Integrated circuit lead frame surface treatment device and method

Abstract

The invention relates to the technical field of lead frame surface treatment, and provides an integrated circuit lead frame surface treatment device and method.The integrated circuit lead frame surface treatment device comprises a chemical cleaning pool and an ultrasonic cleaning pool and further comprises a frame containing platform and a bent installation frame; frame placing platforms are longitudinally and movably arranged in the chemical cleaning pool and the ultrasonic cleaning pool, two frame placing assemblies are arranged on each frame placing platform, a plurality of lead frames can be placed on each frame placing assembly, and the bent mounting frame is transversely and movably arranged at the tops of the chemical cleaning pool and the ultrasonic cleaning pool; bending sliding grooves are formed in the two sides of the bending installation frame, a grabbing groove frame is slidably connected between the two bending sliding grooves, and through the technical scheme, the problem that in the prior art, when the surface of the lead frame is treated, liquid is retained on the surface, and the surface treatment continuity of the lead frame is affected is solved.

Description

Technical Field

[0001] This invention relates to the field of lead frame surface treatment technology, and more specifically, to an integrated circuit lead frame surface treatment apparatus and method. Background Technology

[0002] An integrated circuit is a miniature electronic component that interconnects numerous transistors, resistors, capacitors, inductors, and other components and wiring on a printed circuit board. It is an essential component in current electrical appliances. The lead frame is a metal component used to mount electronic chips onto the printed circuit board and make electrical connections with the integrated circuit. In the manufacturing process of the lead frame, two processing methods are used to form the lead frame: stamping or etching. Regardless of the processing method, the surface of the lead frame is usually covered with a layer of oil and impurities. In order to ensure the quality of subsequent processing of the lead frame, a surface treatment operation is required.

[0003] In the existing technology, the common methods for surface treatment of lead frames are ultrasonic cleaning and chemical cleaning. However, during ultrasonic cleaning, some cleaning water will remain on the surface of the lead frame. At this time, it is difficult to directly perform chemical cleaning on the lead frame, which is not convenient for workers to operate quickly and affects the continuity and convenience of the surface treatment of the lead frame. Summary of the Invention

[0004] This invention proposes a surface treatment device and method for integrated circuit lead frames, which solves the problem in the prior art where residual liquid on the surface affects the continuity of the surface treatment of the lead frame.

[0005] The technical solution of the present invention is as follows: A surface treatment device for integrated circuit lead frames, comprising a chemical cleaning tank and an ultrasonic cleaning tank, and further comprising: The frame placement platform is longitudinally movable in both the chemical cleaning tank and the ultrasonic cleaning tank. The frame placement platform is provided with two frame placement components, and each frame placement component can hold multiple lead wire frames. A curved mounting frame is laterally movable at the top of the chemical cleaning tank and the ultrasonic cleaning tank. Curved grooves are provided on both sides of the curved mounting frame, and a gripping slot frame is slidably connected between the two curved grooves. A gripping moving structure is provided on the curved mounting frame to drive the gripping slot frame to move along the curved groove. The gripping slot frame grips and removes the lead frame on the frame placement assembly. An airflow liquid removal structure is provided between the curved mounting frame and the gripping moving structure. The airflow liquid removal structure is capable of removing liquid from the lead frame by blowing air in three directions.

[0006] To facilitate the longitudinal movement of the frame placement platform, multiple lifting troughs are fixedly connected inside the chemical cleaning tank and the ultrasonic cleaning tank. The frame placement platform is slidably connected to the lifting troughs via sliding plates. First electric cylinders are installed on both sides of the top of the chemical cleaning tank and the ultrasonic cleaning tank. Multiple extension rods are fixedly connected to the frame placement platform, with each extension rod corresponding to one of the first electric cylinders and the extension rods being fixedly connected to the output end of the first electric cylinder.

[0007] To further secure the lead frame to the frame placement platform, the frame placement assembly includes a mounting base plate and a trapezoidal clamp. Multiple mounting base plates are arranged longitudinally on the inner bottom wall of the frame placement platform. The trapezoidal clamp is fixedly connected to both sides of the top of the mounting base plate. The trapezoidal clamp has a hollow center and a through slot. The lead frame is placed between two of the through slots.

