Heat dissipation device and communication base station
By combining the design of helical toothed heat sinks and phase change heat sinks, and utilizing the vaporization and condensation cycle of the phase change medium, the problem of insufficient heat dissipation in communication base stations is solved, achieving efficient heat dissipation and improving the stability and reliability of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZTE CORP
- Filing Date
- 2024-10-12
- Publication Date
- 2026-04-14
AI Technical Summary
Existing communication base stations have insufficient heat dissipation capacity, especially under high heat flux density conditions, which leads to overheating of the equipment and affects stability and reliability.
A heat dissipation device that combines a helical tooth radiator and a phase change radiator improves heat dissipation efficiency by embedding a first heat dissipation substrate into a second heat dissipation substrate and utilizing the cyclic process of vaporization and condensation of the phase change medium in the refrigerant circuit.
It effectively improves heat dissipation capacity, reduces the temperature of heat sources, and enhances the stability and reliability of base stations.
Smart Images
Figure CN121865129A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a communication base station. Background Technology
[0002] With the rapid development of communication technology, especially the widespread deployment of 5G networks, base stations, as critical infrastructure, have seen a significant increase in power density. Base station equipment generates a large amount of heat during operation, particularly the chips in high-power transmitting and receiving units. Efficient heat dissipation of these chips is crucial to ensuring the stable operation of base stations.
[0003] Currently, most base stations use heat sinks that dissipate heat through natural convection. While this can achieve heat dissipation to some extent, its cooling capacity is clearly insufficient in situations with high heat flux density, especially under prolonged full-load operation. This can easily lead to overheating of the equipment, thereby affecting the stability and reliability of the communication base station. Summary of the Invention
[0004] The main objective of this application is to provide a heat dissipation device aimed at improving the heat dissipation capability of existing communication base stations.
[0005] To achieve the above objectives, embodiments of this application propose a heat dissipation device, which includes:
[0006] The helical fin heat sink includes a second heat dissipation substrate and second heat dissipation fins disposed on the second heat dissipation substrate; and
[0007] A phase change heat sink includes a first heat sink substrate and a first heat sink fin disposed on the first heat sink substrate. The first heat sink substrate is at least partially embedded in a second heat sink substrate and is in contact with a heat source. A refrigerant circuit for the flow of a phase change medium is formed between the first heat sink substrate and the first heat sink fin. The second heat sink fin and the first heat sink fin are located on the same side of the second heat sink substrate.
[0008] To achieve the above objectives, this application provides a communication base station, which includes a base station body and a heat dissipation device connected to the base station body. The heat dissipation device is the heat dissipation device described above.
[0009] The technical solution of this application embeds a first heat dissipation substrate into a second heat dissipation substrate. Based on heat dissipation using the second heat dissipation fins, heat from the heat source can be transferred to the refrigerant circuit via the first heat dissipation substrate. The phase change medium in the refrigerant circuit absorbs heat from the heat source and vaporizes to form steam. Under pressure difference, the steam moves along the refrigerant circuit to the end of the first heat dissipation fin furthest from the first heat dissipation substrate. The first heat dissipation fin exchanges heat with the outside air through natural convection. Because the end of the first heat dissipation fin furthest from the first heat dissipation substrate is farther from the heat source, its temperature is lower. During the convection process between the first heat dissipation fin and the outside air, the steam condenses into liquid at the end of the first heat dissipation fin furthest from the first heat dissipation substrate, thereby accelerating the movement of steam towards that end. This increased steam flow rate effectively improves the heat dissipation capacity of the first heat dissipation fin. Simultaneously, the liquid formed by steam condensation moves along the refrigerant circuit towards the first heat dissipation substrate under gravity, and again participates in the cycle of direct heat exchange with the heat source to form steam. It is understandable that the vaporization of the phase change medium in the refrigerant circuit can effectively absorb heat from the heat source, thereby improving heat dissipation capacity. Attached Figure Description
[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0011] Figure 1 This is a schematic diagram of the structure of an embodiment of the heat dissipation device of this application;
[0012] Figure 2 This is an exploded structural diagram of an embodiment of the heat dissipation device of this application;
[0013] Figure 3 for Figure 2 Schematic diagram of a phase change radiator;
[0014] Figure 4 This is a schematic diagram of the internal structure of the first heat dissipation substrate in an embodiment of the heat dissipation device of this application;
[0015] Figure 5 This is a schematic diagram of the phase change heat sink at an angle in an embodiment of the heat dissipation device of this application;
[0016] Figure 6 This is a schematic diagram of another angle of the heat dissipation device embodiment of this application;
[0017] Figure 7This is another structural schematic diagram of an embodiment of the heat dissipation device of this application.
