Laser processing equipment for circuit board processing

Abstract

The invention belongs to the technical field of circuit board processing, particularly relates to laser processing equipment for circuit board processing, and provides the following scheme aiming at the problem that existing smoke dust and slag with temperature are easy to damage and even condense on the surface of a filter screen: the laser processing equipment comprises a workbench, and a plurality of rows of sliding openings are formed in the top end of the workbench; a circuit board clamping assembly is arranged between the two sliding openings in each row, and a rectangular frame is arranged at the top end of the workbench in a sliding mode. According to the laser cutting device, the surrounding suction cover obliquely surrounds the outer side of the laser cutting head all the time, and the surrounding suction cover obliquely stands at the upper end of the circuit board along with work of the laser cutting head, so that the circuit board can conduct heat to the surface of the surrounding suction cover in time; smoke and slag generated by laser cutting of the circuit board and heat reserved on the surface of the circuit board and the surface of a laser cutting head are pumped away through the surrounding suction cover, preliminary segmentation is conducted on the surrounding suction cover through the ceramic net cover, then mixed gas flow is filtered and cooled through the ceramic filter cover, the intercepting net and the heat exchange assembly of the filter box in sequence, and the inside of the air pump is prevented from being damaged by the mixed gas flow.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and more particularly to a laser processing device for circuit board processing. Background Technology

[0002] Circuit boards are the core carriers for electronic components, formed through design, manufacturing, and assembly. Their core function is to miniaturize and visualize circuit layouts, playing a crucial role in the mass production of fixed circuits and optimizing the layout of electrical appliances. They are widely used in the production and layout optimization of electronic equipment. The application of laser technology in circuit board processing has become a core solution for high-precision manufacturing, especially driven by fields such as 5G communication, artificial intelligence, and new energy vehicles, where its advantages are significant. Its main applications include circuit board separation, drilling, engraving, and surface treatment.

[0003] A search revealed a patent with publication number CN119457461A entitled "A Laser Etching Apparatus for Circuit Board Processing." The technical problem it addresses is that when a laser beam irradiates the circuit board material, the material absorbs the laser energy, causing a rapid increase in local temperature. This makes the clamping part of the fixture susceptible to high temperatures, which, over time, can damage the fixture of the laser etching machine, affecting the etching process. Simultaneously, the high temperature also generates smoke and dust that rises, easily interfering with the laser etching head of the laser etching machine, thus affecting the etching quality of the circuit board. The patent aims to address this issue by... The coordinated operation of the frame, transmission mechanism, drive mechanism, concave block, clamping mechanism, and pressing mechanism allows the laser etching machine to securely clamp circuit boards of different sizes from the top and side edges when etching circuit patterns on circuit boards. Furthermore, when the laser beam from the etching head etches circuit patterns on the edges of the circuit board, each clamping part can flexibly avoid the laser beam, and each clamping part can re-clamp the circuit board when the laser beam moves past. This avoids high-temperature damage to the clamping parts while ensuring the stability of the circuit board, thus preventing any disruption to the etching process.

[0004] However, the following drawbacks still need to be addressed: the fumes and slag generated by laser etching at the top of the circuit board are drawn away and transferred by negative pressure. The fumes and slag with temperature are easily damaged or even condensed on the surface of the filter screen, which in turn damages the fan and affects the progress and efficiency of circuit board processing. Summary of the Invention

[0005] In view of the existing technical problem that heated fumes and slag can easily damage or even condense on the surface of the filter screen, the present invention proposes a laser processing equipment for circuit board processing.

