Device, method and system for rapidly measuring three-dimensional shape of micro-lens array

Abstract

The invention discloses a device, a method and a system for rapidly measuring the three-dimensional shape of a micro-lens array, and belongs to the technical field of micro-lens array measurement. According to the invention, efficient and accurate measurement and batch analysis of the three-dimensional morphology of the micro-lens array are realized by using the white light interference measuring head, the XYZ three-axis displacement table, the control processing equipment, and a built-in three-point positioning algorithm, a path planning algorithm, an automatic measurement and analysis algorithm and the like, the measurement result can be visually displayed, and a final report can be generated.

Description

Technical Field

[0001] This application belongs to the field of microlens array measurement technology, specifically relating to a device, method and system for rapid measurement of the three-dimensional morphology of a microlens array. Background Technology

[0002] A microlens array (MLA) is an optical element composed of multiple micrometer-sized lens units, widely used in optical imaging, optical communication, light field imaging, and illumination systems. The typical measurement parameters for microlens arrays are shown in Table 1.

[0003] Table 1

[0004]

[0005] Currently, the three-dimensional topography measurement of microlens arrays is mainly divided into the following non-contact optical measurement techniques: white light interferometry, confocal method, spectral confocal method and phase shift interferometry. The advantages and limitations of different techniques are shown in Table 2.

[0006] Table 2

[0007]

[0008] Currently, there are few dedicated testing devices for the three-dimensional morphology of microlens arrays. Most still use general-purpose white light interferometers as the main measuring equipment. However, although general-purpose white light interferometers can obtain the desired results when measuring microlens arrays, sample positioning is difficult. It is necessary to make specific fixtures or spend a lot of time manually positioning the sample. At the same time, the efficiency of evaluating hundreds or thousands of microlens units is extremely low. Summary of the Invention

[0009] To address the limitations of existing three-dimensional morphology detection devices for microlens arrays, this application proposes a rapid three-dimensional morphology measurement device, method, and system for microlens arrays. This system is used for rapid measurement and batch analysis of the three-dimensional morphology of microlens arrays, and features simple sample positioning, fast measurement speed, high measurement accuracy, and ease of batch detection.

[0010] This application is achieved through the following technical solution:

[0011] A rapid three-dimensional topography measurement device for a microlens array includes: a control and processing device, a chassis, a base, a crossbeam, an X-axis displacement stage, a Y-axis displacement stage, a Z-axis displacement stage, a pitch adjustment stage, a support plate, and a white light interferometer measuring head.

[0012] The base is installed together with the shock absorber on the chassis to isolate the effects of external vibrations.

[0013] The X-axis displacement stage is mounted on the base and can move along the X direction under the drive of the control and processing device;

[0014] The Y-axis displacement stage is mounted on the X-axis displacement stage and can move along the Y direction under the drive of the control and processing device;

[0015] The pitch adjustment platform is mounted on the Y-axis displacement platform, and the bearing plate is mounted on the pitch adjustment platform. The bearing plate is used to mount the sample to be tested, and the attitude of the bearing plate is adjusted by the pitch adjustment platform.

[0016] The crossbeam is fixedly mounted on the base, the Z-axis displacement stage is mounted on the crossbeam and can move along the Z direction under the drive of the control and processing device, the white light interferometer measuring head is mounted on the Z-axis displacement stage, and the objective lens axis of the white light interferometer measuring head is located at the center of the XY axis; the control and processing device receives the measurement results of the white light interferometer measuring head and processes them.

[0017] In some embodiments, the carrier plate is a vacuum suction cup, which fixes the sample to be tested onto the vacuum suction cup by vacuum adsorption.

[0018] Secondly, this application proposes a measurement method based on any embodiment of the above-mentioned rapid three-dimensional topography measurement device, including:

[0019] Input the CAD model of the sample to be tested, and generate the measurement path based on the CAD model of the sample to be tested;

[0020] Based on the three-point positioning principle, the coordinate system of the CAD model is aligned with the coordinate system of the sample to be tested;

[0021] Automatic measurement steps: Automatically measure the next target location according to the measurement path;

[0022] The measurement result is compared with a preset measurement tolerance. If the measurement result is greater than the measurement tolerance, the circle at the current measurement position is marked with a first color; otherwise, the circle at the current measurement position is marked with a second color. The first color and the second color are different.

