Jet flow cold plate, liquid cooling heat dissipation device and electronic equipment

Abstract

The embodiment of the invention provides a jet flow cold plate, a liquid cooling heat dissipation device and electronic equipment. The jet flow cold plate comprises a heat exchange substrate and a jet flow hole plate, the heat exchange substrate comprises a plurality of heat exchange areas with different heat flow densities, and one side of the heat exchange substrate is used for being attached to the heat exchange surface of a heating electronic component; the jet flow hole plate is located on the other side of the heat exchange substrate, a heat exchange cavity is defined by the jet flow hole plate and the heat exchange substrate in a sealed mode, the jet flow hole plate is provided with a plurality of jet flow holes which face the heat exchange substrate and communicate with the heat exchange cavity, and at least one of the jet flow holes faces the heat exchange area with the largest heat flow density in the heat exchange areas; for any two heat exchange areas in the multiple heat exchange areas, the cavity height of the heat exchange cavity corresponding to the heat exchange area with the larger heat flow density is smaller than the cavity height of the heat exchange cavity corresponding to the heat exchange area with the smaller heat flow density. According to the technical scheme, the driving power consumption of the jet flow cold plate can be reduced on the premise that the heat dissipation requirement of the jet flow cold plate is met.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a jet cooling plate, a liquid cooling heat dissipation device, and an electronic device. Background Technology

[0002] With the increasing integration of the electronics industry, the power density of chips is constantly increasing, leading to a sharp increase in the heat generated by electronic devices. Currently, traditional air cooling methods are approaching their heat dissipation limits and cannot meet the heat dissipation requirements of chips in scenarios with higher heat flux densities. Liquid cooling, on the other hand, has been widely used in electronic device heat dissipation due to its advantages such as high heat dissipation efficiency, low noise, energy saving, and compact structure.

[0003] A jet-type cold plate is a liquid-cooled cold plate used in liquid cooling devices. It uses a jet to propel coolant onto a heat exchange substrate, which is used for heat transfer between the coolant and the heat-generating electronic components. This allows for efficient heat exchange between the coolant and the heat exchange substrate, and the heat transferred from the electronic components to the heat exchange substrate can then be carried away through circulation. Generally, the higher the flow rate of the coolant in a jet-type cold plate, the better the heat exchange effect, but the greater the required pressure drop. Since the jetting and circulation of coolant in a jet-type cold plate require power, the power consumption required to meet the pressure drop design is also greater when the pressure drop is large.

[0004] How to reduce the driving power consumption of jet cooling plates while meeting their heat dissipation requirements is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides a jet cooling plate, a liquid cooling heat dissipation device, and an electronic device to reduce the driving power consumption of the jet cooling plate while meeting its heat dissipation requirements.

[0006] According to one aspect of this application, a jet cooling plate is provided, comprising a heat exchange substrate and a jet perforation plate, wherein: the heat exchange substrate includes a plurality of heat exchange zones with different heat flux densities, wherein one side of the heat exchange substrate is used to adhere to the heat exchange surface of a heat-generating electronic component; the jet perforation plate is located on the other side of the heat exchange substrate and seals and encloses a heat exchange cavity with the heat exchange substrate, wherein the jet perforation plate has a plurality of jet holes facing the heat exchange substrate and communicating with the heat exchange cavity, at least one of the plurality of jet holes facing the heat exchange zone with the highest heat flux density among the plurality of heat exchange zones, and for any two heat exchange zones among the plurality of heat exchange zones, the cavity height of the heat exchange cavity corresponding to the heat exchange zone with the higher heat flux density is less than the cavity height of the heat exchange cavity corresponding to the heat exchange zone with the lower heat flux density.

[0007] According to the embodiments of this application, the jet cooling plate can achieve at least the following technical effects: On the one hand, it can make the coolant in the heat exchange cavity obtain a relatively large flow velocity near the heat exchange zone with a higher heat flux density. At least one jet hole is directed towards the heat exchange zone with the highest heat flux density on the heat exchange substrate. Thus, the coolant has the fastest flow velocity near the heat exchange zone with the highest heat flux density. This is beneficial to ensuring the heat exchange effect of the jet cooling plate in the high heat flux density zone, thereby meeting the heat dissipation requirements of the jet cooling plate and achieving the purpose of efficient heat dissipation of heat-generating electronic components. On the other hand, since the cavity height of the heat exchange cavity corresponding to the heat exchange zone with a lower heat flux density is relatively large, the flow velocity of the coolant near the heat exchange zone with a lower heat flux density is also relatively small, and the required pressure drop is also relatively small. Thus, compared with the related technologies that adopt almost the same pressure drop design, it can save drive power consumption.

[0008] In some embodiments, the plurality of jet orifices are all directed toward the heat exchange zone with the highest heat flux density among the plurality of heat exchange zones, for jetting coolant toward the heat exchange zone with the highest heat flux density. In some embodiments, the plurality of jet orifices are directed toward at least two of the plurality of heat exchange zones, for jetting coolant toward at least two heat exchange zones, wherein the at least two heat exchange zones include the heat exchange zone with the highest heat flux density among the plurality of heat exchange zones. The design of these embodiments allows the coolant to flow faster near the heat exchange zone with higher heat flux density and relatively slower near the heat exchange zone with lower heat flux density, thus achieving both efficient heat dissipation for heat-generating electronic components and saving drive power consumption.

[0009] In some embodiments, the side of the heat exchange substrate facing the jet orifice plate has at least one first cavity height adjustment protrusion, and the side of the heat exchange substrate facing away from the jet orifice plate is planar in the region opposite to the at least one first cavity height adjustment protrusion; or, the side of the heat exchange substrate facing away from the jet orifice plate has first recesses formed in the regions opposite to the at least one first cavity height adjustment protrusion. In some embodiments, the side of the jet orifice plate facing the heat exchange substrate has at least one second cavity height adjustment protrusion, and the side of the jet orifice plate facing away from the heat exchange substrate has planar in the region opposite to the at least one second cavity height adjustment protrusion; or, the side of the jet orifice plate facing away from the heat exchange substrate has second recesses formed in the regions opposite to the at least one second cavity height adjustment protrusion. The specific cavity height of the heat exchange cavity corresponding to different heat exchange zones can be determined based on the heat flux density distribution map of the heat exchange surface of the heat-generating electronic component. To achieve different cavity height designs in different regions of the heat exchange cavity, the jet cold plate can flexibly adopt the design schemes of these embodiments.

[0010] In some embodiments, the side of the heat exchange substrate facing the jet orifice plate has at least one first cavity height adjustment slope; and / or, the side of the jet orifice plate facing the heat exchange substrate has at least one second cavity height adjustment slope. By designing the specific location, size, etc., of the first or second cavity height adjustment slope, different cavity heights in different regions of the heat exchange cavity can be constructed.

