Water-cooled jacket for crystal pulling of semiconductor single crystal furnace with novel structure

By optimizing the water-cooling jacket structure and argon blowing design, the problems of water leakage and oxide contamination in traditional water-cooling jackets have been solved, improving crystal pulling speed and quality and extending service life.

CN121853152APending Publication Date: 2026-04-14SHANGHAI HANHONG PRECISION MACHINERY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI HANHONG PRECISION MACHINERY
Filing Date
2026-01-27
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

Traditional water-cooled jackets are prone to water leakage at the welded joints, which affects the crystal pulling speed and quality, and there is also a risk of oxide accumulation contaminating the silicon liquid surface.

Method used

A novel water-cooled jacket structure was designed, including an upper and lower mounting section and a water-cooling section. The welding position was moved to more than 90mm above the bottom, and an argon-blown structure and a reasonable water flow channel design were adopted to avoid water leakage and oxide generation.

Benefits of technology

It improved crystal pulling speed and quality, avoided water leakage and oxide contamination from the water-cooled jacket, extended service life, and ensured the normal operation of the testing equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a water-cooled jacket for crystal pulling of a semiconductor single crystal furnace with a novel structure. A water-cooled jacket for crystal pulling of a semiconductor single crystal furnace with a novel structure comprises a water-cooled jacket body, and the water-cooled jacket body comprises a mounting part and a water-cooled part which are arranged up and down; the water-cooling part comprises a water-cooling inner ring and a water-cooling outer ring which are arranged inside and outside, the water-cooling inner ring and the water-cooling outer ring are both of an integrated structure, the bottom of the water-cooling inner ring is provided with an axial extension part extending upwards, the axial extension part is fixedly connected with the bottom of the water-cooling outer ring in a welded mode, and the joint of the water-cooling outer ring and the axial extension part is 90 mm higher than the bottom of the water-cooling part; the top of the water-cooling inner ring and the top of the water-cooling outer ring are welded and fixedly connected with the lower side of the mounting inner ring; and the water-cooling inner ring, the water-cooling outer ring and the mounting inner ring define a water-cooling channel which is butted and communicated with the annular inner cavity. By optimizing the structure of the water cooling part, the welding position is moved upwards, and the water leakage problem caused by the high temperature of the bottom is avoided.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a water-cooled jacket for a single crystal furnace. Background Technology

[0002] In semiconductor crystal pulling, the temperature of the crystal pulling region is controlled by stabilizing the thermal environment of single crystal growth using a water-cooling jacket.

[0003] Traditional water-cooling jackets form the water-cooling area by welding the inner and outer rings together. However, the welded joint between the inner and outer rings is located at the bottom of the water-cooling jacket, which can easily lead to water leakage at the weld.

[0004] To improve crystal pulling speed and quality, a water-cooling jacket structure is needed that overcomes water leakage, ensures the stability of water flow velocity inside the crystal pulling water-cooling jacket, and avoids obstructing the testing equipment inside the single crystal furnace. This is an urgent area for improvement. Summary of the Invention

[0005] To address the problems existing in the prior art, the present invention provides a novel structure for semiconductor single crystal furnace crystal pulling with a water-cooled jacket, which solves at least one of the above-mentioned technical problems.

[0006] The technical solution of the present invention is: a novel structure semiconductor single crystal furnace crystal pulling water cooling jacket, comprising a water cooling jacket body, characterized in that the water cooling jacket body comprises an upper and lower mounting part and a water cooling part;

[0007] The mounting part includes an inner mounting ring and an outer mounting ring, which are arranged inside and outside. The inner mounting ring and the outer mounting ring are welded together to form an annular inner cavity. The outer mounting ring is provided with an inlet and an outlet that connect to the annular inner cavity.

[0008] The inner wall of the inner ring is provided with an annular groove, and an argon gas sealing plate is welded and fixed to the groove opening. The argon gas sealing plate and the annular groove are connected to form an annular gas chamber. The argon gas sealing plate is provided with an argon gas outlet that is connected to and communicates with the annular gas chamber.

[0009] An air inlet pipe is welded and fixed to the mounting part, and the air inlet pipe passes through the outer ring of the mounting and connects with the annular air chamber.