[0006] This invention proposes a laser processing equipment for circuit board processing, comprising a worktable with multiple rows of sliding openings at the top, and a circuit board clamping assembly between two sliding openings in each row. A rectangular frame is slidably mounted on the top of the worktable, with a limiting opening between the top and bottom of the rectangular frame. A threaded rod is rotatably mounted inside the rectangular frame. A movable component is sleeved between the rectangular frame, the threaded rod, and the two limiting openings, and a hydraulic column is fixedly mounted at the bottom of the movable component. An air pump is fixedly mounted on the outer wall of one end of the movable component, and a T-shaped guide is fixedly mounted in the middle of the outer wall of the other end of the movable component. An L-shaped plate is fixedly mounted at the bottom of the hydraulic column, with a strip-shaped hole in the middle of the vertical section of the L-shaped plate. A filter box is fixedly mounted at one end of the horizontal section of the L-shaped plate, and a laser generator is fixedly mounted at the lower end of the vertical section of the L-shaped plate. A stabilizing rod is fixedly mounted at the bottom of the horizontal section of the L-shaped plate, and a suction hood is fixedly mounted at the bottom of the stabilizing rod at an angle. A trapezoidal opening is provided at one end of the circumference of the suction hood. A laser cutting head is fixedly mounted at the bottom of the laser generator, and the suction hood is angled around the outside of the laser cutting head.

[0007] Preferably, the top of the workbench is provided with sliding grooves on both sides, and T-shaped blocks are slidably installed inside the sliding grooves. Support rods are fixedly connected between the top of the two T-shaped blocks and the bottom sides of the rectangular frame. A U-shaped plate is fixedly connected between the bottom ends of the two T-shaped blocks. A toothed plate is fixedly provided in the middle of the inner wall of the top of the workbench. An active toothed roller is rotatably provided in the middle of the bottom end of the U-shaped plate, and the circumference of the active toothed roller meshes with the toothed plate.

[0008] Preferably, a first drive motor is fixedly installed at the input end of the active toothed roller, and a second drive motor is fixedly installed at the input end of the threaded rod.

[0009] Preferably, the T-shaped guide slides circumferentially inside the strip-shaped hole.

[0010] Preferably, a guide pipe is fixedly connected between the outlet end of the suction hood and the inlet end of the filter box, and a suction pipe is fixedly connected between the outlet end of the filter box and the inlet end of the air pump.

[0011] Preferably, a ceramic filter cover, an intercepting net, and a heat exchange assembly are fixedly installed inside the filter box from bottom to top, and a connecting frame is fixedly installed between the top of the ceramic filter cover and the bottom of the intercepting net, with the bottom of the ceramic filter cover located at the upper end of the filter box inlet.

[0012] Preferably, a vibration motor is fixedly installed in the middle of the inner wall of one end of the filter box, and the vibration rod of the vibration motor is close to the connecting frame. The lower end and bottom end of the outer wall of one side of the filter box are provided with slag discharge ports, and a sealing cover is fixedly installed on the outside of the slag discharge ports. One of the slag discharge ports is located at the lower end of the inner wall of the bottom of the filter box, and the other slag discharge port is located at the lower end of the outer wall of the ceramic filter cover.

[0013] Preferably, a ceramic mesh is fixedly installed inside the suction hood, and the ceramic mesh is arc-shaped and located inside the outlet end of the suction hood. The trapezoidal opening is wider on the outside and narrower on the inside, and the outer length of the trapezoidal opening is the same as the radius of the suction hood.

[0014] The beneficial effects of this invention are as follows: This invention proposes a laser processing device for circuit board manufacturing. A suction hood is always tilted around the outside of a laser cutting head. The suction hood moves synchronously with the laser cutting head in the longitudinal, lateral, and vertical directions. When processing a circuit board, the suction hood tilts and stands on top of the circuit board as the laser cutting head operates, allowing heat from the circuit board to be transferred to the surface of the suction hood in a timely manner. An air pump operates, causing the suction hood to remove the fumes and slag generated during laser cutting of the circuit board, as well as the heat remaining on the surface of the circuit board and the laser cutting head. A ceramic mesh cover then performs preliminary segmentation, breaking large slag pieces into multiple parts and helping to evenly distribute heat, preventing localized overheating and damage. The airflow is filtered and cooled sequentially by the ceramic filter cover, interceptor mesh, and heat exchange components of the filter box. This significantly reduces the amount of particulate matter entering the air pump and lowers its temperature, preventing damage to the pump's internal structure. One discharge port is located at the bottom of the filter box's inner wall, and the other at the bottom of the ceramic filter cover's outer wall. Periodically starting the vibration motor allows it to transmit vibration to the frame, causing the ceramic filter cover and interceptor mesh to vibrate. This shakes off the particles clogging the filter holes and concentrates them at the bottom of the filter box and the bottom of the top outer wall of the ceramic filter cover, allowing them to be discharged periodically. This ensures the ceramic filter cover and interceptor mesh effectively intercept the mixed airflow.

