Processing monitoring method and device, electronic equipment, processing monitoring system and storage medium

Abstract

According to the machining monitoring method and device, the electronic equipment, the machining monitoring system and the storage medium, in the process of conducting through hole machining on a glass substrate through ultrafast laser, a first pulse signal of super-continuous white light generated in the machining process is obtained; and the processing state of the through hole is monitored based on the first pulse signal, so that the processing process of the glass through hole can be monitored in real time.

Description

Technical Field

[0001] This application belongs to the field of glass substrate processing technology, and in particular relates to a processing monitoring method, apparatus, electronic device, processing monitoring system and storage medium. Background Technology

[0002] Precision machining of glass substrates is crucial for the manufacturing of high-performance products. Through-glass via (TGV) technology is a core step, enabling the connection of electronic components and signal transmission by machining tiny through holes on the glass substrate. A single leak can render the entire product unusable. Therefore, it is necessary to inspect the glass substrate. In related technologies, leak detection is performed after machining is completed, which results in a delay in leak detection. Summary of the Invention

[0003] In view of this, embodiments of this application provide a processing monitoring method, apparatus, electronic device, processing monitoring system, and storage medium, which can realize real-time monitoring of the processing of glass through holes.

[0004] In a first aspect, embodiments of this application provide a processing monitoring method, including: During the process of using ultrafast laser to process through holes in a glass substrate, the first pulse signal of the supercontinuous white light generated during the processing was obtained; The processing status of the through hole is monitored based on the first pulse signal.

[0005] In some embodiments, the method further includes: The second pulse signal of the transmitted laser through the reflector is obtained, wherein the reflected laser reflected by the reflector is used to process the through hole; The monitoring of the processing status of the through hole based on the first pulse signal includes: The processing status of the through hole is monitored based on the first pulse signal and the second pulse signal.

[0006] In some embodiments, monitoring the processing status of the through hole based on the first pulse signal and the second pulse signal includes: If the ultrafast laser does not meet the processing requirements based on the second pulse signal, the processing status of the through hole is determined to be abnormal. If the ultrafast laser meets the processing requirements based on the second pulse signal, the processing status of the through hole is monitored based on the first pulse signal.

[0007] In some embodiments, monitoring the processing status of the through hole based on the first pulse signal includes: The pulse intensity and waveform information are determined based on the first pulse signal; The processing status of the through hole is monitored based on the pulse intensity and waveform information. If the pulse intensity change is greater than a change threshold and / or the deviation between the waveform information and the preset waveform is greater than a deviation threshold, the processing status of the through hole is determined to be abnormal. The preset waveform is the pulse waveform corresponding to the condition that the processing status of the through hole meets the preset requirements.

[0008] In some embodiments, the method further includes: If the processing status of the through hole is determined to be abnormal, image information of the through hole is acquired; If the processing status of the through hole is determined to be abnormal based on the image information, the through hole is reprocessed.

[0009] Secondly, embodiments of this application provide a processing monitoring device, comprising: The acquisition module is used to acquire the first pulse signal of the supercontinuous white light generated during the process of processing through holes in a glass substrate using an ultrafast laser. The monitoring module is used to monitor the processing status of the through hole based on the first pulse signal.

[0010] Thirdly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method described in any of the above-mentioned embodiments.

[0011] Fourthly, embodiments of this application provide a processing monitoring system, comprising: the electronic device, optical module, and first detection device described in the third aspect, wherein the electronic device is connected to the first detection device, the optical module is used to adjust the ultrafast laser generated by the laser to process the glass substrate, and the first detection device is used to detect the supercontinuous white light generated during the processing and send the detected first pulse signal to the electronic device.

[0012] In some embodiments, the optical module includes a dichroic mirror that transmits ultrafast laser light and reflects supercontinuous white light. The ultrafast laser light passes through the dichroic mirror to process a glass substrate. The supercontinuous white light is incident on the dichroic mirror, and the dichroic mirror reflects the supercontinuous white light so that the first detection device can detect the supercontinuous white light.

[0013] In some embodiments, the optical module further includes: a beam shaping assembly and a reflector; the beam shaping assembly is configured to shape the ultrafast laser into a Bessel beam; the beam shaping assembly includes at least a conical lens, a lens, and an infinity correction objective; the reflector is used for transmitting and reflecting the ultrafast laser; the ultrafast laser reflected by the reflector is formed on a glass substrate through the dichroic mirror and the infinity correction objective; and / or, The processing monitoring system further includes a second detection device, which is communicatively connected to the electronic device. The second detection device is used to detect the ultrafast laser transmitted through the reflector and send the detected second pulse signal to the electronic device.

[0014] In some embodiments, the processing monitoring system further includes: A beam splitter is used to split the supercontinuous white light reflected by the dichroic mirror and to incident the split supercontinuous white light onto the first detection device. The processing monitoring system also includes an image acquisition module, which is communicatively connected to the electronic device and used to acquire image information.

