Wiring circuit board

Abstract

A wiring circuit board (1) is provided with a frame (2), a mounting part (3), and a bonding part (4). The carrying part (3) is surrounded by the frame (2) and is separated from the frame (2). The joining section (4) connects the frame (2) and the mounting section (3). The mounting section (3) has an element mounting portion (5) having a rectangular shape in plan view. The element mounting portion (5) includes two first sides (51A), (51B) and two second sides (52A), (52B), which are spaced apart from each other and parallel to each other. The two second sides (52A, 52B) connect one ends of the two first sides (51A, 51B), and connect the other ends of the two first sides (51A, 51B). A first force per unit length required when the mounting part (3) is moved relative to the frame (2) in a first direction along the first side (51A) is 0.01 mN / mm or more and 5.0 mN / mm or less.

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] Wiring circuit boards for mounting imaging elements are known (for example, see Patent Document 1 below). The wiring circuit board described in Patent Document 1 includes a frame, a mounting portion surrounded by the frame, and a support member connecting them. The support member is made of a rigid material. The wiring circuit board described in Patent Document 1 is provided in an imaging device with the imaging element mounted on the mounting portion. In the wiring circuit board described in Patent Document 1, the frame elastically supports the mounting portion using the support member.

[0003] If the camera device moves (vibrates), the frame moves (vibrates). Therefore, the mounting part and the frame move (vibrate) in tandem, causing the mounting part to sway (vibrate). However, a support member is used to correct this swaying (vibration) of the mounting part. This correction is called sway correction (vibration correction).

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Publication No. 2020-30306 Summary of the Invention

[0005] The problem that the invention aims to solve Depending on the application and purpose of the wiring circuit board, there is a need to correct the wobbling of the mounting portion with minimal force. However, the wiring circuit board described in Patent Document 1 has a drawback that fails to meet the aforementioned requirement.

[0006] On the other hand, the frame also needs to reliably support the camera element via the mounting part.

[0007] The present invention provides a wiring circuit board that can correct the wobbling of the mounting part with a small force while reliably supporting the camera element.

[0008] Technical solutions for solving the problem The present invention [1] includes a wiring circuit board comprising: a frame; a mounting portion surrounded by the frame and spaced apart from the frame; and a joining portion connecting the frame and the mounting portion, the mounting portion having a thickness, the mounting portion having a component mounting predetermined portion for mounting components, the component mounting predetermined portion being rectangular in shape when viewed in a direction orthogonal to the direction of the thickness, the component mounting predetermined portion including two first sides spaced apart from each other and parallel to each other, and two second sides, the two second sides connecting one end of the two first sides and connecting the other end of the two first sides, and a first force per unit length required to move the mounting portion relative to the frame in a first direction along the first side being 0.01 mN / mm or more and 5.0 mN / mm or less.

[0009] In this wiring circuit board, the first force is less than 5.0 mN / mm, so the wobbling of the mounting part can be corrected with a small force.

[0010] In this wiring circuit board, the first force is 0.01mN / mm or more, so the frame can reliably support the camera element via the mounting part.

[0011] The present invention [2] includes the wiring circuit board described in [1], wherein the second force per unit length required to move the mounting portion relative to the frame in a second direction along the second side is more than 0.01 mN / mm and less than 5.0 mN / mm.

[0012] The present invention [3] includes the wiring circuit board described in [1], wherein the third force per unit length required to move the mounting portion relative to the frame in the thickness direction is 0.01 mN / mm or more and 5.0 mN / mm or less.

[0013] The present invention [4] includes the wiring circuit board described in [1], wherein the frame, the mounting portion and the bonding portion include a wiring layer, the wiring layer in the mounting portion includes: a plurality of terminals spaced apart from each other; and a plurality of wirings spaced apart from each other, the plurality of wirings being electrically connected to the plurality of terminals respectively, the wiring layer in the bonding portion includes a plurality of bonding portion wirings spaced apart from each other, the plurality of bonding portion wirings being electrically connected to the plurality of wirings respectively, the mounting portion having a first portion and a second portion, in the first portion the plurality of wirings extending from the plurality of terminals, the second portion being disposed between the first portion and the outer periphery of the mounting portion and for the plurality of wirings to converge, and the bonding portion being connected to the second portion.

[0014] In this wiring circuit board, the junction is connected to the second part where wiring converges. Therefore, the expansion of the connection portion connected to the second part can be suppressed in the junction. As a result, the rigidity of the junction can be reliably reduced.

[0015] The present invention [5] includes the wiring circuit board described in [1], wherein the mounting portion has an edge disposed outside the component mounting predetermined portion, the joining portion includes a connecting portion for connecting the joining portion on the edge, and the ratio of the length of the connecting portion in the direction along the edge to the length of the edge (length of the connecting portion / length of the edge) is 0.3 or less.

[0016] In this wiring circuit board, the ratio of the length of the connection portion to the length of the side is 0.3 or less, thus suppressing the expansion of the connection portion. Therefore, the rigidity of the joint portion can be reliably reduced.

[0017] The present invention [6] includes the wiring circuit board described in [1], wherein the mounting portion has an edge disposed outside the component mounting pre-position, the joining portion is connected to a central region, the central region including a central portion of the edge and having a length of 1 / 2 the length of the edge.

[0018] In this wiring circuit board, the joint is connected to the central area, thus enabling precise control of the wobbling of the mounting part.

[0019] The present invention [7] includes the wiring circuit board described in [4] or [5], wherein the frame and the mounting portion each include: a substrate insulating layer; the wiring layer disposed on one side of the substrate insulating layer in the thickness direction; and a cover insulating layer disposed on one side of the substrate insulating layer in the thickness direction and covering a portion of the wiring layer. The frame and the mounting portion may also include a metal support layer disposed on the other side of the substrate insulating layer in the thickness direction. The bonding portion does not include the metal support layer and includes the substrate insulating layer, the wiring layer and the cover insulating layer.

[0020] In this wiring circuit board, the joint does not include a metal support layer. Therefore, the rigidity of the joint is reduced. As a result, it is possible to correct the wobbling of the mounting part with a small force.

[0021] The present invention [8] includes the wiring circuit board described in [7], wherein the wiring layer in the joint has a plurality of joint wirings spaced apart from each other, and the base insulating layer and the cover insulating layer in the joint have gaps disposed between the plurality of joint wirings.

[0022] In this wiring circuit board, the base insulating layer and the cover insulating layer in the joint have gaps, which can further reduce the rigidity of the joint.

[0023] The present invention [9] includes the wiring circuit board of [8], wherein the slit extends along the plurality of joint wirings, the joint having a sub-joint that divides the slit in the direction of the slit extension and connects the plurality of joint wirings.

[0024] In this wiring circuit board, the sub-junction portion can suppress the excessive reduction of the rigidity of the junction due to gaps. Therefore, excessive deformation of the junction can be suppressed.

[0025] Invention Effects The wiring circuit board of the present invention can reliably support the camera element while correcting the wobbling of the mounting part with a small force. Attached Figure Description

[0026] Figure 1 This is a top view of the first embodiment of the wiring circuit board of the present invention.

[0027] Figure 2 yes Figure 1 An enlarged view of the wiring circuit board shown.

[0028] Figure 3 It is along Figure 2 A cross-sectional view along line AA in the diagram.

[0029] Figure 4 In the middle, to Figure 4 E is... Figure 3 The diagram shows the manufacturing process of the wiring circuit board. Figure 4 A is the process of forming the substrate insulating layer. Figure 4 B is the process for forming the wiring layer. Figure 4 C is the process of forming the covering insulating layer. Figure 4 D is the process of forming the metal support layer. Figure 4 E is the process of mounting the camera element and external substrate onto the wiring circuit board.

[0030] Figure 5 This is the top view of the first variant.

[0031] Figure 6 It is along Figure 5 A cross-sectional view along line AA in the diagram.

[0032] Figure 7 This is a sectional view of the second variation.

[0033] Figure 8 This is the top view of the third variation.

[0034] Figure 9 yes Figure 8 An enlarged view of the wiring circuit board shown.

[0035] Figure 10 It is along Figure 9 A cross-sectional view along line AA in the diagram.

[0036] Figure 11 It is along Figure 9 A cross-sectional view of the BB line.

[0037] Figure 12 middle, Figure 12 A and Figure 12 B is the process diagram for preparing the kit. Figure 12 A is the process of preparing the frame and mounting unit. Figure 12 B is the process of installing the connector onto the frame and mounting part.

[0038] Figure 13 This is a sectional view of the fourth variation.

[0039] Figure 14 This is a sectional view of the fifth variation.

[0040] Figure 15 This is the top view of the sixth variation.

[0041] Figure 16 This is the top view of the seventh variation. Detailed Implementation

[0042] 1. One embodiment of the wiring circuit board Reference Figures 1 to 3 An embodiment of the wiring circuit board of the present invention will be described. Furthermore, in Figure 1 In order to clearly show the configuration and shape of the component mounting pre-position 5, the component mounting pre-position 5 is shown with shading lines.

[0043] 1.1 Basic Structure of Wiring Circuit Board 1 like Figure 1 As shown, the wiring circuit board 1 has a sheet shape. The wiring circuit board 1 has a thickness. The wiring circuit board 1 extends along the surface direction. The surface direction is orthogonal to the thickness direction. The wiring circuit board 1 includes a frame 2, a mounting portion 3, and a connecting portion 4.

[0044] 1.2 Framework 2 Frame 2 has thickness and extends along the surface direction. Frame 2 has a generally rectangular frame shape when viewed from above. Viewed from above is synonymous with viewing in a direction orthogonal to the thickness direction. Frame 2 has thickness. It has an outer perimeter 21 and an inner perimeter 22.

[0045] 1.3 Mounting Unit 3 The mounting portion 3 has thickness and extends along the surface direction. The mounting portion 3 is surrounded by the frame 2. The mounting portion 3 is spaced apart from the frame 2. The mounting portion 3 has a generally rectangular shape when viewed from above. Preferably, the mounting portion 3 has a generally rectangular shape when viewed from above, specifically, it has a generally rectangular frame shape when viewed from above.

[0046] The mounting part 3 includes an outer periphery 31 and an inner periphery 32. The outer periphery 31 faces the inner periphery 22 of the frame 2.

[0047] The mounting section 3 includes an element mounting pre-positioning section 5. The element mounting pre-positioning section 5 is disposed in the inner portion of the mounting section 3. The outer periphery (imaginary line) of the imaging element 7 is mounted on the element mounting pre-positioning section 5.