[0018] Explanation of icon numbers:
[0019] 100. Helical toothed radiator; 110. Second heat dissipation base plate; 120. Second heat dissipation fin; 200. Phase change radiator; 210. First heat dissipation base plate; 220. First heat dissipation fin; 230. Heat collection boss; 300. Refrigerant circuit; 310. Heat collection cavity; 320. Heat dissipation pipe; 400. Support structure.
[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.
[0022] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0023] Furthermore, in the embodiments of this application, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the embodiments of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0024] In the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.
[0025] Furthermore, the technical solutions of the various embodiments of this application can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the embodiments of this application.
[0026] With the rapid development of communication technology, especially the widespread deployment of 5G networks, base stations, as critical infrastructure, have seen a significant increase in power density. Base station equipment generates a large amount of heat during operation, particularly the chips in high-power transmitting and receiving units. Efficient heat dissipation of these chips is crucial to ensuring the stable operation of base stations.
[0027] Currently, communication base stations typically use heat sinks that dissipate heat naturally. The size and weight of the heat sink are limited by several high-power bottleneck chips inside. Although the heat from the chips can be moved away or diffused, the heat is still concentrated on the substrate, and the cooling effect is not obvious.
[0028] In view of this, the present application provides a heat dissipation device by embedding a first heat dissipation substrate into a second heat dissipation substrate. Based on the heat dissipation using the second heat dissipation fins, the heat from the heat source can be transferred to the refrigerant circuit through the first heat dissipation substrate. The phase change medium in the refrigerant circuit absorbs the heat from the heat source and vaporizes to form steam. The end of the first heat dissipation fin away from the first heat dissipation substrate naturally convections with the outside, causing the steam to liquefy to form liquid. This liquid then flows along the refrigerant circuit toward the first heat dissipation substrate and participates in the vaporization process again. This can accelerate the flow rate of the steam, absorb more heat from the heat source, effectively cool down, and improve the overall heat dissipation effect.
[0029] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.
[0030] like Figure 1 , Figure 2 as well as Figure 6 As shown in the figure, this application provides a heat dissipation device, which includes:
[0031] A helical finned heat sink 100 includes a second heat dissipation substrate 110 and second heat dissipation fins 120 disposed on the second heat dissipation substrate 110. Optionally, the second heat dissipation substrate 110 is vertically arranged and in contact with a heat source. One end of the second heat dissipation fin 120 is connected to the second heat dissipation substrate 110, and the other end of the second heat dissipation fin 120 extends away from the second heat dissipation substrate 110. In this way, the heat transferred between the second heat dissipation substrate 110 and the heat source can be diffused to the external environment away from the heat source, thereby further reducing the heat of the heat source.
[0032] A phase change heat sink 200 includes a first heat dissipation substrate 210 and first heat dissipation fins 220 disposed on the first heat dissipation substrate 210. The first heat dissipation substrate 210 is at least embedded in a second heat dissipation substrate 110 and in contact with a heat source. A refrigerant circuit 300 for the flow of a phase change medium is formed between the first heat dissipation substrate 210 and the first heat dissipation fins 220. The second heat dissipation fins 120 and the first heat dissipation fins 220 are located on the same side of the second heat dissipation substrate 110. Optionally, the first heat dissipation substrate 210 is vertically arranged and in direct contact with the heat source, capable of absorbing heat from the heat source. One end of the first heat dissipation fin 220 is connected to the first heat dissipation substrate 210, and the other end of the first heat dissipation fin 220 extends away from the first heat dissipation substrate 210. A refrigerant circuit 300 is formed between the first heat dissipation substrate 210 and the first heat dissipation fins 220. It can be understood that the phase change medium at the end of the refrigerant circuit 300 closest to the heat source directly absorbs heat from the heat source and vaporizes upon heating to form steam. The steam moves away from the heat source along the refrigerant channel, condenses with the external environment, loses heat, and liquefies to form liquid. The liquid then flows back, absorbs heat from the heat source again, and vaporizes upon heating. The heat from the heat source can be absorbed and diffused in a timely manner, and the heat absorbed by the first heat dissipation substrate 210 is no longer concentrated in the area close to the heat source, thus effectively dissipating and cooling the heat source, significantly improving the heat dissipation capacity of the entire communication base station. In one embodiment, the helical toothed heat sink 100 and the phase change heat sink 200 are welded or screwed together, that is, the second heat dissipation substrate 110 and the first heat dissipation substrate 210 are fixed by welding or screwing. In one embodiment, the second heat dissipation substrate 110 can simultaneously contact multiple heat sources, while the first heat dissipation substrate 210 contacts one heat source. The heat generated by the heat source corresponding to the first heat dissipation substrate 210 is greater than the heat generated by the heat source corresponding to the second heat dissipation substrate 110. Thus, the phase change heat sink 200 can achieve targeted heat dissipation for a single heat source with high heat generation in the entire system, effectively improving the heat dissipation of that single heat source. Furthermore, compared to using phase change heat dissipation devices throughout the entire system, it reduces process complexity, improves the uniformity of liquid filling rate in each heat dissipation tooth, and further enhances the overall heat dissipation effect.