[0011] In some embodiments, the jet cooling plate further includes a plurality of turbulence protrusions, comprising: a first turbulence protrusion disposed on the side of the heat exchange substrate facing the jet perforation plate, wherein the first turbulence protrusion abuts against the jet perforation plate, or a distance is provided between the first turbulence protrusion and the jet perforation plate; and / or, a second turbulence protrusion disposed on the side of the jet perforation plate facing the heat exchange substrate, wherein the second turbulence protrusion abuts against the heat exchange substrate, or a distance is provided between the second turbulence protrusion and the heat exchange substrate. The turbulence protrusions can provide mechanical support within the heat exchange cavity, and also can disperse the coolant and exchange heat with the coolant, thereby further improving the heat exchange effect of the jet cooling plate.

[0012] In some embodiments, a plurality of turbulence protrusions are uniformly arranged in the heat exchange cavity; or, a plurality of turbulence protrusions are arranged in the heat exchange cavity based on at least two arrangement densities.

[0013] In some embodiments, the plurality of turbulence protrusions include columnar turbulence protrusions, conical turbulence protrusions, or frustum-shaped turbulence protrusions.

[0014] In some embodiments, the multiple turbulence protrusions are all identical in shape and size; or, at least two of the multiple turbulence protrusions are different in shape and / or size from one another.

[0015] There are various design options for the turbulence protrusions on jet cooling plates. The design can be tailored to match the design flow rate of the coolant in different heat exchange zones, or the heat exchange requirements between the coolant and the turbulence protrusions in different zones. For example, when the design flow rate of the coolant in a certain heat exchange zone is high, the density of the turbulence protrusions can be designed to be relatively low; when the design flow rate of the coolant in a certain heat exchange zone is low, the density of the turbulence protrusions can be designed to be relatively high. Similarly, when the heat exchange requirement between the coolant and the turbulence protrusions in a certain heat exchange zone is high, the density of the turbulence protrusions can be designed to be relatively high; when the heat exchange requirement between the coolant and the turbulence protrusions in a certain heat exchange zone is low, the density of the turbulence protrusions can be designed to be relatively high. For example, for high heat flux density heat exchange zones, the diameter of the turbulence protrusions can be designed to be smaller to minimize resistance to coolant flow; for low heat flux density heat exchange zones, the diameter of the turbulence protrusions can be designed to be larger. For example, in a high heat flux density heat transfer zone, the height of the turbulence protrusion is also small because the corresponding cavity height is relatively small; in a low heat flux density heat transfer zone, the height of the turbulence protrusion is also large because the corresponding cavity height is relatively large.

[0016] In some embodiments, the jet cooling plate further includes a first component that seals and encloses a liquid inlet chamber on the side of the jet orifice plate opposite to the heat exchange chamber. The first component has a liquid inlet port communicating with the liquid inlet chamber, and multiple jet orifices also communicate with the liquid inlet chamber. The specific structural form of the first component is not limited. For example, it can be generally shell-shaped, with the liquid inlet port located at the top center of the shell shape. To facilitate communication with the piping of the liquid cooling heat dissipation device, the liquid inlet port can extend a certain length along its axial direction.

[0017] In some embodiments, the jet orifice plate further has at least one return port, wherein the at least one return port is in communication with the heat exchange cavity; the jet cooling plate further includes a second component, wherein the second component, the side of the jet orifice plate opposite to the heat exchange cavity, and the side of the first component opposite to the liquid inlet cavity seal and enclose a return cavity, the second component has a liquid outlet communicating with the return cavity, and at least one return port is also in communication with the return cavity. The specific structural form of the second component is not limited. In some embodiments, the heat exchange cavity, the liquid inlet cavity, and the return cavity are arranged sequentially along a direction orthogonal to the heat exchange substrate, which not only helps to shorten the flow path of the coolant in the jet cooling plate to further improve the heat dissipation effect, but also helps to reduce the overall thickness of the jet cooling plate, thereby reducing the space occupied by the liquid cooling heat dissipation device and making it easier to implement and assemble in electronic devices.

[0018] According to one aspect of this application, a liquid cooling heat dissipation device is provided, comprising: a liquid storage tank, a pump, and a jet cooling plate according to any of the foregoing embodiments, all connected in a circulation loop via pipelines. Based on the design scheme of the jet cooling plate of the embodiments of this application, the liquid cooling heat dissipation device not only has a better heat dissipation effect, but also consumes less power than related technologies, thus being more energy-efficient and environmentally friendly.

[0019] According to one aspect of this application, an electronic device is provided, comprising a housing, a heat-generating electronic component disposed within the housing, and a liquid cooling heat dissipation device according to any of the foregoing embodiments disposed within the housing, wherein the side of the heat exchange substrate facing away from the heat exchange cavity is in contact with the heat exchange surface of the heat-generating electronic component. Since the liquid cooling heat dissipation device has good heat dissipation effect and lower power consumption compared to related technologies, the electronic device also achieves corresponding beneficial effects, not only having better operational reliability but also being more energy-efficient. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the cross-sectional structure of the heat exchange substrate and jet perforated plate of the jet cold plate in the related technology, wherein the heat-generating electronic components are shown.

[0021] Figure 2 This is a schematic diagram showing different sub-regions divided based on the differences in heat flux density on the heat exchange surfaces of some heat-generating electronic components;

[0022] Figure 3 This is a schematic cross-sectional view of a jet cooling plate according to some embodiments of this application;

[0023] Figure 4 This is a cross-sectional structural cutaway diagram of a jet cooling plate according to some embodiments of this application;

[0024] Figure 5 This is a simplified cross-sectional schematic diagram of a jet cooling plate according to some embodiments of this application;

[0025] Figures 6A to 6I This is a partial cross-sectional structural diagram of a jet cooling plate according to some embodiments of this application;

[0026] Figures 7A to 7F This is a partial cross-sectional structural diagram of a jet cooling plate according to some embodiments of this application;

[0027] Figure 8 This is a simplified structural block diagram of a liquid cooling heat dissipation device according to some embodiments of this application;

[0028] Figure 9 This is a simplified cross-sectional structural diagram of an electronic device according to some embodiments of this application.

[0029] Figure label:

[0030] The accompanying diagrams referencing the relevant technologies mentioned in this article:

[0031] 001-Jet cold plate; 010-Heat exchange substrate; 020-Jet perforated plate; 030-Heat exchange cavity; 021-Jet hole; 003-Heat-generating electronic components;

[0032] 031 - Heat exchange surface; 031a - Higher heat flux density region; 031b - Lower heat flux density region; 043 - Return port.

[0033] Reference numerals in the accompanying drawings of the embodiments of this application:

[0034] 300 - Heating electronic components; 310 - Heat exchange surface; 311, 311a, 311b - Sub-regions; 200 - Liquid cooling device; 210 - Liquid reservoir; 220 - Pump;

[0035] 230 - Piping; 240 - Heat dissipation component; 100 - Jet cold plate; 10 - Heat exchange base plate; 110, 110a, 110b - Heat exchange zone; 20 - Jet perforated plate;

[0036] 30 - Heat exchange chamber; 21 - Jet orifice; 12 - First chamber height adjustment boss; 22 - Second chamber height adjustment boss; 13 - First recess; 23 - Second recess;

[0037] 14-First cavity height adjustment slope; 24-Second cavity height adjustment slope; 125-Turbulence protrusion; 15-First turbulence protrusion; 25-Second turbulence protrusion;

[0038] 40 - First component; 41 - Liquid inlet chamber; 42 - Liquid inlet port; 43 - Return port; 50 - Second component; 51 - Return chamber; 52 - Liquid outlet port;

[0039] 16a, 16b - Positioning grooves; 500 - Electronic equipment; 400 - Housing; 600 - Display screen; 700 - Battery. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the application will be described in further detail below with reference to the accompanying drawings.