[0048] The component mounting pre-position 5 has a rectangular shape when viewed from above. The component mounting pre-position 5 includes two first sides 51A and 51B and two second sides 52A and 52B. The two first sides 51A and 51B and the two second sides 52A and 52B are disposed between the outer peripheral edge 31 and the inner peripheral edge 32.

[0049] The two first edges 51A and 51B are parallel. The two first edges 51A and 51B are along the first direction. The two first edges 51A and 51B are spaced apart from each other.

[0050] Two second sides 52A and 52B connect one end of the first sides 51A and 51B in the first direction, and also connect the other ends of the first sides 51A and 51B in the first direction. Specifically, second side 52A connects one end of the first side 51A in the first direction to one end of the first side 51B in the first direction. Second side 52B connects the other ends of the first side 51A in the first direction to the other ends of the first side 51B in the first direction. The two second sides 52A and 52B are parallel. The two second sides 52A and 52B are along a second direction. The second direction is orthogonal to the first direction and the thickness direction. The two second sides 52A and 52B are spaced apart from each other in the first direction.

[0051] The outer periphery 31 of the mounting part 3 includes two first outer sides 311A ​​and 311B and two second outer sides 312A and 312B.

[0052] The two first outer edges 311A ​​and 311B are parallel. The two first outer edges 311A ​​and 311B are along a first direction. The two first outer edges 311A ​​and 311B are spaced apart. The first outer edge 311A ​​is opposite to the first edge 51A. The first outer edge 311A ​​is along the first edge 51A. The first outer edge 311B is opposite to the first edge 51B. The first outer edge 311B is along the first edge 51B.

[0053] The two second outer edges 312A and 312B are parallel. The two second outer edges 312A and 312B are along a second direction. The two second outer edges 312A and 312B are spaced apart from each other. The second outer edge 312A connects one end of the first outer edge 311A ​​in the first direction to one end of the first outer edge 311B in the first direction. The second outer edge 312A is opposite to the second edge 52A. The second outer edge 312A is along the second edge 52A. The second outer edge 312B connects the other end of the first outer edge 311A ​​in the first direction to the other end of the first outer edge 311B in the first direction. The second outer edge 312B is opposite to the second edge 52B. The second outer edge 312B is along the second edge 52B.

[0054] The inner periphery 22 of frame 2 includes two first inner sides 221A and 221B and two second inner sides 222A and 222B.

[0055] The two first inner sides 221A and 221B are parallel. The two first inner sides 221A and 221B are along a first direction. The two first inner sides 221A and 221B are spaced apart from each other. The first inner side 221A faces the first outer side 311A. The first inner side 221A is along the first outer side 311A. The first inner side 221B faces the first outer side 311B. The first inner side 221B is along the first outer side 311B.

[0056] The two second inner sides 222A and 222B are parallel. The two second inner sides 222A and 222B are along a second direction. The second inner side 222A connects one end of the first inner side 221A in the first direction to one end of the first inner side 221B in the first direction. The second inner side 222A faces the second outer side 312A. The second inner side 222A is along the second outer side 312A. The second inner side 222B connects the other end of the first inner side 221A in the first direction to the other end of the second inner side 222B in the first direction. The second inner side 222B faces the second outer side 312B. The second inner side 222B is along the second outer side 312B.

[0057] 1.4 Joint 4 A joint 4 is disposed between the frame 2 and the mounting part 3. The joint 4 connects the frame 2 and the mounting part 3. The joint 4 supports the inner periphery 22 of the frame 2 and the outer periphery 31 of the mounting part 3. The joint 4 has a thickness and extends in the surface direction. The joint 4 includes two first joints 41A and 41B and two second joints 42A and 42B.

[0058] 1.4.1 Two first joints 41A and 41B and two second joints 42A and 42B The two first joints 41A and 41B and the two second joints 42A and 42B are spaced apart from each other between the inner periphery 22 and the outer periphery 31.

[0059] 1.4.1.1 First joints 41A and 41B Each of the two first joints 41A and 41B is continuous with each of the two first inner sides 221A and 221B in the frame 2. Each of the two first joints 41A and 41B is continuous with each of the two second outer sides 312A and 312B in the mounting part 3. The first joint 41A connects the first inner side 221A and the second outer side 312A. The first joint 41B connects the first inner side 221B and the second outer side 312B.

[0060] 1.4.1.2 Second joints 42A and 42B Each of the two second joints 42A and 42B is continuous with each of the two second inner sides 222A and 222B in the frame 2. Each of the two second joints 42A and 42B is continuous with each of the two first outer sides 311B and 311A ​​of the mounting part 3. The second joint 42A connects the second inner side 222A to the first outer side 311B. The second joint 42B connects the second inner side 222B to the first outer side 311A.

[0061] 1.5 Layer Structure of Frame 2 like Figure 3 As shown, the frame 2 includes a metal support layer 11, a base insulation layer 12, a wiring layer 13, and a covering insulation layer 14.

[0062] 1.5.1 Metal support layer 11 in frame 2 In frame 2, a metal support layer 11 extends along the surface direction. The metal support layer 11 forms the other side of frame 2 in the thickness direction. The metal support layer 11 is flexible.

[0063] The material of the metal support layer 11 in frame 2 is, for example, a rigid material. Examples of rigid materials include: stainless steel, alloy 42, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloys.

[0064] As rigid materials, stainless steel and copper alloys are preferred from the viewpoint of ensuring the strength of the frame 2 and the mounting part 3. The thickness of the metal support layer 11 in the frame 2 is, for example, 30 mm. μ m~10000 μ m, preferably 100 μ m~1000 μ m.

[0065] 1.5.2 Substrate insulation layer 12 in frame 2 In frame 2, the substrate insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction. The substrate insulating layer 12 is in contact with one side of the metal support layer 11.

[0066] The material of the base insulating layer 12 in the frame 2 has a Young's modulus of, for example, 2.0 GPa to 10.0 GPa at 25°C, preferably 2.0 GPa to 10.0 GPa. Examples of materials for the base insulating layer 12 in the frame 2 include resins, and polyimide resins are preferred. The thickness of the base insulating layer 12 in the frame 2 is, for example, 1. μ m~20 μ m, preferably 5 μ m~15 μ m.

[0067] 1.5.3 Wiring layer 13 in frame 2 In frame 2, wiring layer 13 is disposed on one side of substrate insulating layer 12 in the thickness direction. Wiring layer 13 is in contact with one side of substrate insulating layer 12. Figure 2 As shown, the wiring layer 13 includes multiple frame terminals 131 and multiple frame wirings 132.

[0068] 1.5.3.1 Frame Terminal 131 Multiple frame terminals 131 are respectively disposed corresponding to the first inner sides 221A, 221B and the second inner sides 222A, 222B. The multiple frame terminals 131 corresponding to the first inner side 221A are spaced apart from each other along the first inner side 221A. Preferably, the multiple frame terminals 131 are spaced apart from each other by equal intervals along the first inner side 221A. The multiple frame terminals 131 corresponding to the first inner side 221A include multiple frame ground terminals 131G and multiple frame differential terminals 131D. Although not shown, they are associated with the first inner side 221B (see reference 221B). Figure 1 ), second inner side 222A (refer to) Figure 1 ), second inner side 222B (refer to) Figure 1 Each of the multiple frame terminals 131 has the same structure as the multiple frame terminals 131 corresponding to the first inner side 221A.

[0069] 1.5.3.2 Frame wiring 132 Multiple frame wirings 132 are electrically connected to multiple frame terminals 131 respectively. The multiple frame wirings 132 corresponding to the first inner side 221A extend and bend from the multiple frame terminals 131 corresponding to the first inner side 221A, converge with each other, and then reach the first inner side 221A. Specifically, each of the multiple frame wirings 132 includes a frame extension line 132A and a frame convergence line 132B.

[0070] The frame extension line 132A corresponding to the first inner side 221A extends from the plurality of frame terminals 131 corresponding to the first inner side 221A toward the first inner side 221A.

[0071] A plurality of frame extension lines 132A corresponding to the first inner side 221A and a plurality of frame terminals 131 corresponding to the first inner side 221A are provided.

[0072] Multiple frame extension lines 132A are spaced apart from each other in the direction along the first inner side 221A. Each of the multiple frame extension lines 132A extends in a direction intersecting the first inner side 221A.

[0073] Frame extension line 132A includes multiple frame ground extension lines 132AG and multiple frame differential extension lines 132AD. Each of the multiple frame ground extension lines 132AG extends from a multiple frame ground terminal 131G. Each of the multiple frame differential extension lines 132AD extends from a multiple frame differential terminal 131D.

[0074] In frame 2, the area with multiple frame extension lines 132A is designated as the third part 25.

[0075] With the first inner side 221B (refer to) Figure 1 ), second inner side 222A (refer to) Figure 1 ), second inner side 222B (refer to) Figure 1 Each of the corresponding frame extension lines 132A has the same structure as the frame extension line 132A corresponding to the first inner side 221A mentioned above.

[0076] Multiple frame convergence lines 132B corresponding to the first inner side edge 221A and multiple frame extension lines 132A corresponding to the first inner side edge 221A are provided. The multiple frame convergence lines 132B converge towards each other, near the second connection portion 46 (described later) of the joint portion 4A in the frame 3. Each of the multiple frame convergence lines 132B starts from one end edge of one of the multiple frame extension lines 132A and ends at a position overlapping the first inner side edge 221A in the thickness direction. One end edge is the end edge on the opposite side of the frame terminal 131 on the frame extension line 132A. The starting point of the frame convergence line 132B becomes the first bending point in the frame wiring 132. The frame convergence line 132B bends in the region opposite to the second connection portion 46 of the joint portion 4A. The aforementioned bend in the frame convergence line 132B becomes the second bending point in the frame wiring 132. The second bend point in the frame wiring 132 is spaced apart from the first bend point in the frame wiring 132 in the direction along the first inner side 221A. The second bend point may also be opposite the joint 4A in a direction orthogonal to the first inner side 221A, but not opposite the corresponding frame terminal 131. The wiring density of the plurality of frame converging lines 132B is higher than the wiring density of the frame extension line 132A described above. The plurality of frame converging lines 132B may also have equally spaced portions spaced apart from each other. In this embodiment, each of the plurality of frame converging lines 132B has a generally L-shaped form.

[0077] In frame 2, the area where the frame convergence line 132B is located is designated as the fourth part 26. The fourth part 26 is positioned between the first inner side 221A and the third part 25. The first inner side 221A, the fourth part 26, and the third part 25 are arranged sequentially. The wiring density of the frame convergence line 132B in the fourth part 26 is higher than the wiring density of the frame extension line 132A in the third part 25.