[0033] In this embodiment, by embedding the first heat dissipation substrate 210 into the second heat dissipation substrate 110, and utilizing the second heat dissipation fins 120 for heat dissipation, the heat from the heat source can be transferred to the refrigerant circuit 300 through the first heat dissipation substrate 210. The phase change medium in the refrigerant circuit 300 absorbs the heat from the heat source and vaporizes to form steam. Under the action of pressure difference, the steam moves along the refrigerant circuit 300 to the end of the first heat dissipation fin 220 away from the first heat dissipation substrate 210. The first heat dissipation fin 220 exchanges heat with the outside air through natural convection. Because the end of the first heat dissipation fin 220 away from the first heat dissipation substrate 210 is farther from the heat source, its temperature is lower. During the convection process between the first heat dissipation fin 220 and the outside air, the steam condenses into liquid at the end of the first heat dissipation fin 220 away from the first heat dissipation substrate 210, thereby accelerating the movement of steam towards the end of the first heat dissipation fin 220 away from the first heat dissipation substrate 210. The increased steam flow rate effectively improves the heat dissipation capacity of the first heat dissipation fin 220. Simultaneously, the liquid formed by the condensation of steam moves along the refrigerant circuit 300 towards the first heat dissipation substrate 210 under the influence of gravity, and participates again in the cycle of directly exchanging heat with the heat source to form steam. It can be understood that the vaporization of the phase change medium in the refrigerant circuit 300 can effectively absorb the heat from the heat source, thereby improving the heat dissipation capacity.
[0034] In the embodiments of this application, the second heat dissipation fin 120 and the first heat dissipation fin 220 are arranged in parallel. This maintains a certain distance between the parallel second heat dissipation fin 120 and the first heat dissipation fin 220, facilitating smooth or free airflow and promoting natural convection between the second heat dissipation fin 120 and the first heat dissipation fin 220 and the external environment. This allows for the removal of more heat, further improving the heat dissipation effect. Moreover, compared to staggered or random arrangements, the parallel arrangement of the second heat dissipation fin 120 and the first heat dissipation fin 220 is easier to assemble and install, resulting in a simpler structure.
[0035] In the embodiments of this application, the first heat dissipation fin 220 is inclined relative to the horizontal direction. Compared with straight teeth, the inclined second heat dissipation fin 120 and the first heat dissipation fin 220 can isolate the natural heat dissipation ventilation channel vertically, reduce the thermal cascading effect of the system equipment, and improve the heat dissipation capacity of the system. Of course, in other embodiments, the second heat dissipation fin 120 is also inclined relative to the horizontal direction.
[0036] In the embodiments of this application, the tilt angle between the second heat dissipation fin 120 and the first heat dissipation fin 220 is greater than 40 degrees and less than 70 degrees. This not only maximizes their heat dissipation advantages but also facilitates manufacturing and installation. It is understood that the tilt angle can be 40 degrees, 60 degrees, or 70 degrees; in practical applications, the optimal angle can be selected based on specific circumstances, and no limitation is made here.
[0037] In the embodiments of this application, reference is made to Figures 2 to 5 The refrigerant circuit 300 includes a heat collection cavity 310 disposed inside the first heat dissipation substrate 210 and a heat dissipation pipe 320 disposed on the surface or inside the first heat dissipation fin 220. The heat dissipation pipe 320 and the heat collection cavity 310 are connected. The first heat dissipation substrate 210 serves as the evaporation end of the phase change medium, and the first heat dissipation fin 220 serves as the condensation end of the phase change medium.