[0041] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0042] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0043] With the increasing integration of the electronics industry, the heat generated by electronic devices has increased dramatically. Typically, electronic devices require heat dissipation devices. Liquid cooling is a common type of heat dissipation device, offering advantages over air cooling devices such as higher heat dissipation efficiency, lower noise, greater energy efficiency, and a more compact structure.

[0044] In related technologies, the main structure of a liquid cooling heat dissipation device can include a liquid cooling plate (also commonly referred to as a cold plate or liquid cooling plate), piping, a reservoir, and a pump. The liquid cooling plate is used to remove heat transferred from heat-generating electronic components (such as chips) of electronic devices through the flow of coolant within its cavity. The piping provides a transport path for the circulating coolant, the reservoir stores sufficient coolant, and the pump drives the coolant to circulate within the reservoir, piping, and liquid cooling plate. Furthermore, some liquid cooling heat dissipation devices are also equipped with heat dissipation components, such as heat sink fins, for rapidly cooling the coolant after it has absorbed heat and heated up.

[0045] Jet-type cold plates are a type of liquid-cooled cold plate used in liquid-cooled heat dissipation devices. For example... Figure 1 As shown, this is a cross-sectional structural diagram of the heat exchange substrate 010 and the jet perforated plate 020 of a jet cooling plate 001 in a related art. It also illustrates a heat-generating electronic component 003 for heat exchange with the heat exchange substrate 010 of the jet cooling plate 001. Figure 1As shown, the basic structure of the jet cooling plate 001 includes a heat exchange substrate 010 and a jet perforated plate 020 that are joined together to form a heat exchange cavity 030. The heat exchange substrate 010 is used to adhere to the heat exchange surface of the heat-generating electronic component 003, and the jet perforated plate 020 has multiple jet holes 021 opening towards the heat exchange substrate 010. When the liquid cooling device is working, a certain pressure drop is provided by the pump of the liquid cooling device. Under the action of this pressure drop, the coolant (its flow direction is approximately as shown by the dotted arrow in the figure) first enters the heat exchange cavity 030 in a jet manner through the jet holes 021 and impacts the surface of the heat exchange substrate 010. Then it disperses and flows to other areas of the heat exchange cavity 030, and then flows out of the heat exchange cavity 030 through the return port 043. During this process, the coolant exchanges heat with the heat exchange substrate 010. By continuously allowing coolant to flow into and out of the heat exchange chamber 030, the heat transferred from the heat-generating electronic component 003 to the heat exchange substrate 010 can be carried away, thereby achieving heat dissipation for the heat-generating electronic component 003. In this paper, jet can be understood as a state in which fluid escapes the constraint of a solid boundary (such as the outlet of a jet orifice) and flows at a high speed in another environment (such as a heat exchange chamber); pressure drop can be understood as the hydraulic driving force applied to the fluid to meet the fluid flow rate.

[0046] Generally, with a constant jet flow rate, the smaller the distance between the heat exchange substrate 010 and the jet orifice plate 020, the smaller the cavity height h0 of the heat exchange chamber 030, the shorter the jet distance of the coolant, the greater the jet velocity of the coolant, and the better the heat exchange effect of the jet cold plate 001. However, correspondingly, the pressure drop required to drive the coolant to flow in the jet cold plate 001 is also greater, and the driving power required to meet the pressure drop is also greater. In this paper, the jet flow rate can be understood as the fluid volume of the coolant passing through the jet orifice outlet per unit time, the jet distance can be understood as the flow distance of the coolant after leaving the jet orifice outlet and impacting the surface of the heat exchange substrate, and the jet velocity can be understood as the flow velocity of the coolant when it impacts the surface of the heat exchange substrate.

[0047] In some heat-generating electronic components, such as CPUs (central processing units) or GPUs (graphics processing units), the heat flux density on the heat exchange surface is typically non-uniform. For example... Figure 1As shown, in related technologies, some jet cooling plates 001 are designed without considering the differences in heat flux density of the heat exchange surfaces 031 of the heat-generating electronic components 003 in actual application scenarios. This results in the heat exchange cavity 030 having a basically uniform cavity height h0, meaning the coolant flows in the heat exchange cavity 030 with an almost uniform pressure drop design. While this maximizes the pressure drop to meet the heat dissipation requirements of the heat-generating electronic components 003 in the higher heat flux density region 031a, it also leads to some wasted drive power in the lower heat flux density region 031b of the heat-generating electronic components 003. This results in higher power consumption of the liquid cooling device, such as higher power consumption of the pump. In this paper, heat flux density can be understood as the thermal energy passing through a unit area per unit time, used to represent the rate of heat transfer, with the SI unit being joules per (second * square meter).

[0048] In view of this, embodiments of this application provide a jet cooling plate, a liquid cooling heat dissipation device, and an electronic device to reduce the driving power consumption of the jet cooling plate while meeting its heat dissipation requirements. The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0049] like Figure 2 As shown, some heat-generating electronic components 300, such as CPUs or GPUs, have non-uniform heat flux densities on their heat exchange surfaces 310. Based on the heat flux density distribution, the heat exchange surface 310 of the heat-generating electronic component 300 can be divided into multiple sub-regions 311 with different heat flux densities, thereby obtaining a heat flux density distribution map. For example, in some application scenarios of embodiments, referring to... Figure 2As illustrated in the diagram, the heat exchange surface 310 of the heating electronic component 300 can be divided into a high heat flux density sub-region 311a and a low heat flux density sub-region 311b surrounding the high heat flux density sub-region 311a. For example, in some application scenarios of embodiments (not shown in the accompanying drawings), the heat exchange surface of the heating electronic component can be divided into a high heat flux density sub-region, a medium heat flux density sub-region surrounding the high heat flux density sub-region, and a low heat flux density sub-region surrounding the medium heat flux density sub-region. Furthermore, in some application scenarios of embodiments (not shown in the accompanying drawings), the heat exchange surface of the heating electronic component can be divided into a high heat flux density sub-region and a low heat flux density sub-region located to one side of the high heat flux density sub-region. The heat flux density distribution map can be obtained through actual testing of the heat exchange surface 310 or through simulation analysis of a simulation model of the heating electronic component 300. When the specific product type of the heat-generating electronic component 300 is different, the specific design adopted is different, or the precision of the heat flux density sub-region setting is different, the heat flux density distribution map that can be obtained based on the heat flux density distribution of its heat exchange surface 310 will also be different, resulting in different specific distributions of the above-mentioned multiple sub-regions 311. This application does not make specific limitations in this regard, and more embodiments will not be listed here.

