Chip testing complete machine

Abstract

The invention relates to the technical field of chip testing, in particular to a chip testing complete machine which comprises a machine frame, a material disc station, a detection station, a material taking mechanism and a testing instrument mechanism. An electrostatic eliminator is arranged at the top of the rack; the tray stations comprise a feeding tray storage station, a non-defective tray storage station, a defective tray storage station and an empty tray storage station; the number of the detection stations is multiple, and each detection station is used for positioning and bearing a chip to be detected. The material taking mechanism is used for grabbing a to-be-detected chip from the material supply disc storage station and transferring the to-be-detected chip to the corresponding detection station, and grabbing an empty material disc from the material supply disc storage station and transferring the empty material disc to the empty material disc storage station; and the test instrument mechanism is connected with each detection station and is used for performing electrical or functional detection on the to-be-detected chips on the detection stations. The chip testing complete machine provided by the invention gives consideration to detection quality, efficiency and cost control, and has extremely high practicability and scene adaptability.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a complete chip testing machine. Background Technology

[0002] In small-batch chip testing scenarios, traditional testing equipment generally suffers from problems such as dispersed structure, limited functionality, and low automation: some equipment can only perform single electrical or functional tests, requiring multiple devices to complete all tests, resulting in cumbersome operation and low testing efficiency; chip transfer relies heavily on manual labor, which is prone to chip damage or mixing due to operational errors, especially for small-batch high-precision chips where manual transfer carries even higher risks; tray storage lacks unified planning, with good, defective, and empty trays mixed together, leading to chaotic management; chip transfer posture lacks an effective calibration mechanism, resulting in insufficient detection positioning accuracy and large detection errors; electrostatic discharge protection measures are inadequate, and small-batch chips are more likely to be damaged by electrostatic discharge; at the same time, traditional equipment has poor adaptability, requiring frequent adjustments when changing chip specifications, making it difficult to meet the needs of multiple varieties and specifications in small-batch testing, and the overall testing process is time-consuming and labor-intensive, making it difficult to balance testing quality and cost control. Summary of the Invention

[0003] Based on this, the purpose of this invention is to provide a complete chip testing machine that balances testing quality, efficiency, and cost control, and has strong practicality and adaptability to various scenarios.

[0004] The present invention adopts the following technical solution: A chip testing machine includes a frame, a material tray station, a testing station, a material handling mechanism, and a testing instrument mechanism, all connected to the frame. Static electricity eliminators are evenly distributed on the top of the frame above the material tray station and the testing station. The material tray station includes a material supply tray storage station, a good material tray storage station, a defective material tray storage station, and an empty material tray storage station. Multiple testing stations are provided, each used to locate and hold the chip to be tested. The material handling mechanism is used to pick up the chip to be tested from the material supply tray storage station and transfer it to the corresponding testing station, and to pick up an empty material tray from the material supply tray storage station and transfer it to the empty material tray storage station. The testing instrument mechanism is connected to each testing station and is used to perform electrical or functional tests on the chip to be tested at the testing station.

[0005] A further improvement to the above technical solution is that the feeding tray storage station includes a tray support guide frame and a lifting device; The tray support guide frame is used to support the feed tray loaded with the chip to be tested. It includes several surrounding plates, a tray support block, a guide rail mounting plate, a guide slide rail, a mounting rod, and a sliding door. The surrounding plates form a tray storage cavity, and a supporting upper connecting plate is connected between two adjacent surrounding plates. The tray support block is fixed to the bottom inner side of the surrounding plate to support the feed tray. There are two guide rail mounting plates, which are arranged in parallel opposite directions, and one end of each is connected to a supporting lower connecting plate. The guide slide rail is fixedly connected to the guide rail mounting plate. One end of the mounting rod is fixedly connected to the supporting upper connecting plate and the supporting lower connecting plate, and the other end is fixedly connected to the rear side of the sliding door. A locking handle is connected to the top front side of the sliding door to lock the sliding door to the frame and close the tray storage cavity. The lifting device is positioned between two guide rail mounting plates and includes a lifting support plate, a lifting mounting base plate, a lifting transmission screw, and a lifting drive motor. The bottom center of the lifting support plate is connected to one end of the lifting transmission screw. The lifting mounting base plate is fixedly connected to the bottom of the guide rail mounting plates, and mounting uprights are provided on both sides of its top. Guide sliders are provided on the inner side of the mounting uprights, and these guide sliders slide in and out of the guide rails to guide the material tray carrying guide frame as the sliding door moves. The lifting transmission screw is connected to the lifting drive motor. The housing of the lifting drive motor is fixedly connected to the lifting mounting base plate and drives the lifting screw to rotate, thereby causing the lifting support plate and the material tray to be tested to move up and down.

[0006] A further improvement to the above technical solution is that the structures of the good product tray storage station, the defective product tray storage station, and the empty product tray storage station are all set in the same way as the structure of the feed tray storage station; the good product tray storage station is used to store good product trays loaded with qualified chips; the defective product tray storage station is used to store defective product trays loaded with unqualified chips; and the empty product tray storage station is used to store empty product trays without chips.

[0007] A further improvement to the above technical solution is that a first visual inspection device is provided on one side of the inspection station to detect the posture of picking up the chip to be tested from the material tray storage station so as to accurately transfer it to the inspection station; the first visual inspection device is a visual inspection camera. The testing station includes a testing fixture, a raised platform, and a clamping device; the testing fixture is electrically connected to the testing instrument mechanism and is connected to the upper surface of the raised platform, used to load the chip under test and cooperate with the testing instrument module to perform electrical or functional testing; the raised platform is installed on the upper surface of the frame; the clamping device is used to clamp and position the chip under test.

