Near-zero warping thermal adaptation structure and intelligent optimization method thereof

Abstract

The invention relates to a near-zero warping thermal adaptation structure and an intelligent optimization method thereof, the structure comprises a fixed connection substructure and N thermal deformation release substructures, the fixed connection substructure comprises two solid structures connected through bolts, one solid structure is located in a functional component, and the other solid structure is located in a bearing component. The N thermal deformation release substructures are arranged between the functional component and the bearing component and are distributed in an axial symmetry mode relative to the center line of a connecting bolt for fixing the connecting substructures. The structure is described and constructed by adopting a movable deformable component method, and geometric parameters of an iterative thermal deformation release substructure are updated through a genetic algorithm to obtain an optimal structural design oriented to a space non-uniform and time-varying temperature field. And the integrated design requirements of thermal dimensional stability during the on-orbit period of the spacecraft structure and high rigidity and strength during the launching period can be met.

Description

Technical Field

[0001] This invention belongs to the field of spacecraft structure technology and relates to a near-zero warpage thermal adaptation structure and its intelligent optimization method. Background Technology

[0002] In the aerospace field, during the on-orbit flight of spacecraft or the exploration of extraterrestrial objects by probes, the temperature of the spacecraft exhibits spatial non-uniformity and time-varying characteristics due to the influence of sunlight and the heat generated by its own equipment. The spatial non-uniformity of the temperature field (especially the temperature non-uniformity in the normal direction of structural plates) leads to structural warping deformation, and the time-varying temperature field (different thermal expansion coefficients of materials) leads to warping deformation of heterogeneous structures. These factors significantly impact the main functional performance indicators of spacecraft. For example, the main functional performance of remote sensing satellites heavily relies on the integrity and geometric accuracy of components such as imaging systems, radar arrays, and communication antennas. Thermal deformation on the order of tens of micrometers can also lead to significant mismatches, thus affecting the quality of critical mission data. While metamaterial structures designed for near-zero expansion, which have shown great potential under laboratory conditions, have not performed well when exposed to the typical complex temperature field environment of orbit, limiting their deployment in high-risk missions due to potential risks such as mission failure, signal attenuation, or costly on-orbit recalibration.

[0003] In recent years, thermal warping deformation has attracted attention in the field of aerospace structure technology. Invention patent ZL201910392828.9 discloses a thermally adapted structure and its determination method that combines high resonant frequency and zero warping due to thermal mismatch. This method achieves near-zero warping deformation under temperature changes and has a high first-order resonant frequency by releasing substructures with anisotropic thermal deformation and their spatial self-similar multi-level layout. However, this method does not consider the spatial non-uniformity of the temperature field. The literature "A prediction method of thermal deformation of near-zero warping sandwich structure under non-uniform temperature field, AerospaceScience and Technology 157: 109786, 2025" proposes a method for calculating the thermal warping deformation of near-zero warping sandwich structure under non-uniform temperature field. It can accurately predict the thermal warping deformation of sandwich plate under non-uniform temperature field in the thickness direction. However, this work does not consider the temperature non-uniformity in the in-plane direction of the sandwich plate, nor does it involve the optimization of near-zero thermal warping structure under complex temperature field environment. Summary of the Invention

[0004] The technical problem solved by this invention is to overcome the shortcomings of the prior art and propose a near-zero warpage thermal adaptation structure and its intelligent optimization method.

[0005] The solution of the present invention is: A near-zero warpage thermal adaptation structure is used to connect a functional component and a load-bearing component; it includes a fixed connection substructure and N thermal deformation release substructures; wherein the fixed connection substructure includes a first cylindrical solid structure fixed inside the functional component and a second cylindrical solid structure fixed inside the load-bearing component, and the first cylindrical solid structure and the second cylindrical solid structure are connected by bolts. N heat deformation relief substructures are arranged between the functional component and the load-bearing component, and are symmetrically distributed about the center line of the connecting bolts of the fixed connection substructure. The N heat deformation relief substructures are identical in structure, all being sandwich structures. Each heat deformation relief substructure includes an upper solid structure, a lower solid structure, and fins connecting the upper and lower solid structures. The fins are arranged in parallel. The upper solid structure is connected to the functional component by bolts, and the lower solid structure is connected to the load-bearing component by bolts. The center normal of the fins of each heat deformation relief substructure is perpendicular to the center line of the connecting bolts of the fixed connection substructure.

