Chip high and low temperature testing device in vacuum environment

Abstract

The invention discloses a chip high and low temperature testing device in a vacuum environment, which comprises a device main body with a cavity, a vacuum pump and a gas circuit, and is characterized in that the vacuum pump is communicated with the cavity through the gas circuit, and the cavity can be evacuated to become a vacuum cavity by starting the vacuum pump; a first station, a second station, a third station and a mechanical arm are arranged in the vacuum cavity, a heater used for high-temperature heating of a chip placed on the second station is installed on the side of the second station, and a refrigerating machine used for low-temperature cooling of a chip placed on the third station is installed on the side of the third station. The mechanical arm transfers the chip from the first station to the second station to be heated by the heater; and then the heated chip is transferred from the second station to a third station to be cooled by a refrigerator. The vacuum chamber is arranged for high and low temperature testing, so that the airflow influence is reduced, the phenomena of frosting and condensed water formation are avoided, the heat conduction is reduced, the temperature stability in the testing process is ensured, and the overshoot or undershoot condition is prevented.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a chip high and low temperature testing device in a vacuum environment. Background Technology

[0002] High and low temperature shock testing is a crucial step in evaluating the reliability of chips under extreme temperature changes. It simulates sudden temperature changes that chips might encounter in real-world applications (such as the rapid transition from low winter temperatures to high engine compartment temperatures in automotive electronics), accelerating the exposure of potential failure risks caused by mismatches in material thermal expansion coefficients, packaging defects, or latent manufacturing defects. These risks include bond wire breakage, solder ball cracking, chip delamination, and metal interconnect fatigue. Therefore, this test has become a mandatory verification method before mass production of chips in high-reliability fields such as aerospace, automotive electronics, and industrial control.

[0003] Currently, mainstream high and low temperature shock equipment on the market is mainly based on temperature control and sample transfer technology in a gaseous environment. Structurally, it can be divided into two categories: two-chamber and three-chamber types. Two-chamber equipment typically includes a high-temperature chamber and a low-temperature chamber, with the sample moving directly between them via a robotic arm or basket. While this structure attempts to achieve rapid switching, the sample is completely exposed to ambient air during transfer, making it highly susceptible to condensation on the surface of the low-temperature sample, potentially leading to chip short circuits. Simultaneously, the forced airflow circulation within the chambers achieves temperature uniformity, which suffers from uneven airflow and easy blockage of air ducts, making it difficult to maintain stable uniformity within ±2℃ under extreme high and low temperature conditions. Three-chamber equipment adds a transition chamber between the two chambers. The sample first enters the transition chamber for temperature buffering or gas replacement before entering the target temperature chamber. While this design alleviates the problems of condensation and thermal shock to some extent, the addition of extra dwell and adjustment links significantly prolongs the transition time between high-temperature shock and low-temperature shock (generally 10-15 seconds), failing to meet the stringent test standard of high-low temperature transition time ≤ 5 seconds. Furthermore, gas crosstalk and heat exchange between multiple compartments make temperature control more complex and prone to "overshoot" or "undershoot". Summary of the Invention

[0004] To address the technical problems existing in the background art, the present invention proposes a chip high and low temperature testing device in a vacuum environment.

[0005] This invention proposes a high and low temperature chip testing device under vacuum conditions, comprising a main body with a chamber, a vacuum pump, and a gas path. The vacuum pump is connected to the chamber through the gas path, and starting the vacuum pump can evacuate the chamber to create a vacuum chamber. A first station, a second station, a third station, and a robotic arm are arranged inside the vacuum chamber. A heater for heating the chip placed on the second station at high temperature is installed on the second station side, and a refrigerator for cooling the chip placed on the third station at low temperature is installed on the third station side. The robotic arm transfers the chip from the first station to the second station for heating by the heater, and then transfers the heated chip from the second station to the third station for cooling by the refrigerator. After performing at least one cycle between the second and third stations, the robotic arm transfers the chip back to the first station.

[0006] Preferably, the main body of the device is equipped with a first isolation component that divides the chamber into a temporary storage chamber and a test chamber. The first work station is arranged in the temporary storage chamber. The gas path includes a first pipe with a first valve adapted to be installed on the first pipe. The vacuum pump is connected to the temporary storage chamber through the first pipe. The temporary storage chamber is selectively connected to the test chamber through the openable and closable first isolation component, so that the vacuum pump evacuates the temporary storage chamber separately when the first isolation component is closed. The robotic arm arranged in the test chamber removes the chip from the vacuum temporary storage chamber when the first isolation component is opened.

[0007] Preferably, the main body of the device is also equipped with a second isolation component that divides the test chamber into a high-temperature chamber and a low-temperature chamber. The second workstation is arranged in the high-temperature chamber. The gas path also includes a second pipe, on which a second valve is installed. The vacuum pump is connected to the high-temperature chamber through the second pipe. The high-temperature chamber is selectively connected to the low-temperature chamber through the openable and closable second isolation component, so that the vacuum pump evacuates the high-temperature chamber alone when the second isolation component is closed. The second workstation is arranged in the high-temperature chamber. When the second isolation component is opened, the robotic arm removes the chip from the high-temperature chamber.

