A cutting control method and device, a scribing apparatus and a storage medium

Abstract

The application provides a cutting control method and device, a wafer scribing device and a storage medium. The method comprises the following steps: obtaining initial offset data of a wafer to be cut on a worktable according to the center position of the wafer to be cut and the center position of the worktable; determining the real-time predicted positions of each edge point in the annular cutout with a target radius corresponding to the wafer to be cut when the wafer to be cut rotates with the worktable according to the target radius and the initial offset data of the wafer to be cut on the worktable; and controlling the worktable to move along the X axis and the cutting shaft to move along the Y axis according to the real-time predicted positions of the edge points in the annular cutout, so that the cutting knife moves to the positions corresponding to the edge points and cuts the edge points. The application can make the cutting knife on the wafer scribing device cut the annular cutout with high precision on the wafer to be cut.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a cutting control method, apparatus, dicing equipment, and storage medium. Background Technology

[0002] Dicing equipment, especially wafer trimming machines, requires controlling the axial rotation angle of the working disk to perform circular cutting of the wafer during the wafer dicing process, because the angle of the dicing blade is always parallel to the horizontal direction (i.e., the X direction) of the working disk.

[0003] However, when performing ring-shaped dicing on a wafer, if the concentricity between the wafer and the work pad is poor, it is easy to process an irregular ring-shaped cut on the wafer, which will affect the accuracy of the ring-shaped dicing. Summary of the Invention

[0004] This application provides a cutting control method, apparatus, dicing device, and storage medium, which enables the dicing blade on the dicing device to cut a high-precision annular slit on the wafer to be cut.

[0005] In a first aspect, a cutting control method is provided, applied to a dicing device. The dicing device includes a working disc and a cutting axis. The working disc is used to drive the wafer to be cut to rotate, so that the cutting blade on the cutting axis performs a circular cut on the wafer. The working disc is movable along the X-axis, and the cutting axis is movable along the Y-axis. The method includes: Based on the center position of the wafer to be cut and the center position of the work disk, the initial offset data of the wafer to be cut on the work disk is obtained. The initial offset data includes the initial offset of the center of the wafer to be cut from the center of the work disk on the X-axis after the wafer to be cut is placed on the work disk, the initial offset of the center of the wafer to be cut from the center of the work disk on the Y-axis, and the initial center offset angle of the wafer to be cut on the work disk. Based on the target radius and the initial offset data of the wafer to be cut on the work plate, determine the real-time predicted position of each edge point in the annular cut with the target radius as the wafer to be cut rotates with the work plate. Based on the real-time predicted position corresponding to the edge point in the annular cut, the working disc is controlled to move along the X-axis and the cutting axis is controlled to move along the Y-axis so that the cutting blade moves to the position corresponding to the edge point and cuts the edge point.

[0006] Optionally, based on the target radius and the initial offset data of the wafer to be cut on the worktable, the real-time predicted positions of each edge point in the annular cut with the target radius are determined as the wafer rotates with the worktable, including: Based on the initial offset data of the wafer to be cut on the work plate, calculate the real-time center position of the wafer on the work plate as the wafer rotates with the work plate. Based on the real-time center position of the wafer to be cut on the work disk and the target radius, calculate the real-time predicted position of each edge point in the annular cut with the target radius.

[0007] Optionally, based on the initial offset data of the wafer to be cut on the worktable, the real-time center position of the wafer to be cut on the worktable as the wafer rotates with the worktable is calculated, including: Establish a rectangular coordinate system with the center of the work disk as the origin; Based on the initial offset data of the wafer to be cut on the work disk, the center of the wafer to be cut is characterized as the initial center point in the rectangular coordinate system; Based on the real-time rotation angle of the work disk and the initial center point corresponding to the center of the wafer to be cut, calculate the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates. Based on the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates, and the initial center point of the center of the wafer to be cut in the rectangular coordinate system, determine the real-time coordinate value of the center of the wafer to be cut in the rectangular coordinate system. Based on the real-time coordinates of the center of the wafer to be cut in the rectangular coordinate system and the center position of the worktable on the dicing device, the real-time center position of the center of the wafer to be cut on the worktable is determined.