[0008] To further adjust the position of the curved mounting frame, a transverse sliding trough is fixedly connected between the chemical cleaning tank and the ultrasonic cleaning tank. A screw drive structure is installed within the transverse sliding trough, and a sliding bracket that engages with the screw drive structure is slidably mounted on the transverse sliding trough. A sliding protrusion is provided on the top of the sliding bracket. A slide rail is fixedly connected to the bottom wall of the curved mounting frame, and the sliding protrusion is slidably connected to the slide rail. A second electric cylinder is fixedly connected to the middle of the sliding bracket, and the output end of the second electric cylinder is fixedly connected to the curved mounting frame.

[0009] To enable the gripping slot frame to move along the curved slide, a hollow slot frame is fixedly connected to the top of the gripping slot frame, and an installation rod is fixedly connected to the top of the hollow slot frame. The installation rod passes through the two curved slides and is slidably connected to the curved slides via a sliding block. When the installation rod slides along the inner wall of the curved slide, the installation rod and the gripping slot frame flip.

[0010] To further move the gripping slot frame, the gripping moving structure includes a top slot frame and a third electric cylinder. The top slot frame is fixedly connected to the curved mounting frame. A lead screw moving structure is provided inside the top slot frame. A mounting slot frame that is driven and cooperates with the lead screw moving structure is slidably provided inside the top slot frame. Multiple third electric cylinders are provided on the mounting slot frame. The output end of the third electric cylinder is rotatably connected to the mounting rod through a rotating seat.

[0011] To further grip the lead frame, multiple fixing clamps are fixedly connected inside the gripping slot frame, and multiple fixing racks are fixedly connected to the bottom of the fixing clamps. Sliding clamps are slidably connected inside the gripping slot frame. The sliding clamps and the fixing clamps correspond one-to-one with the trapezoidal clamps. A fourth electric cylinder is provided on the gripping slot frame, and connecting rods are fixedly connected between the multiple sliding clamps. The output end of the fourth electric cylinder is fixedly connected to the connecting rods through a connecting plate.

[0012] To further remove liquid from the lead frame, the airflow liquid removal structure includes a fixed frame and a fixed slot with two mounting chambers. The fixed frame is fixedly connected to the top of the curved mounting frame. Both mounting chambers are provided with air supply pipes. The upper air supply pipe is connected to multiple downwardly inclined flat exhaust heads, and the lower air supply pipe is connected to multiple parallel flat exhaust heads. The fixed slot is fixedly connected to the mounting slot, which is also provided with an air supply pipe. The bottom of the air supply pipe is connected to multiple bidirectional exhaust heads. The top of the gripping slot is provided with a perforated plate.

[0013] To further facilitate the drainage of liquid, multiple curved drainage grooves are provided on the inner bottom wall of the curved mounting frame.

[0014] A method for surface treatment of integrated circuit lead frames, using an integrated circuit lead frame surface treatment apparatus, is characterized by comprising the following steps: Step 1, Ultrasonic Cleaning: Place the lead frame on the frame placement platform and immerse it in the ultrasonic cleaning tank for ultrasonic cleaning. Then, remove the lead frame from the ultrasonic cleaning tank, grab multiple lead frames with the grabbing rack, and move them to the curved mounting frame. Use the airflow liquid removal component to remove the cleaning liquid from the surface of the lead frame. Step 2, Chemical Cleaning: Move the bent mounting frame along the direction of the transverse sliding frame to the upper side of the chemical cleaning tank. Place the lead frame on the frame placement platform inside the chemical cleaning tank and immerse the lead frame in the chemical cleaning tank for cleaning. After cleaning, use the gripping frame to grip the lead frame and then use the airflow liquid removal component to remove the chemical agent from the surface of the lead frame. Step 3, Surface Etching: After cleaning the surface of the lead frame, the lead frame is etched again to optimize the surface structure of the lead frame. Step 4, Electroplating: The lead frame is then electroplated to form an electroplated layer on its surface. Step 5, Surface treatment: Then, the lead frame is passivated and polished.