[0050] like Figure 3 , Figure 4 and Figure 5 As shown, where, Figure 3 This is a schematic cross-sectional view of the jet cooling plate 100 according to some embodiments of this application. Figure 4 This is a cross-sectional exploded view of the jet cooling plate 100 according to some embodiments of this application. Figure 5 This is a simplified cross-sectional schematic diagram of the jet cooling plate 100 according to some embodiments of this application. The jet cooling plate 100 provided in the embodiments of this application is a main component of a liquid cooling heat dissipation device, mainly used to be bonded to, for example, the heat exchange surface 310 of the heat-generating electronic component 300 described above (such as direct contact bonding or bonding through thermally conductive adhesive) and to exchange heat.

[0051] In these embodiments, the jet cooling plate 100 includes a heat exchange substrate 10 and a jet perforated plate 20. (Refer to...) Figure 5As shown, the heat exchange substrate 10 includes multiple heat exchange zones 110 with different heat flux densities, wherein one side of the heat exchange substrate 10 is used to attach to the heat exchange surface 310 of the heat-generating electronic component 300. The jet orifice plate 20 is located on the other side of the heat exchange substrate 10 and seals the heat exchange cavity 30 with the heat exchange substrate 10. The jet orifice plate 20 has a plurality of jet holes 21 facing the heat exchange substrate 10 and communicating with the heat exchange cavity 30. At least one of the plurality of jet holes 21 faces the heat exchange zone 110 with the largest heat flux density (such as heat exchange zone 110a) among the plurality of heat exchange zones 110 of the heat exchange substrate 10. For any two heat exchange zones 110 of the heat exchange substrate 10, the cavity height h1 of the heat exchange cavity 30 corresponding to the heat exchange zone 110 with the larger heat flux density (such as heat exchange zone 110a) is smaller than the cavity height h2 of the heat exchange cavity 30 corresponding to the heat exchange zone 110 with the smaller heat flux density (such as heat exchange zone 110b).

[0052] In the structure of the jet cooling plate 100, the heat exchange substrate 10 is used to adhere to the heat exchange surface 310 of the heat-generating electronic component 300, thereby exchanging heat with it. For example... Figure 5 As shown, the heat exchange substrate 10 includes multiple heat exchange regions 110 with different heat flux densities. These multiple heat exchange regions 110 can interact with multiple sub-regions 311 of the heat exchange surface 310 of the heat-generating electronic component 300 (see reference). Figure 2 As shown, multiple heat exchange zones 110 are arranged opposite to multiple sub-zones 311, so that the heat exchange zone 110 corresponding to the sub-zone 311 with a higher heat flux density also has a higher heat flux density. The jet orifice plate 20 is used to spray coolant toward the heat exchange substrate 10 through its multiple jet holes 21, so that the coolant exchanges heat with the heat exchange substrate 10. Then, by continuously having coolant flow into and out of the heat exchange chamber 30, the heat transferred from the heat-generating electronic component 300 to the heat exchange substrate 10 can be carried away (the flow direction of the coolant is roughly as shown by the arrow in the figure). In the embodiments of this application, the coolant can be selected from, but is not limited to, at least one of pure water, ethylene glycol, alcohol, or ammonia.

[0053] In this embodiment, the heat exchange cavity 30 is formed by a jet orifice plate 20 and a heat exchange substrate 10 sealed together, providing space for coolant jetting and flow dispersion according to certain design requirements. Heat exchange between the coolant and the heat exchange substrate 10 occurs within this heat exchange cavity 30. The sealed enclosure can be understood as the two structures being sealed at the connection point, thus preventing coolant leakage at the connection. The cavity height of the heat exchange cavity 30 corresponding to a certain heat exchange zone 110 can be understood as the average value of the distance between the heat exchange substrate 10 and the jet orifice plate 20 in that heat exchange zone 110.

[0054] As described above, the smaller the cavity height, the shorter the coolant jet distance, the greater the jet velocity, and the better the heat exchange effect. However, correspondingly, the pressure drop required to drive the coolant to flow in the jet cold plate 100 is also greater, and the driving power required to meet the pressure drop is also greater. In this embodiment, the cavity height h1 corresponding to the heat exchange zone 110 with a higher heat flux density (such as heat exchange zone 110a) is designed to be smaller than the cavity height h2 corresponding to the heat exchange zone 110 with a lower heat flux density (such as heat exchange zone 110b). This design can achieve at least the following technical effects:

[0055] On the one hand, the coolant in the heat exchange chamber 30 can achieve a relatively high flow velocity near the heat exchange zone 110 (e.g., heat exchange zone 110a) with a higher heat flux density. For example, the flow velocity of the coolant jetting toward the heat exchange zone 110 (e.g., heat exchange zone 110a) can be faster, and the coolant near the heat exchange zone 110 (e.g., heat exchange zone 110a) can flow more quickly to the surrounding area. At least one of the multiple jet holes 21 is directed toward the heat exchange zone 110 (e.g., heat exchange zone 110a) with the highest heat flux density among the multiple heat exchange zones 110 of the heat exchange substrate 10, thereby the coolant has the fastest flow velocity near the heat exchange zone 110 (e.g., heat exchange zone 110a) with the highest heat flux density. These features help ensure the heat exchange effect of the jet cold plate 100 in the higher heat flux density region, thereby achieving the heat dissipation requirements of the jet cold plate 100 and realizing the purpose of efficient heat dissipation for the heat-generating electronic components 300.

[0056] On the other hand, since the heat exchange chamber 30 has a relatively large cavity height h2 corresponding to the heat exchange zone 110 (such as heat exchange zone 110b) with a smaller heat flux density, the flow velocity of the coolant near the heat exchange zone 110 (such as heat exchange zone 110b) with a smaller heat flux density is also relatively small, and the required pressure drop is also relatively small. Thus, compared with the related technology that adopts an almost identical pressure drop design, the drive power consumption can be saved. For example, the power consumption of the pump of the liquid cooling heat dissipation device can be reduced by this design.

[0057] Therefore, the design of the jet cooling plate 100 in this application embodiment can reduce the driving power consumption of the jet cooling plate 100 while meeting the heat dissipation requirements of the jet cooling plate 100.

[0058] This application does not limit the specific structural form of the jet holes 21 of the jet orifice plate 20. In some embodiments of this application, based on the above-described design of the jet cooling plate 100 and the aforementioned technical effects, the design requirements for the jet holes 21 of the jet orifice plate 20 can be appropriately reduced. For example, the jet holes 21 can adopt a simpler cylindrical hole structure (such as...). Figure 5 (as shown) or tapered hole (such as) Figure 3 As shown in the figure, this helps to reduce the design and manufacturing costs of the jet cooling plate 100.

[0059] Continue to refer to Figure 5 As shown, in some embodiments of this application, a plurality of jet holes 21 may be directed toward at least two of the plurality of heat exchange zones 110 to jet coolant toward the at least two heat exchange zones 110, wherein the at least two heat exchange zones 110 include the heat exchange zone 110 with the highest heat flux density among the plurality of heat exchange zones 110 (such as heat exchange zone 110a).