[0010] The water-cooling unit includes an inner water-cooling ring and an outer water-cooling ring, both of which are integral structures. The bottom of the inner water-cooling ring has an upwardly extending axial extension, which is welded and fixedly connected to the bottom of the outer water-cooling ring. The connection between the outer water-cooling ring and the axial extension is 90mm higher than the bottom of the water-cooling unit.

[0011] The top of the water-cooled inner ring and the top of the water-cooled outer ring are welded and fixedly connected to the lower side of the mounting inner ring.

[0012] The water-cooled inner ring, the water-cooled outer ring, and the mounting inner ring form a water-cooled channel that connects and communicates with the annular inner cavity.

[0013] This invention optimizes the structure of the water-cooling section by moving the welding position upwards, thus avoiding water leakage caused by high temperatures at the bottom.

[0014] This invention avoids the generation of oxides at the water cooling jacket by using an argon blowing structure, because oxide accumulation can cause poor crystal pulling quality or oxides falling into the silicon liquid surface and causing pollution.

[0015] More preferably, the bottom of the water-cooling section has a clearance notch for avoiding detection equipment, the clearance notch penetrates the water-cooling section radially, and the bottom of the clearance notch is open.

[0016] More preferably, the water-cooled inner ring includes a cylindrical inner wall, the bottom of which is connected to a radially extending portion in the shape of an annulus, and the outer side of the radially extending portion is connected to the bottom of the axially extending portion.

[0017] The inner cylinder wall has an inner U-shaped notch with the opening facing downwards, the axial extension has a longitudinal through notch, and the radial extension has an interface that connects the opening of the longitudinal notch and the inner U-shaped notch.

[0018] The bottom of the water-cooled outer ring has a downward-facing U-shaped notch;

[0019] The U-shaped notch and the longitudinal notch are aligned to form an outer U-shaped notch, and the edges of the outer U-shaped notch and the inner U-shaped notch are connected by an inverted U-shaped structure.

[0020] More preferably, a water baffle is welded and fixed to the outer side of the water-cooling inner ring; the water baffle divides the water-cooling channel into an inlet channel that guides water flow from top to bottom and an outlet channel that guides water flow from bottom to top, and the inlet channel and the outlet channel are connected and interconnected;

[0021] The inner ring of the mounting is provided with a first opening that connects and communicates with the water inlet channel;

[0022] The inner ring of the mounting is provided with a second opening that connects and communicates with the water outlet channel;

[0023] An upper water baffle plate is welded and fixed inside the annular inner cavity. The upper water baffle plate divides the annular inner circle into a water inlet cavity and a water outlet cavity. One end of the water inlet cavity is connected to the water inlet. The water inlet cavity is connected to the water inlet channel through the first opening.

[0024] One end of the water outlet cavity is connected to the water outlet, and the water outlet cavity is connected to the water outlet channel through the second opening.

[0025] More preferably, the water-blocking plate is connected to two vertically arranged open slotted vertical plates to form the inverted U-shaped structure.

[0026] More preferably, the mounting inner ring includes an axially extending annular inner ring, and a circular ring plate is connected to the bottom of the annular inner ring;

[0027] The bottom of the annular plate has a first step for installing the water-cooled inner ring;

[0028] The bottom of the annular plate has a second step for mounting the water-cooled outer ring.

[0029] More preferably, the annular piece has the first opening and the second opening on the side adjacent to the inner ring of the annular shape.

[0030] More preferably, the mounting outer ring includes an axially extending annular outer ring, the top of which is connected to an inwardly extending inner extension disc, the inner side of which is welded and fixedly connected to the outer side of the annular inner ring.

[0031] The bottom inner side of the annular outer ring is welded and fixedly connected to the outer side of the circular ring piece;

[0032] The annular outer ring has a longitudinally through mounting hole.

[0033] More preferably, the water inlet channel and the water outlet channel are located on the left and right sides of the water cooling section.

[0034] More preferably, the water-blocking plate is an arc-shaped plate arranged from top to bottom;

[0035] The outer side of the inner ring is welded and fixed with longitudinal plates at both ends located in the length direction of the arc-shaped plate;

[0036] The two ends of the adjacent arc-shaped plates along their length are alternately connected to the vertically arranged longitudinal plates.