[0008] A further improvement to the above technical solution is that the clamping device includes a clamping block, a clamping extension plate, a clamping lifting module, and a clamping translation module; the top of the clamping block is connected to one end of the clamping extension plate; the other end of the clamping extension plate is connected to the power output end of the clamping lifting module; the clamping lifting module is used to drive the clamping extension plate and the clamping block to move up and down to approach or move away from the chip under test on the testing fixture; the clamping translation module is connected to the clamping lifting module and is used to drive the clamping lifting module to move the clamping block horizontally to approach or move away from the chip under test on the testing fixture.

[0009] A further improvement to the above technical solution is that the pressing and lifting module includes a pressing transmission plate, a pressing and lifting screw, and a pressing drive motor; the pressing transmission plate is threadedly connected to the pressing and lifting screw, and a pressing slider is fixedly connected to its back; the pressing slider is slidably connected to a pressing slide rail to guide the pressing transmission plate to move up and down in the vertical direction; the pressing and lifting screw is drivenly connected to the pressing drive motor; the pressing drive motor is connected to a motor mounting base, and the pressing drive motor is used to drive the pressing and lifting screw to rotate, thereby driving the pressing transmission plate, the pressing extension plate, and the pressing block to move up and down in the vertical direction.

[0010] A further improvement to the above technical solution is that the pressing and translating module includes a translating adapter, a translating slide, and a translating drive motor; the translating adapter is connected to the side of the motor mounting base; the translating slide is connected to the bottom of the translating adapter; the translating drive motor is connected to the translating slide for driving the translating slide to move the translating adapter, the pressing and lifting module, and the pressing block in a horizontal translating motion.

[0011] A further improvement to the above technical solution is that the material handling mechanism includes an X-axis linear module, a chip gripping device, and a Y-axis linear module; the X-axis linear module is driven by the chip gripping device and is used to drive the chip gripping device to reciprocate along the X-axis direction; a tray gripping device is provided on the rear side of the chip gripping device, which is used to grip an empty tray without chips and transfer it to an empty tray storage station; the Y-axis linear module is driven by the X-axis linear module and is used to drive the X-axis linear module and the chip gripping device to reciprocate along the Y-axis direction.

[0012] A further improvement to the above technical solution is that the chip gripping device includes a movable mounting plate, a gripping mounting base, gripping groups, a gripping rotation motor, a gripping lifting motor, a second vision inspection device, and a vision inspection lifting motor; the movable mounting plate is fixedly connected to the gripping mounting base and connected to the output end of the X-axis linear module; the gripping mounting base is connected to the gripping groups; the gripping groups are configured as four and arranged in parallel; each gripping group includes a vacuum suction cup and a gripping drive shaft; the vacuum suction cup is connected to the bottom of the gripping drive shaft and is used for negative pressure adsorption of the chip to be tested; the gripping drive shaft is driven by the gripping rotation motor; the gripping rotation motor is driven by the gripping drive wheels of two adjacent gripping groups respectively through a rotating drive belt. The gripping lifting motor is connected to a lifting transmission seat via a first lifting transmission belt. The lifting transmission seat is connected to a gripping transmission shaft. The gripping lifting motor drives the first lifting transmission belt to rotate, thereby driving the lifting transmission seat, gripping transmission shaft, and vacuum suction cup to reciprocate vertically. The second visual inspection device is a visual inspection camera, located on one side of the gripping assembly, used to detect the reference position of the inspection fixture, ensuring that the chip under test is accurately aligned with and placed into the inspection fixture. The visual inspection lifting motor is connected to the second visual inspection device via a second lifting transmission belt, used to drive the second lifting transmission belt to rotate, thereby driving the second visual inspection device to reciprocate vertically. The material tray gripping device includes a material tray gripping lifting cylinder, a material tray gripping finger cylinder, and material tray gripping claws; the cylinder body of the material tray gripping lifting cylinder is connected to the gripping mounting base, and its output end is connected to the cylinder body of the material tray gripping finger cylinder, for driving the material tray gripping finger cylinder to perform reciprocating lifting motion in the vertical direction; the output end of the material tray gripping finger cylinder is set towards the detection station; there are two material tray gripping claws, which are arranged opposite each other and fixedly connected to the output end of the material tray gripping finger cylinder, for clamping or releasing empty material trays.

[0013] A further improvement to the above technical solution is that the testing instrument mechanism is set up in two groups, and each group of the testing instrument mechanism is equipped with several electrical testing instruments and several functional testing instruments. Each testing station is adapted and connected to the electrical testing instruments and functional testing instruments of the corresponding testing instrument mechanism through aviation connectors, so as to selectively perform electrical testing or functional testing on the chip under test carried on the testing station.