[0015] The working principle and beneficial effects of this invention are as follows: 1. In this invention, when lead frames need to be placed in an ultrasonic cleaning tank for ultrasonic cleaning, multiple lead frames are placed on two frame placement components of a frame placement platform. The frame placement platform is then lowered, causing the lead frames to sink into the cleaning fluid in the ultrasonic cleaning tank. The ultrasonic cleaning tank then begins to clean the oil stains on the surface of the lead frames. After cleaning, the frame placement platform lifts the lead frames and removes them from the cleaning fluid. Then, a gripping trough grabs multiple lead frames from one of the frame placement components. The gripping trough moves along a curved slide, and an airflow de-liquidation structure blows the cleaning fluid adhering to the lead frames downwards in three directions, allowing the cleaning fluid to be re-transported into the ultrasonic cleaning tank. This prevents cleaning fluid from remaining on the lead frames, allowing them to directly enter the chemical cleaning tank.

[0016] 2. In this invention, after the lead frame is directly placed into the chemical cleaning tank, the lead frame is cleaned in the chemical cleaning tank and then removed. The chemical agents on the surface of the lead frame are also removed by the airflow liquid removal structure, so that the lead frame can be directly subjected to subsequent etching operations, which effectively improves the continuity of the surface treatment of the lead frame. Attached Figure Description

[0017] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a partial cross-sectional view of the structure of the present invention from another perspective; Figure 3 This is a schematic diagram of the structure of the frame placement platform and the frame placement components in this invention. Figure 4 For the present invention Figure 3 A magnified structural diagram of point A in the middle; Figure 5 This is a partial cross-sectional schematic diagram of the structure in which the curved mounting frame, gripping slot, and airflow liquid removal structure cooperate in this invention; Figure 6 For the present invention Figure 5 A magnified structural diagram of point B in the middle section; Figure 7 This is a partial cross-sectional structural diagram showing the cooperation of the gripping slot frame, the fixed clamp, the sliding clamp, and the connecting rod in this invention.

[0019] In the diagram: 1. Chemical cleaning tank; 2. Ultrasonic cleaning tank; 3. Frame placement platform; 4. Bending installation frame; 5. Bending chute; 6. Gripping chute frame; 7. Lifting chute frame; 8. First electric cylinder; 9. Extension rod; 10. Mounting base plate; 11. Trapezoidal clamp; 12. Through slot; 13. Lateral chute frame; 14. Screw drive structure; 15. Sliding bracket; 16. Sliding protrusion; 17. Slide rail; 18. Second electric cylinder; 19. Hollowed-out design. 20. Slot frame; 21. Mounting rod; 22. Top slot frame; 23. Screw moving structure; 24. Mounting slot frame; 25. Third electric cylinder; 26. Fixing clamp; 27. Fixing rack; 28. Sliding clamp; 29. ​​Fourth electric cylinder; 30. Connecting rod; 31. Fixing frame; 32. Mounting chamber; 33. Air supply pipeline; 34. Flat exhaust head; 35. Fixing slot frame; 36. Bidirectional exhaust head; 37. Ventilation perforated plate; 38. Curved drainage channel. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1, as Figures 1 to 7 As shown, this embodiment proposes a surface treatment device for integrated circuit lead frames, including a chemical cleaning tank 1 and an ultrasonic cleaning tank 2. Both the chemical cleaning tank 1 and the ultrasonic cleaning tank 2 are existing technologies and equipment for surface treatment of lead frames, and are known to those skilled in the art. The ultrasonic cleaning tank 2 uses the interaction between ultrasonic waves and the cleaning liquid to remove impurities attached to the lead frame through bubbling. The chemical cleaning tank 1 uses an acidic solution to immerse the lead frame, further removing oil and contaminants attached to the surface of the lead frame, thus fully treating the surface of the lead frame. After cleaning the surface of the lead frame, the lead frame is etched again to optimize the surface structure of the lead frame. Then, the lead frame is electroplated to process an electroplated layer on the surface of the lead frame. Finally, the lead frame is passivated and polished to completely complete the surface treatment of the lead frame.

