Testing equipment for chip processing and manufacturing

Abstract

The invention relates to the technical field of chip processing, and discloses a test device for chip processing and manufacturing, which comprises a base, a first support plate is fixedly mounted on the base, second support plates are arranged on the two sides of the first support plate, and base plates are arranged on the second support plates. A first electric telescopic rod for driving the base plate to lift is fixedly mounted on the base; a second support is fixedly installed on the base, a second electric telescopic rod is fixedly installed on the horizontal section of the second support, a top plate is fixedly installed at the output end of the second electric telescopic rod, multiple sets of third supports are fixedly installed on the two sides of the top plate, and lifting plates are slidably installed on the third supports. The beneficial effects of the invention are that the base plate independently supports the pins of the chip, so that the pins can be kept in a fixed state when the electrode plate exerts pressure on the pins, and the pins are prevented from being damaged due to deformation caused by stress.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, and more specifically to a testing device for chip processing and manufacturing. Background Technology

[0002] An integrated circuit is a miniature electronic device or component that uses specific processes to fabricate transistors, resistors, capacitors, inductors, and interconnect wiring required for a circuit onto one or more small pieces of semiconductor wafers or dielectric substrates, and then encapsulates them in a package to become a miniature electronic device or component with the required circuit function.

[0003] After integrated circuits are packaged, in order to ensure product quality, it is necessary to test whether the soldering between the pins and the integrated circuit is intact. Patent publication number CN219066760 U describes a method that uses a second spring and a third spring to make the electrode plate contact the pins, adapting to the testing needs of chips with different pin heights. However, the pins are supported by the second spring, which is compressed when under force. Thus, when the electrode plate contacts the pins and applies pressure, the second spring is compressed, causing the pins to deform and become damaged, affecting the test results and causing product damage. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a device for chip pin detection, thereby achieving high detection accuracy.

[0005] The objective of this invention can be achieved through the following technical solutions: A testing device for chip processing and manufacturing includes a base, on which a first support plate is fixedly installed, and second support plates are provided on both sides of the first support plate. A pad is provided on the second support plate, and a first electric telescopic rod that drives the pad to rise and fall is fixedly installed on the base. A second bracket is fixedly installed on the base. A second electric telescopic rod is fixedly installed on the horizontal section of the second bracket. A top plate is fixedly installed at the output end of the second electric telescopic rod. Multiple sets of third brackets are fixedly installed on both sides of the top plate. A lifting plate is slidably installed on the third bracket. A spring connected to the horizontal section of the third bracket is fixedly installed on the lifting plate. A branch pipe penetrating the top plate is fixedly installed on the lifting plate. An electrode plate is fixedly installed at the end of the branch pipe away from the base. The electrode plate is connected to the main body of the test equipment fixedly installed on the top plate.

[0006] As a further embodiment of the present invention: a connecting plate is fixedly installed on the second support plate, the connecting plate is slidably connected to the first support plate, the first support plate has a groove corresponding to the connecting plate and a fixing screw for fixing the connecting plate is threaded in the groove, and a second limiting plate is fixedly installed on the side of the second support plate away from the first support plate.

[0007] As a further aspect of the present invention: two sets of first limiting plates are slidably mounted on the first support plate, and multiple sets of adjusting screws that drive the corresponding first limiting plates to move are threadedly mounted on the first support plate.

[0008] As a further embodiment of the present invention: a first bracket is fixedly installed on the second support plate, an mounting plate is slidably installed on the first bracket, the mounting plate is L-shaped and a base plate is fixedly installed on the end of the mounting plate away from the base, a pad is slidably installed on the base plate and a pressure sensor is fixedly installed on the base plate, the pressure sensor is in contact with the lower surface of the pad 12, a frame-shaped lifting frame is fixedly installed at the output end of the first electric telescopic rod, and the horizontal section of the mounting plate is slidably installed in the lifting frame.