[0008] Preferably, the main body of the device is also equipped with a third isolation component that divides the cooling chamber into a low-temperature chamber and an intermediate chamber. The third workstation is arranged in the low-temperature chamber, and the robotic arm is installed in the intermediate chamber. The gas path also includes a third pipe and a fourth pipe. A third valve and a fourth valve are adapted to be installed on the third pipe / fourth pipe. The vacuum pump is connected to the low-temperature chamber / intermediate chamber through the third pipe / fourth pipe. The low-temperature chamber is selectively connected to the intermediate chamber through the openable and closable third isolation component, so that the vacuum pump can evacuate the low-temperature chamber or the intermediate chamber separately when the third isolation component is closed. When the third isolation component is open, the robotic arm moves the chip into the low-temperature chamber.

[0009] Preferably, a first opening is provided on the wall of the temporary storage chamber, the wall of the high-temperature chamber, and the wall of the low-temperature chamber adjacent to the intermediate chamber, and a second opening is provided on the wall of the intermediate chamber adjacent to the temporary storage chamber, the high-temperature chamber, and the low-temperature chamber. The selective connection specifically means that the first opening and the second opening are connected or disconnected by a first isolation component, a second isolation component, or a third isolation component.

[0010] Preferably, the first isolation component, the second isolation component, and the third isolation component have the same structure. The first isolation component has a housing, a plate, a driving component, and several sealing components. The housing has an interface communicating with the first opening and the second opening. The plate is movably installed inside the housing. The plate can be in a first position to block the interface and disconnect the first opening and the second opening, or in a second position to open the interface and connect the first opening and the second opening. The driving component is connected to the plate and drives the plate to switch between the first position and the second position. Some of the sealing components are disposed on the plate, and other sealing components are arranged around the interface on the side wall of the housing to seal the gap between the housing and the wall of the temporary storage chamber, the wall of the high-temperature chamber, the wall of the low-temperature chamber, or the wall of the intermediate chamber.

[0011] Preferably, the driving component is a pneumatic linear drive device or an electric linear drive device, and the sealing component is a sealing ring.

[0012] Preferably, the high-temperature chamber, low-temperature chamber, temporary storage chamber, and intermediate chamber are all connected by air pipes, and air inflators are installed on the air pipes; vacuum gauges and vacuum safety valves are installed outside the high-temperature chamber, low-temperature chamber, and temporary storage chamber, and the probes of multiple vacuum gauges extend into the high-temperature chamber, low-temperature chamber, temporary storage chamber, and intermediate chamber, respectively.

[0013] Preferably, a heat-conducting plate is arranged at the second station, and a cross-shaped opening is provided in the heat-conducting plate, and a heater is installed in the opening; a cold-conducting plate is arranged at the third station, and the refrigerator is sealed to the bottom plate of the chamber of the main body of the device through a shock-absorbing device, and the cold head of the refrigerator extends into the chamber and is connected to the cold-conducting plate.

[0014] Preferably, it also includes a copper claw, a cylinder, and an extension rod. The copper claw is installed at one end of the extension rod, and the other end of the extension rod is connected to the cylinder. The cylinder is sealed to the top plate of the chamber of the main body of the device through a flange. The copper claw is arranged coaxially with the cold-conducting plate or the heat-conducting plate. The copper claw is arranged on the top of the cold-conducting plate or the heat-conducting plate. A through hole is provided on the copper claw, and a temperature sensor is installed in the through hole.

[0015] In this invention, a vacuum chamber is used for high and low temperature testing, reducing the impact of airflow, preventing frost and condensation, reducing heat conduction, ensuring temperature stability during testing, and preventing overshoot or undershoot. Furthermore, a first isolation component separates the testing area and the temporary storage area for chip handling within the chamber, preventing vacuum disruption and temperature fluctuations caused by frequent air contact in the testing area. This eliminates the need for repeatedly establishing a vacuum environment within the testing area; only the small temporary storage area needs to be evacuated, reducing system energy consumption and vacuum equipment wear. By using second and third isolation components to separate the high and low temperature chambers, the ineffective energy consumption caused by overcoming the large temperature difference between the two temperature zones is reduced, and independent high and low temperature testing is possible, improving testing flexibility and efficiency. This invention also utilizes a high-speed robotic arm to control the chip's transition time between the two temperature zones within 5 seconds, meeting chip testing standards. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the chip high and low temperature testing device in a vacuum environment proposed in this invention. Figure 2 This is a schematic diagram of the gas pipe and gas filling valve of the chip high and low temperature testing device under vacuum environment proposed in this invention. Figure 3 This is a schematic diagram of the temporary storage chamber, high temperature chamber, low temperature chamber, and intermediate chamber of the chip high and low temperature testing device under vacuum environment proposed in this invention; Figure 4 This is a schematic diagram of the intermediate chamber, the second isolation component, and the third isolation component of the chip high and low temperature testing device in a vacuum environment proposed in this invention; Figure 5 This is a schematic diagram of the structure of the first isolation component of the chip high and low temperature testing device in a vacuum environment proposed in this invention. Figure 6 This is a schematic diagram of the robotic arm and intermediate chamber of the high and low temperature chip testing device in a vacuum environment proposed in this invention; Figure 7 This is a schematic diagram showing the arrangement of the fourth tube in the intermediate chamber of the high and low temperature chip testing device under vacuum environment proposed in this invention. Figure 8 This is a schematic diagram of the temporary storage chamber of the chip high and low temperature testing device under vacuum environment proposed in this invention; Figure 9 This is a schematic diagram of the temporary storage chamber and the first workstation of the chip high and low temperature testing device under vacuum environment proposed in this invention; Figure 10 This is a schematic diagram of the low-temperature chamber of the chip high and low temperature testing device under vacuum environment proposed in this invention; Figure 11This is a schematic diagram of the low temperature chamber and the third workstation of the chip high and low temperature testing device under vacuum environment proposed in this invention; Figure 12 This is a schematic diagram of the high-temperature chamber of the chip high-temperature and low-temperature testing device under vacuum environment proposed in this invention; Figure 13 This is a schematic diagram of the high temperature chamber and the second workstation of the chip high and low temperature testing device under vacuum environment proposed in this invention; Figure 14 This is a schematic diagram of the heater and heat-conducting plate of the chip high and low temperature testing device in a vacuum environment proposed in this invention. Detailed Implementation