[0037] It facilitates the creation of meandering water flow channels.

[0038] More preferably, the water-cooling part and the mounting part are both made of SUS310S.

[0039] A further preferred assembly method includes the following steps:

[0040] The first step is to weld the water-cooled inner ring to the mounting inner ring.

[0041] The second step is to spot weld the water baffle plate to the outer surface of the water-cooled inner ring.

[0042] The third step is to weld the vertical plate with the opening slot to the water-cooled inner ring.

[0043] Step 5: Weld the upper baffle plate to the inner ring.

[0044] Step 6: After positioning and fixing the outer ring and the inner ring, weld them together;

[0045] Step 7: Weld the argon gas sealing plate to the inner ring of the installation unit.

[0046] Step 8: Insert the intake pipe into the vent hole of the outer ring and weld it in place.

[0047] Step 9: Weld the inner ring, water-cooled inner ring, water-cooled outer ring, and opening slot vertical plate together.

[0048] Step 10: After all welding is completed, conduct a water pressure test to ensure there is no water leakage.

[0049] Step 11: Surface sandblasting or polishing treatment. After completion, clean the surface thoroughly and then package and ship it.

[0050] Beneficial effects:

[0051] 1. To ensure uniform cooling around the crystal during pulling, the water-cooling jacket is made as long as possible and as close to the liquid surface as possible, thus increasing the crystal pulling speed. To prevent the CCD camera diameter measurement and monocular eye measurement of the crystal rod diameter from being affected throughout the entire crystal pulling process—including crystal pulling, shoulder formation, shoulder rotation, and equal diameter measurement—a notch for CCD camera measurement and monocular eye measurement is designed at the bottom of the water-cooling jacket.

[0052] 2. By adopting a reasonable water channel structure, the water flow direction is ensured to always flow from top to bottom and then slowly flow upwards in circles, thus ensuring that water cooling proceeds from bottom to top.

[0053] 3. High-temperature resistant material SUS310S is used to ensure that the material will not change or its strength will decrease even when crystal pulling is carried out in a high-temperature environment.

[0054] 4. The weld seams are arranged reasonably, with the weld seams located 100mm above the bottom to avoid the previous situation where the weld seams were located at the bottom, which was prone to water leakage under high temperature environments.

[0055] 5. The water-cooled inner ring and the water-cooled outer ring are machined as a single piece with a bottom height of 100mm. This avoids the leakage problems that were caused by welds on the inner ring in the past. The improved structure avoids water leakage and improves the service life of the water-cooling jacket.

[0056] 6. An argon-blown structure is used at the water-cooling jacket to prevent the generation of oxides at the water-cooling jacket, because the accumulation of oxides will cause poor crystal pulling quality, or oxides will fall into the silicon liquid surface and cause pollution. Attached Figure Description

[0057] Figure 1 This is a cross-sectional view of a specific embodiment 1 of the present invention;

[0058] Figure 2 This is a schematic diagram of a structure for concealing the outer ring in a specific embodiment 1 of the present invention;

[0059] Figure 3 This is a schematic diagram of a specific embodiment 1 of the present invention;

[0060] Figure 4 This is a schematic diagram of a structure for concealing the water-cooling outer ring in a specific embodiment 1 of the present invention.

[0061] In the diagram: 1. Water-cooled inner ring, 2. Water-cooled outer ring, 3. Water baffle, 4. Installing the inner ring, 5. Installing the outer ring.