[0038] Specifically, the first heat dissipation substrate 210 has a heat collection cavity 310 inside, and the first heat dissipation fins 220 have heat dissipation pipes 320 inside or on their surface. The heat collection cavity 310 and the heat dissipation pipes 320 are connected. It can be understood that the first heat dissipation substrate 210 is in contact with the heat source, allowing it to directly absorb heat and exchange heat with the phase change medium inside the heat collection cavity 310, causing the phase change medium inside the heat collection cavity 310 to vaporize and form steam. The steam flows into the heat dissipation pipes 320 and flows along the heat dissipation pipes 320 towards the end of the first heat dissipation fins 220 away from the first heat dissipation substrate 210, where it convects and releases heat with the external environment to form a liquid. Under the influence of gravity, the liquid flows back to the heat collection cavity 310, participating again in the vaporization and heat absorption process, thus achieving heat dissipation and cooling of the heat source. In other words, the phase change medium inside the heat collection cavity 310 can quickly absorb heat from areas of high heat flux density and rapidly transfer the heat to the first heat dissipation fins 220 for dissipation, effectively improving the heat dissipation effect. Furthermore, by directly forming the heat collection cavity 310 using the first heat dissipation substrate 210, which is in direct contact with the heat source, the intermediate thermal resistance is reduced compared to setting a two-phase heat exchanger outside the substrate, resulting in higher heat dissipation efficiency. Optionally, the heat dissipation pipe 320 is disposed on the outer surface of the first heat dissipation fin 220, and the first heat dissipation substrate 210 is provided with a mounting port communicating with the heat collection cavity 310. One end of the heat dissipation pipe 320 is inserted into the mounting port, thereby achieving communication with the heat collection cavity 310. Of course, in other embodiments, the heat dissipation pipe 320 can also be formed inside the first heat dissipation fin 220. It is understood that the first heat dissipation fin 220 has a hollow structure.
[0039] In the embodiments of this application, reference is made to Figure 5The first heat dissipation fin 220 has at least two oppositely arranged heat dissipation surfaces, and at least one heat dissipation surface is provided with a heat dissipation pipe 320. This allows for natural convection between at least one side of the first heat dissipation fin 220 and the external environment, increasing the convection area, resulting in faster heat dissipation and further improving the heat dissipation effect. It is understood that the heat dissipation pipe 320 can be provided on only one heat dissipation surface, resulting in a simpler structure and lower cost; alternatively, heat dissipation pipes 320 can be provided on both heat dissipation surfaces, resulting in a larger convection area and better heat dissipation. Optionally, the heat dissipation pipe 320 can be configured as any one of a honeycomb structure, a diagonal structure, or a hybrid structure of honeycomb and diagonal lines, thereby further increasing the heat dissipation area and improving the heat dissipation effect.
[0040] In the embodiments of this application, reference is made to Figure 3 , Figure 4 as well as Figure 7 The first heat dissipation substrate 210 is provided with a heat collection protrusion 230. The heat collection protrusion 230 has a hollow structure and is connected to the heat collection cavity 310. The heat collection protrusion 230 abuts against a heat source. In this way, the heat collection protrusion 230 can easily come into contact with a heat source with a large heat output, thereby collecting the heat from a single heat source and transferring the heat from the heat source to the first heat dissipation substrate 210 through the heat collection protrusion 230.
[0041] In the embodiments of this application, a support structure 400 is provided inside the heat collection cavity 310 and / or the heat collection boss 230. This provides support for the heating cavity or the heat collection boss 230, preventing deformation due to heat. Optionally, the support structure 400 can be a support column, connecting the opposite side walls of the heat collection cavity 310 or the heat collection boss 230. Multiple support columns can be provided, spaced apart, to provide support simultaneously at different locations, further preventing deformation of the heat collection cavity 310 or the heat collection boss 230 due to heat.
[0042] In the embodiments of this application, the heat collection cavity 310 and / or the heat collection boss 230 are provided with a boiling enhancement structure. In this way, the vaporization rate and effect of the liquid phase change medium can be increased, the boiling intensity can be improved, and thus more heat can be absorbed, thereby improving the overall heat dissipation capacity.
[0043] In the embodiments of this application, the boiling-enhanced structure is configured as at least one of sintered aluminum powder, machined micropillars and microgrooves, and a sandblasted layer. This allows for the formation of more micropores and surface roughness, thereby increasing the contact area and interaction forces between the liquid and gas, which is beneficial for the vaporization of liquid molecules. Optionally, for high heat flux density applications, sintered aluminum powder or sintered capillaries can be selected; for low heat flux density applications, machined micropillars and microgrooves can be selected.