[0006] Preferably, the design criteria for each heat deformation release substructure are as follows: ①The maximum stress of the fin under extreme thermal deformation conditions should be less than the yield strength of the fin material; ②The fins do not buckle or become unstable under ultimate mechanical conditions.

[0007] Preferably, the number of thermal deformation release substructures is related to the minimum area of ​​functional components and load-bearing components, the service environment temperature, and the service environment mechanical load.

[0008] A design method for a near-zero warp thermal adapter structure includes: Establish structural models of functional components and load-bearing components, and determine the coefficient of thermal expansion of the materials of the functional components. ≥ Coefficient of thermal expansion of the load-bearing component material ; The initial design state of the fixed connection substructure is given: it includes a first cylindrical solid structure fixed inside the functional component and a second cylindrical solid structure fixed inside the load-bearing component. The first cylindrical solid structure and the second cylindrical solid structure are connected by bolts. The initial design state of the thermal deformation release substructure is given, and its design parameters must meet the following two design criteria: ①The maximum stress of the fin under extreme thermal deformation conditions should be less than the yield strength of the fin material; ②The fins do not buckle or become unstable under ultimate mechanical conditions.

[0009] A smart optimization method for near-zero warp thermal adaptor structures includes: S1 constructs an optimization formula, which includes an objective function, design variables, and constraint functions; S2 establishes multiple thermal deformation release substructure models located between functional components and load-bearing components based on the initial design state; S3 uses explicit geometric parameters of components to describe each thermal deformation release substructure, and constructs the thermal adaptation structure model based on the explicit description of the thermal deformation release substructure. S4 divides the thermally adapted structural model into an adaptive mesh, and then performs finite element analysis to obtain the mechanical response of the thermally adapted structural model; S5 extracts the specific numerical value of the objective function from the mechanical response; S6 is optimized using a genetic algorithm until the objective function converges, at which point the updated geometric parameters of the thermal deformation release substructure are obtained. S7 constructs the optimal thermal adaptation structure based on the geometric parameters of the thermal deformation release substructure obtained from S6 optimization.

[0010] Preferably, in S1, the optimization objective of the thermal adaptor structure is to minimize the mass, the design variables of the thermal adaptor structure are the geometric parameters of the thermal deformation release substructure, and the constraint functions of the thermal adaptor structure include the dimensional constraints of the thermal deformation release substructure and the performance constraints of the thermal adaptor structure.

[0011] Preferably, step S3 is implemented as follows: the position of any point on the geometric path of the thermal deformation release substructure is:

[0012] Correspondingly, the length of the heat deformation release substructure is:

[0013] in, These are the coordinates of the first endpoint. These are the coordinates of the second endpoint. For the introduced parameter variables; Mid-face of the component Represented as

[0014] Parameters in the vertical direction; These are the coordinate parameters for the fin path. This refers to the fin height; The above method can be used to construct a thermally adaptable structural model within a mobile deformable component framework.

[0015] Preferably, in step S1, the optimized formula is expressed as: Find

[0016] Minimize

[0017] st

[0018]

[0019]

[0020] in, To design the total vector of variables, Represents the endpoint coordinates of the geometric path of the thermal deformation release substructure in the design variables. This indicates the thickness of the thermal deformation release substructure in the design variables; The objective function is the mass of the thermally adapted structure. This represents the displacement field obtained from the finite element method.

[0021] In the finite element analysis of thermally adaptable structures It is a state function; Design variables The design space consists of all feasible solutions. It is a constraint of the thermally adaptable structure.

