Antenna assembly
By using conductive vias instead of vertical metal sidewalls in ceramic antennas, the manufacturing process is simplified and costs are reduced, while maintaining similar radiation performance, thus solving the problems of complexity and high cost in the production of existing ceramic antennas.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-29
- Publication Date
- 2026-04-10
AI Technical Summary
In existing ceramic antenna designs, the production of antennas with vertical metal sidewalls requires multiple metal plating steps, resulting in complex manufacturing and high costs.
Multiple conductive vias are used instead of vertical metal sidewalls to achieve similar radiation performance, simplifying the manufacturing process and reducing costs.
At specific frequency bands, antenna components can achieve radiation performance indicators similar to those of vertical metal sidewalls, such as return loss and radiation efficiency, through conductive vias, while significantly reducing production costs.
Smart Images
Figure CN121844449A_ABST
Abstract
Description
[0001] Priority Statement This application is based on and claims priority to U.S. Provisional Application No. 63 / 581,506, filed September 8, 2023; and also claims priority to U.S. Application No. 18 / 659,665, filed May 9, 2024; the contents of each of these applications are incorporated herein by reference. Technical Field
[0002] This disclosure generally relates to antenna assemblies. Background Technology
[0003] Antennas can be used to facilitate wireless communication between devices. It may be desirable for antennas to operate with high antenna radiation efficiency to improve wireless communication between devices. Antennas may need to be integrated into various types of devices to provide wireless communication, such as satellite communication. Summary of the Invention
[0004] Various aspects and advantages of embodiments of this disclosure will be set forth in part in the description which follows, or may be learned from the description, or may be learned by practice of these embodiments.
[0005] One example aspect of this disclosure relates to an antenna assembly. The antenna assembly includes a ceramic carrier having a first surface and a second surface opposite to the first surface. The antenna assembly also includes an antenna pattern. The antenna pattern includes a first antenna portion that is at least partially located on the first surface of the ceramic carrier. The antenna pattern also includes a second antenna portion that includes a plurality of conductive vias extending from the first antenna portion through the ceramic carrier to the second surface of the ceramic carrier.
[0006] Another example aspect of this disclosure relates to a communication device. The communication device includes an antenna. The antenna includes a first antenna portion that is at least partially located on a first surface of a ceramic carrier. The antenna also includes a second antenna portion that includes a plurality of conductive vias extending from the first antenna portion through the ceramic carrier to a second surface of the ceramic carrier. The second surface of the ceramic carrier is opposite to the first surface of the ceramic carrier.
[0007] These and other features, aspects, and advantages of the various embodiments will be better understood by referring to the following description and the appended claims. Several embodiments of this disclosure are illustrated in conjunction with the accompanying drawings, which are incorporated in and form part of this specification, and serve to explain the relevant principles. Attached Figure Description
[0008] For those skilled in the art, this specification provides a detailed description of various embodiments with reference to the accompanying drawings, in which: Figure 1 A perspective view of an example antenna assembly according to an exemplary embodiment of the present disclosure is depicted; Figure 2 A perspective view of an example antenna assembly according to an exemplary embodiment of the present disclosure is depicted; Figure 3 A three-dimensional view of the vertical wall antenna assembly is depicted; Figure 4 Depicting Figure 3 Graphical representations of example return loss and example radiation efficiency of a vertical wall antenna assembly in the L1 band; Figure 5 A graphical representation of an example return loss and a graphical representation of an example radiation efficiency of an antenna assembly according to an example embodiment of the present disclosure in the L1 band are depicted. Figure 6 Depicting Figure 3 Graphical representations of example return loss and example radiation efficiency of a vertical wall antenna assembly in the L5 band; Figure 7 Graphical representations of example return loss and example radiation efficiency of an antenna assembly according to an example embodiment of this disclosure in the L5 band are depicted; and Figure 8 An example communication device according to an example embodiment of this disclosure is depicted. Detailed Implementation
[0009] Reference will now be made in detail to embodiments, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation rather than limitation of the present disclosure. Indeed, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments without departing from the scope or spirit of the present disclosure. For example, features shown or described as part of one embodiment may be used with another embodiment to produce further embodiments. Therefore, aspects of the present disclosure are intended to cover these modifications and variations. As used herein, the term “about” used with numerical values is intended to refer to within 10% of that value.