[0015] In some embodiments, the processing monitoring system further includes: A filter, wherein the filter is used to filter out the ultrafast laser from the ultracontinuous white light incident on the first detection device, and / or, Lasers used to emit ultrafast lasers; and / or, The optical module further includes an optical path adjustment sub-module for directing the ultrafast laser reflected by the mirror onto the dichroic mirror.

[0016] Fifthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in any of the preceding claims.

[0017] Sixthly, embodiments of this application provide a computer program product that, when run on a terminal device, causes the electronic device to execute any of the methods described above.

[0018] The beneficial effects of the embodiments in this application compared with the prior art are: This application provides a processing monitoring method that, during the process of processing through holes in a glass substrate using an ultrafast laser, acquires the first pulse signal of the supercontinuous white light generated during the processing; and monitors the processing status of the through holes based on the first pulse signal, thereby enabling real-time monitoring of the glass through hole processing process. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram illustrating the implementation process of a processing monitoring method provided for the purposes of this application; Figure 2 A schematic diagram illustrating the implementation flow of a processing monitoring method provided in this application embodiment; Figure 3 A schematic diagram illustrating the implementation flow of a processing monitoring method provided in this application embodiment; Figure 4 This is a schematic diagram of the structure of a processing monitoring device provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 6 This is a schematic diagram of a processing monitoring system provided in an embodiment of this application. Detailed Implementation

[0021] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0022] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0023] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0024] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once detected," or "in response to detection."

[0025] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0027] Based on the problems in related technologies, embodiments of this application provide a processing monitoring method that can be applied to electronic devices. These electronic devices may include: mobile phones, tablets, wearable devices, augmented reality (AR) / virtual reality (VR) devices, laptops, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), etc. This application does not impose any limitations on the specific type of electronic device. The electronic devices can be applied to processing monitoring systems.

[0028] Figure 1 A schematic diagram illustrating the implementation flow of a processing monitoring method provided for the purposes of this application is shown below. Figure 1 As shown, the processing monitoring methods include: Step S101: During the process of processing through holes in a glass substrate using an ultrafast laser, the first pulse signal of the supercontinuous white light generated during the processing is acquired.

[0029] In this embodiment, the ultrafast laser is an ultrashort pulse laser with a pulse width less than or equal to picoseconds. Ultrafast laser processing of through-holes in glass substrates utilizes lasers with pulse widths in the picosecond (10⁻¹² seconds) to femtosecond (10⁻¹⁵ seconds) range as the light source. A specific optical system focuses the laser beam onto the processing point of the glass through-hole, thereby inducing photochemical ablation on the glass surface. This achieves high-precision, high-efficiency drilling with minimal thermal impact on the surrounding area. Supercontinuous white light is generated during laser processing of the glass substrate. This is typically due to the nonlinear effect resulting from the interaction between the ultrafast laser and the glass material, leading to significant spectral broadening. The emitted light contains multiple wavelengths, which mix to form supercontinuous white light. The first pulse signal refers to the pulse-like signal related to the supercontinuous white light acquired during processing. The first pulse signal reflects the temporal variation characteristics of the supercontinuous white light, such as the time of its appearance, duration, and intensity changes. Analysis of the first pulse signal allows for the acquisition of key information during processing, enabling monitoring of the processing status.

[0030] In this embodiment, a laser with appropriate parameters can be selected. Based on the material and thickness of the glass substrate and the required via size, the laser's wavelength, pulse energy, pulse width, repetition frequency, and other parameters are adjusted to fix the glass substrate on the processing platform, ensuring its accurate and stable position. The laser is then activated to process vias in the glass substrate according to a preset processing path. During processing, the laser interacts with the glass substrate, generating supercontinuous white light. A first detection device is placed near the processing area to capture the supercontinuous white light generated during processing. The first detection device converts the optical signal into an electrical signal and transmits the electrical signal to an electronic device. The electronic device amplifies and filters the electrical signal to improve its quality and signal-to-noise ratio, finally converting it into a digital signal, i.e., obtaining the first pulse signal. The first detection device may include: an optical sensor, a photodetector, a photomultiplier tube, etc.

[0031] Step S102: Monitor the processing status of the through hole based on the first pulse signal.

[0032] In this embodiment, the acquired first pulse signal can be analyzed using methods such as time-domain analysis, frequency-domain analysis, or combined time-frequency analysis. By analyzing the first pulse signal, the processing status of the through hole can be monitored. In time-domain analysis, the changes in parameters such as the amplitude, width, and interval of the pulse signal over time can be analyzed. In frequency-domain analysis, the time-domain signal is converted into a frequency-domain signal using Fourier transform, and the frequency components of the signal are analyzed to obtain characteristic frequency information related to the processing process.

[0033] In this embodiment, the signal characteristics obtained from real-time analysis can be compared with pre-set standard characteristics to determine the processing status of the through-hole. For example, if the amplitude of the pulse signal suddenly increases and the duration becomes longer, it may indicate an abnormality in the processing area, such as local overheating of the glass substrate causing changes in material properties; if the frequency of the pulse signal fluctuates abnormally, it may mean that the laser energy is unstable or the processing path is deviated. Possible causes of abnormalities include: surface dirt, dust, or internal defects.

