Etching device of display driving semiconductor chip
By using an etching device with an adsorption component and a flexible contact design, the problem of wafer surface scratches has been solved, achieving high-precision etching and low-cost operation, and improving the stability and safety of wafer etching.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-15
- Publication Date
- 2026-04-10
AI Technical Summary
Existing etching equipment, which uses rigid clamping or manual hand-holding, is prone to scratching or leaving marks on the top surface of the wafer, affecting subsequent packaging and chip performance.
It employs an adsorption component and flexible contact design, combining negative pressure adsorption with mechanical clamping to avoid damage caused by direct contact, and removes dust through roller brushes and transmission brushes to ensure etching accuracy and consistency.
It effectively protects the integrity of the wafer surface, reduces displacement errors and dust interference, improves etching accuracy and equipment applicability, and reduces equipment changeover costs and operational complexity.
Smart Images
Figure CN121843440A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to an etching device for display driving semiconductor chip. BACKGROUND
[0002] As the core control component of display panel, the process precision of display driving semiconductor chip directly determines the resolution, response speed and power consumption performance of display device. Etching process is a key link for realizing fine formation of circuit pattern in chip manufacturing, and puts forward high requirements for etching size precision, wafer surface integrity and process stability. With the development of display technology towards ultra-high definition and miniaturization, the circuit line width of chip is continuously reduced, and the error tolerance of etching process is continuously reduced. The traditional etching device gradually exposes many technical defects, and it is difficult to meet the manufacturing needs of high-performance chips.
[0003] However, the existing device is mostly rigidly clamped or manually held and placed in the device. The rigid clamping is easy to cause indentation and scratches on the sidewall of the wafer, damaging the passivation layer on the wafer surface. The fixing stability of manual holding is insufficient, and the wafer etching surface is easy to leave marks during the holding process. In addition, the support structure of some devices directly contacts the wafer surface, which is easy to cause scratches or residual marks on the top surface of the wafer, affecting the subsequent packaging and overall performance of the chip. SUMMARY
[0004] The technical problem to be solved by the present application is to provide an etching device for display driving semiconductor chip to solve the problem that the existing device is mostly rigidly clamped or manually held and placed in the device, which is easy to cause scratches or residual marks on the top surface of the wafer, affecting the subsequent packaging and overall performance of the chip.
[0005] To solve the above technical problems, the present application provides the following technical solutions: An etching device for display driving semiconductor chip, comprising a body, a suction assembly is arranged at the front end of the body, and a moving assembly is arranged at the bottom of the suction assembly. The suction assembly comprises a top cover, a rotating disc is rotatably connected to the top of the top cover, a servo motor one is fixedly installed at the center position of the top of the rotating disc, a rotating shaft one is rotatably connected to the top of the rotating disc, a connecting rod is fixedly installed on the outer side of the rotating shaft one, a rotating shaft two is fixedly installed at the other end of the connecting rod, and a clamping rod is rotatably connected to the bottom of the rotating shaft two.
[0006] Optionally, sliding grooves are formed in the periphery of the top cover, the sliding grooves are slidably connected to the top of the clamping rod, a bottom shell is fixedly installed at the center position of the bottom of the top cover, and a rectangular groove is formed in the top of the bottom shell.
[0007] Optionally, the rectangular groove top is provided with a dust cover, the dust cover is fixedly connected with the inner wall of the bottom shell, a servo motor two is fixedly installed on the side wall of the dust cover, a rolling brush is fixedly installed on the output end of the servo motor two, the rolling brush is located in the rectangular groove, a belt is sleeved on the side wall of the rolling brush, and a transmission brush is driven connected with the belt.
[0008] Optionally, a dust suction pipe is fixedly installed on the top of the dust cover, a dust suction pump is fixedly installed on the other end of the dust suction pipe, the dust suction pump is fixedly connected with the side wall of the bottom shell, a negative pressure pump one is arranged at the bottom of the dust suction pump, and the negative pressure pump one is fixedly connected with the side wall of the bottom shell.
[0009] Optionally, the top cover is fixedly connected with a protection cover, and the protection cover is fixedly connected with a supporting rod.
[0010] Optionally, the supporting rod is fixedly connected with a rotating seat on one side, and the rotating seat is fixedly connected with a Z-axis sliding seat on the other side.