[0015] The present invention proposes a laser processing equipment for circuit board processing. By extending the hydraulic column, the laser cutting head can be brought closer to the circuit board for processing. By shortening the hydraulic column, the laser cutting head can be moved away from the circuit board. During the process of the laser cutting head approaching or moving away from the circuit board, the L-shaped plate moves along the outer wall of the moving part with the extension and retraction of the hydraulic column, and the strip hole also slides along the T-shaped guide, making the up and down movement of the L-shaped plate more stable and reliable. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a laser processing equipment for circuit board processing proposed in this invention; Figure 2 This is a bottom view of the structure of a laser processing equipment for circuit board processing proposed in this invention; Figure 3 This is a schematic diagram of the rectangular frame structure of a laser processing equipment for circuit board processing proposed in this invention; Figure 4 This is a schematic diagram of the structure of an L-shaped plate in a laser processing equipment for circuit board processing proposed in this invention; Figure 5This is a schematic diagram of the structure of the suction cover of a laser processing equipment for circuit board processing proposed in this invention; Figure 6 This is a schematic diagram of the structure of a filter box for a laser processing equipment for circuit board processing proposed in this invention.

[0017] In the diagram: 1. Workbench, 2. Slide opening, 3. Slide groove, 4. T-block, 5. U-shaped plate, 6. First drive motor, 7. Active toothed roller, 8. Toothed plate, 9. Support rod, 10. Rectangular frame, 11. Limiting port, 12. Threaded rod, 13. Second drive motor, 14. Moving part, 15. Hydraulic column, 16. L-shaped plate, 17. T-shaped guide, 19. Strip hole, 20. Laser generator, 21. Laser cutting head, 22. Filter box, 23. Air pump, 24. Suction pipe, 25. Guide pipe, 26. Enclosure suction cover, 27. Stabilizing rod, 28. Trapezoidal opening, 29. Ceramic mesh cover, 30. Vibration motor, 31. Ceramic filter cover, 32. Interception net, 33. Heat exchange component, 34. Slag discharge port, 35. Sealing cover, 36. Connecting frame. Detailed Implementation

[0018] Reference Figure 1-6 A laser processing device for circuit board processing includes a worktable 1. The top of the worktable 1 has multiple rows of sliding openings 2, and a circuit board clamping assembly is provided between two sliding openings 2 in each row. A rectangular frame 10 is slidably mounted on the top of the worktable 1, and a limiting opening 11 is provided between the top and bottom of the rectangular frame 10. A threaded rod 12 is rotatably mounted inside the rectangular frame 10. A movable component 14 is sleeved between the rectangular frame 10, the threaded rod 12, and the two limiting openings 11. A hydraulic column 15 is fixedly mounted on the bottom of the movable component 14. An air pump 23 is fixedly mounted on the outer wall of one end of the movable component 14, and the other end of the movable component 14 is fixedly mounted on the middle of its outer wall. A T-shaped guide 17 is fixedly installed. An L-shaped plate 16 is fixedly installed at the bottom of the hydraulic column 15. A strip-shaped hole 19 is provided in the middle of the vertical section of the L-shaped plate 16. A filter box 22 is fixedly installed at one end of the horizontal section of the L-shaped plate 16. A laser generator 20 is fixedly installed at the lower end of the vertical section of the L-shaped plate 16. A stabilizing rod 27 is fixedly installed at the bottom end of the horizontal section of the L-shaped plate 16. A suction cover 26 is fixedly installed at the bottom end of the stabilizing rod 27 at an angle. A trapezoidal opening 28 is provided at one end of the circumference of the suction cover 26. A laser cutting head 21 is fixedly installed at the bottom end of the laser generator 20. The suction cover 26 is tilted around the outside of the laser cutting head 21.

