Silicon-based liquid crystal packaging device and technology
By implementing regional online monitoring and pressure adjustment in the silicon-based liquid crystal packaging device, the problem of uneven gap in the LCoS bonding process was solved, achieving precise control and consistency of the gap, and improving display quality and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANJING SMARTVISION ELECTRONICS CO LTD
- Filing Date
- 2026-01-21
- Publication Date
- 2026-04-17
AI Technical Summary
The existing LCoS bonding process cannot monitor the gap in real time, resulting in uneven gaps, which affects display quality and production yield. Furthermore, uneven bonding pressure leads to warping and thickness deviations, resulting in material waste.
By employing a silicon-based liquid crystal packaging device, the gap is monitored online in sections and the bonding pressure is adjusted in real time. A combination of gap measurement probe and pressurization unit is used to achieve precise control and consistency of the gap.
It improves the precision and consistency of gap control, reduces material waste, and enhances display quality and production yield.
Smart Images
Figure CN121879022A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a silicon-based liquid crystal packaging device and process. Background Technology
[0002] In the manufacturing process of LCoS (Liquid Crystal on Silicon) display chips, ITO conductive glass needs to be bonded to a silicon-based CMOS wafer to form a liquid crystal cell structure that houses the liquid crystal molecules. The gap between the ITO conductive glass and the silicon-based CMOS is a critical parameter of the LCoS chip, and its size directly affects important optical properties such as the orientation of liquid crystal molecules, response speed, and display contrast. Therefore, precisely controlling the size of this gap and its consistency across the entire chip surface is a core technical challenge in the LCoS manufacturing process.
[0003] In existing LCoS bonding processes, spacers are typically incorporated into the adhesive layer, and a fixed bonding pressure is applied to press the two substrate layers together. The final gap size is determined by the dimensions of the spacers. However, this method has significant limitations. First, real-time gap monitoring is impossible during bonding; gaps can only be measured offline after bonding is complete. If a gap exceeds the design range, the product cannot be reworked due to the solidified bonded structure and must be scrapped. This significantly impacts production yield and wastes materials and manufacturing costs. Second, ITO conductive glass and silicon-based CMOS wafers inevitably exhibit some degree of warping, thickness variations, or surface unevenness during manufacturing. In such cases, applying a uniform bonding pressure leads to inconsistent actual gaps in different areas, resulting in poor gap uniformity in the final product. This unevenness further causes problems such as uneven display brightness and inconsistent grayscale response, severely affecting the display quality and overall performance of the LCoS chip. Summary of the Invention
[0004] The purpose of this application is to address the shortcomings of the prior art by providing a silicon-based liquid crystal packaging device and process, which can perform online monitoring of the gap in different regions during the bonding process, adjust the bonding pressure of different regions in real time, and improve the gap control accuracy and consistency.
[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows: One aspect of this application provides a silicon-based liquid crystal packaging device, including: a base, a lower platform and an upper platform disposed on the base, a plurality of pressurizing units and a gap control unit. The lower platform is used to support the structure to be packaged. The upper platform includes a plurality of sub-platforms, each of which is used to abut against the upper surface of the structure to be packaged. The upper surfaces of the plurality of sub-platforms are respectively driven connected to different pressurizing units. Each of the plurality of sub-platforms is provided with a gap measuring probe. The gap measuring probe and the pressurizing unit are both electrically connected to the gap control unit. The gap measuring probe is used to detect the gap value between the first substrate and the second substrate of the structure to be packaged in real time. The gap control unit adjusts the pressure applied by the pressurizing unit to the sub-platform according to the measured gap value.
[0006] Optionally, at least some of the sub-platforms are equipped with a light source, which is used to irradiate the frame adhesive of the structure to be encapsulated so as to cure the frame adhesive.
[0007] Optionally, multiple sub-platforms are arranged in a rectangular array, and the gap between two adjacent sub-platforms is less than a preset gap value.
