 to enter and exit the body 1; a suction mechanism 5, which is arranged above the tray 4, and comprises a disc 502, the top of which is provided with a first air vent, and the outside of the disc 502 is provided with a lifting assembly 503, and the lower side of the lifting assembly 503 is provided with a replacement assembly 506.

[0023] Before using the equipment, open the lifting door of machine body 1, adjust the feeding mechanism 3, and have the worker place the circuit board to be mounted in the placement rack 307. Adjust the feeding mechanism 3 again so that the placement rack 307 is above the tray 4. Then, start the suction mechanism 5 to perform airflow to remove impurities from the bottom of the board. After airflow removal, use the suction mechanism 5 to apply negative pressure to the bottom of the circuit board. Start machine body 1 to mount the circuit board. After mounting, adjust the suction mechanism 5 and the feeding mechanism 3 to send the mounted circuit board out of machine body 1.

[0024] Feeding mechanism 3 also includes: There are two backing plates 301, which are respectively installed at both ends of the central column 2 and connected to the body 1. The first push rod 302 is an electric push rod, which is set in the horizontal direction and is installed on the outside of the back plate 301. The movable ring 303 is connected to the telescopic end of the first push rod 302, and the movable ring 303 is slidably connected to the outside of the central column 2. The first lifting rod 304 is configured as an electric push rod, and is set in the vertical direction. The first lifting rod 304 is installed at the bottom of the moving ring 303. A connecting frame 305 is connected to the telescopic end of the first lifting rod 304, and a second push rod 306 is installed on the outside of the connecting frame 305. The first placement slot 309 is opened inside the placement rack 307. There are two first placement slots 309, which are symmetrically arranged. The second placement slot 311 is opened inside the placement rack 307 and is used to place raw materials. A through slot 310 is formed inside the placement rack 307. A third push rod 312 is installed inside the through slot 310. The third push rod 312 is an electric push rod. The moving component 308 is connected to the telescopic end of the third push rod 312.

[0025] The process of feeding material using feeding mechanism 3: The second push rod 306 is activated, causing the placement rack 307 to move away from the machine body 1, allowing the worker to place the circuit board to be mounted into the second placement slot 311. The second push rod 306 is then adjusted to its initial position, with the circuit board positioned above the tray 4. The stroke of the first lifting rod 304 is then adjusted, causing the circuit board to move closer to the tray 4.

[0026] The process of feeding material using feeding mechanism 3: After the surface mount process, the stroke of the first lifting rod 304 is adjusted. The first lifting rod 304 drives the connecting frame 305, the second push rod 306 and the placement frame 307 to move upward, separating the circuit board from the adsorption mechanism 5. The second push rod 306 is then activated, driving the placement frame 307 to move away from the machine body 1, allowing the worker to retrieve the circuit board.

[0027] The process of using feeding mechanism 3 in conjunction with adsorption mechanism 5 to remove impurities: During the impurity removal process, the two third push rods 312 are alternately activated to the reciprocating motion mode. The two third push rods 312 take turns driving the two moving components 308 to move above and below the circuit board.

[0028] By setting up the feeding mechanism 3, the circuit board is placed in the second placement slot 311, and the adsorption mechanism 5 uses negative pressure to adsorb and fix the bottom of the circuit board, eliminating the need for a pressure plate to fix the position of the circuit board and avoiding interference between the pressure plate and the surface mount process. During the process of the adsorption mechanism 5 removing impurities from the bottom of the circuit board, the moving component 308 is used to limit the circuit board from above.

[0029] Mobile component 308 includes: Slider 3081 is slidably connected inside the through groove 310, and slider 3081 is connected to the telescopic end of the third push rod 312; The bent rod 3082 is installed on the outside of the slider 3081; Elastic rod 3083 is configured in a wave shape and is connected to bent rod 3082; Connecting rod 3084 is installed on the outside of slider 3081; The chassis 3085 is connected to the connecting rod 3084. The chassis 3085 has a groove 3086 inside and the interior of the chassis 3085 is made of an adhesive material.