[0010] This disclosure provides an example aspect of a technique that simplifies the manufacturing process and reduces the cost of ceramic antennas. Traditionally, metal plating is performed on a ceramic dielectric substrate to manufacture ceramic antennas. Sometimes, ceramic antenna designs include vertical metal sidewalls to achieve desired radiation performance in a specific frequency band. Mass production of such ceramic antennas with vertical metal walls is complex and expensive, as it may require multiple metal plating steps. By replacing the vertical metal walls with multiple vias (VIAs), the manufacturing process of such antennas can be simplified, and costs can be significantly reduced. Similar to vertical metal walls, vias couple the top and bottom metals of the substrate. Furthermore, the antenna radiation performance is unaffected by the via replacement.
[0011] An exemplary aspect of this disclosure relates to antenna assemblies for, for example, various applications. The antenna assembly may include an antenna (e.g., a Laser Direct Structuring (LDS) antenna) situated on a carrier (e.g., a dielectric carrier such as a ceramic carrier). The antenna assembly may be configured to communicate via various different frequency bands / protocols. For example, the antenna assembly may be configured to communicate, for instance, via frequency bands associated with LTE, Bluetooth, WiFi, GPS, or GNSS systems, and / or via various protocols.
[0012] In some ceramic antenna designs, vertical metal sidewalls may be included to achieve desired radiation performance at specific frequency bands. Manufacturing such a ceramic antenna with vertical metal sidewalls may require multiple metal plating steps. According to an example aspect of this disclosure, multiple vias can be used instead of vertical metal sidewalls to achieve similar radiation performance at specific frequencies while reducing the manufacturing cost of such an antenna.
[0013] Figure 1 An example antenna assembly 100 according to an exemplary embodiment of this disclosure is depicted. Using the disclosure provided herein, those skilled in the art will understand that antenna assembly 100 can include any suitable type of antenna having any operating frequency band. For example, antenna assembly 100 can include a GPS antenna (e.g., a GPS ceramic antenna), such as a GPS L1 antenna operating at about 1575 MHz or a GPS L5 antenna operating at about 1176 MHz. Thus, antenna assembly 100 can include a GPS antenna operating in the L1 band (e.g., about 1575 MHz) or the L5 band (e.g., about 1176 MHz).
[0014] Antenna assembly 100 includes a carrier 110 (e.g., a dielectric carrier). In some embodiments, carrier 110 may be a ceramic carrier. Carrier 110 has a first surface 112 and a second surface 114. The first surface 112 is opposite to the second surface 114. Carrier 110 also includes a plurality of sidewalls 116, 117, 118, and 119 connecting the first surface 112 to the second surface 114. Carrier sidewalls 116, 117, 118, and 119 may be defined as bare sidewalls, such that no metal structure is located on sidewalls 116, 117, 118, and 119. The lengths of sidewalls 116 and 118 are L. SW1 The lengths of sidewalls 117 and 119 are L. SW2 In some examples, L SW1 Greater than L SW2 For example, the lengths (L) of the carrier sidewalls 116 and 118 SW1 The length (L) of the carrier sidewalls 117 and 119 can be approximately 32 mm. SW2 The length can be approximately 9 mm. As shown in the figure, the carrier sidewalls 116 and 118 can be longer than the adjacent sidewalls 117 and 119 of the carrier 110.
[0015] In some embodiments, the antenna assembly 100 may further include a circuit board 140 (e.g., a printed circuit board). Figure 2 As shown, the circuit board 140 can be coupled to the carrier 110 (e.g., the second surface 114 of the carrier 110).
[0016] The antenna assembly 100 also includes an antenna pattern 120. Figure 1 The specific antenna pattern 120 shown is provided for illustrative and explanatory purposes. Those skilled in the art will understand using the disclosure provided herein that other antenna patterns may be used without departing from the scope of this disclosure.
[0017] Antenna pattern 120 may include multiple portions. For example, antenna pattern 120 may include a first portion 125 that is at least partially located on a first surface 112 of carrier 110. In some embodiments, the first portion 125 may be metal-plated onto the first surface 112 of carrier 110. In some embodiments, the first portion 125 may be an antenna portion defined by an LDS.
[0018] Antenna pattern 120 also includes a second portion 130 that extends vertically from the first portion 125 through the ceramic carrier 110 to the second surface 114. As shown, the second portion 130 may be defined as a plurality of vias 131, 132, and 133 (e.g., a plurality of conductive vias) extending from the first surface 112 through the ceramic carrier 110 to the second surface 114. The plurality of vias 131, 132, and 133 are configured to enable the antenna assembly 100 to achieve desired radiation performance.