[0008] Optionally, based on the real-time position of the center of the wafer to be cut on the work disk and the target radius, the real-time predicted position of each edge point in the annular cut with the target radius is calculated, including: Based on the real-time center position of the wafer to be cut on the work disk and the target radius, the edge points of each ring cut are arranged in a ring in a rectangular coordinate system with the center of the wafer to be cut as the target center and are characterized in real time. The real-time coordinates of each edge point in the circular cut within the Cartesian coordinate system are used as the real-time predicted positions of each edge point in the circular cut.

[0009] Optionally, based on the real-time predicted position corresponding to the edge point in the annular cut, the working disc is controlled to move along the X-axis and the cutting axis is controlled to move along the Y-axis, so that the cutting blade moves to the position corresponding to the edge point and cuts at that edge point, including: As the wafer to be cut rotates with the worktable, the edge point with the largest distance between the annular cut and the center of the wafer to be cut on the Y-axis is taken as the real-time cutting point. Based on the real-time predicted position corresponding to the real-time cutting point, motion compensation information is calculated; the motion compensation information includes a first motion compensation amount on the X-axis and a second motion compensation amount on the Y-axis; Based on the first motion compensation amount, control the working disk to move along the X-axis so that the center of the wafer to be cut moves to the straight line where the axis of the cutting axis is located. Based on the second motion compensation amount, the cutting axis is controlled to move along the Y-axis so that the cutting blade moves to the position corresponding to the real-time cutting point.

[0010] Optionally, there are two cutting axes, which are arranged opposite each other above the worktable, and the axes of the two cutting axes are on the same straight line; according to the motion compensation amount of the cutting blade on the Y-axis, the cutting axes are controlled to move along the Y-axis so that the cutting blade moves to the position corresponding to the real-time cutting point, including: Based on the positional relationship between the two cutting blades and their respective real-time cutting points, determine the target movement direction of each cutting blade along the Y-axis; Based on the motion compensation of the cutting blade on the Y-axis, the two cutting axes are controlled to move along the Y-axis in their respective target directions, and the distance between the two cutting blades and the center of the wafer to be cut is the same.

[0011] Optionally, before obtaining the initial offset data of the wafer to be cut on the work disk based on the center position of the wafer to be cut and the center position of the work disk, the method further includes: After the wafer to be cut is placed on the work tray, the visual recognition system is used to identify the position of four recognition points evenly distributed on the edge of the wafer to be cut, and obtain the position information of each recognition point on the wafer to be cut. Based on the position information of the four identification points on the wafer to be cut, the center position of the wafer to be cut is determined.

[0012] Secondly, a cutting control device is provided for use in a dicing apparatus. The dicing apparatus includes a working disc and a cutting axis. The working disc drives the wafer to be cut to rotate, so that the cutting blade on the cutting axis performs a circular cut on the wafer. The working disc is movable along the X-axis, and the cutting axis is movable along the Y-axis. The device includes: The initial offset data acquisition module is used to obtain the initial offset data of the wafer to be cut on the work disk based on the center position of the wafer to be cut and the center position of the work disk. The initial offset data includes the initial offset of the center of the wafer to be cut from the center of the work disk on the X-axis after the wafer to be cut is placed on the work disk, the initial offset of the center of the wafer to be cut from the center of the work disk on the Y-axis, and the initial center offset angle of the wafer to be cut on the work disk. The real-time prediction position determination module is used to determine the real-time predicted position of each edge point in the annular cut with the target radius as the wafer to be cut rotates with the work plate, based on the target radius and the initial offset data of the wafer to be cut on the work plate. The motion control module is used to control the working disc to move along the X-axis and the cutting axis to move along the Y-axis based on the real-time predicted position corresponding to the edge point in the annular cut, so that the cutting blade moves to the position corresponding to the edge point and cuts the edge point.

[0013] Thirdly, a dicing apparatus is provided, including a memory and a processor, the memory for storing processor-executable instructions; the processor is configured to execute the executable instructions in the memory to implement the steps of the method as described in the first aspect or its various implementations.

[0014] Fourthly, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the method as described in the first aspect or its various implementations.