[0011] Optionally, the moving assembly comprises an X-axis sliding seat, the X-axis sliding seat is slidably connected with a Y-axis sliding seat at the top, and the Y-axis sliding seat is fixedly connected with a supporting disc at the top center position.
[0012] Optionally, a negative pressure pipe is fixedly inserted into the supporting disc at the top center position, and a negative pressure pump two is fixedly connected with the other end of the negative pressure pipe.
[0013] Optionally, the body comprises a workbench, the workbench is provided with a supporting table at the top, and the supporting table is fixedly installed with a laser module at the bottom.
[0014] Optionally, the workbench is fixedly connected with the negative pressure pump two on the side wall, and the workbench is fixedly connected with the Z-axis sliding seat on the top side wall.
[0015] Compared with the prior art, the application has at least the following advantages: in the above scheme, the rolling brush, the transmission brush and the clamping rod are arranged, a multiple damage prevention design is adopted, when the wafer is adsorbed through the channel at the bottom of the bottom shell, only the flexible brush body is in contact with the top of the wafer, surface scratches caused by direct friction of the bottom shell or the clamp are avoided, and at the same time, the non-contact / soft contact fixing mode of negative pressure adsorption and mechanical clamping is adopted to replace the traditional manual or rigid grabbing, so that marks or damage on the wafer surface are avoided, the original quality of the wafer is guaranteed, and a basis guarantee for subsequent etching and chip performance is provided.
[0016] By setting the adsorption assembly, the servo motor two drives the rolling brush and the transmission brush to rotate synchronously, which can remove dust and pollutants in the bottom of the bottom shell and the wafer contact area in advance. The dust suction pump can suck the dust generated during the cleaning process through the dust suction pipe in real time. At the same time, the dust cover effectively blocks the external dust from entering the etching related area, thereby reducing the dust interference on the etching path from the source. In addition, the horizontal precise displacement of the X-axis sliding seat and the Y-axis sliding seat, the height fine adjustment of the Z-axis sliding seat, and the angle adaptation of the rotating seat ensure that the wafer to be etched area is always accurately aligned with the laser module, greatly reducing the etching deviation caused by displacement error and dust interference, and improving the size precision and consistency of chip etching.
[0017] By setting the clamping rod and the negative pressure pump one, the negative pressure pump one generates negative pressure to adsorb the wafer through the bottom shell channel, and the clamping rod is tightly attached to the side wall for limiting, which effectively avoids the displacement of the wafer due to movement or vibration. The clamping rod can move synchronously towards the center of the circle along the sliding groove around the top cover, and the clamping distance can be adjusted by the driving of the servo motor one, which can adapt to wafers of different diameters without the need to replace special fixtures, thereby reducing the equipment change cost and operation complexity. At the same time, the negative pressure adsorption structure (negative pressure pump one and negative pressure pump two) can be adjusted by air pressure to adapt to wafers of different thicknesses, further expanding the application scenarios of the device and improving the utilization rate of the equipment. The device is equipped with a protective cover to protect the internal transmission assembly, the surface of the support disc is made of elastic material, and the negative pressure pipe is made of elastic hose to meet the movement requirements, which not only protects the core components of the equipment, but also reduces the risk of wafer falling during transfer and etching, thereby improving the safety and stability of the overall operation. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 FIG. 1 is a schematic diagram of the overall structure of the etching device for driving semiconductor chips; Figure 2 FIG. 2 is a schematic diagram of the overall bottom view structure of the etching device for driving semiconductor chips; Figure 3 FIG. 3 is a schematic diagram of the moving assembly and the workbench structure; Figure 4 FIG. 4 is a schematic diagram of the adsorption assembly structure; Figure 5 FIG. 5 is a schematic diagram of the protective cover, top cover, rotating disc, rotating shaft two, bottom shell and clamping rod structure; Figure 6 FIG. 6 is a schematic diagram of the top cover, rotating disc, rotating shaft two, servo motor one, sliding groove, servo motor two, rolling brush, belt, bottom shell and clamping rod structure; Figure 7 FIG. 7 is a schematic diagram of the rotating disc, rotating shaft two, servo motor one, sliding groove, servo motor two, dust suction pump, negative pressure pump one, dust suction pipe, bottom shell and clamping rod structure; Figure 8 FIG. 8 is a schematic diagram of the bottom shell, dust cover, rolling brush, transmission brush and rectangular groove cross-sectional structure.