[0060] For example, in some embodiments, the heat exchange surface 310 of the heating electronic component 300 may be divided into a high heat flux density sub-region 311a and a low heat flux density sub-region 311b surrounding the high heat flux density sub-region 311a (see reference). Figure 2 As shown), correspondingly, as Figure 5 As shown, the heat exchange substrate 10 includes a high heat flux density heat exchange region 110a and a low heat flux density heat exchange region 110b, which are respectively arranged in a one-to-one correspondence with the high heat flux density sub-region 311a and the low heat flux density sub-region 311b. A portion of the multiple jet holes 21 of the jet substrate 20 face the high heat flux density heat exchange region 110a, while the remaining portion of the jet holes 21 face the low heat flux density heat exchange region 110b. This arrangement allows the coolant jetted towards the high heat flux density heat exchange region 110a to have a faster flow velocity in that region, while the coolant jetted towards the low heat flux density heat exchange region 110b has a relatively slower flow velocity in that region. This achieves efficient heat dissipation for the heat-generating electronic components 300 and also helps to save drive power consumption.

[0061] For example, in some embodiments (not illustrated in the accompanying drawings), the heat exchange surface of the heat-generating electronic component can be divided into a high heat flux density sub-region, a medium heat flux density sub-region surrounding the high heat flux density sub-region, and a low heat flux density sub-region surrounding the medium heat flux density sub-region. Correspondingly, the heat exchange substrate includes high heat flux density heat exchange regions, medium heat flux density heat exchange regions, and low heat flux density heat exchange regions, each corresponding to one of the high, medium, and low heat flux density sub-regions. A portion of the multiple jet holes face the high heat flux density heat exchange region, while the remaining jet holes face the medium heat flux density heat exchange region. Thus, the coolant flowing towards the high heat flux density heat exchange region has the fastest flow velocity in that region, the coolant flowing towards the medium heat flux density heat exchange region has a relatively slower flow velocity in that region, and the coolant flowing near the low heat flux density heat exchange region has the slowest flow velocity in that region. This achieves efficient heat dissipation for the heat-generating electronic component and also helps save on drive power consumption.

[0062] In other embodiments of this application (see the appendix described below) Figure 6AIn the embodiment shown, the multiple jet holes 21 of the jet substrate 20 can all be directed towards the heat exchange zone with the highest heat flux density among the multiple heat exchange zones of the heat exchange substrate 10 (not shown in the figure), so as to jet the coolant into the heat exchange zone with the highest heat flux density. After the coolant is jetted into the heat exchange zone with the highest heat flux density through the multiple jet holes 21, it flows and disperses to other areas. Since the flow velocity of the coolant is fastest near the heat exchange zone with the highest heat flux density, it can efficiently remove the heat from the heat-generating electronic components, thereby efficiently dissipating heat from the heat-generating electronic components. The coolant near other heat exchange zones requires a relatively small pressure drop, which helps to save drive power consumption.

[0063] In this embodiment, the jet orifice plate 20 and the heat exchange substrate 10 can be sealed together using fasteners (not shown in the figure) and sealing connectors (such as sealing gaskets, not shown in the figure). Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments of this application, the jet cooling plate 100 may further include a first component 40, which seals and encloses the liquid inlet cavity 41 on the side of the jet orifice plate 20 away from the heat exchange cavity 30. The first component 40 has a liquid inlet port 42 communicating with the liquid inlet cavity 41, and a plurality of jet holes 21 of the jet orifice plate 20 are also communicating with the liquid inlet cavity 41.

[0064] The specific structural form of the first component 40 is not limited. In some embodiments, such as Figure 3 , Figure 4 and Figure 5 As shown, the first component 40 is generally shell-shaped, with the liquid inlet 42 located at the top center of the shell. To facilitate connection with the piping of the liquid cooling heat dissipation device (not shown in the figure), the liquid inlet 42 can extend a certain length along its axial direction. A sealed connection can be achieved between the first component 40 and the jet orifice plate 20 using a sealing connector (such as a sealing compound, not shown in the figure). Figure 4 As shown, in order to facilitate the assembly of the first component 40 and the jet orifice plate 20, a positioning groove 16a for limiting the first component 40 can be provided in the jet orifice plate 20.

[0065] like Figure 4 or Figure 5 As shown, in some embodiments of this application, the jet orifice plate 20 further has at least one return port 43, which communicates with the heat exchange chamber 30. The jet cooling plate 100 may also include a second component 50, wherein the second component 50, the side of the jet orifice plate 20 facing away from the heat exchange chamber 30, and the side of the first component 40 facing away from the liquid inlet chamber 41 seal and enclose a return liquid chamber 51, and the second component 50 has a liquid outlet 52 communicating with the return liquid chamber 51, and the aforementioned at least one return port 43 also communicates with the return liquid chamber 51. Figure 4As shown, to facilitate the assembly of the second component 50 with the jet orifice plate 20, a positioning groove 16b for limiting the second component 50 can be provided in the jet orifice plate 20.

[0066] When the jet cooling plate 100 is working, under the action of hydraulic drive, the coolant at a lower temperature enters the inlet chamber 41 through the inlet port 42 and is jetted toward the heat exchange substrate 10 through multiple jet holes 21, thereby impacting the heat exchange substrate 10 and exchanging heat with it; then, under the action of hydraulic drive, the coolant at a higher temperature in the heat exchange chamber 30 enters the return chamber 51 through at least one return port 43 and flows out of the jet cooling plate 100 through the outlet port 52.

[0067] The specific structural form of the second component 50 is not limited. In some embodiments, such as Figure 3 , Figure 4 and Figure 5 As shown, the second component 50 is generally in the shape of a cover with a central opening. The liquid inlet 42 of the first component 40 passes through the central opening of the second component 50 and is sealed to it at the central opening. In these embodiments, the heat exchange chamber 30, the liquid inlet chamber 41, and the liquid return chamber 51 are arranged sequentially along a direction orthogonal to the heat exchange substrate 10. This not only helps to shorten the flow path of the coolant in the jet cooling plate 100 to further improve the heat dissipation effect, but also helps to reduce the overall thickness of the jet cooling plate 100, thereby reducing the space occupied by the liquid cooling heat dissipation device and making it easier to arrange and assemble in electronic devices.

[0068] In this embodiment, the cavity height h1 of the heat exchange cavity 30 corresponding to the heat exchange region 110 with a higher heat flux density (such as heat exchange region 110a) is smaller than the cavity height h2 of the heat exchange cavity 30 corresponding to the heat exchange region 110 with a lower heat flux density (such as heat exchange region 110b). The specific cavity height of the heat exchange cavity 30 corresponding to different heat exchange regions 110 can be based on the heat exchange surface 310 of the heating electronic component 300 (see...). Figure 2 The heat flux density distribution diagram (as shown) is used to determine this. To achieve different cavity heights in different regions of the heat exchange cavity 30, the jet cooling plate 100 can adopt various design schemes. This application embodiment does not specifically limit this, such as... Figures 6A to 6I As shown, it illustrates a partial cross-sectional structural diagram of the jet cooling plate 100 according to different embodiments of this application.