[0022] Preferably, in step S6, a genetic algorithm is used for optimization, as follows: (1) Randomly initialize many individuals according to the designed coding rules to form a population; then evaluate the fitness of individuals in the population according to the objective function and constraint function, select individuals with high fitness to the evolution pool, and recombine and mutate the individuals in the evolution pool to generate a breeding population. (2) Select individuals with high fitness from the current population to participate in recombination and mutation evolution; select individuals with high fitness from the parent generation and the offspring obtained from recombination and mutation to form the next generation population; (3) Iterate through step (2) until the optimization meets the convergence condition and the final design of the thermal deformation release substructure geometric parameters are obtained.

[0023] Preferred fitness function

[0024] In the formula This is a penalty factor.

[0025] The advantages of this invention compared to the prior art are: This invention uses a mobile deformable component method to describe and construct the structure. By updating and iterating the geometric parameters of the thermally deformable substructure through a genetic algorithm, the optimal structural design for non-uniform and time-varying temperature fields in space is obtained. This design can meet the integrated design requirements of thermal dimensional stability of spacecraft structures during on-orbit operation and high rigidity during launch. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the thermal deformation release substructure in the thermal adaptation structure of the present invention; Figure 2 This is a schematic diagram of the thermal deformation release substructure layout in the thermal adaptation structure of the present invention; Figure 3 This is a schematic diagram of the functional components, load-bearing components, and their connection relationships in the thermal adaptation structure of the present invention; Figure 4 This is a flowchart of the method for determining the initial design of the thermal adapter structure of the present invention; Figure 5 This is a schematic diagram of the initial design of the thermal adapter structure of the present invention; Figure 6 This is a schematic diagram of the method for describing each thermal deformation release substructure of a movable deformable component using explicit geometric parameters of the components according to the present invention; Figure 7 This invention is based on a thermally adapted structural model constructed using explicit geometric description. Figure 8 This is a schematic diagram of the adaptive mesh divided for the thermal adaptation structure in this invention; Figure 9 This is a flowchart of the genetic algorithm used in this invention. Detailed Implementation

[0027] The invention will now be further described with reference to the accompanying drawings.

[0028] This invention provides a near-zero warpage thermal adapter structure for connecting functional components (such as cameras, antennas, thermal radiators, etc.) and load-bearing components (the main load-bearing structure of a spacecraft). This thermal adapter structure includes one fixed connection substructure and N thermal deformation release substructures. The fixed connection substructure is generally two cylindrical solid structures connected by bolts; one cylindrical solid structure is arranged inside the functional component structure, and the other is arranged inside the load-bearing component structure. The N thermal deformation release substructures adopt the same structural design parameters and are all sandwich structures, consisting of upper and lower solid structures and intermediate fins arranged in parallel. The N thermal deformation release substructures are arranged between the functional component and the load-bearing component, and their specific positions are determined by the optimization method provided by this invention. However, the center normal of the fins of each thermal deformation release substructure points perpendicularly to the center line of the bolts of the fixed connection substructure.

[0029] The initial design method of the thermal adapter structure of this invention is as follows: Establish structural models of functional components and load-bearing components; The coefficient of thermal expansion of the material of the functional component structure is: The coefficient of thermal expansion of the material of the load-bearing component structure is ,and ≥ ; A thermal mismatch structure model is established. The initial design state of the thermal adaptation structure is as follows: one fixed connection substructure includes cylindrical solid structures arranged inside the functional component structure and the load-bearing component structure, respectively. The two solid structures are connected by bolts. The diameter of the solid structure is generally between 5mm and 15mm. N thermal deformation release substructures are identical and are all sandwich structures, consisting of upper and lower solid structures and fins in the middle. The thickness of the upper and lower solid structures is generally between 3-6mm, and the length and width are generally between 50mm and 200mm. The upper and lower solid structures are connected to the functional component structure and the load-bearing component structure by bolts, respectively. The fins are arranged in parallel, with a fin thickness between 0.3mm and 2.0mm, a fin height between 10mm and 30mm, and a fin number of generally 5-20. N thermal deformation release substructures are arranged between the functional component and the load-bearing component. They are axially symmetrical about the bolt centerline of the fixed connection substructure, but the fin center normal of each thermal deformation release substructure is perpendicular to the bolt centerline. The number N of heat deformation release substructures is related to the minimum area of ​​functional and load-bearing components, the service environment temperature, and the mechanical load in the service environment, and is generally controlled between 4 and 40 per m. 2 .

