Curved surface microstructure array and manufacturing method and device thereof
By processing the microstructure array using polishing methods, the problem of high cost and low efficiency in the production of curved surface microstructure arrays has been solved, realizing low-cost and high-efficiency production of curved surface microstructures and meeting high precision requirements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN TSIMEC CO LTD
- Filing Date
- 2024-10-11
- Publication Date
- 2026-04-14
AI Technical Summary
The fabrication cost of curved microstructure arrays in the prior art is high and the efficiency is low, mainly because it requires expensive and inefficient grayscale lithography and etching processes.
The microstructure array is processed by polishing. By fixing the microstructure array to the polishing head of the polishing equipment, applying vertical pressure and controlling relative rotation, the first surface of the microstructure becomes curved. Polishing is achieved by utilizing the difference in contact force between the edge region and the center region of the microstructure, avoiding the use of photolithography and etching.
It reduced manufacturing costs, increased manufacturing speed, and enabled the large-scale production of curved microstructures with surface roughness at the 0.5-nanometer to 1-nanometer level, meeting high precision requirements.
Smart Images
Figure CN121848246A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of curved surface microstructure fabrication, and in particular to a curved surface microstructure array and its fabrication method and device. Background Technology
[0002] 3D curved surface microstructure arrays are widely used in micro-optical components (such as microlenses, prisms, gratings, etc.), complex freeform surface optical devices, and micro-switching devices. The dimensions of these curved microstructures are very small, typically on the micrometer scale. Due to the stringent requirements on the surface shape and roughness of these microstructures, expensive and inefficient grayscale photolithography and etching processes are usually required, resulting in high fabrication costs and low efficiency for curved surface microstructure arrays. Furthermore, the sheer number of curved microstructures within an array further complicates the fabrication process.
[0003] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Summary of the Invention
[0004] The purpose of this application is to provide a curved surface microstructure array and its fabrication method and device, thereby improving the efficiency of curved surface microstructure fabrication and reducing the fabrication cost.
[0005] To address the aforementioned technical problems, this application provides a method for fabricating a curved surface microstructure array, comprising:
[0006] Prepare a microstructure array, the microstructure array comprising a plurality of spaced microstructures, the first surface of the microstructure being planar;
[0007] The microstructure array is fixed to the polishing head of the polishing equipment;
[0008] The first surface of the microstructure array is brought into contact with the polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the polishing pad are controlled to rotate relative to each other to polish the microstructure array, so that the first surface of the microstructure becomes a curved surface, thus obtaining a curved microstructure array.
[0009] The pressure is perpendicular to the first surface of the microstructure, and the contact force on the edge region of the microstructure is greater than the contact force on the central region of the microstructure.
[0010] Optionally, the polishing pad includes a resilient polishing pad.
[0011] Optionally, the resilient polishing pad includes any of the following:
[0012] Soft metal polishing pads, polishing pads with microporous structure layers, damping cloth polishing pads, and non-woven polishing pads.
[0013] Optionally, pressure is applied to the polishing head to control the relative rotation between the microstructure array and the polishing pad. When polishing the microstructure array, the polishing speed of the microstructure array ranges from 30 nm / min to 200 nm / min, and the polishing time ranges from 10 s to 180 s.
[0014] Optionally, when pressure is applied to the polishing head to control the relative rotation of the microstructure array and the polishing pad, the pressure range is 1 PSI to 3 PSI, the rotation speed range of the polishing head is 80 RPM to 90 RPM, and the rotation speed range of the polishing pad is 30 RPM to 200 RPM.
[0015] Optionally, it also includes:
[0016] Pressure is applied to the retaining ring, the pressure applied to the retaining ring being greater than the pressure applied to the polishing head; wherein the retaining ring is used to fix the substrate, the microstructure is fixed on the substrate, and the second surface of the microstructure is in contact with the substrate.
[0017] Optionally, it also includes:
[0018] Control the oscillation of the polishing head.
