A laminating device for a packaging bag making machine

CN224276483UActive Publication Date: 2026-05-26ZHUHAI INSPIRATION PACKAGING MATERIALS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHUHAI INSPIRATION PACKAGING MATERIALS CO LTD
Filing Date
2025-05-12
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing technology cannot perform separate heat-pressing on the edges of the double-layer structure of the packaging bag, resulting in limitations in its use.

Method used

A packaging bag making machine laminating device is designed, including a laminating mechanism, an adjusting mechanism, and a cleaning mechanism. It can perform heat-pressing lamination on the edges of double-layer film from the side, and the adjusting mechanism can adjust the position and angle to adapt to different size specifications. The cleaning mechanism performs pre-pressing and cleaning before lamination.

Benefits of technology

It enables individual heat-pressing of the edges of the double-layer film on the packaging bag, improving product quality, having a wide range of applications, removing surface impurities, and adapting to packaging bags of different sizes and specifications.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224276483U_ABST
    Figure CN224276483U_ABST
Patent Text Reader

Abstract

This utility model relates to a bonding device for a packaging bag making machine, belonging to the field of packaging bag processing technology. It includes a base plate and a bonding mechanism installed on the top of the base plate. The top of the base plate is provided with an adjustment mechanism for adjusting the position of the bonding mechanism. Through the setting of the bonding mechanism, this utility model can individually heat-press the edges of double-layer structures such as double-layer films from the side of the packaging bag. Furthermore, by adjusting the position of the bonding mechanism, the entire double-layer film can be fed from the side into the bonding groove of the bonding mechanism for full bonding. It has a wide range of applications. The cleaning mechanism can also pre-press and clean the double-layer structure before bonding, so that debris and other impurities on the surface of the double-layer film and other double-layer structures are not easily heat-pressed into the outer surface of the double-layer structure during the subsequent bonding process, thereby improving product quality.
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Description

Technical Field

[0001] This utility model belongs to the field of packaging bag processing technology, specifically relating to a bonding device for a packaging bag making machine. Background Technology

[0002] Packaging bags are bags used to package various goods and are widely used in daily life and industrial production. Their main functions are to facilitate the transportation and storage of goods, protect them from damage, and ensure their safe delivery to consumers. Packaging bags are usually composed of two or more layers of film. The edges of the double-layer film are heat-pressed together by the laminating device of a bag-making machine, creating a space between the two layers for storing items.

[0003] Patent CN210047143U discloses "a roller heat-sealing bonding device for a bag-making machine, including a mounting frame, on which a heat-sealing roller is rotatably mounted. The mounting frame is provided with a first driving component for driving the heat-sealing roller to rotate. The mounting frame is provided with a first lifting component and a second lifting component on both sides of the heat-sealing roller. The first lifting component includes a first lifting rod assembly and a first lifting seat, with the first lifting rod assembly mounted on the first lifting seat. By adopting the above solution, the heat-sealing operation can be completed, and overheating of the paper and film can be avoided when the machine is stopped."

[0004] Although the existing technology can heat-press and bond double-layer structures such as kraft paper and film, it can only heat-press and bond the middle double-layer structure as a whole from the top and bottom of the double-layer structure. It cannot heat-press and bond the edges of the double-layer structure separately to form the bottom or corners of the bag. Its use is relatively limited and therefore needs to be improved. Utility Model Content

[0005] The purpose of this utility model is to provide a bonding device for a packaging bag making machine in order to solve the above-mentioned problems.

[0006] This utility model achieves the above objectives through the following technical solutions:

[0007] A packaging bag making machine laminating device includes a base plate and a laminating mechanism installed on the top of the base plate. The top of the base plate is provided with an adjustment mechanism for adjusting the position of the laminating mechanism. The laminating mechanism includes a laminating seat on the top of the base plate, a laminating groove opened in the middle of one side of the laminating seat for the passage of double-layer structures such as double-layer film of the packaging bag, a hot press plate fixedly installed at the bottom of the laminating groove of the laminating seat, a cylinder fixedly installed on the top of the outer side of the laminating seat, and a triangular pressure post fixedly installed at the bottom of the cylinder for pressing the double-layer structure such as double-layer film of the packaging bag against the hot press plate. The laminating seat is provided with a cleaning mechanism for pre-pressing and cleaning the double-layer structure such as double-layer film of the packaging bag before laminating.