[0022] It also includes a frame placement platform 3, which is longitudinally movable within both the chemical cleaning tank 1 and the ultrasonic cleaning tank 2. Multiple lifting troughs 7 are fixedly connected within the chemical cleaning tank 1 and the ultrasonic cleaning tank 2. The frame placement platform 3 is slidably connected to the lifting troughs 7 via sliding plates. First electric cylinders 8 are installed on both sides of the top of the chemical cleaning tank 1 and the ultrasonic cleaning tank 2. Multiple extension rods 9 are fixedly connected to the frame placement platform 3, with each extension rod 9 corresponding to one of the first electric cylinders 8. The extension rods 9 are fixedly connected to the output ends of the first electric cylinders 8. Activating the first electric cylinder 8 drives the extension rods 9 to move longitudinally, thereby causing the extension rods 9 to drive the frame placement platform 3 to move longitudinally between the multiple lifting troughs 7, completing the movement of the lead frame into and out of the chemical cleaning tank 1 and the ultrasonic cleaning tank 2.

[0023] The frame placement platform 3 is equipped with two frame placement components, each of which can hold multiple lead frames. The frame placement components include a mounting base plate 10 and a trapezoidal clamp 11. Multiple mounting base plates 10 are arranged longitudinally on the inner bottom wall of the frame placement platform 3. Trapezoidal clamps 11 are fixedly connected to both sides of the top of the mounting base plate 10. The trapezoidal clamp 11 has a hollow center and a through slot 12. The lead frame is placed between two through slots 12. When the lead frame is immersed in chemical agents or cleaning solutions, the hollow design of the trapezoidal clamp 11 does not affect the full contact between the chemical agents and cleaning solutions and the lead frame.

[0024] A curved mounting frame 4 is laterally movable and positioned on top of the chemical cleaning tank 1 and the ultrasonic cleaning tank 2. A transverse sliding trough 13 is fixedly connected between the chemical cleaning tank 1 and the ultrasonic cleaning tank 2. A screw drive structure 14 is installed inside the transverse sliding trough 13. A sliding bracket 15, which is in transmission cooperation with the screw drive structure 14, is slidably mounted on the transverse sliding trough 13. A sliding protrusion 16 is provided on the top of the sliding bracket 15. A slide rail 17 is fixedly connected to the bottom wall of the curved mounting frame 4. The sliding protrusion 16 is slidably connected to the slide rail 17. A [missing information - likely a component or element] is fixedly connected to the middle of the sliding bracket 15. The second electric cylinder 18 has its output end fixedly connected to the bending mounting frame 4. Through the screw drive structure 14, it drives the bending mounting frame 4 to move laterally along the transverse sliding frame 13, so that the bending mounting frame 4 can reciprocate between the top of the chemical cleaning tank 1 and the ultrasonic cleaning tank 2. Since both the chemical cleaning tank 1 and the ultrasonic cleaning tank 2 are equipped with two frame placement components, the second electric cylinder 18 is activated to push the bending mounting frame 4 to move laterally on the sliding protrusion 16, so that the gripping frame 6 corresponds to the corresponding frame placement component.

