Darlington circuit with driver amplifier

Abstract

An apparatus for implementing a Darlington circuit with a driver amplifier to provide power clamping is disclosed. In an example aspect, an apparatus includes an amplifier circuit having an input port and an output port. The amplifier circuit includes a driver amplifier, a power amplifier, and a Darlington circuit. The driver amplifier includes a driver amplifier output and a transistor, wherein the driver amplifier is coupled between the input port and the output port. The power amplifier includes a power amplifier input, and the power amplifier is coupled between the driver amplifier output and the output port. The Darlington circuit is coupled to the driver amplifier via a node coupled between the input port and the power amplifier input.

Description

Technical Field

[0001] This disclosure relates in general to signal communication or signal processing using electronic devices, and more specifically to Darlington circuits employing driver amplifiers. Background Technology

[0002] Electronic devices include traditional computing devices such as desktop computers, laptops, smartphones, wearable devices like smartwatches, and internet servers. They also include other types of computing devices such as personal voice assistants (e.g., smart speakers), wireless access points or routers, thermostats and other automation controllers, robots, automotive electronics, devices embedded in other machines such as refrigerators and industrial tools, Internet of Things (IoT) devices, and medical devices. These diverse electronic devices provide services related to productivity, communication, social interaction, security, health and safety, remote management, entertainment, transportation, and information dissemination. Therefore, electronic devices play a vital role in modern society.

[0003] In today's interconnected world, many services provided by electronic devices rely at least in part on electronic communication. Electronic communication may include, for example, the use of one or more networks (such as the Internet, Wi-Fi, etc.). ® Electronic communication refers to the exchange of wireless or wired signals transmitted over a network (or cellular network) between two or more electronic devices. Therefore, electronic communication can include wireless transmission and reception or wired transmission and reception. To transmit and receive communications, electronic devices may use transceivers, such as wireless transceivers designed for wireless communication.

[0004] Therefore, electronic communication can be achieved by transmitting signals between two wireless transceivers at two different electronic devices. For example, using a wireless transmitter, a smartphone can send wireless signals over the air to a base station (as part of uplink communication) to support mobile services. Using a wireless receiver, a smartphone can receive wireless signals transmitted from a base station over the air (as part of downlink communication) to enable mobile services. For smartphones, mobile services may include making voice and video calls, engaging in social media interactions, sending messages, watching movies, sharing videos, and performing searches. Other mobile services may include using map information or navigation instructions, finding friends, generally participating in location-based services, transferring money, obtaining another service such as ride-hailing, and so on.

[0005] Many of these mobile services rely, at least in part, on the transmission or reception of wireless signals between two or more electronic devices. Therefore, researchers, electrical engineers, and designers of electronic devices strive to develop wireless transceivers and other wireless hardware that can effectively utilize wireless signals to provide these and other mobile services. Summary of the Invention

[0006] Power clamps protect components of wireless interface devices. In one approach, a power clamp is employed on a controller die to protect a power amplifier on a different integrated circuit die or chip. However, the routing distance between such a power clamp on the controller die and the power amplifier on the amplifier die is sufficient to reduce the actual power clamping to a level below a target power clamping protection threshold. To shorten this routing distance and at least reduce the difference between the target protection level and the actual protection level, this document describes employing a Darlington circuit with a driver amplifier to provide power clamping, including providing protection for the power amplifier. In an example embodiment, the integrated circuit chip may include an amplifier circuit with a driver amplifier feeding the power amplifier. The integrated circuit chip also includes a Darlington circuit coupled to the driver amplifier via a node, such as a power distribution node for a transistor in the driver amplifier. In example operation, a plurality of diodes and two or more transistors arranged in a Darlington configuration can clamp the voltage level of the node. The Darlington circuit can also clamp the current flowing through the transistor in the driver amplifier. The circuit may additionally provide electrostatic discharge (ESD) protection. Therefore, Darlington circuits can provide power clamping for amplifier circuits, including power clamping for power amplifiers "downstream" coupled to the output of the driver amplifier. Furthermore, power clamping can be achieved with a significantly shorter routing distance between the power clamp and the power amplifier.

[0007] In an example, an apparatus is disclosed. The apparatus includes an amplifier circuit having an input port and an output port. The amplifier circuit includes a driver amplifier, a power amplifier, and a Darlington circuit. The driver amplifier includes a driver amplifier output and a transistor, wherein the driver amplifier is coupled between the input port and the output port. The power amplifier includes a power amplifier input, wherein the power amplifier is coupled between the driver amplifier output and the output port. The Darlington circuit is coupled to the driver amplifier via a node coupled between the input port and the power amplifier input.

[0008] In one example, an apparatus for clamping a voltage with respect to at least one driver amplifier is disclosed. The apparatus includes an amplifier circuit having an input port and an output port. The amplifier circuit includes a driver amplifier having a driver amplifier input, a driver amplifier output, and components for amplifying a signal. The driver amplifier is coupled to the input port via the driver amplifier input. The amplifier circuit also includes a power amplifier having a power amplifier input and a power amplifier output. The power amplifier is coupled to the driver amplifier output via the power amplifier input and to the output port via the power amplifier output. The amplifier circuit also includes components for clamping the supply voltage of the components used for amplifying the signal.

[0009] In an example, a method for clamping power relative to an amplifier circuit via a Darlington circuit, or for operating a power clamping circuit having a Darlington circuit, is disclosed. The method includes receiving a signal at a signal input terminal of an integrated circuit die and receiving a supply voltage at a power input terminal of the integrated circuit die. The method also includes amplifying the signal using a driver amplifier and the supply voltage to generate a first amplified signal. The method additionally includes amplifying an intermediate signal using a power amplifier to generate a second amplified signal, the intermediate signal being at least based on the first amplified signal. The method further includes clamping the supply voltage using two or more transistors coupled together in a Darlington transistor arrangement. Attached Figure Description

[0010] Figure 1 An environment with an example electronic device is illustrated, the example electronic device having a wireless interface device, the wireless interface device including at least one example amplifier circuit with Darlington circuitry.

[0011] Figure 2 These are schematic diagrams illustrating example radio frequency (RF) front-ends and example transceivers, each of which may include at least one amplifier circuit having a Darlington circuit.

[0012] Figure 3 This is a schematic diagram illustrating an example amplifier die including an amplifier circuit, which includes a driver amplifier and a power amplifier, as well as a Darlington circuit coupled to the driver amplifier.

[0013] Figure 4 This is a circuit diagram illustrating an example Darlington circuit that can be coupled to an amplifier circuit.

[0014] Figure 5 This is a circuit diagram illustrating an example amplifier circuit with a driver amplifier and a power amplifier, and multiple example nodes with Darlington circuitry that can be coupled thereto.

[0015] Figure 6 This is a flowchart illustrating an example process for clamping power relative to an amplifier circuit via a Darlington circuit or for operating power clamping with a Darlington circuit. Detailed Implementation

[0016] Introduction and Overview To facilitate the transmission and reception of wireless signals, electronic devices may use wireless interface devices, including wireless transceivers and / or radio frequency (RF) front-ends. Wireless interface devices comprise various electrical and electronic components that operate based on voltage and current and use such voltages and currents to process signals. These components are designed to operate within specified voltage and current ranges. If operating conditions deviate from these specified ranges, the components may generate fault signaling. Furthermore, deviations from specified operating conditions may damage the components, especially if the operating current or voltage exceeds the corresponding specified range.

[0017] To protect components of a circuit, such as transistors used for amplification or switching, the circuit may include a power clamp. A power clamp prevents the power experienced by a component from exceeding the power that would damage it. For this purpose, a power clamp may limit voltage levels or current values. This may include limiting voltage and current according to a permissible but optional interpretation of the word "or" to cover an inclusive "OR" relationship. In some cases, a power clamp may be used to provide, for example, overvoltage protection or electrostatic discharge (ESD) protection.

[0018] In some wireless interface device environments, at least a portion of the control functionality is decoupled from the amplifier functionality. For example, the controller die may be decoupled from the amplifier die. The controller die may be implemented using complementary metal-oxide-semiconductor (CMOS) or silicon-on-insulator (SOI) process technologies. The amplifier die includes amplification circuitry, which may include a driver amplifier and a power amplifier. The controller die may modulate signals (such as radio frequency (RF) signals) before they are amplified by the power amplifier using, for example, a filter or pre-driver amplifier.