[0014] The beneficial effects of this invention are as follows: This invention achieves advantages such as precise positioning, efficient transfer, flexible testing, safety protection, and convenient operation and maintenance through the collaborative design of its components. Structurally, the frame provides stable and rigid support; the material tray stations are clearly categorized and structurally uniform; the testing stations and material handling mechanisms are rationally laid out; the testing instrument mechanism has a high degree of integration; and all components form an organic whole, resulting in a compact structure and convenient maintenance. Functionally, the static eliminator provides comprehensive protection against electrostatic damage; the first and second vision inspection devices dual-calibrate chip posture and fixture position; the multi-module driven gripping and clamping devices ensure precise chip positioning; four gripping groups synchronously transfer chips to improve efficiency; two sets of testing instrument mechanisms cover diverse testing needs; and automated processes replace manual operation, reducing chip damage and the risk of material mixing. In terms of adaptability, the lifting, translation, and clamping actions of each component can be precisely adjusted to adapt to small batches of chips of different sizes and types; parallel testing and classified storage improve operational efficiency; and the standardized structure reduces operating and maintenance costs. In summary, this equipment comprehensively solves the pain points of insufficient accuracy, low efficiency, cumbersome operation, chip damage, and poor adaptability in small-batch chip testing. It balances testing quality, operational efficiency, and cost control, and has strong practicality and competitiveness in small-batch high-precision chip testing scenarios. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the chip testing device of the present invention; Figure 2 for Figure 1 A top view of the entire chip testing machine; Figure 3 for Figure 1 A schematic diagram of the material tray station of the chip testing machine; Figure 4 for Figure 3 A schematic diagram of the structure of the material tray storage station at the material tray station; Figure 5 for Figure 3 A structural diagram of the material tray storage station from another angle; Figure 6 for Figure 1 A schematic diagram of the testing station structure of the chip testing machine; Figure 7 for Figure 1 A schematic diagram of the testing station of the chip testing machine from another angle; Figure 8 for Figure 1 A schematic diagram of the material handling mechanism of the chip testing machine; Figure 9 for Figure 8 A schematic diagram of the chip gripping device of the material handling mechanism; Figure 10 forFigure 8 A schematic diagram of the chip gripping device of the material handling mechanism from another angle; Figure 11 for Figure 8 A schematic diagram of the chip gripping device and the material tray gripping device of the material handling mechanism; Figure 12 for Figure 11 A schematic diagram of the testing instrument mechanism of the chip testing machine.

[0016] The numbers on the map are: 10. Rack; 11. Static eliminator; 20. Material tray storage station; 21. Material supply tray storage station; 22. Good product material tray storage station; 23. Defective material tray storage station; 24. Empty material tray storage station; 30. Inspection station; 31. First vision inspection device; 32. Inspection fixture; 33. Elevated platform; 34. Clamping device; 341. Clamping block; 342. Clamping extension plate; 35. Clamping lifting module; 351. Clamping transmission plate; 352. Clamping lifting screw; 353. Clamping drive motor; 354. Clamping slider; 355. Clamping slide rail; 356. Motor mounting base; 36. Clamping translation module; 361. Translation adapter; 362. Translation slide; 363. Translation drive motor; 40. Material handling mechanism; 41. X-axis linear module; 42. Y-axis linear module; 50. Testing instrument mechanism; 51. Electrical testing instrument; 52. Functional testing instrument; 53. Aviation connector; 60. Tray support guide frame; 61. Enclosure panel; 611. Tray storage cavity; 62. Tray support block; 63. Guide rail mounting plate; 64. Guide slide rail; 65. Mounting support rod; 66. Sliding door; 67. Upper support connecting plate; 68. Lower support connecting plate; 69. Locking handle; 70. Lifting device; 71. Lifting support plate; 72. Lifting mounting base plate; 73. Lifting transmission screw; 74. Lifting drive motor; 75. Mounting plate; 76. Guide slider; 80. Chip gripping device; 81. Movable mounting plate; 82. Gripping mounting base; 83. Gripping assembly; 831. Vacuum suction cup; 832. Gripping drive shaft; 84. Gripping rotary motor; 841. Rotary drive belt; 85. Gripping lifting motor; 851. First lifting drive belt; 852. Lifting drive base; 86. Second vision inspection device; 87. Vision inspection lifting motor; 871. Second lifting drive belt; 90. Material tray gripping device; 91. Material tray gripping lifting cylinder; 92. Material tray gripping finger cylinder; 93. Material tray gripping claw. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0020] like Figures 1 to 12 As shown in the figure, this is an embodiment of the present invention, relating to a chip testing machine, including a frame 10, a material tray station 20, a testing station 30, a material picking mechanism 40, and a testing instrument mechanism 50, all connected to the frame 10. Static eliminators 11 are evenly distributed on the top of the frame 10 above the material tray station 20 and the testing station 30. The material tray station 20 includes a material tray storage station 21, a good material tray storage station 22, a defective material tray storage station 23, and an empty material tray storage station 24. Multiple testing stations 30 are provided, each used to position and hold the chip to be tested. The material picking mechanism 40 is used to pick up the chip to be tested from the material tray storage station 21 and transfer it to the corresponding testing station 30, and to pick up an empty material tray from the material tray storage station 21 and transfer it to the empty material tray storage station 24. The testing instrument mechanism 50 is connected to each testing station 30 and is used to perform electrical or functional tests on the chip to be tested on the testing station 30.

[0021] Specifically, the frame 10 provides stable rigid support for all components, ensuring structural stability during equipment operation; the subdivided material tray stations 20 realize full-process classification management of chips for testing, qualified, unqualified, and empty trays, completely avoiding the mixing and mis-material problems that are prone to occur in small-batch testing; multiple testing stations 30 are arranged in parallel, which can process multiple chips simultaneously, and can operate continuously without waiting for the testing of a single chip to be completed, significantly improving testing efficiency; the material handling mechanism 40 combines chip grabbing and transfer with empty material tray recycling, replacing manual operation and reducing damage and contamination of high-precision chips caused by human contact; the testing instrument mechanism 50 covers electrical and functional testing, meeting the diverse testing needs of small-batch chips; the static eliminator 11 on the top of the frame 10 fully covers the key operating areas, effectively eliminating static interference, reducing the risk of static damage to high-value chips, ensuring the safety of the testing process and chip yield, and the overall structure is compact and functionally closed-loop, adapting to the flexible operation needs of testing.