[0017] Reference Figure 1-14 This invention proposes a high and low temperature chip testing device under vacuum conditions, comprising a device body 1 with chambers, a vacuum pump 2, and a gas path 3. The vacuum pump 2 is connected to the chambers through the gas path 3, and starting the vacuum pump 2 can evacuate the chambers to create a vacuum chamber. The device body 1 is equipped with a first isolation component 51 that divides the chambers into a temporary storage chamber 11 and a testing chamber, a second isolation component 52 that divides the testing chambers into a high-temperature chamber 12 and a low-temperature chamber, and a third isolation component 53 that divides the low-temperature chamber into a low-temperature chamber 13 and an intermediate chamber 14. This design divides the chambers of the device body 1 into four independent cavities. By setting up temporary storage chambers 11, high-temperature chambers 12, and low-temperature chambers 13 that can be independently evacuated and selectively connected through the isolation components, during workpiece tray loading and unloading operations, only the smaller temporary storage chamber 11 needs to be evacuated or degassed, while the high-temperature chambers 12 and low-temperature chambers 13 can always maintain their working vacuum state. This completely avoids the huge energy waste caused by the need to repeatedly vacuum the entire large-volume system for sampling and placement of traditional equipment, resulting in significant energy savings, shortening test preparation time, and improving equipment utilization.

[0018] The aforementioned temporary storage chamber 11, high-temperature chamber 12, and low-temperature chamber 13 are arranged around the intermediate chamber 14. First openings 61 are provided on the walls of the temporary storage chamber 11, high-temperature chamber 12, and low-temperature chamber 13 adjacent to the intermediate chamber 14, and second openings 62 are provided on the wall of the intermediate chamber 14 adjacent to the temporary storage chamber 11, high-temperature chamber 12, and low-temperature chamber 13. The first isolation component 51, second isolation component 52, and third isolation component 53 have the same structure. The first isolation component 51 will be used as an example for explanation: Figure 5The first isolation assembly 51 has a housing 511, a plate 512, a drive unit 513, and several seals 514. The housing 511 has an interface 515 communicating with the first opening 61 and the second opening 62. Some of the seals 514 are disposed on one side wall of the plate 512, and other seals 514 are arranged around the interface 515 on the side wall of the housing 511 to seal the gap between the housing 511 and the wall of the temporary storage chamber 11, the gap between the housing 511 and the wall of the high-temperature chamber 12, the gap between the housing 511 and the wall of the low-temperature chamber 13, and the gap between the housing 511 and the wall of the intermediate chamber 14. The plate 512 is movably installed inside the housing 511. The driving component 513 is connected to the plate 512. The driving component 513 can drive the plate 512 to move to the sealing interface 515 to disconnect the first opening 61 and the second opening 62 in the first position, or drive the plate 512 to move to the opening interface 515 to connect the first opening 61 and the second opening 62 in the second position. Under the driving action of the driving component 513, the plate 512 can switch between the first position and the second position to connect or disconnect the intermediate chamber 14 and the temporary storage chamber 11, or connect the intermediate chamber 14 and the high temperature chamber 12, or connect the intermediate chamber 14 and the low temperature chamber 13.

[0019] In this embodiment, the driving component 513 is a pneumatically driven device, which can be referenced from the driving structure used in the L-motion rectangular valve. During sealing, the driving component 513 first moves the plate 512 upwards, then pushes the plate 512 horizontally toward the side where the sealing component 514 is installed, thereby squeezing the sealing component 514 on the plate 512 to seal the gap between the plate 512 and the housing 511. The sealing component 514 can be a sealing ring or a sealing strip. Other structures capable of sealing the gaps between the housing 511 and the wall of the temporary storage chamber 11, or the wall of the high-temperature chamber 12, or the wall of the low-temperature chamber 13 and the wall of the intermediate chamber 14, as well as the gap between the plate 512 and the housing 511, can also be applied in this embodiment, and no further limitations are imposed.