[0019] In one approach to protecting circuitry components, an input clamp is deployed at the controller die to meet the power protection specifications of the controller die and amplifier die assembly. However, with the input clamp on the controller die, the RF input signal routing is relatively extensive. The RF input signal enters the controller die and propagates through multiple blocks or stages to regulate the signal. These blocks may include input attenuators, input clamps, input switches, pre-driver amplifiers, and so on. The regulated RF signal then leaves the controller die and travels to the amplifier die, which contains the power amplifier. This significant routing distance introduces problems for the RF signal. First, the routing distance degrades the quality of the signal itself (e.g., by altering the signal's phase). Second, the routing distance shifts the designed target power clamp protection threshold to an actual power clamp protection threshold that may be lower than the target threshold.

[0020] This makes the components of the amplifier die (including the power amplifier) ​​susceptible to damage from voltages and currents exceeding specified limits. Consequently, the power amplifier circuitry may be damaged, and the die may become unusable. The discovery of unusable dies during testing at the manufacturing facility results in financial losses. Furthermore, damaged dies cause even greater damage after deployment in electronic devices, as the entire device (such as a cell phone) may become inoperable and be returned by the customer.

[0021] To at least reduce this routing distance between the input power clamp and the power amplifier, this document describes alternative methods for protecting circuit components, wherein the power clamp is incorporated into an integrated circuit die having a driver amplifier or power amplifier. This amplifier die can be implemented using, for example, gallium arsenide (GaAs) semiconductor technology. The power clamp may be coupled to a node of the amplifier circuitry of the amplifier die. In some cases, the amplifier circuitry includes a driver amplifier that feeds the power amplifier. A node may be associated with the driver amplifier. For example, a node may correspond to a power distribution node of a transistor in the driver amplifier or a channel terminal of a transistor in the driver amplifier.

[0022] In some implementations, power clamping can be implemented using a Darlington circuit. A Darlington circuit includes two or more transistors coupled together in a Darlington arrangement between a node associated with a driver amplifier and another node, such as another power distribution node. The Darlington circuit may also include multiple diodes coupled in series. The number of diodes connected in series can at least partially establish the trigger point for the power clamp. The Darlington circuit can limit the voltage level at the node or the amount of current flowing through the node to the transistors of the driver amplifier based on the trigger point. The Darlington circuit may also include one or more other diodes coupled in series in opposite directions to prevent opposing voltages.

[0023] Therefore, some of the described specific implementations include an input power clamp disposed on the same die as the power amplifier, which is part of the amplification circuit. The power clamp can be implemented using a Darlington circuit or coupled to a driver amplifier of the amplification circuit. The Darlington circuit of the power clamp can provide ESD protection at the driver stage amplifier. The Darlington circuit can also operate as a voltage or current clamp at the driver stage amplifier. Thus, this clamping at the driver amplifier limits the input power to the power amplifier, which, from a signal flow or signal processing perspective, "follows" the driver amplifier.

[0024] The on-die power clamping method described herein provides a significantly shorter routing distance along the RF signal chain between the power clamp and the power amplifier. This shorter routing distance is achieved without significantly increasing the size of the amplifier die. Therefore, the target power clamping protection threshold can be achieved more definitively at the power amplifier with less signal degradation. Furthermore, the overall product cost is reduced by omitting or removing the power clamp from the controller die.

[0025] Therefore, a Darlington circuit can be coupled to a driver amplifier stage cell (e.g., via the collector terminal of a heterojunction bipolar transistor (HBT) or the drain terminal of a field-effect transistor (FET)) to provide input clamping functionality. An example implementation of a Darlington circuit-based power clamp can provide power clamping capability at the input of a power amplifier via a driver amplifier. Furthermore, as the power supply voltage (e.g., Vcc) increases, a stronger clamping effect can be forced or achieved, providing excellent protection. Compared to the controller die approach presented above, the amplifier die approach with a Darlington circuit also provides superior ESD ratings, at least according to the Human Body Model (HBM) of ESD protection. Additional example implementations for providing power clamping protection using a Darlington circuit with a driver amplifier are described herein.

[0026] Description Example Figure 1 An example environment 100 is illustrated with electronic device 102 having a wireless interface device 120, which includes at least one example amplifier circuit 130 having a Darlington circuit 138. This document describes an example specific implementation of the amplifier circuit 130, which may be part of a transceiver, radio frequency front-end (RFFE), etc., of a device. In environment 100, example electronic device 102 communicates with base station 104 via wireless link 106.

[0027] exist Figure 1In this design, electronic device 102 is depicted as a smartphone. However, electronic device 102 can be implemented as any suitable computing device or other electronic device. Examples of devices that can be implemented as electronic device 102 include cellular base stations, broadband routers, access points, cellular or mobile phones, gaming devices, navigation devices, media devices, laptop computers, desktop computers, tablet computers, server computers, network attached storage (NAS) devices, smart appliances, vehicle-based communication systems, Internet of Things (IoT) devices, sensor or security devices, asset trackers, fitness management devices, wearable devices such as smart glasses or smartwatches, wireless power devices (transmitters or receivers), medical devices, and the like.

[0028] Base station 104 communicates with electronic device 102 via wireless link 106, which can be implemented as any suitable type of wireless link carrying communication signals. Although depicted as a base station tower of a cellular radio network, base station 104 can be represented or implemented as another device, such as a satellite, terrestrial broadcast tower, access point, peer-to-peer device, mesh network node, fiber optic interface, or another electronic device generally as described above. Therefore, wireless link 106 or its extensions can be connected between electronic device 102 and base station 104 in any of a variety of ways.

[0029] Wireless link 106 may include a downlink that transmits data or control information from base station 104 to electronic device 102. Wireless link 106 may also include an uplink that transmits other data or control information from electronic device 102 to base station 104. Wireless link 106 may be implemented using any suitable wireless communication protocol or standard. Examples of such protocols and standards include 3GPP Long Term Evolution (LTE) standards, such as 4G, 5G, or 6G cellular standards; IEEE 802.11 standards, such as 802.11g, ac, ax, ad, aj, or ay standards (e.g., Wi-Fi). ® 6 or WiGig ® ); IEEE 802.16 standard (e.g., WiMAX) ® );Bluetooth ® Standards; Ultra-wideband (UWB) standards (e.g., IEEE 802.15.4); etc. In some implementations, the wireless link 106 may provide power wirelessly, and the electronic device 102 or base station 104 may include a power source.

[0030] As shown with respect to some specific embodiments, electronic device 102 may include at least one application processor 108 and at least one computer-readable storage medium 110 (CRM 110). Application processor 108 may include any type of processor, such as a central processing unit (CPU) or a multi-core processor, configured to execute processor-executable instructions (e.g., code) stored in CRM 110. CRM 110 may include any suitable type of data storage medium, such as volatile memory (e.g., random access memory (RAM)), non-volatile memory (e.g., flash memory), optical media, magnetic media (e.g., magnetic disk or magnetic tape), etc. In the context of this disclosure, CRM 110 is implemented to store instructions 112, data 114, and other information of electronic device 102, and therefore CRM 110 does not include transiently propagated signals or carrier waves.

[0031] Electronic device 102 may also include one or more input / output ports 116 (I / O ports 116) and at least one display 118. The I / O ports 116 enable data exchange or interaction with other devices, networks, or users. The I / O ports 116 may include serial ports (e.g., Universal Serial Bus (USB)). ® Display 118 may include ports such as parallel ports, Ethernet ports, audio ports, infrared (IR) ports, camera ports, or other sensor ports. Display 118 may be implemented as a display screen or projection that presents graphical images provided by other components of electronic device 102, such as a user interface (UI) associated with an operating system, program, or application. Alternatively or additionally, display 118 may be implemented as a display port or virtual interface through which graphical content of electronic device 102 is conveyed or presented.