[0034] In this embodiment of the application, when it is determined that the processing state is abnormal or deviates from the expected requirements, a feedback signal can be issued in a timely manner to control and adjust the laser.

[0035] The method provided in this application, by acquiring and analyzing the first pulse signal of the supercontinuous white light generated during processing in real time, can promptly understand the dynamic status of through-hole processing. Compared with traditional processing monitoring methods, this method can achieve real-time tracking of the processing process, eliminating the need to discover quality problems only after processing is completed, thereby greatly improving production efficiency and product quality.

[0036] In some embodiments, the method further includes: Step S103: Obtain the second pulse signal of the transmitted laser through the ultrafast laser mirror, wherein the reflected laser reflected by the mirror is used to process the through hole.

[0037] In this embodiment, the reflector serves to change the propagation direction of the laser. By rationally designing and arranging the reflectors, the ultrafast laser can be guided to the location on the glass substrate where through-hole processing is required, achieving flexible control of the processing path. Reflectors typically have high reflectivity, efficiently reflecting the laser while having minimal impact on its wavelength, polarization, and other characteristics. When the ultrafast laser irradiates the reflector, besides most of the laser being reflected for processing, a small portion continues to propagate through the reflector; this portion is the transmitted laser. The intensity of the transmitted laser is relatively weaker than the reflected laser, but it still carries information related to the laser source. The second pulse signal refers to the pulse-shaped signal related to the transmitted laser, acquired through a specific sensor. The second pulse signal reflects the temporal variation characteristics of the transmitted laser, such as the moment of its appearance, duration, and intensity fluctuations. These characteristics are closely related to the stability of the laser source, the performance of the reflector, and other factors during the processing.

[0038] In this embodiment, a second detection device can be installed at a suitable position behind the reflector. The second detection device must be able to accurately receive the transmitted laser light passing through the reflector and convert its optical signal into an electrical signal. The installation position of the second detection device needs to be carefully determined based on the size of the reflector, the propagation path of the laser light, and the overall layout of the processing system to ensure that a representative transmitted laser signal can be obtained. The second detection device may include a photoelectric sensor, such as a photodiode or a photodetector array. A second pulse signal can be obtained through the second detection device.

[0039] In this embodiment of the application, step S102 can be achieved by the following steps: monitoring the processing status of the through hole based on the first pulse signal and the second pulse signal.

[0040] In this embodiment, the first pulse signal and the second pulse signal are acquired at different locations, but both are closely related to the through-hole machining process. It is necessary to ensure that these two signals are synchronized in time so that they can be accurately correlated for analysis. Synchronization can be achieved by setting a unified clock signal or by time calibration of the two signals. The synchronized first and second pulse signals are then analyzed to monitor the machining status of the through-hole.

[0041] The method provided in this application relies solely on the first pulse signal to monitor the through-hole machining status. While this can acquire some information about the machined area, it may not comprehensively reflect the status of the entire machining system. Introducing a second pulse signal allows for comprehensive analysis of both signals, enabling the acquisition of machining information from multiple perspectives and a more accurate assessment of the through-hole's machining status. During machining, various types of faults may occur, some of which may be difficult to diagnose accurately using only a single signal. Simultaneous analysis of both the first and second pulse signals provides a more comprehensive understanding of the machining monitoring system's operation, enhancing the ability to diagnose various faults. For example, when a decline in through-hole machining quality is detected, analyzing only the first pulse signal may only indicate a problem at the machined area. However, combining this with the transmitted laser signal allows for further determination of whether the fault is due to unstable laser source energy or other causes, enabling more targeted repair measures.

[0042] In some embodiments, monitoring the processing status of the through hole based on the first pulse signal and the second pulse signal includes: Step S1021: If it is determined that the ultrafast laser does not meet the processing requirements based on the second pulse signal, the processing status of the through hole is determined to be abnormal.

[0043] In this embodiment, "ultrafast laser not meeting processing requirements" refers to the ultrafast laser's parameters exceeding the pre-set range that ensures normal through-hole processing on the glass substrate. Ultrafast laser parameters may include energy, pulse width, repetition rate, beam quality, etc. For example, if the laser energy is too low, it may not be able to penetrate the glass substrate to complete the through-hole processing; if the energy is too high, it may cause the glass substrate to crack or reduce processing accuracy. An inappropriate pulse width may affect the size of the heat-affected zone and the processing quality. An abnormal through-hole processing status indicates that unexpected situations have occurred during the through-hole processing, which may include, but are not limited to, excessive through-hole size deviation, non-compliant shape, poor surface quality, incomplete processing, and unexpected situations such as glass substrate cracking during processing.