[0020] To connect the vacuum pump 2 to the four independent chambers, the gas path 3 includes a first pipe 31, a second pipe 32, a third pipe 33, and a fourth pipe 34. The vacuum pump 2 is connected to the temporary storage chamber 11, the high-temperature chamber 12, the low-temperature chamber 13, and the intermediate chamber 14 through the first pipe 31, the second pipe 32, the third pipe 33, and the fourth pipe 34, respectively. A first valve 311, a second valve 321, a third valve 331, and a fourth valve 341 are respectively fitted onto the first pipe 31, the second pipe 32, the third pipe 33, and the fourth pipe 34. 1. Both the third valve 331 and the fourth valve 341 are electric valves. By opening the corresponding valve on the corresponding pipeline, the cavity at one end of the pipeline can be connected to the vacuum pump 2, allowing the vacuum pump 2 to evacuate each cavity independently. By observing the vacuum gauges 91 installed on the side walls of the high-temperature chamber 12, the low-temperature chamber 13, the intermediate chamber 14, and the temporary storage chamber 11, the vacuum level in each cavity can be monitored in real time to help maintain a vacuum environment. Alternatively, the entire cavity can be evacuated through one pipeline while the three isolation components are open. To ensure the safety of each cavity, vacuum safety valves 92 are also installed on the walls of the temporary storage chamber 11, the high-temperature chamber 12, the low-temperature chamber 13, and the bottom wall of the intermediate chamber 14. These valves can release pressure when the pressure in each cavity is too high, ensuring that each cavity is not damaged by abnormal pressure and guaranteeing operational safety.

[0021] After placing the chip on the first station 41 and closing the door, the temporary storage chamber 11, high temperature chamber 12, low temperature chamber 13 and intermediate chamber 14 can all be evacuated to a vacuum through the first tube 31, the second tube 32, the third tube 33 and the fourth tube 34. After the high and low temperature tests, since it is necessary to open the door of the temporary storage chamber 11 to take out the chip, in order to prevent air from entering the intermediate chamber 14 through the temporary storage chamber 11, the first isolation component 51 can be closed, allowing only the temporary storage chamber 11 to be connected to the outside. In this way, after a new chip to be tested is placed in the subsequent test, it is only necessary to extract the gas in the temporary storage chamber 11 to make it a vacuum, thereby reducing system energy consumption and vacuum equipment wear.

[0022] By using a vacuum design, not only can the impact of gas flow on the test temperature be reduced and the stability of the ambient temperature be ensured, but also the phenomenon of frost or condensation can be prevented, thereby avoiding safety hazards caused by condensation.

[0023] After the test, in order to restore the air pressure in each chamber to normal pressure, air pipes 8 were connected to the high-temperature chamber 12, low-temperature chamber 13, temporary storage chamber 11 and intermediate chamber 14. An inflation valve 81 was installed on the air pipe 8, and air could be injected into each chamber through the air pipe 8 by opening the inflation valve 81.

[0024] like Figure 8 and Figure 9The first workstation 41 is arranged in the temporary storage room 11, such as... Figure 12 , Figure 13 and Figure 14 A second workstation 42 is arranged inside the high-temperature chamber 12. A heater 421 for heating the chip placed on the second workstation 42 at high temperature is installed on the side of the second workstation 42. The heater 421 can be connected to the control circuit through the core seat 91 set on the wall of the high-temperature chamber 12. A heat-conducting plate 422 is arranged on the second workstation 42. A cross-shaped opening 423 is provided in the heat-conducting plate 422. The heater 421 is adapted to be installed in the opening 423. The heater 421 is made of alloy resistance wire heating tube with an upper temperature resistance limit of ≥200℃ and a surface load reduced to below 1.5W / cm² to avoid local overheating and burnout. The heating tube is encapsulated with a high-purity alumina ceramic sleeve with excellent temperature resistance and insulation performance to prevent the insulation layer from aging and breaking down at high temperature.

[0025] like Figure 10 and Figure 11 A third workstation 43 is arranged inside the low-temperature chamber 13. A refrigerator 431 for low-temperature cooling of chips placed on the third workstation 43 is installed on the side of the third workstation 43. A cold guide plate 432 is arranged on the third workstation 43. The refrigerator 431 is sealed to the bottom plate of the chamber of the main body 1 through a shock-absorbing device 433. The cold head of the refrigerator 431 extends into the low-temperature chamber 13 and is connected to the cold guide plate 432. The refrigerator 431 adopts the mature GM refrigerator 431 product on the market. Only the cold head is inside the cavity of the low-temperature chamber 13. There is a cold guide plate 432 between the cold head and the workpiece plate. It does not directly bear the impact of high and low temperatures. Since the cavity is completely vacuum, the only impact on the sealing structure is radiative heat leakage. When the distance is sufficient, a fluororubber sealing ring is used, which can withstand high and low temperature alternating conditions, improves the anti-aging performance by more than 3 times, and eliminates leakage problems caused by low-temperature brittleness and high-temperature softening.

[0026] like Figure 4 , Figure 6 and Figure 7 A robotic arm 44 is installed in the intermediate chamber 14. Each of the temporary storage chamber 11, the high-temperature chamber 12, and the low-temperature chamber 13 has an openable door. By opening the door on the temporary storage chamber 11, the chip to be tested can be placed on the first work station 41. A glass window 141 is also provided on the top plate of the intermediate chamber 14 for easy observation by workers. By opening the first isolation component 51 connected to the temporary storage chamber 11 and the second isolation component 52 connected to the high-temperature chamber 12, the robotic arm 44 can transfer the chip from the temporary storage chamber 11 to the high-temperature chamber 12. Then, by opening the third isolation component 53 connected to the low-temperature chamber 13, the robotic arm 44 can transfer the chip from the high-temperature chamber 12 to the low-temperature chamber 13. After the robotic arm 44 performs at least one cycle between the second work station 42 and the third work station 43, it transfers the chip back to the first work station 41 and then removes it from the first work station 41.