[0032] Electronic device 102 also includes at least one wireless interface device 120 and at least one antenna 122. Example wireless interface device 120 provides connectivity to appropriate networks and peer devices via a wireless link, which may be configured similarly or differently from wireless link 106. Wireless interface device 120 can facilitate communication over any suitable type of wireless network, such as wireless local area network (LAN) (WLAN), wireless personal area network (PAN) (WPAN), peer-to-peer (P2P) network, mesh network, cellular network, wireless wide area network (WAN) (WWAN), and / or navigation network (e.g., North American Global Positioning System (GPS) or another Satellite Positioning System (SPS) or Global Navigation Satellite System (GNSS)). In the context of example environment 100, electronic device 102 can bidirectionally communicate various data and control information with base station 104 via wireless interface device 120. However, electronic device 102 can communicate directly with other peer devices, alternative wireless networks, etc. Additionally, as described above, electronic device 102 may alternatively be implemented as base station 104 or another device as described herein.

[0033] As shown, the wireless interface device 120 may include at least one communication processor 124, at least one transceiver 126 (e.g., a wireless transceiver 126), and at least one radio frequency front-end 128 (RFFE 128). These components process data information, control information, and signals associated with transmitting information to the electronic device 102 via antenna 122. The communication processor 124 may be implemented as at least a portion of a system-on-chip (SoC), a modem processor, or a baseband radio processor (BBP) that implements a digital communication interface for data, voice, message sending and receiving, or other applications of the electronic device 102. The communication processor 124 may include a digital signal processor (DSP) or one or more signal processing blocks (not shown) for encoding and modulating data for transmission and for demodulating and decoding received data. Additionally, the communication processor 124 may also manage (e.g., control or configure) aspects or operations of the transceiver 126, the RF front-end 128, and other components of the wireless interface device 120 to implement various communication protocols or communication technologies.

[0034] In some cases, application processor 108 and communication processor 124 may be combined into a single module or integrated circuit (IC), such as a SoC. Regardless, application processor 108, communication processor 124, or a processor may be substantially operatively coupled to one or more other components (such as CRM 110 or display 118) to enable control of various components of electronic device 102 or other interactions with those components. For example, at least one processor 108 or 124 may present one or more graphic images on a display screen embodiment of display 118 based on one or more wireless signals transmitted or received by a component of wireless interface device 120 via at least one antenna 122. Furthermore, application processor 108 or communication processor 124 (including combinations thereof) may be implemented using digital circuitry that implements the logic or functionality described herein. Additionally, communication processor 124 may also include memory (not depicted separately) for storing data and processor-executable instructions (e.g., code), such as the same or another CRM 110, or associated with it.

[0035] As shown, the wireless interface device 120 may include at least one amplifier circuit 130 (or amplifier circuit 130) as described below. More specifically, transceiver 126 may include at least one amplifier circuit 130-2, or RF front end 128 may include at least one amplifier circuit 130-1 (subject to the optional but permissible inclusion or interpretation of the word "or," including both components may have at least one amplifier circuit 130). Transceiver 126 may also include circuitry and logic for filtering, switching, amplification, channelization, frequency conversion, etc. Frequency conversion functionality may include up-conversion or down-conversion of frequencies performed by a single conversion operation (e.g., using a direct conversion architecture) or by multiple conversion operations (e.g., using a superheterodyne architecture). Generally, transceiver 126 may include filters, switches, amplifiers, mixers, etc., for routing and conditioning signals transmitted or received via antenna 122.

[0036] In addition to amplifier circuit 130-2, transceiver 126 may also include analog-to-digital converter (ADC) or digital-to-analog converter (DAC). Figure 1 (Not shown in the diagram). In operation, the ADC converts an analog signal to a digital signal, and the DAC converts a digital signal to an analog signal. Generally, the ADC or DAC may be implemented as part of the communication processor 124, as part of the transceiver 126, or separately from both (e.g., as another part of the SoC or as part of the application processor 108).

[0037] The components or circuitry of transceiver 126 can be implemented in any suitable manner, such as utilizing combined transceiver logic or individually as respective transmitter and receiver entities. In some cases, transceiver 126 is implemented using multiple or different parts to perform the corresponding transmit and receive operations (e.g., using...). Figure 2 (Implemented by separate send and receive chains as described in the text). Although in Figure 1 Although not shown, transceiver 126 may also include logic for performing in-phase / quadrature (I / Q) operations such as combining, phase correction, modulation, demodulation, etc.

[0038] RF front-end 128 may include one or more filters, multiple switches, or one or more amplifiers (such as amplifier circuit 130-1) for conditioning signals received via antenna 122 or for conditioning signals to be transmitted via antenna 122. RF front-end 128 may also include a phase shifter (PS), a peak detector, a power meter, a gain control block, and antenna tuning circuitry. n Multiplexers, baluns, etc. Configurable components of the RF front end 128 (such as phase shifters, automatic gain controllers (AGCs), or switches) can be controlled by the communication processor 124 to enable communication in various modes, communication utilizing different frequency bands and / or carrier aggregation (CA), or communication using beamforming.

[0039] In some implementations, antenna 122 is implemented as at least one antenna array comprising multiple antenna elements. Therefore, as used herein, “antenna” can refer to at least one discrete or separate antenna, at least one antenna array comprising multiple antenna elements, or a portion of an antenna array (e.g., an antenna element), depending on the context or implementation. At least one antenna 122 can also be part of a module comprising one or more other components of RF front-end 128 (e.g., amplifier circuitry 130-1 or a filter), or at least one antenna 122 can be a separate component.

[0040] exist Figure 1In this context, the example amplifier circuit 130 is depicted as having amplifier circuit 130-2 as part of transceiver 126, amplifier circuit 130-1 as part of RF front-end 128, and so on. However, the specific implementations of amplifier circuit 130 described herein may additionally or alternatively be used in other parts of wireless interface device 120 or other parts of electronic device 102. As explained above, amplifier circuit 130 may be included in electronic devices other than cellular phones, such as base station 104. For base stations (or mobile phones), by way of example only, the transmit or receive chain of the intermediate frequency (IF) portion of wireless interface device 120 and / or RF front-end 128 may include amplifier circuit 130 as described herein. Other electronic devices that may employ amplifier circuit 130 include laptops, communication hardware for vehicles, wireless access points, and so on, as described herein.

[0041] In an exemplary embodiment, amplifier circuit 130 may include at least one port 132, such as input port 132-1 and output port 132-2 (or more generally, a first port 132-1 and a second port 132-2). As illustrated, amplifier circuit 130 may include at least one driver amplifier 134, at least one power amplifier 136, and at least one Darlington circuit 138. In some cases, driver amplifier 134 and power amplifier 136 are coupled in series between input port 132-1 and output port 132-2. As shown, driver amplifier 134 may be coupled closer to input port 132-1 than power amplifier 136, and power amplifier 136 may be coupled closer to output port 132-2 than driver amplifier 134. Therefore, driver amplifier 134 may be coupled between input port 132-1 and power amplifier 136, and power amplifier 136 may be coupled between driver amplifier 134 and output port 132-2. Darlington circuit 138 can be coupled to driver amplifier 134 to provide power clamping functionality for one or more portions, cells, or stages of amplifier circuit 130.

[0042] As depicted, the signal flow can proceed from input port 132-1 to driver amplifier 134 and through it. A first amplified signal can propagate from driver amplifier 134 to power amplifier 136 and through it. A second amplified signal output from power amplifier 136 can travel to output port 132-2. This document primarily describes the two amplifiers of amplifier circuit 130 with respect to driver amplifier 134 and power amplifier 136. However, two or more amplifiers protected by Darlington circuit 138 may generally be referred to as the first amplifier and the second amplifier. Such other amplifiers can be or include any type of amplifier for any purpose, such as low-noise amplifiers, operational amplifiers, amplifiers of any given class, combinations thereof, etc.

[0043] Despite Figure 1 In China (and in Figures 2 to 5 The diagram explicitly depicts a specific number and arrangement of components, but amplifier circuit 130 may include more or fewer of any such components, as well as other components not shown. Furthermore, components may be arranged and interconnected in different ways. Reference is made below to several figures (from...). Figure 3 and Figure 4 (Beginning) This document describes an example specific implementation of the Darlington circuit 138 and at least one node coupled thereto. However, the following references... Figure 2 Example implementations of the transceiver and RF front end are described.