[0008] Optionally, the gap measuring probe is embedded in the sub-platform, with the probe end protruding from the lower surface of the sub-platform and flush with it.
[0009] Optionally, the pressurization unit includes a motor, a lead screw driven by the motor, and a slider threadedly engaged with the lead screw, the slider being driven by the sub-platform.
[0010] Another aspect of this application provides a silicon-based liquid crystal packaging process, including: controlling multiple pressurizing units to apply preset pressure to different areas of the surface of the structure to be packaged; detecting the gap value between the first substrate and the second substrate in each area of the structure to be packaged; comparing the gap value with a preset gap range; if the gap value is less than the preset gap range, reducing the pressure applied to the structure to be packaged by the corresponding pressurizing unit; if the gap value is greater than the preset gap range, increasing the pressure applied to the structure to be packaged by the corresponding pressurizing unit.
[0011] Optionally, after comparing the gap value with the preset gap range, the process further includes: after the gap values between the first substrate and the second substrate in each region of the structure to be packaged are within the preset gap range, controlling the light source to turn on to irradiate the frame adhesive of the structure to be packaged, so as to cure the frame adhesive.
[0012] Optionally, reducing the pressure applied to the packaged structure by the corresponding pressurizing unit includes: stepwise reduction of the pressure applied to the packaged structure by the corresponding pressurizing unit; increasing the pressure applied to the packaged structure by the corresponding pressurizing unit includes: stepwise increase of the pressure applied to the packaged structure by the corresponding pressurizing unit.
[0013] Optionally, detecting the gap value between the first substrate and the second substrate in each region of the structure to be packaged includes: using multiple gap measuring probes to detect the gap value between the first substrate and the second substrate in each region of the structure to be packaged.
[0014] Optionally, controlling multiple pressurizing units to apply preset pressure to different areas of the surface of the package structure includes: controlling multiple pressurizing units to apply preset pressure to different areas of the upper surface of the package structure through a sub-platform.
[0015] The beneficial effects of this application include: This application provides a silicon-based liquid crystal packaging device, including: a base, a lower platform and an upper platform disposed on the base, multiple pressurizing units and a gap control unit. The lower platform is used to support the structure to be packaged. The upper platform includes multiple sub-platforms, each of which is used to abut against the upper surface of the structure to be packaged. The upper surfaces of the multiple sub-platforms are driven and connected to different pressurizing units. Each sub-platform is equipped with a gap measuring probe. The gap measuring probe and the pressurizing unit are electrically connected to the gap control unit. The gap measuring probe is used to detect the gap value between the first substrate and the second substrate of the structure to be packaged in real time. The gap control unit adjusts the pressure applied by the pressurizing unit to the sub-platform according to the measured gap value. This silicon-based liquid crystal packaging device divides the upper platform into multiple independent sub-platforms, each of which is equipped with a pressurizing unit for pressure control. Each sub-platform applies pressure to different areas of the structure to be packaged, and uses the gap measuring probe on it to monitor the gap value of the first substrate and the second substrate in the bonding process in different areas online. At the same time, the gap value is compared with a preset gap range, automatically compensating for the bonding pressure in different areas, improving the gap control accuracy, and achieving the effect of consistent gap height across the entire substrate surface. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the silicon-based liquid crystal packaging device provided in the embodiments of this application; Figure 2 This is a top view of the structure to be packaged provided in an embodiment of this application; Figure 3 This is a flowchart of a silicon-based liquid crystal packaging process provided in an embodiment of this application.
[0018] Icons: 10-Silicon-based liquid crystal packaging device; 11-Lower platform; 12-Sub-platform; 13-Pressure unit; 14-Gap control unit; 15-Gap measurement probe; 16-Fiber optic cable; 17-Light source; 20-Structure to be packaged; 21-First substrate; 22-Second substrate; 23-Frame adhesive; 24-Spacer. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.