[0025] Both sides of the curved mounting frame 4 are provided with curved grooves 5. The top of the gripping slot frame 6 is fixedly connected to a hollow slot frame 19. The top of the hollow slot frame 19 is fixedly connected to an installation rod 20. The installation rod 20 passes through the two curved grooves 5. The installation rod 20 is slidably connected in the curved groove 5 through a sliding block. When the installation rod 20 slides along the inner wall of the curved groove 5, the installation rod 20 and the gripping slot frame 6 flip. When the gripping slot frame 6 moves along the opening path of the two curved grooves 5, because the sliding block and the curved groove 5 always maintain a sliding connection, when the sliding block moves to the curved section of the curved mounting frame 4, the sliding block will drive the installation rod 20 and the gripping slot frame 6 to flip, causing the gripping slot frame 6 and multiple lead frames to tilt. A gripping slot frame 6 is slidably connected between two curved slides 5. A gripping moving structure is provided on the curved mounting frame 4 to drive the gripping slot frame 6 to move along the curved slides 5. The gripping moving structure includes a top slot frame 21 and a third electric cylinder 24. The top slot frame 21 is fixedly connected to the curved mounting frame 4. A screw moving structure 22 is provided inside the top slot frame 21. An mounting slot frame 23 that is driven and cooperates with the screw moving structure 22 is slidably provided inside the top slot frame 21. Multiple third electric cylinders 24 are provided on the mounting slot frame 23. The output end of the third electric cylinder 24 is rotatably connected to the mounting rod 20 through a rotating seat. The screw moving structure 22 drives the mounting slot frame 23 to move laterally, pulling the gripping slot frame 6 to move along the opening path of the curved slides 5. By adjusting the feed length of the output end of the third electric cylinder 24, the distance between the mounting rod 20 and the mounting slot frame 23 changes when the mounting rod 20 moves along the curved slides 5. It should be noted that the lead screw transmission structure 14 and lead screw moving structure 22 used in this invention are both common drive structures in the prior art, in which a drive motor and a transmission lead screw cooperate with each other. The mounting slot 23 and the sliding bracket 15 are both provided with ball nut groups that can cooperate with the lead screw transmission structure 14 or the lead screw moving structure 22, so that the mounting slot 23 and the sliding bracket 15 can move laterally along the top slot 21 and the transverse slot 13, respectively.

[0026] The gripping slot 6 grips and removes the lead frame from the frame placement assembly. Multiple fixing clamps 25 are fixedly connected inside the gripping slot 6, and multiple fixing racks 26 are fixedly connected to the bottom of each fixing clamp 25. Sliding clamps 27 are slidably connected inside the gripping slot 6. Both the sliding clamps 27 and the fixing clamps 25 correspond one-to-one with the trapezoidal clamps 11. A fourth electric cylinder 28 is installed on the gripping slot 6. Connecting rods 29 are fixedly connected between the multiple sliding clamps 27. The output end of the fourth electric cylinder 28 is connected to... The connecting rod 29 is fixedly connected, and the gripping slot frame 6 is moved to the top of the corresponding frame placement component. Then, the top of the lead frame extends between the sliding clamp 27 and the fixed clamp 25. Then, the fourth electric cylinder 28 is activated to drive the connecting plate and the connecting rod 29 to move laterally, so that the lead frame is held between the sliding clamp 27 and the fixed clamp 25. The clamping stability of the sliding clamp 27 and the fixed clamp 25 is improved by the fixed rack 26. Then, when the gripping slot frame 6 is moved in the future, the lead frame is moved. When the gripping slot 6 moves along the curved slide 5, it first grips the lead frame, then rises vertically. As it moves along the curved section of the curved slide 5, it flips under the action of the sliding block, and then gradually moves to the top of the curved mounting frame 4.

[0027] An airflow liquid removal structure is provided between the curved mounting frame 4 and the gripping moving structure. This structure can remove liquid from the lead frame by blowing air in three directions. The airflow liquid removal structure includes a fixed frame 30 with two mounting chambers 31 and a fixed slot 34. The fixed frame 30 is fixedly connected to the top of the curved mounting frame 4. Each of the two mounting chambers 31 has an air supply pipe 32. The upper air supply pipe 32 is connected to multiple downwardly inclined flat exhaust heads 33, and the lower air supply pipe 32 is connected to multiple parallel flat exhaust heads 33. A fixed slot 34 is fixedly connected to the mounting slot 23, and the fixed slot 34 also has an air supply pipe 32. The passage 32 is connected to the external gas supply device and can supply gas to the three gas supply lines 32. The bottom of the gas supply line 32 is connected to multiple bidirectional exhaust heads 35. The top of the gripping slot 6 is provided with a perforated plate 36. After the gripping slot 6 and the lead frame are moved to the top of the curved mounting frame 4, the flat exhaust head 33 on the upper side faces the perforated plate 36 of the gripping slot 6. When the multiple flat exhaust heads 33 in this area spray gas, the airflow blows the liquid towards the inner bottom wall of the curved mounting frame 4 through the perforated plate 36. The flat exhaust head 33 on the lower side can blow the lead frame and also make the liquid flow on the inner bottom wall of the curved mounting frame 4, thereby increasing the removal speed of the liquid on the lead frame. After the grabbing slot 6 stops moving, the fixed slot 34 is positioned directly above the multiple lead frames, and the lead frames are positioned directly below the two bidirectional exhaust heads 35. When the bidirectional exhaust heads 35 discharge gas, the gas simultaneously contacts the two end faces of the lead frames, causing the liquid on the lead frames to flow downwards more quickly, accelerating the removal of liquid from the lead frames, and the airflow can increase the downward flow speed of the liquid along the inner bottom wall of the curved mounting frame 4.