[0044] Figure 2 Each of these examples may include a Darlington circuit 138 ( Figure 2 A schematic diagram 200 of at least one amplifier circuit 130 (not shown) includes an example RF front end 128 and an example transceiver 126. Figure 2 Antenna 122 and communication processor 124 are also depicted. Communication processor 124 transmits one or more data signals to other components (such as...). Figure 1 The application processor 108 is used for further processing at 224 (e.g., for processing at the application level). As shown, circuit 200 may include a first amplifier circuit 130-1, a second amplifier circuit 130-2, a third amplifier circuit 130-3, or a fourth amplifier circuit 130-4, including one to four such amplifier circuits. However, circuit 200 may include different numbers of amplifiers (e.g., more or fewer amplifier circuits), may include amplifiers or other components coupled together in different ways, may include amplifiers in different locations, may include amplifiers implemented using two or more stages, some combination thereof, etc.

[0045] As illustrated from left to right, in the example implementation, antenna 122 is coupled to RF front-end 128, and RF front-end 128 is coupled to transceiver 126. Transceiver 126 is coupled to communication processor 124. The example RF front-end 128 includes at least one signal propagation path 222. The at least one signal propagation path 222 may include at least one amplifier circuit 130, such as amplifier circuit 130-1 and amplifier circuit 130-3. The example wireless transceiver 126 includes at least one receive chain 202 (or receive path 202) and at least one transmit chain 252 (or transmit path 252). Although only one RF front-end 128, one transceiver 126, and one communication processor 124 are shown at circuit 200, electronic device 102 or its wireless interface device 120 may include multiple instances of any or all of these components. Additionally, although... Figure 2 Only certain components are explicitly depicted and shown as coupled together in a particular manner, but transceiver 126 or RF front end 128 may include other unillustrated components (e.g., switches or buffers), more or fewer components, component arrangements coupled in different ways, and so on.

[0046] In some implementations, the RF front-end 128 couples the antenna 122 to the transceiver 126 via a signal propagation path 222. In operation, the signal propagation path 222 carries a signal between the antenna 122 and the transceiver 126. During or as part of signal propagation, the signal propagation path 222 may modulate the propagating signal, for example, using amplifier circuitry 130-1 or 130-3. This enables the RF front-end 128 to couple the wireless signal 220 from the antenna 122 to the transceiver 126 as part of a reception operation. The RF front-end 128 also enables the transmission signal to be coupled from the transceiver 126 to the antenna 122 as part of a transmission operation to transmit the wireless signal 220. Although Figure 2 Not explicitly shown, but the RF front end 128 or its signal propagation path 222 may include one or more other components, such as another amplifier (e.g., a driver amplifier, power amplifier, or low-noise amplifier), filters, n Multiplexers, phase shifters, dual-signal devices, one or more switches, etc.

[0047] In some implementations, transceiver 126 may include at least one receive chain 202, at least one transmit chain 252, or at least one receive chain 202 and at least one transmit chain 252. From left to right, receive chain 202 may include a low-noise amplifier 204 (LNA 204), a filter 206, a mixer 208 for frequency down-conversion, and an ADC 210. Transmit chain 252 may include a power amplifier 254 (PA 254), a filter 256, a mixer 258 for frequency up-conversion, and a DAC 260. However, receive chain 202 or transmit chain 252 may include other components, such as additional amplifiers or filters, multiple mixers, one or more buffers, or at least one local oscillator, which may be electrically or electromagnetically positioned anywhere along the depicted receive and transmit chains.

[0048] The receive chain 202 is coupled between the signal propagation path 222 of the RF front-end 128 and the communication processor 124, for example, via a low-noise amplifier 204 and an ADC 210. The transmit chain 252 is coupled between the signal propagation path 222 and the communication processor 124, for example, via a power amplifier 254 and a DAC 260. The transceiver 126 may also include at least one phase-locked loop 232 (PLL 232) coupled to the mixer 208 or the mixer 258. For example, the transceiver 126 may include one PLL 232 for each transmit chain / receive chain pair, one PLL 232 for each transmit chain, one PLL 232 for each receive chain, multiple PLL 232 per chain, etc.

[0049] As shown in some example implementations of the receive chain 202 along the signal propagation direction, antenna 122 is coupled to low-noise amplifier 204 via signal propagation path 222 and its amplifier circuit 130-3. Low-noise amplifier 204 is coupled to filter 206. Filter 206 is coupled to mixer 208, and mixer 208 is coupled to ADC 210. ADC 210 is then coupled to communication processor 124. As shown in some example implementations of the transmit chain 252 along the signal propagation direction, communication processor 124 is coupled to DAC 260, and DAC 260 is coupled to mixer 258. Mixer 258 is coupled to filter 256, and filter 256 is coupled to power amplifier 254. Power amplifier 254 is coupled to antenna 122 via amplifier circuit 130-1 of signal propagation path 222. Although only one receive chain 202 and one transmit chain 252 are explicitly shown, the electronic device 102 or its transceiver 126 may include multiple instances of any one or both components. Although the ADC 210 and DAC 260 are illustrated as being individually coupled to the communication processor 124, they may share a bus or other mechanism for communicating with the processor 124. Furthermore, the ADC 210 or DAC 260 may be part of the communication processor 124 or separate from the transceiver 126 and the communication processor 124.

[0050] As part of the example signal reception operation, amplifier circuit 130-3 of signal propagation path 222 amplifies the received signal and forwards the amplified signal to low-noise amplifier 204. Low-noise amplifier 204 receives the amplified signal from RF front-end 128 and, based on the received signal, provides another amplified signal to filter 206. Filter 206 filters the other amplified signal and provides the filtered signal to mixer 208. Mixer 208 performs frequency conversion on the filtered signal to down-convert from one frequency to a lower frequency (e.g., from radio frequency (RF) to intermediate frequency (IF), or from RF or IF to baseband frequency (BBF)). Mixer 208 may use at least one PLL 232 to perform frequency down-conversion in a single conversion step or through multiple conversion steps. Mixer 208 may provide the down-converted signal to ADC 210 for conversion and forward as a digital signal to communication processor 124.

[0051] As part of the example signal transmission operation, mixer 258 receives an analog signal at BBF from DAC 260 (or, if the signal has already been up-converted once by another mixer (not shown)). Mixer 258 upconverts the analog signal to a higher frequency (such as upconverting to an RF frequency) to generate an RF signal with a target synthesized frequency using the signal generated by PLL 232. Mixer 258 provides the RF or other upconverted signal to filter 256. Filter 256 filters the RF signal and provides the filtered signal to power amplifier 254. Thus, after being filtered by filter 256, power amplifier 254 amplifies the filtered signal and provides the amplified signal to signal propagation path 222 for signal conditioning. RF front-end 128 may use, for example, amplifier circuit 130-1 of signal propagation path 222 to provide another amplified signal to antenna 122 for transmission as wireless signal 220.

[0052] As described herein, example implementations of amplifier circuit 130 may be used at any or more of example amplifier circuits 130-1, 130-2, 130-3, or 130-4 in transceiver 126 or RF front end 128, or at other amplifiers in electronic device 102. Figure 2 (Not shown in the image). In some cases, if the first amplifier circuit 130-1 of the RF front end 128 includes (e.g., Figure 1 and Figure 3 If the transceiver 126 omits the power amplifier 254 or an "alternative" driver amplifier or its pre-driver amplifier, then the transceiver 126 may omit the power amplifier 254. Additionally or alternatively, the second amplifier circuit 130-2 may include a driver amplifier and a Darlington circuit 138 combined with the depicted power amplifier 254. Figure 2 (Not shown in the text).