[0019] Figure label: 100. Main body; 101. Worktable; 102. Support platform; 103. Laser module; 110. Adsorption assembly; 111. Top cover; 112. Rotating disk; 113. Servo motor one; 114. Rotating shaft one; 115. Connecting rod; 116. Rotating shaft two; 117. Clamping rod; 118. Sliding groove; 119. Bottom shell; 120. Rectangular groove; 121. Dust cover; 122. Servo motor... Serving motor II; 123. Roller brush; 124. Belt; 125. Transmission brush; 126. Suction pipe; 127. Suction pump; 128. Negative pressure pump I; 129. Protective cover; 130. Support rod; 131. Rotating seat; 132. Z-axis slide; 140. Moving assembly; 141. X-axis slide; 142. Y-axis slide; 143. Support plate; 144. Negative pressure pipe; 145. Negative pressure pump II. Detailed Implementation
[0020] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structure, features and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.
[0021] like Figures 1 to 8As shown, an embodiment of the present invention provides an etching apparatus for a display driving semiconductor chip, including a body 100, an adsorption assembly 110 at the front end of the body 100, and a moving assembly 140 at the bottom of the adsorption assembly 110; the adsorption assembly 110 includes a top cover 111, a rotating disk 112 rotatably connected to the top of the top cover 111, a servo motor 113 fixedly mounted at the center of the top of the rotating disk 112, a rotating shaft 114 rotatably connected to the top periphery of the rotating disk 112, a connecting rod 115 fixedly mounted on the outer side of the rotating shaft 114, a rotating shaft 116 fixedly mounted at the other end of the connecting rod 115, a clamping rod 117 rotatably connected to the bottom of the rotating shaft 116, and a sliding groove 118 formed around the top cover 111, the sliding groove 118 and the clamping rod 117 being connected to the top cover 111. The top of the handle 117 is slidably connected, and a bottom shell 119 is fixedly installed at the center of the bottom of the top cover 111. A rectangular groove 120 is opened on the top of the bottom shell 119, and a dust cover 121 is installed on the top of the rectangular groove 120. The dust cover 121 is fixedly connected to the inner wall of the bottom shell 119. A servo motor 122 is fixedly installed on the side wall of the dust cover 121. A roller brush 123 is fixedly installed at the output end of the servo motor 122. The roller brush 123 is located in the rectangular groove 120. A belt 124 is sleeved on the side wall of the roller brush 123. A drive brush 125 is driven by the belt 124. A suction pipe 126 is fixedly installed on the top of the dust cover 121. A suction pump 127 is fixedly installed at the other end of the suction pipe 126. The suction pump 127 is fixedly connected to the side wall of the bottom shell 119. A negative pressure pump 128 is installed at the bottom, and is fixedly connected to the side wall of the bottom shell 119. A protective cover 129 is fixedly connected to the top of the top cover 111, and a support rod 130 is fixedly connected to the top of the protective cover 129. A rotating seat 131 is fixedly connected to one side of the support rod 130, and a Z-axis slide 132 is fixedly connected to the other side of the rotating seat 131. The servo motor 113 can drive the rotating disk 112 to rotate, which in turn drives the rotating shaft 114 to rotate. This causes the connecting rod 115 to drive the rotating shaft 116 to move, thereby allowing the rotating shaft 116 to move the clamping rod 117 within the sliding groove 118. This allows the clamping rod 115 to clamp the wafer, enabling the clamping of wafers of different sizes. The inner side of the rod 117 is made of silicone to prevent damage to the wafer sidewalls. The sliding groove 118 limits the movement of the clamping rod 117, allowing it to move towards the center of the top cover 111. The bottom shell 119 supports and fixes the dust cover 121. The dust pump 127 uses the suction pipe 126 to remove dust from the bottom of the dust cover 121 and the surface of the roller brush 123, preventing it from affecting wafer etching. The roller brush 123 and the drive brush 125 are made of silicone and protrude from the rectangular groove 120 at the bottom to prevent the top surface of the wafer from directly contacting the bottom surface of the bottom shell 119, thus preventing damage to the wafer surface. The bottom of the bottom shell 119 has multiple grooves that allow the negative pressure pump 128 to draw air from it, thereby adsorbing the wafer.The wafer is moved upwards to align with the roller brush 123 and the transmission brush 125. The protective cover 129 supports and fixes the top cover 111. The control center can cause the rotating seat 131 to drive the support rod 130 and the protective cover 129 to deflect outwards, thereby making the bottom support plate 143 contact the laser emitted by the top laser module 103. The Z-axis slide 132, through the control center, can drive the support rod 130, the protective cover 129, the top cover 111, and the bottom shell 119 to move up and down, thereby making the wafer adsorbed below the bottom shell 119 contact the support plate 143.