[0008] As a further optimization of this utility model, the adjustment mechanism includes an adjustment plate that abuts against the top of one end of the base plate, a limiting groove formed in the middle of the adjustment plate, and a fixing bolt threaded on the top of the base plate for pressing down and fixing the adjustment plate. The fixing bolt is located in the limiting groove of the adjustment plate.

[0009] As a further optimization of this utility model, one end of the adjustment plate is provided with a circular hole, and the bottom of one end of the fitting seat is fixedly provided with a circular rod that is movably connected in the matching circular hole.

[0010] As a further optimization of this utility model, the top of one end of the adjustment plate is provided with a plurality of positioning holes arranged in a circumferential array along the circular hole, and the bottom of the fitting seat is fixedly provided with a positioning rod that is fitted into the positioning hole.

[0011] As a further optimization of this utility model, the bottom of the triangular pressure post is provided with an arc surface, and the triangular pressure post is located above the hot press plate.

[0012] As a further optimization of this utility model, the cleaning mechanism includes a lower cleaning component fixedly disposed at the bottom of the fitting groove of the fitting seat, a connecting plate fixedly disposed on one side of the top of the triangular pressure post, and an upper cleaning component fixedly disposed at the bottom of one end of the connecting plate and located directly above the lower cleaning component.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. The bonding mechanism allows for individual heat-pressing bonding of the edges of double-layered structures such as double-layered films from the side of the packaging bag. By adjusting the position of the bonding mechanism, the entire double-layered film can be fed into the bonding groove of the bonding mechanism from the side for complete bonding. This has a wide range of applications. The cleaning mechanism can also pre-press and clean the double-layered structure before bonding, preventing debris and other impurities on the surface of the double-layered film from being heat-pressed into the outer surface of the double-layered structure during the subsequent bonding process, thus improving product quality.

[0015] 2. By adjusting the position of the fixing bolts in the limiting groove of the adjusting plate, the position of the bonding mechanism can be adjusted. By rotating the inner round rod of the adjusting plate, the bonding seat can be rotated, thereby adjusting the angle of the bonding mechanism. This allows the bonding mechanism to perform heat-press bonding of double-layer structures of packaging bags of different sizes and specifications after the position and angle are adjusted. Furthermore, by inserting the positioning rod into the corresponding positioning round hole, the angle of the bonding mechanism after rotation can be fixed, which is convenient and practical. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the adjustment plate and the bonding seat in the separated state of this utility model;

[0018] Figure 3 This is a longitudinal cross-sectional view of the fitting seat of this utility model.

[0019] In the diagram: 1. Base plate; 11. Adjusting plate; 12. Limiting groove; 13. Fixing bolt; 14. Round hole; 15. Round rod; 16. Positioning hole; 17. Positioning rod; 2. Fitting seat; 21. Fitting groove; 22. Hot press plate; 23. Cylinder; 24. Triangular pressure column; 3. Lower cleaning component; 31. Connecting plate; 32. Upper cleaning component. Detailed Implementation

[0020] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0021] Example

[0022] like Figure 1-3 As shown, a bonding device for a packaging bag making machine includes a base plate 1 and a bonding mechanism. The base plate 1 can be installed inside the packaging bag making machine, and multiple bonding devices can be provided.

[0023] like Figure 1-3 As shown, the bonding mechanism is installed on the top of the base plate 1. The bonding mechanism includes a bonding seat 2 on the top of the base plate 1, a bonding groove 21 opened in the middle of one side of the bonding seat 2 for the double-layer structure such as the double-layer film of the packaging bag to pass through, a hot press plate 22 fixedly installed at the bottom of the bonding groove 21 of the bonding seat 2, a cylinder 23 fixedly installed on the top of the outer side of the bonding seat 2, and a triangular pressure post 24 fixedly installed at the bottom of the cylinder 23 for pressing the double-layer structure such as the double-layer film of the packaging bag against the hot press plate 22. The triangular pressure post 24 is located above the hot press plate 22. The bottom of the triangular pressure post 24 has an arc surface. During hot pressing, the double-layer structure such as the double-layer film of the packaging bag can be continuously pulled and transported by the traction equipment in the bag making machine. During hot pressing, the triangular pressure post 24 can reduce the resistance and wear between itself and the double-layer structure such as the double-layer film during traction through the arc surface at the bottom, so that the double-layer structure of the packaging bag is not easily damaged during hot pressing.