[0028] Multiple curved drainage channels 37 are provided on the inner bottom wall of the curved mounting frame 4. After the liquid flows into the curved mounting frame 4, it enters the curved drainage channels 37 and is collected and discharged, which accelerates the discharge speed of the liquid. In this invention, whether the cleaning liquid or chemical agent is removed, airflow is required to ensure that there is no liquid retention in the curved mounting frame 4, ensuring that the curved mounting frame 4 is clean and dry, and avoiding the mixing of cleaning liquid and chemical agent.

[0029] The working principle of this integrated circuit lead frame surface treatment device: First, the corresponding number of lead frames are placed on the frame placement platform 3 located in the ultrasonic cleaning tank 2. Then, the first electric cylinder 8 is activated to move the frame placement platform 3 into the cleaning liquid in the ultrasonic cleaning tank 2, so that the ultrasonic cleaning tank 2 performs surface treatment on the lead frames on the frame placement platform 3. After the lead frames are treated, the frame placement platform 3 is raised to expose the lead frames from the cleaning liquid. Then, the gripping tray 6 is moved to one of the multiple lead frames, so that the lead frames are moved between the fixed clamp 25 and the sliding clamp 27. The fourth electric cylinder 28 is activated to move the connecting plate and the connecting rod 29 laterally, so that the lead frames are held between the sliding clamp 27 and the fixed clamp 25. The screw moving structure 22 drives the mounting frame 23 to move laterally, pulling the gripping frame 6 to move along the opening path of the curved slide 5. By adjusting the feed length of the output end of the third electric cylinder 24, the distance between the mounting rod 20 and the mounting frame 23 changes when the mounting rod 20 moves along the curved slide 5. The gripping frame 6 and multiple lead frames are moved to the positions corresponding to the fixed frame 30 and the fixed frame 34 and then stopped. Air is blown towards the gripping frame 6 and the lead frames through the flat exhaust head 33 and the bidirectional exhaust head 35, so that the liquid on the lead frames is blown onto the curved mounting frame 4 and then flows back down into the ultrasonic cleaning tank 2. After removing the cleaning solution from the surface of the lead frame, the bent mounting frame 4 is moved along the direction of the transverse sliding frame 13 to the upper side of the chemical cleaning tank 1. The gripping frame 6 is then moved towards the frame placement platform 3 on the chemical cleaning tank 1. After the gripping frame 6 is kept parallel, the lead frame is placed into the corresponding trapezoidal clamp 11. Then, the frame placement platform 3 is lowered to immerse the lead frame in the chemical agent. During this process, the cleaning solution remaining on the inner wall of the bent mounting frame 4 is cleaned as needed. After the lead frame is cleaned, it is moved out of the chemical cleaning tank 1. The gripping frame 6 is used again to grip the lead frame, and the chemical agent on the surface of the lead frame is removed using an airflow de-liquidation structure. Then, the lead frame is processed.