[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0022] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0023] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0024] Please refer to Figure 1 and Figure 2 This application provides a silicon-based liquid crystal packaging device 10 for packaging silicon-based liquid crystals. The packaging structure 20 for storing the silicon-based liquid crystal includes a first substrate 21 and a second substrate 22 facing each other. A frame adhesive 23 is disposed between the first substrate 21 and the second substrate 22, forming a closed space between the first substrate 21 and the second substrate 22 for storing the silicon-based liquid crystal. Spacers 24 are mixed within the frame adhesive 23. After the frame adhesive 23 cures, the final gap between the first substrate 21 and the second substrate 22 is mainly determined by the size of the spacers 24. The silicon-based liquid crystal packaging device 10 provided in this application is at least used to adjust the gap between the first substrate 21 and the second substrate 22, improving the gap control accuracy and consistency.
[0025] Specifically, the silicon-based liquid crystal packaging device 10 includes: a base, a lower platform 11 disposed on the base, an upper platform, multiple pressurizing units 13, and a gap control unit 14. The lower platform 11 supports the structure 20 to be packaged. The upper platform includes multiple sub-platforms 12, each sub-platform 12 abutting against the upper surface of the structure 20 to be packaged. The upper surfaces of the multiple sub-platforms 12 are driven and connected to different pressurizing units 13. Each sub-platform 12 is equipped with a gap measuring probe 15. Both the gap measuring probe 15 and the pressurizing units 13 are electrically connected to the gap control unit 14 (e.g., via optical fiber 16). The gap measuring probe 15 is used to detect the gap value between the first substrate 21 and the second substrate 22 of the structure 20 to be packaged in real time. The gap control unit 14 adjusts the pressure applied by the pressurizing units 13 to the sub-platforms 12 according to the measured gap value.
[0026] It should be noted that during encapsulation, the second substrate 22 of the structure to be encapsulated 20 is placed on the lower platform 11, with the first substrate 21 facing the upper platform. Multiple sub-platforms 12 of the upper platform are located above different areas of the first substrate 21, and each sub-platform 12, on the side facing away from the structure to be encapsulated 20, is driven and connected to a different pressurizing unit 13. It can be understood that the drive connection here means that the sub-platform 12 can be driven by the pressurizing unit 13 to apply pressure to the structure to be encapsulated 20. The sub-platform 12 and the pressurizing unit 13 can be directly connected or indirectly connected through other structures. The back side of each sub-platform 12 is driven and connected to a pressurizing unit 13, and different sub-platforms 12 are connected to different pressurizing units 13.
[0027] Driven by the pressurizing unit 13, the sub-platform 12 can move closer to or further away from the unit to be packaged. During packaging, the sub-platform 12 is driven downward to contact the first substrate 21 of the structure to be packaged 20. After contact, the pressurizing unit 13 can apply pressure to the first substrate 21 through the sub-platform 12, thereby adjusting the gap value between the first substrate 21 and the second substrate 22 below the sub-platform 12. Multiple sub-platforms 12 divide multiple regions on the first substrate 21, so that multiple sub-platforms 12 can adjust the gap value between the first substrate 21 and the second substrate 22 in different regions under the drive of the pressurizing unit 13.