[0019] Optionally, the polishing pad is a black damping cloth polishing pad, the pressure applied to the polishing head is 2.2 PSI, the rotational speed of the polishing head is 87 RPM, the rotational speed of the polishing pad is 93 RPM, the flow rate of the polishing fluid is in the range of 120 mL / min to 150 mL / min, and the polishing speed of the microstructure array is in the range of 50 nm / min to 160 nm / min. Optionally, the distance between the microstructures is in the range of 4D to 100D, where D is the dimension of the first surface of the microstructure.
[0020] Optionally, the distances between adjacent microstructures may be equal or unequal.
[0021] Optionally, polishing the microstructure array involves contacting its first surface with the polishing pad of the polishing device, applying pressure to the polishing head, and controlling the relative rotation of the microstructure array and the polishing pad.
[0022] The first surface of the microstructure array is brought into contact with the first polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array is controlled to rotate relative to the first polishing pad to perform coarse polishing on the microstructure array;
[0023] The first surface of the microstructure array is brought into contact with the second polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the second polishing pad are controlled to rotate relative to each other to perform fine polishing on the microstructure array.
[0024] This application also provides a curved surface microstructure array, which is fabricated using any of the above-described methods for fabricating curved surface microstructure arrays.
[0025] This application also provides a device comprising the above-described curved microstructure array.
[0026] This application provides a method for fabricating a curved microstructure array, comprising: preparing a microstructure array, the microstructure array including a plurality of spaced microstructures, the first surface of the microstructures being planar; fixing the microstructure array to a polishing head of a polishing device; contacting the first surface of the microstructure array with a polishing pad of the polishing device, applying pressure to the polishing head, and controlling the microstructure array to rotate relative to the polishing pad, polishing the microstructure array to make the first surface of the microstructures curved, thereby obtaining a curved microstructure array; wherein the pressure is perpendicular to the first surface of the microstructure, and the contact force on the edge region of the microstructure is greater than the contact force on the center region of the microstructure.
[0027] As can be seen, in this application, when fabricating the curved microstructure array, polishing is used to polish the microstructure array whose first surface is planar. The microstructure array is fixed on a polishing head, and the pressure applied to the polishing head is perpendicular to the first surface of the microstructure. Simultaneously, due to factors such as the gaps between the microstructures, the force experienced by the edge region where the microstructure contacts the polishing pad is greater than the force experienced by the middle region of the microstructure during polishing. Therefore, the polishing speed of the edge region is greater than that of the middle region, thereby transforming the first surface of the microstructure from a planar surface into a curved surface, thus obtaining the curved microstructure array. The curved microstructure array in this application is fabricated using polishing, eliminating the need for photolithography and etching, which reduces fabrication costs, increases fabrication speed, and allows for the simultaneous polishing of multiple microstructures, enabling large-scale fabrication of curved microstructures.
[0028] In addition, this application also provides a curved surface microstructure array and device. Attached Figure Description
[0029] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0030] Figure 1 A flowchart illustrating a method for fabricating a curved surface microstructure array provided in an embodiment of this application;
[0031] Figure 2 and Figure 3 A schematic diagram illustrating the principle of a method for fabricating a curved surface microstructure array provided in an embodiment of this application;
[0032] Figure 4 and Figure 5 A comparison image of a microstructure before and after polishing using the fabrication method of this application;
[0033] Figure 6 and Figure 7 Comparison images before and after polishing using the fabrication method of this application for another microstructure. Detailed Implementation
[0034] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0035] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.
[0036] As described in the background section, grayscale lithography and etching processes are currently used to fabricate curved microstructures, which are costly and inefficient.
[0037] In view of this, this application provides a method for fabricating a curved surface microstructure array, please refer to... Figure 1 The method may include:
[0038] Step S101: Prepare a microstructure array, the microstructure array comprising a plurality of spaced microstructures, the first surface of the microstructure being planar.
[0039] In this embodiment, the number of microstructures in the microstructure array is not limited and depends on the situation.
[0040] Furthermore, this embodiment does not limit the distribution of microstructures and can be set as needed. For example, microstructures can be distributed in the form of a matrix, or in the form of concentric circles, or in a spiral arrangement, etc.
[0041] The shape of the microstructure includes, but is not limited to, any one of cylinder, frustum, and prism.