[0030] The process of using the moving component 308 in conjunction with the adsorption mechanism 5 to remove impurities: As the third push rod 312 drives the slider 3081 to reciprocate inside the through groove 310, the slider 3081 drives the bent rod 3082 to move, and the bent rod 3082 drives the elastic rod 3083 to move above the circuit board, preventing the circuit board from moving upward and detaching from the second placement groove 311; at the same time, the slider 3081 drives the connecting rod 3084 and the chassis 3085 to move at the bottom of the circuit board. During the movement, most of the impurities are caught, and since the inside of the chassis 3085 is made of adhesive material, the impurities are adhered and the downward movement of impurities is reduced, thus preventing them from clogging the adsorption mechanism 5.

[0031] By setting the moving components 308, when the adsorption mechanism 5 is used to remove impurities from the bottom of the circuit board, the two third push rods 312 alternately drive the two moving components 308 to move above and below the circuit board. The slider 3081 drives the elastic rod 3083 to move above the circuit board, preventing the circuit board from moving upward and detaching from the second placement slot 311; at the same time, the slider 3081 drives the connecting rod 3084 and the chassis 3085 to move at the bottom of the circuit board, receiving and adhering most of the impurities, reducing the downward movement of impurities and preventing them from clogging the adsorption mechanism 5.

[0032] The adsorption mechanism 5 also includes: The bottom box 501 is installed at the bottom of the tray 4, and a motor is installed inside the bottom box 501; There are two channels 504, which are symmetrically arranged and are located at the bottom of the base box 501. There are two fixed frames 505, which are symmetrically arranged. The fixed frames 505 are installed at the bottom of the tray 4. The replacement component 506 is located inside the fixed frames 505.

[0033] The process of using adsorption mechanism 5 to remove impurities from the bottom of the circuit board: As the feeding mechanism 3 moves the circuit board above the adsorption mechanism 5, the lifting assembly 503 removes impurities from the bottom of the circuit board.

[0034] The process of using adsorption mechanism 5 to perform negative pressure adsorption on the bottom of the circuit board: As the feeding mechanism 3 drives the circuit board to contact the adsorption mechanism 5, the lifting assembly 503 applies negative pressure to the bottom of the circuit board. The lifting assembly 503 then checks whether the negative pressure adsorption at the four positions is stable. If unstable, the replacement assembly 506 is used for processing.

[0035] By incorporating the adsorption mechanism 5, impurities on the bottom of the circuit board are removed before negative pressure adsorption. Impurities on the bottom of the circuit board can affect its flatness, which in turn affects the stability of the negative pressure adsorption and consequently the accuracy of the placement. Therefore, the adsorption mechanism 5 is designed to remove impurities from the bottom of the circuit board, preventing them from interfering with the placement process.

[0036] Lifting assembly 503 includes: The lifting column 5031 is configured as an electric push rod. The lifting column 5031 is connected to the output end of the motor and to the disc 502. A ventilation pipe is installed on the outside of the disc 502 and is connected to an external fan. A connecting box 5032 is installed on the outside of the disc 502. A second ventilation opening is provided inside the connecting box 5032. The disc 502 is connected to the connecting box 5032. A connecting plate 5033 is installed at the bottom of the connecting box 5032, and a communication port is provided inside the connecting plate 5033; The connecting tube 5035 penetrates the interior of the connecting plate 5033. An adsorption head 5034 is installed on the top of the connecting tube 5035, and the connecting tube 5035 is connected to the vacuum generator.

[0037] The process of using lifting assembly 503 to remove impurities from the bottom of the circuit board: When the lifting column 5031 is activated, it drives the disc 502, connecting box 5032, and connecting plate 5033 to move upward. At this time, the connecting plate 5033 is above the adsorption head 5034. The motor is started, and the motor drives the lifting column 5031 to rotate, which in turn drives the disc 502, connecting box 5032, and connecting plate 5033 to rotate. The external fan is started, and the gas enters the disc 502 through the ventilation pipe, then enters the connecting box 5032 through the disc 502, and moves upward to the bottom of the circuit board through the first ventilation port in the disc 502 and the second ventilation port in the connecting box 5032, promoting the movement of impurities at the bottom of the circuit board.