[0044] In the embodiments of this application, the surface area of the heat-collecting protrusion 230 is S1, and the surface area of the heat source is S2, where S1 ≥ 1.5S2. This allows for complete coverage of the heat source, increasing the heat exchange area and enhancing heat dissipation.
[0045] In the embodiments of this application, a first thermally conductive layer is provided on the surface of the heat-collecting protrusion 230 facing the heat source. This first thermally conductive layer improves the heat exchange efficiency between the heat-collecting protrusion 230 and the heat source, allowing heat from the heat source to be quickly and promptly transferred to the heat-collecting protrusion 230, thereby achieving rapid cooling of the heat source. Optionally, the first thermally conductive layer is thermally conductive silicone.
[0046] In the embodiments of this application, the first heat dissipation substrate 210 includes a substrate base and a substrate cover plate connected to the substrate base. The substrate base and the substrate cover plate are fastened together to form a heat collection cavity 310. This facilitates the formation of the heat collection cavity 310. The substrate base and the substrate cover plate can be fixed by welding or by bolts and sealing strips, and there is no limitation on this.
[0047] In the embodiments of this application, the thickness of both the substrate base and the substrate cover is 2 mm to 4 mm. In practical applications, the phase change medium inside the heat collection cavity 310 evaporates upon heating, causing a sudden increase in cavity pressure. When the substrate is too thin, the first heat dissipation substrate 210 is prone to bulging; when the substrate is too thick, the thermal resistance is high, leading to poor heat dissipation. To balance reliability and heat dissipation performance, the thickness of the substrate base and the substrate cover is between 2 mm and 4 mm. It is understood that the thickness of the substrate base and the substrate cover can be 2 mm, 3 mm, or 4 mm respectively, and the optimal setting can be selected based on the actual situation.
[0048] In the embodiments of this application, the surface of the second heat dissipation substrate 110 facing the second heat dissipation fin 120 is provided with a groove, and the first heat dissipation substrate 210 is embedded in the groove. It is possible that the first heat dissipation substrate 210 penetrates a portion of the second heat dissipation substrate 110, that is, a portion of the second heat dissipation substrate 110 is hollowed out to form the groove, and the first heat dissipation substrate 210 is embedded in the groove. The heat-collecting protrusion 230 penetrates the second heat dissipation substrate 110, thus ensuring the strength of the second heat dissipation substrate 110. Furthermore, the connection surface between the second heat dissipation substrate 110 and the first heat dissipation substrate 210 is a planar structure, resulting in better versatility.
[0049] Of course, in other embodiments, the first heat dissipation substrate 210 can completely penetrate the second heat dissipation substrate 110, allowing the first heat dissipation substrate 210 to better contact the heat source with higher heat output. It is understood that the second heat dissipation substrate 110 has a mounting opening that penetrates the second heat dissipation substrate 110 along its thickness direction, and the first heat dissipation substrate 210 is fixed in the mounting opening. In this way, the first heat dissipation substrate 210 can directly contact the heat source, better absorb heat, and effectively improve the heat dissipation effect. Furthermore, during installation, the first heat dissipation substrate 210 can be observed from one side of the second heat dissipation substrate 110, improving assembly convenience.
[0050] In embodiments of this application, the heat dissipation device further includes a second thermally conductive layer disposed at the bottom of the groove, connecting the first heat dissipation substrate and the bottom of the groove. By providing the second thermally conductive layer, the thermal conductivity between the second heat dissipation substrate 110 and the first heat dissipation substrate 210 can be improved, allowing the heat from the heat source to be better transferred to the first heat dissipation substrate 210. Optionally, the second thermally conductive layer is thermally conductive silicone.
[0051] In the embodiments of this application, the thickness of the second heat dissipation substrate 110 is between 2 mm and 4 mm. The thinner the second heat dissipation substrate 110, the better the heat from the heat source can be transferred to the first heat dissipation substrate 210, resulting in better vaporization of the first heat dissipation substrate 210. Considering the installation requirements of the second and first heat dissipation substrates 110, the second heat dissipation substrate 110 needs to have good installation or support strength. The thickness of the second heat dissipation substrate 110 is between 2 mm and 4 mm. Thus, while ensuring heat dissipation performance, the connection reliability between the second and first heat dissipation substrates 110 is improved. Optionally, the thickness of the second heat dissipation substrate 110 can be 2 mm, 4 mm, or 3 mm; no limitation is made here.
