PCB manufacturing method

Abstract

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and more specifically to a PCB manufacturing method. Background Technology

[0002] PCB, or Printed Circuit Board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical interconnection. Because it is manufactured using electronic printing technology, it is called a "printed" circuit board. It provides mechanical support for fixing and assembling various electronic components, enabling wiring and electrical connections or electrical insulation between integrated circuits and other electronic components, and providing the required electrical characteristics. However, current technology cannot process multiple circuit boards at once during PCB manufacturing, resulting in slower PCB production speed. Summary of the Invention

[0003] The purpose of this invention is to provide a PCB manufacturing method that can process multiple circuit boards at once, thereby further improving the speed of PCB manufacturing.

[0004] The objective of this invention is achieved through the following technical solution:

[0005] A PCB manufacturing method, the method comprising the following steps:

[0006] Step 1: Prepare raw materials and add them into the hot melt machine to turn solid raw materials into liquid raw materials;

[0007] Step 2: Add the liquid raw material into the mold processing device to complete the processing of the circuit board;

[0008] Step 3: Perform anti-corrosion treatment on the processed circuit boards;

[0009] Step 4: Draw lines on the circuit board after the anti-corrosion treatment is completed;

[0010] Step 5: Drill holes in the circuit board after the lines have been drawn;

[0011] Step 6: Solder the drilled circuit board to complete the PCB fabrication.

[0012] The PCB manufacturing method, wherein the mold processing device comprises the following steps:

[0013] S1. Add the liquid raw material into the mold cavity;

[0014] S2. Cooling the liquid raw material inside the mold cavity;

[0015] S3, Move the mold cavity outward;

[0016] S4. Complete the automatic demolding process of solidified raw materials;

[0017] S5. The solidified material that is demolded is the circuit board.

[0018] In the PCB manufacturing method described above, the anti-corrosion treatment of the circuit board uses a ferric chloride solution.

[0019] The mold processing device includes a base circular plate and multiple vertical blocking plates uniformly fixedly connected to the base circular plate. Multiple limiting slide plates are uniformly fixedly connected to the base circular plate. Square support slide columns are slidably connected to each of the multiple limiting slide plates. Mold cavities are fixedly connected to the inner ends of the multiple square support slide columns. The multiple mold cavities are in contact with the multiple vertical blocking plates respectively. Feeding cavities are fixedly connected to each of the multiple mold cavities. Stepped circular plates are slidably connected to each of the multiple mold cavities. Demolding slide columns are fixedly connected to the outer ends of the multiple stepped circular plates.

[0020] Preferably, each of the multiple limiting slide plates is fixedly connected to a bearing seat, and each of the multiple bearing seats is rotatably connected to a transverse lead screw, and the multiple transverse lead screws are respectively threadedly connected to multiple square support slide columns.

[0021] Preferably, each of the plurality of square support slide columns is fixedly connected to a vertical abutment plate, the plurality of vertical abutment plates are slidably connected to the plurality of demolding slide columns respectively, and each of the plurality of demolding slide columns is fitted with a spring.

[0022] Preferably, the mold processing device further includes a horizontal support frame plate, a storage tank, a feeding ring pipe, and a discharge inclined pipe. The horizontal support frame plate is fixedly connected to the bottom support round plate, the storage tank is fixedly connected to the horizontal support frame plate, the feeding ring pipe is slidably connected to the storage tank, and the discharge inclined pipe is rotatably connected to the bottom of the storage tank.

[0023] Preferably, the mold processing device further includes a conical cavity, which is slidably connected to the feeding ring pipe.

[0024] Preferably, the mold processing device further includes a sealing cover, an arched plate, a square rotating shaft, a stirring vertical shaft, two perforated stirring plates, and a cross stirring plate. The sealing cover is fixedly connected to the storage tank, the arched plate is fixedly connected to the sealing cover, the square rotating shaft is rotatably connected to the arched plate, the stirring vertical shaft is rotatably connected to the sealing cover, the square rotating shaft is slidably connected to the stirring vertical shaft, and the two perforated stirring plates and the cross stirring plate are all fixedly connected to the stirring vertical shaft.