[0038] The process of using lifting assembly 503 to apply negative pressure adsorption to the bottom of the circuit board: After impurity removal, the motor is turned off, and the lifting column 5031 is adjusted to its initial stroke. The adsorption head 5034 is positioned in the connecting port within the connecting plate 5033, and the height of the adsorption head 5034 is consistent with the height of the upper surface of the disc 502. As the circuit board contacts the adsorption head 5034 downwards, the vacuum generator is activated, and the adsorption head 5034 begins to adsorb the bottom of the circuit board under negative pressure.

[0039] The external fan is then restarted, and the gas moves upward through the connection box 5032. The worker observes whether the four corners of the circuit board are floating. If any floating occurs, the corresponding position is adjusted using the replacement component 506.

[0040] By setting up the lifting component 503, airflow is used to remove impurities from the bottom of the circuit board before negative pressure adsorption is applied. With the assistance of the moving component 308, this promotes the removal of impurities from the bottom of the circuit board, thus preventing unevenness due to impurities. After negative pressure adsorption, airflow is used to check whether the four corners of the circuit board are fixed and stable.

[0041] Replacement component 506 includes: The first outer frame 5061 is slidably connected to the inside of the fixed frame 505. There are four first outer frames 5061, and four connecting tubes 5035 are located in the four first outer frames 5061. The second lifting rod 5063 is configured as an electric push rod, and the telescopic end of the second lifting rod 5063 is connected to the first outer frame 5061. The first slide plate 5064 is installed below the second lifting rod 5063. The first slide plate 5064 is slidably connected to the inside of the base box 501 and is driven by the power system to move within the base box 501. The second outer frame 5062 is slidably connected to the inside of the fixed frame 505. There are four second outer frames 5062, and four connecting tubes 5035 are located in the four second outer frames 5062. The third lifting rod 5065 is configured as an electric push rod, and the telescopic end of the third lifting rod 5065 is connected to the second outer frame 5062. The second slide plate 5066 is installed below the third lifting rod 5065. The second slide plate 5066 is slidably connected to the inside of the base box 501 and is driven by the power system to move within the base box 501.

[0042] The process of re-secure the circuit board in unstable positions using replacement component 506: In the initial state, the suction head 5034 at the top of the connecting tube 5035 in the second outer frame 5062 is attached to the bottom of the circuit board and fixed. The third lifting rod 5065 at the bottom of the second outer frame 5062 is in the open state, and the second lifting rod 5063 at the bottom of the first outer frame 5061 is in the closed state.

[0043] When it is necessary to replace the connecting tube 5035 and the suction head 5034, adjust the third lifting rod 5065 to its initial state. The third lifting rod 5065 drives the second outer frame 5062, the connecting tube 5035, and the suction head 5034 to move downwards. Then, the power system drives the second sliding plate 5066 to move, reserving working space for the first sliding plate 5064. Subsequently, the power system drives the first sliding plate 5064 to move, which in turn drives the second lifting rod 5063 and the first outer frame 5061 to move. The second lifting rod 5063 is then activated, causing the first outer frame 5061, the connecting tube 5035, and the suction head 5034 to move upwards. The suction head 5034 gradually contacts the bottom of the circuit board through the connecting port in the connecting plate 5033, completing the replacement of the connecting tube 5035 and the suction head 5034.

[0044] By setting up the replacement component 506, it is possible that the suction head 5034 becomes clogged after prolonged use, causing it to become unstable and not securely fixed to the circuit board. This problem is difficult to detect before surface mount technology (SMT) assembly. By using the lifting component 503 and the replacement component 506 to check the stability of the suction head 5034 and circuit board via airflow, the replacement component 506 is used to replace the connecting tube 5035 and the suction head 5034 at the unstable points, thus resolving the aforementioned issue.