[0030] The core design principles are: ①The maximum stress of the fin under extreme thermal deformation conditions should be less than the yield strength of the fin material; ②The fins do not buckle or become unstable under ultimate mechanical conditions.

[0031] Right now:

[0032]

[0033] Where E is the elastic modulus of the fin material, t is the fin thickness, T1 and T2 are the highest and lowest temperatures in the service environment, h is the fin height, R is the radius of the circumscribed circle of the functional component, and Y... s Where M is the yield strength of the fin material, f1 is a safety factor greater than 1; M1 is the mass of the functional component, g1 is the maximum out-of-plane acceleration of the service environment on the functional structural plate and the load-bearing structural plate, N is the number of thermal deformation release substructures, n is the number of fins in the thermal deformation release substructure, f2 is a safety factor greater than 1, and I... cpLet be the moment of inertia of the fin's cross section.

[0034] This invention provides a near-zero warpage thermal adaptation structure intelligent optimization method, comprising the following steps: An optimization formula is constructed, which includes an objective function, design variables, and constraint functions. The optimization objective of the thermal adaptation structure is to minimize the mass. The design variables of the thermal adaptation structure are the geometric parameters of the thermal deformation release substructure components. The constraint functions of the thermal adaptation structure include dimensional constraints of the thermal deformation release substructure, performance constraints of the thermal adaptation structure, and value range constraints of the geometric parameters of the thermal deformation release substructure. Acquire multiple thermal deformation release substructure components located between structural plates; Each thermal deformation release substructure is described using explicit geometric parameters of the components, and the thermal adaptation structure model is constructed based on the explicit description of the thermal deformation release substructure. After dividing the thermally adaptive structure model into an adaptive mesh, finite element analysis is performed to obtain the mechanical response of the thermally adaptive structure model. Obtain the objective function value from the mechanical response; Based on the optimized formula, a genetic algorithm is used for optimization to obtain updated geometric parameters of the thermal deformation release substructure component. Then, the process proceeds to the step of constructing the thermal adaptation structure model based on the explicit description of the thermal deformation release substructure until the objective function converges and the updated geometric parameters of the thermal deformation release substructure component are obtained. The optimal thermal adaptation structure is constructed based on the optimized geometric parameters of the thermal deformation release substructure component.

[0035] Example: This invention proposes a near-zero warpage thermal adaptation structure for connecting functional components and load-bearing components. It includes: one fixed connection substructure and N thermal deformation release substructures. The fixed connection substructure is generally two cylindrical solid structures connected by bolts. One cylindrical solid structure is arranged inside the functional component structure, and the other is arranged inside the load-bearing component structure. The diameter of the solid structures is generally 5mm-15mm. The N thermal deformation release substructures preferably have the same structural design parameters and are all sandwich structures, consisting of upper and lower solid structures and intermediate fins. The fins are arranged in parallel. Figure 1 As shown; the N heat deformation release substructures are identical, all being sandwich structures, consisting of upper and lower solid structures and fins in the middle. The thickness of the upper and lower solid structures is generally 3-6mm, and the length and width are generally between 50mm and 200mm. The upper and lower solid structures are connected to the functional component structure and the load-bearing component structure by bolts, respectively. The fins are arranged in parallel, with a fin thickness between 0.3mm and 2.0mm, a fin height between 10mm and 30mm, and a fin number of generally 5-20.

[0036] The number N of heat deformation release substructures is related to the minimum area of ​​functional and load-bearing components, the service environment temperature, and the mechanical load in the service environment, and is generally controlled between 4 and 40 per m. 2 ,like Figure 2 As shown.