[0024] During hot pressing, the edge of the double-layer structure such as the double-layer film of the packaging bag can enter the bonding groove 21 of the bonding seat 2 from the side. After the control cylinder 23 extends and retracts, it will drive the triangular pressure column 24 to rise and fall. When the triangular pressure column 24 descends, it will press the double-layer structure such as the double-layer film onto the top of the hot pressing plate 22, so that the edge of the double-layer structure such as the double-layer film can be hot pressed and bonded. When the double-layer structure such as the double-layer film of the packaging bag is completely inserted into the bonding groove 21, the bonding mechanism such as the hot pressing plate 22 can then fully bond the double-layer structure such as the double-layer film.

[0025] like Figure 1 and Figure 3 As shown, the bonding seat 2 is equipped with a cleaning mechanism for pre-pressing and cleaning the double-layer structure of the packaging bag, such as the double-layer film, before bonding. The cleaning mechanism includes a lower cleaning component 3 fixedly installed at the bottom of the bonding groove 21 of the bonding seat 2, a connecting plate 31 fixedly installed on one side of the top of the triangular pressure post 24, and an upper cleaning component 32 fixedly installed at the bottom of one end of the connecting plate 31 and located directly above the lower cleaning component 3. The upper cleaning component 32 and the lower cleaning component 3 can be objects with cleaning effect, such as sponges. The connecting plate 31 can connect the upper cleaning component 32 and the triangular pressure post 24. The bottom of the upper cleaning component 32 is flush with the bottom of the triangular pressure post 24.

[0026] Before lamination, the upper cleaning component 32 and the lower cleaning component 3 can hold against the double-layer structure such as the double-layer film in the middle. At this time, with the traction and conveying of the double-layer structure such as the double-layer film, the upper cleaning component 32 and the lower cleaning component 3 can pre-press and clean the surface of the double-layer structure, so that the debris and other impurities on the surface of the double-layer structure are not easily pressed into the outer surface of the double-layer structure during the subsequent lamination process, thereby improving the quality of the product. When the cylinder 23 shortens and drives the triangular pressure column 24 to move upward, the upper and lower cleaning components 32 connected by the connecting plate 31 will move upward accordingly, making it easier for double-layer structures such as double-layer films of other specifications and sizes to enter between the moved upper cleaning component 32 and the fixed lower cleaning component 3, which is convenient for subsequent use.

[0027] like Figure 1-2 As shown, the top of the base plate 1 is provided with an adjustment mechanism for adjusting the position of the fitting mechanism. The adjustment mechanism includes an adjustment plate 11 that abuts against the top of one end of the base plate 1, a limiting groove 12 opened in the middle of the adjustment plate 11, and a fixing bolt 13 that is threaded on the top of the base plate 1 and used to press down and fix the adjustment plate 11. The fixing bolt 13 is located in the limiting groove 12 of the adjustment plate 11. After the fixing bolt 13 is rotated, it will press down and fix the adjustment plate 11 through the nut.

[0028] like Figure 1-2 As shown, one end of the adjusting plate 11 has a circular hole 14, and the bottom of one end of the bonding seat 2 is fixedly provided with a circular rod 15 that is movably connected in the matching circular hole 14. The circular rod 15 can rotate in the circular hole 14 of the adjusting plate 11 and can also be pulled out from the circular hole 14, which makes it convenient to remove the bonding mechanism and the circular rod 15 as a whole from the adjusting plate 11 for inspection and maintenance of the bonding mechanism. The adjusting mechanism and other structures can connect the base plate 1 and the bonding seat 2 and other bonding mechanisms.

[0029] By adjusting the position of the fixing bolt 13 in the limiting groove 12 of the adjusting plate 11, the position of the adjusting plate 11 and the bonding mechanism can be adjusted. By rotating the inner round rod 15 of the adjusting plate 11, the bonding seat 2 can be rotated, thereby adjusting the angle of the bonding mechanism such as the bonding seat 2. This makes it easier for the bonding mechanism after the position and angle are adjusted to perform hot pressing bonding on the double-layer structure of packaging bags of different sizes and specifications.

[0030] like Figure 1-2 As shown, the top of one end of the adjusting plate 11 is provided with a plurality of positioning holes 16 arranged in a circumferential array along the circular hole 14. The bottom of the bonding seat 2 is fixedly provided with a positioning rod 17 that is inserted into the positioning hole 16. When it is necessary to adjust the angle of the bonding mechanism such as the bonding seat 2, the bonding seat 2 can be lifted upward, so that the positioning rod 17 moves upward and disengages from the positioning hole 16. Then the bonding seat 2 is rotated. When the bonding seat 2 is rotated to the required angle, the bonding seat 2 can be lowered. At this time, under the force of gravity, the positioning rod 17 will be inserted into the corresponding positioning hole 16 to fix the adjusting plate 11 and the rotated bonding seat 2, and fix the angle of the bonding mechanism after rotation.