[0023] Determine whether the measurement of all target locations on the measurement path has been completed. If so, generate a measurement report; otherwise, return to the automatic measurement step to measure the next target location.

[0024] In some embodiments, generating the measurement path based on the CAD model of the sample to be tested includes:

[0025] Automatically identify the custom graphic element information in the CAD model and remove discrete points from it;

[0026] A planar circle, including its position coordinates and radius, is obtained by fitting primitive information after removing discrete points;

[0027] The planar circles are aligned according to the arrangement rules of the test samples, and the bow-shaped trajectory is planned.

[0028] In some implementations, aligning the coordinate system of the CAD model with the coordinate system of the sample to be tested based on the three-point positioning principle includes:

[0029] The white light interferometer measuring head is aligned with the plane position of the microlens array. The interference fringes are adjusted to the range of 0 to 1 by adjusting the pitch adjustment stage to ensure that the microlens array and the white light interferometer measuring head remain perpendicular.

[0030] The X-axis and Y-axis displacement stages are controlled to move the selected first microlens vertex directly below the white light interferometer measuring head, focus and position it to the interference fringe corresponding to the first microlens vertex; the interference fringe is a concentric ring shape;

[0031] Find the primitive corresponding to the first microlens vertex in the CAD model, generate a circular mark at the center of the primitive, and fine-tune the X-axis displacement stage and the Y-axis displacement stage so that the generated circular mark coincides with the concentric rings of the interference fringes, thus completing the marking of the first positioning point.

[0032] Repeat the above operation to mark the vertices of the microlenses at two other different locations in sequence, thus completing the marking of the three positioning points; at this point, the coordinate system of the CAD model and the sample under test are aligned.

[0033] In some implementations, the three positioning points should meet the following conditions:

[0034] The three positioning points are not on the same straight line, yet they are clearly distinguishable.

[0035] In some implementations, the automatic measurement of the next target location based on the measurement path includes:

[0036] The X-axis and Y-axis displacement stages are controlled according to the coordinates of the target position to adjust the position of the sample under test, so that the vertex of the microlens corresponding to the target position of the sample under test is directly facing the white light interferometer measuring head.

[0037] The measurement is performed using the white light interferometer measuring head, and the measurement results are uploaded to the control and processing equipment.

[0038] In some embodiments, the measurement method of this application further includes:

[0039] The measurement results are then visualized.

[0040] Thirdly, this application proposes a measurement system based on any embodiment of the above-described rapid three-dimensional topography measurement device, comprising:

[0041] The path generation unit is used to input the CAD model of the sample to be tested and generate a measurement path based on the CAD model of the sample to be tested.

[0042] The positioning unit is used to align the coordinate system of the CAD model with the coordinate system of the sample to be tested based on the three-point positioning principle.

[0043] A measurement unit is used to automatically measure the next target location according to the measurement path;

[0044] An analysis unit is used to compare the measurement result with a preset measurement tolerance. If the measurement result is greater than the measurement tolerance, the circle at the current measurement position is marked with a first color; otherwise, the circle at the current measurement position is marked with a second color. The first color and the second color are different.

[0045] In addition, a report generation unit is used to determine whether the measurement of all target positions on the measurement path has been completed. If so, a measurement report is generated; otherwise, the measurement unit is driven to measure the next target position.

[0046] In some embodiments, the measurement system of this application further includes:

[0047] A visual interface is provided for displaying the measurement results.

[0048] This application discloses a rapid measurement device, method, and system for the three-dimensional topography of a microlens array. It utilizes a white light interferometer head, an XYZ three-axis displacement stage, a control and processing device, and built-in three-point positioning algorithm, path planning algorithm, and automatic measurement and analysis algorithm to achieve efficient and accurate measurement and batch analysis of the three-dimensional topography of the microlens array. It can also intuitively display the measurement results and generate a final report. Attached Figure Description

[0049] The accompanying drawings, which are included to provide a further understanding of the embodiments of this application and form part of this application, do not constitute a limitation on the embodiments of this application. In the drawings:

[0050] Figure 1 This is a schematic diagram of the structure of the rapid three-dimensional topography measurement device proposed in the embodiments of this application;

[0051] Figure 2A schematic diagram of the three positioning points selected for this application embodiment and the resulting I-shaped measurement path;

[0052] Figure 3 This is a flowchart of the measurement method proposed in the embodiments of this application;

[0053] Figure 4 This is a block diagram illustrating the principle of the measurement system proposed in an embodiment of this application.

