Embedded radiator

Abstract

The invention is applicable to the field of radiators, and provides an embedded radiator, which comprises a radiating bottom plate, an embedded groove recessed inwards from the top surface of the radiating bottom plate, and a heat absorption surface arranged on the bottom surface of the embedded groove; the heat pipe is in a flat shape, the heat pipe is contained in the inlaying groove, the heat pipe comprises an evaporation section and a condensation section which are oppositely arranged, and the evaporation section is connected to the heat absorption surface; and the radiating fins are connected to the condensation sections of the heat pipes in a surface-mounted welding manner. According to the embedded radiator, the heat pipe is arranged to be flat and embedded in the embedding groove of the radiating bottom plate, and the radiating fins are welded to the heat pipe in a surface-mounted mode, so that the embedded radiator is of an integrated structure, and solder thermal resistance and air gaps can be effectively eliminated. The evaporation section of the heat pipe is directly connected to the heat absorption face of the heat dissipation bottom plate, the heat transfer path from the chip to the heat pipe can be shortened, the transverse heat resistance of the heat dissipation bottom plate is reduced, rapid activation of the heat pipe is achieved, and center heat accumulation is reduced. The heat dissipation fins and the condensation section are welded in a surface-mounted mode, contact thermal resistance between the heat dissipation fins and the condensation section can be reduced, and heat dissipation efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of heat sinks, and particularly relates to an inlaid heat sink. BACKGROUND

[0002] With the continuous improvement of the performance of electronic chips, the power consumption and heat generation of the electronic chips increase dramatically, and the unit area and heat flux density are higher and higher. The traditional air-cooled heat sink usually adopts a combination of a copper or aluminum heat dissipation base plate and a copper heat pipe to dissipate heat from the chip.

[0003] In the related art, the copper heat pipe is usually welded on the surface of the base plate by welding. There is a thermal resistance layer (solder layer or air gap) between the base plate and the copper heat pipe. Under high heat flux density, the path for heat conduction from the center of the chip to the copper heat pipe is long, and the lateral thermal resistance of the base plate is large, which causes the copper heat pipe to be unable to be fully activated, and the heat in the center area to be accumulated seriously. SUMMARY

[0004] The embodiments of the present application provide an inlaid heat sink, which can solve the technical problem that the heat pipe cannot be fully activated and the heat in the center area is accumulated seriously in the related art.

[0005] The embodiments of the present application provide an inlaid heat sink, which includes: A heat dissipation base plate having an inlaid groove recessed inward from the top surface thereof, the bottom surface of the inlaid groove being configured as a heat absorption surface; A heat pipe in a flat shape, the heat pipe being accommodated in the inlaid groove, the heat pipe including oppositely arranged evaporation and condensation sections, the evaporation section being connected to the heat absorption surface; A heat dissipation fin connected to the condensation section of the heat pipe by surface mount welding.

[0006] The inlaid heat sink provided by the embodiments of the present application is configured as an integrated structure, which can effectively eliminate the solder thermal resistance and air gap of the traditional welding. The evaporation section of the heat pipe is directly connected to the heat absorption surface of the heat dissipation base plate, which can shorten the heat conduction path from the center of the chip to the heat pipe, reduce the lateral thermal resistance of the heat dissipation base plate, realize the rapid activation of the heat pipe, and reduce the accumulation of heat in the center. The heat dissipation fin and the condensation section are surface mount welded, which can reduce the contact thermal resistance therebetween and help improve the heat dissipation efficiency.

[0007] In some embodiments, the heat pipe is inlaid in the inlaid groove in an interference fit or a micro-gap fit.

[0008] By adopting the above technical solution, the interference fit of the heat pipe and the inlaid groove can realize the close fit of the two, which can eliminate the contact gap therebetween, reduce the thermal resistance of the contact interface, and help improve the heat conduction efficiency between the evaporation section and the heat dissipation base plate. The micro-gap fit of the heat pipe and the inlaid groove facilitates the assembly and fault tolerance of the two.