[0022] like Figures 3 to 5 As shown, the feeding tray storage station 21 includes a tray support guide frame 60 and a lifting device 70; The tray support guide frame 60 is used to support the feed tray loaded with the chip to be tested. It includes several surrounding plates 61, a tray support block 62, a guide rail mounting plate 63, a guide rail 64, a mounting rod 65, and a sliding door 66. The surrounding plates 61 form a tray storage cavity 611, and a supporting upper connecting plate 67 connects two adjacent surrounding plates 61. The tray support block 62 is fixed to the inner bottom of the surrounding plate 61 to support the feed tray. There are two guide rail mounting plates 63. The two guide rail mounting plates 63 are arranged in parallel opposite directions, with one end connected to a lower load-bearing connecting plate 68; the guide slide rail 64 is fixedly connected to the guide rail mounting plate 63; one end of the mounting support rod 65 is fixedly connected to the upper load-bearing connecting plate 67 and the lower load-bearing connecting plate 68 respectively, and the other end is fixedly connected to the rear side of the sliding door 66; a locking handle 69 is connected to the top front side of the sliding door 66, which is used to lock the sliding door 66 to the frame 10 and close the material tray storage cavity 611; The lifting device 70 is disposed between two guide rail mounting plates 63, and includes a lifting support plate 71, a lifting mounting base plate 72, a lifting transmission screw 73, and a lifting drive motor 74. The bottom center of the lifting support plate 71 is connected to one end of the lifting transmission screw 73. The lifting mounting base plate 72 is fixedly connected to the bottom of the guide rail mounting plate 63, and mounting uprights 75 are respectively provided on both sides of its top. The inner side of the mounting uprights 75 is provided with a guide slider 76, which slides in cooperation with the guide rail 64 to guide the material tray carrying guide frame 60 to slide in or out with the push-pull action of the sliding door 66. The lifting transmission screw 73 is connected to the lifting drive motor 74. The housing of the lifting drive motor 74 is fixedly connected to the lifting mounting base plate 72 to drive the lifting screw to rotate, thereby driving the lifting support plate 71 and the material tray to be tested to move up and down.

[0023] Specifically, the tray support guide frame 60 is enclosed by the surrounding plate 61 to form a closed tray storage cavity 611, which, together with the tray support block 62, provides stable support for the tray and prevents tilting or misalignment of the tray due to insufficient storage or shift in the center of gravity. The guide rail 64 slides in conjunction with the guide slider 76 on the mounting plate 75, allowing the frame to be smoothly pulled out with the sliding door 66. Operators can quickly replenish and replace the tray without complicated operations, making it suitable for scenarios with frequent material changes during testing. The locking handle 69 connects the sliding door 66 to the frame 10. The reliable locking mechanism ensures operational safety during equipment operation and seals the storage cavity, reducing dust and impurities from contaminating the chips. The lifting device 70 drives the lifting transmission screw 73 to rotate via the lifting drive motor 74, which in turn drives the lifting tray 71 to rise and fall smoothly. The position of the feeding tray can be precisely adjusted according to the gripping height of the picking mechanism 40, ensuring that the gripping height of the chips remains consistent and avoiding missed or incorrect gripping. The high-precision characteristics of the screw drive ensure the consistency and stability of the lifting action, further improving the accuracy and efficiency of chip transfer.

[0024] like Figure 2 and Figure 3As shown, the structures of the good product tray storage station 22, the defective product tray storage station 23, and the empty product tray storage station 24 are all the same as those of the feed tray storage station 21. The good product tray storage station 22 is used to store good product trays loaded with qualified chips. The defective product tray storage station 23 is used to store defective product trays loaded with unqualified chips. The empty product tray storage station 24 is used to store empty product trays without chips. Specifically, the standardized structure allows for the interchangeability of components, reducing manufacturing and maintenance costs and making spare parts procurement and subsequent maintenance more convenient during production. Clearly categorized storage areas enable the orderly collection of tested chips, with good chips, defective chips, and empty trays stored separately, completely resolving chip confusion and secondary contamination issues caused by disorganized storage during testing. The identical pull-out frame and lifting structure standardize the operating procedures, eliminating the need for operators to adapt to different workstation operating logics; consistent material replenishment and retrieval actions improve testing efficiency. The enclosed storage chamber design provides a clean storage environment for qualified chips, while the separate storage of empty trays facilitates subsequent recycling and reuse, optimizing material management throughout the chip testing process and reducing material loss.

[0025] like Figure 3 , Figure 6 and Figure 7 As shown, a first visual inspection device 31 is provided on one side of the inspection station 30, which is used to detect the posture of picking up the chip to be tested from the material tray storage station so as to accurately transfer it to the inspection station 30; the first visual inspection device 31 is a visual inspection camera. The testing station 30 includes a testing fixture 32, a raised platform 33, and a clamping device 34. The testing fixture 32 is electrically connected to the testing instrument mechanism 50 and is connected to the upper surface of the raised platform 33. It is used to load the chip under test and cooperate with the testing instrument module to perform electrical or functional tests. The raised platform 33 is installed on the upper surface of the frame 10. The clamping device 34 is used to clamp and position the chip under test.

[0026] Specifically, the first vision inspection device 31 uses a vision inspection camera to capture the posture of the chip to be tested picked up by the picking mechanism 40 in real time, quickly identify the offset and provide feedback for adjustment, ensuring that the chip is accurately transferred to the inspection station 30, avoiding inspection failure or chip pin damage caused by chip posture deviation during inspection; the inspection fixture 32, as the core carrier of chip inspection, is stably electrically connected to the testing instrument mechanism 50, which can reliably carry the chip to be tested and ensure the stable transmission of the inspection signal. With the height adaptation design of the raised platform 33, the installation position of the inspection fixture 32 is perfectly matched with the picking mechanism 40 and the testing instrument mechanism 50, which can meet the assembly requirements of inspection without additional adjustment; the clamping device 34 clamps and positions the chip to be tested, effectively preventing the chip from being displaced due to equipment vibration or inspection action during the inspection process, ensuring the contact stability of electrical and functional inspection, and ensuring that the inspection results of each chip are accurate and reliable even if the number of chips is small, avoiding repeated inspections caused by positioning deviation.