[0053] In some cases, the third amplifier circuit 130-3 of the RF front-end 128 includes two or more amplifiers combined with the Darlington circuit 138. At least one of these two or more amplifiers may be implemented as a low-noise amplifier for receiving signal processing. Additionally or alternatively, the fourth amplifier circuit 130-4 may include a driver amplifier combined with the depicted low-noise amplifier 204 and the Darlington circuit 138. Figure 2 (Not shown in the image). Alternatively, the fourth amplifier circuit 130-4 may include multiple low-noise amplifiers combined with the Darlington circuit 138, which provides clamping functionality. Generally, the amplifier circuit 130 with the Darlington circuit 138 can be deployed anywhere within the transceiver 126, the RF front-end 128, another part of the wireless interface device 120, or another part of the electronic device 102.

[0054] However, circuit 200 only depicts some examples for transceiver 126 and / or RF front-end 128. In some cases, the various components illustrated using separate schematic boxes or circuit elements in the figures may be manufactured or packaged in different discrete ways. For example, one physical module may include components of RF front-end 128 and a portion of components of transceiver 126, and another physical module may combine communication processor 124 with the remaining components of transceiver 126. Furthermore, in some cases, antenna 122 may be co-packaged with at least some components of RF front-end 128 (e.g., co-packaged with amplifier circuitry 130 and at least one filter) or co-packaged with those components of transceiver 126. Although Figure 2 Some amplifiers in the circuit are described as potentially including Darlington circuit 138 as described herein. Figure 2 The amplifier circuit 130 (not shown) may be implemented without the Darlington circuit 138, but any one or more such amplifier circuits may be implemented in a different manner or as an amplifier circuit that clamps voltage or current in a different way.

[0055] In additional or alternative embodiments, one or more components may be physically or logically “relocated” to different parts of the wireless interface device 120 compared to the illustrated circuitry 200, and / or may be incorporated into different modules. For example, a low-noise amplifier 204 or a power amplifier 254 may be alternatively or additionally deployed in the RF front end 128, such as as at least part of amplifier circuitry 130-3 or amplifier circuitry 130-1, respectively. Reference will be made to the following... Figure 3 An example of an amplifier circuit 130-1 with a power amplifier 136 (or power amplifier 254) is described.

[0056] Figure 3 This is a schematic diagram 300 illustrating an example amplifier die 304 including amplifier circuitry 130, which includes a driver amplifier 134 and a power amplifier 136, and a Darlington circuit 138 coupled to the driver amplifier 134. As illustrated, schematic diagram 300 includes a controller die 302 and an amplifier die 304. The controller die 302 and the amplifier die 304 may be (e.g., Figure 1 and Figure 2 The communication processor 124 and (e.g., Figure 1 and Figure 2 The antennas 122 are coupled together in series. More generally, the two individual dies or integrated circuit chips may be referred to as the first die and the second die.

[0057] In the example operation, the input of controller die 302 receives signals from communication processor 124. Although Figure 3Not shown, but other components (e.g., mixers or filters) may be coupled between the communication processor 124 and the input of the controller die 302. The output of the controller die 302 generates a regulated signal 318, which is coupled to the input of the amplifier die 304. After amplification, the amplifier die 304 provides an amplified signal 328 at its output. The amplified signal 328 can be relayed to the antenna 122. Although... Figure 3 Not shown, but other components (e.g., mode switches, filters, or front-end modules (FEMs)) may be coupled between the output of amplifier die 304 and antenna 122.

[0058] As shown in the figure, the controller die 302 includes at least one attenuator 312 (ATT 312), at least one pre-driver amplifier 314 (PDA 314), and at least one output matching network 316 (OMN 316). The attenuator 312, pre-driver amplifier 314, and output matching network 316 are coupled together in series between the input and output of the controller die 302. However, the controller die 302 may include more, fewer, or different components. The depicted components and other components may be arranged and coupled in a similar or different manner to those depicted.

[0059] In one approach, a power clamp may be coupled between attenuator 312 and pre-driver amplifier 314. This power clamp may limit the power input to downstream power amplifier 136. However, as described above, the relatively long signal path between pre-driver amplifier 314 of controller die 302 and power amplifier 136 of amplifier die 304 creates signaling problems. These problems include signal degradation and failure to reach the target power clamping protection threshold at power amplifier 136.

[0060] In a specific embodiment of the example, to at least partially mitigate these problems, this document describes incorporating a Darlington circuit 138 as at least part of a power clamp 310 at the driver amplifier 134 on the amplifier die 304. The Darlington circuit 138 can provide power clamping relative to the power supplied to the driver amplifier 134 relative to the integrated circuit die. The amplifier die 304 may include an input matching network 322 (IMN 322), an amplifier circuit 130, and an output matching network 326 (OMN 326). The input matching network 322, the amplifier circuit 130, and the output matching network 326 may be coupled together in series between the input and output terminals of the amplifier die 304.

[0061] As shown, input matching network 322 may be coupled between the input terminal of amplifier die 304 and amplifier circuit 130 (e.g., via input port 132-1). Output matching network 326 may be coupled between amplifier circuit 130 (e.g., via output port 132-2) and the output terminal of amplifier die 304. Furthermore, amplifier circuit 130 may be coupled between input matching network 322 and output matching network 326. However, amplifier die 304 may include more, fewer, or different components. The depicted components and other components may be arranged and coupled in a similar or different manner compared to the way they are arranged and coupled together.

[0062] As illustrated, amplifier circuit 130 includes at least one driver amplifier 134, at least one power amplifier 136, and at least one interstage matching network 324 (ISMN 324). In some cases, driver amplifier 134, interstage matching network 324, and power amplifier 136 are coupled in series between input port 132-1 and output port 132-2 of amplifier circuit 130. As shown, driver amplifier 134 may be coupled closer to input port 132-1 than power amplifier 136, and power amplifier 136 may be coupled closer to output port 132-2 than driver amplifier 134. Therefore, driver amplifier 134 may be coupled between input port 132-1 and power amplifier 136, and power amplifier 136 may be coupled between driver amplifier 134 and output port 132-2.

[0063] Interstage matching network 324 can be coupled between two stages: a first stage corresponding to driver amplifier 134 and a second stage corresponding to power amplifier 136. Therefore, driver amplifier 134 can be coupled between input port 132-1 and interstage matching network 324. Power amplifier 136 can be coupled between interstage matching network 324 and output port 132-2.

[0064] Darlington circuit 138 may be coupled to driver amplifier 134 to provide power clamping functionality for one or more portions, cells, stages, or components of amplifier circuit 130. For example, as at least part of power clamp 310, Darlington circuit 138 may provide power protection for downstream components, including power protection for the input of power amplifier 136. Darlington circuit 138 may be coupled to, for example, a power distribution node that supplies power to at least one transistor of driver amplifier 134, terminals of at least one transistor of driver amplifier 134, some combination thereof, etc. Reference below. Figure 4 and Figure 5 Describe an example coupling between Darlington circuit 138 and driver amplifier 134.

[0065] As depicted, the signal flow can proceed from input port 132-1 to driver amplifier 134 and through it. Driver amplifier 134 generates a first amplified signal 332-1. The first amplified signal 332-1 can propagate from driver amplifier 134 through interstage matching network 324 to power amplifier 136, which generates a second amplified signal 332-2. The second amplified signal 332-2 output from power amplifier 136 can travel to output port 132-2 and output matching network 326.

[0066] This document primarily describes the two amplifiers of amplifier circuit 130 with regard to driver amplifier 134 and power amplifier 136. However, two or more amplifiers protected by Darlington circuit 138 may generally be referred to as the first amplifier and the second amplifier. Such other amplifiers may be or may include any type of amplifier for any purpose, such as low-noise amplifiers, operational amplifiers, amplifiers of any given class, combinations thereof, etc.

[0067] Figure 4 This is an example of coupling to (e.g., Figure 1 and Figure 3 A circuit diagram 400 shows an example Darlington circuit 138 for the driver amplifier 134 of the amplifier circuit 130. The Darlington circuit 138 includes at least two nodes that can be used, for example, to couple the Darlington circuit 138 to a larger circuit via the driver amplifier 134. These at least two nodes include a first node 402-1 and a second node 402-2. See below for reference. Figure 4 And further reference Figure 5 Describe the example circuit connector.