[0019] Multiple vias 131, 132, and 133 can be positioned along the carrier sidewalls 116, 117, 118, and 119, such that the multiple vias 131, 132, and 133 are parallel to the carrier sidewalls 116, 117, 118, and 119. For example... Figure 1 As shown, a plurality of vias 131, 132, and 133 can be positioned along the carrier sidewall 116 such that each of the plurality of vias 131, 132, and 133 is located at a distance 135 from the edge of the antenna pattern 120 (e.g., the first portion 125 of the antenna pattern 120). In some embodiments, the distance 135 can be in the range of 0.2 mm to 0.3 mm, for example, 0.25 mm. The plurality of vias 131, 132, and 133 (e.g., the second portion 130 of the antenna pattern 120) can directly contact (e.g., electrically couple to) the first portion 125 located on the first surface 112 of the carrier 110.
[0020] In some embodiments, the second portion 130 can electrically couple the first portion 125 to one or more portions 121, 122, and 123 located on the second surface 114 of the carrier 110. Thus, the second antenna portion 130 can include a plurality of vias 131, 132, and 133. The plurality of vias 131, 132, and 133 can be configured to electrically couple the first antenna portion 125 located on the first surface 112 of the carrier 110 to the plurality of antenna portions 121, 122, and 123 located on the second surface 114 of the carrier 110. For example, the plurality of vias 131 can electrically couple the first portion 125 located on the first surface 112 of the carrier 110 to a third portion 121 located on the second surface 114 of the carrier 110. The plurality of vias 132 can electrically couple the first portion 125 located on the first surface 112 of the carrier 110 to a fourth portion 122 located on the second surface 114 of the carrier 110. Multiple vias 133 can electrically couple a first portion 125 located on a first surface 112 of a carrier 110 to a fifth portion 123 located on a second surface 114 of a carrier 110.
[0021] Although Figure 1The document depicts three sets of multiple vias 131, 132, and 133 and three antenna portions 121, 122, and 123. However, those skilled in the art will understand that, without departing from the scope of this disclosure, the second portion 130 may include any number of multiple vias that electrically couple the first portion 125 to any number of portions located on the second surface 114 of the carrier 110.
[0022] A second portion 130 of the antenna assembly 100 (e.g., multiple sets of vias 131, 132, and 133) can be used to replace the vertical sidewalls (e.g., metal sidewalls). For example, Figure 3 A vertical sidewall antenna assembly 200 is depicted. For example... Figure 3 As shown, the vertical sidewall antenna assembly 200 includes a first antenna pattern 220 located on a first surface 212 of the carrier 210. A vertical sidewall 230 (e.g., a metal sidewall) is located on the carrier sidewall 216 to achieve desired radiation performance in a specific frequency band.
[0023] Because of the vertical sidewall 230, the production of the vertical sidewall antenna assembly 200 can be expensive. Vias 131, 132, and 133 can be used to replace the vertical sidewall 230, thereby achieving similar desired radiation performance in a specific frequency band at a lower production cost.
[0024] Figure 4 and Figure 5 Graphical representations of example return loss and example radiation efficiency of antenna assembly 100 and vertical sidewall antenna assembly 200 in the L1 band (e.g., GPS L1 band) are shown.
[0025] Specifically, Figure 4 Describing as Figure 3 The graphs show example return loss and example radiation efficiency of the vertical sidewall antenna assembly 200 in the L1 band (e.g., GPS L1 band).
[0026] Figure 410 illustrates an example return loss of the vertical sidewall antenna assembly 200. As shown by curve 412 in Figure 410, the vertical sidewall antenna assembly 200 can exhibit a return loss of approximately -14 dB at a frequency of approximately 1575 MHz (e.g., the GPS L1 operating frequency). As shown, the vertical sidewall antenna assembly 200 can have a bandwidth (BW) of 83 MHz. For example, the vertical sidewall antenna assembly 200 can operate with a return loss of less than -10 dB over a frequency range of 83 MHz centered at 1575 MHz (e.g., the GPS L1 operating frequency).
[0027] Furthermore, graph 420 depicts an example radiation efficiency of the vertical sidewall antenna assembly 200 in the L1 band (e.g., the GPS L1 band). As shown by curve 422 in graph 420, the vertical sidewall antenna assembly 200 can exhibit an antenna radiation efficiency of approximately -0.31 dB at a frequency of approximately 1575 MHz (e.g., the GPS L1 operating frequency).