[0027] like Figure 6 and Figure 7 As shown, the clamping device 34 includes a clamping block 341, a clamping extension plate 342, a clamping lifting module 35, and a clamping translation module 36. The top of the clamping block 341 is connected to one end of the clamping extension plate 342. The other end of the clamping extension plate 342 is connected to the power output end of the clamping lifting module 35. The clamping lifting module 35 is used to drive the clamping extension plate 342 and the clamping block 341 to move up and down to get closer to or away from the chip under test on the testing fixture 32. The clamping translation module 36 is connected to the clamping lifting module 35 and is used to drive the clamping lifting module 35 to move the clamping block 341 horizontally to get closer to or away from the chip under test on the testing fixture 32. Specifically, the clamping block 341 adopts a chip-adaptive structural design, which can provide stable clamping force while avoiding damage caused by contact with the core area of ​​the chip; the clamping extension plate 342 realizes a rigid connection between the clamping block 341 and the drive module, ensuring lossless power transmission and consistent clamping action; the clamping lifting module 35 drives the clamping block 341 to rise and fall vertically, which can accurately adjust the clamping height according to chips of different thicknesses, avoiding over-pressure damage to the chip or insufficient pressure leading to positioning failure; the clamping translation module 36 drives the lifting module and the clamping block 341 to move horizontally, which can quickly align with the chips on different inspection stations 30, realize flexible switching between multiple stations, eliminate the need to change clamping accessories due to changes in chip placement, reduce inspection adaptation time and cost, and the automated clamping action reduces manual intervention, improves inspection efficiency and reduces the rate of operational errors.

[0028] like Figure 6As shown, the pressing and lifting module 35 includes a pressing transmission plate 351, a pressing and lifting screw 352, and a pressing drive motor 353. The pressing transmission plate 351 is threadedly connected to the pressing and lifting screw 352, and a pressing slider 354 is fixedly connected to its back. The pressing slider 354 is slidably connected to a pressing slide rail 355 to guide the pressing transmission plate 351 to rise and fall in the vertical direction. The pressing and lifting screw 352 is drivenly connected to the pressing drive motor 353. The pressing drive motor 353 is connected to a motor mounting base 356. The pressing drive motor 353 is used to drive the pressing and lifting screw 352 to rotate, thereby driving the pressing transmission plate 351, the pressing extension plate 342, and the pressing block 341 to move up and down in the vertical direction. Specifically, the clamping lifting screw 352 is threadedly connected to the clamping transmission plate 351, resulting in high transmission efficiency and smooth movement. It can achieve micron-level lifting and fine-tuning, ensuring that the clamping force is evenly applied to the chip surface, avoiding excessive local pressure that could damage the chip packaging, and meeting the testing requirements of high-precision chips. The clamping slider 354 and the clamping slide rail 355 slide together, providing precise guidance for the lifting and lowering movement of the transmission plate, effectively preventing deviation and jamming during movement, and ensuring the consistency of clamping actions in the testing of multiple batches of chips. The clamping drive motor 353 provides stable power for the lifting and lowering movement. The lifting stroke can be precisely controlled by the program, adapting to chips of different thicknesses without manual adjustment, improving the automation level of the equipment. At the same time, the fixed design of the motor mounting base 356 enhances the structural stability of the module, reduces vibration during equipment operation, and further ensures the accuracy of clamping positioning.

[0029] like Figure 7 As shown, the pressing and translating module 36 includes a translating adapter 361, a translating slide 362, and a translating drive motor 363; the translating adapter 361 is connected to the side of the motor mounting base 356; the translating slide 362 is connected to the bottom of the translating adapter 361; the translating drive motor 363 is connected to the translating slide 362 for driving the translating slide 362 to move the translating adapter 361, the pressing and lifting module 35, and the pressing block 341 in a horizontal translational motion. Specifically, the translation adapter 361 ensures a reliable connection between the module and the motor mounting base 356, guaranteeing the rigidity of power transmission and preventing positioning deviations caused by loose connections during translation. The translation slide 362 adopts a high-precision linear transmission structure, with high motion accuracy and fast response speed. It can drive the clamping lifting module 35 and the clamping block 341 to quickly adjust their horizontal positions, accurately aligning them with different spacing detection stations 30 or different chips on the same station. The switching efficiency is high, making it suitable for scenarios where chip specifications are frequently changed during testing. The translation drive motor 363 can be precisely controlled by the program, with a wide adjustable range of stroke. It can adapt to different sizes of chips and the layout of the detection station 30 without changing the module, making the equipment highly versatile and reducing the equipment investment and adaptation costs for testing.