[0068] In the example implementation, the Darlington circuit 138 includes two or more transistors 404, which are coupled together in a Darlington transistor arrangement or Darlington configuration 408. For example, the channel terminal of the first transistor (e.g., on the left side, as shown) Figure 4 (As depicted) can be coupled to the control terminal of the second transistor (e.g., on the right side, as shown in the image). Figure 4 (As depicted in the figure). Furthermore, another channel terminal of the first transistor can be coupled to a channel terminal of the second transistor. A set of transistors coupled together in a Darlington transistor arrangement can have two transistors (e.g., a Darlington pair) as shown, or it can have more than two transistors. Generally, the Darlington configuration 408 for multiple transistors allows the first current amplified by the first transistor to be amplified again by the second transistor into a second current. Therefore, the total current gain can be greater than the current gain of any single transistor.

[0069] This document describes several transistors, and several transistors are depicted in associated figures, which are incorporated herein by reference. These transistors can be implemented in different ways or as different transistor types. Example transistor types include field-effect transistors (FETs), junction FETs (JFETs), metal-oxide-semiconductor FETs (MOSFETs), bipolar junction transistors (BJTs), insulated-gate bipolar transistors (IGBTs), heterojunction bipolar transistors (HBTs), combinations thereof, and so on. Manufacturers can fabricate FETs as n-channel or p-channel transistor types and can fabricate BJTs as NPN or PNP transistor types. Heterojunction bipolar transistors (HBTs) can be considered as a form or subset of bipolar junction transistors (BJTs). Although some transistors are depicted as HBTs in the figures, one or more of these transistors can be implemented as different transistor types.

[0070] Each transistor may include at least one control terminal and one or more channel terminals. For a FET, the control terminal may correspond to the gate terminal, and the channel terminal may correspond to either the source terminal or the drain terminal. For a BJT (including an HBT), the control terminal may correspond to the base terminal, and the channel terminal may correspond to either the emitter terminal or the collector terminal.

[0071] In the Darlington configuration 408, the emitter (or source) terminal of the first transistor is coupled to the base (or gate) terminal of the second transistor. The base (or gate) terminal of the first transistor acts as the base (or gate) terminal of the Darlington transistor arrangement and can serve as an input terminal. The emitter (or source) terminal of the second transistor acts as the emitter (or source) terminal of the Darlington transistor arrangement and can provide output current.

[0072] Continue to refer to Figure 4 Two or more diodes 406 may be coupled in series between a first node 402-1 and the base terminal (or gate terminal) of a Darlington configuration 408 of two or more transistors 404. The number of diodes in these two or more diodes 406 may at least partially set the voltage level that triggers the protection of the Darlington circuit 138. For example, the voltage drop across each diode (which may depend on the material or process technology) multiplied by the number of diodes establishes the voltage level that turns on the two or more transistors 404 of the Darlington configuration 408. Thus, the protection implemented using the Darlington circuit 138 as described herein (e.g., Figure 3 The power clamp 310 can be designed for different power levels. This can be achieved, at least in part, by deploying different numbers of trigger diodes for two or more diodes 406 to establish a clamping voltage implemented by the Darlington circuit 138.

[0073] At least one diode 412 and at least one resistor 414 are shown in series coupled between the base terminal (or gate terminal) of the Darlington configuration 408 and the second node 402-2. The resistance value of resistor 414 can also at least partially set the trigger voltage at which clamping protection begins. Generally, as the resistance value of resistor 414 increases, the trigger voltage that initiates clamping decreases. Another diode 416 is shown coupled between the first node 402-1 of the Darlington circuit 138 and the terminals of the Darlington configuration 408 (such as the collector terminal (or drain terminal) of the Darlington configuration 408). For example, diode 416 can be omitted while maintaining satisfactory transient performance through the Darlington circuit 138. However, the presence of diode 416 keeps the voltage swing on the Darlington transistor arrangement low, which protects the Darlington configuration 408 and extends its lifespan.

[0074] One or more diodes 422 are shown coupled in series between a first node 402-1 and a second node 402-2. However, these one or more diodes 422 are coupled in the opposite direction to those of the two or more diodes 406. Therefore, these diodes of the one or more diodes 422 can provide protection against voltages of opposite signs (e.g., protection against negative voltages if the first node 402-1 is coupled to a positive supply voltage).

[0075] Like other components depicted as part of the Darlington circuit 138 (other than at least two transistors 404), diode 422 may be omitted from the Darlington circuit 138, or may be coupled to the Darlington configuration 408 while being separate from the Darlington circuit 138. Furthermore, certain components are depicted or described as having a specific number, such as one, two, three, multiple, plural, singular, etc. However, each of these components may have a different number. By way of example only, the series-connected diode string 406 can alternatively be implemented using a single diode.

[0076] In some respects, the Darlington circuit 138 may be coupled between two power distribution nodes. For example, a first node 402-1 may be coupled to a first power distribution node 432-1, and a second node 402-2 may be coupled to a second power distribution node 432-2. Examples of power distribution nodes 432 include a supply voltage node (e.g., positive Vcc or negative Vcc) and ground. In some cases, the first power distribution node 432-1 may be implemented as a supply voltage node, and the second power distribution node 432-2 may be implemented as ground. In at least some of these cases, the associated driver amplifier 134 may also be powered by the first power distribution node 432-1. (Refer to the following...) Figure 5Example instances of this circuit are described. However, the power distribution node types (e.g., supply voltage node versus ground) can be interchanged, such as if the transistors or diodes are doped or if the coupling directions of these components are interchanged.

[0077] Figure 5 This is a circuit diagram 500 illustrating an example amplifier circuit 130 having a driver amplifier 134 and a power amplifier 136 and having a Darlington circuit 138 coupled thereto to multiple example nodes. Figure 5 An integrated circuit die 502 is depicted, which includes multiple input or output terminals that can be implemented using pins, pads or other electrical contact nodes to couple signaling to or from the integrated circuit die 502. Figure 5 Examples of such input and output terminals described in the text include Rf.in, Rf.out, Vcc1, Vcc2, etc.

[0078] In an example implementation, the driver amplifier 134 includes at least one transistor 504. The channel terminal of transistor 504 (e.g., the collector terminal of a BJT or the drain terminal of a FET) is coupled to node 506. Node 506 is coupled to a first power distribution node 432-1 and a first node 402-1 of the Darlington circuit 138-1. In some cases, node 506 may correspond to either the first power distribution node 432-1 or the first node 402-1 of the Darlington circuit 138-1, including a node that may correspond to both the first power distribution node 432-1 and the first node 402-1. A second node 402-2 is coupled to and may correspond to the second power distribution node 432-2. Figure 5 In the example, the first power distribution node 432-1 is implemented as a supply voltage node (Vcc1), and the second power distribution node 432-2 is implemented as ground. The Darlington circuit 138 may respond to at least partially based on the Darlington circuit 138 (e.g., Figure 4 The voltage at node 506 is clamped by the voltage level of the number of diodes in the plurality of diodes 406 (shown). Additionally or alternatively, the Darlington circuit 138 may increase the clamping action of the voltage at node 506 as the voltage at node 506 increases.

[0079] In the example operation, the control terminal of transistor 504 of driver amplifier 134 (e.g., the base terminal of a BJT or the gate terminal of a FET) receives input signal 512. Driver amplifier 134 amplifies input signal 512 to generate a first amplified signal 332-1. Interstage matching network 324 may modify the first amplified signal 332-1 to generate an intermediate signal 514, which is coupled to the input of power amplifier 136. Power amplifier 136 amplifies the intermediate signal 514, at least based on the first amplified signal 332-1, to generate a second amplified signal 332-2. The second amplified signal 332-2 may be forwarded as the output signal 516 of amplifier circuit 130 or integrated circuit die 502 to the Rf.out output.

[0080] The Darlington circuit 138-1 can be coupled to the driver amplifier 134 via node 506 to provide power clamping. This power clamping may limit the voltage or current at the driver amplifier 134. Furthermore, this power clamping may limit the input power at the power amplifier 136. However, the Darlington circuit 138, as described herein, can be coupled to other nodes of the integrated circuit die 502 to provide additional functionality.