[0009] In some embodiments, the heat pipe is made of a round tube by a flattening process, and the depth of the inlaid groove is 30% to 60% of the outer diameter of the heat pipe.

[0010] By adopting the above technical solution, the heat pipe is made by a flattening process, and the flat heat pipe can balance the heat pipe forming property and the internal capillary structure integrity, ensuring the phase change heat transfer efficiency of the heat pipe; the depth of the inlaid groove is 30% to 60% of the outer diameter of the heat pipe, which can not only ensure the effective contact area of the heat pipe and the heat absorption surface, but also avoid the heat pipe being embedded too deep to cause the strength of the bottom plate to decrease, which helps to balance the heat performance and mechanical reliability.

[0011] In some embodiments, the surface of the evaporation section of the heat pipe is attached to the heat absorption surface.

[0012] By adopting the above technical solution, the contact area of the evaporation section and the heat absorption surface is maximized, the interfacial contact thermal resistance is reduced, the heat transfer from the chip to the evaporation section of the heat pipe is accelerated, the activation speed of the heat pipe is improved, and the formation of local hot spots is avoided, which adapts to the rapid heat dissipation demand of the chip under high heat flux.

[0013] In some embodiments, the surface of the condensation section of the heat pipe is flush with the top surface of the heat dissipation bottom plate.

[0014] By adopting the above technical solution, the surface of the condensation section flush with the top surface of the heat dissipation bottom plate helps to ensure the flatness of the top surface of the heat sink, facilitates the subsequent surface mount welding of the heat dissipation fins, avoids the airflow disturbance and poor fin attachment caused by the protrusion or depression of the condensation section, ensures the heat dissipation efficiency of the fins, and can improve the assembly precision and structural stability of the inlaid heat sink.

[0015] In some embodiments, in the thickness direction of the heat pipe, the evaporation section is configured as the lower surface of the heat pipe, and the condensation section is configured as the upper surface of the heat pipe.

[0016] By adopting the above technical solution, the evaporation section and the condensation section are respectively configured as the lower surface and the upper surface of the heat pipe, and the upper and lower surfaces of the heat pipe are functionally divided, the lower surface of the evaporation section efficiently contacts the heat absorption surface, and the upper surface of the condensation section efficiently connects the fins, forming a directional heat transfer path of heat absorption surface-evaporation section-condensation section-fins, which can effectively reduce the transverse diffusion loss of heat in the heat pipe and improve the overall heat dissipation efficiency.

[0017] In some embodiments, the area of the heat absorption surface is greater than or equal to the area of the evaporation section.

[0018] By adopting the above technical solution, the area of ​​the heat absorption surface is greater than or equal to the area of ​​the evaporation section, ensuring that the heat absorption surface can fully cover and conduct the chip heat to the evaporation section, avoiding heat overflow or local overheating caused by insufficient heat absorption surface, improving the heat pipe's ability to absorb chip heat, adapting to the heat dissipation needs of chips of different sizes, and enhancing the versatility of the heat sink.

[0019] In some embodiments, the length of the condensation section is greater than or equal to the length of the heat dissipation fins.

[0020] By adopting the above technical solution, the length of the condensation section is greater than or equal to the length of the heat dissipation fins, which can ensure that the condensation section fits the heat dissipation fins effectively and avoid the heat dissipation fins from exceeding the condensation section, thus preventing uneven heat transfer and helping to improve the overall heat dissipation efficiency of the heat dissipation fins.

[0021] In some embodiments, the width of the heat dissipation fins is greater than the width of the condensation section.

[0022] By adopting the above technical solution, the width of the heat dissipation fins exceeds the width of the condensation section, which can increase the air convection heat dissipation area and improve the heat dissipation capacity of the embedded heat sink; at the same time, the edge of the fins can cover part of the top surface of the heat dissipation base plate, assisting the heat dissipation base plate in heat dissipation, which helps to further improve the heat dissipation efficiency of the embedded heat sink.

