Electronic device

Abstract

The electronic device comprises a substrate, a plurality of light-emitting elements and a plurality of retaining walls. The plurality of light-emitting element arrays are arranged on the substrate. The retaining walls are arranged on the substrate and surround the light-emitting elements, the retaining walls comprise a plurality of first retaining walls extending in the first direction and a plurality of second retaining walls extending in the second direction, and the first direction is perpendicular to the second direction. In the overlook direction of the electronic device, at least one of the multiple first retaining walls and at least one of the multiple second retaining walls are arranged around one of the multiple light-emitting elements, and the tail end of at least one of the multiple first retaining walls and the tail end of at least one of the multiple second retaining walls are adjacent to each other and spaced by a distance. The electronic device provided by the invention can have relatively good display quality and / or relatively low process cost.

Description

Technical Field

[0001] This disclosure relates to an electronic device, and more particularly to an electronic device comprising a chip-scale packaged light-emitting diode. Background Technology

[0002] In existing light-emitting diodes (LEDs), baffles are typically used to guide the light emitted by the LED upwards for emission; however, current baffle designs are prone to displaying grid-like patterns, which can affect the display quality of electronic devices. This results in relatively poor light extraction efficiency and / or display quality for the electronic device. Summary of the Invention

[0003] Some embodiments of this disclosure are directed to an electronic device that may have relatively good display quality.

[0004] An electronic device according to some embodiments of the present disclosure includes a substrate, a plurality of light-emitting elements, and a plurality of baffles. The plurality of light-emitting elements are arranged in an array on the substrate. A plurality of baffles are disposed on the substrate and surrounding the plurality of light-emitting elements, wherein the plurality of baffles includes a plurality of first baffles extending along a first direction and a plurality of second baffles extending along a second direction, the first direction being perpendicular to the second direction. In a top view of the electronic device, at least one of the plurality of first baffles and at least one of the plurality of second baffles are disposed around one of the plurality of light-emitting elements, and the end of the at least one of the plurality of first baffles is adjacent to and spaced apart from the end of the at least one of the plurality of second baffles by a distance.

[0005] An electronic device according to other embodiments of the present disclosure includes a substrate, a plurality of light-emitting elements, and a plurality of baffles. The plurality of light-emitting elements are arranged in an array on the substrate. A plurality of baffles are disposed on the substrate and surrounding the plurality of light-emitting elements, wherein the plurality of baffles includes a plurality of first baffles extending along a first direction and a plurality of second baffles extending along a second direction, the first direction being perpendicular to the second direction. In a top view of the electronic device, at least one of the plurality of first baffles and at least one of the plurality of second baffles are disposed around one of the plurality of light-emitting elements, and at least one of the plurality of first baffles is connected to said at least one of the plurality of second baffles, and at least one of the plurality of first baffles has an opening.

[0006] Based on this, the electronic device provided in this disclosure improves the uniformity of light emission by incorporating multiple baffles, including discontinuous baffles, through which light emitted from adjacent light-emitting units can be mixed by the gaps between the discontinuous baffles, thereby enhancing the display quality of the electronic device. Furthermore, the electronic device provided in this disclosure does not require the use of uniform light films, high haze diffusers, or other film layers, resulting in relatively low manufacturing costs.

[0007] To make the above-described features and advantages of this disclosure more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0008] Figure 1A This is a partial top view of an electronic device according to a first embodiment of the present disclosure;

[0009] Figure 1B This is a partial top view of an electronic device according to a second embodiment of the present disclosure;

[0010] Figure 1C This is a partial top view of an electronic device according to a third embodiment of the present disclosure;

[0011] Figure 1D This is a partial top view of an electronic device according to a fourth embodiment of the present disclosure;

[0012] Figure 2A This is a partial cross-sectional schematic diagram of an electronic device according to a fifth embodiment of the present disclosure;

[0013] Figure 2B This is a partial cross-sectional schematic diagram of an electronic device according to a sixth embodiment of the present disclosure;

[0014] Figure 3A This is a schematic flowchart of a method for manufacturing an electronic device according to the seventh embodiment of this disclosure;

[0015] Figure 3B It is based on Figure 3A A partial cross-sectional schematic diagram of an embodiment of a method for manufacturing an electronic device is shown;

[0016] Figure 3C This is a schematic flowchart of a method for manufacturing an electronic device according to the eighth embodiment of this disclosure;