[0009] As a further aspect of the present invention: a protective cover is slidably installed on the branch pipe, the side of the protective cover near the base is an open structure, a first sealing plate for closing the opening of the protective cover is slidably installed on the side of the protective cover, multiple sets of first sealing plates are fixedly connected by support rods, a third electric telescopic rod is fixedly installed on the top plate, a power plate is fixedly installed at the output end of the third electric telescopic rod, and the power plate is slidably connected to one of the sets of first sealing plates.

[0010] As a further aspect of the present invention: an elastic membrane sleeve is fitted onto the first sealing plate, and the fixed end of the elastic membrane sleeve is fixedly connected to the side of the protective cover.

[0011] As a further aspect of the present invention: the first sealing plate is provided with a blowing hole, and a first support plate and a second support plate are fixedly installed in the blowing hole. A second sealing plate for sealing the blowing hole is slidably installed on the first support plate. An elastic line is fixedly installed on the second support plate and is fixedly connected to the second sealing plate. Multiple sets of protective covers are interconnected through connecting pipes, and one set of protective covers is connected to an air pump fixedly installed on the base.

[0012] The beneficial effects of this invention are: (1) In this invention, the chip pins are individually supported by the pad, so that the pins can be kept in a fixed state when the electrode plate applies pressure to the pins, avoiding the pins from deforming due to force and causing damage. The electrode plate can also make stable contact with the pins, improving the accuracy of the test results.

[0013] (2) In this invention, the pressure on the pad is detected by a pressure sensor to ensure that the pad is in contact with the pin and to avoid causing pin deformation, thereby improving the stability of the pad's support for the pin. At the same time, the pressure applied to the pin by the electrode plate can be precisely controlled to ensure that the electrode plate is stably connected to the pin and to avoid the pin being damaged by excessive pressure, thus ensuring the accuracy of the detection results and the quality of the pin after detection.

[0014] (3) In this invention, air is blown down onto the pins, and the dust and impurities on the pins are removed by the ionized air, ensuring that the area in contact with the electrode plate is clean and ensuring the stability of the connection between the electrode plate and the pins. At the same time, the protective cover and the first sealing plate work together to ensure that the electrode plate is in a closed space when it is in contact with the pins, thereby preventing dust and impurities from adhering to the electrode plate, further improving the stability of the connection between the electrode plate and the pins, and improving the accuracy of the test results. Attached Figure Description

[0015] The invention will now be further described with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 This is a cross-sectional structural diagram of the present invention.

[0018] Figure 3 This is a schematic diagram of the first support plate in this invention from a first-view perspective.

[0019] Figure 4 This is a schematic diagram of the second perspective structure of the first support plate in this invention.

[0020] Figure 5 This is a schematic diagram of the top plate structure in this invention.

[0021] Figure 6 This is a schematic diagram of the structure of the protective cover in this invention.

[0022] Figure 7 This is a front view of the blower hole in this invention.

[0023] Figure 8 yes Figure 2 Enlarged diagram of point A in the middle.