[0023] In some embodiments, the heat dissipation fins are supported by a condensation section and a heat dissipation base plate.

[0024] By adopting the above technical solution, the condensation section and the heat dissipation base plate jointly support the heat dissipation fins, which can improve the structural rigidity of the heat dissipation fins and avoid fin deformation or breakage caused by high-speed airflow or assembly stress. At the same time, it can disperse the load of the fins on the heat pipe, protect the capillary structure and sealing performance of the heat pipe, and help extend the service life of the embedded heat sink. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Fig. 1 This is a schematic diagram of the structure of an embedded heat sink provided in one embodiment of this application; Fig. 2 This is an exploded structural diagram of an embedded heat sink provided in one embodiment of this application. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0028] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] Please see Figs. 1-2 This application provides an embedded heat sink 100, which includes a heat sink base plate 10, a heat pipe 20 and heat sink fins 30.

[0032] The heat sink base plate 10 is constructed as a flat plate structure. The heat sink base plate 10 is located at the bottom of the embedded heat sink 100. The heat sink base plate 10 has an inset groove 11 recessed inward from its top surface. The bottom surface of the inset groove 11 is constructed as a heat-absorbing surface 12. The heat-absorbing surface 12 can contact the chip and is used to conduct heat from the chip. That is, the heat generated by the chip can be conducted to the heat sink base plate 10 through the heat-absorbing surface 12.

[0033] Heat pipe 20 is a heat-conducting element based on the principle of phase change heat transfer. Its overall structure is a sealed cavity. The heat pipe 20 contains a low-boiling-point liquid (e.g., plasma water, ethanol, acetone, liquid nitrogen, etc.). Heat pipe 20 achieves efficient heat transfer through a continuous phase change cycle of internal liquid vaporization-vapor migration-vapor condensation-liquid recirculation.

[0034] The heat pipe 20 is flat and is housed in the mounting groove 11. The heat pipe 20 includes an evaporation section 21 and a condensation section 22 arranged opposite to each other.

[0035] The heat dissipation fins 30 are surface-mounted to the condensation section 22 of the heat pipe 20. There are multiple heat dissipation fins 30, and the multiple heat dissipation fins 30 are evenly spaced and fixed to the condensation section 22 by surface mounting.

[0036] Evaporation section 21 is connected to heat absorption surface 12. Evaporation section 21 is the end of heat pipe 20 that contacts the heat source (chip). The heat from the heat source is transferred to the liquid medium inside heat pipe 20 through evaporation section 21. After absorbing heat, the liquid medium rapidly vaporizes and expands in volume to produce steam. Under the action of pressure difference, the steam flows rapidly from evaporation section 21 to the other end of heat pipe 20, namely condensation section 22. After the steam reaches condensation section 22, it comes into contact with heat dissipation structures such as heat dissipation fins 30 of the heat sink, releases heat and condenses into liquid. The condensed liquid flows back to evaporation section 21 under the action of capillary structure inside heat pipe 20, completing one cycle and continuously transferring heat.

[0037] The embedded heat sink 100 provided in this embodiment has a flat heat pipe 20 embedded in the mounting groove 11 of the heat sink base plate 10. The heat sink fins 30 are surface-mount welded to the heat pipe 20, making the embedded heat sink 100 an integrated structure, which can effectively eliminate the solder thermal resistance and air gap of traditional soldering. The evaporation section 21 of the heat pipe 20 is directly connected to the heat absorption surface 12 of the heat sink base plate 10, which can shorten the heat transfer path from the chip center to the heat pipe 20, reduce the lateral thermal resistance of the heat sink base plate 10, realize the rapid activation of the heat pipe 20, and reduce the accumulation of heat in the center. The surface-mount welding of the heat sink fins 30 and the condensation section 22 can reduce the contact thermal resistance between them and help improve the heat dissipation efficiency.