[0017] Figure 3D This is a schematic flowchart of a method for manufacturing an electronic device according to the ninth embodiment of this disclosure;

[0018] Figure 3E This is a schematic flowchart of a method for manufacturing an electronic device according to the tenth embodiment of this disclosure;

[0019] Figure 4A This is a partial cross-sectional schematic diagram of an electronic device according to the eleventh embodiment of the present disclosure;

[0020] Figure 4B This is a partial cross-sectional schematic diagram of an electronic device according to the twelfth embodiment of the present disclosure;

[0021] Figure 4C This is a partial cross-sectional schematic diagram of an electronic device according to the thirteenth embodiment of the present disclosure. Detailed Implementation

[0022] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0023] This disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0024] Throughout this disclosure and in the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the following description and claims, words such as “comprising,” “containing,” and “having” are open-ended terms and should therefore be interpreted as “containing but not limited to…”. Thus, when the terms “comprising,” “containing,” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component.

[0025] The directional terms used herein, such as "up," "down," "front," "back," "left," and "right," are for reference only when referring to the accompanying drawings. Therefore, the directional terms used are illustrative and not intended to limit this disclosure. In the accompanying drawings, each figure illustrates general features of the methods, structures, and / or materials used in specific embodiments. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and positions of various films, regions, and / or structures may be reduced or enlarged.

[0026] When a component (e.g., a membrane or region) is referred to as "on another component," it can be directly on that component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component," there are no components between them unless otherwise specified in the specification. Furthermore, when a component is referred to as "on another component," the two components are vertically related in the planar view, and this component can be above or below the other component, depending on the orientation of the device.

[0027] The terms “approximately,” “substantially,” or “roughly” are generally interpreted as being within 10% of a given value or range, or as being within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0028] The ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0029] It should be understood that the features described below can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0030] The electrical connection or connection described in this disclosure can refer to a direct connection or an indirect connection. In the case of a direct connection, the endpoints of the two circuit components are directly connected or connected to each other by a conductor segment. In the case of an indirect connection, there is a switch, diode, capacitor, inductor, other suitable component, or combination of the above components between the endpoints of the two circuit components, but not limited thereto.

[0031] In this disclosure, the thickness, length, width, and area can be measured using an optical microscope, and the thickness can be measured from a cross-sectional image in an electron microscope, but is not limited thereto. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of approximately 10% between the first and second values; if the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0032] The electronic devices described in this disclosure can be applied to display devices, light-emitting devices, backlight devices, antenna devices, sensing devices, or splicing devices, or as temporary storage substrates for arranging electronic units at specific intervals, but are not limited thereto. The electronic devices can be bendable or flexible. The display devices can be non-self-emissive or self-emissive. The antenna devices can be liquid crystal type or non-liquid crystal type antenna devices, and the sensing devices can be sensing capacitance, light, heat, or ultrasound, but are not limited thereto. The electronic devices can include passive and active electronic components, such as capacitors, resistors, inductors, diodes, and transistors. Diodes can include light-emitting diodes or photodiodes. Light-emitting diodes (LEDs) can include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. Splicing devices can be, for example, display splicing devices or antenna splicing devices, but are not limited thereto. It should be noted that the electronic device can be any of the aforementioned arrangements and combinations, but is not limited thereto. Furthermore, the electronic device can be rectangular, circular, polygonal, have curved edges, or other suitable shapes.

[0033] Figure 1A This is a partial top view of an electronic device according to a first embodiment of the present disclosure.

[0034] Please refer to Figure 1A In this embodiment, the electronic device 10a includes a substrate 100, a plurality of light-emitting elements 200 and a plurality of barrier walls 300.

[0035] The substrate 100 can be used to support components and films disposed thereon. The substrate 100 may comprise a rigid material or a flexible material. Rigid materials include, for example, glass, quartz, sapphire, ceramic, other suitable materials, or combinations thereof. Flexible materials include, for example, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other suitable materials, or combinations thereof. Furthermore, in some embodiments, the substrate 100 may include a circuit structure (not shown) to drive a plurality of light-emitting elements 200 disposed thereon. For example, the substrate 100 may be a circuit board, but this disclosure is not limited thereto.