[0062] 6. Argon gas sealing plate, 7. Upper water-proof plate, 8. Gas inlet pipe, 9. Opening slot vertical plate. Detailed Implementation

[0063] See Figures 1 to 4 Specific embodiment 1: A novel structure for semiconductor single crystal furnace crystal pulling using a water-cooling jacket includes a water-cooling jacket body, comprising an upper and lower mounting section and a water-cooling section; the mounting section includes an inner mounting ring 4 and an outer mounting ring 5, which are welded together to form an annular inner cavity; the outer mounting ring 5 has an inlet and an outlet that connect to the annular inner cavity; the inner wall of the inner mounting ring 4 has an annular groove, and an argon gas sealing plate 6 is welded and fixed to the groove opening; the argon gas sealing plate 6 and the annular groove connect to form an annular gas chamber; the argon gas sealing plate 6 has an argon gas outlet that connects to and communicates with the annular gas chamber; the mounting section is welded and fixed. An air intake pipe 8 passes through the mounting outer ring 5 and connects with the annular air chamber. The water-cooling section includes an inner water-cooling ring 1 and an outer water-cooling ring 2, both of which are integral structures. The bottom of the inner water-cooling ring 1 has an upwardly extending axial extension, which is welded and fixedly connected to the bottom of the outer water-cooling ring 2. The connection point between the outer water-cooling ring 2 and the axial extension is 90mm higher than the bottom of the water-cooling section. The tops of the inner water-cooling ring 1 and the outer water-cooling ring 2 are welded and fixedly connected to the lower side of the mounting inner ring 4. The inner water-cooling ring 1, the outer water-cooling ring 2, and the mounting inner ring 4 form a water-cooling channel that connects with and communicates with the annular inner cavity. The connection point between the outer water-cooling ring 2 and the axial extension is 100mm higher than the bottom of the water-cooling section.

[0064] This invention optimizes the structure of the water-cooling section by moving the welding position upwards, thus avoiding water leakage caused by high temperatures at the bottom.

[0065] This invention avoids the generation of oxides at the water cooling jacket by using an argon blowing structure, because oxide accumulation can cause poor crystal pulling quality or oxides falling into the silicon liquid surface and causing pollution.

[0066] The bottom of the water-cooling section has a clearance notch for avoiding detection equipment. The clearance notch extends radially through the water-cooling section and has an opening at the bottom.

[0067] The water-cooled inner ring 1 includes a cylindrical inner wall, the bottom of which is connected to a radially extending portion in the shape of an annulus, and the outer side of the radially extending portion is connected to the bottom of the axially extending portion. The inner wall has an inner U-shaped notch with its opening facing downwards, the axially extending portion has a longitudinally penetrating notch, and the radially extending portion has an interface at the opening of the longitudinal notch and the inner U-shaped notch. The bottom of the water-cooled outer ring 2 has a U-shaped notch with its opening facing downwards. The U-shaped notch and the longitudinal notch are connected to form an outer U-shaped notch, and the edges of the outer U-shaped notch and the inner U-shaped notch are connected by an inverted U-shaped structure.

[0068] A water baffle plate 3 is welded and fixed to the outer side of the water-cooled inner ring 1; the water baffle plate 3 divides the water-cooling channel into an inlet channel that flows from top to bottom and an outlet channel that flows from bottom to top, and the inlet channel and the outlet channel are connected; a first opening that connects and communicates with the inlet channel is opened on the mounting inner ring 4; a second opening that connects and communicates with the outlet channel is opened on the mounting inner ring 4; an upper water baffle plate 7 is welded and fixed inside the annular inner cavity, and the upper water baffle plate 7 divides the annular inner ring into an inlet chamber and an outlet chamber, one end of the inlet chamber is connected and communicates with the inlet port, and the inlet chamber is connected and communicates with the inlet channel through the first opening; one end of the outlet chamber is connected and communicates with the outlet port, and the outlet chamber is connected and communicates with the outlet channel through the second opening.

[0069] The water-blocking plate 3 is connected to two vertically set open slot vertical plates 9 to form an inverted U-shaped structure.

[0070] The mounting inner ring 4 includes an axially extending annular inner ring, the bottom of which is connected to a circular ring plate; the bottom of the circular ring plate has a first step for mounting the water-cooled inner ring 1; the bottom of the circular ring plate has a second step for mounting the water-cooled outer ring 2.

[0071] The annular plate has a first opening and a second opening on the side adjacent to the inner ring.

[0072] The mounting outer ring 5 includes an axially extending annular outer ring, the top of which is connected to an inwardly extending inner extension disc, the inner side of which is welded and fixedly connected to the outer side of the annular inner ring; the bottom inner side of the annular outer ring is welded and fixedly connected to the outer side of the circular ring piece; and a longitudinally through mounting hole is provided on the annular outer ring.