[0078] With the first inner side 221B (refer to) Figure 1 ), second inner side 222A (refer to) Figure 1 ), second inner side 222B (refer to) Figure 1 Each of the corresponding frame convergence lines 132B has the same structure as the frame convergence line 132B corresponding to the first inner side 221A mentioned above.

[0079] The material used for the wiring layer 13 in frame 2 can be, for example, a conductor. Copper is preferably used as a conductor. The thickness of the wiring layer 13 in frame 2 is, for example, 1. μ m~50 μ m, 5 μ m~35 μ m.

[0080] 1.5.4 Covering insulation layer 14 in frame 2 like Figure 3 As shown, in frame 2, a covering insulating layer 14 is disposed on one side of the base insulating layer 12 in the thickness direction. The covering insulating layer 14 covers the frame wiring 132 (frame extension line 132A and frame convergence line 132B, as part of the wiring layer 13) which is part of the wiring layer 13. Figure 2 The insulating layer 14 covers the remaining portion of the wiring layer 13, including the frame terminals 131 (frame ground terminal 131G and frame differential terminal 131D, see reference 131G). Figure 2 (Exposed)

[0081] As a material for the covering insulation layer 14, examples include resins, with polyimide resins being a preferred example. The thickness of the covering insulation layer 14 in the frame 2 is, for example, 5 mm. μ m~100 μ m, preferably 5 μ m~50 μ m.

[0082] 1.5.5 Dimensions of Frame 2 like Figure 1 As shown, the interval between the first inner side edges 221A and 221B and the interval between the second inner side edges 222A and 222B are each, for example, 5mm to 50mm, preferably 8mm to 30mm. The length of each of the first inner side edges 221A and 221B, and the second inner side edges 222A and 222B is, for example, 5mm to 50mm, preferably 8mm to 30mm. The width of the frame 2 is, for example, 0.1mm to 50mm, preferably 0.3mm to 30mm. The width of the frame 2 is the length between the outer perimeter 21 and the inner perimeter 22. The length of each of the first inner side edges 221A and 221B, and the second inner side edges 222A and 222B is, for example, 15mm to 60mm.

[0083] like Figure 2 As shown, the width of each of the multiple frame terminals 131 is, for example, 10. μ m~3000 μ m, preferably 30 μ m~1000 μ m.

[0084] The spacing between the multiple frame terminals 131 is, for example, 30. μ m~2000 μ m, preferably 50 μ m~1000 μ m. The spacing is the distance between the respective end edges of adjacent frame terminals 131. Each of the two end edges is an end edge along the direction of the first inner side 221A. The definition of the spacing is the same below.

[0085] For example, the spacing at the equally spaced portions of the multiple frame convergence lines 132B is smaller than the spacing between the multiple frame extension lines 132A. The spacing at the equally spaced portions of the multiple frame convergence lines 132B is, for example, 1500. μ Below m, preferably 1000 μ Below m, more preferably 800 μ Below m, and for example, 10. μ m or more. The ratio of the spacing of the equally spaced portions of the multiple frame convergence lines 132B to the spacing of the multiple frame extension lines 132A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and, for example, 0.01 or more.

[0086] For example, the width of the frame wiring 132 is 1. μ m~3000 μ m, preferably 5 μ m~1000 μ m.

[0087] 1.6 Layered structure of mounting unit 3 like Figure 3 As shown, the mounting part 3 includes a metal support layer 11, a base insulating layer 12, a wiring layer 13, and a covering insulating layer 14.

[0088] 1.6.1 Metal support layer 11 in mounting part 3 In the mounting section 3, the metal support layer 11 extends along the surface direction. The metal support layer 11 forms the other side of the mounting section 3 in the thickness direction. The material and thickness of the metal support layer 11 in the mounting section 3 are the same as those of the metal support layer 11 in the frame 2.

[0089] 1.6.2 The base insulating layer 12 in the mounting part 3 In the mounting section 3, the base insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction. The base insulating layer 12 is in contact with one side of the metal support layer 11. The material and thickness of the base insulating layer 12 in the mounting section 3 are the same as those of the base insulating layer 12 in the frame 2.

[0090] 1.6.3 Wiring layer 13 in mounting unit 3 In the mounting section 3, the wiring layer 13 is disposed on one side of the substrate insulating layer 12 in the thickness direction. The wiring layer 13 is in contact with one side of the substrate insulating layer 12. Figure 2 As shown, the wiring layer 13 in the mounting unit 3 has a plurality of terminals 133 and a plurality of wirings 134.

[0091] 1.6.3.1 Terminal 133 Multiple terminals 133 are respectively connected to the first outer sides 311A, 311B and the second outer sides 312A, 312B (see reference). Figure 1 Correspondingly, the terminals 133 corresponding to the second outer side 312A are spaced apart from each other in the direction along the second outer side 312A. Preferably, the multiple terminals 133 are spaced apart from each other by equal intervals in the direction along the second outer side 312A. The second side 52A is divided (formed) on a straight line along the outer end face (or nearby portion) of the multiple terminals 133 in the first direction. The multiple terminals 133 corresponding to the second outer side 312A include multiple ground terminals 133G and multiple differential terminals 133D. Although not shown, the terminals 133 corresponding to the second outer side 312B (refer to...) are... Figure 1 ), first outer side 311A ​​(refer to) Figure 1 ), first outer side 311B (refer to) Figure 1 Each of the multiple terminals 133 has the same structure as the terminal 133 corresponding to the second outer side 312A.

[0092] The second side 52B of the component mounting predetermined part 5 is divided (formed) on a straight line along the outer end face (or nearby portion) of the plurality of terminals 133 along the first direction. The first sides 51A and 51B are each divided (formed) on a straight line along the outer end face (or nearby portion) of the plurality of terminals 133 along the second direction.

[0093] 1.6.3.2 Wiring 134 Multiple wirings 134 are each electrically connected to multiple terminals 133. The multiple wirings 134 are spaced apart from each other. The multiple wirings 134 corresponding to the second outer side 312A extend from the multiple terminals 133 corresponding to the second outer side 312A, then converge to each other, and then reach the second outer side 312A. Specifically, each of the multiple wirings 134 includes an extension line 134A and a converging line 134B.

[0094] An extension line 134A corresponding to the second outer side 312A extends from each of the plurality of terminals 133 corresponding to the second outer side 312A toward the second outer side 312A. A plurality of extension lines 134A and a plurality of terminals 133 corresponding to the second outer side 312A are provided.

[0095] Multiple extension lines 134A are spaced apart from each other in the direction along the second outer side 312A. Each of the multiple extension lines 134A extends in a direction intersecting the second outer side 312A. The extension lines 134A include multiple ground extension lines 134AG and multiple differential extension lines 134AD. Each of the multiple ground extension lines 134AG extends from a respective of a multiple ground terminal 133G. Each of the multiple differential extension lines 134AD extends from a respective of a multiple differential terminal 133D.

[0096] In the mounting section 3, the area where multiple extension lines 134A are provided is the first portion 36. In other words, the mounting section 3 includes the first portion 36. In other words, in the first portion 36, multiple wirings 134 extend from multiple terminals 133.

[0097] With the second outer side 312B (refer to) Figure 1 The extension lines 134A corresponding to the first outer side 311A ​​and the first outer side 311B respectively have the same structure as the extension line 134A corresponding to the second outer side 312A mentioned above.

[0098] Multiple convergence lines 134B corresponding to the second outer edge 312A and multiple extension lines 134A corresponding to the second outer edge 312A are provided. The multiple convergence lines 134B converge towards each other, near the connection portion 45 (described later) in the mounting portion 3 of the joint portion 4A. Each of the multiple convergence lines 134B starts from one end edge of one of the multiple extension lines 134A and ends at a position overlapping the second outer edge 312A in the thickness direction. One end edge is the end edge on the opposite side of the upper terminal 133 of the extension line 134A. The starting point of the convergence line 134B becomes the first bending point in the wiring 134. The convergence line 134B bends in the region opposite to the connection portion 45 of the joint portion 4A. The aforementioned bend in the convergence line 134B becomes the second bending point in the wiring 134. The second bending point in the wiring 134 is spaced apart from the first bending point in the wiring 134 in the direction along the second outer edge 312A. The second bending point may also be opposite the joint 4A in a direction orthogonal to the second outer side 312A, rather than opposite the corresponding terminal 133. The wiring density of the plurality of converging lines 134B is higher than that of the aforementioned extension line 134A. The plurality of converging lines 134B may also have equally spaced portions that are equally spaced from each other. Each of the plurality of converging lines 134B has a generally L-shaped form.

[0099] In the mounting portion 3, the area where the converging line 134B is provided is the second portion 37. In other words, the mounting portion 3 has a second portion 37. The second portion 37 is disposed between the second outer side 312A and the aforementioned first portion 36. The second outer side 312A, the second portion 37, and the first portion 36 are arranged sequentially toward the inner periphery 32. In the second portion 37, a plurality of wirings 134 converge. The wiring density of the converging line 134B in the second portion 37 is higher than the wiring density of the extension line 134A in the first portion 36.

[0100] 1.6.4 Covering insulation layer 14 in mounting part 3 like Figure 3 As shown, in the mounting part 3, a covering insulating layer 14 is disposed on one side of the base insulating layer 12 in the thickness direction. The covering insulating layer 14 covers the wiring 134 (extension line 134A and convergence line 134B, see reference 134A) which is part of the wiring layer 13. Figure 2 The insulating layer 14 covers the remaining portion of the wiring layer 13, including the terminals 133 (see reference 133). Figure 2 (Exposed)

[0101] 1.6.5 Dimensions of Mounting Unit 3 like Figure 1 As shown, the interval between the second outer side 312A and the second outer side 312B and the interval between the first outer side 311A ​​and the first outer side 311B are each, for example, 3mm to 50mm, preferably 5mm to 30mm. The length of each of the second outer side 312A, 312B and the first outer side 311A, 311B is, for example, 3mm to 50mm, preferably 5mm to 30mm.

[0102] The width of the mounting portion 3 is, for example, 0.3 mm to 30 mm, preferably 0.5 mm to 20 mm. The width of the mounting portion 3 is the length between the outer periphery 31 and the inner periphery 32.

[0103] like Figure 2 As shown, the width of each of the multiple terminals 133 is the same as the width of each of the multiple frame terminals 131 described above.

[0104] The spacing between the multiple terminals 133 is, for example, 30. μ m~2000 μ m, preferably 50 μ m~1000 μ m. The spacing between adjacent terminals 133 is, for example, 10. μ m~1500 μ m, preferably 30 μ m~800 μ m.