[0036] Multiple light-emitting elements 200 are arranged in an array on the substrate 100, for example. In some embodiments, mass transfer can be performed using processes such as stamp transfer, laser transfer, or fluid transfer to deposit the multiple light-emitting elements 200 on the substrate 100, but this disclosure is not limited thereto. Any of the multiple light-emitting elements 200 may emit various suitable visible light (e.g., red, green, and blue light), infrared light, UV light, or combinations thereof, but this disclosure is not limited thereto. In some embodiments, the multiple light-emitting elements 200 include self-emissive materials. For example, the multiple light-emitting elements 200 are chip-scale packaged LEDs (CSP LEDs), but this disclosure is not limited thereto. In some embodiments, the multiple light-emitting elements 200 may be four-sided sub-millimeter light-emitting diodes (mini LEDs). Specifically, the multiple light-emitting elements 200 may emit light in a direction perpendicular to the top view direction z of the electronic device 10a (e.g., directions x and y and their opposite directions), but this disclosure is not limited thereto. In other embodiments, the plurality of light-emitting elements 200 may be sub-millimeter light-emitting diodes with five-sided light emission. That is, the plurality of light-emitting elements 200 may also emit light in a direction opposite to the top view direction z of the electronic device 10a.

[0037] Multiple baffles 300 are disposed on the substrate 100 and surrounding the multiple light-emitting elements 200. In some embodiments, the multiple baffles 300 may be used to define the placement positions of the multiple light-emitting elements 200, but this disclosure is not limited thereto. The multiple baffles 300 may, for example, comprise a highly reflective material. For example, the material of the multiple baffles 300 may include silicone, but this disclosure is not limited thereto. By the arrangement of the multiple baffles 300, the light emitted from the multiple light-emitting elements 200 can be reflected multiple times by the multiple baffles 300 and transformed into light emitted in a collimating direction (opposite to the top view direction z of the electronic device 10a), thereby improving the light emission brightness of the electronic device 10a. In some embodiments, the height of the multiple baffles 300 may be 0.2 mm to 5 mm.

[0038] In this embodiment, the plurality of baffles 300 include a plurality of first baffles 310 extending along direction e1 and a plurality of second baffles 320 extending along direction e2. Direction e1 is, for example, perpendicular to direction e2, and directions e1 and e2 are, for example, perpendicular to the top view direction z of the electronic device 10a. In some embodiments, in the top view direction z of the electronic device 10a, at least one of the plurality of first baffles 310 and at least one of the plurality of second baffles 320 are arranged around one of the plurality of light-emitting elements 200, and the end 310e of the plurality of first baffles 310 and the end 320e of the plurality of second baffles 320 are adjacent to each other and separated by a distance D. Specifically, in this embodiment, the plurality of first baffles 310 and the plurality of second baffles 320 are each independently and discontinuously arranged, such that the space SP enclosed by the respective two first baffles 310 and the respective two second baffles 320 has a gap. Based on this, the above-described configuration of the multiple baffles 300 in this embodiment can increase the light mixing effect of the light emitted by the multiple light-emitting elements 200, thereby improving the light emission uniformity of the electronic device 10a.

[0039] In this embodiment, the row arrangement direction (direction y) of the plurality of light-emitting elements 200 forms an angle θ1 of 40° to 50° with the direction e1 of the extension of the plurality of first baffles 310, and the column arrangement direction (direction x) of the plurality of light-emitting elements 200 forms an angle θ2 of 40° to 50° with the direction e2 of the extension of the plurality of second baffles 320. When the plurality of light-emitting elements 200 are sub-millimeter light-emitting diodes that emit light from four sides, they have relatively large light emission intensity in directions e1, e2, and their opposite directions. Therefore, by designing the angle between the arrangement direction of the plurality of light-emitting elements 200 and the extension direction of the plurality of baffles 300 as described above, the light emission brightness of the electronic device 10a in the collimation direction (the opposite direction to the top view direction z of the electronic device 10a) can be improved.

[0040] In this embodiment, the electronic device 10a further includes a back plate 400. The back plate 400 is disposed, for example, on the side of the substrate 100 away from the plurality of light-emitting elements 200. The back plate 400 has, for example, an outer frame portion 400a, which is disposed, for example, at the edge of the electronic device 10a to form a space for accommodating at least one substrate 100, but this disclosure is not limited thereto. The back plate 400 may, for example, comprise a material with high heat dissipation properties. For example, the material of the back plate 400 may include aluminum, but this disclosure is not limited thereto.