[0069] like Figure 6E As shown, in some embodiments, to achieve different cavity heights in different regions of the heat exchange cavity 30, the side of the heat exchange substrate 10 facing the jet orifice plate 20 has at least one first cavity height adjustment boss 12. Figure 6EOnly one first cavity height adjustment boss 12 is shown in the diagram. The side of the heat exchange substrate 10 facing away from the jet orifice plate 20 is planar in the area opposite to the at least one first cavity height adjustment boss 12. The first cavity height adjustment boss 12 is stepped and can be a single-stage boss or a multi-stage boss. Figure 6E (Illustrated as a first-order boss). In some embodiments, the side of the heat exchange substrate 10 facing the jet orifice plate 20 may have a plurality of first cavity height adjustment bosses 12, and the dimensions of the plurality of first cavity height adjustment bosses 12 may be exactly the same. In some embodiments, the side of the heat exchange substrate 10 facing the jet orifice plate 20 may have a plurality of first cavity height adjustment bosses 12, and the dimensions of the plurality of first cavity height adjustment bosses 12 may be different, for example, the protrusion heights of two first cavity height adjustment bosses 12 may be different.

[0070] like Figure 6F As shown, in some embodiments, to achieve different cavity heights in different regions of the heat exchange cavity 30, the side of the heat exchange substrate 10 facing the jet orifice plate 20 has at least one first cavity height adjustment boss 12. Figure 6F Only one first cavity height adjustment boss 12 is shown in the diagram. Furthermore, on the side of the heat exchange substrate 10 facing away from the jet orifice plate 20, first recesses 13 are formed in the region opposite to the at least one first cavity height adjustment boss 12. The first cavity height adjustment boss 12 is stepped and can be a single-stage boss or a multi-stage boss. Figure 6F (Illustrated as a first-order boss). In some embodiments, the side of the heat exchange substrate 10 facing the jet orifice plate 20 may have a plurality of first cavity height adjustment bosses 12 designed in this way, and the plurality of first cavity height adjustment bosses 12 may have identical dimensions. In some embodiments, the side of the heat exchange substrate 10 facing the jet orifice plate 20 may have a plurality of first cavity height adjustment bosses 12 designed in this way, and the plurality of first cavity height adjustment bosses 12 may have different dimensions, for example, the protrusion heights of two first cavity height adjustment bosses 12 may be different.

[0071] like Figure 6A , Figure 6B , Figure 6C and Figure 6D As shown, in some embodiments, to achieve different cavity heights in different regions of the heat exchange cavity 30, the side of the jet orifice plate 20 facing the heat exchange substrate 10 has at least one second cavity height adjusting boss 22, and the side of the jet orifice plate 20 facing away from the heat exchange substrate 10 is planar in the region opposite to the at least one second cavity height adjusting boss 22. The second cavity height adjusting boss 22 is stepped and can be a single-stage boss or a multi-stage boss. Figure 6A , Figure 6B , Figure 6C and Figure 6D(These are illustrated as first-order bosses). In these embodiments, at least one of the plurality of jet holes 21 may be disposed on and penetrate the second cavity height adjusting boss 22. Figure 6C As shown, the jet orifice plate 20 has a plurality of second cavity height adjustment protrusions 22 on the side facing the heat exchange substrate 10, and the plurality of second cavity height adjustment protrusions 22 can be identical in size. In some embodiments, such as Figure 6D As shown, the jet orifice plate 20 has a plurality of second cavity height adjustment protrusions 22 on the side facing the heat exchange substrate 10. The size and specifications of the plurality of second cavity height adjustment protrusions 22 may be different. For example, the protrusion heights of two second cavity height adjustment protrusions 22 may be different.

[0072] like Figure 6E As shown, in some embodiments, to achieve different cavity heights in different regions of the heat exchange cavity 30, the jet orifice plate 20 has at least one second cavity height adjustment boss 22 on the side facing the heat exchange substrate 10. Figure 6E Only one second cavity height adjustment boss 22 is shown in the diagram. Furthermore, on the side of the jet orifice plate 20 facing away from the heat exchange substrate 10, second recesses 23 are formed in the region opposite to the at least one second cavity height adjustment boss 22. The second cavity height adjustment boss 22 is stepped and can be a single-stage boss or a multi-stage boss. Figure 6E (Illustrated as a first-order boss). In some embodiments, the side of the jet orifice plate 20 facing the heat exchange substrate 10 may have a plurality of second cavity height adjustment bosses 22 designed in this way, and the dimensions of the plurality of second cavity height adjustment bosses 22 may be exactly the same. In some embodiments, the side of the jet orifice plate 20 facing the heat exchange substrate 10 may have a plurality of second cavity height adjustment bosses 22 designed in this way, and the dimensions of the plurality of second cavity height adjustment bosses 22 may be different, for example, the protrusion heights of two second cavity height adjustment bosses 22 may be different.

[0073] As described above, the cavity height of a heat exchange chamber 30 corresponding to a certain heat exchange zone 110 can be understood as the average value of the distance between the heat exchange substrate 10 and the jet orifice plate 20 in the heat exchange zone 110. In other words, the distance between each position point in the same heat exchange zone 110 of the heat exchange substrate 10 and the jet orifice plate 20 can be equal or unequal. If they are not equal, the average value is taken as the cavity height corresponding to the heat exchange zone 110.

[0074] like Figure 6G As shown, in some embodiments, to achieve different cavity heights in different regions of the heat exchange cavity 30, the side of the heat exchange substrate 10 facing the jet orifice plate 20 has at least one first cavity height adjustment slope 14. Figure 6GThe diagram illustrates two first cavity height adjustment slopes 14. When the heat exchange substrate 10 has multiple first cavity height adjustment slopes 14 on the side facing the jet orifice plate 20, the slopes of these multiple first cavity height adjustment slopes 14 may be the same or different.

[0075] like Figure 6H , Figure 6I As shown, in some embodiments, to achieve different cavity heights in different regions of the heat exchange cavity 30, the jet orifice plate 20 has at least one second cavity height adjustment slope 24 on the side facing the heat exchange substrate 10. Figure 6H , Figure 6I The diagram illustrates two second cavity height adjustment slopes 24. When the jet orifice plate 20 has multiple second cavity height adjustment slopes 24 on the side facing the heat exchange substrate 10, the slopes of these multiple second cavity height adjustment slopes 24 may be the same or different.

[0076] By designing the specific location, size, and specifications of the first cavity height adjustment slope 14 or the second cavity height adjustment slope 24, different cavity heights of the heat exchange cavity 30 in different regions can be constructed.

[0077] The jet cooling plate of some embodiments of this application can also combine some of the above-mentioned cavity height adjustment design schemes. For example Figure 6F As shown, in some embodiments, the heat exchange substrate 10 has a first cavity height adjustment boss 12 on the side facing the jet orifice plate 20, and the jet orifice plate 20 has a second cavity height adjustment boss 22 on the side facing the heat exchange substrate 10. The first cavity height adjustment boss 12 and the second cavity height adjustment boss 22 are opposite to each other, and a first recess 13 and a second recess 23 are respectively formed on the back side, so that the cavity height formed between the two is significantly smaller than the cavity height of the remaining areas. Figure 6E As shown, in some embodiments, the heat exchange substrate 10 has a first cavity height adjustment boss 12 on the side facing the jet orifice plate 20, and the jet orifice plate 20 has a second cavity height adjustment boss 22 on the side facing the heat exchange substrate 10. A second recess 23 is formed on the back side of the second cavity height adjustment boss 22, and the first cavity height adjustment boss 12 and the second cavity height adjustment boss 22 are arranged in a staggered manner. More embodiments are not listed here.

