Positioning mechanism of micro-fluidic chip alignment bonding device

Abstract

The invention discloses a positioning mechanism of a micro-fluidic chip alignment bonding device, which comprises a chuck and a plurality of mounting blocks, the plurality of mounting blocks are arranged around the outside of the chuck, the bottom of each mounting block is fixedly connected with a supporting block, and the supporting blocks are connected with the chuck through turnbuckles; a cavity is formed in the mounting block, a screw rod is rotationally connected in the cavity, a first gear fixedly sleeves the screw rod, a second gear meshed with the first gear is arranged in the cavity, the second gear is rotationally connected with the inner wall of the cavity through a rotating rod, and one end of the rotating rod penetrates through the inner wall of the cavity and is fixedly connected with a knob; a clamping mechanism corresponding to the rotary knob is fixedly connected to the outer wall of the mounting block, and a plurality of clamping grooves corresponding to the clamping mechanism are formed in the rotary knob in a surrounding mode. Through the arrangement of the adjustable positioning structure, the chip can be quickly positioned and aligned, the chip can be conveniently aligned and bonded, and thus the preparation efficiency of the micro-fluidic chip is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of microfluidic chip fabrication technology, and in particular to a positioning mechanism for a microfluidic chip alignment and bonding device. Background Technology

[0002] Microfluidic chips are a high-tech field that emerged in the late 1990s. Judging from their analytical performance, their future applications will be very extensive, but the current focus is clearly on biomedicine.

[0003] The emergence of microfluidic chips not only greatly reduces the consumption of precious biological samples and reagents to microliters or even nanoliters, but also increases the analysis speed by ten or even a hundred times and reduces the cost by ten or even a hundred times, thus creating conditions for the popularization of analytical testing technology to every household.

[0004] Currently, the conventional method for fabricating microfluidic chips is the thermocompression bonding method, which is a widely used approach. In the thermocompression bonding method, the chuck plays a decisive role in the alignment accuracy and bonding quality of the chip. Currently, several chucks with different structures and operating principles exist both domestically and internationally.

[0005] However, existing alignment and bonding devices for microfluidic chip fabrication are relatively simple and lack a certain positioning mechanism, making it impossible to quickly position and align the chip, thus affecting the fabrication efficiency of microfluidic chips. Summary of the Invention

[0006] 1. Technical problems to be solved The purpose of this invention is to solve the problem that the bonding device in the prior art lacks a certain positioning mechanism, which makes it impossible to quickly position and align the chip, and proposes a positioning mechanism for a microfluidic chip alignment and bonding device.

[0007] 2. Technical Solution To achieve the above objectives, the present invention adopts the following technical solution: A positioning mechanism for a microfluidic chip alignment and bonding device includes a chuck and multiple mounting blocks. The mounting blocks are arranged around the outside of the chuck, and a support block is fixedly connected to the bottom of each mounting block. The support block is connected to the chuck by turnbuckles. The mounting block has a cavity, and a screw is rotatably connected inside the cavity. A first gear is fixedly sleeved on the screw. A second gear meshes with the first gear inside the cavity. The second gear and the inner wall of the cavity are rotatably connected through a rotating rod. One end of the rotating rod passes through the inner wall of the cavity and is fixedly connected to a knob. A locking mechanism corresponding to the knob is fixedly connected to the outer wall of the mounting block. The knob is surrounded by multiple slots corresponding to the locking mechanism. The top of the screw penetrates the inner wall of the cavity and extends upward. A support plate is fixedly connected to the top of the mounting block. A support groove corresponding to the screw is provided on one side of the support plate. A transmission block is threaded onto the screw. A fixing plate is fixedly connected to one end of the transmission block. A through-hole is provided on the top of the fixing plate. A positioning plate is slidably inserted into the through-hole. A locking groove is provided on one side of the fixing plate. A locking mechanism corresponding to the positioning plate is fixedly connected in the locking groove.

[0008] Preferably, a guide rod is fixedly connected to one side of the mounting block, and a guide cavity corresponding to the guide rod is provided on the chuck. A limit block is fixedly connected to one end of the guide rod located in the guide cavity.