[0044] In this embodiment, the acquired second pulse signal can be analyzed in detail. Key characteristic parameters, such as pulse amplitude, width, frequency, and energy, are extracted from the second pulse signal using pre-set analysis algorithms and standards. These key characteristic parameters reflect the intensity and stability of the transmitted laser, and thus indirectly reflect the state of the ultrafast laser source. The extracted characteristic parameters of the second pulse signal are compared with pre-set standard parameter ranges that the ultrafast laser should meet under normal processing conditions. For example, if the standard specifies that the pulse amplitude of the transmitted laser should be within a certain range during normal processing, but the actual pulse amplitude obtained from the analysis exceeds this range, it indicates that there may be a problem with the ultrafast laser. If the comparison results show that the characteristic parameters of the second pulse signal do not meet the standard requirements, it can be determined that the ultrafast laser does not meet the processing requirements. Based on this, the processing state of the corresponding through-hole can be determined to be abnormal.

[0045] Step S1022: If the ultrafast laser meets the processing requirements based on the second pulse signal, the processing status of the through hole is monitored based on the first pulse signal.

[0046] In this embodiment, "meeting the processing requirements" means that the ultrafast laser parameters are within a pre-set, reasonable range that ensures high-quality through-hole processing on the glass substrate, enabling the fabrication of through-holes on the glass substrate that meet the requirements for size, shape, and surface quality, as expected. Meeting the processing requirements indicates normal processing.

[0047] In this embodiment, when the characteristic parameters of the second pulse signal are within the pre-set standard parameter range, the ultrafast laser is considered to meet the processing requirements. At this point, the laser source is considered to be in normal working condition and will not adversely affect the through-hole processing due to laser-related issues. The first pulse signal is then analyzed. A pre-set analysis algorithm can be used to extract key features from the first pulse signal, such as the occurrence time, duration, intensity change, and frequency characteristics of the supercontinuous white light pulse. These features directly reflect the physical changes at the through-hole of the glass substrate, such as material melting, vaporization, and plasma generation. Based on the characteristic analysis results of the first pulse signal, combined with a pre-established correspondence model between the through-hole processing state and the actual processing state, the processing state of the through-hole can be monitored in real time. For example, if the intensity of the supercontinuous white light pulse in the first pulse signal remains stable and meets expectations within a certain time, it may indicate that the processing is proceeding normally; if the intensity of the supercontinuous white light pulse suddenly increases or exhibits abnormal fluctuations, it may indicate an abnormal situation at the processing location.

[0048] The method provided in this application provides a rapid determination of whether ultrafast laser processing meets the requirements. If the ultrafast laser itself has a problem, the abnormal processing status is directly determined without the need for complex analysis of the first pulse signal, saving monitoring time and computing resources and improving overall monitoring efficiency. By first ensuring that the ultrafast laser meets the processing requirements and eliminating the influence of equipment factors such as the laser source and reflectors on the processing status, detailed monitoring of the processing area is then performed based on the first pulse signal. This allows for a more accurate determination of whether the abnormality in the through-hole processing status is caused by factors such as the material properties of the processing area itself, processing parameter settings, or problems with laser-related equipment, thereby improving the accuracy of the monitoring results.

[0049] In some embodiments, monitoring the processing status of the through hole based on the first pulse signal can be achieved through the following steps: Step S1: Determine the pulse intensity and waveform information based on the first pulse signal.

[0050] In this embodiment, pulse intensity refers to the energy level of the first pulse signal at a certain moment, which is usually measured by the signal amplitude. The magnitude of pulse intensity is closely related to the material removal rate and the size of the heat-affected zone at the processing location, and can intuitively reflect the concentration and effect of energy during processing. Waveform information refers to the shape characteristics of the first pulse signal changing over time, including the pulse rise time, fall time, pulse width, peak position, and overall pulse profile. Different processing states will cause the processing location to generate pulse signals with different characteristics; therefore, waveform information can reflect the dynamic changes during processing.

[0051] In this embodiment, the peak amplitude of each pulse can be extracted from the digital signal, and this peak amplitude represents the pulse intensity. The values ​​of each pulse signal at different time points can be recorded to obtain complete pulse waveform data. By analyzing this data, waveform characteristic parameters such as pulse rise time, fall time, and pulse width can be extracted to comprehensively describe the shape characteristics of the pulse.

[0052] Step S2: Monitor the processing status of the through hole based on the pulse intensity and waveform information. If the pulse intensity change is greater than a change threshold and / or the deviation between the waveform information and the preset waveform is greater than a deviation threshold, the processing status of the through hole is determined to be abnormal. The preset waveform is the pulse waveform corresponding to the through hole processing status meeting the preset requirements.

[0053] In this embodiment, the change threshold is a pre-set critical value used to determine whether the pulse intensity change is abnormal. When the pulse intensity change during processing exceeds this threshold, it means that the processing state may be abnormal and further analysis and processing are required. The deviation threshold is a pre-set critical value used to measure the degree of difference between the actual waveform information and the preset waveform. If the deviation between the actual waveform and the preset waveform exceeds this threshold, it indicates that the processing state may have deviated from the normal range, and there may be a fault or abnormality. The preset waveform is the waveform of the first pulse signal corresponding to the through-hole processing state meeting the preset requirements, serving as a reference standard for judging whether the current processing state is normal.