[0015] The technical solution provided in this application enables the real-time determination of the predicted positions of each edge point in the annular cut with the target radius when the concentricity between the wafer to be cut and the working disk is poor. This is achieved by dynamically compensating for the positions of the working disk on the X-axis and the cutting axis on the Y-axis based on the real-time predicted positions of the edge points in the annular cut. This allows the cutting blade to move in real-time to the position corresponding to the edge point, thereby enabling the cutting blade to cut an equilateral annular cut on the wafer to be cut and improving the accuracy of the annular cut. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 An application scenario diagram provided for an embodiment of this application; Figure 2 A flowchart illustrating a cutting control method provided in an embodiment of this application; Figure 3 This is a schematic diagram of the annular cut made by a dicing device in the prior art when the wafer and the worktable are well concentric. Figure 4 The annular cut is made by existing dicing equipment when the concentricity between the wafer and the worktable is not good. Figure 5 This is a schematic diagram of the slicing device provided in an embodiment of this application; Figure 6 A schematic diagram of a wafer to be cut on a working disk with a concentricity difference from the working disk, provided in an embodiment of this application; Figure 7 A schematic diagram of a cutting control device provided in an embodiment of this application; Figure 8 This is a schematic block diagram of the dicing device provided in the embodiments of this application. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0020] As mentioned above, in dicing equipment, especially high-cleanliness wafer trimming machines, controlling the width and depth of the circumferential trimming process on the wafer is particularly important when trimming the circular edge of the wafer. When the wafer and the dicing equipment's worktable have good concentricity, the dicing blade falls at a specific position, and when the axial rotation of the worktable is greater than 360°, a pattern such as... can be processed on the wafer. Figure 3 The diagram shows an equilateral annular cut. However, when the concentricity between the wafer and the worktable is poor, if the dicing tool is dropped at a specific position, and the worktable rotates more than 360° axially, a cut like the one shown will be produced. Figure 4 The irregular ring-shaped cut is shown.

[0021] Therefore, a method to improve the ring machining accuracy of wafers when the concentricity between the wafer and the work pad is poor is urgently needed.

[0022] To address at least one of the technical problems existing in the prior art or related technologies, this invention provides a cutting control method, apparatus, dicing device, and storage medium. The method includes: obtaining initial offset data of the wafer to be cut on the working disk based on the center position of the wafer to be cut and the center position of the working disk; determining the real-time predicted positions corresponding to each edge point in an annular kerf with the target radius as the wafer rotates with the working disk, based on the target radius and the initial offset data of the wafer to be cut on the working disk; and controlling the working disk to move along the X-axis and the cutting axis to move along the Y-axis based on the real-time predicted positions corresponding to the edge points in the annular kerf, so that the cutting blade moves to the position corresponding to the edge point and cuts at that edge point. This application can dynamically compensate for the positions of the working disk on the X-axis and the cutting axis on the Y-axis, so that the cutting blade moves to the position corresponding to the edge point in real time, thereby enabling the cutting blade to cut an equilateral annular kerf on the wafer to be cut, thus improving the accuracy of the annular kerf.

[0023] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to: In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as... Figure 1 As shown, this application scenario may include a dicing device 110 and a network device 120. The dicing device 110 can establish a connection with the network device 120 via a wired network or a wireless network.

[0024] For example, the dicing device 110 may be a desktop computer, laptop computer, tablet computer, etc., but is not limited thereto. The network device 120 may be a terminal device or a server, but is not limited thereto. In one embodiment of this application, the dicing device 110 may send a request message to the network device 120, which may be used to request the acquisition of the initial offset data of the wafer to be diced on the work disk. Further, the dicing device 110 may receive a response message sent by the network device 120, which includes the acquisition of the initial offset data of the wafer to be diced on the work disk.

[0025] also, Figure 1 An illustrative example is provided with a slicing device and a network device, but in practice, other numbers of slicing devices and network devices may be included, and this application is not limited thereto.

[0026] In other possible implementations, the technical solution of this application can also be executed by the slicing device 110, or by the network device 120, and this application does not limit this.