[0054] Figure 5 This is a schematic diagram of the electronic device proposed in the embodiments of this application;

[0055] Figure 6 This is a schematic diagram of a computer-readable storage medium proposed in an embodiment of this application;

[0056] Figure 7 This refers to partial graphic element information identified based on the imported CAD model;

[0057] Figure 8 This is a schematic diagram of some measurement points in the generated measurement path;

[0058] Figure 9 A diagram showing the results of local measurements;

[0059] Figure 10 This is a physical image of a microlens array measured using the rapid three-dimensional topography measurement device proposed in this application.

[0060] Figure reference numerals and corresponding component names:

[0061] 1-Chassis, 2-Base, 3-X-axis displacement stage, 4-Crossbeam, 5-Z-axis displacement stage, 6-White light interferometer measuring head, 7-Sample to be measured, 8-Bearing plate, 9-Pitch adjustment stage, 10-Y-axis displacement stage, 300-Measurement system, 301-Path generation unit, 302-Positioning unit, 303-Measurement unit, 304-Analysis unit, 305-Report generation unit, 400-Electronic device, 410-Memory B, 420-Processor B, 411-Computer program A, 500-Computer-readable storage medium, 511-Computer program B. Detailed Implementation

[0062] In the following, the terms “comprising” or “may include” as used in the various embodiments of this application indicate the presence of a function, operation, or element of the invention and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in the various embodiments of this application, the terms “comprising,” “having,” and their cognates are intended only to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing, or adding one or more combinations of the foregoing.

[0063] In various embodiments of this application, the expression "or" or "at least one of A and / or B" includes any combination or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A and / or B" may include A, may include B, or may include both A and B.

[0064] The terms used in the various embodiments of this application (such as "first," "second," etc.) may modify various constituent elements in the various embodiments, but do not limit the corresponding constituent elements. For example, the above terms do not limit the order and / or importance of the elements. The above terms are only used for the purpose of distinguishing one element from other elements. For example, a first user device and a second user device refer to different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0065] It should be noted that if a description is made of "connecting" one component to another, then the first component can be directly connected to the second component, and a third component can be "connected" between the first and second components. Conversely, when a component is "directly connected" to another component, it can be understood that there is no third component between the first and second components.

[0066] The terminology used in the various embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the various embodiments of this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of this application pertain. The terms (such as those defined in a generally used dictionary) are to be interpreted as having the same meaning as in the context of the relevant technical field and are not to be interpreted as having an idealized or overly formal meaning, unless clearly defined in the various embodiments of this application.

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this application are only for explaining this application and are not intended to limit this application.

[0068] like Figure 1 As shown in the embodiment of this application, a rapid three-dimensional topography measurement device for a microlens array is proposed, including a control and processing device (industrial computer, motion control card), a chassis 1 (including shock absorber), a base 2, a crossbeam 4, an X-axis displacement stage 3, a Y-axis displacement stage 10, a Z-axis displacement stage 5, a pitch adjustment stage 9, a support plate 8, and a white light interferometer measuring head 6, etc. The base 2 (which can be a marble base) is installed together with the shock absorber on the chassis 1 to isolate the influence of external vibrations. The X-axis displacement stage 3 is installed on the marble base 2 and can move along the X direction under drive to adjust the X displacement of the device mounted on it. The Y-axis displacement stage 10 is installed on the X-axis displacement stage 3 and can move along the Y direction under drive to adjust the Y displacement of the device mounted on it. The pitch adjustment stage 9 is installed on the Y-axis displacement stage 10, and the bearing plate 8 (which can be a vacuum chuck to fix the sample 7 to be tested on the vacuum chuck by vacuum adsorption) is installed on the pitch adjustment stage 9. The attitude of the bearing plate 8 can be adjusted by the pitch adjustment stage 9. The bearing plate 8 is used to install the sample 7 to be tested (i.e., the microlens array to be tested). The crossbeam 4 is fixedly installed on the marble base 2, the Z-axis displacement stage 5 is installed on the crossbeam 4 and can move along the Z direction under drive, and the white light interferometer measuring head 6 is installed on the Z-axis displacement stage 5. The objective lens axis of the white light reflectometer measuring head 6 is located in the center of the crossbeam for focusing and data acquisition. The XYZ three-axis displacement stage is controlled by the control and processing equipment, while the pitch adjustment stage is manually adjustable (after one adjustment, the probe and the sample will remain perpendicular). The measurement results from the white light interferometer measuring head 6 are fed back to the control and processing equipment for subsequent processing, display, and output. The X-axis is perpendicular to the Y-axis, and the plane containing the XY axes is parallel to the surface of base 2. The Z-axis is perpendicular to the surface of base 2.