[0027] The design of the heat-conducting plate 422 and the cold-conducting plate 432 can reserve heat or cold in advance to resist the influence of temperature difference changes. For example, high-temperature testing needs to be maintained at 350K, while the chip is transferred from a low-temperature environment of 77K. In order to offset the influence of this low temperature on the high-temperature testing temperature, the heat-conducting plate 422 can be preheated to 380K to reserve some heat to resist the low temperature and prevent the occurrence of "overshoot" or "undershoot".

[0028] Copper claws 7 and extension rods 71 ​​are also installed in the high-temperature greenhouse 12 and the low-temperature greenhouse 13, such as Figure 11 The copper claw 7 is installed at one end of the extension rod 71, and the other end of the extension rod 71 is connected to the cylinder 72. The cylinder 72 is sealed to the top plate of the chamber of the main body 1 through a flange. The copper claw 7 is coaxially arranged with the cold conduction plate 432 or the heat conduction plate 422, and the copper claw 7 is arranged on the top of the cold conduction plate 432 or the heat conduction plate 422. During the test, the copper claw 7 is pressed directly onto the workpiece tray carrying the chip under the push of the cylinder 72. Then, the temperature of the workpiece tray is measured in real time by the temperature sensor installed in the through hole on the copper claw 7. The temperature sensor can also be connected to the system transmission line through the core seat 91 on the wall of the high temperature chamber 12 and the wall of the low temperature chamber 13 to transmit the monitored temperature signal value in real time, so as to ensure that the system can obtain the temperature change of the workpiece tray in real time.

[0029] The above-described device will be further explained below with reference to specific embodiments: Example 1

[0030] Only one workpiece tray is set up for each test, which is transferred between the temporary storage chamber 11, the high temperature chamber 12, and the low temperature chamber 13.

[0031] In the initial state, all isolation components are open, and the temporary storage chamber 11, high temperature chamber 12, low temperature chamber 13, and intermediate chamber 14 are all at normal temperature and pressure; S1. Lofting: Place the workpiece tray containing the chip into the temporary storage chamber 11 and close the chamber door; S2. Evacuation: Open the first valve 311, second valve 321, third valve 331, and fourth valve 341 on the first pipe 31, second pipe 32, third pipe 33, and fourth pipe 34, respectively, and start the vacuum pump 2 to evacuate the temporary storage chamber 11, high temperature chamber 12, low temperature chamber 13, and intermediate chamber 14 until the chamber pressure reaches 10. -3 When Pa is reached, the second isolation component 52 and the third isolation component 53 are shut down, and high and low temperature preparation begins; S3. High and Low Temperature Acquisition: Turn on the refrigerator 431 and heater 421 to bring the high and low temperatures to the target temperatures (T). D2 and T G1 ); where T D2 The test temperature was set below that of the low-temperature room 13 to allow for sufficient cooling; TG1 The test temperature for high-temperature chamber 12; S4. Transfer: Open the second isolation component 52, the robotic arm 44 transfers the workpiece tray to the high-temperature chamber 12, the robotic arm 44 returns to its original position, and the first isolation component 51 and the second isolation component 52 are closed. S5. High Temperature Maintenance: The cylinder on the high temperature chamber 12 is activated, driving the copper claw 7 to press the workpiece disc onto the heat-conducting plate 422. The temperature controller maintains the temperature of the heat-conducting plate 422 at T. G1 The high-temperature station holding time for the workpiece is t1 (min); S6. Transfer: The cylinder on the high-temperature chamber 12 is pulled up, releasing the workpiece tray; the second isolation component 52 and the third isolation component 53 are opened, and the robotic arm 44 transfers the workpiece tray to the low-temperature chamber 13; the robotic arm 44 returns to its original position, the second isolation component 52 and the third isolation component 53 are closed, the cylinder in the low-temperature chamber 13 is pressed down, and the transfer begins from T... G1 To T D1 Cooling down; T D1 The low-temperature greenhouse 13 was used for testing; the high-temperature greenhouse 12 was used to start testing at high temperature T. G2 Ready, T G2 The test temperature is higher than that of the high-temperature chamber in order to reserve enough heat. S7. Cooling process: Initial temperature T of the cold plate 432 D2 Initial temperature T of the workpiece disk G1 T D2 The test temperature T below the low temperature chamber 13 D1 This design allows the coolant plate 432 to absorb heat from the high-temperature workpiece tray upon contact with it. The excess cooling capacity can then offset the significant heat load from the workpiece tray, preventing the temperature of the coolant plate 432 from rising to T. D1 The above steps are taken to reduce initial deviation and make the system response more stable; the workpiece tray begins to cool down, and the temperature controller starts to control the temperature to T. D1 The cooling process is complete; During the temperature control process, the built-in PID controller of the temperature controller detects, based on the feedback from the temperature sensor on the copper claw 7, that the temperature of the workpiece tray is much higher than T. D1 The PID controller calculates the cooling output of the chiller 431 based on the deviation, but since the temperature of the cooling plate 432 itself is T... D2The temperature difference between the workpiece and the workpiece plate is extremely large, so heat will spontaneously and rapidly flow from the workpiece plate to the cooling plate 432. The derivative action of the PID can predict the temperature change trend. When the temperature of the workpiece plate is detected to be approaching the target value at a relatively fast speed, the derivative term will reduce the cooling output in advance to suppress undershoot. When the temperature of the workpiece plate is close to the target value, the proportional and integral actions are finely adjusted. The integral term eliminates steady-state error, and the proportional term provides control action proportional to the deviation. Since the cooling plate 432 has stored energy, the cooling capacity of the system is relatively sufficient. A small adjustment of the power of the refrigerator 431 by the PID output can maintain the temperature stability and avoid oscillation caused by drastic power fluctuations.