[0025] Preferably, the mold processing device further includes a corrugated circular plate and multiple horizontal support cylinders. The corrugated circular plate is fixedly connected to the sealing cover, and the multiple horizontal support cylinders are uniformly fixedly connected to the stirring vertical shaft, with all of the multiple horizontal support cylinders in contact with the corrugated circular plate. Attached Figure Description

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.

[0027] Figure 1 This is a flowchart illustrating a PCB manufacturing method.

[0028] Figure 2 This is a flowchart illustrating the processing method of the mold processing device;

[0029] Figure 3 This is a schematic diagram of the mold processing device of the present invention;

[0030] Figure 4 This is a partial structural schematic diagram of the mold processing device of the present invention;

[0031] Figure 5 This is a schematic diagram of an embodiment of mold processing of liquid raw materials;

[0032] Figure 6 This is a cross-sectional structural diagram of an embodiment of mold processing of liquid raw materials;

[0033] Figure 7 This is a schematic diagram of an embodiment for storing and stirring liquid raw materials;

[0034] Figure 8 This is a partial structural schematic diagram of an embodiment for storing and stirring liquid raw materials;

[0035] Figure 9 This is a cross-sectional structural diagram of an embodiment for storing liquid raw materials;

[0036] Figure 10 This is a schematic diagram of a specific structure for an embodiment of stirring liquid raw materials. Detailed Implementation

[0037] The present invention will now be described in further detail with reference to the accompanying drawings.

[0038] The following is in conjunction with the appendix Figure 1 Detailed explanation: A PCB manufacturing method, which includes the following steps:

[0039] Step 1: Prepare raw materials and add them into the hot melt machine to turn solid raw materials into liquid raw materials;

[0040] Step 2: Add the liquid raw material into the mold processing device to complete the processing of the circuit board;

[0041] Step 3: Perform anti-corrosion treatment on the processed circuit boards;

[0042] Step 4: Draw lines on the circuit board after the anti-corrosion treatment is completed;

[0043] Step 5: Drill holes in the circuit board after the lines have been drawn;

[0044] Step 6: Solder the drilled circuit board to complete the PCB fabrication.

[0045] The following is in conjunction with the appendix Figure 2 In detail, the PCB manufacturing method described above includes the following steps in the processing method of the mold processing device:

[0046] S1. Add the liquid raw material into the mold cavity;

[0047] S2. Cooling the liquid raw material inside the mold cavity;

[0048] S3, Move the mold cavity outward;

[0049] S4. Complete the automatic demolding process of solidified raw materials;

[0050] S5. The solidified material that is demolded is the circuit board.

[0051] According to the instruction manual Figure 1 In detail, the PCB manufacturing method described herein uses a ferric chloride solution for corrosion protection of the circuit board.

[0052] According to the instruction manual Figure 3-6 In detail, the mold processing device includes a base circular plate 101, multiple vertical blocking plates 102, multiple limiting sliding plates 103, multiple square support sliding pillars 104, multiple mold cavities 105, multiple feeding cavities 106, multiple stepped circular plates 107, and multiple demolding sliding pillars 108. Multiple vertical blocking plates 102 are uniformly and fixedly connected to the base circular plate 101 by welding. Multiple limiting sliding plates 103 are uniformly and fixedly connected to the base circular plate 101 by welding. Multiple square support sliding pillars 104 pass through square holes. Multiple limiting slide plates 103 are slidably connected to multiple mold cavities 105, which are respectively fixedly connected to the inner ends of multiple square support slide columns 104 by welding. Multiple vertical blocking plates 102 are respectively in contact with multiple mold cavities 105. Multiple feeding cavities 106 are respectively fixedly connected to multiple mold cavities 105 by welding. Multiple stepped circular plates 107 are respectively slidably connected to multiple mold cavities 105 through stepped holes. Multiple demolding slide columns 108 are respectively fixedly connected to the outer ends of multiple stepped circular plates 107 by welding.