[0031] It should be noted that, in use, the edge of the double-layer structure such as the double-layer film of the packaging bag can enter the bonding groove 21 of the bonding seat 2 from the side. After the control cylinder 23 extends and retracts, it will drive the triangular pressure column 24 to rise and fall. When the triangular pressure column 24 descends, it will press the double-layer structure such as the double-layer film onto the top of the hot press plate 22, thereby performing hot pressing bonding on the edge of the double-layer structure such as the double-layer film. When the double-layer structure such as the double-layer film of the packaging bag is completely inserted into the bonding groove 21, the bonding mechanism such as the hot press plate 22 can fully bond the double-layer structure such as the double-layer film, which has a wide range of applications.

[0032] Before lamination, the upper cleaning component 32 and the lower cleaning component 3 can resist the double-layer structure such as the double-layer film in the middle. At this time, with the traction and conveying of the double-layer structure such as the double-layer film, the upper cleaning component 32 and the lower cleaning component 3 can pre-press and clean the surface of the double-layer structure, so that the debris and other impurities on the surface of the double-layer structure are not easily pressed into the outer surface of the double-layer structure during the subsequent lamination process, thereby improving the quality of the product.

[0033] By adjusting the position of the fixing bolt 13 in the limiting groove 12 of the adjusting plate 11, the position of the adjusting plate 11 and the bonding mechanism can be adjusted. By rotating the inner round rod 15 of the adjusting plate 11, the bonding seat 2 can be rotated, thereby adjusting the angle of the bonding mechanism such as the bonding seat 2. This makes it easier for the bonding mechanism after the position and angle are adjusted to perform hot pressing bonding on the double-layer structure of packaging bags of different sizes and specifications.

[0034] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A bonding device for a packaging bag making machine, comprising a base plate (1) and a bonding mechanism mounted on the top of the base plate (1), characterized in that: The top of the base plate (1) is provided with an adjustment mechanism for adjusting the position of the bonding mechanism; The bonding mechanism includes a bonding seat (2) on the top of the base plate (1), a bonding groove (21) opened in the middle of one side of the bonding seat (2) for the double film of the packaging bag to pass through, a hot press plate (22) fixedly installed at the bottom of the bonding groove (21) of the bonding seat (2), a cylinder (23) fixedly installed on the top of the outer side of the bonding seat (2), and a triangular pressure post (24) fixedly installed at the bottom of the cylinder (23) for pressing the double film of the packaging bag against the hot press plate (22). The bonding seat (2) is provided with a cleaning mechanism for pre-pressing and cleaning the double film of the packaging bag before bonding.

2. The bonding device for a packaging bag making machine according to claim 1, characterized in that: The adjustment mechanism includes an adjustment plate (11) that abuts against the top of one end of the base plate (1), a limiting groove (12) opened in the middle of the adjustment plate (11), and a fixing bolt (13) threaded on the top of the base plate (1) for pressing down and fixing the adjustment plate (11). The fixing bolt (13) is located in the limiting groove (12) of the adjustment plate (11).

3. The bonding device for a packaging bag making machine according to claim 2, characterized in that: The adjusting plate (11) has a round hole (14) at one end, and the bottom of the fitting seat (2) is fixedly provided with a round rod (15) that is movably connected in the matching round hole (14).

4. The bonding device for a packaging bag making machine according to claim 3, characterized in that: The top of one end of the adjustment plate (11) is provided with a plurality of positioning holes (16) arranged in a circumferential array along the circular hole (14), and the bottom of the fitting seat (2) is provided with a positioning rod (17) that is fitted into the positioning hole (16).

5. The bonding device for a packaging bag making machine according to claim 1, characterized in that: The bottom of the triangular pressure post (24) is provided with an arc surface, and the triangular pressure post (24) is located above the hot press plate (22).

6. The bonding device for a packaging bag making machine according to claim 1, characterized in that: The cleaning mechanism includes a lower cleaning component (3) fixedly installed at the bottom of the fitting groove (21) of the fitting seat (2), a connecting plate (31) fixedly installed on one side of the top of the triangular pressure post (24), and an upper cleaning component (32) fixedly installed at the bottom of one end of the connecting plate (31) and located directly above the lower cleaning component (3).