[0045] Working principle: Before using the equipment, open the lifting door of the machine body 1 and activate the second push rod 306. The second push rod 306 drives the placement rack 307 to move away from the machine body 1, allowing the worker to place the circuit board to be mounted into the second placement slot 311. Then, adjust the second push rod 306 to its initial state, with the circuit board above the tray 4. Adjust the stroke of the first lifting rod 304, and the circuit board moves closer to the tray 4.

[0046] Then, the adsorption mechanism 5 is activated to perform airflow to remove impurities from the bottom of the patch. After airflow to remove impurities, the adsorption mechanism 5 is used to perform negative pressure adsorption on the bottom of the circuit board.

[0047] When the lifting column 5031 is activated, it drives the disc 502, connecting box 5032, and connecting plate 5033 to move upward. At this time, the connecting plate 5033 is above the adsorption head 5034. The motor is started, and the motor drives the lifting column 5031 to rotate, which in turn drives the disc 502, connecting box 5032, and connecting plate 5033 to rotate. The external fan is started, and the gas enters the disc 502 through the ventilation pipe, then enters the connecting box 5032 through the disc 502, and moves upward to the bottom of the circuit board through the first ventilation port in the disc 502 and the second ventilation port in the connecting box 5032, promoting the movement of impurities at the bottom of the circuit board.

[0048] During the impurity removal process, the two third push rods 312 are alternately activated to the reciprocating motion mode. The two third push rods 312 take turns driving the two moving components 308 to move above and below the circuit board.

[0049] As the third push rod 312 drives the slider 3081 to reciprocate inside the through groove 310, the slider 3081 drives the bent rod 3082 to move, and the bent rod 3082 drives the elastic rod 3083 to move above the circuit board, preventing the circuit board from moving upward and detaching from the second placement groove 311; at the same time, the slider 3081 drives the connecting rod 3084 and the chassis 3085 to move at the bottom of the circuit board. During the movement, most of the impurities are caught, and since the inside of the chassis 3085 is made of adhesive material, the impurities are adhered and the downward movement of impurities is reduced, thus preventing them from clogging the adsorption mechanism 5.

[0050] After impurity removal, the motor is turned off, and the lifting column 5031 is adjusted to its initial stroke. The adsorption head 5034 is positioned in the connecting port within the connecting plate 5033, and the height of the adsorption head 5034 is consistent with the height of the upper surface of the disc 502. As the circuit board contacts the adsorption head 5034 downwards, the vacuum generator is activated, and the adsorption head 5034 begins to adsorb the bottom of the circuit board under negative pressure.

[0051] The external fan is then restarted, and the gas moves upward through the connection box 5032. The worker observes whether the four corners of the circuit board are floating. If any floating occurs, the corresponding position is adjusted using the replacement component 506.

[0052] When it is necessary to replace the connecting tube 5035 and the suction head 5034, adjust the third lifting rod 5065 to its initial state. The third lifting rod 5065 drives the second outer frame 5062, the connecting tube 5035, and the suction head 5034 to move downwards. Then, the power system drives the second sliding plate 5066 to move, reserving working space for the first sliding plate 5064. Subsequently, the power system drives the first sliding plate 5064 to move, which in turn drives the second lifting rod 5063 and the first outer frame 5061 to move. The second lifting rod 5063 is then activated, causing the first outer frame 5061, the connecting tube 5035, and the suction head 5034 to move upwards. The suction head 5034 gradually contacts the bottom of the circuit board through the connecting port in the connecting plate 5033, completing the replacement of the connecting tube 5035 and the suction head 5034.

[0053] Start machine 1 to perform surface mount technology (SMT) on the circuit board. After SMT, adjust the adsorption mechanism 5 and the feeding mechanism 3 to send the SMT-mounted circuit board out of machine 1.

[0054] After the surface mount process, the stroke of the first lifting rod 304 is adjusted. The first lifting rod 304 drives the connecting frame 305, the second push rod 306 and the placement frame 307 to move upward, separating the circuit board from the adsorption mechanism 5. The second push rod 306 is then activated, driving the placement frame 307 to move away from the machine body 1, allowing the worker to retrieve the circuit board.