[0081] By way of example, Darlington circuit 138-2 is coupled to the output of power amplifier 136 via node 508. Darlington circuit 138-2 can provide power clamping for the transistors of power amplifier 136, for the output of power amplifier 136, for the output of integrated circuit 502, etc. Darlington circuit 138-2 can be referenced above. Figure 4 The Darlington circuit 138 described is similar in architecture and operation.

[0082] Figure 6 This is a flowchart illustrating an example process 600 for clamping power relative to an amplifier circuit via a Darlington circuit or for operating a power clamp having a Darlington circuit. Process 600 includes five blocks 602 to 610 specifying operations that can be performed for the method. However, the operations are not necessarily limited to the order shown in the figures or described herein, as these operations may be performed in an alternative order or in a fully or partially overlapping manner. Additionally, more, fewer, and / or different operations may be performed to perform the corresponding or alternative processes.

[0083] In the specific implementation of the example, the operation represented by the illustrated box for each process can be performed by an electronic device (such as...). Figure 1 The operation of the corresponding process can be performed by an electronic device 102 or a wireless interface device 120 of that electronic device. More specifically, the operation of the corresponding process can be performed by an integrated circuit die (e.g., Figure 3 Amplifier die 304 or Figure 5The chip 502 and the amplifier circuit 130, which includes a first amplifier and a second amplifier, perform this. Although some of the description herein focuses on amplifiers and power clamping that operate on single-ended signaling, the principles described (e.g., corresponding to devices, circuits, techniques, and processes) are not limited thereto. Therefore, these principles also apply to differential signaling.

[0084] At block 602, a signal is received at the signal input terminal of the integrated circuit die. For example, a pin or pad for the signal input terminal Rf.in of integrated circuit die 502 may receive signal 512. For example, amplifier die 304 may receive signal 512 from controller die 302.

[0085] At block 604, a supply voltage is accepted at the power input of the integrated circuit die. For example, a pin or pad for the power input of integrated circuit die 502 (e.g., corresponding to the first power distribution node 432-1) may accept the supply voltage Vcc1. In some cases, the supply voltage Vcc1 may be coupled to the first node 402-1 of the Linton circuit 138-1.

[0086] At block 606, the amplifier circuit uses a driver amplifier and a supply voltage to amplify the signal to generate a first amplified signal. For example, amplifier circuit 130 can use driver amplifier 134 and supply voltage Vcc1 to amplify signal 512 to generate a first amplified signal 332-1. The signal 512 at the input of driver amplifier 134 can be modified, for example, by means of input matching network 322, compared to the signal 512 at the input of integrated circuit die 502. To perform driver amplification, transistor 504 of driver amplifier 134 can operate in common-emitter mode (or common-source mode of FET) to accept signal 512 at the base terminal (or gate terminal) and provide the first amplified signal 332-1 at the collector terminal (or drain terminal) of transistor 504.

[0087] At block 608, the amplifier circuit uses a power amplifier to amplify an intermediate signal to generate a second amplified signal, wherein the intermediate signal is at least based on the first amplified signal. For example, amplifier circuit 130 may use power amplifier 136 to amplify intermediate signal 514 to generate a second amplified signal 332-2. Here, intermediate signal 514 may be at least based on the first amplified signal 332-1. The intermediate signal 514, which may be applied to the power amplifier input of power amplifier 136, may also include the first amplified signal 332-1 (e.g., if no architectural component is coupled between the driver amplifier output of driver amplifier 134 and the power amplifier input of power amplifier 136). This power amplification may be performed by a power transistor of power amplifier 136 that receives the same input power Vcc1 or a different input power Vcc2, and presents the second amplified signal 332-2 at the power amplifier output of power amplifier 136.

[0088] At block 610, two or more transistors coupled together in a Darlington transistor arrangement are used to clamp the supply voltage. For example, power clamp 310 can use a Darlington transistor configuration 408 (e.g., as shown in the image). Figure 4 Two or more transistors 404 coupled together (as depicted in the diagram) clamp the supply voltage Vcc1. Multiple diodes 406, coupled in series, can be used to perform the clamping of the supply voltage Vcc1, and the clamping voltage is established based on the number of diodes 406. Therefore, the number of diodes 406, in conjunction with the Darlington configuration 408 of the Darlington circuit 138-1, sets the trigger voltage for power clamping.

[0089] Specific implementation examples This section describes some aspects of example implementations and / or example configurations relating to the apparatus and / or processes presented above.

[0090] Example aspect 1: An apparatus comprising: An amplifier circuit, comprising an input port and an output port, includes: A driver amplifier, the driver amplifier including a driver amplifier output terminal and a transistor, the driver amplifier being coupled between the input port and the output port; A power amplifier, comprising a power amplifier input terminal, wherein the power amplifier is coupled between the driver amplifier output terminal and the output port; and A Darlington circuit, which is coupled to the driver amplifier via a node coupled between the input port and the input of the power amplifier.

[0091] Example aspect 2: The apparatus according to example aspect 1 further includes: An integrated circuit die, wherein the integrated circuit die includes the amplifier circuit, The Darlington circuit is configured to provide electrostatic discharge (ESD) protection for the integrated circuit die.

[0092] Example aspect 3: The apparatus according to example aspect 1 or 2 further includes: An integrated circuit die, wherein the integrated circuit die includes the amplifier circuit, The Darlington circuit described therein is configured to provide power clamping to the integrated circuit die relative to the power supplied to the driver amplifier.

[0093] Example aspect 4: The apparatus according to any one of the foregoing example aspects, wherein the Darlington circuit is coupled to the power distribution node of the transistor of the driver amplifier.

[0094] Example aspect 5: The apparatus according to example aspect 4, wherein the power distribution node includes a supply voltage node.

[0095] Example aspect 6: The apparatus according to any one of the foregoing example aspects, wherein the Darlington circuit is coupled to the channel terminal of the transistor of the driver amplifier.

[0096] Example aspect 7: The apparatus according to example aspect 6, wherein: The transistor in the driver amplifier includes a heterojunction bipolar transistor (HBT); and The channel terminal includes a collector terminal.

[0097] Example aspect 8: The apparatus according to any one of the foregoing example aspects, wherein: The node is coupled between the driver amplifier input and the power amplifier input of the driver amplifier; and The node corresponds to: The channel terminals of the transistor in the driver amplifier; and The power supply voltage node for the transistors of the driver amplifier.

[0098] Example aspect 9: The apparatus according to any one of the foregoing example aspects, wherein the Darlington circuit comprises: Two or more transistors coupled together in a Darlington transistor arrangement between the node and the power distribution node.

[0099] Example aspect 10: The apparatus according to example aspect 9, wherein the Darlington circuit includes: At least one diode, The Darlington transistor arrangement and the at least one diode are coupled together in series between the node and the power distribution node.

[0100] Example aspect 11: The apparatus according to example aspect 9 or 10, wherein: The two or more transistors include a first transistor and a second transistor; and The channel terminal of the first transistor is coupled to the control terminal of the second transistor.

[0101] Example aspect 12: The apparatus according to example aspect 11, wherein the Darlington circuit includes: A plurality of diodes are coupled in series between the node and the control terminal of the first transistor of the two or more transistors.

[0102] Example aspect 13: The apparatus according to example aspect 12, wherein the Darlington circuit is configured to clamp the voltage at the node in response to a voltage level at least in part based on the number of diodes among the plurality of diodes.

[0103] Example aspect 14: The apparatus according to example aspect 12 or 13, wherein the Darlington circuit is configured to increase the clamping action on the voltage at the node as the voltage at the node increases.

[0104] Example aspect 15: The apparatus according to any one of Example aspects 11 to 14, wherein the Darlington circuit comprises: At least one diode is coupled between the control terminal of the first transistor and the power distribution node.

[0105] Example aspect 16: The apparatus according to example aspect 15, wherein the Darlington circuit includes: At least one resistor, the at least one resistor being coupled in series with the at least one diode between the control terminal of the first transistor and the power distribution node.

[0106] Example aspect 17: The apparatus according to any one of the foregoing example aspects further includes: The radio frequency front end includes the amplifier circuit.