[0037] Reference Figure 3 , Figure 3 This is a schematic diagram of the functional components, the load-bearing components, and their connection relationships in an embodiment of the thermal adaptation structure; the coefficient of thermal expansion of the functional components is greater than that of the load-bearing components.

[0038] Both functional and load-bearing components are made of lightweight materials; for example, functional components are made of aluminum alloy and load-bearing components are made of carbon fiber reinforced resin matrix composites.

[0039] Reference Figure 4 , Figure 4 An embodiment of a method for determining the initial design of a thermal adapter structure is illustrated. It includes the following steps: a. The coefficients of thermal expansion of the materials of the functional components and the load-bearing components are respectively denoted as... and ,in ≥ The functional component is a rectangular aluminum alloy honeycomb sandwich panel with a central circular hole, both the length and width are D1=1m and the thickness is 10mm, with a square hole in the center. The load-bearing component is a rectangular carbon fiber reinforced resin matrix composite honeycomb sandwich panel, both the length and width are D2=1m and the thickness is 20mm.

[0040] b. The fixed connection substructure consists of two cylindrical solid structures arranged inside the functional component structure and the load-bearing component structure, respectively. The two solid structures are connected by bolts, and the diameter of the solid structure is 10mm.

[0041] c. The heat deformation release substructure is a sandwich structure, consisting of upper and lower solid structures and intermediate fins, made of TC-4 titanium alloy. It is planned to be integrated additively manufactured using laser selective melting forming technology. The upper and lower solid structures are 5mm thick and 50mm long and wide. The upper and lower solid structures are connected to the functional component structure and the load-bearing component structure respectively by bolts. The fins are arranged in parallel, with a fin thickness of t=1mm, a fin height of h, and a fin quantity of n=10. The core design principle is: ①The maximum stress of the fin under extreme thermal deformation conditions should be less than the yield strength of the fin material; ②The fins do not buckle or become unstable under ultimate mechanical conditions.

[0042] Combination Figures 5-8 This paper describes an embodiment of a near-zero warp thermal adaptation structure intelligent optimization method proposed in this application.

[0043] like Figure 5 As shown, the optimization target is the thermal adaptation structure, and the specific optimization steps are as follows: An optimization formula is constructed, which includes an objective function, design variables, and constraint functions. The optimization objective of the thermal adaptation structure is to minimize the mass. The design variables of the thermal adaptation structure are the geometric parameters of the thermal deformation release substructure components. The constraint functions of the thermal adaptation structure include the dimensional constraints of the thermal deformation release substructure, the performance constraints of the thermal adaptation structure, and the value range constraints of the geometric parameters of the thermal deformation release substructure. In this embodiment, after obtaining the optimized design parameters, target optimized parameters, and constraint parameters, an optimized formula can be constructed. The optimization objective is to minimize the mass of the thermal adaptor structure. The geometric parameters of the thermal deformation release substructure component of the thermal adaptor structure are the optimized design variables. The dimensional constraints of the thermal deformation release substructure, the performance constraints of the thermal adaptor structure, and the range constraints of the geometric parameters of the thermal deformation release substructure are the constraint functions. Specifically, the optimized formula can be expressed as: Find

[0044] Minimize

[0045] st

[0046]

[0047]

[0048] in, To design the total vector of variables, This represents the endpoint coordinates of the geometric path of the thermal deformation release substructure component in the design variables. This indicates the thickness of the thermal deformation release substructure component in the design variables; The objective function is the mass of the thermal adapter structure; in the finite element analysis of the thermal adapter structure, It is a state function; Design variables The design space consists of all feasible solutions. These are some dimensional constraints and performance constraints of the thermal adaptation structure. This represents the displacement field obtained from the finite element method.

[0049] Acquire multiple thermal deformation release substructure components located between functional components and load-bearing components.

[0050] The thermal adaptor structure is described using the movable deformable component method, such as... Figure 6As shown, each thermal deformation release substructure is described using explicit geometric parameters of the components. Based on the explicit description of the thermal deformation release substructures, the thermal adaptation structure model is constructed, as follows: Figure 7 As shown.