[0105] The spacing between the multiple extension lines 134A is, for example, the same as the spacing between the multiple terminals 133. The spacing at the equally spaced portions of the converging line 134B is smaller than the spacing between the multiple extension lines 134A. The spacing at the equally spaced portions of the converging line 134B is, for example, 1500. μ Below m, preferably 1000 μ Below m, more preferably 800 μ Below m, and for example, 10. μ m or more. The ratio of the spacing of the equally spaced portions of the converging line 134B to the spacing of the plurality of extension lines 134A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and, for example, 0.01 or more.

[0106] The width of wiring 134 is the same as the width of the frame wiring 132 described above.

[0107] When the wiring circuit board 1 is viewed from above in the thickness direction, the area ratio of the joint portion 4 in the area defined between the frame 2 and the mounting portion 3 is, for example, 50% or less, preferably 40% or less, more preferably 35% or less, and even more preferably 30% or less.

[0108] Furthermore, this ratio is, for example, 1% or more, preferably 10% or more, more preferably 20% or more, and even more preferably 25% or more. In addition, if this ratio is within this range, the length, width and / or thickness of the joint 4 can be set within an appropriate range, so that the mounting part 3 can be wobbled with a small force while the camera element 7 can be reliably supported.

[0109] 1.7.1 Shape of joint 4A, etc. like Figure 2 As shown, the joint 4A has a curved shape when viewed from above. Preferably, the joint 4A does not have a straight shape and / or a curved shape, but only a curved shape. Specifically, the joint 4A has an S-shaped or hook-shaped shape. If the joint 4A has a curved shape, stress will not be locally concentrated and can be evenly mitigated, thus improving the accuracy of the sway correction of the mounting part 3.

[0110] The width of the joint 4A (the length of the direction orthogonal to the direction in which the joint 4A extends and the length of the direction orthogonal to the thickness direction) is, for example, 0.1 mm to 10 mm, preferably 0.5 mm to 5 mm.

[0111] 1.7.2 Connection of joint 4 to mounting part 3 The joint 4A is connected to the second part 37 of the mounting part 3. That is, the joint 4A is not connected to the first part 36 of the mounting part 3, which has a plurality of extension lines 134A with the same spacing as (i.e., a relatively large spacing) as the plurality of terminals 133, but is connected to the second part 37, which has a plurality of converging lines 134B with a smaller spacing than the plurality of terminals 133.

[0112] The joint 4A includes a connecting portion 45 that connects to the second portion 37 described above. For example... Figure 1 As shown, for example, the connecting portion 45 is connected to the second outer side 312A in the central region 34 of the mounting portion 3.

[0113] The central region 34 is the region within the second outer side 312A that includes a central portion 35. The central portion 35 is the central point and its vicinity within the second outer side 312A. The central region 34 has a length of 1 / 2 that of the second outer side 312A. Preferably, the central region 34 has a length of 1 / 3 that of the second outer side 312A, and more preferably, it has a length of 1 / 4 that of the second outer side 312A.

[0114] Preferably, the joint 4A is connected to the central portion 35 of the second outer side 312A.

[0115] The ratio of the length of the connecting portion 45 along the direction of the second outer side 312A to the length of the second outer side 312A (length of the connecting portion 45 / length of the second outer side 312A) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and also, for example, 0.01 or more.

[0116] If the ratio of the length of the connecting portion 45 along the direction of the second outer side 312A to the length of the second outer side 312A is less than or equal to the aforementioned upper limit, the expansion of the connecting portion 45 in the direction extending from the second outer side 312A can be suppressed. Therefore, the rigidity of the joint portion 4A can be reliably reduced.

[0117] 1.7.3 Connection of joint 4 to frame 2 like Figure 2 As shown, the joint 4A is connected to the fourth part 26 in the frame 2. That is, the joint 4A is not connected to the third part 25 in the frame 2, which has a plurality of frame extension lines 132A with a spacing that is the same as (i.e., a relatively large spacing) as the plurality of frame terminals 131, but is connected to the fourth part 26, which has a plurality of converging lines 134B with a spacing smaller than that of the plurality of frame terminals 131.

[0118] like Figure 1 As shown, the joint 4A includes a second connecting portion 46 that connects to the fourth portion 26. For example, the second connecting portion 46 connects to the second central region 29 of the first inner side 221A in the frame 2.

[0119] The second central region 29 is the region within the first inner side 221A that includes a second central portion 28. The second central portion 28 is the central point and its vicinity within the first inner side 221A. The second central region 29 has a length of 1 / 2 the length of the first inner side 221A. Preferably, the second central region 29 has a length of 1 / 3 the length of the first inner side 221A. More preferably, the second central region 29 has a length of 1 / 4 the length of the first inner side 221A.

[0120] Preferably, the joint 4A is connected to the second central portion 28 of the first inner side 221A.

[0121] The ratio of the length of the second connecting portion 46 along the direction of the first inner side edge 221A to the length of the first inner side edge 221A (length of the second connecting portion 46 / length of the first inner side edge 221A) is, for example, 0.3 or less, preferably 0.25 or less, and more preferably 0.2 or less. If the ratio of the length of the second connecting portion 46 along the direction of the first inner side edge 221A to the length of the first inner side edge 221A is less than or equal to the aforementioned upper limit, the expansion of the second connecting portion 46 in the direction extending from the first inner side edge 221A can be suppressed. Therefore, the rigidity of the joint 4A can be reliably reduced.

[0122] The lower limit of the ratio of the length of the second connecting portion 46 along the direction of the first inner side 221A to the length of the first inner side 221A is, for example, 0.01 or more.

[0123] like Figure 2 As shown, the joint 4A includes multiple gaps 421, 422, 423, multiple wiring portions 431, 432, and grounding wiring portions 433, 434.

[0124] 1.7.4 Gaps 421, 422, 423 Multiple slits 421, 422, and 423 are each disposed in the middle portion of the joint 4 in a direction that intersects the direction in which the joint 4 extends (intersecting direction, preferably orthogonal direction). The multiple slits 421, 422, and 423 are spaced apart from each other in the intersecting direction.

[0125] Multiple slots 421, 422, and 423 are each disposed throughout the joint 4 in the direction in which the joint 4 extends. The multiple slots 421, 422, and 423 are arranged sequentially in intersecting directions. The multiple slots 421, 422, and 423 separate the wiring body portion 431, the wiring body portion 432, the grounding wiring body portion 433, and the grounding wiring body portion 434. Figure 3 As shown, multiple slits 421, 422, and 423 each penetrate the base insulating layer 12 and the cover insulating layer 14 in the thickness direction.

[0126] 1.7.5 Wiring components 431, 432 Wiring portions 431 and 432 are separated by slots 421, 422, and 423. Wiring portions 431 and 432 are spaced apart from each other in the intersecting direction. Multiple slots 421, 422, and 423 extend along wiring portions 431 and 432. Each wiring portion 431 and 432 includes four joint wirings 1341, 1342, 1343, and 1344, a base insulation layer 12, and a cover insulation layer 14.

[0127] The joint wirings 1341, 1342, 1343, and 1344 are spaced apart from each other in the intersecting direction. The joint wirings 1341, 1342, 1343, and 1344 are arranged sequentially in the intersecting direction. Multiple gaps 421, 422, and 423 extend along the joint wirings 1341, 1342, 1343, and 1344. The joint wirings 1341, 1342, 1343, and 1344 can function as differential lines. For example, joint wirings 1341 and 1342 operate as a differential pair. Joint wirings 1343 and 1344 operate as a differential pair.

[0128] A base insulating layer 12 contacts the other side of the junction wirings 1341, 1342, 1343, and 1344 in the thickness direction in each of the wiring body portions 431 and 432.

[0129] An insulating layer 14 covers the joint wirings 1341, 1342, 1343, and 1344 in each of the wiring bodies 431 and 432. The insulating layer 14 contacts one side and the outer side of each of the joint wirings 1341, 1342, 1343, and 1344.

[0130] 1.7.6 Grounding wiring body parts 433, 434 Grounding wiring body 433 is disposed with a gap 421 between it and wiring body 431. Grounding wiring body 434 is disposed with a gap 423 between it and wiring body 432. Grounding wiring body 433 and 434 each have a grounding wiring 1345, a base insulation layer 12 and a cover insulation layer 14.

[0131] A base insulating layer 12 contacts the lower surface of the grounding wiring 1345 in the thickness direction in each of the grounding wiring body portions 433 and 434. The grounding wiring 1345 is thicker than the joint wirings 1341, 1342, 1343, and 1344.

[0132] An insulating layer 14 covers the grounding wiring 1345 in each of the grounding wiring bodies 433 and 434. The insulating layer 14 is in contact with one side and the outer side of the grounding wiring 1345 in the thickness direction.

[0133] like Figure 2 As shown, the grounding wiring 1345 is electrically connected to the frame grounding terminal 131G in the frame 2. Specifically, the grounding wiring 1345 is electrically connected to the metal support layer 11 in the frame 2 via the convergence line 134B corresponding to the grounding extension line 134AG, the grounding extension line 134AG, and the frame grounding terminal 131G. Thus, the grounding wiring 1345 is grounded to the frame grounding terminal 131G.

[0134] like Figure 3 As shown, the joint 4A does not include the metal support layer 11. The metal support layer 11 is a layer disposed on the opposite side of the substrate insulating layer 12 in the thickness direction. The material of the metal support layer 11 is, for example, the rigid material described above.

[0135] The joint 4A includes a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14. Preferably, the joint 4A includes only the base insulating layer 12, the wiring layer 13, and the cover insulating layer 14.

[0136] 1.7.7 The base insulating layer 12 in the joint 4A In the joint 4A, the base insulating layer 12 forms the other side of the joint 4A in the thickness direction. The base insulating layer 12 is exposed on the other side in the thickness direction. The material and thickness of the base insulating layer 12 in the joint 4 are the same as those of the base insulating layer 12 in the joint 4 in the frame 2.

[0137] The base insulating layer 12 has the aforementioned plurality of slits 421, 422, and 423. These slits are disposed between wiring portions 431 and 432, between wiring portion 431 and grounding wiring portion 433, and between wiring portion 432 and grounding wiring portion 434.

[0138] 1.7.8 Wiring layer 13 in joint 4A In the junction 4A, the wiring layer 13 includes the junction wirings 1341, 1342, 1343, and 1344 described above, and the two grounding wirings 1345 described above.