[0055] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A circuit board mounting device without a pressure plate, comprising a body (1), characterized in that, Also includes: A central column (2) is installed inside the body (1); Tray (4), said tray (4) is installed inside the body (1); The feeding mechanism (3) is installed outside the central column (2). The feeding mechanism (3) includes a second push rod (306). A placement frame (307) is provided outside the second push rod (306). A moving component (308) is provided inside the placement frame (307). The second push rod (306) is used to control the placement frame (307) and the moving component (308) to enter and exit the machine body (1). Adsorption mechanism (5) is arranged above tray (4). Adsorption mechanism (5) includes disc (502). A lifting component (503) is arranged outside the disc (502). A replacement component (506) is arranged below the lifting component (503).

2. The circuit board mounting device without pressure plate according to claim 1, characterized in that: The feeding mechanism (3) further includes: Two backrests (301) are provided, and the two backrests (301) are respectively installed at both ends of the central column (2). The backrests (301) are connected to the body (1). The first push rod (302) is mounted on the outside of the back plate (301); The movable ring (303) is connected to the telescopic end of the first push rod (302) and is slidably connected to the outside of the central column (2).

3. The circuit board mounting device without pressure plate according to claim 2, characterized in that: The feeding mechanism (3) further includes: The first lifting rod (304) is installed at the bottom of the moving ring (303); A connecting frame (305) is connected to the telescopic end of the first lifting rod (304), and a second push rod (306) is installed on the outside of the connecting frame (305).

4. The circuit board mounting device without pressure plate according to claim 3, characterized in that: The feeding mechanism (3) further includes: The first placement slot (309) is opened inside the placement rack (307). There are two first placement slots (309) and they are arranged symmetrically. The second placement slot (311) is opened inside the placement rack (307) and is used to place raw materials; A through slot (310) is formed inside the placement frame (307), and a third push rod (312) is installed inside the through slot (310). The moving component (308) is connected to the telescopic end of the third push rod (312).

5. The circuit board mounting device without pressure plate according to claim 4, characterized in that: The moving component (308) includes: The slider (3081) is slidably connected inside the through groove (310), and the slider (3081) is connected to the telescopic end of the third push rod (312); A bent rod (3082) is mounted on the outside of the slider (3081); An elastic rod (3083) is connected to a bent rod (3082).

6. The circuit board mounting device without pressure plate according to claim 5, characterized in that: The moving component (308) also includes: A connecting rod (3084) is mounted on the outside of the slider (3081); The chassis (3085) is connected to the connecting rod (3084), and the chassis (3085) has a groove (3086) inside.

7. The circuit board mounting device without pressure plate according to claim 1, characterized in that: The adsorption mechanism (5) further includes: A base box (501) is installed at the bottom of the tray (4), and a motor is installed inside the base box (501); A channel (504) is provided at the bottom of the base box (501); A fixing frame (505) is installed at the bottom of the tray (4), and the replacement component (506) is disposed inside the fixing frame (505).

8. The circuit board mounting device without pressure plate according to claim 7, characterized in that: The lifting assembly (503) includes: A lifting column (5031) is connected to the output end of a motor and to a disc (502). A ventilation pipe is installed on the outside of the disc (502). A connecting box (5032) is mounted on the outside of the disc (502); A connecting plate (5033) is installed at the bottom of the connecting box (5032); A connecting tube (5035) penetrates the interior of a connecting plate (5033), and an adsorption head (5034) is installed on the top of the connecting tube (5035).

9. The circuit board mounting device without pressure plate according to claim 8, characterized in that: The replacement component (506) includes: The first outer frame (5061) is slidably connected to the inside of the fixed frame (505); The second lifting rod (5063) has its telescopic end connected to the first outer frame (5061); The first slide plate (5064) is installed below the second lifting rod (5063) and is slidably connected to the inside of the base box (501); The second outer frame (5062) is slidably connected to the inside of the fixed frame (505); The third lifting rod (5065) has its telescopic end connected to the second outer frame (5062); The second slide plate (5066) is installed below the third lifting rod (5065) and is slidably connected to the inside of the base box (501).

Images