[0027] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below: Figure 2 A flowchart illustrating a cutting control method provided in this application embodiment, the method being applied to a dicing device, and can be performed by, for example... Figure 1 The dicing apparatus 110 shown performs the operation. The dicing apparatus 110 includes a working disk and a dicing axis. The working disk drives the wafer to be diced to rotate, so that the dicing blade on the dicing axis performs a circular cut on the wafer. The working disk can move along the X-axis, and the dicing axis can move along the Y-axis, but is not limited thereto. Figure 2 As shown, the method may include the following steps: S210. Based on the center position of the wafer to be cut and the center position of the work disk, obtain the initial offset data of the wafer to be cut on the work disk.

[0028] The initial offset data includes the initial offset of the center of the wafer to be cut from the center of the work disk on the X-axis after the wafer is placed on the work disk, the initial offset of the center of the wafer to be cut from the center of the work disk on the Y-axis, and the initial offset angle of the center of the wafer to be cut on the work disk.

[0029] Here, based on the center positions of the wafer to be cut and the work disk, the centers of the wafer to be cut and the work disk can be projected onto the X-axis respectively. The initial offset between the center of the wafer to be cut and the center of the work disk on the X-axis can be obtained based on the distance between the projection points of the two centers on the X-axis. At the same time, based on the center positions of the wafer to be cut and the work disk, the centers of the wafer to be cut and the work disk can be projected onto the Y-axis respectively. The initial offset between the center of the wafer to be cut and the center of the work disk on the Y-axis can be obtained based on the distance between the projection points of the two centers on the Y-axis.

[0030] In addition, the azimuth angle of the center of the wafer to be cut relative to the center of the work disk can be determined based on the center position of the wafer to be cut and the center position of the work disk as the initial center offset angle. For example, if the center of the wafer to be cut is located at the 2 o'clock position of the center of the work disk, the azimuth angle is determined to be 30°, and the initial center offset angle is 30°. As another example, if the center of the wafer to be cut is located at the 10 o'clock position of the center of the work disk, the azimuth angle is determined to be 150°, and the initial center offset angle is 150°.

[0031] In this step, when the center of the wafer to be cut and the center of the worktable are difficult to align, the initial offset data of the wafer to be cut on the worktable obtained by using the center positions of the wafer to be cut and the worktable can provide a reference compensation for subsequent adjustments to the cutting position of the dicing blade and the moving position of the worktable without adjusting the position of the wafer to be cut on the worktable. This avoids the dicing blade from being misaligned around the wafer to be cut due to the initial deviation between the center of the wafer to be cut and the center of the worktable.

[0032] S220. Based on the target radius and the initial offset data of the wafer to be cut on the work plate, determine the real-time predicted position of each edge point in the annular cut with the target radius when the wafer to be cut rotates with the work plate.

[0033] To facilitate the subsequent step S230 of cutting the wafer to be cut, in this step, the edge of the annular cut with the target radius can be divided into 3600 segments, and the corresponding dividing points on the edge are used as edge points.

[0034] Since the position of the center of the wafer to be cut changes as the working disk rotates axially, the position of each theoretical cutting point on the wafer to be cut relative to the cutting blade also changes continuously. Therefore, in this step, based on the target radius and the initial offset data of the wafer to be cut on the working disk, the real-time predicted position of each edge point in the annular cut with the target radius is calculated in real time as the wafer to be cut rotates with the working disk. This ensures that step S230, by dynamically adjusting the movement of the working disk on the X-axis and the movement of the cutting axis on the Y-axis, ensures that the cutting blade is always aligned with the theoretical cutting point. The theoretical cutting point can be the edge point in the annular cut that is close to the cutting blade.

[0035] S230. Based on the real-time predicted position corresponding to the edge point in the annular cut, control the working disc to move along the X-axis and the cutting axis to move along the Y-axis, so that the cutting blade moves to the position corresponding to the edge point and cuts the edge point.

[0036] Driven by the rotation of the working disc, each edge point in the annular cut can be brought close to the cutting blade one by one. Here, the working disc can be controlled to move along the X-axis and the cutting axis can be moved along the Y-axis according to the real-time predicted position corresponding to the edge point that is close to the cutting blade, so that the cutting blade can move to the position corresponding to the edge point and cut it. Then, after the next edge point that is close to the edge point moves close to the cutting blade, the above steps are repeated to achieve the cutting of the edge points in the annular cut by the cutting blade.