[0019] In this invention, the top of the workbench 1 is provided with sliding grooves 3 on both sides, and T-shaped blocks 4 are slidably installed inside the sliding grooves 3. Support rods 9 are fixedly connected between the top of the two T-shaped blocks 4 and the bottom sides of the rectangular frame 10. U-shaped plates 5 are fixedly connected between the bottom ends of the two T-shaped blocks 4. A toothed plate 8 is fixedly provided in the middle of the inner wall of the top of the workbench 1. An active toothed roller 7 is rotatably provided in the middle of the bottom end of the U-shaped plate 5, and the circumference of the active toothed roller 7 meshes with the toothed plate 8. The active toothed roller 7 can be rotated along the toothed plate 8 by the first drive motor 6, so that the U-shaped plate 5 carries the two T-shaped blocks 4, the two support rods 9 and the rectangular frame 10 to move along the direction of the sliding groove 3. The moving part 14 can be moved along the direction of the rectangular frame 10 by the second drive motor 13, and the threaded rod 12 can be rotated to make the laser generator 20 and the laser cutting head 21 move according to a predetermined trajectory to process the circuit board. The input end of the active toothed roller 7 is fixedly installed with a first drive motor 6, and the input end of the threaded rod 12 is fixedly installed with a second drive motor 13. The T-shaped guide 17 slides circumferentially inside the strip hole 19. The extension of the hydraulic column 15 allows the laser cutting head 21 to approach the circuit board for processing. The retraction of the hydraulic column 15 allows the laser cutting head 21 to move away from the circuit board. During the process of the laser cutting head 21 approaching or moving away from the circuit board, the L-shaped plate 16 moves along the outer wall of the moving part 14 as the hydraulic column 15 extends and retracts. The strip hole 19 also slides along the T-shaped guide 17, making the L-shaped plate 16 more stable and reliable during its up and down movement. A guide pipe 25 is fixedly connected between the outlet end of the suction hood 26 and the inlet end of the filter box 22, and a suction pipe 24 is fixedly connected between the outlet end of the filter box 22 and the inlet end of the air pump 23. The air pump 23 operates to cause the suction hood 26 to extract the fumes and slag generated during laser cutting of the circuit board, as well as the heat remaining on the surface of the circuit board and the laser cutting head 21. A ceramic mesh cover 29 initially separates the slag, breaking large slag pieces into multiple parts and helping to evenly distribute the heat, preventing localized overheating and damage to the guide pipe 25. The ceramic filter cover 31, the intercepting mesh 32, and the heat exchange assembly 33 of the filter box 22 then sequentially process the mixed airflow. Filtration and cooling significantly reduce the particulate matter entering the airflow into the air pump 23, and the temperature is significantly lowered, preventing damage to the internal structure of the air pump 23. One of the slag discharge ports 34 is located at the bottom of the inner wall of the filter box 22, and the other slag discharge port 34 is located at the bottom of the outer wall of the ceramic filter cover 31. Periodically starting the vibration motor 30 can transmit the vibration to the vibration frame 36, causing the ceramic filter cover 31 and the intercepting net 32 ​​to vibrate, shaking off the particulate matter clogging the filter holes and concentrating it at the bottom of the filter box 22 and the bottom of the outer wall of the top of the ceramic filter cover 31. This allows for periodic discharge, ensuring the high efficiency of the ceramic filter cover 31 and the intercepting net 32 ​​in intercepting the mixed airflow. Inside the filter box 22, a ceramic filter cover 31, an intercepting net 32, and a heat exchange assembly 33 are fixedly installed from bottom to top. A connecting frame 36 is fixedly installed between the top of the ceramic filter cover 31 and the bottom of the intercepting net 32. The bottom of the ceramic filter cover 31 is located at the upper end of the inlet of the filter box 22. A vibration motor 30 is fixedly installed in the middle of the inner wall of one end of the filter box 22, and the vibration rod of the vibration motor 30 is close to the connecting frame 36. The lower end and bottom end of the outer wall of one side of the filter box 22 are provided with slag discharge ports 34, and a sealing cover 35 is fixedly installed on the outside of the slag discharge ports 34. One of the slag discharge ports 34 is located at the lower end of the inner wall of the bottom end of the filter box 22, and the other slag discharge port 34 is located at the lower end of the outer wall of the ceramic filter cover 31. A ceramic mesh cover 29 is fixedly installed inside the suction cover 26. The ceramic mesh cover 29 is arc-shaped and located inside the outlet end of the suction cover 26. The trapezoidal opening 28 is wider on the outside and narrower on the inside, and the outer length of the trapezoidal opening 28 is the same as the radius of the suction cover 26.