[0032] S8. Low temperature holding: The workpiece tray continues to be held at the third station 43 for t2 (min). S9. Transfer: The cylinder of the low-temperature chamber 13 is pulled up, releasing the workpiece tray. The second isolation component 52 and the third isolation component 53 open. The robotic arm 44 transfers the workpiece tray from the third station 43 to the second station 42. The robotic arm 44 returns to its original position, and the second isolation component 52 and the third isolation component 53 close. The low-temperature chamber 13 begins T... D2 Prepare; S10, High Temperature Regain: Initial Temperature T of Heat Conductor 422 G2 The initial temperature T of the workpiece disk D1 Inside the high-temperature chamber 12, the cylinder descends, pressing the workpiece disc. The temperature controller is activated, and the temperature control process is similar to that in S7. The workpiece disc begins to heat up until T... G1 ; S11, Cycle: Return to S5, maintain high temperature; S5~S10 cycle N times; S12, End of Test and Temperature Recovery: In the final cycle, the workpiece tray is removed from the second station 42, the cylinder in the high-temperature chamber 12 rises, the first isolation component 51 and the second isolation component 52 are opened, the robotic arm 44 moves the workpiece tray to the temporary storage chamber 11, the first isolation component 51 and the second isolation component 52 are closed, and then the temporary storage chamber 11 is filled with gas to normal pressure for temperature recovery; the high-temperature chamber 12 and the low-temperature chamber 13 continue to undergo T... D2 and T G1 Temperature preparation; S13. Test sample removal: Open the door lock of temporary storage chamber 11, remove the test chip, and the high and low temperature shock test is over.

[0033] The aforementioned design using the cold-conducting plate 432 and the heat-conducting plate 422 is essentially a "preheating / cooling" feedforward control, providing energy reserves to cope with known interference (chip transfer). The subsequent PID feedback control focuses on eliminating residual deviations and suppressing fluctuations. The combination of these two achieves a balance between speed and accuracy. Furthermore, the PID feedback signal originates directly from the workpiece tray, rather than from the cold-conducting plate 432 or the heat-conducting plate 422. This enables direct and precise control of the final controlled object, avoiding control lag and deviations caused by the contact thermal resistance between the cold-conducting plate 432 or the heat-conducting plate 422 and the workpiece tray.

[0034] Example 2

[0035] Unlike Embodiment 1, there are two workpiece trays for transferring between the temporary storage chamber 11, the high-temperature chamber 12, and the low-temperature chamber 13. All other settings are the same as in Embodiment 1 and will not be described further here.

[0036] In the initial state, all isolation components are open, and the temporary storage chamber 11, high temperature chamber 12, low temperature chamber 13, and intermediate chamber 14 are all at normal temperature and pressure.