[0069] The working principle of this rapid three-dimensional topography measurement device is as follows:

[0070] By controlling the measurement software pre-installed on the processing equipment, the software identifies the center coordinates of each microlens in the microlens array based on the CAD model of the sample to be tested (i.e., the microlens array to be tested), and manually guides the equipment to find the center positions of the first microlens in the first row, the last microlens in the first row, and the last microlens in the corresponding column of the first row. Figure 2As shown in the figure, after guiding the position of the three points, the measurement software will align the CAD model with the coordinates of the sample to be measured and automatically plan the measurement path, and automatically perform subsequent measurements. During the measurement, the measurement results can be automatically determined according to the tolerance settings, and different colors will be displayed at the corresponding positions on the path diagram according to the measurement results. After the measurement is completed, the data to be exported can be selected as needed to automatically generate a measurement report.

[0071] Furthermore, embodiments of this application also propose a measurement method based on the aforementioned rapid three-dimensional topography measurement device, such as... Figure 3 As shown, the measurement method includes the following steps:

[0072] Step 1: Input the CAD model of the sample to be tested, and generate the measurement path based on the CAD model of the sample to be tested;

[0073] Step 2: Based on the three-point positioning principle, align the coordinate system of the CAD model with the coordinate system of the sample to be tested;

[0074] Step 3: Automatically measure the next target location based on the measurement path;

[0075] Step 4: Compare the measurement result with the preset measurement tolerance. If the measurement result is greater than the measurement tolerance, mark the circle at the current measurement position with the first color; otherwise, mark the circle at the current measurement position with the second color. The first color and the second color are different. The measurement tolerance is the allowable tolerance range of the component and is used as the standard for judging whether the measurement result is qualified.

[0076] Step 5: Determine whether the measurement of all target locations on the measurement path has been completed. If so, generate a measurement report; otherwise, return to step 3 to measure the next target location.

[0077] Optionally, the measurement method proposed in this application embodiment further includes: visualizing the measurement results. Figure 9 The results of local measurements are shown.

[0078] Furthermore, in step 1 of this application embodiment, the measurement path is generated as follows:

[0079] Automatically identify the center coordinates of microlenses in the CAD model and manually remove non-microlens features, i.e., remove interference;

[0080] A planar circle, including its position coordinates and radius, is obtained by fitting the primitive information after removing interference.

[0081] Align the plane circles according to the arrangement rules of the samples to be tested, and complete the process. Figure 2 The diagram shows the planning of the I-shaped trajectory (measurement path). Figure 7 This shows some of the primitive information obtained from the CAD model. Figure 8 The diagram shows some of the measurement locations (measurement points) in the generated measurement path.

[0082] Furthermore, in step 2 of this embodiment, based on the three-point positioning principle, the coordinate system of the CAD model is aligned with the coordinate system of the sample to be tested, including:

[0083] Control the white light interferometer measuring head to align with the plane position of the microlens array, and adjust the interference fringes to the range of 0 to 1 by adjusting the pitch adjustment stage to ensure that the microlens array and the white light interferometer measuring head remain perpendicular;

[0084] The X-axis and Y-axis displacement stages are controlled to move the selected first microlens vertex directly below the white light interferometer measuring head, focus and position it to the interference fringes corresponding to the microlens vertex; at this time, the spherical or aspherical surface will show typical concentric ring interference fringes.