[0041] In this embodiment, the electronic device 10a further includes a reflective layer (not shown). The reflective layer is disposed on the substrate 100, for example, and surrounds the plurality of light-emitting elements 200. Specifically, the reflective layer may, for example, cover at least a portion of the sidewalls of the plurality of light-emitting elements 200, but does not cover the light-emitting layer (not shown) of the plurality of light-emitting elements 200. A detailed description of the reflective layer will be given in the following embodiments and will not be repeated here.

[0042] Based on the above, in this embodiment, the end 310e of at least one of the plurality of first barrier walls 310 in the electronic device 10a is adjacent to and separated by a distance D1 from the end 320e of at least one of the plurality of second barrier walls 320, so that the light emitted by the adjacent light-emitting units can be mixed through the gap between the first barrier wall and the second barrier wall to improve the light emission uniformity of the electronic device 10a. This can reduce the grid pattern marks that the first barrier wall 310 and / or the second barrier wall 320 show when the electronic device 10a emits light, thereby improving the display quality of the electronic device 10a.

[0043] Figure 1B This is a partial top view of an electronic device according to a second embodiment of the present disclosure. It should be noted that... Figure 1B The embodiments can be used Figure 1A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0044] Please refer to Figure 1B The main difference between the electronic device 10b and the electronic device 10a in this embodiment is that the row arrangement direction (direction y) of the plurality of light-emitting elements 200 is parallel to the direction e1 of the extension of the plurality of first barrier walls 310, and the column arrangement direction (direction x) of the plurality of light-emitting elements 200 is parallel to the direction e2 of the extension of the plurality of second barrier walls 320.

[0045] Figure 1C This is a partial top view of an electronic device according to a third embodiment of this disclosure. It should be noted that... Figure 1C The embodiments can be used Figure 1A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0046] Please refer to Figure 1C The main difference between the electronic device 20a and the electronic device 10a in this embodiment is that the substrate 100 has an irregular edge formed by at least edge 100e1, edge 100e2 and edge 100e3, and a plurality of first barriers 310 disposed on the edge 100e1 side of the substrate 100 are configured to have an opening 310OP.

[0047] In detail, in this embodiment, the extension direction of edge 100e1 of substrate 100 has an angle other than 90° with the extension directions of edges 100e2 and 100e3 connected thereto. In some embodiments, there is an angle θ3 between edge 100e1 and edge 100e3 of substrate 100, and an angle 90°+90°-θ3 between edge 100e1 and edge 100e2 of substrate 100. Based on this, the plurality of first baffles 310 disposed on one side of edge 100e1 of substrate 100 will have different lengths relative to each other in direction y along direction x, which will affect the light emission intensity of each space SP located on one side of edge 100e1 of substrate 100.

[0048] In this embodiment, the plurality of light-emitting elements 200 includes light-emitting elements 200 disposed in the outermost column. Since the light-emitting elements 200 disposed in the outermost column already have a relatively poor light mixing effect compared to the other light-emitting elements 200, the light-emitting elements 200 located in the outermost column are more prone to the generation of dark areas due to the different lengths of the plurality of first barrier walls 310 relative to each other in the y-direction. In this regard, in the electronic device 20a of this embodiment, the plurality of first barrier walls 310 disposed on the edge 100e1 side of the substrate 100 are configured to have an opening 310OP, and the opening 310OP is correspondingly disposed in the x-direction with the adjacent light-emitting elements 200. Through the design of this opening 310OP, the light mixing effect of the light emitted by the light-emitting elements 200 disposed in the outermost column can be increased, thereby reducing the generation of dark areas and improving the display quality of the electronic device 20a.

[0049] In addition, in this embodiment, at least one of the plurality of first barrier walls 310 is connected to at least one of the plurality of second barrier walls 320, and the remaining plurality of first barrier walls 310 not disposed on the edge 100e1 side of the substrate 100 may not have an opening 310OP, but this disclosure is not limited thereto.

[0050] Figure 1D This is a partial top view of the electronic device according to the fourth embodiment of this disclosure. It should be noted that... Figure 1D The embodiments can be used Figure 1C The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0051] Please refer to Figure 1D The main difference between electronic device 20b and electronic device 20a in this embodiment is that the height of the second barrier 320 surrounding the outermost row of light-emitting elements 200 is greater than the height of the first barrier 310.