[0051] In this embodiment, for the thermal adapter structure, a thermal deformation release substructure component is used to describe and construct the thermal adapter structure. First, multiple thermal deformation release substructure components located between the functional components and the load-bearing components need to be obtained, and these are referred to together. Figure 5 and Figure 6 For the acquired thermal deformation release substructure component, its explicit geometric parameters are used for description. Specifically, these parameters include the component's geometric path endpoint coordinates, component width, component solid portion thickness, fin height, fin thickness, and number of fins. Within the framework of the movable deformable component, the aforementioned thermal adaptation structure model is constructed using these geometric parameters, as follows: Figure 7 As shown.

[0052] Specifically, the description of the thermal deformation release substructure component under the movable deformable component framework is as follows: The position of any point on the geometric path of the thermal deformation release substructure component is:

[0053] Accordingly, the length of the heat deformation release substructure component is:

[0054] in, These are the coordinates of the first endpoint. These are the coordinates of the second endpoint. For the introduced parameter variables, Along the length direction, the front and rear ends are referred to as the first endpoint and the second endpoint, respectively.

[0055] Furthermore, by introducing another parameter in the vertical direction... ( ), the middle surface of the component It can be represented as

[0056] The above description method can be used to construct a thermally adaptable structural model within the framework of a mobile deformable component.

[0057] The thermally adapted structural model is divided into adaptive meshes, such as... Figure 8 As shown, finite element analysis was then performed to obtain the mechanical response of the thermally adapted structural model. Obtain the objective function value from the mechanical response; Considering the complexity of the formulation of the optimization problem described above, commonly used gradient-based algorithms will be unable to efficiently find a feasible solution. Therefore, this embodiment adopts a robust and stable genetic algorithm (see [reference]). Figure 9 At the start of the genetic algorithm computation, many individuals are randomly initialized according to the designed encoding rules (different individuals correspond to one design, and all individuals form one or more populations). Then, the fitness of individuals in the population is evaluated according to the objective function and constraint function, and some individuals are selected into the evolutionary pool according to the built-in fitness criteria. Then, the individuals in the evolutionary pool are recombined and mutated with a certain probability to generate a breeding population.

[0058] At this point, both parent and breeding populations exist in the environment. The genetic algorithm selects individuals from these populations to obtain a new generation (i.e., the updated geometric parameters of the thermal deformation release substructure component). This process involves two selections: first, selecting individuals from the current population to participate in evolutionary operations such as recombination and mutation; second, selecting individuals from the parent and the breeding offspring obtained through recombination and mutation to be retained for the next generation. This process iterates continuously until the optimization meets the convergence condition, yielding the final designed geometric parameters of the thermal deformation release substructure component. Finally, based on the optimized geometric parameters of the thermal deformation release substructure component, an optimal near-zero warpage thermal adaptation structure is constructed.

[0059] In this embodiment, the optimization objective is to minimize the quality, while genetic algorithms typically employ a fitness maximization strategy and struggle to directly handle constraint functions. Therefore, this paper defines the fitness function based on the objective function and constraint functions, namely…

[0060] In the formula As the penalty factor, a positive real number with a large absolute value is chosen here, specifically 10. 6 Compared to the original objective function, the fitness function here is penalized based on the constraint function. Designs that do not meet the constraint functions (including constraints on the dimensions of the thermal deformation release substructure, the performance constraints of the thermal adaptation structure, and the range of values ​​for the geometric parameters of the thermal deformation release substructure) have a smaller fitness function and will be eliminated under the fitness maximization framework. For designs that meet the constraint functions, their fitness function is the negative of the objective function (i.e., quality), and under the fitness maximization framework, it tends to reduce the response of the objective function.