[0028] Figure 5 Plots of example return loss and example radiation efficiency of antenna assembly 100 in the L1 band (e.g., GPS L1 band) are presented.
[0029] Figure 510 depicts an example return loss of antenna assembly 100. As shown by curve 512 in Figure 510, antenna assembly 100 can exhibit a return loss ranging from about -12 dB to about -16 dB, for example, a return loss of about -14 dB at a frequency of about 1575 MHz (e.g., the GPS L1 operating frequency). Antenna assembly 100 can have a bandwidth at a specific frequency depending on the application of antenna assembly 100. In some embodiments, antenna assembly 100 can have a bandwidth ranging from about 80 MHz to about 85 MHz, for example, a bandwidth of about 83 MHz. For example, antenna assembly 100 can operate with a return loss of less than -10 dB in an 83 MHz frequency range centered at 1575 MHz (e.g., the GPS L1 operating frequency).
[0030] Furthermore, graph 520 depicts an example radiation efficiency of antenna assembly 100 in the L1 band (e.g., GPS L1 band). As shown by curve 522 in graph 520, antenna assembly 100 can exhibit an antenna radiation efficiency ranging from about -0.30 to about -0.40, for example, at a frequency of about 1575 MHz (e.g., GPS L1 operating frequency), the antenna radiation efficiency is about -0.35 dB.
[0031] As shown in the figure, in the L1 band, the antenna assembly 100 can achieve the following: Figure 4 The vertical sidewall antenna assembly 200 shown has similar radiation performance parameters (e.g., return loss, bandwidth, radiation efficiency).
[0032] also, Figure 6 and Figure 7 Graphical representations of example return loss and example radiation efficiency of antenna assembly 100 and vertical sidewall antenna assembly 200 in the L5 band (e.g., GPS L5 band) are shown.
[0033] Specifically, Figure 6 Describing as Figure 3The graphs show example return loss and example radiation efficiency of the vertical sidewall antenna assembly 200 in the L5 band (e.g., GPS L5 band).
[0034] Figure 610 illustrates an example return loss of the vertical sidewall antenna assembly 200. As shown by curve 612 in Figure 610, the vertical sidewall antenna assembly 200 can exhibit a return loss of approximately -28 dB at a frequency of approximately 1176 MHz (e.g., the GPS L5 operating frequency). As shown, the vertical sidewall antenna assembly 200 can have a bandwidth of 121 MHz. For example, the vertical sidewall antenna assembly 200 can operate with a return loss of less than -10 dB in a frequency range of 121 MHz centered at 1176 MHz (e.g., the GPS L5 operating frequency).
[0035] Furthermore, Figure 620 depicts an example radiation efficiency of the vertical sidewall antenna assembly 200 in the L5 band (e.g., the GPS L5 band). As shown by curve 622 in Figure 620, the vertical sidewall antenna assembly 200 can exhibit an antenna radiation efficiency of approximately -0.21 dB at a frequency of approximately 1176 MHz (e.g., the GPS L5 operating frequency).
[0036] Figure 7 Plots of example return loss and example radiation efficiency of antenna assembly 100 in the L5 band (e.g., GPS L5 band) are presented.
[0037] Figure 710 depicts an example return loss of antenna assembly 100. As shown by curve 712 in Figure 710, antenna assembly 100 can exhibit a return loss ranging from about -25 dB to about -30 dB, for example, a return loss of about -26 dB at a frequency of about 1176 MHz (e.g., the GPS L5 operating frequency). Antenna assembly 100 can have a bandwidth at a specific frequency depending on the application of antenna assembly 100. In some embodiments, antenna assembly 100 can have a bandwidth ranging from about 130 MHz to about 135 MHz, for example, a bandwidth of about 132 MHz. For example, antenna assembly 100 can operate with a return loss of less than -10 dB in a frequency range of 132 MHz centered at 1176 MHz (e.g., the GPS L5 operating frequency).
[0038] Furthermore, graph 720 depicts an example radiation efficiency of antenna assembly 100 in the L5 band (e.g., GPS L5 band). As shown by curve 722 in graph 720, antenna assembly 100 can exhibit an antenna radiation efficiency ranging from about -0.20 to about -0.30, for example, at a frequency of about 1176 MHz (e.g., GPS L1 operating frequency), the antenna radiation efficiency is about -0.27 dB.