[0037] In this step, the real-time predicted position of the edge point in the annular cut can be continuously predicted. Based on the real-time predicted position of the edge point, the working disk is moved along the X-axis and the cutting axis is moved along the Y-axis to achieve dynamic compensation of the annular machining accuracy, so that an annular cut with the target radius is cut on the wafer to be cut.

[0038] Using the above method, when the concentricity between the wafer to be cut and the work pad is poor, the real-time predicted position of each edge point in the annular cut with the target radius can be determined in real time based on the target radius and the initial offset data of the wafer to be cut on the work pad. This enables dynamic compensation of the position of the work pad on the X-axis and the cutting axis on the Y-axis based on the real-time predicted position of the edge point in the annular cut, so that the cutting blade moves to the position corresponding to the edge point in real time, thereby enabling the cutting blade to cut an equilateral annular cut on the wafer to be cut, thus improving the accuracy of the annular cut.

[0039] In some possible implementations, determining the real-time predicted position of each edge point in the annular cut with the target radius as the wafer to be cut rotates with the work disk, based on the target radius and the initial offset data of the wafer to be cut on the work disk, may include the following steps: S310. Based on the initial offset data of the wafer to be cut on the work disk, calculate the real-time center position of the wafer to be cut on the work disk as the wafer rotates with the work disk.

[0040] When the work disk rotates axially, the center of the wafer to be cut on the work disk also rotates circumferentially around the center of the work disk. The angle of circumferential rotation of the center of the wafer to be cut is the same as the angle of axial rotation of the work disk. Therefore, the real-time center offset angle of the wafer to be cut on the work disk can be calculated based on the initial center offset angle in the initial offset data of the wafer to be cut on the work disk. For example, if the initial center offset angle corresponding to the center of the wafer to be cut is θ2, and the real-time rotation angle of the work disk is θ1, the real-time offset angle between the center of the wafer to be cut and the center on the work disk can be obtained as θ = θ1 + θ2.

[0041] Here, the center of the wafer to be cut is rotated circumferentially around the center of the work disk, with the offset distance between the center of the wafer to be cut and the center of the work disk as the radius. This allows us to obtain the real-time center position of the wafer to be cut on the work disk as it rotates with the work disk. The offset distance between the center of the wafer to be cut and the center of the work disk can be calculated based on the initial offsets of the wafer to be cut's center and the work disk's center on the X-axis and the Y-axis.

[0042] S320. Based on the real-time center position of the wafer to be cut on the work disk and the target radius, calculate the real-time predicted position of each edge point in the annular cut with the target radius.

[0043] Here, after determining the real-time center position of the wafer to be cut on the work disk, a circle can be drawn with the target radius as the radius and the point on the wafer to be cut with the real-time center position as the center, so as to determine the real-time predicted position of each edge point in the annular cut with the target radius on the wafer to be cut.

[0044] Using the above method, it is possible to quickly and accurately calculate the real-time predicted position of each edge point in the annular cut with the target radius on the wafer at every instant when the position of the wafer to be cut changes as it rotates with the axis of the work disk.

[0045] In some possible implementations, calculating the real-time center position of the wafer to be cut on the work disk as the wafer rotates with the work disk, based on the initial offset data of the wafer to be cut on the work disk, may include the following steps: S410. Establish a rectangular coordinate system with the center of the work disk as the origin.

[0046] It should be noted that the X-axis in this rectangular coordinate system is in the same direction as the X-axis in step 230, and the Y-axis in this rectangular coordinate system is in the same direction as the Y-axis in step 230. That is, the X-axis in the rectangular coordinate system is in the same direction as the movement of the worktable, and the Y-axis in the rectangular coordinate system is in the same direction as the movement of the cutting axis.

[0047] Here, by establishing a rectangular coordinate system with the center of the work disk as the origin, all positions in subsequent steps can be determined, such as the center of the wafer to be cut, each edge point in the annular cut, and the cutting position of the cutting blade. All of these are based on a coordinate system that is consistent with the X-axis and Y-axis directions in step 230, avoiding errors caused by confusion between the X-axis and Y-axis of the reference system.