[0107] Example aspect 18: An apparatus comprising: An amplifier circuit, comprising an input port and an output port, includes: A driver amplifier, comprising a driver amplifier input, a driver amplifier output, and components for amplifying signals, wherein the driver amplifier is coupled to the input port via the driver amplifier input. A power amplifier, comprising a power amplifier input and a power amplifier output, wherein the power amplifier is coupled to the driver amplifier output via the power amplifier input and to the output port via the power amplifier output; and A component used to clamp the power supply voltage of the component used to amplify the signal.

[0108] Example aspect 19: A method comprising: Receive signals at the signal input terminal of the integrated circuit die; The integrated circuit die receives a power supply voltage at its power input terminal. The signal is amplified using a driver amplifier and the supply voltage to generate a first amplified signal; A power amplifier is used to amplify the intermediate signal to generate a second amplified signal, the intermediate signal being at least based on the first amplified signal; and The supply voltage is clamped by using two or more transistors coupled together in a Darlington transistor arrangement.

[0109] Example aspect 20: The method according to example aspect 19, wherein the clamping includes: Multiple diodes are used to clamp the supply voltage. The multiple diodes are coupled together in series, and the clamping voltage is established based on the number of the multiple diodes.

[0110] in conclusion As used herein, the term "coupling" refers to a relationship between two or more components that are operatively communicable to each other to implement a feature or capability described herein. For example, coupling can be achieved using physical lines such as metallic traces or wires, or electromagnetic coupling such as transducers. Coupling can include direct coupling or indirect coupling. Direct coupling refers to connecting discrete circuit elements via the same node without intermediate components. Indirect coupling refers to connecting discrete circuit elements via one or more other devices or other discrete circuit elements, including two or more different nodes.

[0111] The term "port" (e.g., including "first port" or "amplifier port") at least indicates a point of electrical connection at or near the input or output of a component, or between two or more components (e.g., active or passive circuit elements or parts). Although a port may sometimes be visually depicted as a single point (or circle) in a drawing, a port may represent an interconnecting portion of a physical circuit or network having at least approximately the same voltage potential at or along that portion. In other words, a single-ended port may represent at least one point (e.g., a node) among a plurality of points along a conductive medium (e.g., a wire or trace) present between the electrically connected components. In some cases, "port" may represent at least one node that represents or corresponds to an input or output of a component (such as a filter, amplifier circuit, or a portion thereof). Similarly, "terminal" or "node" may represent one or more points having at least approximately the same voltage potential relative to the input or output of a component.

[0112] The terms “first,” “second,” “third,” and other numerically related indicators are used herein to identify or distinguish items that are similar or related to each other in a given context (such as a particular embodiment, a single diagram, a given component, or a claim). Thus, a first item in one context may differ from a first item in another context. For example, an item identified as “first signal” in one context may be identified as “second signal” in another. Similarly, “first port” or “first transistor” in one claim may be referred to as “second port” or “third transistor” in different claims, respectively.

[0113] Unless the context otherwise requires, the use of the word “or” in this document is to be interpreted as “inclusive or” or the use of a term that allows the inclusion or application of one or more items linked by the word “or” (e.g., the phrase “A or B” can be interpreted as allowing only “A”, only “B”, or both “A” and “B”). Additionally, as used herein, the phrase “at least one of” in a list of items refers to any combination of those items (including single members). For example, “at least one of a, b, or c” can cover a, b, c, ab, ac, bc, and abc, as well as any combination having multiple identical elements (e.g., aa, aaa, aab, aac, abb, acc, bb, bbb, bbc, cc, and ccc, or any other ordering of a, b, and c). Furthermore, the items represented in the figures and the terms discussed herein can indicate one or more items or terms, and therefore, the singular or plural forms of these items and terms can be referred to interchangeably in this written description.

[0114] Although specific implementations of a Darlington circuit with a driver amplifier have been described in language specific to certain features and / or methods, the subject matter of the appended claims is not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed as exemplary specific implementations for implementing a Darlington circuit with a driver amplifier.

Claims

1. An apparatus, the apparatus comprising: An amplifier circuit, comprising an input port and an output port, includes: A driver amplifier, the driver amplifier including a driver amplifier output terminal and a transistor, the driver amplifier being coupled between the input port and the output port; A power amplifier, comprising a power amplifier input terminal, wherein the power amplifier is coupled between the driver amplifier output terminal and the output port; and A Darlington circuit, which is coupled to the driver amplifier via a node coupled between the input port and the input of the power amplifier.

2. The apparatus according to claim 1, further comprising: An integrated circuit die, wherein the integrated circuit die includes the amplifier circuit, The Darlington circuit is configured to provide electrostatic discharge (ESD) protection for the integrated circuit die.

3. The apparatus according to claim 1, further comprising: An integrated circuit die, wherein the integrated circuit die includes the amplifier circuit, The Darlington circuit described therein is configured to provide power clamping to the integrated circuit die relative to the power supplied to the driver amplifier.

4. The apparatus of claim 1, wherein the Darlington circuit is coupled to a power distribution node of the transistor for the driver amplifier.

5. The apparatus of claim 4, wherein the power distribution node includes a power supply voltage node.

6. The apparatus of claim 1, wherein the Darlington circuit is coupled to the channel terminal of the transistor of the driver amplifier.

7. The apparatus according to claim 6, wherein: The transistor in the driver amplifier includes a heterojunction bipolar transistor (HBT); and The channel terminal includes a collector terminal.

8. The apparatus according to claim 1, wherein: The node is coupled between the driver amplifier input and the power amplifier input of the driver amplifier; and The node corresponds to: The channel terminals of the transistor in the driver amplifier; and The power supply voltage node for the transistors of the driver amplifier.

9. The apparatus of claim 1, wherein the Darlington circuit comprises: Two or more transistors coupled together in a Darlington transistor arrangement between the node and the power distribution node.

10. The apparatus of claim 9, wherein the Darlington circuit comprises: At least one diode, The Darlington transistor arrangement and the at least one diode are coupled together in series between the node and the power distribution node.

11. The apparatus according to claim 9, wherein: The two or more transistors include a first transistor and a second transistor; and The channel terminal of the first transistor is coupled to the control terminal of the second transistor.

12. The apparatus of claim 11, wherein the Darlington circuit comprises: A plurality of diodes are coupled in series between the node and the control terminal of the first transistor of the two or more transistors.

13. The apparatus of claim 12, wherein the Darlington circuit is configured to clamp the voltage at the node in response to a voltage level at least in part based on the number of diodes among the plurality of diodes.

14. The apparatus of claim 12, wherein the Darlington circuit is configured to increase the clamping action on the voltage at the node as the voltage at the node increases.

15. The apparatus of claim 11, wherein the Darlington circuit comprises: At least one diode is coupled between the control terminal of the first transistor and the power distribution node.

16. The apparatus of claim 15, wherein the Darlington circuit comprises: At least one resistor, the at least one resistor being coupled in series with the at least one diode between the control terminal of the first transistor and the power distribution node.

17. The apparatus according to claim 1, further comprising: The radio frequency front end includes the amplifier circuit.

18. An apparatus comprising: An amplifier circuit, comprising an input port and an output port, includes: A driver amplifier, comprising a driver amplifier input, a driver amplifier output, and components for amplifying signals, wherein the driver amplifier is coupled to the input port via the driver amplifier input. A power amplifier, comprising a power amplifier input and a power amplifier output, wherein the power amplifier is coupled to the driver amplifier output via the power amplifier input and to the output port via the power amplifier output; and A component used to clamp the power supply voltage of the component used to amplify the signal.

19. A method comprising: Receive signals at the signal input terminal of the integrated circuit die; The integrated circuit die receives a power supply voltage at its power input terminal. The signal is amplified using a driver amplifier and the supply voltage to generate a first amplified signal; A power amplifier is used to amplify the intermediate signal to generate a second amplified signal, the intermediate signal being at least based on the first amplified signal; as well as The supply voltage is clamped by using two or more transistors coupled together in a Darlington transistor arrangement.

20. The method of claim 19, wherein the clamping comprises: Multiple diodes are used to clamp the supply voltage. The multiple diodes are coupled together in series, and the clamping voltage is established based on the number of the multiple diodes.

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