[0028] Each sub-platform 12 is equipped with a gap measurement probe 15. The gap measurement probe 15 is used to monitor the gap value between the first substrate 21 and the second substrate 22 in the area below its corresponding sub-platform 12 in real time, and sends the gap value to the gap control unit 14. After receiving the gap value measured by each gap measurement probe 15, the gap control unit 14 compares each gap value with a preset gap range. If the gap value is less than the preset gap range, the pressure unit 13 corresponding to that gap value is controlled to reduce the pressure applied to the sub-platform 12, that is, to reduce the pressure applied to the first substrate 21, thereby increasing the gap value between the first substrate 21 and the second substrate 22 in the corresponding area (because the frame adhesive 23 between the first substrate 21 and the second substrate 22 is elastic). If the gap value is greater than the preset gap range, the pressure unit 13 corresponding to that gap value is controlled to increase the pressure applied to the sub-platform 12, that is, to increase the pressure applied to the first substrate 21, thereby decreasing the gap value between the first substrate 21 and the second substrate 22 in the corresponding area. If the gap value is within the preset gap range, it means that the gap value between the first substrate 21 and the second substrate 22 in the area corresponding to that gap value meets the accuracy requirements, and there is no need to adjust the pressure unit 13. Under the control of the gap control unit 14, the gap values between the first substrate 21 and the second substrate 22 in each area can be within the preset gap range, thereby meeting the gap accuracy requirements of silicon-based liquid crystal packaging. It can be understood that the preset gap range can be determined according to the packaging accuracy requirements, and its interval length is generally a few tenths of a micrometer, or even smaller.
[0029] The aforementioned silicon-based liquid crystal packaging device 10 divides the upper platform into multiple independent sub-platforms 12, each of which is equipped with a pressurizing unit 13 for pressure control. Each sub-platform 12 applies pressure to different areas of the structure to be packaged 20, and uses a gap measuring probe 15 to monitor the gap values of the first substrate 21 and the second substrate 22 in different areas during the bonding process. At the same time, the gap values are compared with the preset gap range, automatically compensating for the bonding pressure in different areas, improving the gap control accuracy, and achieving a consistent gap height across the entire substrate surface.
[0030] Optionally, at least a portion of the sub-platform 12 is provided with a light source 17, which is used to irradiate the frame adhesive 23 of the structure to be packaged 20 so that the frame adhesive 23 is cured.
[0031] By setting a light source 17 on the sub-platform 12, the frame adhesive 23 can be cured when the gap between the first substrate 21 and the second substrate 22 reaches the optimal state, preventing the frame adhesive 23 from rebounding, ensuring the gap consistency and accuracy of the final product, and eliminating the need for additional lighting devices or transferring the structure to be packaged 20.
[0032] The light source 17 can be a UV light source. Since the frame adhesive 23 is ring-shaped, in order to better cure the frame adhesive 23, the number of light sources 17 can be multiple, and the multiple light sources 17 are evenly distributed in a ring on multiple sub-platforms 12 and located directly above the frame adhesive 23.
[0033] Optionally, the multiple sub-platforms 12 are arranged in a rectangular array, and the gap between two adjacent sub-platforms 12 is less than a preset gap value.
[0034] The first substrate 21 and the second substrate 22 of the structure to be packaged 20 are typically rectangular. Therefore, arranging multiple sub-platforms 12 in a rectangular array can better adapt to the shapes of the first substrate 21 and the second substrate 22. For example, the number of sub-platforms 12 is 9, combined with... Figure 2 As shown by the red dashed line, the nine sub-platforms 12 are distributed in a 3×3 configuration, thus dividing the structure to be packaged 20 into nine regions. To better control the gap between the first substrate 21 and the second substrate 22, the coverage area of the multiple sub-platforms 12 spliced together is preferably larger than the surface of the first substrate 21.
[0035] If two adjacent sub-platforms 12 are completely fitted together, the adjustment process will be hindered by the adjacent sub-platforms 12, which will also increase the difficulty of processing and assembly. Therefore, limiting the gap between two adjacent sub-platforms 12 to less than the preset gap value can avoid the influence of the adjacent sub-platforms 12 when the sub-platforms 12 are raised or lowered, reduce the difficulty of processing and assembly, and ensure the accuracy and consistency of gap control.
[0036] It is understandable that, in order to ensure that most of the area of the first substrate 21 can interact with the sub-platform 12, the value of the preset gap should not be too large, and can be selected as 0.5~1mm.