[0139] In the joint 4A, the wiring layer 13 is disposed on one side of the base insulating layer 12 in the thickness direction. The wiring layer 13 is in contact with one side of the base insulating layer 12. The joint wirings 1341, 1342, 1343, and 1344 are spaced apart from each other in the intersecting direction (preferably the orthogonal direction) in the joint 4A. Figure 2As shown, the joint wirings 1341, 1342, 1343, and 1344 are electrically connected to a plurality of wirings 134. Furthermore, the joint wirings 1341, 1342, 1343, and 1344 are electrically connected to a plurality of frame wirings 132. That is, the plurality of joint wirings 1341, 1342, 1343, and 1344 electrically connect the plurality of frame wirings 132 in the frame 2 to the plurality of wirings 134 in the mounting portion 3. The material and thickness of the wiring layer 13 in the joint portion 4 are the same as those of the wiring layer 13 in the frame 2. The Young's modulus of the material of the wiring layer 13 in the joint portion 4A at 25°C is, for example, 20 GPa to 150 GPa.

[0140] 1.7.9 Covering insulation layer 14 in joint 4A like Figure 3 As shown, in the joint 4A, a covering insulating layer 14 forms one side of the joint 4A in the thickness direction. The covering insulating layer 14 is exposed on the side facing the thickness direction. The covering insulating layer 14 is disposed on one side of the base insulating layer 12 in the thickness direction. The covering insulating layer 14 covers a plurality of joint wirings 1341, 1342, 1343, 1344 and grounding wiring 1345.

[0141] The covering insulation layer 14, together with the base insulation layer 12, has the aforementioned plurality of slits 421, 422, and 423. Each of the plurality of slits 421, 422, and 423 penetrates the covering insulation layer 14 in the thickness direction. The inner surface of the covering insulation layer 14 that separates each of the plurality of slits 421, 422, and 423 is coplanar with the inner surface of the base insulation layer 12 that separates each of the plurality of slits 421, 422, and 423. The material and thickness of the base insulation layer 12 in the covering insulation layer 14 may also be the same as the material and thickness of the base insulation layer 12 in the frame 2.

[0142] 1.7.10 Dimensions of joint 4A The ratio of the thickness of the grounding wiring 1345 to the thickness of the joint wirings 1341, 1342, 1343, and 1344 is, for example, 0.5 or more, preferably 0.8 or more, more preferably 1 or more, and, for example, 10 or less. The thickness of the joint wirings 1341, 1342, 1343, and 1344 is the same as the thickness of the frame wiring 132. The thickness of the grounding wiring 1345 is, for example, 3. μ m~100 μ m, preferably 6 μ m~50 μ m.

[0143] The thickness of each of the multiple wiring bodies 431 and 432 is, for example, 3. μ m~100 μ m, preferably 5 μ m~50 μ m. The width of each of the multiple wiring bodies 431, 432 is, for example, 5 m. μ m~500 μ m, preferably 10 μ m~300 μ m.

[0144] The thickness of each of the grounding wiring sections 433 and 434 is, for example, 3. μ m~100 μ m, preferably 5 μ m~50 μ m. The width of each of the grounding wiring sections 433 and 434 is, for example, 5 m. μ m~500 μ m, preferably 10 μ m~300 μ m.

[0145] The widths of gaps 421, 422, and 423 are, for example, 5. μ m~500 μ m, preferably 10 μ m~300 μ m.

[0146] 1.8 First Force, Second Force, Third Force 1.8.1 First Force The first force required per unit length for moving the mounting portion 3 relative to the frame 2 in the first direction is 0.01 mN / mm or more, preferably 0.05 mN / mm or more, more preferably 0.1 mN / mm or more, further preferably 0.3 mN / mm or more, and especially preferably 0.5 mN / mm or more. If the first force is at or above the lower limit mentioned above, the frame 2 can reliably support the camera element 7 via the mounting portion 3.

[0147] The first force is 5 mN / mm or less, preferably 4 mN / mm or less, more preferably 3 mN / mm or less, even more preferably 2 mN / mm or less, and especially preferably 1 mN / mm or less. If the first force is below the above-mentioned upper limit, the sway correction of the mounting part can be performed with a small force.

[0148] The first force is 0.01 mN / mm to 5 mN / mm, preferably 0.05 mN / mm to 4 mN / mm, more preferably 0.1 mN / mm to 3 mN / mm, even more preferably 0.3 mN / mm to 2 mN / mm, and particularly preferably 0.5 mN / mm to 1 mN / mm. If the first force is within the above range, the mounting part 3 can be wobbled with a small force while the camera element 7 can be reliably supported.

[0149] The first force per unit length required to move the mounting part 3 relative to the frame 2 to one side in the first direction is the same as the first force per unit length required to move the mounting part 3 relative to the frame 2 to the other side in the first direction.

[0150] When the mounting part 3 is moved relative to the frame 2 to one side or the other side in the first direction, the posture of the mounting part 3 relative to the frame 2 is maintained. The state of maintaining the posture of the mounting part 3 relative to the frame 2 means that the first outer side 311A ​​and the first inner side 221A are parallel and the second outer side 312A and the second inner side 222A are parallel.

[0151] The first force is designed (adjusted) by adjusting the shape, configuration, and material of the joint 4.

[0152] The first force is calculated by simulating the shape, configuration, and material of the joint 4 through linear static analysis. The first force can also be determined by actual measurement. When measuring the first force, for example, the frame 2 is fixed to the fixing part of the measuring device, and the stress measuring part of the measuring device is fixed to the element mounting predetermined part 5 of the mounting part 3. The stress measuring part is then moved relative to the fixing part in the first direction, and the stress on the stress measuring part in the first direction is measured.

[0153] 1.8.2 Second Force The second force required per unit length to move the mounting part 3 relative to the frame 2 in the second direction is, for example, less than or equal to the first force. In other words, the first force is, for example, greater than or equal to the second force. That is, for example, the second force is the same as or less than the first force.

[0154] The second force is, for example, 0.01 mN / mm or more, preferably 0.05 mN / mm or more, more preferably 0.1 mN / mm or more, even more preferably 0.3 mN / mm or more, and particularly preferably 0.5 mN / mm or more. If the second force is at or above the lower limit mentioned above, the frame 2 can reliably support the camera element 7 via the mounting part 3.

[0155] The second force is, for example, 5 mN / mm or less, preferably less than 5 mN / mm, more preferably 4 mN / mm or less, even more preferably 3 mN / mm or less, particularly preferably 2 mN / mm or less, and most preferably 1 mN / mm or less. If the second force is below the above-mentioned upper limit, the sway correction of the mounting part can be performed with a small force.

[0156] The second force is, for example, 0.01 mN / mm to 5 mN / mm, preferably 0.05 mN / mm to 4 mN / mm, more preferably 0.1 mN / mm to 3 mN / mm, even more preferably 0.3 mN / mm to 2 mN / mm, and particularly preferably 0.5 mN / mm to 1 mN / mm. If the second force is within the above range, the mounting part 3 can be wobbled with a small force while the camera element 7 can be reliably supported.

[0157] The second force per unit length required to move the mounting part 3 relative to the frame 2 to one side in the second direction is the same as the second force per unit length required to move the mounting part 3 relative to the frame 2 to the other side in the second direction.

[0158] The ratio of the first force to the second force is, for example, 0.50 to 1.50.

[0159] When the mounting part 3 is moved relative to the frame 2 to one side or the other side in the second direction, the posture of the mounting part 3 relative to the frame 2 is maintained.

[0160] The second force is designed (adjusted) by adjusting the shape, configuration, and material of the joint 4.

[0161] The second force is calculated by simulating the shape, configuration, and material of the joint 4 through linear static analysis. The second force can also be determined by actual measurement. When measuring the second force, for example, the frame 2 is fixed to the fixing part of the measuring device, and the stress measuring part of the measuring device is fixed to the element mounting predetermined part 5 of the mounting part 3. The stress measuring part is then moved relative to the fixing part in the second direction, and the stress on the stress measuring part in the second direction is measured.

[0162] 1.8.3 The Third Force The third force per unit length required to move the mounting part 3 relative to the frame 2 in the thickness direction is, for example, less than the first force per unit length required to move the mounting part 3 relative to the frame 2 in the first direction.

[0163] The third force is, for example, 0.01 mN / mm or more, preferably 0.05 mN / mm or more, more preferably 0.1 mN / mm or more, even more preferably 0.3 mN / mm or more, and particularly preferably 0.5 mN / mm or more. If the third force is at or above the lower limit mentioned above, the frame 2 can reliably support the camera element 7 via the mounting part 3.

[0164] The third force is, for example, 5 mN / mm or less, preferably less than 5 mN / mm, more preferably 4 mN / mm or less, even more preferably 3 mN / mm or less, particularly preferably 2 mN / mm or less, and most preferably 1 mN / mm or less. If the third force is below the above-mentioned upper limit, the sway correction of the mounting part can be performed with a small force.

[0165] The third force is, for example, 0.01 mN / mm to 5 mN / mm, preferably 0.05 mN / mm to 4 mN / mm, more preferably 0.1 mN / mm to 3 mN / mm, even more preferably 0.3 mN / mm to 2 mN / mm, and particularly preferably 0.5 mN / mm to 1 mN / mm. If the third force is within the above range, the mounting part 3 can be wobbled with a small force while the camera element 7 can be reliably supported.

[0166] The third force per unit length required to move the mounting part 3 relative to the frame 2 to one side in a third direction is the same as the third force required to move the mounting part 3 relative to the frame 2 to the other side in a third direction.

[0167] When the mounting part 3 is moved relative to the frame 2 to one or the other side in a third direction, the posture of the mounting part 3 relative to the frame 2 is maintained.

[0168] The third force is designed (adjusted) by adjusting the shape, configuration, and material of the joint 4.

[0169] The third force is calculated by simulating the shape, configuration, and material of the joint 4 through linear static analysis. The third force can also be determined by actual measurement. When measuring the third force, for example, the frame 2 is fixed to the fixing part of the measuring device, and after the stress measuring part of the measuring device is fixed to the element mounting predetermined part 5 of the mounting part 3, the stress measuring part is moved relative to the fixing part in the third direction, and the stress on the stress measuring part in the third direction is measured.

[0170] 1.9 Manufacturing method of wiring circuit board 1 Reference Figure 4 A to Figure 4 E describes the manufacturing method of the wiring circuit board 1 and the mounting of the camera element 7.

[0171] like Figure 4 As shown in Figure A, in this method, firstly, a substrate insulating layer 12 is formed on one side of the metal support plate 110 in the thickness direction. The metal support plate 110 is a metal plate used to form the metal support layer 11. The metal support plate 110 comprises the same material as the metal support layer 11 and has the same thickness as the metal support layer 11.

[0172] For example, resin is coated on one side of the metal support plate 110, and a base insulating layer 12 with a pattern corresponding to the frame 2, the mounting part 3, and the joint part 4 is formed by photolithography. In this process, the base insulating layer 12 of the frame 2, the base insulating layer 12 of the mounting part 3, and the base insulating layer 12 of the joint part 4 are formed simultaneously.