[0054] In this embodiment, the pulse intensity can be continuously monitored during the processing, and the difference between adjacent pulse intensities or the rate of change of pulse intensity over a period of time can be calculated. The calculated intensity change value is compared with a preset change threshold. If the intensity change is greater than the change threshold, it indicates that the concentration of energy or the effect of the process has changed significantly, which may indicate an abnormal processing state. The extracted actual waveform information can be compared and analyzed with a pre-stored preset waveform. Various comparison methods can be used, such as calculating the correlation coefficient and root mean square error between the two waveforms. By setting an appropriate deviation threshold, when the deviation between the actual waveform and the preset waveform is greater than the deviation threshold, it indicates that the physical change process of the processed part is significantly different from the normal situation, and there may be a processing fault or abnormality. When the intensity change is determined to be greater than the change threshold based on the pulse intensity and / or the deviation between the waveform information and the preset waveform is greater than the deviation threshold, the processing state of the through hole is comprehensively judged to be abnormal.

[0055] The method provided in this application, by simultaneously considering both pulse intensity and waveform information, can more comprehensively and accurately reflect the physical changes during the through-hole processing.

[0056] In some embodiments, after step S102, the method further includes: Step S104: If the processing status of the through hole is determined to be abnormal, obtain the image information of the through hole.

[0057] In this embodiment, the image information refers to image data acquired through an image acquisition device that reflects the appearance characteristics of the through-hole. The image data includes detailed information such as the shape, size, and surface texture of the through-hole, and can be used to visually observe and evaluate the processing quality of the through-hole.

[0058] In this embodiment, when the processing status of the through hole is determined to be abnormal, the image acquisition process is triggered. For example, when the pulse signal analysis result shows that the processing status is abnormal, the control system immediately sends a command to the image acquisition device, which can then move to the corresponding position to acquire image information, thereby enabling the electronic device to obtain image information.

[0059] Step S105: If the processing status of the through hole is determined to be abnormal based on the image information, the through hole is reprocessed.

[0060] In this embodiment, the acquired through-hole images can be imported into image processing software for preprocessing operations such as noise reduction, contrast enhancement, and image segmentation to improve image quality and analyzability. Then, image analysis algorithms are used to extract and analyze the features of the through-holes in the image. For example, edge detection algorithms can accurately determine the outline of the through-hole, thereby measuring its diameter and shape; defect recognition algorithms can detect defects such as cracks and burrs on the through-hole surface. The results obtained from image analysis are compared with pre-set processing standards to determine whether the processing status of the through-hole is indeed abnormal. If the image analysis results show that the size, shape, or surface quality of the through-hole does not meet the requirements, the processing status of the through-hole is confirmed to be abnormal again. Based on the type and degree of abnormality determined by image analysis, a corresponding reprocessing plan can be formulated. If the through-hole size is too small, the laser energy can be appropriately increased or the processing time extended; if the through-hole shape is deformed, it may be necessary to adjust the shape of the laser spot or the processing path; if surface defects exist, laser cleaning, grinding, or other processes can be used for repair before reprocessing. The established reprocessing plan is input into the control system of the processing equipment, and the processing equipment is started to reprocess the through hole according to the new parameters and process.

[0061] The method provided in this application uses image information of the through-hole for secondary confirmation, avoiding potential misjudgments that may occur when relying solely on pulse signal monitoring. Image information can intuitively and accurately reflect the actual processing status of the through-hole, making the judgment of abnormalities more reliable. This ensures that only through-holes with genuine processing problems are reprocessed, improving the overall processing quality of the product. Based on the image analysis results, the specific causes and extent of through-hole processing abnormalities can be understood more precisely, allowing for the development of more targeted reprocessing plans. After pulse signal monitoring determines an abnormal processing status, confirmation via image information avoids blind reprocessing, reducing unnecessary processing operations and resource waste. If the image analysis results show that the through-hole processing status actually meets the requirements, reprocessing is unnecessary, saving processing time and costs. This method organically combines pulse signal monitoring, image information confirmation, and reprocessing to form a complete closed-loop control.

[0062] Based on the foregoing embodiments, this application provides a flowchart of a processing monitoring method. Figure 2 This is a schematic diagram illustrating the implementation flow of a processing monitoring method provided in an embodiment of this application, as shown below. Figure 2 As shown, it includes: Step S201: Obtain the first pulse signal and the second pulse signal.

[0063] Step S202: Determine that the processing is normal based on the first pulse signal and the second pulse signal.

[0064] Step S203, processing completed.

[0065] Based on the foregoing embodiments, this application provides a schematic flowchart of the implementation of a processing monitoring method. Figure 3 This is a schematic diagram illustrating the implementation flow of a processing monitoring method provided in an embodiment of this application, as shown below. Figure 3 As shown, it includes: Step S301: Obtain the first pulse signal and the second pulse signal.