[0037] Optionally, the gap measuring probe 15 is embedded in the sub-platform 12, and the probe end of the gap measuring probe 15 is exposed on the lower surface of the sub-platform 12 and flush with the lower surface of the sub-platform 12.
[0038] This embedded structure effectively prevents the gap measurement probe 15 from colliding, wearing, or deforming due to its protrusion when moving or contacting the surface being measured, significantly improving the reliability and service life of the device. Simultaneously, the probe end is flush with the reference surface, preventing interference with the pressure applied to the packaged structure 20 by the sub-platform 12. This also makes the measurement starting point more stable and uniform, reducing system deviations caused by installation errors, changes in the attitude of the sub-platform 12, or inconsistent extension lengths of the gap measurement probe 15, thereby improving the accuracy and repeatability of gap measurements.
[0039] Optionally, the pressurization unit 13 includes a motor, a lead screw connected to the motor drive, and a slider threaded to the lead screw, the slider being driven to the sub-platform 12.
[0040] The motor is electrically connected to the gap control unit 14, and the motor's output shaft is connected to the lead screw drive. When the motor starts, it drives the lead screw to rotate around its own axis. The slider is threadedly engaged with the lead screw, and the rotational motion of the lead screw can be converted into the linear motion of the slider. The slider is driven to the sub-platform 12, which can drive the sub-platform 12 to rise and fall, and apply pressure to the structure to be packaged 20 after the sub-platform 12 comes into contact with it.
[0041] The pressurizing unit 13, designed with a motor-driven lead screw and slider, boasts significant advantages such as compact structure, high transmission efficiency, and excellent control precision. The combination of motor and lead screw enables high-precision linear displacement output, ensuring smooth movement and accurate positioning of the sub-platform 12 during pressurization, thereby improving the stability and repeatability of gap measurements. The lead screw drive has a self-locking characteristic, maintaining its current position even when power is off or drive stops, preventing displacement deviations caused by external forces and enhancing measurement reliability.
[0042] This embodiment also provides a silicon-based liquid crystal packaging process; please refer to [link / reference]. Figure 3 ,include: S100: Controls multiple pressurizing units to apply preset pressure to different areas of the surface of the packaged structure.
[0043] Please refer to the reference. Figure 1 During encapsulation, multiple pressurizing units 13 apply preset pressure to different areas of the surface of the structure to be encapsulated 20, thereby initially adjusting the gap value between the first substrate 21 and the second substrate 22 of the structure to be encapsulated 20. This preset pressure can be determined empirically.
[0044] S200: Detects the gap value between the first substrate and the second substrate in each region of the structure to be packaged.
[0045] The gap values between the first substrate 21 and the second substrate 22 in each region of the structure to be packaged 20 are detected in real time. The number of detected gap values is equal to the number of pressurizing units 13 and corresponds one-to-one. That is, the gap values between the first substrate 21 and the second substrate 22 below each pressurizing unit 13 are detected respectively.
[0046] S300: Compare the gap value with the preset gap range. If the gap value is less than the preset gap range, reduce the pressure applied to the packaged structure by the corresponding pressurizing unit; if the gap value is greater than the preset gap range, increase the pressure applied to the packaged structure by the corresponding pressurizing unit.
[0047] The pressure applied to the encapsulated structure 20 by the pressurizing unit 13 is adjusted according to the measured gap value. Specifically, if the gap value is less than a preset gap range, the pressurizing unit 13 corresponding to that gap value is controlled to reduce the pressure applied to the encapsulated structure 20, thereby increasing the gap value between the first substrate 21 and the second substrate 22 in the corresponding area (because the frame adhesive 23 between the first substrate 21 and the second substrate 22 is elastic); if the gap value is greater than the preset gap range, the pressurizing unit 13 corresponding to that gap value is controlled to increase the pressure applied to the encapsulated structure 20, thereby decreasing the gap value between the first substrate 21 and the second substrate 22 in the corresponding area; if the gap value is within the preset gap range, it indicates that the gap value between the first substrate 21 and the second substrate 22 in the area corresponding to that gap value meets the accuracy requirements, and no adjustment of the pressurizing unit 13 is required. After a single adjustment, real-time comparison continues, and adjustment continues until the gap values between the first substrate 21 and the second substrate 22 in each area are all within the preset gap range, thereby meeting the gap accuracy requirements of silicon-based liquid crystal packaging.