[0053] Furthermore, the bottom support circular plate 101 serves as a load-bearing connection, providing a fixed space for the entire device and enabling it to be placed stably on the ground. Multiple vertical blocking plates 102 seal the openings at the inner ends of the multiple mold cavities 105. Multiple limiting slide plates 103 provide sliding space for the multiple square support slide columns 104 and limit their movement, ensuring they can only slide laterally. The multiple square support slide columns 104 provide space for the multiple mold cavities 105. A fixed space is provided, and multiple mold cavities 105 are moved. Gaps exist between the mold cavities 105 and the vertical blocking plates 102, allowing the liquid raw material to solidify within these gaps. The solidified material becomes the circuit board. Both the mold cavities 105 and the vertical blocking plates 102 are hollow structures, with coolant placed in their hollow areas. This allows the mold cavities 105 and the vertical blocking plates 102 to maintain a low temperature, which can then affect the circuit board. To further shorten the solidification rate of the liquid raw material, the liquid raw material can enter multiple mold cavities 105 through multiple feeding chambers 106. The inward movement of multiple stepped circular plates 107 completes the demolding process of the solidified liquid raw material. Multiple demolding slides 108 can drive the stepped circular plates 107 inward, adding the liquid raw material to multiple vertical blocking plates 102 and multiple mold cavities 105 through the multiple feeding chambers 106. The multiple vertical blocking plates 102 and multiple mold cavities 105 then... The coolant inside the cavity 105 cools the liquid raw material, causing it to solidify. After solidification, multiple square support slide columns 104 are pulled outward, causing the multiple mold cavities 105 to detach from the multiple vertical blocking plates 102. At this time, multiple demolding slide columns 108 are pushed inward. The inward movement of the demolding slide columns 108 will drive multiple stepped circular plates 107 to move into the multiple mold cavities 105, thereby completing the demolding process of the solidified liquid raw material and completing the preparation of the circuit board.

[0054] According to the instruction manual Figure 3-6 In detail, the mold processing device further includes multiple bearing seats 201 and multiple transverse lead screws 202. The multiple bearing seats 201 are respectively fixedly connected to multiple limiting slide plates 103 by welding. The multiple transverse lead screws 202 are respectively rotatably connected to the multiple bearing seats 201 through bearing holes. The multiple square support slide columns 104 are respectively threadedly connected to the multiple transverse lead screws 202.

[0055] Furthermore, multiple bearing seats 201 provide rotation space for multiple transverse lead screws 202. Each bearing seat 201 is fixedly connected to a geared motor I. The output shafts of the multiple geared motors I are fixedly connected to the multiple transverse lead screws 202. After starting the multiple geared motors I, the multiple transverse lead screws 202 can be driven to rotate. The rotating multiple transverse lead screws 202 can drive the multiple square support slide columns 104 to move. The multiple square support slide columns 104 can drive the multiple mold cavities 105 to move. When processing liquid raw materials with molds, the multiple mold cavities 105 are respectively in contact with the multiple vertical blocking plates 102. When demolding, the multiple mold cavities 105 are respectively released from contact with the multiple vertical blocking plates 102 in order to complete the demolding process of solidified liquid raw materials.

[0056] According to the instruction manual Figure 3-6 In detail, the mold processing device further includes multiple vertical support plates 301 and multiple springs 302. The multiple vertical support plates 301 are respectively fixedly connected to multiple square support slide columns 104 by welding. The multiple demolding slide columns 108 are respectively slidably connected to the multiple vertical support plates 301 through round holes. The multiple springs 302 are respectively sleeved on the multiple demolding slide columns 108.

[0057] Furthermore, the multiple vertical support plates 301 provide sliding space for the multiple demolding slide pillars 108, ensuring that the multiple demolding slide pillars 108 can slide smoothly. The elastic force generated by the multiple springs 302 acts on the multiple demolding slide pillars 108, causing the multiple demolding slide pillars 108 to tend to move outward. When the multiple square support slide pillars 104 move outward, the multiple vertical support plates 301 can drive the multiple demolding slide pillars 108 to move outward. When the multiple demolding slide pillars 108 contact the multiple bearing seats 201, the multiple demolding slide pillars 108 will slide inward, eventually driving the multiple stepped circular plates 107 to move into the interior of the multiple mold cavities 105, completing the demolding process of the solidified liquid raw material. When the multiple demolding slide pillars 108 are no longer in contact with the multiple bearing seats 201, the elastic force generated by the multiple springs 302 acts on the multiple demolding slide pillars 108, causing the multiple stepped circular plates 107 to return to their original positions, completing the secondary mold processing of the liquid raw material.