[0061] This invention first determines an initial design for a near-zero warpage thermal adaptor structure; then, it obtains multiple thermal deformation release substructure components located between the functional component structure and the load-bearing component structure; it describes each thermal deformation release substructure using the explicit geometric parameters of the components and constructs the aforementioned thermal adaptor structure model; after dividing the thermal adaptor structure model into an adaptive mesh, it performs finite element analysis to obtain the mechanical response of the thermal adaptor structure model; it obtains the optimization objective and constraint function values ​​from the mechanical response; it constructs an optimization formula, which includes an objective function, design variables, and constraint functions, wherein the optimization objective of the thermal adaptor structure is to minimize the mass, and the thermal adaptor structure design... The variables are the geometric parameters of the thermal deformation release substructure component. The thermal adaptation structure constraint function includes dimensional constraints, performance constraints, and value range constraints of the thermal deformation release substructure geometric parameters. A genetic algorithm is used for optimization to obtain updated geometric parameters of the thermal deformation release substructure component. The process then proceeds to the step of constructing the thermal adaptation structure model based on the explicit description of the thermal deformation release substructure until the objective function converges, at which point updated geometric parameters of the thermal deformation release substructure component are obtained. The optimal thermal adaptation structure is constructed based on the optimized geometric parameters of the thermal deformation release substructure component, thus overcoming the shortcomings of existing technologies.

[0062] This invention first determines an initial design for a near-zero warpage thermal adaptor structure; then, it acquires multiple thermal deformation release substructure components located between the functional component structure and the load-bearing component structure; it describes each thermal deformation release substructure using the explicit geometric parameters of the components and constructs the thermal adaptor structure model; after dividing the thermal adaptor structure model into an adaptive mesh, it performs finite element analysis to obtain the mechanical response of the thermal adaptor structure model; it obtains the optimization objective and constraint function values ​​from the mechanical response; it constructs an optimization formula, which includes an objective function, design variables, and constraint functions, wherein the optimization objective of the thermal adaptor structure is to minimize its mass. The design variables are the geometric parameters of the thermal deformation release substructure component. The thermal adaptation structure constraint function includes dimensional constraints, performance constraints, and value range constraints of the thermal deformation release substructure geometric parameters. A genetic algorithm is used for optimization to obtain updated geometric parameters of the thermal deformation release substructure component. The process then proceeds to the step of constructing the thermal adaptation structure model based on the explicit description of the thermal deformation release substructure, until the objective function converges, at which point updated geometric parameters of the thermal deformation release substructure component are obtained. The optimal thermal adaptation structure is constructed based on the optimized geometric parameters of the thermal deformation release substructure component, thus overcoming the shortcomings of existing technologies.

[0063] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A near-zero warpage thermal adapter structure, characterized in that: Used to connect functional components and load-bearing components; includes a fixed connection substructure and N thermal deformation release substructures; The fixed connection substructure includes a first cylindrical solid structure fixed inside the functional component and a second cylindrical solid structure fixed inside the load-bearing component. The first cylindrical solid structure and the second cylindrical solid structure are connected by bolts. N heat deformation relief substructures are arranged between the functional component and the load-bearing component, and are symmetrically distributed about the center line of the connecting bolts of the fixed connection substructure. The N heat deformation relief substructures are identical in structure, all being sandwich structures. Each heat deformation relief substructure includes an upper solid structure, a lower solid structure, and fins connecting the upper and lower solid structures. The fins are arranged in parallel. The upper solid structure is connected to the functional component by bolts, and the lower solid structure is connected to the load-bearing component by bolts. The center normal of the fins of each heat deformation relief substructure is perpendicular to the center line of the connecting bolts of the fixed connection substructure.

2. The near-zero warpage thermal adapter structure according to claim 1, characterized in that: The design criteria for each heat deformation release substructure are as follows: ①The maximum stress of the fin under extreme thermal deformation conditions should be less than the yield strength of the fin material; ②The fins do not buckle or become unstable under ultimate mechanical conditions.

3. The near-zero warpage thermal adapter structure according to claim 1, characterized in that: The number of thermal deformation release substructures is related to the minimum area of ​​functional and load-bearing components, service environment temperature, and service environment mechanical load.