[0038] In some embodiments, the heat pipe 20 is embedded in the mounting groove 11 with an interference fit or a micro-gap fit. In this way, the heat pipe 20 and the mounting groove 11 can be tightly fitted by the interference fit, which can eliminate the contact gap between them, reduce the thermal resistance of the contact interface, and help improve the heat conduction efficiency between the evaporation section 21 and the heat dissipation base plate 10; the micro-gap fit between the heat pipe 20 and the mounting groove 11 facilitates the assembly and fault tolerance of the two.

[0039] In some embodiments, the heat pipe 20 is made of a round tube by a flattening process, and the depth of the mounting groove 11 is 30% to 60% of the outer diameter of the heat pipe 20. The depth of the mounting groove 11 is the distance between the top surface of the heat dissipation base plate and the heat-absorbing surface 12 of the mounting groove 11. For example, the outer diameter of the heat pipe 20 is d, and the depth of the mounting groove 11 is any value between 0.3d and 0.6d.

[0040] The flattening process of heat pipe 20 is a forming technology that processes cylindrical heat pipe 20 into a flat cross-section through methods such as die extrusion. The flattened shape of heat pipe 20 balances formability and internal capillary structure integrity, ensuring its phase change heat transfer efficiency. The depth of the embedding groove 11 is 30%–60% of the outer diameter of heat pipe 20, ensuring effective contact area between heat pipe 20 and heat-absorbing surface 12 while preventing excessive embedding of the heat pipe 20, which could reduce the structural strength of the base plate. This helps to achieve a balance between thermal performance and mechanical reliability.

[0041] In some embodiments, the surface of the evaporation section 21 of the heat pipe 20 is in contact with the heat absorption surface 12, and the surface of the evaporation section 21 and the heat absorption surface 12 are coplanar, together forming a planar composite heat absorption interface.

[0042] By adopting the above technical solution, the contact area between the evaporation section 21 and the heat absorption surface 12 is maximized, the interfacial contact thermal resistance is reduced, the heat transfer from the chip to the evaporation section 21 of the heat pipe 20 is accelerated, the activation speed of the heat pipe 20 is improved, the formation of local hot spots is avoided, and the rapid heat dissipation requirements under high heat flux density of the chip are adapted.

[0043] In some embodiments, the surface of the condensation section 22 of the heat pipe 20 is flush with the top surface of the heat dissipation base plate 10. This flushness helps ensure the flatness of the top surface of the heat sink, facilitating subsequent surface mounting of the heat dissipation fins 30. It also prevents airflow disturbances and poor fin adhesion caused by protruding or recessed condensation section 22, ensuring the heat dissipation efficiency of the fins and improving the assembly accuracy and structural stability of the embedded heat sink 100.

[0044] In some embodiments, in the thickness direction of the heat pipe 20, the evaporation section 21 is configured as the lower surface of the heat pipe 20, and the condensation section 22 is configured as the upper surface of the heat pipe 20. The thickness direction of the heat pipe 20 is also the extension direction of the inlay groove 11, that is, the depth direction of the inlay groove 11.

[0045] By adopting the above technical solution, the evaporation section 21 and the condensation section 22 are respectively configured as the lower surface and the upper surface of the heat pipe 20. By functionally partitioning the upper and lower surfaces of the heat pipe 20, the lower surface of the evaporation section 21 is used to efficiently contact the heat absorption surface 12, and the upper surface of the condensation section 22 is used to efficiently connect the fins, forming a directional heat transfer path of heat absorption surface 12-evaporation section 21-condensation section 22-fins. This can effectively reduce the lateral diffusion loss of heat inside the heat pipe 20 and improve the overall heat dissipation efficiency.