[0042] In this embodiment, the material of the microstructure is not limited and can be determined as appropriate.
[0043] As one possible implementation, the material of the microstructure can be a metallic material, such as gold, silver, copper, nickel, platinum, aluminum, etc.
[0044] As another possible implementation, the material of the microstructure can be an insulating material, such as silicon oxide, silicon nitride, hafnium oxide, silicon, silicon nitride, etc.
[0045] Step S102: Fix the microstructure array to the polishing head of the polishing equipment.
[0046] Polishing equipment can be chemical mechanical polishing (also known as chemical mechanical polishing, or CMP) machines.
[0047] like Figure 2 As shown, the microstructure array 1 can be located on the substrate supporting the wafer 3. The wafer 3, supporting the microstructure array 1, is fixed below the polishing head 4 of the polishing equipment, with the first surface of the microstructure array 1 facing downwards. The microstructure array 1 is located above the polishing pad 2, which is located on the polishing disk 6. In addition, the wafer 3 is also fixed by a retaining ring.
[0048] Step S103: The first surface of the microstructure array is brought into contact with the polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the polishing pad are controlled to rotate relative to each other. The microstructure array is polished so that the first surface of the microstructure becomes a curved surface, thus obtaining a curved microstructure array.
[0049] The pressure is perpendicular to the first surface of the microstructure, and the contact force on the edge region of the microstructure is greater than the contact force on the central region of the microstructure.
[0050] The polishing pad 2 is in contact with the first surface of the microstructure array 1, that is, the polishing pad 2 is in contact with the first surface of each microstructure. The first surface of the microstructure array 1 is also the side where the first surface of the microstructure is located.
[0051] like Figure 3 As shown, pressure F is applied to the polishing head. The pressure F is uniform at all points on the polishing head and is perpendicular to the first surface of the microstructure. In addition, due to the certain gap d between the microstructures, the contact force on the edge area of the microstructure is greater than that on the middle area during the polishing process. Therefore, the polishing speed of the edge area of the microstructure is greater than that of the middle area, which makes the first surface of the microstructure become curved. The middle area of the first surface of the microstructure is high and the edge area is low, thus obtaining the curved microstructure array 5.
[0052] For those skilled in the art, CMP is generally used directly for polishing, that is, grinding the surface to make it smooth. They would not usually think of using CMP for surface microstructure processing. Moreover, the size of a single microstructure is very small, generally ranging from 1 micrometer to 20 micrometers, and its processing is extremely difficult. Therefore, it is not easy to use this method for processing.
[0053] The use of CMP for surface microstructure processing in this application overcomes many difficulties, such as determining the pressure applied to the polishing head when fabricating curved surface microstructures so that the pressure matches the microstructure of the curved surface; determining the spacing between microstructures; and determining the rotation speed, the pressure applied to the polishing head, and the flow rate of the polishing fluid during polishing, etc.
[0054] In the prior art, the process of fabricating curved microstructures using photolithography takes about 10 hours. However, in this application, after setting the relevant parameters (such as the applied pressure, rotation speed, and flow rate of the polishing fluid), the polishing process takes only 20 to 30 seconds to obtain the curved microstructure.
[0055] The curved microstructure obtained in this embodiment has extremely low surface roughness, ranging from 0.5 nanometers to 1 nanometer, which meets the requirements for the surface roughness of curved microstructures.
[0056] In one embodiment of this application, when pressure is applied to the polishing head, the pressure range can be 1 PSI to 3 PSI. The greater the pressure applied to the polishing head, the faster the polishing speed; the specific pressure can be set as needed.
[0057] For example, the pressure applied to the polishing head can be 1 PSI, 1.5 PSI, 2 PSI, 2.5 PSI, 3 PSI, etc.
[0058] The pressure applied to the polishing head can also be adjusted according to the elastic modulus of the material in the microstructure.
[0059] When the microstructure array 1 and the polishing pad rotate relative to each other, they can rotate simultaneously to increase the polishing speed. The rotation of the microstructure array 1 can be driven by the rotation of the polishing head, and the polishing pad is located on the polishing disk, and its rotation can be driven by the rotation of the polishing disk.