[0066] Step S302: Determine that the processing is abnormal based on the first pulse signal and the second pulse signal.

[0067] Step S303: Locate the location of the potential defect based on the first pulse signal and the second pulse signal.

[0068] Step S304: After the entire board is processed, move it to a location where defects may exist.

[0069] Step S305: Obtain image information.

[0070] Step S306: Determine if there is an anomaly.

[0071] In this embodiment of the application, if an abnormality occurs, step S307 is executed; otherwise, the processing ends.

[0072] Step S307: Repair or re-apply.

[0073] In this embodiment, when ultrafast lasers process glass materials, they excite and generate supercontinuous white light. The intensity and waveform of this supercontinuous white light are directly related to the processing state. When the processing state is normal (the glass surface is free of dirt and dust, and there are no internal defects), the laser energy transmission is stable, and the intensity and waveform of the first pulse signal of the supercontinuous white light generated in each processing operation remain consistent. When the processing state is abnormal, the laser energy transmission is obstructed or the focus shifts, affecting the generation of the first pulse signal of the supercontinuous white light. Its pulse intensity and waveform will show significant abnormalities, or even the supercontinuous white light may not be generated at all. The second pulse signal and the first pulse signal can be synchronously acquired through a time synchronizer. Electronic equipment can be used to accurately determine the processing state of each processing point. After locating the defect point, combined with camera visual inspection and reprocessing operations, real-time monitoring and precise repair of leaks can be achieved.

[0074] The method provided in this application enables real-time monitoring of the processing status, reduces the scrap of entire boards, and avoids batch losses caused by leaks by synchronously identifying abnormal sites, significantly reducing production costs. Leveraging the strong correlation between supercontinuous white light and the processing status, combined with dual verification of spectral signal analysis and visual inspection, it can accurately identify potential leaks caused by surface dirt, dust, and internal defects, achieving high defect location accuracy. It integrates fully automated operation of signal acquisition, analysis, defect location, and repair processing, eliminating the need for manual intervention in detection and location, reducing labor costs, shortening production cycles, and helping enterprises achieve large-scale mass production. Designed for TGV laser precision processing scenarios, it is compatible with glass substrates of different specifications and processing requirements, and is also applicable to other laser precision processing fields with extremely high requirements for leak control, making it widely applicable.

[0075] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0076] According to the foregoing embodiments, this application provides a processing monitoring device. The various modules and units included in the device can be implemented by a processor in a computer device; of course, they can also be implemented by specific logic circuits. In the implementation process, the processor can be a central processing unit (CPU), a microprocessor unit (MPU), a digital signal processor (DSP), or a field programmable gate array (FPGA), etc.

[0077] This application provides a control device. Figure 4 This is a schematic diagram of a processing monitoring device provided in an embodiment of this application, as shown below. Figure 4 As shown, the processing monitoring device 400 includes: The acquisition module 401 is used to acquire the first pulse signal of the supercontinuous white light generated during the process of processing a glass substrate through a hole using an ultrafast laser. The monitoring module 402 is used to monitor the processing status of the through hole based on the first pulse signal.

[0078] In some embodiments, the processing monitoring device 400 further includes: An excitation pulse signal acquisition module is used to acquire the second pulse signal of the transmitted laser light through the ultrafast laser mirror, wherein the reflected laser light reflected by the mirror is used to process the through hole; The monitoring module is used to monitor the processing status of the through hole based on the first pulse signal and the second pulse signal.

[0079] In some embodiments, the monitoring module includes: The first determining unit is used to determine that the processing status of the through hole is abnormal when it is determined based on the second pulse signal that the ultrafast laser does not meet the processing requirements. The second determining unit is used to monitor the processing status of the through hole based on the first pulse signal when it is determined based on the second pulse signal that the ultrafast laser meets the processing requirements.

[0080] In some embodiments, the second determining unit includes: A determination subunit is used to determine the pulse intensity and waveform information based on the first pulse signal; The monitoring subunit is used to monitor the processing status of the through hole based on the pulse intensity and waveform information. Specifically, if the pulse intensity change is greater than a change threshold and / or the deviation between the waveform information and a preset waveform is greater than a deviation threshold, the processing status of the through hole is determined to be abnormal. The preset waveform is the pulse waveform corresponding to the condition that the processing status of the through hole meets the preset requirements.

[0081] In some embodiments, the processing monitoring device 400 further includes: The image acquisition module is used to acquire image information of the through hole when it is determined that the processing status of the through hole is abnormal; A reprocessing module is used to reprocess the through hole if the processing status of the through hole is determined to be abnormal based on the image information.

[0082] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0083] In addition, the control device described above can be a software unit, a hardware unit, or a combination of software and hardware. It can also be integrated into electronic devices as an independent component, or exist as an independent terminal device.