[0052] This application also proposes a communication base station, which includes a base station body and a heat dissipation device connected to the base station body, wherein the heat dissipation device is the heat dissipation device described above.
[0053] The above description is merely an exemplary implementation of this application and does not limit the patent scope of the embodiments of this application. Any equivalent structural transformations made based on the technical concept of the embodiments of this application and the contents of the specification and drawings of the embodiments of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the embodiments of this application.
Claims
1. A heat dissipation device, characterized in that, The heat dissipation device includes: The helical fin heat sink includes a second heat dissipation substrate and second heat dissipation fins disposed on the second heat dissipation substrate; and A phase change heat sink includes a first heat sink substrate and a first heat sink fin disposed on the first heat sink substrate. The first heat sink substrate is at least partially embedded in a second heat sink substrate and is in contact with a heat source. A refrigerant circuit for the flow of a phase change medium is formed between the first heat sink substrate and the first heat sink fin. The second heat sink fin and the first heat sink fin are located on the same side of the second heat sink substrate.
2. The heat dissipation device as described in claim 1, characterized in that, The refrigerant circuit includes a heat collection cavity disposed inside the first heat dissipation substrate and a heat dissipation pipe disposed on the surface or inside the first heat dissipation fin. The heat dissipation pipe and the heat collection cavity are connected. The first heat dissipation substrate serves as the evaporation end of the phase change medium, and the first heat dissipation fin serves as the condensation end of the phase change medium.
3. The heat dissipation device as described in claim 2, characterized in that, The first heat dissipation fin has at least two heat dissipation surfaces arranged opposite each other, and at least one of the heat dissipation surfaces is provided with the heat dissipation pipe.
4. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation piping is configured as any one of a honeycomb structure, a diagonal structure, or a hybrid structure of honeycomb and diagonal.
5. The heat dissipation device as described in claim 2, characterized in that, The first heat dissipation substrate is provided with a heat collection protrusion. The heat collection protrusion has a hollow structure and is connected to the heat collection cavity. The heat collection protrusion abuts against one of the heat sources.
6. The heat dissipation device as described in claim 5, characterized in that, The heat collection cavity and / or the heat collection boss are provided with a support structure inside.
7. The heat dissipation device as described in claim 5, characterized in that, The heat collection cavity and / or the heat collection boss are provided with a boiling enhancement structure inside.
8. The heat dissipation device as described in claim 7, characterized in that, The boiling-enhanced structure is configured as at least one of sintered aluminum powder, machined micro-columns and micro-grooves, and sandblasting layer.
9. The heat dissipation device as described in claim 5, characterized in that, The surface area of the heat collecting boss is S1, the surface area of the heat source is S2, and S1 ≥ 1.5S2.
10. The heat dissipation device as described in claim 5, characterized in that, The surface of the heat-collecting protrusion facing the heat source is provided with a first heat-conducting layer.
11. The heat dissipation device as claimed in claim 1, characterized in that, The first heat dissipation fin is inclined relative to the horizontal direction, and the inclination angle of the first heat dissipation fin is greater than 40 degrees and less than 70 degrees.
12. The heat dissipation device as claimed in claim 1, characterized in that, The first heat dissipation substrate includes a substrate base and a substrate cover plate connected to the substrate base, the substrate base and the substrate cover plate cooperating to form the heat collection cavity.
13. The heat dissipation device as described in claim 12, characterized in that, The thickness of the substrate base and / or the substrate cover is 2 mm to 4 mm.
14. The heat dissipation device as claimed in claim 1, characterized in that, The second heat dissipation substrate has a groove on its surface facing the second heat dissipation fins, and the first heat dissipation substrate is disposed in the groove.
15. The heat dissipation device as described in claim 14, characterized in that, The heat dissipation device further includes a second heat-conducting layer, which is disposed at the bottom of the groove and connects the first heat dissipation substrate and the bottom of the groove.
16. The heat dissipation device as described in claim 14, characterized in that, The thickness of the second heat dissipation substrate is between 2 mm and 4 mm.
17. The heat dissipation device as claimed in claim 1, characterized in that, The second heat dissipation substrate has a mounting port that penetrates through the second heat dissipation substrate, and the first heat dissipation substrate is disposed at the mounting port.
18. The heat dissipation device as claimed in claim 1, characterized in that, The helical tooth radiator and the phase change radiator are connected by welding or screwing.
19. A communication base station, characterized in that, The communication base station includes a base station body and a heat dissipation device connected to the base station body, wherein the heat dissipation device is the heat dissipation device as described in any one of claims 1 to 18.