[0046] In some embodiments, the area of ​​the heat-absorbing surface 12 is greater than or equal to the area of ​​the evaporation section 21. This ensures that the heat-absorbing surface 12 can fully cover and conduct the chip heat to the evaporation section 21, avoiding heat overflow or local overheating due to insufficient heat-absorbing surface 12, improving the heat pipe 20's ability to absorb chip heat, adapting to the heat dissipation needs of chips of different sizes, and enhancing the versatility of the heat sink.

[0047] In some embodiments, the length of the condensation section 22 is greater than or equal to the length of the heat dissipation fins 30. This ensures effective contact between the condensation section 22 and the heat dissipation fins 30, preventing the heat dissipation fins 30 from extending beyond the condensation section 22 and causing uneven heat transfer, thus improving the overall heat dissipation efficiency of the heat dissipation fins 30.

[0048] In some embodiments, the width of the heat dissipation fins 30 is greater than the width of the condensation section 22.

[0049] By adopting the above technical solution, the width of the heat dissipation fins 30 exceeds the width of the condensation section 22, which can increase the air convection heat dissipation area and improve the heat dissipation capacity of the embedded heat sink 100; at the same time, the edge of the fins can cover part of the top surface of the heat dissipation base plate 10, assisting the heat dissipation base plate 10 in heat dissipation, which helps to further improve the heat dissipation efficiency of the embedded heat sink 100.

[0050] In some embodiments, the bottom of the heat dissipation fins 30 simultaneously contacts the surface of the condensation section 22 and the surface of the heat dissipation base plate 10, and the heat dissipation fins 30 are supported by the condensation section 22 and the heat dissipation base plate 10.

[0051] By adopting the above technical solution, the condensation section 22 and the heat dissipation base plate 10 jointly support the heat dissipation fins 30, which can improve the structural rigidity of the heat dissipation fins 30 and avoid fin deformation or breakage caused by high-speed airflow or assembly stress; at the same time, it can disperse the load of the fins on the heat pipe 20, protect the capillary structure and sealing performance of the heat pipe 20, and help extend the service life of the embedded heat sink 100.

[0052] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An embedded heat sink, characterized in that, include: A heat dissipation base plate has an inlay groove recessed inward from its top surface, the bottom surface of which is configured as a heat-absorbing surface; A flat heat pipe is housed in the mounting groove. The heat pipe includes an evaporation section and a condensation section arranged opposite to each other. The evaporation section is connected to the heat-absorbing surface. The heat dissipation fins are surface-mount welded to the condensation section of the heat pipe.

2. The embedded heat sink according to claim 1, characterized in that, The heat pipe is embedded in the mounting groove with an interference fit or a micro-gap fit.

3. The embedded heat sink according to claim 1, characterized in that, The heat pipe is made from a round tube by a flattening process, and the depth of the inlay groove is 30% to 60% of the outer diameter of the heat pipe.

4. The embedded heat sink according to claim 1, characterized in that, The surface of the evaporation section of the heat pipe is in contact with the heat absorption surface.

5. The embedded heat sink according to claim 4, characterized in that, The surface of the condensation section of the heat pipe is flush with the top surface of the heat dissipation base plate.

6. The embedded heat sink according to claim 1, characterized in that, In the thickness direction of the heat pipe, the evaporation section is configured as the lower surface of the heat pipe, and the condensation section is configured as the upper surface of the heat pipe.

7. The embedded heat sink according to claim 1, characterized in that, The area of ​​the heat-absorbing surface is greater than or equal to the area of ​​the evaporation section.

8. The embedded heat sink according to claim 1, characterized in that, The length of the condensation section is greater than or equal to the length of the heat dissipation fins.

9. The embedded heat sink according to claim 8, characterized in that, The width of the heat dissipation fins is greater than the width of the condensation section.

10. The embedded heat sink according to claim 9, characterized in that, The heat dissipation fins are supported by the condensation section and the heat dissipation base plate.

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