[0009] Preferably, the clamping mechanism includes a clamping block, on which a clamping rod is slidably inserted. A clamping sleeve is fixedly sleeved at one end of the clamping rod near the knob, and a pull rod is fixedly connected at the other end of the clamping rod away from the clamping sleeve.

[0010] Preferably, a first spring is sleeved on the lever, and the two ends of the first spring are fixedly connected to the sleeve and the block, respectively.

[0011] Preferably, a fixing rod is fixedly connected to the top of the mounting block, and a sliding cavity corresponding to the fixing rod is provided at the bottom of the fixing plate.

[0012] Preferably, a slider is fixedly connected inside the through-hole, the bottom of the positioning plate is provided with a groove corresponding to the slider, a slide rod is fixedly connected inside the groove, and the slider is provided with a slide opening corresponding to the slide rod.

[0013] Preferably, a second spring is sleeved on the slide rod, and the two ends of the second spring are fixedly connected to the slider and the inner wall of the slide groove, respectively.

[0014] Preferably, the locking mechanism includes a support rod, an L-shaped locking rod is slidably sleeved on the support rod, and a third spring is sleeved on the support rod, with both ends of the third spring fixedly connected to the L-shaped locking rod and the inner wall of the locking groove, respectively.

[0015] Preferably, rubber pads are fixedly connected to the side of the positioning plate and the fixing plate near the chuck.

[0016] 3. Beneficial effects Compared with the prior art, the advantages of this invention are: (1) In this invention, the chip can be quickly positioned and aligned by setting an adjustable positioning structure, which facilitates chip alignment and bonding, thereby effectively improving the fabrication efficiency of microfluidic chips.

[0017] (2) In this invention, the mounting block can be moved by rotating the turnbuckle, the distance between the mounting block and the chuck can be adjusted, the knob can be rotated to drive the rotating rod to rotate, the screw can be rotated by the meshing action between the first gear and the second gear, and the fixed plate can be moved up and down by the transmission block to adjust the height of the positioning plate. At the same time, the clamping mechanism can fix the knob, the sliding positioning plate can adjust the horizontal position of the positioning plate, and then the locking mechanism can fix the positioning plate.

[0018] (3) In this invention, the guide rod can guide the mounting block to a certain extent, the fixing rod can prevent the fixing plate from shaking, and the slider and sliding rod can guide the positioning plate to a certain extent. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the positioning mechanism of a microfluidic chip alignment and bonding device proposed in this invention; Figure 2 This is a top view of the positioning mechanism of a microfluidic chip alignment and bonding device proposed in this invention. Figure 3 This is a schematic diagram of the locking mechanism in the positioning mechanism of a microfluidic chip alignment and bonding device proposed in this invention; Figure 4 for Figure 1 A schematic diagram of the structure at point A.

[0020] In the diagram: 1. Chuck, 2. Mounting block, 3. Support block, 4. Turnbuckle, 5. Screw, 6. First gear, 7. Second gear, 8. Rotating rod, 9. Knob, 10. Support plate, 11. Transmission block, 12. Fixing plate, 13. Positioning plate, 14. Guide rod, 15. Limiting block, 16. Locking block, 17. Locking rod, 18. Sleeve, 19. Pull rod, 20. First spring, 21. Fixing rod, 22. Slider, 23. Sliding rod, 24. Second spring, 25. Support rod, 26. L-shaped locking rod, 27. Third spring, 28. Rubber pad. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Example 1