[0052] In detail, in this embodiment, the height of the plurality of first barrier walls 310A disposed on one side of the edge 100e1 of the substrate 100 may be lower than the height of the remaining first barrier walls 310B, and the height of the plurality of second barrier walls 320A disposed on one side of the edge 100e1 of the substrate 100 may be higher than the height of the remaining second barrier walls 320B. Therefore, the height of the second barrier walls 320A surrounding the outermost row of light-emitting elements 200 will be higher than the height of the first barrier walls 310A. In some embodiments, the heights of the first barrier walls 310A, the first barrier walls 310B, the second barrier walls 320A, and the second barrier walls 320B may be 0.2 mm to 5 mm.

[0053] By designing the multiple first baffles 310 as described above, the multiple first baffles 310 disposed on the edge 100e1 side of the substrate 100, due to their relatively low height, can further increase the light mixing effect of the light emitted by the light-emitting elements 200 located in the outermost row. In addition, by designing the multiple second baffles 320 as described above, the number of times the light emitted by the light-emitting elements 200 located in the outermost row is reflected by the multiple second baffles 320 disposed on the edge 100e1 side of the substrate 100 can be increased, thereby restricting the light emitted by the light-emitting elements 200 located in the outermost row to be emitted within a smaller angle range, thereby increasing the light extraction efficiency of the electronic device 20b.

[0054] Figure 2A This is a partial cross-sectional schematic diagram of an electronic device according to the fifth embodiment of this disclosure. It should be noted that... Figure 2A The embodiments can be used Figure 1A The component reference numerals and partial contents of the embodiments are as follows, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. It is worth noting that the electronic device 30a of this embodiment omits the illustration of the substrate 100.

[0055] Please refer to Figure 2A The main difference between the electronic device 30a and the electronic device 10a in this embodiment is that the height 300H1 of the retaining wall 300 closest to the outer frame portion 400a of the back plate 400 is higher than the height 300H2 of the other retaining walls 300.

[0056] In this embodiment, the reflective layer 500 is disposed on the substrate 100, for example, and surrounds the plurality of light-emitting elements 200. Specifically, the reflective layer 500 may, for example, cover at least a portion of the sidewalls of the plurality of light-emitting elements 200, but not the light-emitting layer 220 of the plurality of light-emitting elements 200. The reflective layer 500 may, for example, comprise a highly reflective material. For example, the material of the reflective layer 500 may include silicone (e.g., white glue), but this disclosure is not limited thereto.

[0057] In addition, in this embodiment, Figure 2A The structure of the light-emitting element 200 is shown. Specifically, the light-emitting element 200 may include, for example, a base 210, a light-emitting layer 220, and a light-shielding layer 230, wherein the base 210, the light-emitting layer 220, and the light-shielding layer 230 are sequentially disposed on the backplate 400. In some embodiments, the reflective layer 500 may cover the base 210 in a direction perpendicular to the top view direction z of the electronic device 30a, and at least expose the light-emitting layer 220. Furthermore, the light-shielding layer 230 may, for example, cover the top surface of the light-emitting layer 220 to shield the light emitted by the light-emitting element 200 in a direction perpendicular to the top view direction z of the electronic device 30a. Based on this, the light-emitting element 200 may be a four-sided light-emitting element. For example, the light-emitting element 200 may be a four-sided sub-millimeter light-emitting diode, but this disclosure is not limited thereto. In some embodiments, the light-emitting element 200 may omit the light-shielding layer 230 as needed, and may be a five-sided light-emitting element, but this is not limited thereto.

[0058] In this embodiment, since the height 300H1 of the barrier wall 300A closest to the outer frame portion 400a of the back plate 400 is higher than the height 300H2 of the other barrier walls 300B, the number of times the light emitted by the light-emitting element 200 is reflected by the barrier wall 300A closest to the outer frame portion 400a can be increased, so as to limit the light emitted by the light-emitting element 200 to be emitted within a smaller angle range, thereby increasing the light emission efficiency of the electronic device 30a.

[0059] In some embodiments, the distance S1 between the barrier wall 300A and the light-emitting element 200 may be the same as the distance S2 between the barrier wall 300B and the light-emitting element 200. In other embodiments, the distance S1 between the barrier wall 300A and the light-emitting element 200 may be different from the distance S2 between the barrier wall 300B and the light-emitting element 200. For example, the distance S1 between the barrier wall 300A and the light-emitting element 200 may be greater than the distance S2 between the barrier wall 300B and the light-emitting element 200, but this is not a limitation.

[0060] Figure 2B This is a partial cross-sectional schematic diagram of an electronic device according to the sixth embodiment of this disclosure. It should be noted that... Figure 2B The embodiments can be used Figure 1A and Figure 2A The component reference numerals and partial contents of the embodiments are as follows, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. It is worth noting that the electronic device 30b of this embodiment omits the illustration of the substrate 100.