[0039] As shown in the figure, in the L5 band, antenna assembly 100 can achieve the following: Figure 6 The vertical sidewall antenna assembly 200 shown has similar radiation performance parameters (e.g., return loss, bandwidth, radiation efficiency).
[0040] Figure 8 An example communication device according to an example embodiment of this disclosure is depicted. For example... Figure 8 As shown, the communication device 800 includes an antenna assembly 400 (e.g., an antenna). The antenna assembly 400 can be any of the various antenna assemblies provided herein. The communication device 800 also includes communication circuitry 830. Communication circuitry 830 may include electronic components (e.g., transmission lines, transceivers, receivers, transmitters, matching circuits, etc.) configured to facilitate information communication via the antenna. In some embodiments, the communication device 800 includes a memory 820 and one or more processors 810. The one or more processors 810 are configured to perform various computer-implemented functions. As used herein, the term "processor" refers not only to an integrated circuit considered to be included in a computer in the art, but also to a controller, microcontroller, microcomputer, programmable logic controller (PLC), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), and / or other programmable circuitry. As shown, the communication device 800 may include a memory 820. Examples of memory 820 may include computer-readable media, including but not limited to non-transitory computer-readable media such as random access memory (RAM), read-only memory (ROM), hard disk drive, flash drive, or other suitable storage devices. Memory 820 may store information accessible by one or more processors 810, including computer-readable instructions executable by one or more processors 810.
[0041] The communication device 800 may further include a housing 860 configured to accommodate the various components of the communication device 800. In some embodiments, the communication device 800 may further include one or more screens 840 (e.g., a display screen, a touch screen). In some embodiments, the communication device 800 may further include an input device 850 (e.g., a keypad, a touchpad, a keyboard).
[0042] One example aspect of this disclosure relates to an antenna assembly. The antenna assembly includes a ceramic carrier having a first surface and a second surface opposite to the first surface. The antenna assembly also includes an antenna pattern. The antenna pattern includes a first antenna portion that is at least partially located on the first surface of the ceramic carrier. The antenna pattern also includes a second antenna portion that includes a plurality of conductive vias extending from the first antenna portion through the ceramic carrier to the second surface of the ceramic carrier.
[0043] In some examples, the plurality of conductive vias are positioned along the sidewall of the ceramic carrier, with each of the plurality of conductive vias located at a distance from the sidewall.
[0044] In some examples, the antenna pattern also includes a third antenna portion located on a second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the third antenna portion.
[0045] In some examples, the antenna pattern further includes a fourth antenna portion and a fifth antenna portion, the fourth antenna portion being located on a second surface of the ceramic carrier, and the fifth antenna portion being located on a second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the fourth antenna portion. The second antenna portion electrically couples the first antenna portion to the fifth antenna portion.
[0046] In some examples, the antenna assembly includes a GPS antenna.
[0047] In some examples, the GPS antenna operates in the L1 band.
[0048] In some examples, the antenna assembly has a return loss ranging from approximately -12 dB to approximately -16 dB.
[0049] In some examples, the antenna assembly has a bandwidth ranging from approximately 80 MHz to approximately 85 MHz.
[0050] In some examples, the antenna assembly has a radiation efficiency ranging from about -0.30 to about -0.40.
[0051] In some examples, the GPS antenna operates in the L5 band.
[0052] In some examples, the antenna assembly has a return loss ranging from approximately -25 dB to approximately -30 dB.
[0053] In some examples, the antenna assembly has a bandwidth ranging from approximately 130 MHz to approximately 135 MHz.
[0054] In some examples, the antenna assembly has a radiation efficiency ranging from about -0.20 to about -0.30.
[0055] In some examples, the antenna assembly also includes a circuit board. The circuit board is coupled to a second surface of the ceramic carrier.
[0056] In some examples, multiple conductive vias are positioned along a first sidewall of the ceramic carrier, which is longer than the adjacent sidewall of the ceramic carrier.
[0057] In some examples, the antenna assembly does not include metal sidewalls.
[0058] Another example aspect of this disclosure relates to a communication device. The communication device includes an antenna. The antenna includes a first antenna portion that is at least partially located on a first surface of a ceramic carrier. The antenna also includes a second antenna portion that includes a plurality of conductive vias extending from the first antenna portion through the ceramic carrier to a second surface of the ceramic carrier. The second surface of the ceramic carrier is opposite to the first surface of the ceramic carrier.
[0059] In some examples, the plurality of conductive vias are positioned along the sidewall of the ceramic carrier, with each of the plurality of conductive vias located at a distance from the sidewall.