[0030] like Figure 8 As shown, the material handling mechanism 40 includes an X-axis linear module 41, a chip gripping device 80, and a Y-axis linear module 42. The X-axis linear module 41 is driven to the chip gripping device 80 and is used to drive the chip gripping device 80 to reciprocate along the X-axis direction. A tray gripping device 90 is provided on the rear side of the chip gripping device 80. The tray gripping device 90 is used to grip empty trays without chips and transfer them to the empty tray storage station 24. The Y-axis linear module 42 is driven to the X-axis linear module 41 and is used to drive the X-axis linear module 41 and the chip gripping device 80 to reciprocate along the Y-axis direction. Specifically, the X-axis linear module 41 and the Y-axis linear module 42 work together to form a two-dimensional moving space, which can fully cover all material tray stations 20 and inspection stations 30. The reciprocating movement mode is adapted to the frequent transfer needs in inspection. The movement speed and stroke can be precisely controlled by the program, resulting in high transfer efficiency and accurate positioning. The chip gripping device 80 and the material tray gripping device 90 have clear functional divisions. The chip gripping device 80 focuses on the transfer of chips to be tested, while the material tray gripping device 90 is responsible for the recovery of empty material trays. This avoids action conflicts or inefficiencies caused by a single device handling multiple tasks, making the transfer process more seamless. The overall automated transfer design replaces manual handling, which reduces damage and contamination of chips caused by manual contact and lowers labor costs. It is especially suitable for scenarios with streamlined personnel in inspection. At the same time, the modular design makes equipment maintenance more convenient, further improving the overall efficiency of inspection operations.

[0031] like Figures 9 to 11As shown, the chip gripping device 80 includes a movable mounting plate 81, a gripping mounting base 82, gripping groups 83, a gripping rotation motor 84, a gripping lifting motor 85, a second vision inspection device 86, and a vision inspection lifting motor 87. The movable mounting plate 81 is fixedly connected to the gripping mounting base 82 and connected to the output end of the X-axis linear module 41. The gripping mounting base 82 is connected to the gripping groups 83. There are four gripping groups 83 arranged in parallel. Each gripping group 83 includes a vacuum suction cup 831 and a gripping drive shaft 832. The vacuum suction cup 831 is connected to the bottom of the gripping drive shaft 832 and is used to adsorb the chip under test by negative pressure. The gripping drive shaft 832 is driven by the gripping rotation motor 84. The gripping rotation motor 84 is driven by the gripping drive wheels of two adjacent gripping groups 83 through a rotating drive belt 841. The gripping lifting motor 85 is connected to a lifting transmission seat 852 via a first lifting transmission belt 851. The lifting transmission seat 852 is connected to a gripping transmission shaft 832. The gripping lifting motor 85 drives the first lifting transmission belt 851 to rotate, thereby driving the lifting transmission seat 852, the gripping transmission shaft 832, and the vacuum suction cup 831 to reciprocate vertically. The second visual inspection device 86 is a visual inspection camera, located on one side of the gripping group 83, used to detect the reference position of the inspection fixture 32, ensuring that the chip under test is accurately aligned with and placed into the inspection fixture 32. The visual inspection lifting motor 87 is connected to the second visual inspection device 86 via a second lifting transmission belt 871, used to drive the second lifting transmission belt 871 to rotate, thereby driving the second visual inspection device 86 to reciprocate vertically. The tray gripping device 90 includes a tray gripping lifting cylinder 91, a tray gripping finger cylinder 92, and tray gripping claws 93. The cylinder body of the tray gripping lifting cylinder 91 is connected to the gripping mounting base 82, and its output end is connected to the cylinder body of the tray gripping finger cylinder 92, which is used to drive the tray gripping finger cylinder 92 to perform reciprocating lifting motion in the vertical direction. The output end of the tray gripping finger cylinder 92 is set towards the detection station 30. There are two tray gripping claws 93, which are arranged opposite each other and fixedly connected to the output end of the tray gripping finger cylinder 92, which are used to clamp or release empty trays.

[0032] Specifically, the chip gripping device 80 employs four parallel gripping groups 83, capable of simultaneously gripping multiple chips, effectively improving chip transfer efficiency and eliminating the need for chip-by-chip transfer, thus meeting the high-efficiency operation requirements of inspection. The vacuum suction cup 831 adsorbs chips through negative pressure, providing uniform adsorption force that can be adjusted according to chip specifications, avoiding damage to chip pins or surfaces caused by mechanical clamping, and is particularly suitable for the transfer of high-precision, fragile chips. The gripping rotation motor 84 drives adjacent gripping groups 83 to rotate synchronously via a rotating transmission belt 841, allowing for flexible adjustment of chip posture, and works in conjunction with the second vision inspection device 86 to inspect the inspection fixture 32. Real-time detection and calibration of the reference position ensures accurate alignment and placement of the chip when it is transferred to the inspection station 30, reducing inspection errors. The gripping lifting motor 85 and the vision inspection lifting motor 87 drive the chip gripping group 83 and the second vision inspection device 86 to lift and lower respectively, which can be flexibly adjusted according to different station heights, making them highly adaptable. The tray gripping device 90 uses a lifting cylinder and a finger cylinder for coordinated drive. The two oppositely arranged tray gripping claws 93 can firmly clamp the empty tray. The lifting and clamping actions are responsive and stable, ensuring that the empty tray does not fall off or tilt during the transfer process, thus ensuring the reliability of tray turnover.

[0033] like Figure 7 and Figure 12 As shown, the testing instrument mechanism 50 is configured in two groups. Each group of the testing instrument mechanism 50 is equipped with several electrical testing instruments 51 and several functional testing instruments 52. Each testing station 30 is adapted and connected to the electrical testing instruments 51 and functional testing instruments 52 of the corresponding testing instrument mechanism 50 through aviation connectors 53, so as to selectively perform electrical testing or functional testing on the chip under test carried on the testing station 30. Specifically, the two sets of testing instrument mechanisms 50 can selectively perform electrical testing, functional testing, or both types of testing in parallel, depending on the chip's testing requirements. The operation mode is flexible, and the entire testing project can be completed without the need for multiple devices, saving equipment space and testing time. Each module has several built-in electrical and functional testing instruments 52, with a high degree of integration, eliminating the need for additional external instruments. It is flexible in adapting to different scenarios and can quickly switch testing items to meet the testing requirements of different types of chips. The testing station 30 is connected to the testing instruments via an aviation connector 53. The aviation connector 53 has the advantages of reliable connection, stable signal transmission, and strong anti-interference ability, ensuring that there is no loss of electrical signals and test data during chip testing, and that the test results are accurate and reliable. At the same time, it is suitable for testing scenarios with frequent plugging and unplugging, and the connection stability is not affected, further ensuring the accuracy and consistency of the test data.