[0058] According to the instruction manual Figure 3 , 4 As detailed in 7-9, the mold processing device further includes a horizontal support frame plate 401, a storage tank 402, a feeding ring pipe 403, and a discharge inclined pipe 404. The horizontal support frame plate 401 is fixedly connected to the bottom support circular plate 101 by welding. The storage tank 402 is fixedly connected to the horizontal support frame plate 401 by welding. The feeding ring pipe 403 is slidably connected to the storage tank 402 through a groove. The discharge inclined pipe 404 is rotatably connected to the bottom of the storage tank 402 through a circular hole.

[0059] Furthermore, the horizontal support frame plate 401 serves as a support and fixation mechanism, providing a fixed space for the storage tank 402. Liquid raw materials can be added into the storage tank 402 for storage. The liquid raw materials are added into the storage tank 402 using the feeding ring pipe 403. The liquid raw materials entering the storage tank 402 are discharged through the discharge inclined pipe 404. The discharge inclined pipe 404 is equipped with a valve. After the valve is opened, the liquid raw materials in the storage tank 402 will be discharged. The liquid raw materials discharged through the discharge inclined pipe 404 will enter multiple feeding chambers 106 respectively, completing the addition of liquid raw materials into multiple vertical blocking plates 102 and multiple mold cavities 105, thus completing the simultaneous processing of multiple circuit boards.

[0060] According to the instruction manual Figure 3 , 7 As detailed in section 8, the mold processing device further includes a conical cavity 501, which is slidably connected to the feeding ring pipe 403 via a straight cavity.

[0061] Furthermore, liquid raw materials can be added into the conical collecting cavity 501. The liquid raw materials entering the conical collecting cavity 501 will enter the feeding ring pipe 403, and finally the liquid raw materials will enter the storage tank 402 to complete the storage of liquid raw materials.

[0062] According to the instruction manual Figure 3 , 7 Detailed descriptions of sections 8 and 10: The mold processing device further includes a sealing cover 601, an arched plate 602, a square rotating shaft 603, a stirring vertical shaft 604, two perforated stirring plates 605, and a cross stirring plate 606. The sealing cover 601 is fixedly connected to the storage tank 402 by threads. The arched plate 602 is fixedly connected to the sealing cover 601 by welding. The square rotating shaft 603 is rotatably connected to the arched plate 602 through bearing holes. The stirring vertical shaft 604 is rotatably connected to the sealing cover 601 through bearing holes. The square rotating shaft 603 and the stirring vertical shaft 604 are slidably connected through square holes. The two perforated stirring plates 605 and the cross stirring plate 606 are all fixedly connected to the stirring vertical shaft 604 by welding.

[0063] Furthermore, the sealing cap 601 can cover and seal the opening above the storage tank 402, and the arched plate 602 can provide space for the square rotating shaft 603 to rotate. A geared motor II is fixedly connected to the arched plate 602, and the output shaft of the geared motor II is fixedly connected to the square rotating shaft 603. After the geared motor II is started, it can drive the square rotating shaft 603 to rotate, and the rotating square rotating shaft 603 will drive the stirring vertical shaft 604 to rotate. When the stirring vertical shaft 604 rotates, it can drive the two perforated stirring plates 605 and the cross stirring plate 606 to rotate, thereby completing the stirring treatment of the liquid raw materials in the storage tank 402, further ensuring that the liquid raw materials entering the storage tank 402 will not solidify in the storage tank 402, avoiding waste of resources.

[0064] According to the instruction manual Figure 3 , 7 According to details in sections 8 and 10, the mold processing device further includes a corrugated circular plate 701 and multiple horizontal support cylinders 702. The corrugated circular plate 701 is fixedly connected to the sealing cover 601 by welding, and the multiple horizontal support cylinders 702 are uniformly fixedly connected to the stirring vertical shaft 604 by welding. All of the multiple horizontal support cylinders 702 are in contact with the corrugated circular plate 701.

[0065] Furthermore, the wave-shaped circular plate 701 is designed with a wave structure. When the stirring vertical shaft 604 rotates, it will drive multiple horizontal support cylinders 702 to rotate. When the multiple horizontal support cylinders 702 rotate and come into contact with the wave-shaped circular plate 701, they will drive the stirring vertical shaft 604 to oscillate up and down, thereby driving the two perforated stirring plates 605 and the cross stirring plate 606 to rotate and oscillate up and down. At this time, the two perforated stirring plates 605 and the cross stirring plate 606 will rotate and oscillate up and down at the same time, thus generating a larger contact area. At this time, the two perforated stirring plates 605 and the cross stirring plate 606 will produce a better stirring effect.