4. The design method of a near-zero warpage thermal adapter structure as described in claim 1, characterized in that, include: Establish structural models of functional components and load-bearing components, and determine the coefficient of thermal expansion of the materials of the functional components. ≥ Coefficient of thermal expansion of the load-bearing component material ; The initial design state of the fixed connection substructure is given: it includes a first cylindrical solid structure fixed inside the functional component and a second cylindrical solid structure fixed inside the load-bearing component. The first cylindrical solid structure and the second cylindrical solid structure are connected by bolts. The initial design state of the thermal deformation release substructure is given, and its design parameters must meet the following two design criteria: ①The maximum stress of the fin under extreme thermal deformation conditions should be less than the yield strength of the fin material; ②The fins do not buckle or become unstable under ultimate mechanical conditions.

5. The intelligent optimization method for a near-zero warpage thermal adaptation structure as described in claim 1, characterized in that, include: S1 constructs an optimization formula, which includes an objective function, design variables, and constraint functions; S2 establishes multiple thermal deformation release substructure models located between functional components and load-bearing components based on the initial design state; S3 uses explicit geometric parameters of components to describe each thermal deformation release substructure, and constructs the thermal adaptation structure model based on the explicit description of the thermal deformation release substructure. S4 divides the thermally adapted structural model into an adaptive mesh, and then performs finite element analysis to obtain the mechanical response of the thermally adapted structural model; S5 extracts the specific numerical value of the objective function from the mechanical response; S6 is optimized using a genetic algorithm until the objective function converges, at which point the updated geometric parameters of the thermal deformation release substructure are obtained. S7 constructs the optimal thermal adaptation structure based on the geometric parameters of the thermal deformation release substructure obtained from S6 optimization.

6. The intelligent optimization method according to claim 5, characterized in that, In S1, the optimization objective of the thermal adaptation structure is to minimize the mass, the design variables of the thermal adaptation structure are the geometric parameters of the thermal deformation release substructure, and the constraint functions of the thermal adaptation structure include the dimensional constraints of the thermal deformation release substructure and the performance constraints of the thermal adaptation structure.

7. The intelligent optimization method according to claim 5, characterized in that, The implementation method of step S3 is as follows: The position of any point on the geometric path of the thermal deformation release substructure is: Correspondingly, the length of the heat deformation release substructure is: in, These are the coordinates of the first endpoint. These are the coordinates of the second endpoint. For the introduced parameter variables; Mid-face of the component Represented as Parameters in the vertical direction; These are the coordinate parameters for the fin path. This refers to the fin height; The above method can be used to construct a thermally adaptable structural model within a mobile deformable component framework.

8. The intelligent optimization method according to claim 5, characterized in that, In step S1, the optimized formula is expressed as: Find Minimize st in, To design the total vector of variables, Represents the endpoint coordinates of the geometric path of the thermal deformation release substructure in the design variables. This indicates the thickness of the thermal deformation release substructure in the design variables; The objective function is the mass of the thermally adapted structure. This represents the displacement field obtained from the finite element method. In the finite element analysis of thermally adaptable structures It is a state function; Design variables The design space consists of all feasible solutions. It is a constraint of the thermally adaptable structure.

9. The intelligent optimization method according to claim 5, characterized in that, In step S6, a genetic algorithm is used for optimization, as follows: (1) Randomly initialize many individuals according to the designed coding rules to form a population; then evaluate the fitness of individuals in the population according to the objective function and constraint function, select individuals with high fitness to the evolution pool, and recombine and mutate the individuals in the evolution pool to generate a breeding population. (2) Select individuals with high fitness from the current population to participate in recombination and mutation evolution; select individuals with high fitness from the parent generation and the offspring obtained from recombination and mutation to form the next generation population; (3) Iterate through step (2) until the optimization meets the convergence condition and the final design of the thermal deformation release substructure geometric parameters are obtained.

10. The intelligent optimization method according to claim 9, characterized in that, fitness function In the formula This is a penalty factor.

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