[0073] The water inlet and outlet channels are located on the left and right sides of the water cooling section.

[0074] The baffle plate 3 is an arc-shaped plate arranged from top to bottom; longitudinal plates located at both ends along the length of the arc-shaped plate are welded and fixed to the outer side of the inner ring 4; the two ends along the length of adjacent arc-shaped plates are alternately connected to the vertically arranged longitudinal plates. This facilitates the creation of a meandering water flow channel.

[0075] The water cooling unit and the mounting unit are both made of SUS310S.

[0076] The assembly method includes the following steps:

[0077] Step 1: Weld the water-cooled inner ring 1 to the mounting inner ring 4. Use double-sided slit welding and ensure the weld is smooth.

[0078] The second step is to spot weld the water baffle plate 3 to the outer surface of the water-cooled inner ring 1; the spot welding is required to be intermittent.

[0079] The third step is to weld the vertical plate of the opening groove to the water-cooled inner ring 1; double-sided welding is used, and the weld seam is required to be flat.

[0080] Step 5: Weld the upper water-blocking plate 7 to the inner ring 4; spot welding is performed, and intermittent welding can be used for spot welding.

[0081] Step 6: After positioning and fixing the outer ring 5 and the inner ring 4, weld them together; use double-sided slit welding, and the weld should be flat.

[0082] Step 7: Weld the argon gas sealing plate 6 to the inner ring 4; use a method of welding with a slit at one end and a fillet weld at the other end to make the weld secure, and the weld should be flat and smooth.

[0083] Step 8: Insert the intake pipe 8 into the vent hole of the outer ring 5 and weld the intake pipe 8 in place; the outer ring 5 is installed by circumferential fillet welding to make a complete round weld.

[0084] Step 9: Weld the inner ring 4, water-cooled inner ring 1, water-cooled outer ring 2, and the vertical plate 9 with the opening groove together; perform full welding by double-sided slit welding or fillet welding.

[0085] Step 10: After all welding is completed, conduct a water pressure test to ensure there is no water leakage.

[0086] Step 11: Surface sandblasting or polishing treatment. After completion, clean the surface thoroughly and then package and ship it.

[0087] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A novel water-cooled jacket for crystal pulling in a semiconductor single crystal furnace, comprising a water-cooled jacket body, characterized in that, The water-cooled jacket includes an upper and lower mounting section and a water-cooling section; The mounting part includes an inner mounting ring and an outer mounting ring, which are arranged inside and outside. The inner mounting ring and the outer mounting ring are welded together to form an annular inner cavity. The outer mounting ring is provided with an inlet and an outlet that connect to the annular inner cavity. The inner wall of the inner ring is provided with an annular groove, and an argon gas sealing plate is welded and fixed to the groove opening. The argon gas sealing plate and the annular groove are connected to form an annular gas chamber. The argon gas sealing plate is provided with an argon gas outlet that is connected to and communicates with the annular gas chamber. An air inlet pipe is welded and fixed to the mounting part, and the air inlet pipe passes through the outer ring of the mounting and connects with the annular air chamber. The water-cooling unit includes an inner water-cooling ring and an outer water-cooling ring, both of which are integral structures. The bottom of the inner water-cooling ring has an upwardly extending axial extension, which is welded and fixedly connected to the bottom of the outer water-cooling ring. The connection between the outer water-cooling ring and the axial extension is 90mm higher than the bottom of the water-cooling unit. The top of the water-cooled inner ring and the top of the water-cooled outer ring are welded and fixedly connected to the lower side of the mounting inner ring. The water-cooled inner ring, the water-cooled outer ring, and the mounting inner ring form a water-cooled channel that connects and communicates with the annular inner cavity.

2. The novel semiconductor single crystal furnace with water-cooled jacket according to claim 1, characterized in that: The bottom of the water-cooling section has a clearance notch for avoiding detection equipment. The clearance notch penetrates the water-cooling section radially and has an opening at the bottom.