[0037] S1. Lofting: Place the No. 1 workpiece tray containing the chip into the temporary storage chamber 11 and close the door of the temporary storage chamber 11. S2. Evacuation: Open the first valve 311, second valve 321, third valve 331, and fourth valve 341 on the first pipe 31, second pipe 32, third pipe 33, and fourth pipe 34, respectively, and start the vacuum pump 2 to evacuate the temporary storage chamber 11, high temperature chamber 12, low temperature chamber 13, and intermediate chamber 14 until the chamber pressure reaches 10. -3 When Pa is reached, the second isolation component 52 and the third isolation component 53 are shut down, and high and low temperature preparation begins; S3, High and Low Temperature Acquisition: Turn on the refrigerator 431 and heater 421 to bring the high and low temperatures to the target temperatures (T). D2 and T G1 ); where T D2 The test temperature was set below that of the low-temperature room 13 to allow for sufficient cooling; T G1 The test temperature for high-temperature chamber 12; S4. Transfer: Open the second isolation component 52, and the robotic arm 44 transfers the No. 1 workpiece tray to the high-temperature chamber 12. The robotic arm 44 returns to its original position, and the first isolation component 51 and the second isolation component 52 are closed. The temporary storage chamber 11 is filled with air to normal pressure using the air pipe 8. The chamber door is opened and the No. 2 workpiece tray is placed in the first station 41 of the temporary storage chamber 11. The chamber door of the temporary storage chamber 11 is closed, and the temporary storage chamber 11 is evacuated again. S5. High Temperature Maintenance: The cylinder on the high temperature chamber 12 is activated, driving the copper claw 7 to press the workpiece disc onto the heat-conducting plate 422. The temperature controller maintains the temperature of the heat-conducting plate 422 at T. G1The high temperature holding time for workpiece No. 1 is t1 (min); S6. Transfer: The cylinder on the high-temperature chamber 12 is pulled up, releasing the workpiece tray; the second isolation component 52 and the third isolation component 53 are opened, and the robotic arm 44 transfers the first workpiece tray to the low-temperature chamber 13; the robotic arm 44 returns to its original position, the second isolation component 52 and the third isolation component 53 are closed, the cylinder in the low-temperature chamber 13 is pressed down, and the transfer from T... G1 Cool down to T D1 ;T D1 The temperature of the low-temperature chamber 13 was tested; the second workpiece tray was transferred to the high-temperature chamber 12 using a robotic arm 44, and the high temperature of the second workpiece tray was maintained for t1 (min); S7. Cooling process of workpiece tray No. 1: Initial temperature T of cooling plate 432 D2 The initial temperature T of workpiece tray No. 1 G1 T D2 The test temperature T below the low temperature chamber 13 D1 This design allows the coolant plate 432 to absorb heat from the high-temperature workpiece tray instantly upon contact with it. The excess cooling capacity from this absorption can then offset the significant heat load from the workpiece tray, preventing the temperature of the coolant plate 432 from dropping below T. D1 The following steps are taken to reduce initial deviation and make the system response more stable; the workpiece tray begins to cool down, and the temperature controller starts to control the temperature to T. D1 (The temperature control process of this temperature controller is the same as in Example 1), the cooling process is completed; the No. 1 workpiece tray continues to be maintained at t2 (min) in the low temperature chamber 13. S8. Transfer: Open the first isolation component 51 and the third isolation component 53, and use the robotic arm 44 to transfer the No. 1 workpiece tray to the first workstation 41 in the temporary storage chamber 11; at the same time, start the low temperature preparation, start the refrigeration unit 431, and lower the temperature of the cold plate 432 in the low temperature chamber 13 to T. D2 Then, the second workpiece tray is transferred to the third station 43 of the low-temperature chamber 13. The cylinder inside the low-temperature chamber 13 is pressed down, and the temperature of the second workpiece tray rises from T... G1 Reduced to T D1 And continue to maintain t2 (min); then begin high-temperature preparation, start heater 421, and heat the heat conduction plate 422 to T. G2 Open the first isolation component 51 and the second isolation component 52, and transfer the No. 1 workpiece tray to the second station 42 inside the high-temperature chamber 12; S9, return to S5, maintain high temperature; cycle N times from S5 to S8; S10. Sampling at the end of the test: In the last cycle, workpiece tray No. 1 is removed from station 42 and workpiece tray No. 2 is removed from station 43. When the No. 1 workpiece tray is removed, the cylinder inside the high-temperature chamber 12 rises, opening the first isolation component 51 and the second isolation component 52. The robotic arm 44 moves the No. 1 workpiece tray to the temporary storage chamber 11, closes the first isolation component 51 and the second isolation component 52, and then fills the temporary storage chamber 11 with gas until it returns to normal pressure and temperature. The high-temperature chamber 12 continues to perform T... G1 Temperature preparation; open the door lock of temporary storage chamber 11 and take out the chip from workpiece tray number one; Close the door of temporary storage chamber 11, evacuate temporary storage chamber 11, then open the first isolation component 51 and the third isolation component 53, and the robotic arm 44 moves the second workpiece tray into temporary storage chamber 11. Close the first isolation component 51 and the third isolation component 53, and then fill temporary storage chamber 11 with gas until it reaches normal pressure and temperature recovery; the low temperature chamber 13 continues to process T D1 Temperature preparation; open the door lock of temporary storage chamber 11 and take out the chip from workpiece tray number two; At this point, the high and low temperature tests on the chips on both workpiece trays are complete. This method of simultaneously utilizing two workpiece trays for high and low temperature testing, compared to single-workpiece tray testing where the high temperature chamber 12 or low temperature chamber 13 is idle for half the time, ensures that the high temperature chamber 12 and low temperature chamber 13 in this embodiment are almost always operational (either testing or preparing), with extremely short idle times. This maximizes equipment utilization and significantly increases the number of chips tested in a single cycle, substantially doubling testing efficiency.

[0038] It is worth noting that the core of high and low temperature shock testing is the ability to withstand extreme temperatures and rapidly transition between them. "Transition time" refers to the physical movement time of the chip from one extreme temperature environment to another. In this embodiment, the time the chip spends in the temporary storage chamber 11 is the "waiting queue time" or "system preparation time," not the "transition time" defined in standards such as JESD22-A104. In this embodiment, after leaving the test temperature zone, the chip enters the neutral buffer zone (temporary storage chamber 11) and does not begin the next test. Once the low-temperature environment is ready, the physical movement time of the chip from the neutral buffer zone to the test temperature zone remains ≤5 seconds. This invention perfectly solves the core problem of long and unstable transition times in existing technologies and stabilizes the transition time at an extremely high level. The "waiting" caused by scheduling in this embodiment is a management behavior that occurs outside the test conditions due to system throughput optimization and does not affect the accuracy and standard compliance of individual tests.

[0039] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A chip high and low temperature testing device in a vacuum environment, characterized in that, The device includes a main body with a chamber, a vacuum pump, and a gas path. The vacuum pump is connected to the chamber through the gas path. Activating the vacuum pump can evacuate the chamber to create a vacuum chamber. Inside the vacuum chamber, there are a first station, a second station, a third station, and a robotic arm. A heater for heating a chip placed on the second station is installed on the second station side, and a refrigerator for cooling a chip placed on the third station side is installed on the third station side. The robotic arm transfers the chip from the first station to the second station for heating by the heater, and then transfers the heated chip from the second station to the third station for cooling by the refrigerator. After performing at least one cycle between the second and third stations, the robotic arm transfers the chip back to the first station.