[0030] Example 2: Based on an integrated circuit lead frame surface treatment apparatus, the present invention also proposes an integrated circuit lead frame surface treatment method: Step 1, Ultrasonic Cleaning: Place the lead frame on the frame placement platform 3 and immerse it in the ultrasonic cleaning tank 2 for ultrasonic cleaning. Then, remove the lead frame from the ultrasonic cleaning tank 2. After the grabbing rack 6 grabs multiple lead frames, move them to the bending mounting frame 4 and use the airflow liquid removal component to remove the cleaning liquid from the surface of the lead frame. Step 2, Chemical Cleaning: The bent mounting frame 4 is moved along the direction of the transverse sliding frame 13 to the upper side of the chemical cleaning tank 1. The lead frame is then placed on the frame placement platform 3 inside the chemical cleaning tank 1. The lead frame is immersed in the chemical cleaning tank 1 for cleaning. After cleaning, the lead frame is gripped by the gripping frame 6, and then the chemical agent on the surface of the lead frame is removed by the airflow liquid removal component. Step 3, Surface Etching: After cleaning the surface of the lead frame, the lead frame is etched again to optimize the surface structure of the lead frame. Step 4, Electroplating: The lead frame is then electroplated to form an electroplated layer on its surface. Step 5, Surface treatment: Then, the lead frame is passivated and polished.

[0031] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A surface treatment apparatus for integrated circuit lead frames, comprising a chemical cleaning tank (1) and an ultrasonic cleaning tank (2), characterized in that, Also includes: The frame placement platform (3) is longitudinally movable in both the chemical cleaning tank (1) and the ultrasonic cleaning tank (2). The frame placement platform (3) is provided with two frame placement components, and each frame placement component can hold multiple lead wire frames. A curved mounting frame (4) is laterally movably disposed on top of the chemical cleaning tank (1) and the ultrasonic cleaning tank (2). Curved grooves (5) are provided on both sides of the curved mounting frame (4). A gripping slot frame (6) is slidably connected between the two curved grooves (5). A gripping moving structure is provided on the curved mounting frame (4) to drive the gripping slot frame (6) to move along the curved grooves (5). The gripping slot frame (6) grips and removes the lead frame on the frame placement assembly. An airflow liquid removal structure is provided between the curved mounting frame (4) and the gripping moving structure. The airflow liquid removal structure is capable of blowing airflow in three directions to remove liquid from the lead frame.

2. The surface treatment apparatus for an integrated circuit lead frame according to claim 1, characterized in that, Multiple lifting troughs (7) are fixedly connected inside the chemical cleaning tank (1) and the ultrasonic cleaning tank (2). The frame placement platform (3) is slidably connected to the lifting troughs (7) via a sliding plate. A first electric cylinder (8) is provided on both sides of the top of the chemical cleaning tank (1) and the ultrasonic cleaning tank (2). Multiple extension rods (9) are fixedly connected on the frame placement platform (3). Each extension rod (9) corresponds to one of the first electric cylinders (8). The extension rod (9) is fixedly connected to the output end of the first electric cylinder (8).

3. The surface treatment apparatus for an integrated circuit lead frame according to claim 2, characterized in that, The frame placement components include: Mounting substrate (10), a plurality of mounting substrates (10) are arranged longitudinally on the inner bottom wall of the frame placement platform (3). The trapezoidal clamp (11) is fixedly connected to both sides of the top of the mounting base plate (10). The trapezoidal clamp (11) has a hollow center and a through slot (12) is provided on the trapezoidal clamp (11). The lead frame is placed between the two through slots (12).

4. The surface treatment apparatus for an integrated circuit lead frame according to claim 3, characterized in that, A transverse sliding frame (13) is fixedly connected between the chemical cleaning tank (1) and the ultrasonic cleaning tank (2). A screw drive structure (14) is provided inside the transverse sliding frame (13). A sliding bracket (15) that is in transmission cooperation with the screw drive structure (14) is slidably provided on the transverse sliding frame (13). A sliding protrusion (16) is provided on the top of the sliding bracket (15). A slide rail (17) is fixedly connected to the bottom wall of the curved mounting frame (4). The sliding protrusion (16) is slidably connected to the slide rail (17). A second electric cylinder (18) is fixedly connected to the middle of the sliding bracket (15). The output end of the second electric cylinder (18) is fixedly connected to the curved mounting frame (4).