[0173] like Figure 4 As shown in B, next, a wiring layer 13 is formed on one side of the substrate insulating layer 12 in the thickness direction. For example, the wiring layer 13 is formed by a conductor patterning method. Examples of conductor patterning methods include additive and subtractive methods, with additive methods being preferred. To form the wiring layer 13 using the additive method, firstly, the wiring layer 13 of the frame 2, a portion of the wiring layer 13 of the mounting portion 3 (refer to the imaginary line), and the wiring layer 13 of the junction portion 4 are formed simultaneously. The portion of the wiring layer 13 of the mounting portion 3 (refer to the imaginary line) is the junction wiring 1341, 1342, 1343, 1344, and the other side portion of the ground wiring 1345 in the thickness direction. Then, one side portion of the ground wiring 1345 in the thickness direction is stacked on the other side portion of the ground wiring 1345.

[0174] like Figure 4 As shown in C, a covering insulation layer 14 is then formed on one side of the base insulation layer 12 in the thickness direction in such a way as covering the frame wiring 132, wiring 134 and the joint wiring 1341, 1342, 1343, 1344.

[0175] For example, resin is coated on one side of the metal support plate 110, the base insulating layer 12, and the wiring layer 13, and a cover insulating layer 14 with a pattern corresponding to the frame 2, the mounting part 3, and the joint part 4 is formed by photolithography. In this process, the cover insulating layer 14 of the frame 2, the cover insulating layer 14 of the mounting part 3, and the cover insulating layer 14 of the joint part 4 are formed simultaneously.

[0176] like Figure 4 As shown in D, the metal support plate 110 is then shaped to form a metal support layer 11. Examples of shaped shaping include etching, stamping, and laser engraving. From a productivity point of view, etching is preferred. By shaped shaping the metal support plate 110, the metal support plate 110 between the frame 2 and the mounting portion 3 is removed. As a result, the joint portion 4 does not include the metal support layer 11.

[0177] like Figure 4 As shown in E, the camera element 7 is then mounted on the element mounting pre-positioning part 5 of the mounting part 3. The electrodes 71 of the camera element 7 are electrically connected to the plurality of terminals 133 in the mounting part 3.

[0178] In addition, the camera element 7 is mounted on the mounting section 3 via a mounting substrate (not shown).

[0179] Furthermore, the outer substrate 6 is mounted on the frame 2. The electrodes 61 of the outer substrate 6 are electrically connected to a plurality of frame terminals 131 in the frame 2. The outer periphery 21 of the frame 2 (refer to...) Figure 1 It can also be supported on external components (not shown).

[0180] 2. Effects of the first implementation method In this wiring circuit board 1, the first force is less than 5.0 mN / mm, so the wobbling correction of the mounting part 3 can be performed with a small force.

[0181] In the wiring circuit board 1, the first force is 0.01mN / mm or more, so the frame 2 can reliably support the camera element 7 via the mounting part 3.

[0182] In this wiring circuit board 1, the joint 4 is connected to the second portion 37 where multiple wirings 134 converge. Therefore, in the joint 4, the expansion of the connection portion 45 connected to the second portion 37 can be suppressed. As a result, the rigidity of the joint 4 can be reliably reduced.

[0183] In this wiring circuit board 1, the ratio of the length of the connection portion 45 along the direction of the second outer side 312A to the length of the second outer side 312A (length of connection portion 45 / length of the second outer side 312A) is 0.3 or less, thus suppressing the expansion of the connection portion 45. Therefore, the rigidity of the joint portion 4 can be reliably reduced.

[0184] Furthermore, if the connecting part 45 expands when the mounting part 3 moves and the joint part 4 flexes, the difference between the force applied to the central part in the width direction and the force applied to one end in the width direction in the joint part 4 increases. Therefore, there is a situation where the swaying of the mounting part 3 cannot be controlled with good precision.

[0185] However, in this wiring circuit board 1, when the frame 2 moves and the joint 4 flexes, the expansion of the connection 45 is suppressed. Therefore, the difference between the force applied to the central part in the width direction and the force applied to one end in the width direction in the joint 4 can be reduced. Therefore, the shaking of the mounting part 3 can be controlled with good precision.

[0186] In this wiring circuit board 1, the joint 4 is connected to the central region 34, so the shaking of the mounting part 3 can be controlled with good precision.

[0187] In this wiring circuit board 1, the joint 4 does not include a metal support layer 11. Therefore, the rigidity of the joint 4 is reduced. As a result, the mounting part 3 can be corrected for wobbling with a small force.

[0188] In this wiring circuit board 1, the base insulating layer 12 and the cover insulating layer 14 in the joint 4 have gaps 421, 422, and 423, which can further reduce the rigidity of the joint 4.

[0189] 3. Variations In the following variations, the same reference numerals are used to mark the same components and processes as in the first embodiment described above, and detailed descriptions are omitted. Furthermore, unless otherwise specified, each variation achieves the same effect as the first embodiment. Moreover, the first embodiment and its variations can be appropriately combined.

[0190] 3.1 First Variation In the first variation, such as Figure 5 As shown, the joint 4 has sub-joints 4511, 4512, 4521, 4522, 4531, and 4532.

[0191] Sub-joints 4511 and 4512 divide the gap 421 in the direction in which the gap 421 extends. Sub-joints 4511 and 4512 are spaced apart in the direction in which the gap 421 extends.

[0192] Sub-joints 4521 and 4522 divide the gap 422 in the direction in which the gap 422 extends. Sub-joints 4521 and 4522 are spaced apart in the direction in which the gap 422 extends. Figure 6 As shown, sub-joints 4521 and 4522 each connect wiring body portion 431 and wiring body portion 432. In addition, sub-joints 4521 and 4522 each connect the joint wiring 1344 of wiring body portion 431 to the joint wiring 1341 of wiring body portion 432.

[0193] Sub-joints 4531 and 4532 divide the gap 423 in the direction in which the gap 421 extends. Sub-joints 4531 and 4532 are spaced apart in the direction in which the gap 423 extends.

[0194] like Figure 5 As shown, sub-joints 4511, 4521, and 4531 are arranged in a direction that intersects the direction in which the joint 4 extends (intersecting direction, preferably orthogonal direction). Sub-joints 4512, 4522, and 4532 are arranged in a direction that intersects the direction in which the joint 4 extends (intersecting direction, preferably orthogonal direction).

[0195] like Figure 6 As shown, sub-junctions 4511, 4512, 4521, 4522, 4531, and 4532 do not include the covering insulating layer 14 but include the base insulating layer 12. In this modified example, sub-junctions 4511, 4512, 4521, 4522, 4531, and 4532 include only the base insulating layer 12.

[0196] According to the first modified example, the sub-joints 4521 and 4522 can suppress the excessive reduction in rigidity of the joint 4 caused by the gap 422. Therefore, excessive deformation of the joint 4 can be suppressed.

[0197] 3.2 Another variation of the first variation Although not shown in the figure, the sub-junctions 4511, 4512, 4521, 4522, 4531, and 4532 may also include a base insulating layer 12 and a cover insulating layer 14.

[0198] Although not shown in the figure, the sub-joints 4511, 4512, 4521, 4522, 4531, and 4532 may also consist only of the covering insulation layer 14.

[0199] 3.3 Second variation like Figure 7 As shown, the frame 2, the mounting part 3, and the joint part 4 may each be without the metal support layer 11.

[0200] In the second variation, the frame 2 is supported on the outer substrate 6 and an external component (not shown), and the mounting portion 3 is supported on the imaging element 7. Therefore, the rigidity of the joint 4 is lower than that of the frame 2 and the mounting portion 3. Thus, the mounting portion 3 can be corrected for wobbling with a small force.

[0201] 3.4 Other variations Although not shown in the figure, the mounting part 3 may not have a second part 37. In this case, the connecting part 4A is connected to the first part 36 of the mounting part 3.

[0202] Preferably, as in one embodiment, the mounting portion 3 has a second portion 37, and the joining portion 4A is connected to the second portion 37 of the mounting portion 3. In one embodiment, in the joining portion 4, the expansion of the connecting portion 45 connected to the second portion 37 in the intersecting direction (width direction) can be suppressed. As a result, the rigidity of the joining portion 4 can be reliably reduced.

[0203] In one embodiment, the inner periphery 22 of the frame 2 includes two first inner sides 221A, 221B and two second inner sides 222A, 222B. However, in a variation, the inner periphery 22 may also include a curve. Specifically, the inner periphery 22 may also be circular without inner sides.

[0204] In one embodiment, the outer periphery 31 of the mounting portion 3 includes two first outer sides 311A, 311B and two second outer sides 312A, 312B. However, in a variation, the outer periphery 31 may also include a curve. Specifically, the outer periphery 31 may also be circular without outer sides.

[0205] In one embodiment, the mounting portion 3 has an inner periphery 32, but in a modified embodiment, the mounting portion 3 may not have an inner periphery 32.

[0206] The joint 4A may also have a generally wavy shape. The number of joints 4 may also be two. The joints 4 may also have a straight shape and / or a curved shape.

[0207] 3.5 Third Variation like Figure 8 As shown, in addition to the frame 2, mounting part 3 and joining part 4 described above, the wiring circuit board 1 of the third modification also has connectors 8 and 9.

[0208] 3.5.1 Framework 2 The frame terminal 131 in frame 2 is opposite to the first inner side 221A. The frame terminal 131 in frame 2 is disposed between the first inner side 221A and the outer side disposed on its outer side.

[0209] 3.5.2 Joint 4 The joint 4, frame 2, and mounting part 3 are independent entities. For example... Figure 10 As shown, the joint 4 includes a joint base layer 41, a joint wiring layer 42, and a joint cover layer 43. The joint 4 does not have a metal support layer 11. The joint 4 also does not include an adhesive layer.

[0210] The joint base layer 41 forms the other side of the joint 4A in the thickness direction. The joint base layer 41 is exposed on the other side in the thickness direction. The material of the joint base layer 41 can be the same as or different from the material of the base insulation layer 12 in the frame 2. The thickness of the joint base layer 41 is, for example, 1. μ m~20 μ m, preferably 5 μ m~15 μ m.

[0211] The bonding wiring layer 42 is disposed on one side of the bonding base layer 41 in the thickness direction. The bonding wiring layer 42 is in contact with one side of the bonding base layer 41. Figure 12 As shown, the joint wiring layer 42 includes joint wiring 421 and joint terminals 422.

[0212] Multiple joint wirings 421 are arranged at intervals in a direction that intersects the direction of extension of the joint 4 (intersecting direction, preferably orthogonal direction). The joint wirings 421 are arranged in the middle part of the joint 4 in the direction of extension of the joint 4.