[0034] The working principle of this invention is as follows: Based on the frame 10, all components work together to complete the fully automated chip testing process: the static eliminator 11 at the top of the frame 10 continuously eliminates static electricity in the area above the tray station 20 and the testing station 30 to prevent damage to the chips from static electricity; the operator slides the tray containing the chips to be tested into the tray support guide frame 60 through the sliding door 66 of the tray storage station 21, and the locking handle 69 locks the sliding door 66 and the frame 10 to seal the tray storage cavity 611; the lifting drive motor 74 drives the lifting transmission screw 73 to rotate, driving the lifting plate 71 and the tray to the appropriate picking height; the sliding cooperation between the guide slider 76 and the guide rail 64 ensures smooth frame pulling; the X-axis and Y-axis of the picking mechanism 40... The linear axis module works in tandem to move the chip gripping device 80. The first vision inspection device 31 detects the posture of the chip under test. The gripping rotation motor 84 drives the gripping transmission shafts 832 of the four gripping groups 83 to rotate synchronously via the rotation transmission belt 841, adjusting the chip posture. The gripping lifting motor 85 drives the first lifting transmission belt 851 to lower the vacuum suction cup 831, adsorbing the chip under test through negative pressure. Subsequently, the chip gripping device 80 moves above the inspection station 30. The second vision inspection device 86 detects the reference position of the inspection fixture 32. The vision inspection lifting motor 87 drives it to rise and fall to adapt to the inspection height, ensuring precise alignment between the chip and the inspection fixture 32. The vacuum suction cup 831 releases the chip, allowing it to fall into the inspection fixture 32. The raised platform 33 supports the inspection fixture 32, and the pressing and translation module 36 drives the pressing. The lifting module 35 moves above the chip, and the pressing lifting module 35 drives the pressing block 341 to descend, pressing and positioning the chip to be tested. The testing fixture 32 is adapted to the electrical testing instrument 51 or functional testing instrument 52 of the two sets of testing instrument mechanisms 50 through the aviation connector 53, and selectively performs the corresponding testing items. After the test is completed, the chip gripping device 80 of the material handling mechanism 40 transfers qualified chips to the good product tray storage station 22 and unqualified chips to the defective tray storage station 23. The tray gripping device 90 drives the tray gripping claw 93 through the tray gripping lifting cylinder 91 and the finger cylinder to grab the empty tray at the material supply tray storage station 21 and transfer it to the empty tray storage station 24, realizing the fully automated operation of the chip from feeding, transfer, attitude calibration, positioning test to classification and storage.

[0035] The above description merely illustrates preferred technical solutions of the present invention, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and the present invention also intends to include these modifications and variations.

Claims

1. A chip testing machine, characterized in that, The system includes a frame, a tray station, a testing station, a picking mechanism, and a testing instrument mechanism, all connected to the frame. Static eliminators are evenly distributed on the top of the frame above the tray station and the testing station. The tray station includes a feed tray storage station, a good product tray storage station, a defective product tray storage station, and an empty tray storage station. Multiple testing stations are provided, each used to locate and hold the chip under test. The picking mechanism picks up the chip under test from the feed tray storage station and transfers it to the corresponding testing station, and also picks up an empty tray from the feed tray storage station and transfers it to the empty tray storage station. The testing instrument mechanism is connected to each testing station and performs electrical or functional tests on the chip under test at the testing station.

2. The chip testing machine according to claim 1, characterized in that, The feeding tray storage station includes a tray support guide frame and a lifting device; The tray support guide frame is used to support the feed tray loaded with the chip to be tested. It includes several surrounding plates, a tray support block, a guide rail mounting plate, a guide slide rail, a mounting rod, and a sliding door. The surrounding plates form a tray storage cavity, and a supporting upper connecting plate is connected between two adjacent surrounding plates. The tray support block is fixed to the bottom inner side of the surrounding plate to support the feed tray. There are two guide rail mounting plates, which are arranged in parallel opposite directions, and one end of each is connected to a supporting lower connecting plate. The guide slide rail is fixedly connected to the guide rail mounting plate. One end of the mounting rod is fixedly connected to the supporting upper connecting plate and the supporting lower connecting plate, and the other end is fixedly connected to the rear side of the sliding door. A locking handle is connected to the top front side of the sliding door to lock the sliding door to the frame and close the tray storage cavity. The lifting device is positioned between two guide rail mounting plates and includes a lifting support plate, a lifting mounting base plate, a lifting transmission screw, and a lifting drive motor. The bottom center of the lifting support plate is connected to one end of the lifting transmission screw. The lifting mounting base plate is fixedly connected to the bottom of the guide rail mounting plates, and mounting uprights are provided on both sides of its top. Guide sliders are provided on the inner side of the mounting uprights, and these guide sliders slide in and out of the guide rails to guide the material tray carrying guide frame as the sliding door moves. The lifting transmission screw is connected to the lifting drive motor. The housing of the lifting drive motor is fixedly connected to the lifting mounting base plate and drives the lifting screw to rotate, thereby causing the lifting support plate and the material tray to be tested to move up and down.