[0084] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0085] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 5 As shown, the electronic device 300 of this embodiment may include: at least one processor 30 ( Figure 5Only one processor 30, memory 31, and computer program 32 stored in memory 31 and executable on at least one processor 30 are shown. When the processor 30 executes the computer program 32, it implements the steps in any of the above method embodiments, or the processor 30 executes the computer program 32 to implement the functions of each module / unit in the above device or system embodiments.

[0086] Based on the foregoing embodiments, this application provides a processing monitoring system. Figure 6 This is a schematic diagram of a processing monitoring system provided in an embodiment of this application, as shown below. Figure 6 As shown, it includes: an electronic device 300, an optical module, and a first detection device 12. The electronic device 300 is connected to the first detection device 12. The optical module is used to adjust the ultrafast laser generated by the laser to process the glass substrate. The first detection device 12 is used to detect the supercontinuous white light generated during the processing and send the detected first pulse signal to the electronic device 300.

[0087] In some embodiments, the optical module includes a dichroic mirror 4, which is capable of transmitting ultrafast laser light and reflecting supercontinuous white light. The ultrafast laser forms a Bessel beam through the conical lens 1, lens 2, and the infinity correction objective lens 3, and is processed on a glass substrate. The supercontinuous white light is incident on the dichroic mirror 4, and the dichroic mirror 4 reflects the supercontinuous white light so that the first detection device 12 can detect the supercontinuous white light.

[0088] In some embodiments, the optical module further includes a reflector 14 and a beam shaping assembly. The reflector 14 is used to transmit and reflect ultrafast laser light. The beam shaping assembly includes a conical lens 1, a lens 2, and a dichroic mirror 4. The ultrafast laser light reflected by the reflector 14 is formed on a glass substrate through the conical lens 1, the lens 2, the dichroic mirror 4, and the infinity correction objective lens 3.

[0089] In some embodiments, the processing monitoring system further includes a second detection device 15, which is communicatively connected to the electronic device 300. The second detection device 15 is used to detect the ultrafast laser transmitted by the reflector 14 and send the detected second pulse signal to the electronic device 300.

[0090] In some embodiments, the processing monitoring system further includes: Beam splitter 8 is used to split the supercontinuous white light reflected by the dichroic mirror 4 and then incident the split supercontinuous white light onto the first detection device 12.

[0091] The processing monitoring system also includes an image acquisition module 9, which is communicatively connected to the electronic device 300 and used to acquire image information. Another beam of split supercontinuous white light can be input to the image acquisition module 9.

[0092] In this embodiment of the application, the image acquisition module can be a camera.

[0093] In some embodiments, the processing monitoring system further includes: Filter 11, the filter 11 is used to filter out the ultrafast laser from the ultracontinuous white light incident on the first detection device 12.

[0094] In some embodiments, the processing monitoring system further includes: Laser 7 is used to emit ultrafast lasers.

[0095] In some embodiments, the optical module further includes an optical path adjustment sub-module for directing the ultrafast laser reflected by the mirror onto the dichroic mirror 4. In some embodiments, the optical path adjustment sub-module includes a dielectric / metal mirror 6.

[0096] In this embodiment, there may be multiple dielectric film / metal reflectors 6.

[0097] In some embodiments, the processing monitoring system further includes a time synchronizer, which is disposed between the first detection device and the electronic device, and between the second detection device and the electronic device, for synchronizing the first pulse signal and the second pulse signal in time.

[0098] In some embodiments, the processing monitoring system further includes a motion platform 16 for placing the glass substrate 5.

[0099] The workflow of the processing monitoring system is as follows: After the ultrashort pulse is emitted from the laser 7, part of the beam passes through the reflector 14 and enters the second detection device 15. The second detection device 15 converts the optical signal into a photocurrent, and the resulting second pulse signal is collected by the electronic device 300. The beam reflected by the reflector 14 passes sequentially through the conical lens 1, multiple dielectric film reflectors 6, lens 2, and dichroic mirror 4 before entering the infinity correction objective lens 3 to generate a Bessel beam, which is used to process the glass substrate 5 placed on the motion platform 16. The supercontinuum white light generated during the processing is incident on the dichroic mirror 4 through the infinity correction objective lens 3. Its 1030±5nm component is transmitted, and the remaining spectral components are reflected and enter the 55 beam splitter 8, which splits the beam into two beams of equal intensity. One of the beams is filtered by the filter 11 and then incident on the first detection device 12. The first detection device 12 detects the weak supercontinuum white light (excluding the 1030±5nm component). The components are converted into photocurrent, forming a first pulse signal in pulse form, which is acquired by electronic device 300. The motion platform 16 moves the glass substrate 5 to different processing positions for processing. The time synchronizer 10 synchronizes the second pulse signal acquired by the second detection device 15 with the first pulse signal acquired by the first detection device 12. Electronic device 300 monitors the processing status based on the first and second pulse signals. If there is no significant difference in the pulse intensity and waveform of the first and second pulse signals, the processing is determined to be normal, and the process ends after the entire board processing is completed.