[0024] In the diagram: 1. Base; 2. First support plate; 3. First limiting plate; 4. Adjusting screw; 5. Second support plate; 6. Connecting plate; 7. Fixing screw; 8. Second limiting plate; 9. First bracket; 10. Mounting plate; 11. Base plate; 12. Pad plate; 13. Pressure sensor; 14. First electric telescopic rod; 15. Lifting frame; 16. Second bracket; 17. Second electric telescopic rod; 18. Top plate; 19. Third bracket; 20. Spring; 21. Lifting plate; 22. Branch pipe; 23. Electrode plate; 24. Main body of the testing equipment; 25. Protective cover; 26. Connecting pipe; 27. First sealing plate; 28. Support rod; 29. ​​Power plate; 30. Third electric telescopic rod; 31. Elastic diaphragm sleeve; 32. Air hole; 33. First support plate; 34. Second support plate; 35. Second sealing plate; 36. Elastic line; 37. Air pump. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figures 1-8 As shown, the present invention is a testing device for chip processing and manufacturing, including a base 1, a first support plate 2 fixedly installed on the base 1, second support plates 5 arranged on both sides of the first support plate 2, a connecting plate 6 fixedly installed on the second support plate 5, the connecting plate 6 being slidably connected to the first support plate 2, the first support plate 2 having a groove corresponding to the connecting plate 6 and a fixing screw 7 for fixing the connecting plate 6 threaded in the groove, a second limiting plate 8 fixedly installed on the side of the second support plate 5 away from the first support plate 2, two sets of first limiting plates 3 slidably installed on the first support plate 2, multiple sets of adjusting screws 4 threaded on the first support plate 2 to drive the corresponding first limiting plates 3 to move, a pad 12 provided on the second support plate 5, and a first electric telescopic rod 14 for driving the pad 12 to rise and fall fixedly installed on the base 1; A second bracket 16 is fixedly installed on the base 1. A second electric telescopic rod 17 is fixedly installed on the horizontal section of the second bracket 16. A top plate 18 is fixedly installed on the output end of the second electric telescopic rod 17. Multiple sets of third brackets 19 are fixedly installed on both sides of the top plate 18. A lifting plate 21 is slidably installed on the third bracket 19. A spring 20 connected to the horizontal section of the third bracket 19 is fixedly installed on the lifting plate 21. A branch pipe 22 penetrating the top plate 18 is fixedly installed on the lifting plate 21. An electrode plate 23 is fixedly installed at the end of the branch pipe 22 away from the base 1. The electrode plate 23 is connected to the main body 24 of the test equipment fixedly installed on the top plate 18.

[0027] In practical application, the positions of the two sets of second support plates 5 are adjusted according to the width of the chip. After the adjustment is completed, the connecting plate 6 is fixed by fixing screws 7 to fix the position of the second support plate 5. Then, the position of the first limiting plate 3 is adjusted by adjusting screws 4 according to the length of the chip. Then, the chip is placed on the first support plate 2 and the second support plate 5. The chip pins are located on the side of the second support plate 5. The chip is positioned and restricted from all sides by the first limiting plate 3 and the second limiting plate 8. After the chip is placed, the first electric telescopic rod 14 drives the pad 12 to move upward so that the pad 12 contacts the lower surface of the chip pins. At this time, the support of the chip and the individual support of the pins can be completed. The top plate 18 is moved downward by a set distance via the second electric telescopic rod 17. When the top plate 18 moves downward, multiple sets of electrode plates 23 contact the corresponding pins and compress the springs 20. The compression of the springs 20 applies pressure to the pins by the electrode plates 23. The springs 20 also buffer the impact between the electrode plates 23 and the pins and prevent excessive pressure from damaging the pins. After connection, the main body 24 of the test equipment tests different pins of the chip sequentially by using multiple sets of electrode plates 23. After the test is completed, the top plate 18 is reset and the chip can be replaced. The chip is supported by the first support plate 2 and the second support plate 5, and the pins of the chip are individually supported by the pad plate 12. This ensures that the pins are kept in a fixed state when the electrode plates 23 apply pressure to the pins, preventing deformation of the pins and damage caused by force. The electrode plates 23 can also make stable contact with the pins, improving the accuracy of the test results.

[0028] Please see Figure 2 , Figure 8 As shown, the present invention is a testing device for chip processing and manufacturing. A first bracket 9 is fixedly installed on the second support plate 5. A mounting plate 10 is slidably installed on the first bracket 9. The mounting plate 10 is L-shaped and a base plate 11 is fixedly installed on the end of the mounting plate 10 away from the base 1. A pad 12 is slidably installed on the base plate 11 and a pressure sensor 13 is fixedly installed on the base plate 11. The pressure sensor 13 contacts the lower surface of the pad 12. A frame-shaped lifting frame 15 is fixedly installed at the output end of the first electric telescopic rod 14. The horizontal section of the mounting plate 10 is slidably installed in the lifting frame 15.