[0085] Find the primitive corresponding to the first microlens vertex in the CAD model, generate a circular mark at the center of the primitive, and fine-tune the X-axis and Y-axis displacement stages to make the generated circular mark coincide with the concentric rings of the interference fringes, thus completing the marking of the first positioning point.

[0086] Repeat the above steps to mark the vertices of the other two selected microlenses at different locations, completing the marking of the three positioning points. At this point, the coordinate systems of the CAD model and the sample under test are precisely aligned, enabling the subsequent measurement process to be automatically executed under the guidance of the CAD model. The selection of the three positioning points should meet the following requirements: the positions of the three positioning points are not on the same straight line, and they are also easily identifiable. Generally, the first microlens in the first row, the last microlens in the first row, and the last microlens in the corresponding column of the first row can be used as positioning points. Figure 2 The location shown.

[0087] Furthermore, in step 3 of this application embodiment, the automatic measurement process includes:

[0088] The X-axis and Y-axis displacement stages are controlled to adjust the position of the sample under test according to the coordinates of the target position, so that the vertex of the microlens corresponding to the target position of the sample under test is directly facing the white light interferometer measuring head. The white light interferometer measuring head is used to perform the measurement and the collected data is uploaded to the control and processing equipment, thereby realizing the measurement. Figure 10 A physical image of a microlens array measured using the apparatus of this application is shown.

[0089] Furthermore, in step 4 of this application embodiment, the measurement result analysis process specifically includes:

[0090] After data acquisition is completed for each microlens array point, the contour of the target location is first reconstructed in three dimensions. Then, post-processing operations such as aspherical fitting and filtering are used to obtain the evaluation results of the contour, including root mean square, fitting radius, conic coefficient, etc. These parameters are compared with preset thresholds to determine whether the measurement results are qualified.

[0091] If the measurement result is greater than the tolerance range, the corresponding position of the current measurement point on the interface (usually a dot) will be automatically marked with the first color, such as red, to indicate that it is unqualified.

[0092] If the measurement result is less than or equal to the tolerance range, the corresponding position of the current measurement point on the interface will be automatically marked with a second color, such as green, to indicate that it is qualified.

[0093] Furthermore, in step 5 of this application embodiment, after completing the measurement of a target location, it will automatically determine whether the measurement of all target locations on the measurement path has been completed. If so, it means that the measurement of the entire sample under test has been completed, and all measurement data will be automatically summarized to generate a complete measurement report; otherwise, it will return to step 3 to continue automatically measuring the next target location.

[0094] The three-dimensional topography rapid measurement device and method proposed in this application integrate technologies such as CAD model guidance, automatic coordinate alignment, path planning and real-time data comparison to achieve efficient and accurate measurement of the sample to be measured, and can intuitively display the results and generate a final report.

[0095] Based on the same technical concept described above, this application also proposes a measurement system based on the aforementioned rapid three-dimensional topography measurement device, such as... Figure 4 As shown, the measurement system 300 includes:

[0096] The path generation unit 301 is used to input the CAD model of the sample to be tested and generate a measurement path based on the CAD model. The specific implementation method is as described in step 1 above, and will not be repeated here.

[0097] The positioning unit 302 is used to align the coordinate system of the CAD model with the coordinate system of the sample to be tested based on the three-point positioning principle. The specific implementation process is as described in step 2 above, and will not be repeated here.

[0098] The measurement unit 303 is used to automatically measure the next target position according to the measurement path. The specific measurement process is as described in step 3 above, and will not be repeated here.

[0099] Analysis unit 304 is used to compare the measurement result with a preset measurement tolerance. If the measurement result is greater than the measurement tolerance, the circle at the current measurement position is marked with a first color; otherwise, the circle at the current measurement position is marked with a second color. The first and second colors are different. The measurement tolerance is the allowable tolerance range of the component and serves as the standard for judging whether the measurement result is qualified. The specific implementation method is as described in step 4 above, and will not be repeated here.

[0100] In addition, the report generation unit 305 is used to determine whether the measurement of all target positions on the measurement path has been completed. If so, a measurement report is generated; otherwise, the measurement unit 303 is driven to measure the next target position.

[0101] Furthermore, the measurement system 300 proposed in this application embodiment also includes:

[0102] A visual interface is used to display measurement results in a visual format.