[0020] Working principle: The suction hood 26 is always tilted around the outside of the laser cutting head 21. The suction hood 26 moves synchronously with the laser cutting head 21 in the longitudinal, lateral, and vertical directions. When processing the circuit board, the suction hood 26 tilts and stands on the top of the circuit board as the laser cutting head 21 works, allowing the circuit board to conduct heat to the surface of the suction hood 26 in a timely manner. The air pump 23 works, causing the suction hood 26 to remove the fumes and slag generated by the laser cutting of the circuit board, as well as the heat remaining on the surface of the circuit board and the laser cutting head 21. The ceramic mesh cover 29 performs preliminary separation, breaking large slags into multiple parts and helping to evenly distribute the heat, avoiding local overheating and damage to the guide pipe 25. Then, the ceramic mesh cover 29 removes the slag. The ceramic filter cover 31, the intercepting net 32, and the heat exchange component 33 sequentially filter and cool the mixed airflow, greatly reducing the particulate matter entering the airflow into the air pump 23 and significantly lowering the temperature, thus preventing damage to the internal structure of the air pump 23. One of the slag discharge ports 34 is located at the bottom of the inner wall of the filter box 22, and the other slag discharge port 34 is located at the bottom of the outer wall of the ceramic filter cover 31. Periodically starting the vibration motor 30 can transmit the vibration link 36 to drive the ceramic filter cover 31 and the intercepting net 32 ​​to vibrate, shaking off the particulate matter clogging the filter holes and concentrating it at the bottom of the filter box 22 and the bottom of the outer wall of the top of the ceramic filter cover 31, so that it can be discharged periodically, ensuring the efficient interception effect of the ceramic filter cover 31 and the intercepting net 32 ​​on the mixed airflow. The extension of the hydraulic column 15 allows the laser cutting head 21 to approach the circuit board for processing, while the retraction of the hydraulic column 15 allows the laser cutting head 21 to move away from the circuit board. During the process of the laser cutting head 21 approaching or moving away from the circuit board, the L-shaped plate 16 moves along the outer wall of the moving part 14 as the hydraulic column 15 extends and retracts, and the strip hole 19 also slides along the T-shaped guide 17, making the L-shaped plate 16 more stable and reliable during its up-and-down movement.