[0048] It is understandable that the preset gap range can be determined according to the packaging precision requirements, and its interval length is generally a few tenths of a micrometer, or even smaller.
[0049] The aforementioned silicon-based liquid crystal packaging process divides the surface of the structure to be packaged 20 into multiple regions and uses multiple pressurizing units 13 to pressurize each region separately. During the pressurization process, the gap value between the first substrate 21 and the second substrate 22 in each region is detected in real time, and the gap value is compared with the preset gap range to automatically compensate for the bonding pressure in different regions, thereby improving the gap control accuracy and achieving the effect of consistent gap height across the entire substrate surface.
[0050] Optionally, after comparing the gap value with a preset gap range, the process further includes: S400: After the gap values between the first substrate and the second substrate in each region of the structure to be packaged are within the preset gap range, the light source is turned on to irradiate the frame adhesive of the structure to be packaged so that the frame adhesive can be cured.
[0051] The frame adhesive 23 is cured when the gap between the first substrate 21 and the second substrate 22 reaches its optimal state, preventing the frame adhesive 23 from springing back and ensuring the gap consistency and precision of the final product. The light source 17 can be a UV light source 17. Since the frame adhesive 23 is ring-shaped, in order to better cure the frame adhesive 23, optionally, multiple light sources 17 are used, and multiple light sources 17 are evenly arranged in a ring above the frame adhesive 23.
[0052] Optionally, reducing the pressure applied to the packaged structure by the corresponding pressurizing unit includes: S310: Stepwise reduction of the pressure applied to the packaged structure by the corresponding pressurization unit.
[0053] Increasing the pressure applied to the packaged structure by the corresponding pressurizing unit includes: S320: Stepped increase of the pressure applied to the packaged structure by the corresponding pressure unit.
[0054] Based on the real-time monitored gap value, the pressure applied by the pressurizing unit 13 to the packaged structure 20 can be increased or decreased in a stepwise manner, allowing for more precise control of the gap between the first substrate 21 and the second substrate 22. The pressure value for each increase or decrease can be a fixed value or a variable value.
[0055] For example, a minimum pressure value is determined, and each increase or decrease in pressure is equal to this minimum pressure value.
[0056] Alternatively, a preset pressure range can be provided, and each increase or decrease in pressure value must fall within this range. Furthermore, the pressure value for each increase or decrease can be adaptively adjusted based on the difference between the current gap value and the preset gap range. For example, during the adjustment process, as the gap value gradually approaches the preset gap range, the pressure value for each increase or decrease also gradually decreases.
[0057] Optionally, controlling multiple pressurizing units to apply preset pressure to different areas of the surface of the packaged structure includes: S110: Controls multiple pressurization units to apply preset pressure to different areas of the upper surface of the structure to be packaged via a sub-platform.
[0058] The pressurizing unit 13 applies pressure to the structure to be packaged 20 through the sub-platform 12. The sub-platform 12 has a large contact area with the structure to be packaged 20, which can better adjust the gap between the first substrate 21 and the second substrate 22.
[0059] Optionally, detecting the gap value between the first substrate and the second substrate in each region of the structure to be packaged includes: S210: Multiple gap measurement probes are used to detect the gap value between the first substrate and the second substrate in each area of the structure to be packaged.
[0060] For each pressurizing unit 13, a gap measuring probe 15 is provided to measure the gap value between the first substrate 21 and the second substrate 22 within the area controlled by the corresponding pressurizing unit 13. The gap measuring probe 15 can be embedded in the sub-platform 12 connected to the pressurizing platform.