[0078] Reference Figure 5 As shown, in some embodiments of this application, the jet cooling plate 100 may further include a plurality of turbulence protrusions 125 disposed within the heat exchange cavity 30. The plurality of turbulence protrusions 125 can provide mechanical support within the heat exchange cavity 30, and can also disperse the coolant and exchange heat with the coolant, thereby further improving the heat exchange effect of the jet cooling plate 100.

[0079] There are various design options for the turbulence protrusions 125 of the jet cooling plate 100, and this application embodiment does not specifically limit them. Figures 7A to 7F As shown, it illustrates a partial cross-sectional structural diagram of the jet cooling plate 100 according to different embodiments of this application.

[0080] like Figure 7A and Figure 7B As shown, in some embodiments, the plurality of turbulence protrusions 125 include a first turbulence protrusion 15, which is disposed on the side of the heat exchange substrate 10 facing the jet orifice plate 20, for example, it can be integrally connected or welded to the heat exchange substrate 10, and the first turbulence protrusion 15 can abut against the jet orifice plate 20.

[0081] like Figure 7D As shown, in some embodiments, the plurality of turbulence protrusions 125 include a first turbulence protrusion 15, which is disposed on the side of the heat exchange substrate 10 facing the jet orifice plate 20, for example, it can be integrally connected or welded to the heat exchange substrate 10, and there can be a gap between the first turbulence protrusion 15 and the jet orifice plate 20.

[0082] In some embodiments (not illustrated in the drawings), the plurality of turbulence protrusions may include a second turbulence protrusion disposed on the side of the jet orifice plate facing the heat exchange substrate, for example, it may be integrally connected to or welded to the jet orifice plate, and the second turbulence protrusion may abut against the heat exchange substrate.

[0083] like Figure 7E As shown, in some embodiments, the plurality of turbulence protrusions 125 include a second turbulence protrusion 25, which is disposed on the side of the jet orifice plate 20 facing the heat exchange substrate 10, for example, it can be integrally connected or welded to the jet orifice plate 20, and the second turbulence protrusion 25 and the heat exchange substrate 10 can have a gap.

[0084] like Figure 7F As shown, in some embodiments, multiple turbulence protrusions 125 may simultaneously include Figure 7D and Figure 7E The first turbulence protrusion 15 and the second turbulence protrusion 25 shown above.

[0085] like Figure 7A As shown, in some embodiments, multiple turbulence protrusions 125 can be evenly arranged in the heat exchange chamber 30, thereby achieving a more uniform dispersion of the coolant.

[0086] like Figure 7CAs shown, in some embodiments, the plurality of turbulence protrusions 125 within the heat exchange chamber 30 can be arranged based on at least two density configurations (i.e., the number of protrusions per unit area). This allows for matching the design density based on the coolant's design flow rate in different heat exchange zones, or the heat exchange requirements between the coolant and the turbulence protrusions 125 in different heat exchange zones. For example, when the design flow rate of the coolant in a certain heat exchange zone is high, the density of the turbulence protrusions 125 can be designed to be relatively low; when the design flow rate of the coolant in a certain heat exchange zone is low, the density of the turbulence protrusions 125 can be designed to be relatively high. Similarly, when the heat exchange requirements between the coolant and the turbulence protrusions 125 in a certain heat exchange zone are high, the density of the turbulence protrusions 125 can be designed to be relatively high; when the heat exchange requirements between the coolant and the turbulence protrusions 125 in a certain heat exchange zone are low, the density of the turbulence protrusions 125 can be designed to be relatively high.

[0087] The specific structural form of the turbulence protrusion 125 is not limited in the embodiments of this application. (Refer to...) Figure 7B As shown, in some embodiments, the plurality of turbulence protrusions 125 may include at least one of columnar turbulence protrusions, conical turbulence protrusions, or frustum-shaped turbulence protrusions. Figure 7B The diagram illustrates two shapes: columnar turbulence protrusions and frustum-shaped turbulence protrusions (the conical turbulence protrusion is not shown in the diagram). The specific structure of the turbulence protrusion 125 can be flexibly selected or chosen according to the process requirements of the jet cooling plate 100. In some embodiments, the turbulence protrusion 125 can be a cylindrical turbulence protrusion, a conical turbulence protrusion, or a frustum-shaped turbulence protrusion with a maximum diameter of not less than 0.01 mm and not more than 1 mm.

[0088] In some embodiments, the multiple turbulence protrusions 125 may be designed to have the same shape and size. For example Figure 7D As shown, the multiple turbulence protrusions 125 can be cylindrical or prismatic protrusions of the same size and specifications, which facilitates processing and manufacturing.

[0089] In other embodiments, at least two of the plurality of turbulence protrusions 125 may be designed to have different shapes and / or sizes. For example Figure 7C As shown, the turbulence protrusion 125 can be cylindrical. For high heat flux density heat transfer zones, the diameter of the turbulence protrusion 125 can be designed to be smaller to minimize resistance to coolant flow; for low heat flux density heat transfer zones, the diameter of the turbulence protrusion 125 can be designed to be larger. For example... Figure 7CAs shown, the turbulence protrusion 125 is a cylindrical turbulence protrusion. For high heat flux density heat transfer zones, since the corresponding cavity height is small, the height of the turbulence protrusion 125 is also small; for low heat flux density heat transfer zones, since the corresponding cavity height is relatively large, the height of the turbulence protrusion 125 is also large. More embodiments are not listed here.

[0090] This application also provides a liquid cooling heat dissipation device. For example... Figure 8 As shown, it illustrates a simplified structural block diagram of a liquid cooling heat dissipation device 200 according to some embodiments of this application. The main structure of the liquid cooling heat dissipation device 200 may include: a liquid storage tank 210 connected to form a circulation loop through a pipeline 230, a pump 220, and a jet cooling plate 100 of any of the aforementioned embodiments. The dashed arrows roughly indicate the flow direction of the coolant.

[0091] When the liquid cooling heat dissipation device 200 is working, the heat exchange substrate 10 of the jet cooling plate 100 is in contact with the heat exchange surface 310 of the heat-generating electronic component 300 and heat exchange occurs (see the description in the previous embodiment). The pump 220 drives the coolant to circulate in the storage tank 210, pipelines and the jet cooling plate 100. In the jet cooling plate 100, the coolant is jetted and impacts the heat exchange substrate 10 to exchange heat with it. Then, the coolant flows out of the jet cooling plate 100 and carries away the heat.

[0092] In some embodiments, such as Figure 8 As shown, the liquid cooling heat dissipation device 200 may also be equipped with a heat dissipation component 240 for cooling the coolant after it has absorbed heat and increased in temperature, such as a heat dissipation fin assembly or a cold water tank, etc. This application does not make specific limitations on this.