5. The surface treatment apparatus for an integrated circuit lead frame according to claim 4, characterized in that, The top of the gripping slot frame (6) is fixedly connected to a hollow slot frame (19), and the top of the hollow slot frame (19) is fixedly connected to an installation rod (20). The installation rod (20) passes through the two curved slide grooves (5). The installation rod (20) is slidably connected to the curved slide groove (5) through a sliding block. When the installation rod (20) slides along the inner wall of the curved slide groove (5), the installation rod (20) and the gripping slot frame (6) flip.

6. The surface treatment apparatus for an integrated circuit lead frame according to claim 5, characterized in that, The grasping and moving structure includes: Top slot frame (21), the top slot frame (21) is fixedly connected to the curved mounting frame (4), the top slot frame (21) is provided with a screw moving structure (22), and the top slot frame (21) is slidably provided with a mounting slot frame (23) that is in transmission cooperation with the screw moving structure (22). The third electric cylinder (24) is mounted on the mounting bracket (23) with multiple third electric cylinders (24). The output end of the third electric cylinder (24) is rotatably connected to the mounting rod (20) through a rotating seat.

7. The surface treatment apparatus for an integrated circuit lead frame according to claim 6, characterized in that, Multiple fixing clamps (25) are fixedly connected inside the gripping slot frame (6). Multiple fixing racks (26) are fixedly connected to the bottom of the fixing clamps (25). A sliding clamp (27) is slidably connected inside the gripping slot frame (6). The sliding clamp (27) and the fixing clamps (25) correspond one-to-one with the trapezoidal clamps (11). The gripping slot frame (6) is equipped with a fourth electric cylinder (28), and a connecting rod (29) is fixedly connected between the multiple sliding clamps (27). The output end of the fourth electric cylinder (28) is fixedly connected to the connecting rod (29) through a connecting plate.

8. The surface treatment apparatus for an integrated circuit lead frame according to claim 7, characterized in that, The airflow liquid removal structure includes: A fixed frame (30) having two mounting chambers (31) is fixedly connected to the top of the curved mounting frame (4), and each of the two mounting chambers (31) is provided with an air supply line (32). Among them, the upper gas supply pipe (32) is connected to a plurality of downwardly inclined flat exhaust heads (33), and the lower gas supply pipe (32) is connected to a plurality of parallel flat exhaust heads (33). A fixed slot frame (34) is fixedly connected to the mounting slot frame (23). An air supply pipe (32) is also provided inside the fixed slot frame (34). The bottom of the air supply pipe (32) is connected to multiple bidirectional exhaust heads (35). The top of the gripping slot frame (6) is provided with a perforated plate (36).

9. The surface treatment apparatus for an integrated circuit lead frame according to claim 8, characterized in that, Multiple curved drainage grooves (37) are provided on the inner bottom wall of the curved mounting frame (4).

10. A method for surface treatment of integrated circuit lead frames, using the surface treatment apparatus for integrated circuit lead frames as described in claim 9, characterized in that, Includes the following steps: Step 1, Ultrasonic cleaning: Place the lead frame on the frame placement platform (3), immerse it in the ultrasonic cleaning tank (2) for ultrasonic cleaning, then remove the lead frame from the ultrasonic cleaning tank (2), grab the multiple lead frames with the grabbing rack (6), and then move them to the curved mounting frame (4), and use the airflow liquid removal component to remove the cleaning liquid from the surface of the lead frame. Step 2, Chemical Cleaning: The bent mounting frame (4) is moved along the direction of the transverse sliding frame (13) to the upper side of the chemical cleaning tank (1). The lead frame is then placed on the frame placement platform (3) in the chemical cleaning tank (1). The lead frame is immersed in the chemical cleaning tank (1) for cleaning. After cleaning, the lead frame is gripped by the gripping frame (6) and then the chemical agent on the surface of the lead frame is removed by the airflow liquid removal component. Step 3, Surface Etching: After cleaning the surface of the lead frame, the lead frame is etched again to optimize the surface structure of the lead frame. Step 4, Electroplating: The lead frame is then electroplated to form an electroplated layer on its surface. Step 5, Surface treatment: Then, the lead frame is passivated and polished.

Images