2. The chip high-low temperature test device in vacuum environment according to claim 1, characterized in that, The main body of the device is equipped with a first isolation component that divides the chamber into a temporary storage chamber and a test chamber. The first station is arranged in the temporary storage chamber. The gas path includes a first pipe with a first valve adapted to it. The vacuum pump is connected to the temporary storage chamber through the first pipe. The temporary storage chamber is selectively connected to the test chamber through the openable and closable first isolation component, so that the vacuum pump evacuates the temporary storage chamber separately when the first isolation component is closed. The robotic arm arranged in the test chamber removes the chip from the vacuum temporary storage chamber when the first isolation component is opened.

3. The chip high-low temperature test device in vacuum environment according to claim 2, characterized in that, The main body of the device is also equipped with a second isolation component that divides the test chamber into a high-temperature chamber and a low-temperature chamber. The second workstation is located in the high-temperature chamber. The gas path also includes a second pipe with a second valve installed on it. The vacuum pump is connected to the high-temperature chamber through the second pipe. The high-temperature chamber is selectively connected to the low-temperature chamber through the openable and closable second isolation component, so that the vacuum pump evacuates the high-temperature chamber alone when the second isolation component is closed. The second workstation is located in the high-temperature chamber. When the second isolation component is opened, the robotic arm removes the chip from the high-temperature chamber.

4. The chip high and low temperature testing device under vacuum environment according to claim 3, characterized in that, The main body of the device is also equipped with a third isolation component that divides the cooling chamber into a low-temperature chamber and an intermediate chamber. The third workstation is arranged in the low-temperature chamber, and the robotic arm is installed in the intermediate chamber. The gas path also includes a third pipe and a fourth pipe. A third valve and a fourth valve are adapted to be installed on the third pipe / fourth pipe. The vacuum pump is connected to the low-temperature chamber / intermediate chamber through the third pipe / fourth pipe. The low-temperature chamber is selectively connected to the intermediate chamber through the openable and closable third isolation component, so that the vacuum pump can evacuate the low-temperature chamber or the intermediate chamber separately when the third isolation component is closed. When the third isolation component is open, the robotic arm moves the chip into the low-temperature chamber.

5. The chip high and low temperature testing device under vacuum environment according to claim 4, characterized in that, A first opening is provided on the wall of the temporary storage chamber, the wall of the high-temperature chamber, and the wall of the low-temperature chamber adjacent to the intermediate chamber. A second opening is provided on the wall of the intermediate chamber adjacent to the temporary storage chamber, the high-temperature chamber, and the low-temperature chamber. The selective connection specifically means that the first opening and the second opening are connected or disconnected by a first isolation component, a second isolation component, or a third isolation component.

6. The chip high and low temperature testing device under vacuum environment according to claim 5, characterized in that, The first isolation component, the second isolation component, and the third isolation component have the same structure. The first isolation component has a housing, a plate, a driving component, and several sealing components. The housing has an interface that communicates with the first opening and the second opening. The plate is movably installed inside the housing. The plate can be in a first position to block the interface and disconnect the first and second openings, or in a second position to open the interface and connect the first and second openings. The drive unit is connected to the plate body, and the drive unit drives the plate body to switch between the first position and the second position; some seals are set on one side wall of the plate body, and other seals are arranged around the interface of the shell side wall to seal the gap between the shell and the temporary storage chamber wall, the high temperature chamber wall, the low temperature chamber wall, or the intermediate chamber wall.

7. The chip high and low temperature testing device under vacuum environment according to claim 6, characterized in that, The driving component is a pneumatic linear drive device or an electric linear drive device, and the sealing component is a sealing ring.

8. The chip high and low temperature testing device under vacuum environment according to claim 4, characterized in that, The high-temperature chamber, low-temperature chamber, temporary storage chamber, and intermediate chamber are all connected by air pipes, and air inflators are installed on the air pipes. Vacuum gauges and vacuum safety valves are installed outside the high-temperature chamber, low-temperature chamber, and temporary storage chamber, respectively. The probes of multiple vacuum gauges extend into the high-temperature chamber, low-temperature chamber, temporary storage chamber, and intermediate chamber.

9. The chip high and low temperature testing device under vacuum environment according to claim 1, characterized in that, The second station is equipped with a heat-conducting plate with cross-shaped openings, and the heater is installed in the openings. The third station is equipped with a cold-conducting plate. The refrigerator is sealed to the bottom plate of the main body of the device through a shock-absorbing device. The cold head of the refrigerator extends into the cavity and is connected to the cold-conducting plate.

10. The chip high and low temperature testing device under vacuum environment according to claim 9, characterized in that, It also includes a copper claw, a cylinder, and an extension rod. The copper claw is installed at one end of the extension rod, and the other end of the extension rod is connected to the cylinder. The cylinder is sealed to the top plate of the chamber of the main body of the device through a flange. The copper claw is arranged coaxially with the cold-conducting plate or the heat-conducting plate. The copper claw is arranged on the top of the cold-conducting plate or the heat-conducting plate. The copper claw is provided with a through hole, and a temperature sensor is installed in the through hole.

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