[0061] Please refer to Figure 2B The main difference between the electronic device 30b and the electronic device 10a in this embodiment is that the electronic device 30b also includes a light-collecting element 600 disposed on the barrier wall 300 closest to the outer frame portion 400a of the back plate 400.

[0062] The light-collecting element 600 may be, for example, a plurality of lenses, but this disclosure is not limited thereto. In this embodiment, by providing the light-collecting element 600 on the baffle 300 closest to the outer frame portion 400a of the back plate 400, the light emitted by the light-emitting element 200 closest to the outer frame portion 400a of the back plate 400 can be refracted by the light-collecting element 600, thereby limiting the light emitted by the light-emitting element 200 to a smaller angle range and increasing the light extraction efficiency of the electronic device 30b. In some embodiments, the light-collecting element 600 may be uniformly distributed on the baffle 300 closest to the outer frame portion 400a of the back plate 400. In other embodiments, the light-collecting element 600 may be distributed in a region corresponding to the light emission angle of the light-emitting element of 30 to 70 degrees, or the light-collecting element 600 may have a higher density in the region corresponding to the light emission angle of the light-emitting element of 30 to 70 degrees, but this is not limited thereto. In other embodiments, the light-collecting element 600 may be distributed in the top 1 / 2 to 1 / 4 area of ​​the barrier wall 300 closest to the outer frame portion 400a of the back plate 400, or the light-collecting element 600 may have a high density in the top 1 / 2 to 1 / 4 area of ​​the barrier wall 300 closest to the outer frame portion 400a of the back plate 400, but this is not a limitation.

[0063] Figure 3A This is a schematic flowchart illustrating a method for manufacturing an electronic device according to the seventh embodiment of this disclosure. It should be noted that... Figure 3A The embodiments can be used Figure 1A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0064] Please refer to Figure 3A In this embodiment, electronic device 1a is a modular electronic device. By modularizing multiple small electronic devices, a relatively large modular electronic device can be obtained. Specifically, electronic device 1a can be obtained, for example, by modularizing electronic devices 40a and 40b, or by modularizing electronic devices 40c and 40d, or by modularizing electronic devices 40e and 40f.

[0065] In this embodiment, the splicing edges of each electronic device are designed. Specifically, at the splicing point between electronic devices 40a and 40b, the baffle 300 is located on one of the splicing edges of electronic devices 40a and 40b to reduce technical problems such as warping, bright lines, and dark lines at the splicing points of adjacent electronic devices 40a and 40b. Similarly, at the splicing point between electronic devices 40c and 40d, the baffle 300 is located on the splicing edge of electronic device 40d to reduce technical problems such as warping, bright lines, and dark lines at the splicing points of adjacent electronic devices 40c and 40d.

[0066] For adjacent electronic devices 40e and 40f, the barrier 300 is not located at either of the splicing edges of electronic devices 40e and 40f. Instead, after electronic devices 40e and 40f are spliced, the barrier 300 is formed at the splicing point of electronic devices 40e and 40f using a spraying process or other suitable process. This reduces technical problems such as warping, bright lines, and dark lines at the splicing point of adjacent electronic devices 40e and 40f.

[0067] For details, please refer to Figure 3B , Figure 3B It is based on Figure 3A The diagram shows a partial cross-sectional view of an embodiment of a method for manufacturing an electronic device. In some embodiments, a highly reflective and adhesive reflective layer 500 may be first formed at the splicing edge of electronic devices 40e and 40f. After electronic devices 40e and 40f are spliced, a barrier 300 is formed at the splicing point of electronic devices 40e and 40f using a spraying process or other suitable processes, but this disclosure is not limited thereto.

[0068] Figure 3C This is a schematic flowchart illustrating a method for manufacturing an electronic device according to the eighth embodiment of this disclosure. It should be noted that... Figure 3C The embodiments can be used Figure 3A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0069] Please refer to Figure 3CIn other embodiments, electronic devices 40g and 40h are provided, wherein the barrier 300 has not yet been formed in electronic devices 40g and 40h, and the reflective layer 500 with adhesive properties has not been formed at the splicing edges of electronic devices 40g and 40h. After electronic devices 40g and 40h are spliced, the barrier 300 is formed in electronic devices 40g and 40h using a spraying process or other suitable process to form electronic device 1b. In this embodiment, before forming the barrier 300, a highly reflective and adhesive material can be formed at the seam of electronic devices 40g and 40h using a coating apparatus CD, wherein the material can penetrate into the seam to adhere electronic devices 40g and 40h to each other, but this disclosure is not limited thereto.