[0022] Reference Figure 1-4A positioning mechanism for a microfluidic chip alignment and bonding device includes a chuck 1 and multiple mounting blocks 2. The mounting blocks 2 are arranged around the outside of the chuck 1. A support block 3 is fixedly connected to the bottom of the mounting block 2. The support block 3 is connected to the chuck 1 by a turnbuckle 4 to adjust the distance between the mounting block 2 and the chuck 1. A guide rod 14 is fixedly connected to one side of the mounting block 2. The chuck 1 is provided with a guide cavity corresponding to the guide rod 14, which plays a certain guiding role for the mounting block 2. A limit block 15 is fixedly connected to one end of the guide rod 14 located in the guide cavity. In this invention, the mounting block 2 has a cavity, and a screw 5 is rotatably connected in the cavity to drive the transmission block 11 to move up and down. A first gear 6 is fixedly sleeved on the screw 5. A second gear 7 that meshes with the first gear 6 is provided in the cavity to drive the first gear 6 to rotate. The second gear 7 and the inner wall of the cavity are rotatably connected through a rotating rod 8. One end of the rotating rod 8 passes through the inner wall of the cavity and is fixedly connected to a knob 9 to drive the rotating rod 8 to rotate. In this invention, a clamping mechanism corresponding to the knob 9 is fixedly connected to the outer wall of the mounting block 2 for fixing the knob 9. The knob 9 is surrounded by multiple slots corresponding to the clamping mechanism. The clamping mechanism includes a clamping block 16, a clamping rod 17 is slidably inserted on the clamping block 16, a clamping sleeve 18 is fixedly sleeved on the end of the clamping rod 17 near the knob 9 to prevent the clamping rod 17 from falling off the clamping block 16, a pull rod 19 is fixedly connected to the end of the clamping rod 17 away from the clamping sleeve 18, and a first spring 20 is sleeved on the clamping rod 17. The two ends of the first spring 20 are fixedly connected to the clamping sleeve 18 and the clamping block 16 respectively, providing a certain elastic support for the clamping rod 17. In this invention, the top of the screw 5 penetrates the inner wall of the cavity and extends upward. The top of the mounting block 2 is fixedly connected to a support plate 10. One side of the support plate 10 is provided with a support groove corresponding to the screw 5. A transmission block 11 is threaded onto the screw 5 to drive the fixed plate 12 to move up and down. One end of the transmission block 11 is fixedly connected to the fixed plate 12. The top of the mounting block 2 is fixedly connected to a fixing rod 21 to support the fixed plate 12. The top of the fixed plate 12 is provided with a through-hole. A slider 22 is fixedly connected inside the through-hole. The bottom of the fixed plate 12 is provided with a sliding cavity corresponding to the fixing rod 21. In this invention, the bottom of the positioning plate 13 is provided with a groove corresponding to the slider 22, and a sliding rod 23 is fixedly connected in the groove to support the positioning plate 13. The slider 22 is provided with a sliding opening corresponding to the sliding rod 23, and the positioning plate 13 is slidably inserted in the opening to position the chip. A second spring 24 is sleeved on the sliding rod 23, and the two ends of the second spring 24 are fixedly connected to the slider 22 and the inner wall of the groove, respectively, to provide a certain elastic support for the slider 22. A locking groove is provided on one side of the fixing plate 12, and a locking mechanism corresponding to the positioning plate 13 is fixedly connected in the locking groove to fix the position of the positioning plate 13. In this invention, the locking mechanism includes a support rod 25, an L-shaped locking rod 26 is slidably sleeved on the support rod 25, and a third spring 27 is sleeved on the support rod 25. The two ends of the third spring 27 are fixedly connected to the L-shaped locking rod 26 and the inner wall of the locking groove, respectively, providing a certain elastic support for the L-shaped locking rod 26. Rubber pads 28 are fixedly connected to the side of the positioning plate 13 and the fixing plate 12 near the chuck 1.

[0023] In this invention, rotating the turnbuckle 4 can move the mounting block 2, adjusting the distance between the mounting block 2 and the chuck 1. Rotating the knob 9 can rotate the rotating rod 8, which can rotate the screw 5 through the meshing action between the first gear 6 and the second gear 7. The screw 5 can be rotated, and the fixed plate 12 can be moved up and down through the transmission block 11 to adjust the height of the positioning plate 13. At the same time, the clamping mechanism can fix the knob 9. Sliding the positioning plate 13 can adjust the horizontal position of the positioning plate 13. Then, the locking mechanism can fix the positioning plate 13.

[0024] In this invention, the adjustable positioning structure enables rapid positioning and alignment of the chip, facilitating chip alignment and bonding, thereby effectively improving the fabrication efficiency of microfluidic chips.