[0021] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A laser processing device for circuit board processing, comprising a worktable (1), wherein the top of the worktable (1) is provided with multiple rows of sliding openings (2), and a circuit board clamping assembly is provided between two sliding openings (2) in each row, characterized in that, The workbench (1) has a rectangular frame (10) slidably mounted on its top end, and a limiting port (11) is provided between the top and bottom ends of the rectangular frame (10). A threaded rod (12) is rotatably mounted inside the rectangular frame (10). A moving part (14) is sleeved between the rectangular frame (10), the threaded rod (12) and the two limiting ports (11), and a hydraulic column (15) is fixedly mounted on the bottom end of the moving part (14). An air pump (23) is fixedly mounted on the outer wall of one end of the moving part (14), and a T-shaped guide (17) is fixedly mounted on the middle of the outer wall of the other end of the moving part (14). An L-shaped plate (17) is fixedly mounted on the bottom end of the hydraulic column (15). 6), and the vertical section of the L-shaped plate (16) is provided with a strip hole (19) in the middle. A filter box (22) is fixedly installed at one end of the horizontal section of the L-shaped plate (16). A laser generator (20) is fixedly installed at the lower end of the vertical section of the L-shaped plate (16). A stabilizing rod (27) is fixedly installed at the bottom end of the horizontal section of the L-shaped plate (16). A suction cover (26) is fixedly installed at the bottom end of the stabilizing rod (27). A trapezoidal opening (28) is provided at one end of the circumference of the suction cover (26). A laser cutting head (21) is fixedly installed at the bottom end of the laser generator (20). The suction cover (26) is inclined around the outside of the laser cutting head (21).

2. The laser processing equipment for circuit board processing according to claim 1, characterized in that, The workbench (1) has sliding grooves (3) on both sides of the top, and T-shaped blocks (4) are slidably installed inside the sliding grooves (3). Support rods (9) are fixedly connected between the top of the two T-shaped blocks (4) and the bottom sides of the rectangular frame (10). U-shaped plates (5) are fixedly connected between the bottom ends of the two T-shaped blocks (4). A toothed plate (8) is fixedly provided in the middle of the inner wall of the top of the workbench (1). An active toothed roller (7) is rotatably provided in the middle of the bottom end of the U-shaped plate (5), and the circumference of the active toothed roller (7) meshes with the toothed plate (8).

3. The laser processing equipment for circuit board processing according to claim 2, characterized in that, The input end of the active toothed roller (7) is fixedly equipped with a first drive motor (6), and the input end of the threaded rod (12) is fixedly equipped with a second drive motor (13).

4. The laser processing equipment for circuit board processing according to claim 1, characterized in that, The T-shaped guide (17) slides circumferentially inside the strip hole (19).

5. The laser processing equipment for circuit board processing according to claim 1, characterized in that, A guide pipe (25) is fixedly connected between the outlet end of the suction hood (26) and the inlet end of the filter box (22), and a suction pipe (24) is fixedly connected between the outlet end of the filter box (22) and the inlet end of the air pump (23).

6. The laser processing equipment for circuit board processing according to claim 1, characterized in that, The filter box (22) is fixedly installed with a ceramic filter cover (31), a net (32) and a heat exchange component (33) from bottom to top inside. A connecting frame (36) is fixedly installed between the top of the ceramic filter cover (31) and the bottom of the net (32). The bottom of the ceramic filter cover (31) is located at the top of the inlet of the filter box (22).

7. The laser processing equipment for circuit board processing according to claim 6, characterized in that, A vibration motor (30) is fixedly installed in the middle of the inner wall of one end of the filter box (22), and the vibration rod of the vibration motor (30) is close to the connecting frame (36). The lower end and bottom end of the outer wall of one side of the filter box (22) are provided with slag discharge ports (34), and a sealing cover (35) is fixedly installed on the outside of the slag discharge port (34). One of the slag discharge ports (34) is located at the lower end of the inner wall of the bottom end of the filter box (22), and the other slag discharge port (34) is located at the lower end of the outer wall of the ceramic filter cover (31).

8. The laser processing equipment for circuit board processing according to claim 1, characterized in that, The enclosed suction cover (26) is fixedly provided with a ceramic mesh cover (29), and the ceramic mesh cover (29) is arc-shaped. The ceramic mesh cover (29) is located inside the outlet end of the enclosed suction cover (26). The trapezoidal opening (28) is wide on the outside and narrow on the inside, and the outer length of the trapezoidal opening (28) is the same as the radius of the enclosed suction cover (26).

Images