[0060] In this embodiment, the rotation speed of the polishing head and polishing pad is not limited and can be set by the user.
[0061] As one possible implementation, the rotational speed range of the polishing head can be 80 RPM to 90 RPM, and the rotational speed range of the polishing pad can be 30 RPM to 200 RPM. For example, the rotational speed of the polishing head can be 80 RPM, 85 RPM, 90 RPM, etc., and the rotational speed of the polishing pad can be 30 RPM, 50 RPM, 100 RPM, 150 RPM, 200 RPM, etc.
[0062] To improve the effect of polishing the first surface of the microstructure to form a curved surface, as one possible implementation, the polishing pad includes an elastic polishing pad.
[0063] In this embodiment, the type of polishing pad is not limited and can be selected at will. For example, the type of polishing pad includes, but is not limited to, any of the following:
[0064] Soft metal polishing pads, polishing pads with microporous structure layers, damping cloth polishing pads, and non-woven polishing pads.
[0065] The soft metal polishing pad can be made of materials such as copper, aluminum, tungsten, and nickel; the polishing pad with a microporous structure layer includes a microporous structure layer and a substrate layer. The pore size range of the pores in the microporous structure layer can be 45 micrometers to 50 micrometers. The microporous structure layer can be a PU (Polyurethane) foam layer, etc., and the substrate layer can be made of materials such as polyethylene terephthalate.
[0066] As a preferred method, using a soft metal polishing pad can avoid the polishing orange peel defect.
[0067] The height range of the curved surface microstructure obtained after polishing can be 100μm~200μm.
[0068] In this embodiment, when fabricating the curved microstructure array, polishing is used to polish the microstructure array whose first surface is planar. The microstructure array is fixed on a polishing head, and the pressure applied to the polishing head is perpendicular to the first surface of the microstructure. Simultaneously, due to factors such as the gaps between the microstructures, the force experienced by the edge region where the microstructure contacts the polishing pad is greater than the force experienced by the middle region of the microstructure during polishing. Therefore, the polishing speed of the edge region is greater than that of the middle region, thereby transforming the first surface of the microstructure from a planar surface into a curved surface, thus obtaining the curved microstructure array. In this application, the curved microstructure array is fabricated using polishing, eliminating the need for photolithography and etching, which reduces fabrication costs, increases fabrication speed, and allows for the simultaneous polishing of multiple microstructures, enabling large-scale fabrication of curved microstructures.
[0069] Based on the above embodiments, in one embodiment of this application, the method for fabricating a curved surface microstructure array includes:
[0070] Step S201: Prepare a microstructure array, the microstructure array comprising a plurality of spaced microstructures, the first surface of the microstructure being planar.
[0071] Step S202: Fix the microstructure array to the polishing head of the polishing equipment.
[0072] Step S203: The first surface of the microstructure array is brought into contact with the polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the polishing pad are controlled to rotate relative to each other to polish the microstructure array, so that the first surface of the microstructure becomes a curved surface, thus obtaining a curved microstructure array;
[0073] The polishing speed of the microstructure array ranges from 30 nm / min to 200 nm / min, and the polishing time ranges from 10 s to 180 s. The pressure is perpendicular to the first surface of the microstructure, and the contact force on the edge region of the microstructure is greater than the contact force on the central region of the microstructure.
[0074] For example, the polishing speed can be 20nm / min, 40nm / min, 60nm / min, 80nm / min, 100nm / min, etc.
[0075] For example, the polishing time can be 10s, 30s, 50s, 100s, 130s, 150s, 180s, etc.
[0076] By setting the target polishing speed and polishing time, the desired curved surface microstructure array can be obtained quickly.
[0077] In one possible implementation, the polishing pad is a black damping cloth polishing pad, the pressure applied to the polishing head is 2.2 PSI, the rotation speed of the polishing head is 87 RPM, the rotation speed of the polishing pad is 93 RPM, the flow rate of the polishing fluid is in the range of 120 mL / min to 150 mL / min, and the polishing speed of the microstructure array is in the range of 50 nm / min to 160 nm / min.