Claims

1. A PCB manufacturing method, characterized in that: The method includes the following steps: Step 1: Prepare raw materials and add them into the hot melt machine to turn solid raw materials into liquid raw materials; Step 2: Add the liquid raw material into the mold processing device to complete the processing of the circuit board; Step 3: Perform anti-corrosion treatment on the processed circuit boards; Step 4: Draw lines on the circuit board after the anti-corrosion treatment is completed; Step 5: Drill holes in the circuit board after the lines have been drawn; Step 6: Solder the drilled circuit board to complete the PCB fabrication.

2. The PCB manufacturing method according to claim 1, characterized in that: The processing method of the mold processing device includes the following steps: S1. Add the liquid raw material into the mold cavity; S2. Cooling the liquid raw material inside the mold cavity; S3, Move the mold cavity outward; S4. Complete the automatic demolding process of solidified raw materials; S5. The solidified material that is demolded is the circuit board.

3. The PCB manufacturing method according to claim 1, characterized in that: The circuit board is treated with ferric chloride solution for corrosion protection.

4. The PCB manufacturing method according to claim 2, characterized in that: The mold processing device includes a bottom support circular plate (101) and a plurality of vertical blocking plates (102) uniformly fixedly connected to the bottom support circular plate (101). A plurality of limiting slide plates (103) are uniformly fixedly connected to the bottom support circular plate (101). A square support slide column (104) is slidably connected to each of the plurality of limiting slide plates (103). A mold cavity (105) is fixedly connected to the inner end of each of the plurality of square support slide columns (104). The plurality of mold cavities (105) are in contact with the plurality of vertical blocking plates (102). A feeding cavity (106) is fixedly connected to each of the plurality of mold cavities (105). A stepped circular plate (107) is slidably connected to each of the plurality of mold cavities (105). A demolding slide column (108) is fixedly connected to the outer end of each of the plurality of stepped circular plates (107).

5. The PCB manufacturing method according to claim 4, characterized in that: Each of the multiple limiting slide plates (103) is fixedly connected to a bearing seat (201), and each of the multiple bearing seats (201) is rotatably connected to a transverse lead screw (202). The multiple transverse lead screws (202) are respectively threadedly connected to multiple square support slide columns (104).

6. The PCB manufacturing method according to claim 5, characterized in that: Each of the multiple square support slide columns (104) is fixedly connected with a vertical abutment plate (301), and the multiple vertical abutment plates (301) are slidably connected to the multiple demolding slide columns (108) respectively. Each of the multiple demolding slide columns (108) is fitted with a spring (302).

7. The PCB manufacturing method according to claim 4, characterized in that: A horizontal support frame plate (401) is fixedly connected to the bottom support circular plate (101), a storage tank (402) is fixedly connected to the horizontal support frame plate (401), a feeding ring pipe (403) is slidably connected to the storage tank (402), and a discharge inclined pipe (404) is rotatably connected to the bottom of the storage tank (402).

8. The PCB manufacturing method according to claim 7, characterized in that: A conical collecting cavity (501) is slidably connected to the feeding ring pipe (403).

9. A PCB manufacturing method according to claim 7, characterized in that: A sealing cover (601) is fixedly connected to the storage tank (402), an arched plate (602) is fixedly connected to the sealing cover (601), a square rotating shaft (603) is rotatably connected to the arched plate (602), a stirring vertical shaft (604) is rotatably connected to the sealing cover (601), the stirring vertical shaft (604) is slidably connected to the square rotating shaft (603), and two perforated stirring plates (605) and a cross stirring plate (606) are fixedly connected to the stirring vertical shaft (604).

10. A PCB manufacturing method according to claim 9, characterized in that: A corrugated circular plate (701) is fixedly connected to the sealing cover (601), and multiple horizontal support cylinders (702) are fixedly connected to the stirring vertical shaft (604). All the horizontal support cylinders (702) are in contact with the corrugated circular plate (701).

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