[0103] Based on the same technical concept described above, this application also proposes an electronic device, such as... Figure 5 As shown, the electronic device 400 includes: a memory B410, a processor B420, and a computer program A411 stored in the memory B410 and executable on the processor B420. When the processor B420 executes the computer program A411, it performs the following steps:

[0104] Input the CAD model of the sample to be tested, and generate the measurement path based on the CAD model of the sample to be tested;

[0105] Based on the three-point positioning principle, the coordinate system of the CAD model is aligned with the coordinate system of the sample to be tested;

[0106] Automatic measurement steps: Automatically measure the next target location according to the measurement path;

[0107] The measurement result is compared with the preset measurement tolerance. If the measurement result is greater than the measurement tolerance, the circle at the current measurement position is marked with the first color; otherwise, the circle at the current measurement position is marked with the second color. The first color and the second color are different. The measurement tolerance is the allowable tolerance range of the component and is used as the standard for judging whether the measurement result is qualified.

[0108] Determine whether the measurement of all target locations on the measurement path has been completed. If so, generate a measurement report; otherwise, return to the automatic measurement step to measure the next target location.

[0109] Optionally, when processor B420 executes computer program A411, it can implement any of the embodiments in the corresponding examples of the above measurement method.

[0110] It should be noted that the electronic device proposed in this application embodiment is a device used to implement the above measurement method. Therefore, based on the above measurement method proposed in this application embodiment, those skilled in the art can understand the specific implementation method and various variations of the electronic device in this application embodiment. Therefore, how the electronic device specifically implements the above measurement method will not be described in detail here. Any electronic device used by those skilled in the art to implement the above measurement method falls within the scope of protection of this application.

[0111] Based on the same technical concept described above, embodiments of this application also propose a computer-readable storage medium, such as... Figure 6 As shown, the computer-readable storage medium 500 stores a computer program B511, which, when executed by a processor, performs the following steps:

[0112] Input the CAD model of the sample to be tested, and generate the measurement path based on the CAD model of the sample to be tested;

[0113] Based on the three-point positioning principle, the coordinate system of the CAD model is aligned with the coordinate system of the sample to be tested;

[0114] Automatic measurement steps: Automatically measure the next target location according to the measurement path;

[0115] The measurement result is compared with the preset measurement tolerance. If the measurement result is greater than the measurement tolerance, the circle at the current measurement position is marked with the first color; otherwise, the circle at the current measurement position is marked with the second color. The first color and the second color are different. The measurement tolerance is the allowable tolerance range of the component and is used as the standard for judging whether the measurement result is qualified.

[0116] Determine whether the measurement of all target locations on the measurement path has been completed. If so, generate a measurement report; otherwise, return to the automatic measurement step to measure the next target location.

[0117] Optionally, when the computer program B511 is executed by the processor, it can implement any of the embodiments corresponding to the above measurement method.

[0118] It should be noted that the descriptions of each embodiment in the above embodiments have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0119] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0120] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0121] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0122] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0123] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this application. It should be understood that the above description is only a specific embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A rapid three-dimensional topography measurement device for a microlens array, characterized in that, include: Control and processing equipment, chassis, base, crossbeam, X-axis displacement stage, Y-axis displacement stage, Z-axis displacement stage, pitch adjustment stage, bearing plate, and white light interferometer measuring head; The base is installed together with the shock absorber on the chassis to isolate the effects of external vibrations. The X-axis displacement stage is mounted on the base and can move along the X direction under the drive of the control and processing device; The Y-axis displacement stage is mounted on the X-axis displacement stage and can move along the Y direction under the drive of the control and processing device; The pitch adjustment platform is mounted on the Y-axis displacement platform, and the bearing plate is mounted on the pitch adjustment platform. The bearing plate is used to mount the sample to be tested, and the attitude of the bearing plate is adjusted by the pitch adjustment platform. The crossbeam is fixedly mounted on the base, the Z-axis displacement stage is mounted on the crossbeam and can move along the Z direction under the drive of the control and processing device, the white light interferometer measuring head is mounted on the Z-axis displacement stage, and the objective lens axis of the white light interferometer measuring head is located at the center of the XY axis; the control and processing device receives the measurement results of the white light interferometer measuring head and processes them.