[0022] like Figures 1 to 3 As shown, the moving component 140 includes an X-axis slide 141, a Y-axis slide 142 slidably connected to the top of the X-axis slide 141, a support plate 143 fixedly connected to the center of the top of the Y-axis slide 142, a negative pressure pipe 144 fixedly inserted into the center of the top of the support plate 143, and a negative pressure pump 145 fixedly connected to the other end of the negative pressure pipe 144. The main body 100 includes a worktable 101, a support platform 102 on the top of the worktable 101, a laser module 103 fixedly installed at the bottom of the support platform 102, a side wall of the worktable 101 fixedly connected to the negative pressure pump 145, and a top side wall of the worktable 101 fixedly connected to the Z-axis slide 132. The X-axis slide 141 can drive the Y-axis slide 142 and the support plate 143 to move left and right through the control center. The Y-axis slide 142 can also move the support plate 143 back and forth on the X-axis slide 141 through the control center, so that the wafer on the support plate 143 is always aligned with the laser emitted by the laser module 103. The negative pressure tube 144 is a flexible tube to accommodate the movement of the support plate 143. The surface of the support plate 143 is made of elastic material to prevent damage to the wafer. The negative pressure pump 145 evacuates air from the top of the support plate 143 through the negative pressure tube 144, thereby adsorbing the wafer and making the wafer move synchronously with the support plate 143.
[0023] The working principle of the technical solution provided by this invention is as follows: After the device is started, servo motor 122 starts, and its output drives the roller brush 123 to rotate. The roller brush 123 drives the transmission brush 125 to rotate synchronously through belt 124. The roller brush 123 and transmission brush 125 roll on the bottom of the bottom shell 119 to remove dust and other contaminants. At the same time, the dust pump 127 starts and generates suction through the suction pipe 126 on the top of the dust cover 121 to suck in and discharge the dust generated during the rolling cleaning process in a timely manner, so as to prevent dust from adhering or entering the etching area and affecting the etching accuracy. The dust cover 121 effectively prevents external dust from entering the rectangular groove 120. Then, the Z-axis slide 132 drives the support rod 130, the protective cover 129 and the top cover 1 according to the preset parameters. The components 11 and 12 move downwards, bringing the bottom shell 119 close to the support plate 143 of the moving assembly 140. At this time, the negative pressure pump 128 starts, generating negative pressure through multiple channels at the bottom of the bottom shell 119, adsorbing the wafer to be etched to the bottom shell 119. Simultaneously, the top of the wafer contacts the roller brush 123 and transmission brush 125 in the rectangular groove 120 to prevent damage or marks on the top surface of the wafer caused by manual or machine handling, which would affect subsequent etching. Then, the servo motor 113 starts, driving the rotating disk 112 to rotate. The rotating disk 112 drives the rotating shafts 114 around it to rotate synchronously. The rotating shafts 114 pull the rotating shaft 116 through the connecting rod 115, causing the clamping rod 116 to move. 17. The clamping rod 117 moves along the sliding groove 118 around the top cover 111 towards the center of the top cover 111 until the inner side of the clamping rod 117 is tightly attached to the side wall of the wafer, completing the double fixation of the wafer and ensuring that the wafer does not shift during subsequent etching. It also adapts to wafers of different sizes. Then, the control center controls the rotating seat 131 to drive the support rod 130 and the protective cover 129 to deflect outward, so that the wafer fixed under the bottom shell 119 is completely exposed to the irradiation range of the laser module 103. At the same time, the Z-axis slide 132 finely adjusts the height of the top cover 111 assembly to place the wafer at the optimal distance required for etching. Then, the negative pressure pump 145 is started, generating negative pressure through the negative pressure pipe 144 at the top center of the support plate 143. At this time, the negative pressure... Pump 128 stops working, clamping rod 117 is reset and released under the reverse drive of servo motor 113, and the wafer is smoothly transferred to the top of support plate 143 under negative pressure and is attracted and fixed. Then, according to the etching path planning, X-axis slide 141 drives Y-axis slide 142 and support plate 143 to move in the horizontal X direction, and Y-axis slide 142 drives support plate 143 to move in the horizontal Y direction, realizing the precise displacement of the wafer in the horizontal plane, ensuring that the area to be etched on the wafer is always aligned with the laser module 103 at the bottom of support platform 102 of body 100. After etching is completed, laser module 103 stops working, and X-axis slide 141 and Y-axis slide 142 drive support plate 143 to reset to the initial position.Negative pressure pump 145 stops working, releasing the wafer from adsorption; at the same time, Z-axis slide 132 drives top cover 111 assembly to move downward, negative pressure pump 128 restarts to adsorb the wafer, clamping rod 117 re-clamps the wafer, rotating seat 131 drives top cover 111 assembly to deflect and reset, and finally Z-axis slide 132 rises to facilitate subsequent unloading operations, completing one etching cycle.