[0029] In practical application, the first electric telescopic rod 14 drives the lifting frame 15 to move upward. The lifting frame 15 pushes the base plate 11 upward through the mounting plate 10, thereby causing the pad 12 to move upward and contact the pin. The pressure sensor 13 detects the pressure on the pad 12. When the pressure sensor 13 detects the force of the pin on the pad 12, the pad 12 stops moving. Then the pad 12 slowly descends, causing the pressure reading detected by the pressure sensor 13 to gradually decrease to a set value close to zero. At this time, the pad 12 is kept in contact with the pin and the pin is prevented from deforming, thus improving the stability of the pad 12 in supporting the pin. When the electrode plate 23 contacts the pin and applies pressure, the pressure sensor 13 can detect the pressure applied by the electrode plate 23 to the pin, thereby accurately controlling the pressure applied by the electrode plate 23 to the pin, ensuring a stable connection between the electrode plate 23 and the pin and avoiding damage to the pin due to excessive pressure, thus ensuring the accuracy of the test results and the quality of the pin after testing.

[0030] Please see Figure 1 , Figure 2 , Figure 5 , Figure 6 , Figure 8As shown, the present invention is a testing device for chip processing and manufacturing. A protective cover 25 is slidably installed on the branch pipe 22. The side of the protective cover 25 near the base 1 has an open structure. A first sealing plate 27 for closing the opening of the protective cover 25 is slidably installed on the side of the protective cover 25. Multiple sets of first sealing plates 27 are fixedly connected by support rods 28. A third electric telescopic rod 30 is fixedly installed on the top plate 18. A power plate 29 is fixedly installed at the output end of the third electric telescopic rod 30. The power plate 29 is slidably connected to one of the sets of first sealing plates 27.

[0031] Specifically, an elastic membrane sleeve 31 is fitted onto the first sealing plate 27, and the fixed end of the elastic membrane sleeve 31 is fixedly connected to the side of the protective cover 25.

[0032] Specifically, the first sealing plate 27 has a blower hole 32, and a first support plate 33 and a second support plate 34 are fixedly installed inside the blower hole 32. A second sealing plate 35 for sealing the blower hole 32 is slidably installed on the first support plate 33. An elastic line 36 is fixedly installed on the second support plate 34. The elastic line 36 is fixedly connected to the second sealing plate 35. Multiple sets of protective covers 25 are interconnected through connecting pipes 26, and one set of protective covers 25 is connected to an air pump 37 fixedly installed on the base 1.

[0033] In practical application, when the top plate 18 moves downward, the air pump 37 delivers ionized air into the protective cover 25. Under the action of air pressure, the air in the protective cover 25 pushes the second sealing plate 35 downward and stretches the elastic wire 36. At this time, the air can be blown towards the pin below through the blowing hole 32. Under the blowing of the ionized air, the dust and impurities on the pin are removed, ensuring that the area where the pin contacts the electrode plate 23 is in a clean state and ensuring the stability of the connection between the electrode plate 23 and the pin. When the lower end of the protective cover 25 contacts the upper surface of the pin, the air supply stops. At this time, under the action of the elastic wire 36, the second sealing plate 35 is reset. After the lower end of the protective cover 25 contacts the upper surface of the pin, a closed area is formed. Then, the third electric telescopic rod 30 drives multiple sets of first sealing plates 27 to move away from the chip through the power plate 29 to release the seal on the lower end of the protective cover 25. Then the electrode plate 23 can contact the pin for testing. After the test is completed, the electrode plate 23 moves upward, and then the first sealing plate 27 is reset. After the first sealing plate 27 is reset, the electrode plate 23 contacts the top of the protective cover 25 and drives the protective cover 25 to reset. Through the cooperation of the protective cover 25 and the first sealing plate 27, the electrode plate 23 is in a closed space when it is in contact with the pin, thus avoiding dust and impurities adhering to the electrode plate 23, further improving the stability of the connection between the electrode plate 23 and the pin, and improving the accuracy of the test results. When the first sealing plate 27 moves to the outside of the protective cover 25, the elastic membrane sleeve 31 protects the first sealing plate 27, preventing dust adhering to the first sealing plate 27 from being brought into the protective cover 25, further improving the cleanliness of the protective cover 25 and ensuring the cleanliness of the electrode plate 23.