[0061] It should be understood that although the steps in the flowchart of this application are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart may include multiple steps or multiple stages, which are not necessarily completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.
[0062] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A silicon-based liquid crystal packaging device, characterized in that, include: The package includes a base, a lower platform and an upper platform mounted on the base, multiple pressurizing units and a gap control unit. The lower platform is used to support the structure to be packaged. The upper platform includes multiple sub-platforms, each of which is used to abut against the upper surface of the structure to be packaged. The upper surfaces of the multiple sub-platforms are driven and connected to different pressurizing units. Each of the multiple sub-platforms is equipped with a gap measuring probe. The gap measuring probe and the pressurizing unit are both electrically connected to the gap control unit. The gap measurement probe is used to detect the gap value between the first substrate and the second substrate of the structure to be packaged in real time, and the gap control unit adjusts the pressure applied to the sub-platform by the pressurizing unit according to the measured gap value.
2. The silicon-based liquid crystal packaging device as described in claim 1, characterized in that, At least a portion of the sub-platform is provided with a light source, which is used to irradiate the frame adhesive of the structure to be encapsulated, so as to cure the frame adhesive.
3. The silicon-based liquid crystal packaging device as described in claim 1, characterized in that, The multiple sub-platforms are arranged in a rectangular array, and the gap between two adjacent sub-platforms is less than a preset gap value.
4. The silicon-based liquid crystal packaging device as described in claim 1, characterized in that, The gap measuring probe is embedded in the sub-platform, and the probe end of the gap measuring probe protrudes from the lower surface of the sub-platform and is flush with the lower surface of the sub-platform.
5. The silicon-based liquid crystal packaging device as described in claim 1, characterized in that, The pressurization unit includes a motor, a lead screw driven by the motor, and a slider threadedly engaged with the lead screw. The slider is driven by the sub-platform.
6. A silicon-based liquid crystal packaging process, characterized in that, include: Multiple pressurization units are controlled to apply preset pressure to different areas of the surface of the structure to be packaged. Detect the gap value between the first substrate and the second substrate in each region of the structure to be packaged; The gap value is compared with a preset gap range. If the gap value is less than the preset gap range, the pressure applied by the corresponding pressurizing unit to the structure to be packaged is reduced. If the gap value is greater than the preset gap range, the pressure applied by the corresponding pressurizing unit to the structure to be packaged is increased.
7. The silicon-based liquid crystal packaging process as described in claim 6, characterized in that, After comparing the gap value with the preset gap range, the process further includes: Once the gap values between the first substrate and the second substrate in each region of the structure to be packaged are within the preset gap range, the light source is turned on to irradiate the frame adhesive of the structure to be packaged, so that the frame adhesive is cured.
8. The silicon-based liquid crystal packaging process as described in claim 6, characterized in that, The reduction of the pressure applied to the structure to be packaged by the corresponding pressurizing unit includes: The pressure applied to the structure to be packaged by the corresponding pressurizing unit is reduced in a stepwise manner. The pressure applied to the structure to be packaged by the corresponding increasing pressure unit includes: The pressure applied to the structure to be packaged is increased in a stepped manner by the corresponding pressurizing unit.
9. The silicon-based liquid crystal packaging process as described in claim 6, characterized in that, The detection of the gap value between the first substrate and the second substrate in each region of the structure to be packaged includes: Multiple gap measurement probes are used to detect the gap values between the first substrate and the second substrate in each region of the structure to be packaged.
10. The silicon-based liquid crystal packaging process as described in claim 6, characterized in that, The method of controlling multiple pressurizing units to apply preset pressure to different areas of the surface of the structure to be packaged includes: Multiple pressurization units are controlled to apply preset pressure to different areas on the upper surface of the structure to be packaged via a sub-platform.