[0060] In some examples, the antenna also includes a third antenna portion located on a second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the third antenna portion.
[0061] In some examples, the antenna further includes a fourth antenna portion and a fifth antenna portion, the fourth antenna portion being located on a second surface of the ceramic carrier, and the fifth antenna portion being located on a second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the fourth antenna portion. The second antenna portion electrically couples the first antenna portion to the fifth antenna portion.
[0062] Although the subject matter has been described in detail with reference to specific exemplary embodiments, it should be understood that those skilled in the art can readily make changes, modifications, and equivalents to these embodiments upon understanding the foregoing. Therefore, the scope of this disclosure is by way of example rather than limitation, and the disclosure does not exclude such modifications, variations, and / or additions to the subject matter that would be obvious to those skilled in the art.
Claims
1. An antenna assembly, comprising: A ceramic carrier having a first surface and a second surface, wherein the second surface is opposite to the first surface; Antenna pattern, the antenna pattern including: A first antenna portion, which is at least partially located on the first surface of the ceramic carrier; as well as The second antenna portion includes a plurality of conductive vias that extend from the first antenna portion through the ceramic carrier to the second surface of the ceramic carrier.
2. The antenna assembly according to claim 1, wherein, The plurality of conductive vias are positioned along the sidewall of the ceramic carrier, and each of the plurality of conductive vias is located at a distance from the sidewall.
3. The antenna assembly according to claim 1, wherein, The antenna pattern also includes: The third antenna portion is located on the second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the third antenna portion.
4. The antenna assembly according to claim 1, wherein, The antenna pattern also includes: A fourth antenna portion, said fourth antenna portion being located on the second surface of the ceramic carrier; and The fifth antenna portion is located on the second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the fourth antenna portion. The second antenna portion electrically couples the first antenna portion to the fifth antenna portion.
5. The antenna assembly according to claim 1, wherein, The antenna assembly includes a GPS antenna.
6. The antenna assembly according to claim 5, wherein, The GPS antenna operates in the L1 frequency band.
7. The antenna assembly according to claim 6, wherein, The antenna assembly has a return loss ranging from approximately -12 dB to approximately -16 dB.
8. The antenna assembly according to claim 6, wherein, The antenna assembly has a bandwidth ranging from about 80 MHz to about 85 MHz.
9. The antenna assembly according to claim 6, wherein, The antenna assembly has a radiation efficiency ranging from about -0.30 to about -0.
40.
10. The antenna assembly according to claim 5, wherein, The GPS antenna operates in the L5 frequency band.
11. The antenna assembly of claim 10, wherein, The antenna assembly has a return loss ranging from about -25 dB to about -30 dB.
12. The antenna assembly of claim 10, wherein, The antenna assembly has a bandwidth ranging from about 130 MHz to about 135 MHz.
13. The antenna assembly according to claim 10, wherein, The antenna assembly has a radiation efficiency ranging from about -0.20 to about -0.
30.
14. The antenna assembly according to claim 1, further comprising: circuit board, The circuit board is coupled to the second surface of the ceramic carrier.
15. The antenna assembly according to claim 1, wherein, The plurality of conductive vias are positioned along a first sidewall of the ceramic carrier, the first sidewall being longer than the adjacent sidewall of the ceramic carrier.
16. The antenna assembly according to claim 1, wherein, The antenna assembly does not include metal sidewalls.
17. A communication device, comprising: Antenna, the antenna comprising: A first antenna portion, wherein the first antenna portion is at least partially located on a first surface of the ceramic carrier; and The second antenna portion includes a plurality of conductive vias that extend from the first antenna portion through the ceramic carrier to a second surface of the ceramic carrier. The second surface of the ceramic carrier is opposite to the first surface of the ceramic carrier.
18. The communication device according to claim 17, wherein, The plurality of conductive vias are positioned along the sidewall of the ceramic carrier, and each of the plurality of conductive vias is located at a distance from the sidewall.
19. The communication device according to claim 17, wherein, The antenna also includes: The third antenna portion is located on the second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the third antenna portion.
20. The communication device according to claim 17, wherein, The antenna also includes: A fourth antenna portion, said fourth antenna portion being located on the second surface of the ceramic carrier; and The fifth antenna portion is located on the second surface of the ceramic carrier. The second antenna portion electrically couples the first antenna portion to the fourth antenna portion. The second antenna portion electrically couples the first antenna portion to the fifth antenna portion.