[0213] The joint terminal 422 includes a first terminal 4221 and a second terminal 4222. The first terminal 4221 is disposed at one end of the joint 4 in the direction in which the joint 4 extends.

[0214] The first terminal 4221 extends to one side from one end edge of the junction wiring 421 in the direction of extension of the junction 4. For example... Figure 9 As shown, the first terminal 4221 is provided with a plurality of corresponding joint wiring 421.

[0215] The second terminal 4222 is disposed at the other end of the joint 4 in the direction in which the joint 4 extends. The second terminal 4222 extends from the other end edge of the joint wiring 421 to the other side in the direction in which the joint 4 extends. Multiple second terminals 4222 are provided corresponding to multiple joint wirings 421.

[0216] The joint 4 also has gaps 441, 442, 443, and 444.

[0217] 3.5.3 Connector 8 like Figure 8 As shown, connector 8 is disposed on frame 2. Multiple connectors 8 are provided corresponding to two first inner sides 221A, 221B and two second inner sides 222A, 222B. The multiple connectors 8 include two first connector portions 81A, 81B and two second connector portions 82A, 82B.

[0218] The first connector portion 81A corresponds to the first inner side 221A. The first connector portion 81B corresponds to the first inner side 221B. The second connector portion 82A corresponds to the second inner side 222A. The second connector portion 82B corresponds to the second inner side 222B. Hereinafter, the first connector portion 81A will be described in detail. The first connector portion 81B, the second connector portions 82A, and 82B have the same structure as the first connector portion 81A, and their description will be omitted.

[0219] like Figure 11 As shown, the first connector portion 81A is disposed on one side of the metal support layer 11 in the thickness direction. Specifically, the first connector portion 81A is disposed on one side of the substrate insulating layer 12 in the thickness direction. The other side of the first connector portion 81A in the thickness direction is fixed to one side of the frame 2 in the thickness direction.

[0220] The first connector portion 81A has a recess 83A. The recess 83A includes a connector terminal. The connector terminal is electrically connected to the wiring layer 13 in the frame 2. Specifically, the connector terminal is connected to the frame wiring 132 (see reference). Figure 9 Electrical connection. When the first terminal 4221 (described later) of the joint 4 contacts the connector terminal, the joint wiring layer 142 of the joint 4 (see reference) Figure 9 ) and wiring layer 13 of frame 2 (refer to Figure 9 Electrical connection is achieved via connector terminals. The recess 83A is configured to allow one end of the engaging portion 4A to be inserted and secured. In this embodiment, the first connector portion 81A is a ZIF connector. The recess 83A faces the mounting portion 3. Specifically, as... Figure 8As shown, the recess 83A faces the first outer side 311A ​​of the mounting part 3.

[0221] 3.5.4 Connector 9 Connector 9 is disposed on mounting part 3. Multiple connector 9 are provided corresponding to two first outer sides 311A, 311B and two second outer sides 312A, 312B. Multiple connector 9 include two third connector parts 91A, 91B and two fourth connector parts 92A, 92B.

[0222] The third connector portion 91A corresponds to the first outer side 311A. The third connector portion 91B corresponds to the first outer side 311B. The fourth connector portion 92A corresponds to the second outer side 312A. The fourth connector portion 92B corresponds to the second outer side 312B. Hereinafter, the fourth connector portion 92A will be described in detail. The third connector portions 91A, 91B, and the fourth connector portion 92B have the same structure as the fourth connector portion 92A, and their description will be omitted.

[0223] like Figure 11 As shown, the fourth connector portion 92A is disposed on one side of the metal support layer 11 in the thickness direction. Specifically, the fourth connector portion 92A is disposed on one side of the substrate insulating layer 12 in the thickness direction. The other side of the fourth connector portion 92A in the thickness direction is fixed to one side of the mounting portion 3 in the thickness direction.

[0224] The fourth connector section 92A has a recess 94A. The recess 94A includes a connector terminal. The connector terminal is electrically connected to the wiring layer 13 in the mounting section 3. Specifically, the connector terminal is connected to the wiring 134 (see reference 134). Figure 9 Electrical connection. At the second terminal 4222 of the junction 4 (described later, see reference 4222) Figure 11 When the connector terminal is in contact, the wiring layer 1421 of the joint portion 4 and the wiring layer 13 of the mounting portion 3 (see reference) Figure 3 Electrical connection is achieved via connector terminals. The recess 94A is configured to allow insertion of the other end of the engagement portion 4A, thereby securing the other end of the engagement portion 4A. In this embodiment, the fourth connector portion 92A is a ZIF connector. The recess 94A faces the frame 2. Specifically, as... Figure 1 As shown, the recess 94A faces the second inner side 222A of the frame 2.

[0225] 3.5.5 Manufacturing method of wiring circuit board 1 Reference Figure 10 , Figure 12 A, Figure 12 B describes the manufacturing method of the wiring circuit board 1 and the mounting of the camera element 7.

[0226] The manufacturing method of the wiring circuit board 1 includes process (1) and process (2). Process (1) and process (2) are performed sequentially.

[0227] 3.5.6 Process (1) like Figure 12 As shown in B, in process (1), kit 10 is prepared.

[0228] The kit 10 includes the frame 2, mounting part 3, and connecting part 4 as described above. Specifically, the kit 10 separately includes the frame 2, mounting part 3, and connecting part 4. In the kit 10, when the connecting part 4 connects the frame 2 and the mounting part 3, the connecting part 4 is an independent entity from the frame 2 and the mounting part 3. In other words, in step (1), the connecting part 4 has not yet connected the frame 2 and the mounting part 3 to the connecting part 4. Specifically, one end of the connecting part 4 has not yet been inserted into and fixed to the connector 8 in the frame 2. The other end of the connecting part 4 has not yet been inserted into and fixed to the connector 9 in the mounting part 3.

[0229] 3.5.7 Preparation of Frame 2 and Mounting Unit 3 like Figure 12 As shown in Figure A, for example, a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14 are sequentially formed on one side of the metal plate in the thickness direction. In the formation of the base insulating layer 12 and the cover insulating layer 14, optical processing for the photosensitive resin is used. In the formation of the wiring layer 13, for example, an additive or subtractive method is used.

[0230] Then, the metal plate is shaped to form a metal support layer 11. In the shaping process, for example, etching is used.

[0231] As described above, the frame 2 and the mounting part 3 are prepared separately. In this embodiment, the frame 2 and the mounting part 3 are prepared separately.

[0232] 3.5.8 Preparation of Joint 4 For example, a junction wiring layer 142 and a junction cover layer 143 are sequentially formed on one side of the junction base layer 141. In the formation of the junction wiring layer 142, for example, an additive or subtractive method is used. In the formation of the junction cover layer 143, an optical processing method for the photosensitive resin is used.

[0233] Then, gaps 441, 442, 443, and 444 are formed in the joint base layer 141 and the joint cover layer 143. The gaps 441, 442, 443, and 444 are formed, for example, using laser processing. Thus, the joint 4 is prepared.

[0234] Then, as Figure 12As shown in Figure B, connector 8 is installed on frame 2. Connector 9 is installed on mounting part 3. Thus, kit 10 is prepared.

[0235] 3.5.9 Process (2) like Figure 11 as well as Figure 12 As indicated by arrow B, in process (2), the frame 2 and the mounting part 3 are connected by the joint 4.

[0236] Specifically, one end of the connecting portion 4 is inserted into the recess 53A of the connector 8 (first connector portion 81A). The other end of the connecting portion 4 is inserted into the recess 93A of the connector 9 (fourth connector portion 92A).

[0237] Therefore, the first terminal 4221 contacts the connector terminal of connector 8. The second terminal 4222 contacts the connector terminal of connector 9.

[0238] One end of the joint 4 is fixed to the connector 8. The other end of the joint 4 is fixed to the connector 9.

[0239] Thus, the joint 4 connects the frame 2 and the mounting part 3 in a manner that treats the joint 4, frame 2, and mounting part 3 as independent entities.

[0240] Thus, a wiring circuit board 1 is manufactured.

[0241] 3.6 Fourth Variation like Figure 13 As shown, in this modified example, the metal support layer 11 can also be a rigid substrate 112. The rigid substrate 112 is bonded to the lower surface of the base insulating layer 12 in the thickness direction via an adhesive layer 113. The rigid substrate 112 has a second base insulating layer 114 and a second wiring layer 115 sequentially on the other side in the thickness direction. The second base insulating layer 114 is rigid. For example, glass-epoxy resin can be used as a material for the second base insulating layer 114. The rigid substrate 112 may also have a second cover insulating layer.

[0242] 3.7 Fifth Variation like Figure 14 As shown, the frame 2 and the mounting portion 3 each have a third base insulating layer 15, a third wiring layer 16, a third cover insulating layer 17, a fourth wiring layer 18, a fourth cover insulating layer 19, and a metal support layer 11. The joint portion 4 does not include the metal support layer 11, but has the third base insulating layer 15, the third wiring layer 16, the third cover insulating layer 17, the fourth wiring layer 18, and the fourth cover insulating layer 19.

[0243] The third base insulating layer 15 extends along the surface direction. The shape, material, and thickness of the third base insulating layer 15 may also be the same as those of the base insulating layer 12 in one embodiment. The third base insulating layer 15 in the frame 2 and the mounting part 3 has a through hole 151.

[0244] The third wiring layer 16 is disposed on one side of the third substrate insulating layer 15 in the thickness direction. The third wiring layer 16 includes a third wiring 161. The third wiring layer 16 in the frame 2 and the mounting part 3 includes a third terminal 162. The third terminal 162 has a protective layer 163 on one side in the thickness direction.

[0245] The third cover insulating layer 17 is disposed on one side of the third base insulating layer 15 in the thickness direction. The third cover insulating layer 17 covers the third wiring 161, which is part of the third wiring layer 16.

[0246] The third covering insulation layer 17 may also include an adhesive layer 171 on the other side in the thickness direction.

[0247] The fourth wiring layer 18 is disposed on the other side of the third substrate insulating layer 15 in the thickness direction. The fourth wiring layer 18 includes a fourth wiring 181. The fourth wiring layer 18 in the frame 2 and the mounting part 3 includes a fourth terminal 182. The fourth terminal 182 is electrically connected to the third terminal 162 via a conductive connection portion 164. The conductive connection portion 164 fills the through hole 151.

[0248] A fourth cover insulating layer 19 is disposed on the opposite side of the third base insulating layer 15 in the thickness direction. The fourth cover insulating layer 19 covers the fourth wiring layer 18. The fourth cover insulating layer 19 may also include an adhesive layer 191 on one side in the thickness direction. The fourth cover insulating layer 19 has a through hole 192.