[0070] Figure 3D This is a schematic flowchart illustrating a method for manufacturing an electronic device according to the ninth embodiment of this disclosure. It should be noted that... Figure 3D The embodiments can be used Figure 3A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0071] Please refer to Figure 3D In some embodiments, electronic devices 40i and 40j are provided, wherein electronic devices 40i and 40j may have asymmetrical edge designs due to factors such as cutting. For example, the light-emitting element 200 disposed at the edge of the substrate 100 is closer to the edge of the electronic device 40i than the edge of the electronic device 40j. Based on this, the baffles 300 can be disposed at the edges of the electronic devices 40j first, and then a highly reflective and adhesive material can be formed at the seam between the electronic devices 40i and 40j using the coating apparatus of the above embodiment. This material can penetrate into the seam to adhere the electronic devices 40i and 40j to each other, thereby forming electronic device 1c.

[0072] Figure 3E This is a schematic flowchart illustrating a method for manufacturing an electronic device according to the tenth embodiment of this disclosure. It should be noted that... Figure 3E The embodiments can be used Figure 3A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0073] Please refer to Figure 3EIn some embodiments, the electronic device 40i can be first spliced ​​with the dummy light panel 1000, wherein the dummy light panel 1000 has multiple detachable baffles 300 and a reflective layer 500 already provided on it. Based on this, after separating the dummy light panel 1000 from the electronic device 40i, the multiple baffles 300 and the reflective layer 500 are not removed. Then, the electronic device 40j can be spliced ​​with the electronic device 40i to form the electronic device 1c.

[0074] Figure 4A This is a partial cross-sectional schematic diagram of an electronic device according to the eleventh embodiment of this disclosure. It should be noted that... Figure 4A The embodiments can be used Figure 1A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0075] Please refer to Figure 4A The main difference between the electronic device 50a and the electronic device 10a in this embodiment is that the electronic device 50a further includes a diffuser 700 and a light-collecting element 600a. The diffuser 700, for example, is opposite to the substrate 100 in the top view z direction of the electronic device 50a, and faces the side of the substrate 100 on which the light-emitting element 200 is disposed. The light-collecting element 600a is disposed, for example, on the diffuser 700. In some embodiments, the light-collecting element 600a may include a lens, but this disclosure is not limited thereto. The light-collecting element 600a may, for example, be disposed on the side of the diffuser 700 facing the substrate 100 and / or on the side of the diffuser 700 away from the substrate 100. In this embodiment, the light-collecting element 600a is correspondingly disposed with the barrier 300. With this design, when light emitted from the light-emitting element 200 at a relatively large angle reaches the light-collecting element 600a, it can be refracted by the light-collecting element 600a and emitted from the diffuser 700, thereby reducing the possibility of this light being reflected by the diffuser 700 and creating a dark area at the location of the barrier 300. In some embodiments, the light-collecting element 600a may further include diffuser particles to further improve the light-collecting effect of the light-collecting element 600a.

[0076] Figure 4B This is a partial cross-sectional schematic diagram of an electronic device according to the twelfth embodiment of this disclosure. It should be noted that... Figure 4B The embodiments can be used Figure 4A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0077] Please refer to Figure 4B The main difference between electronic device 50b and electronic device 50a in this embodiment is that the light collecting element 600a is also arranged to correspond with the light emitting element 200'.

[0078] In detail, in this embodiment, the plurality of light-emitting elements 200' are five-sided sub-millimeter light-emitting diodes. That is, the plurality of light-emitting elements 200' can emit light in a direction opposite to the top view direction z of the electronic device 50b. With this design, the possibility of light emitted from the top surface of the light-emitting elements 200' being reflected by the diffuser 700 and creating dark areas can be reduced.

[0079] Figure 4C This is a partial cross-sectional schematic diagram of an electronic device according to the thirteenth embodiment of this disclosure. It should be noted that... Figure 4C The embodiments can be used Figure 4A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0080] Please refer to Figure 4C The main difference between the electronic device 50c and the electronic device 50a in this embodiment is that the light-collecting element 600b includes multiple microstructures 600M.