2. The rapid three-dimensional topography measurement device for a microlens array according to claim 1, characterized in that, The carrier plate is a vacuum suction cup, which fixes the sample to be tested on the vacuum suction cup by vacuum adsorption.

3. A measurement method based on the three-dimensional topography rapid measurement device according to any one of claims 1-2, characterized in that, include: Input the CAD model of the sample to be tested, and generate the measurement path based on the CAD model of the sample to be tested; Based on the three-point positioning principle, the coordinate system of the CAD model is aligned with the coordinate system of the sample to be tested; Automatic measurement steps: Automatically measure the next target location according to the measurement path; The measurement result is compared with a preset measurement tolerance. If the measurement result is greater than the measurement tolerance, the circle at the current measurement position is marked with a first color; otherwise, the circle at the current measurement position is marked with a second color. The first color and the second color are different. Determine whether the measurement of all target locations on the measurement path has been completed. If so, generate a measurement report; otherwise, return to the automatic measurement step to measure the next target location.

4. The measurement method according to claim 3, characterized in that, The method of generating a measurement path based on the CAD model of the sample to be tested includes: Automatically identify the custom graphic element information in the CAD model and remove discrete points from it; A planar circle, including its position coordinates and radius, is obtained by fitting primitive information after removing discrete points. The planar circles are aligned according to the arrangement rules of the test samples, and the bow-shaped trajectory is planned.

5. The measurement method according to claim 3, characterized in that, The method of aligning the coordinate system of the CAD model with the coordinate system of the sample under test based on the three-point positioning principle includes: The white light interferometer measuring head is aligned with the plane position of the microlens array. The interference fringes are adjusted to the range of 0 to 1 by adjusting the pitch adjustment stage to ensure that the microlens array and the white light interferometer measuring head remain perpendicular. The X-axis and Y-axis displacement stages are controlled to move the selected first microlens vertex directly below the white light interferometer measuring head, focus and position it to the interference fringe corresponding to the first microlens vertex; the interference fringe is a concentric ring shape; In the CAD model, find the primitive corresponding to the vertex of the first microlens, generate a circular mark at the center of the primitive, and fine-tune the X-axis displacement stage and the Y-axis displacement stage so that the generated circular mark coincides with the concentric rings of the interference fringes, thus completing the marking of the first positioning point. Repeat the above operation to mark the vertices of the microlenses at two other different locations in sequence, thus completing the marking of the three positioning points; at this point, the coordinate system of the CAD model and the sample under test are aligned.

6. The measurement method according to claim 5, characterized in that, The three positioning points should meet the following conditions: The three positioning points are not on the same straight line, yet they are clearly distinguishable.

7. The measurement method according to claim 3, characterized in that, The automatic measurement of the next target location based on the measurement path includes: The X-axis and Y-axis displacement stages are controlled according to the coordinates of the target position to adjust the position of the sample under test, so that the vertex of the microlens corresponding to the target position of the sample under test is directly facing the white light interferometer measuring head. The measurement is performed using the white light interferometer measuring head, and the measurement results are uploaded to the control and processing equipment.

8. The measurement method according to any one of claims 3-7, characterized in that, Also includes: The measurement results are then visualized.

9. A measurement system based on the rapid three-dimensional topography measurement device according to any one of claims 1-2, characterized in that, include: The path generation unit is used to input the CAD model of the sample to be tested and generate a measurement path based on the CAD model of the sample to be tested. The positioning unit is used to align the coordinate system of the CAD model with the coordinate system of the sample to be tested based on the three-point positioning principle. A measurement unit is used to automatically measure the next target location according to the measurement path; An analysis unit is used to compare the measurement result with a preset measurement tolerance. If the measurement result is greater than the measurement tolerance, the circle at the current measurement position is marked with a first color; otherwise, the circle at the current measurement position is marked with a second color. The first color and the second color are different. In addition, a report generation unit is used to determine whether the measurement of all target positions on the measurement path has been completed. If so, a measurement report is generated; otherwise, the measurement unit is driven to measure the next target position.

10. The measurement system according to claim 9, characterized in that, Also includes: A visual interface is provided for displaying the measurement results.

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