[0249] The metal support layer 11 in the frame 2 and the mounting portion 3 is disposed on the other side of the fourth covering insulating layer 19 in the thickness direction. The metal support layer 11 is bonded to the other side of the fourth covering insulating layer 19 via an adhesive layer 111. The adhesive layer 111 is, for example, conductive. The adhesive layer 111 is disposed on the other side of the fourth covering insulating layer 19 in the thickness direction. A portion of the adhesive layer 111 fills the through hole 192. The joining portion 4 does not have the adhesive layer 111.

[0250] 3.8 Sixth Variation like Figure 15 As shown, the mounting portion 3 and the connecting portion 4 are integrated. The mounting portion 3 and the connecting portion 4 both have a connecting portion 100 with the mounting portion. That is, the connecting portion 100 with the mounting portion integrally includes the mounting portion 3 and the connecting portion 4. The wiring circuit board 1 of the sixth modification includes a frame 2, a connector 8, and a connecting portion 100 with the mounting portion.

[0251] The frame terminal 131 in frame 2 is opposite to the second outer side piece 312A in mounting part 3. The frame terminal 131 in frame 2 is disposed between the second inner side piece 222A and the outer side piece disposed on its outer side.

[0252] Connector 8 is disposed on frame 2. Two connectors 8 (81A, 81B) are provided corresponding to the two first inner sides 221A, 221B. The recess 83A of connector 81A and the recess 83B of connector 81B both open toward the other side in the first direction.

[0253] The joint 100 with mounting portion includes a metal support layer 11, a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14. The joint 4 in the joint 100 with mounting portion includes a first joint 41A and a second joint 42A.

[0254] The first engagement portion 41A has a curved shape. In the first engagement portion 41A, at least the middle portion in the extending direction is curved. The first engagement portion 41A extends from the second outer side 312B of the mounting portion 3 to the other side in the first direction, bends, and returns to one side in the first direction. The front end portion 411A of the first engagement portion 41A is inserted into the recess 83A of the connector 81A.

[0255] The second joint portion 42A is linearly symmetrical to the first joint portion 41A with respect to line L. Line L passes through the center of the mounting portion 3 along the first direction. The second joint portion 42A is spaced apart from the first joint portion 41A. The second joint portion 42A has a curved shape. In the second joint portion 42A, at least the middle portion in the extending direction is curved. The second joint portion 42A extends from the second outer side 312B of the mounting portion 3 towards one side in the first direction, bends, and returns to the other side in the first direction. The front end portion 421A of the second joint portion 42A is inserted into the recess 83B of the connector 81B. In addition, the shapes of the first joint portion 41A and the second joint portion 42A are not particularly limited as long as both the first force and the second force satisfy 0.01mN / mm or more and 5.0mN / mm or less. For example, at least one of the first joint portion 41A and the second joint portion 42A may have a shape in place of a partial bend instead of an overall bend in the joint portion.

[0256] In the sixth variation, the direction in which the two joints 41A and 41B are arranged (or opposite each other) is the second direction. In the sixth variation, the direction orthogonal to the two bent parts 4111 is the first direction.

[0257] In the sixth variation, when the mounting part 3 is moved relative to the frame 2 in the first direction, the degree of bending (deflection) of the two joints 41A and 41B changes, and a first force within the range described above is applied.

[0258] 3.9 Seventh Variation like Figure 16 As shown, in the seventh modification, the two joints 4 of the sixth modification are symmetrically arranged with respect to the center point of the mounting portion 3. That is, the second joint 42A is symmetrical with respect to the center of the mounting portion 3 as the first joint 41A.

[0259] The recess 83B of connector 81B opens toward the side facing the first direction. That is, the recess 83B opens toward the opposite direction to the recess 83A.

[0260] The second joint 42A extends from the second outer side 312A of the mounting part 3 in one direction, bends, and returns to the other side in the first direction.

[0261] Example Example 1 manufacture Figures 1 to 3 The wiring circuit board 1 shown is used to form the wiring layer 13 using an additive method.

[0262] The dimensions and materials are as follows: Width of joint 4: 850 μ m; Width of gaps 421, 422, and 423: 40 μ m; Width of wiring sections 431 and 432: 150 μ m; Thickness of wiring components 431 and 432: 45 μ m; Width of grounding wiring sections 433 and 434: 120 μ m; Thickness of grounding wiring body parts 433 and 434: 45 μ m; Thickness of substrate insulating layer 12: 12 μ m; The thickness of the grounding wiring 1345 in joint 4 is 24. μ m; Width of grounding wiring 1345 in joint 4: 50 μ m; Thickness of wiring at the joint 1341, 1342, 1343, and 1344: 12 μ m; Width of joint wiring 1341, 1342, 1343, 1344: 20 μ m; Thickness of the covering insulation layer 14: 6 μ m; Thickness of metal support layer 11: 120 μ m; The materials of the base insulating layer 12 and the covering insulating layer 14 are: polyimide; Material of wiring layer 13 and Young's modulus at 25°C: copper, 45 GPa.

[0263] Example 2 The wiring circuit board 1 is manufactured in the same manner as in Example 1. However, the wiring layer 13 is formed using a subtractive method. The dimensions are changed as follows: Back side: Thickness of grounding wiring 1345 in joint 4: 24 μ m; Back side: Width of grounding wiring 1345 in joint 4: 50 μ m; Front: Thickness of wiring 1341, 1342, 1343, and 1344 at the joint: 9 mm μ m; Front: Width of joint wiring 1341, 1342, 1343, 1344: 20 μ m; Thickness of the insulating layer 14 covering the junction wiring: 24 μ m; Thickness of the covering insulation layer 14 on the grounding wiring: 40 μ m.

[0264] Comparative Example 1 The wiring circuit board 1 is manufactured in the same manner as in Embodiment 1. However, a metal support layer 11 is provided at the joint 4.

[0265] (evaluate) For the wiring circuit board 1 of Examples 1, 2, and Comparative Example 1, a first force, a second force, and a third force were calculated. Ansys Mechanical (simulation software) was used in the linear static analysis. The results are shown in Table 1.

[0266] [Table 1] Furthermore, the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Variations of the invention that are obvious to those skilled in the art are included within the scope of the following claims.

[0267] Industrial availability The wiring circuit board of the present invention is suitable for use, for example, in the manufacture of camera devices.

[0268] Symbol Explanation 1. Wiring circuit board 11 Metal support layer 12. Substrate insulation layer 13 Wiring Layer 131 Frame Terminal 132 Frame Cabling 133 terminal 134 wiring 14. Cover with insulation layer 15 Third base insulating layer 16 Third wiring layer 17 Third Cover Insulation Layer 18 Fourth wiring layer 19 Fourth Cover Insulation Layer 2 Framework 21 Peripheral edge 25 Part Three 26 Part Four 28 Second Central Division 29 Second Central Region 3. Mounting section 31 Peripheral edge 311A, 311B First outer edge (an example of an outer edge) 312A, 312B Second outer edge (an example of an outer edge) 34 Central Region 35. Central Department 36 Part One 37 Part Two 4. Joint 421, 422, 423, 441, 442, 443, 444 gaps Sub-joints 4511, 4512, 4521, 4522, 4531, 4532 45 Connecting part 46 Second connecting part 5 components are pre-installed. 51A, 51B First side 52A, 52B Second Side 7. Camera element 8 and 9 connectors.

Claims

1. A wiring circuit board, comprising: frame; The mounting portion, which is surrounded by the frame and spaced apart from the frame; and The joint connects the frame and the mounting part. The mounting portion has a thickness. The mounting portion has a component mounting pre-positioning portion for mounting components, which is rectangular in shape when viewed in a direction orthogonal to the thickness direction. The component mounting portion includes two first sides spaced apart and parallel to each other, and two second sides, wherein the two second sides connect one end of the two first sides and the other end of the two first sides. The first force required per unit length to move the mounting part relative to the frame in a first direction along the first side is 0.01 mN / mm or more and 5.0 mN / mm or less.

2. The wiring circuit board according to claim 1, wherein, The second force required per unit length to move the mounting part relative to the frame in the second direction along the second side is 0.01 mN / mm or more and 5.0 mN / mm or less.

3. The wiring circuit board according to claim 1, wherein, The third force required per unit length to move the mounting part relative to the frame in the thickness direction is 0.01 mN / mm or more and 5.0 mN / mm or less.

4. The wiring circuit board according to claim 1, wherein, The frame, the mounting portion, and the connecting portion include a wiring layer. The wiring layer in the mounting section includes: a plurality of terminals spaced apart from each other; and a plurality of wires spaced apart from each other, wherein the plurality of wires are electrically connected to the plurality of terminals respectively. The wiring layer in the joint has a plurality of joint wirings spaced apart from each other, and the plurality of joint wirings are electrically connected to the plurality of wirings respectively. The mounting portion has a first portion and a second portion, in which the plurality of wires extend from the plurality of terminals, and the second portion is disposed between the first portion and the outer periphery of the mounting portion, and for the plurality of wires to converge. The joint is connected to the second part.

5. The wiring circuit board according to claim 1, wherein, The mounting portion has an outer side disposed outside the component mounting predetermined portion. The joint includes a connecting portion on its outer side for connection. The ratio of the length of the connecting portion along the outer side to the length of the outer side, i.e., the length of the connecting portion / the length of the outer side, is 0.3 or less.

6. The wiring circuit board according to claim 1, wherein, The mounting portion has an outer side disposed outside the component mounting predetermined portion. The joint is connected to the central region, which includes the central portion of the outer side and has a length of 1 / 2 the length of the outer side.

7. The wiring circuit board according to claim 4 or 5, wherein, The frame and the mounting portion each include: a substrate insulating layer; a wiring layer disposed on one side of the substrate insulating layer in the thickness direction; and a covering insulating layer disposed on one side of the substrate insulating layer in the thickness direction and covering a portion of the wiring layer. The frame and the mounting portion may also include a metal support layer disposed on the other side of the substrate insulating layer in the thickness direction. The joint does not include the metal support layer, and the joint includes the base insulation layer, the wiring layer, and the cover insulation layer.

8. The wiring circuit board according to claim 7, wherein, The wiring layer in the joint has a plurality of joint wirings spaced apart from each other. The base insulation layer and the cover insulation layer in the joint have gaps disposed between the plurality of joint wirings.

9. The wiring circuit board according to claim 8, wherein, The gap extends along the wiring of the plurality of joints. The joint has sub-joints that divide the gap in the direction in which the gap extends and connect the wiring of the plurality of joints.

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