3. The chip testing machine according to claim 1, characterized in that, The structures of the good product tray storage station, the defective product tray storage station, and the empty product tray storage station are all the same as the structure of the feed tray storage station; the good product tray storage station is used to store good product trays loaded with qualified chips; the defective product tray storage station is used to store defective product trays loaded with unqualified chips; and the empty product tray storage station is used to store empty product trays without chips.

4. The chip testing machine according to claim 1, characterized in that, A first visual inspection device is provided on one side of the inspection station to detect the posture of picking up the chip to be tested from the material tray storage station so as to accurately transfer it to the inspection station; the first visual inspection device is a visual inspection camera. The testing station includes a testing fixture, a raised platform, and a clamping device; the testing fixture is electrically connected to the testing instrument mechanism and is connected to the upper surface of the raised platform, used to load the chip under test and cooperate with the testing instrument module to perform electrical or functional testing; the raised platform is installed on the upper surface of the frame; the clamping device is used to clamp and position the chip under test.

5. The chip testing machine according to claim 4, characterized in that, The clamping device includes a clamping block, a clamping extension plate, a clamping lifting module, and a clamping translation module; the top of the clamping block is connected to one end of the clamping extension plate; the other end of the clamping extension plate is connected to the power output end of the clamping lifting module; the clamping lifting module is used to drive the clamping extension plate and the clamping block to move up and down to approach or move away from the chip under test on the testing fixture; the clamping translation module is connected to the clamping lifting module and is used to drive the clamping lifting module to move the clamping block horizontally to approach or move away from the chip under test on the testing fixture.

6. The chip testing machine according to claim 5, characterized in that, The clamping and lifting module includes a clamping transmission plate, a clamping and lifting screw, and a clamping drive motor. The clamping transmission plate is threadedly connected to the clamping and lifting screw, and a clamping slider is fixedly connected to its back. The clamping slider is slidably connected to a clamping slide rail to guide the clamping transmission plate to move up and down in the vertical direction. The clamping and lifting screw is driven by the clamping drive motor. The clamping drive motor is connected to a motor mounting base and is used to drive the clamping and lifting screw to rotate, thereby driving the clamping transmission plate, the clamping extension plate, and the clamping block to move up and down in the vertical direction.

7. The chip testing machine according to claim 5, characterized in that, The pressing and translating module includes a translating adapter, a translating slide, and a translating drive motor; the translating adapter is connected to the side of the motor mounting base; the translating slide is connected to the bottom of the translating adapter; the translating drive motor is connected to the translating slide for driving the translating slide to move the translating adapter, the pressing and lifting module, and the pressing block in a horizontal translating motion.

8. The chip testing machine according to claim 1, characterized in that, The material handling mechanism includes an X-axis linear module, a chip gripping device, and a Y-axis linear module. The X-axis linear module is driven by the chip gripping device and is used to drive the chip gripping device to reciprocate along the X-axis direction. A tray gripping device is provided on the rear side of the chip gripping device. The tray gripping device is used to grip empty trays without chips and transfer them to the empty tray storage station. The Y-axis linear module is driven by the X-axis linear module and is used to drive the X-axis linear module and the chip gripping device to reciprocate along the Y-axis direction.

9. The chip testing machine according to claim 8, characterized in that, The chip gripping device includes a movable mounting plate, a gripping mounting base, gripping groups, a gripping rotation motor, a gripping lifting motor, a second vision inspection device, and a vision inspection lifting motor. The movable mounting plate is fixedly connected to the gripping mounting base and connected to the output end of the X-axis linear module. The gripping mounting base is connected to the gripping groups. Four gripping groups are arranged in parallel. Each gripping group includes a vacuum suction cup and a gripping drive shaft. The vacuum suction cup is connected to the bottom of the gripping drive shaft for negative pressure adsorption of the chip to be tested. The gripping drive shaft is driven by the gripping rotation motor. The gripping rotation motor is driven by the gripping drive wheels of two adjacent gripping groups via rotating drive belts. The lifting motor is connected to a lifting transmission seat via a first lifting transmission belt. The lifting transmission seat is connected to a gripping transmission shaft. The gripping lifting motor drives the first lifting transmission belt to rotate, thereby causing the lifting transmission seat, gripping transmission shaft, and vacuum suction cup to reciprocate vertically. The second visual inspection device is a visual inspection camera, located on one side of the gripping assembly, used to detect the reference position of the inspection fixture, ensuring that the chip under test is accurately aligned with and placed into the inspection fixture. The visual inspection lifting motor is connected to the second visual inspection device via a second lifting transmission belt, used to drive the second lifting transmission belt to rotate, thereby causing the second visual inspection device to reciprocate vertically. The material tray gripping device includes a material tray gripping lifting cylinder, a material tray gripping finger cylinder, and material tray gripping claws; the cylinder body of the material tray gripping lifting cylinder is connected to the gripping mounting base, and its output end is connected to the cylinder body of the material tray gripping finger cylinder, for driving the material tray gripping finger cylinder to perform reciprocating lifting motion in the vertical direction; the output end of the material tray gripping finger cylinder is set towards the detection station; there are two material tray gripping claws, which are arranged opposite each other and fixedly connected to the output end of the material tray gripping finger cylinder, for clamping or releasing empty material trays.

10. The chip testing machine according to claim 1, characterized in that, The testing instrument mechanism is configured in two groups, each group having several electrical testing instruments and several functional testing instruments inside. Each testing station is connected to the electrical testing instruments and functional testing instruments of the corresponding testing instrument mechanism via aviation connectors, so as to selectively perform electrical or functional testing on the chip under test carried at the testing station.

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