Claims

1. A testing device for chip processing and manufacturing, comprising a base (1), characterized in that, A first support plate (2) is fixedly installed on the base (1), and a second support plate (5) is provided on both sides of the first support plate (2). A pad (12) is provided on the second support plate (5). A first electric telescopic rod (14) that drives the pad (12) to rise and fall is fixedly installed on the base (1). A second bracket (16) is fixedly installed on the base (1). A second electric telescopic rod (17) is fixedly installed on the horizontal section of the second bracket (16). A top plate (18) is fixedly installed at the output end of the second electric telescopic rod (17). Multiple sets of third brackets (19) are fixedly installed on both sides of the top plate (18). A lifting plate (21) is slidably installed on the third bracket (19). A spring (20) connected to the horizontal section of the third bracket (19) is fixedly installed on the lifting plate (21). A branch pipe (22) penetrating the top plate (18) is fixedly installed on the lifting plate (21). An electrode plate (23) is fixedly installed at the end of the branch pipe (22) away from the base (1). The electrode plate (23) is connected to the main body (24) of the test equipment fixedly installed on the top plate (18).

2. The testing equipment for chip processing and manufacturing according to claim 1, characterized in that, A connecting plate (6) is fixedly installed on the second support plate (5). The connecting plate (6) is slidably connected to the first support plate (2). The first support plate (2) has a groove corresponding to the connecting plate (6) and a fixing screw (7) for fixing the connecting plate (6) is installed in the groove. A second limiting plate (8) is fixedly installed on the side of the second support plate (5) away from the first support plate (2).

3. The testing equipment for chip processing and manufacturing according to claim 1, characterized in that, Two sets of first limiting plates (3) are slidably installed on the first support plate (2), and multiple sets of adjusting screws (4) that drive the corresponding first limiting plates (3) to move are threaded on the first support plate (2).

4. The testing equipment for chip processing and manufacturing according to claim 1, characterized in that, A first bracket (9) is fixedly installed on the second support plate (5). A mounting plate (10) is slidably installed on the first bracket (9). The mounting plate (10) is L-shaped and a base plate (11) is fixedly installed at the end of the mounting plate (10) away from the base (1). A pad (12) is slidably installed on the base plate (11) and a pressure sensor (13) is fixedly installed on the base plate (11). The pressure sensor (13) is in contact with the lower surface of the pad (12). A frame-shaped lifting frame (15) is fixedly installed at the output end of the first electric telescopic rod (14). The horizontal section of the mounting plate (10) is slidably installed inside the lifting frame (15).

5. A testing device for chip processing and manufacturing according to claim 1, characterized in that, A protective cover (25) is slidably installed on the branch pipe (22). The side of the protective cover (25) near the base (1) is an open structure. A first sealing plate (27) for closing the opening of the protective cover (25) is slidably installed on the side of the protective cover (25). Multiple sets of first sealing plates (27) are fixedly connected by a support rod (28). A third electric telescopic rod (30) is fixedly installed on the top plate (18). A power plate (29) is fixedly installed at the output end of the third electric telescopic rod (30). The power plate (29) is slidably connected to one of the sets of first sealing plates (27).

6. A testing device for chip processing and manufacturing according to claim 5, characterized in that, An elastic membrane sleeve (31) is fitted on the first sealing plate (27), and the fixed end of the elastic membrane sleeve (31) is fixedly connected to the side of the protective cover (25).

7. A testing device for chip processing and manufacturing according to claim 6, characterized in that, The first sealing plate (27) has a blow hole (32). A first support plate (33) and a second support plate (34) are fixedly installed inside the blow hole (32). A second sealing plate (35) for sealing the blow hole (32) is slidably installed on the first support plate (33). An elastic line (36) is fixedly installed on the second support plate (34). The elastic line (36) is fixedly connected to the second sealing plate (35). Multiple sets of protective covers (25) are interconnected through connecting pipes (26), and one set of protective covers (25) is connected to an air pump (37) fixedly installed on the base (1).

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