[0078] In one embodiment of this application, the size of the first surface of the microstructure can be in the range of 5μm to 6μm, and the fabrication method in this embodiment can be applied to small-sized microstructures.
[0079] For example, when the microstructure is a cylinder or a frustum, the size of the first surface of the microstructure is the diameter; when the microstructure is a prism, the size of the first surface of the microstructure can be the side length.
[0080] In one embodiment of this application, the distance between the microstructures ranges from 4D to 100D, where D is the size of the first surface of the microstructure.
[0081] The microstructure array includes multiple microstructures, and the distance between adjacent microstructures may be equal or unequal. This application does not impose any limitation on this, and the distance can be set as needed.
[0082] When the distance between microstructures is different, the polishing principle is the same when making curved surface microstructure arrays. Only the curvature of the surface after a single polishing will be different. The specific design can be carried out according to the requirements.
[0083] Based on any of the above embodiments, in one embodiment of this application, the method for fabricating a curved surface microstructure array may further include:
[0084] Pressure is applied to the retaining ring, the pressure applied to the retaining ring being greater than the pressure applied to the polishing head; wherein the retaining ring is used to fix the substrate, the microstructure is fixed on the substrate, and the second surface of the microstructure is in contact with the substrate.
[0085] The substrate can be a wafer.
[0086] By ensuring that the pressure applied to the retaining ring is greater than the pressure applied to the polishing head, it is possible to prevent the polishing disc from slipping during the polishing process.
[0087] Based on any of the above embodiments, in one embodiment of this application, the method for fabricating a curved surface microstructure array may include:
[0088] Step S301: Prepare a microstructure array, the microstructure array comprising a plurality of spaced microstructures, the first surface of the microstructure being planar;
[0089] Step S302: Fix the microstructure array to the polishing head of the polishing equipment;
[0090] Step S303: The first surface of the microstructure array is brought into contact with the polishing pad of the polishing device, pressure is applied to the polishing head and the retaining ring, the polishing head is controlled to swing, and the microstructure array and the polishing pad are controlled to rotate relative to each other, so that the microstructure array is polished, and the first surface of the microstructure becomes a curved surface, thus obtaining a curved microstructure array;
[0091] The polishing pad includes an elastic polishing pad, the pressure applied to the retaining ring is greater than the pressure applied to the polishing head, the pressure is perpendicular to the first surface of the microstructure, and the contact force on the edge region of the microstructure is greater than the contact force on the central region of the microstructure.
[0092] During the polishing process, the polishing head is oscillated, which can improve polishing efficiency and increase working pressure, thereby improving polishing quality.
[0093] Based on any of the above embodiments, in one embodiment of this application, the first surface of the microstructure array is brought into contact with the polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the polishing pad are controlled to rotate relative to each other, thereby polishing the microstructure array.
[0094] The first surface of the microstructure array is brought into contact with the first polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array is controlled to rotate relative to the first polishing pad to perform coarse polishing on the microstructure array;
[0095] The first surface of the microstructure array is brought into contact with the second polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the second polishing pad are controlled to rotate relative to each other to perform fine polishing on the microstructure array.
[0096] For coarse polishing, a double-layer polyurethane polishing pad can be used. For fine polishing, a black damping cloth or non-woven fabric polishing pad can be used. The thinner the polishing pad is for fine polishing, the higher the uniformity and flatness, and the more precise the control of the consistency of microstructure and step difference.
[0097] In this embodiment, the polishing process of the microstructure is divided into coarse polishing and fine polishing, which can improve polishing efficiency.
[0098] The fabrication method of the curved surface microstructure array of this application is verified below using different microstructures.
[0099] Example 1
[0100] The microstructures in the microstructure array are cylindrical in shape, with a diameter of 6 μm and a height of 291 nm on the first surface. Figure 4 As shown, after polishing the microstructure array using a polishing pad, the diameter of the curved microstructure is 4.8 μm and the height is 122.3 nm. Figure 5 As shown. Figure 4 (b) and Figure 5 In (b), the horizontal axis represents the diameter of the micro-cylinder, and the vertical axis represents the height.