[0100] For example, computer program 32 may be divided into one or more modules / units, one or more of which are stored in memory 31 and executed by processor 30 to complete this application. One or more modules / units may be a series of computer program 32 instruction segments capable of performing a specific function, which describe the execution process of computer program 32 in electronic device 300.

[0101] This application also provides a computer-readable storage medium storing a computer program 32, which, when executed by a processor 30, implements the steps described in the above-described method embodiments.

[0102] This application provides a computer program product that, when run on an electronic device, enables the electronic device to perform the steps described in the various method embodiments above.

[0103] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program 32 instructing related hardware. The computer program 32 can be stored in a computer-readable storage medium, and when executed by the processor 30, it can implement the steps of the various method embodiments described above. The computer program 32 includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to a terminal, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks.

[0104] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0105] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0106] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0107] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0108] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A processing monitoring method, characterized in that, include: During the process of using ultrafast laser to process through holes in a glass substrate, the first pulse signal of the supercontinuous white light generated during the processing was obtained; The processing status of the through hole is monitored based on the first pulse signal.

2. The method according to claim 1, characterized in that, The method further includes: The second pulse signal of the transmitted laser through the ultrafast laser mirror is obtained, wherein the reflected laser reflected by the mirror is used to process the through hole; The monitoring of the processing status of the through hole based on the first pulse signal includes: The processing status of the through hole is monitored based on the first pulse signal and the second pulse signal.

3. The method according to claim 2, characterized in that, The monitoring of the processing status of the through hole based on the first pulse signal and the second pulse signal includes: If the ultrafast laser does not meet the processing requirements based on the second pulse signal, the processing status of the through hole is determined to be abnormal. If the ultrafast laser meets the processing requirements based on the second pulse signal, the processing status of the through hole is monitored based on the first pulse signal.

4. The method according to any one of claims 1 to 3, characterized in that, The monitoring of the processing status of the through hole based on the first pulse signal includes: The pulse intensity and waveform information are determined based on the first pulse signal; The processing status of the through hole is monitored based on the pulse intensity and waveform information. If the pulse intensity change is greater than a change threshold and / or the deviation between the waveform information and the preset waveform is greater than a deviation threshold, the processing status of the through hole is determined to be abnormal. The preset waveform is the pulse waveform corresponding to the condition that the processing status of the through hole meets the preset requirements.

5. The method according to any one of claims 1 to 3, characterized in that, The method further includes: If the processing status of the through hole is determined to be abnormal, image information of the through hole is acquired; If the processing status of the through hole is determined to be abnormal based on the image information, the through hole is reprocessed.

6. A processing monitoring device, characterized in that, include: The acquisition module is used to acquire the first pulse signal of the supercontinuous white light generated during the process of processing through holes in a glass substrate using an ultrafast laser. The monitoring module is used to monitor the processing status of the through hole based on the first pulse signal.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 5.

8. A processing monitoring system, characterized in that, include: The electronic device, optical module, and first detection device according to claim 7, wherein the electronic device is connected to the first detection device, the optical module is used to adjust the ultrafast laser generated by the laser to process the glass substrate, and the first detection device is used to detect the supercontinuous white light generated during the processing and send the detected first pulse signal to the electronic device.

9. The processing monitoring system according to claim 8, characterized in that, The optical module includes a dichroic mirror that can transmit ultrafast laser light and reflect supercontinuous white light. The ultrafast laser light passes through the dichroic mirror to process the glass substrate. The supercontinuous white light is incident on the dichroic mirror, and the dichroic mirror reflects the supercontinuous white light so that the first detection device can detect the supercontinuous white light.

10. The processing monitoring system according to claim 9, characterized in that, The optical module further includes a beam shaping component and a reflector. The beam shaping component is configured to shape the ultrafast laser into a Bessel beam. The beam shaping component includes at least a conical lens, a lens, and an infinity correction objective. The reflector is used to transmit and reflect the ultrafast laser. The ultrafast laser reflected by the reflector is formed on a glass substrate through the dichroic mirror and the infinity correction objective. And / or, The processing monitoring system further includes a second detection device, which is communicatively connected to the electronic device. The second detection device is used to detect the ultrafast laser transmitted through the reflector and send the detected second pulse signal to the electronic device.

11. The processing monitoring system according to claim 9, characterized in that, The processing monitoring system also includes: A beam splitter is used to split the supercontinuous white light reflected by the dichroic mirror and to incident the split supercontinuous white light onto the first detection device. The processing monitoring system also includes an image acquisition module, which is communicatively connected to the electronic device and used to acquire image information.

12. The processing monitoring system according to claim 11, characterized in that, The processing monitoring system also includes: A filter, wherein the filter is used to filter out the ultrafast laser from the ultracontinuous white light incident on the first detection device, and / or, Lasers used to emit ultrafast lasers; and / or, The optical module further includes an optical path adjustment sub-module for directing the ultrafast laser reflected by the mirror onto the dichroic mirror.

13. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1 to 5.

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