[0025] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A positioning mechanism of a microfluidic chip aligning and bonding apparatus comprising a chuck (1) and a plurality of mounting blocks (2), characterized in that, Multiple mounting blocks (2) are arranged around the outside of the chuck (1), and a support block (3) is fixedly connected to the bottom of the mounting block (2). The support block (3) is connected to the chuck (1) by turnbuckles (4). The mounting block (2) has a cavity, and a screw (5) is rotatably connected inside the cavity. A first gear (6) is fixedly sleeved on the screw (5). A second gear (7) meshes with the first gear (6) inside the cavity. The second gear (7) and the inner wall of the cavity are rotatably connected through a rotating rod (8). One end of the rotating rod (8) passes through the inner wall of the cavity and is fixedly connected to a knob (9). A clamping mechanism corresponding to the knob (9) is fixedly connected to the outer wall of the mounting block (2). Multiple slots corresponding to the clamping mechanism are arranged around the knob (9). The top of the screw (5) penetrates the inner wall of the cavity and extends upward. The top of the mounting block (2) is fixedly connected to a support plate (10). One side of the support plate (10) is provided with a support groove corresponding to the screw (5). A transmission block (11) is threaded onto the screw (5). One end of the transmission block (11) is fixedly connected to a fixing plate (12). The top of the fixing plate (12) is provided with a through-hole. A positioning plate (13) is slidably inserted into the through-hole. One side of the fixing plate (12) is provided with a locking groove. A locking mechanism corresponding to the positioning plate (13) is fixedly connected in the locking groove.

2. The positioning mechanism of a microfluidic chip alignment and bonding apparatus according to claim 1, wherein, A guide rod (14) is fixedly connected to one side of the mounting block (2). The chuck (1) is provided with a guide cavity corresponding to the guide rod (14). A limit block (15) is fixedly connected to one end of the guide rod (14) located in the guide cavity.

3. The positioning mechanism of a microfluidic chip alignment and bonding device according to claim 1, characterized in that, The clamping mechanism includes a clamping block (16), on which a clamping rod (17) is slidably inserted. A sleeve (18) is fixedly sleeved at one end of the clamping rod (17) near the knob (9), and a pull rod (19) is fixedly connected at the other end of the clamping rod (17) away from the sleeve (18).

4. The positioning mechanism of a microfluidic chip alignment and bonding device according to claim 3, characterized in that, A first spring (20) is fitted on the lever (17), and the two ends of the first spring (20) are fixedly connected to the sleeve (18) and the block (16) respectively.

5. The positioning mechanism of a microfluidic chip alignment and bonding device according to claim 1, characterized in that, The top of the mounting block (2) is fixedly connected to a fixing rod (21), and the bottom of the fixing plate (12) is provided with a sliding cavity corresponding to the fixing rod (21).

6. The positioning mechanism of a microfluidic chip alignment and bonding device according to claim 1, characterized in that, A slider (22) is fixedly connected inside the opening. The bottom of the positioning plate (13) is provided with a groove corresponding to the slider (22). A slide rod (23) is fixedly connected inside the groove. The slider (22) is provided with a sliding opening corresponding to the slide rod (23).

7. The positioning mechanism of a microfluidic chip alignment and bonding device according to claim 6, characterized in that, A second spring (24) is sleeved on the slide bar (23), and the two ends of the second spring (24) are fixedly connected to the slider (22) and the inner wall of the groove, respectively.

8. The positioning mechanism of a microfluidic chip alignment and bonding device according to claim 1, characterized in that, The locking mechanism includes a support rod (25), an L-shaped locking rod (26) is slidably sleeved on the support rod (25), and a third spring (27) is sleeved on the support rod (25). The two ends of the third spring (27) are fixedly connected to the L-shaped locking rod (26) and the inner wall of the locking groove, respectively.

9. The positioning mechanism of a microfluidic chip alignment and bonding device according to claim 1, characterized in that, Both the positioning plate (13) and the fixing plate (12) are fixedly connected to rubber pads (28) on the side near the chuck (1).

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