[0093] Based on the design scheme of the jet cooling plate 100 in the embodiments of this application, the liquid cooling heat dissipation device 200 not only has a better heat dissipation effect, but also consumes less power than related technologies, thus being more energy-efficient and environmentally friendly.

[0094] Some embodiments of this application also provide an electronic device. For example... Figure 9 The diagram shows a simplified cross-sectional view of an electronic device 500 according to some embodiments of this application. The electronic device 500 includes a housing 400, a heat-generating electronic component 300 disposed within the housing 400, and a liquid cooling heat dissipation device 200 according to any of the foregoing embodiments. Referring to the description in the preceding embodiments, the side of the heat exchange substrate 10 of the jet cooling plate 100 of the liquid cooling heat dissipation device 200 facing away from the heat exchange cavity 30 is bonded to the heat exchange surface 310 of the heat-generating electronic component 300, for example, through direct contact or by means of thermally conductive adhesive.

[0095] The specific product type of electronic device 500 is not limited, and can include, for example, mobile phones, tablets, laptops, smart wearable devices, in-vehicle computers, medical electronic devices, servers, routers, switches, etc. It typically includes heat-generating electronic components 300, such as processor chips (e.g., CPUs or GPUs) or memory chips. Figure 9 As shown, in some embodiments, the electronic device 500 is an electronic product such as a mobile phone or a tablet computer, and may also include components such as a display screen 600 and a battery 700. The aforementioned housing 400 may specifically be the back cover of these electronic devices 500, and the aforementioned heat-generating electronic components 300 and liquid cooling heat dissipation devices 200 may be disposed between the display screen 600 and the back cover.

[0096] In these embodiments, the liquid cooling heat dissipation device 200 is assembled in the electronic device 500 as a heat dissipation module. Because the liquid cooling heat dissipation device 200 has good heat dissipation performance and lower power consumption compared to related technologies, the electronic device 500 also achieves corresponding beneficial effects, including better operational reliability and greater energy efficiency.

[0097] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A jet cold plate, characterized by, include: A heat exchange substrate includes multiple heat exchange zones with different heat flux densities, wherein one side of the heat exchange substrate is used to adhere to the heat exchange surface of a heat-generating electronic component; and A jet orifice plate, located on the other side of the heat exchange substrate and sealingly enclosing a heat exchange cavity with the heat exchange substrate, wherein the jet orifice plate has a plurality of jet holes facing the heat exchange substrate and communicating with the heat exchange cavity, at least one of the plurality of jet holes facing the heat exchange zone with the highest heat flux density among the plurality of heat exchange zones, and, For any two of the plurality of heat exchange zones, the cavity height of the heat exchange chamber corresponding to the heat exchange zone with a larger heat flux density is less than the cavity height of the heat exchange chamber corresponding to the heat exchange zone with a smaller heat flux density.

2. The jet cooling plate according to claim 1, characterized in that, The plurality of jet holes are all directed toward the heat exchange zone with the highest heat flux density among the plurality of heat exchange zones, so as to jet the coolant toward the heat exchange zone with the highest heat flux density.

3. The jet cooling plate according to claim 1, characterized in that, The plurality of jet holes are directed toward at least two of the plurality of heat exchange zones to jet coolant into the at least two heat exchange zones, wherein the at least two heat exchange zones include the heat exchange zone with the highest heat flux density among the plurality of heat exchange zones.

4. The jet cooling plate according to any one of claims 1 to 3, characterized in that, The heat exchange substrate has at least one first cavity height adjustment boss on the side facing the jet orifice plate, and the side of the heat exchange substrate facing away from the jet orifice plate is flat in the area opposite to the at least one first cavity height adjustment boss, or the side of the heat exchange substrate facing away from the jet orifice plate has a first recess formed in the area opposite to the at least one first cavity height adjustment boss.

5. The jet cooling plate according to any one of claims 1 to 4, characterized in that, The jet orifice plate has at least one second cavity height adjustment boss on the side facing the heat exchange substrate, and the side of the jet orifice plate away from the heat exchange substrate is flat in the area opposite to the at least one second cavity height adjustment boss, or the side of the jet orifice plate away from the heat exchange substrate forms a second recess in the area opposite to the at least one second cavity height adjustment boss.

6. The jet cooling plate according to any one of claims 1 to 3, characterized in that, The heat exchange substrate has at least one first cavity height adjustable slope on the side facing the jet orifice plate; and / or The jet orifice plate has at least one second cavity height adjustment slope on the side facing the heat exchange substrate.

7. The jet flow cold plate according to any one of claims 1 to 6, characterized by, It also includes multiple turbulence protrusions, the multiple turbulence protrusions including: A first turbulence protrusion is disposed on the side of the heat exchange substrate facing the jet orifice plate, wherein the first turbulence protrusion abuts against the jet orifice plate, or there is a gap between the first turbulence protrusion and the jet orifice plate; and / or A second turbulence protrusion is provided on the side of the jet orifice plate facing the heat exchange substrate, wherein the second turbulence protrusion abuts against the heat exchange substrate, or there is a gap between the second turbulence protrusion and the heat exchange substrate.

8. The jet cooling plate according to claim 7, characterized in that, The plurality of turbulence protrusions are evenly distributed within the heat exchange cavity; or The plurality of turbulence protrusions are arranged in the heat exchange cavity based on at least two arrangement densities.

9. The jet cooling plate according to claim 7 or 8, characterized in that, The plurality of turbulence protrusions include columnar turbulence protrusions, conical turbulence protrusions, or frustum-shaped turbulence protrusions.

10. The jet cooling plate according to any one of claims 7 to 9, characterized in that, The multiple turbulence protrusions are all the same in shape and size; or At least two of the plurality of turbulence protrusions have different shapes and / or sizes from each other.

11. The jet flow cold plate according to any one of claims 1 to 10, characterized by, Also includes: The first component seals and encloses the liquid inlet cavity on the side of the jet orifice plate opposite to the heat exchange cavity. The first component has a liquid inlet port communicating with the liquid inlet cavity, and the plurality of jet orifices are also communicating with the liquid inlet cavity.

12. The jet cooling plate according to claim 11, characterized in that, The jet orifice plate also has at least one return port, which is connected to the heat exchange chamber. The jet cooling plate further includes a second component, wherein the second component, the side of the jet orifice plate facing away from the heat exchange cavity, and the side of the first component facing away from the liquid inlet cavity seal and enclose a return liquid cavity, the second component has a liquid outlet communicating with the return liquid cavity, and the at least one return port is also communicating with the return liquid cavity.

13. A liquid cooling heat sink, comprising: include: A liquid storage tank, a pump, and a jet cooling plate according to any one of claims 1 to 12 are connected by pipelines to form a circulation loop.

14. An electronic device, comprising: include: shell; Heating electronic components located within the housing; as well as The liquid cooling heat dissipation device according to claim 13, disposed within the housing, wherein the side of the heat exchange substrate facing away from the heat exchange cavity is in contact with the heat exchange surface of the heat-generating electronic component.

Images