[0081] With this design, when light emitted from the light-emitting element 200 at a relatively large angle reaches the light-collecting element 600b, the possibility of this light being reflected by the diffuser 700 and creating a dark area at the location of the barrier 300 can be further reduced.

[0082] In summary, in the electronic devices provided in some embodiments of this disclosure, the end of at least one of the plurality of first baffles is adjacent to and separated by a distance from the end of at least one of the plurality of second baffles, so that the light emitted by adjacent light-emitting units can be mixed through the gap between the first baffles and the second baffles to improve the uniformity of light emission. This reduces the appearance of grid patterns on the first baffles and / or the second baffles when the electronic device emits light, thereby improving the display quality of the electronic devices provided in some embodiments of this disclosure.

[0083] Furthermore, in the electronic devices provided in other embodiments of this disclosure, the height of the second barrier wall surrounding the outermost row of light-emitting elements is greater than the height of the first barrier wall. Based on this, the plurality of first barrier walls disposed on one side of the edge of the substrate, due to their relatively low height, can increase the light mixing effect of the light emitted by the light-emitting elements in the outermost row, thereby improving the display quality of the electronic devices provided in other embodiments of this disclosure. Additionally, the number of times the light emitted by the light-emitting elements in the outermost row is reflected by the plurality of second barrier walls disposed on one side of the edge of the substrate can be increased, which can increase the light extraction efficiency of the electronic devices provided in other embodiments of this disclosure.

[0084] In addition, in some embodiments of the electronic device provided in this disclosure, a non-continuous barrier is formed by spraying. Therefore, the electronic device provided in some embodiments of this disclosure may not have a uniform light film, a high haze diffuser plate or other film layer, and thus has a relatively low process cost.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic device, characterized in that, include: substrate; Multiple light-emitting elements are arranged in an array on the substrate; as well as Multiple baffles are disposed on the substrate and surrounding the multiple light-emitting elements, wherein the multiple baffles include multiple first baffles extending along a first direction and multiple second baffles extending along a second direction, and the first direction is perpendicular to the second direction. In the top view of the electronic device, at least one of the plurality of first barriers and at least one of the plurality of second barriers are arranged around one of the plurality of light-emitting elements, and the end of the at least one of the plurality of first barriers is adjacent to and separated by a distance from the end of the at least one of the plurality of second barriers.

2. The electronic device according to claim 1, wherein the height of the plurality of barriers is 0.2 mm to 5 mm.

3. The electronic device according to claim 1, wherein the row arrangement direction of the plurality of light-emitting elements forms an angle of 40° to 50° with the first direction.

4. The electronic device according to claim 1, wherein the column arrangement direction of the plurality of light-emitting elements forms an angle of 40° to 50° with the second direction.

5. The electronic device according to claim 1, wherein the row arrangement direction of the plurality of light-emitting elements is parallel to the first direction.

6. The electronic device according to claim 1, wherein the column arrangement direction of the plurality of light-emitting elements is parallel to the second direction.

7. The electronic device according to claim 1, further comprising a back plate disposed on the side of the substrate away from the plurality of light-emitting elements, wherein the height of the retaining wall closest to the outer frame portion of the back plate is higher than the height of the other retaining walls.

8. The electronic device according to claim 1, further comprising a back plate and a light-collecting element, the back plate being disposed on the side of the substrate away from the plurality of light-emitting elements, and the light-collecting element being disposed on a baffle wall closest to the outer frame portion of the back plate.

9. An electronic device, characterized in that, include: substrate; Multiple light-emitting elements are arranged in an array on the substrate; as well as Multiple baffles are disposed on the substrate and surrounding the multiple light-emitting elements, wherein the multiple baffles include multiple first baffles extending along a first direction and multiple second baffles extending along a second direction, and the first direction is perpendicular to the second direction. In the top view of the electronic device, at least one of the plurality of first barriers and at least one of the plurality of second barriers are arranged around one of the plurality of light-emitting elements, and the at least one of the plurality of first barriers is connected to the at least one of the plurality of second barriers, and the at least one of the plurality of first barriers has an opening.

10. The electronic device according to claim 9, wherein the height of the plurality of barriers is 0.2 mm to 5 mm.

11. The electronic device of claim 9, wherein one of the plurality of light-emitting elements is located in the outermost column of the plurality of light-emitting elements.

12. The electronic device of claim 11, wherein the height of the second barrier surrounding one of the plurality of light-emitting elements located in the outermost row of the plurality of light-emitting elements is greater than the height of the first barrier.

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