[0101] Example 2
[0102] The microstructures in the microstructure array are cylindrical in shape, with a diameter of 6 μm and a height of 288 nm on the first surface. Figure 6 As shown, after polishing the microstructure array using a polishing pad, the diameter of the curved microstructure is 5.1 μm and the height is 117.4 nm. Figure 7 As shown. Figure 6 (b) and Figure 7 In (b), the horizontal axis represents the diameter of the micro-cylinder, and the vertical axis represents the height.
[0103] This application also provides a curved surface microstructure array, which is fabricated using the method for fabricating curved surface microstructure arrays described in any of the above embodiments.
[0104] This application also provides a device comprising the curved microstructure array described in the above embodiments.
[0105] The device can be a micro-optical element, an optical device, or a micro-switching device, etc., where the micro-optical element can be a microlens, prism, grating, etc.
[0106] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0107] The curved microstructure array, its fabrication method, and the device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.
Claims
1. A method for fabricating a curved surface microstructure array, characterized in that, include: Prepare a microstructure array, the microstructure array comprising a plurality of spaced microstructures, the first surface of the microstructure being planar; The microstructure array is fixed to the polishing head of the polishing equipment; The first surface of the microstructure array is brought into contact with the polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the polishing pad are controlled to rotate relative to each other to polish the microstructure array, so that the first surface of the microstructure becomes a curved surface, thus obtaining a curved microstructure array. The pressure is perpendicular to the first surface of the microstructure, and the contact force on the edge region of the microstructure is greater than the contact force on the central region of the microstructure.
2. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, The polishing pad includes a resilient polishing pad.
3. The method for fabricating a curved surface microstructure array as described in claim 2, characterized in that, The elastic polishing pad includes any of the following: Soft metal polishing pads, polishing pads with microporous structure layers, damping cloth polishing pads, and non-woven polishing pads.
4. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, Pressure is applied to the polishing head to control the relative rotation of the microstructure array and the polishing pad. When polishing the microstructure array, the polishing speed of the microstructure array is in the range of 30nm / min to 200nm / min, and the polishing time is in the range of 10s to 180s.
5. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, When pressure is applied to the polishing head to control the relative rotation of the microstructure array and the polishing pad, the pressure range is 1 PSI to 3 PSI, the rotation speed of the polishing head is 80 RPM to 90 RPM, and the rotation speed of the polishing pad is 30 RPM to 200 RPM.
6. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, Also includes: Pressure is applied to the retaining ring, the pressure applied to the retaining ring being greater than the pressure applied to the polishing head; wherein the retaining ring is used to fix the substrate, the microstructure is fixed on the substrate, and the second surface of the microstructure is in contact with the substrate.
7. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, Also includes: Control the oscillation of the polishing head.
8. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, The polishing pad is a black damping cloth polishing pad, the pressure applied to the polishing head is 2.2 PSI, the rotation speed of the polishing head is 87 RPM, the rotation speed of the polishing pad is 93 RPM, the flow rate of the polishing fluid is 120 mL / min to 150 mL / min, and the polishing speed of the microstructure array is 50 nm / min to 160 nm / min.
9. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, The distance between the microstructures ranges from 4D to 100D, where D is the size of the first surface of the microstructure.
10. The method for fabricating a curved surface microstructure array as described in claim 1, characterized in that, The distances between adjacent microstructures may be equal or unequal.
11. The method for fabricating a curved surface microstructure array as described in any one of claims 1 to 10, characterized in that, Polishing the microstructure array involves contacting its first surface with the polishing pad of the polishing device, applying pressure to the polishing head, and controlling the relative rotation of the microstructure array and the polishing pad. The first surface of the microstructure array is brought into contact with the first polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array is controlled to rotate relative to the first polishing pad to perform coarse polishing on the microstructure array; The first surface of the microstructure array is brought into contact with the second polishing pad of the polishing device, pressure is applied to the polishing head, and the microstructure array and the second polishing pad are controlled to rotate relative to each other to perform fine polishing on the microstructure array.
12. A curved surface microstructure array, characterized in that, The curved surface microstructure array is fabricated using the method described in any one of claims 1 to 11.
13. A device, characterized in that, The device includes the curved microstructure array as described in claim 12.