3. The novel semiconductor single crystal furnace with water-cooled jacket according to claim 1, characterized in that: The water-cooled inner ring includes a cylindrical inner wall, the bottom of which is connected to a radially extending portion in the shape of an annulus, and the outer side of the radially extending portion is connected to the bottom of the axially extending portion. The inner cylinder wall has an inner U-shaped notch with the opening facing downwards, the axial extension has a longitudinal through notch, and the radial extension has an interface that connects the opening of the longitudinal notch and the inner U-shaped notch. The bottom of the water-cooled outer ring has a downward-facing U-shaped notch; The U-shaped notch and the longitudinal notch are aligned to form an outer U-shaped notch, and the edges of the outer U-shaped notch and the inner U-shaped notch are connected by an inverted U-shaped structure.

4. The novel semiconductor single crystal furnace with water-cooled jacket according to claim 1, characterized in that: A water baffle plate is welded and fixed to the outer side of the water-cooling inner ring; the water baffle plate divides the water-cooling channel into an inlet channel that flows from top to bottom and an outlet channel that flows from bottom to top, and the inlet channel and the outlet channel are connected and interconnected. The inner ring of the mounting is provided with a first opening that connects and communicates with the water inlet channel; The inner ring of the mounting is provided with a second opening that connects and communicates with the water outlet channel; An upper water baffle plate is welded and fixed inside the annular inner cavity. The upper water baffle plate divides the annular inner circle into a water inlet cavity and a water outlet cavity. One end of the water inlet cavity is connected to the water inlet. The water inlet cavity is connected to the water inlet channel through the first opening. One end of the water outlet cavity is connected to the water outlet, and the water outlet cavity is connected to the water outlet channel through the second opening.

5. The novel semiconductor single crystal furnace with water-cooled jacket according to claim 4, characterized in that: The water-blocking plate is connected to two vertically arranged open slotted vertical plates to form the inverted U-shaped structure.

6. The novel semiconductor single crystal furnace with water-cooled jacket according to claim 4, characterized in that: The mounting inner ring includes an axially extending annular inner ring, and a circular ring plate is connected to the bottom of the annular inner ring; The bottom of the annular plate has a first step for installing the water-cooled inner ring; The bottom of the annular plate has a second step for mounting the water-cooled outer ring.

7. A novel semiconductor single crystal furnace with a water-cooled jacket according to claim 6, characterized in that: The annular plate has a first opening and a second opening on the side adjacent to the inner ring.

8. A novel semiconductor single crystal furnace with a water-cooled jacket according to claim 6, characterized in that: The mounting outer ring includes an axially extending annular outer ring, the top of which is connected to an inwardly extending inner extension disc, the inner side of which is welded and fixedly connected to the outer side of the annular inner ring. The bottom inner side of the annular outer ring is welded and fixedly connected to the outer side of the circular ring piece; The annular outer ring has a longitudinally through mounting hole.

9. A novel semiconductor single crystal furnace with a water-cooled jacket according to claim 4, characterized in that: The water-blocking plate is an arc-shaped plate arranged from top to bottom; The outer side of the inner ring is welded and fixed with longitudinal plates at both ends located in the length direction of the arc-shaped plate; The two ends of the adjacent arc-shaped plates along their length are alternately connected to the vertically arranged longitudinal plates.

10. A novel semiconductor single crystal furnace with a water-cooled jacket according to claim 1, characterized in that: The assembly method includes the following steps: Step 1: Weld the water-cooled inner ring to the mounting inner ring. The second step is to spot weld the water baffle plate to the outer surface of the water-cooled inner ring. The third step is to weld the vertical plate with the opening slot to the water-cooled inner ring. Step 5: Weld the upper baffle plate to the inner ring. Step 6: After positioning and fixing the outer ring and the inner ring, weld them together; Step 7: Weld the argon gas sealing plate to the inner ring of the installation unit. Step 8: Insert the intake pipe into the vent hole of the outer ring and weld it in place. Step 9: Weld the inner ring, water-cooled inner ring, water-cooled outer ring, and opening slot vertical plate together. Step 10: After all welding is completed, conduct a water pressure test to ensure there is no water leakage. Step 11: Surface sandblasting or polishing treatment. After completion, clean the surface thoroughly and then package and ship it.