[0024] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.
Claims
1. An etching apparatus for a display driver semiconductor chip, characterized in that, Includes a body (100), the front end of which is provided with an adsorption component (110), and the bottom of which is provided with a moving component (140). The adsorption assembly (110) includes a top cover (111), a rotating disk (112) is rotatably connected to the top of the top cover (111), a servo motor (113) is fixedly installed at the center of the top of the rotating disk (112), a rotating shaft (114) is rotatably connected around the top of the rotating disk (112), a connecting rod (115) is fixedly installed on the outside of the rotating shaft (114), a rotating shaft (116) is fixedly installed at the other end of the connecting rod (115), and a clamping rod (117) is rotatably connected to the bottom of the rotating shaft (116).
2. The etching apparatus for a display driving semiconductor chip according to claim 1, characterized in that, The top cover (111) has a sliding groove (118) around its perimeter. The sliding groove (118) is slidably connected to the top of the clamping rod (117). A bottom shell (119) is fixedly installed at the center of the bottom of the top cover (111). A rectangular groove (120) is provided on the top of the bottom shell (119).
3. The etching apparatus for a display driving semiconductor chip according to claim 2, characterized in that, The top of the rectangular groove (120) is provided with a dust cover (121), the dust cover (121) is fixedly connected to the inner wall of the bottom shell (119), a servo motor (122) is fixedly installed on the side wall of the dust cover (121), a roller brush (123) is fixedly installed at the output end of the servo motor (122), the roller brush (123) is located in the rectangular groove (120), a belt (124) is sleeved on the side wall of the roller brush (123), and a transmission brush (125) is driven by the belt (124).
4. The etching apparatus for a display driving semiconductor chip according to claim 3, characterized in that, A suction pipe (126) is fixedly installed on the top of the dust cover (121), and a suction pump (127) is fixedly installed at the other end of the suction pipe (126). The suction pump (127) is fixedly connected to the side wall of the bottom shell (119). A negative pressure pump (128) is provided at the bottom of the suction pump (127), and the negative pressure pump (128) is fixedly connected to the side wall of the bottom shell (119).
5. The etching apparatus for a display driving semiconductor chip according to claim 1, characterized in that, The top cover (111) is fixedly connected to a protective cover (129), and the top of the protective cover (129) is fixedly connected to a support rod (130).
6. The etching apparatus for a display driving semiconductor chip according to claim 5, characterized in that, A rotating seat (131) is fixedly connected to one side of the support rod (130), and a Z-axis slide (132) is fixedly connected to the other side of the rotating seat (131).
7. The etching apparatus for a display driving semiconductor chip according to claim 1, characterized in that, The moving component (140) includes an X-axis slide (141), a Y-axis slide (142) is slidably connected to the top of the X-axis slide (141), and a support plate (143) is fixedly connected to the center of the top of the Y-axis slide (142).
8. The etching apparatus for a display driving semiconductor chip according to claim 7, characterized in that, A negative pressure pipe (144) is fixedly inserted at the top center of the support plate (143), and a negative pressure pump (145) is fixedly connected to the other end of the negative pressure pipe (144).
9. The etching apparatus for a display driving semiconductor chip according to claim 1, characterized in that, The main body (100) includes a workbench (101), a support platform (102) is provided on the top of the workbench (101), and a laser module (103) is fixedly installed on the bottom of the support platform (102).
10. The etching apparatus for a display driving semiconductor chip according to claim 9, characterized in that, The side wall of the worktable (101) is fixedly connected to the negative pressure pump (145), and the top side wall of the worktable (101) is fixedly connected to the Z-axis slide (132).