[0048] At the same time, this coordinate system can be directly mapped to the physical motion space of the worktable and the X / Y axis, so that the calculated coordinate values ​​can be directly converted into control commands for the servo motor used to control the rotation of the worktable.

[0049] S420. Based on the initial offset data of the wafer to be cut on the work disk, the center of the wafer to be cut is characterized as the initial center point in the rectangular coordinate system.

[0050] For example, see Figure 6The center of the wafer to be cut has coordinates (X, Y) in the world coordinate system of the dicing equipment, and the center of the worktable has coordinates (x, y) in the world coordinate system of the dicing equipment. The initial offset between the center of the wafer to be cut and the center of the worktable on the X-axis in the world coordinate system of the dicing equipment is ΔX = xX, and the initial offset between the center of the wafer to be cut and the center of the worktable on the Y-axis in the world coordinate system of the dicing equipment is ΔY = yY. At this time, the orientation of the center of the wafer to be cut relative to the center of the worktable can be determined according to the positive and negative values ​​of ΔX and ΔY, so as to determine the quadrant in which the center of the wafer to be cut is located in the rectangular coordinate system in step S410, and further determine the coordinate value of the center of the wafer to be cut in the rectangular coordinate system, and the obtained coordinate value is represented as the initial center point of the center of the wafer to be cut. For example, if ΔX and ΔY are positive numbers, then ΔX represents the initial offset between the center of the wafer to be cut and the center of the worktable on the X-axis of the world coordinate system of the dicing equipment, and ΔY represents the initial offset between the center of the wafer to be cut and the center of the worktable on the Y-axis of the world coordinate system of the dicing equipment. The coordinate point with the value (ΔX, ΔY) in the first quadrant of the rectangular coordinate system will be represented as the initial center point of the wafer to be cut.

[0051] S430. Based on the real-time rotation angle of the work disk and the initial center point corresponding to the center of the wafer to be cut, calculate the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates.

[0052] Since the initial center point corresponding to the center of the wafer to be cut can be used to determine the coordinates of that initial center point in a Cartesian coordinate system, the initial coordinate angle of the wafer's center in the Cartesian coordinate system can be determined based on the positional relationship between these coordinates and the origin of the Cartesian coordinate system. Furthermore, since the center of the wafer to be cut also rotates circumferentially around the center of the worktable when the worktable rotates axially, and the angle of circumferential rotation of the wafer's center is the same as the angle of axial rotation of the worktable, the real-time coordinate angle of the wafer's center in the Cartesian coordinate system can be calculated based on the real-time rotation angle of the worktable and the initial center point corresponding to the center of the wafer. For example, the initial coordinate angle of the wafer's center in the Cartesian coordinate system determined based on the initial center point corresponding to the center of the wafer is: The real-time rotation angle of the working disc is The real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates is then determined. .

[0053] S440. The real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates, and the initial center point of the center of the wafer to be cut in the rectangular coordinate system, determine the real-time coordinate value of the center of the wafer to be cut in the rectangular coordinate system.

[0054] Here, the real-time coordinates (xisX, xisY) of the center of the wafer to be cut in the Cartesian coordinate system established in step S410 are calculated using the following formula: ; Where ΔX is the coordinate value of the initial center point of the wafer to be cut on the X-axis of the rectangular coordinate system; ΔY is the coordinate value of the initial center point of the wafer to be cut on the Y-axis of the rectangular coordinate system; and θ is the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates.

[0055] S450. Based on the real-time coordinates of the center of the wafer to be cut in the rectangular coordinate system and the center position of the worktable on the dicing device, determine the real-time center position of the center of the wafer to be cut on the worktable.

[0056] Here, the center position of the work tray on the dicing device can include the coordinate value of the center of the work tray in the world coordinate system of the dicing device. Therefore, when determining the real-time center position of the wafer to be diced on the work tray, the real-time coordinate value of the center of the wafer to be diced in the rectangular coordinate system can be summed with the coordinate value of the center of the work tray in the world coordinate system of the dicing device to obtain the real-time center position of the wafer to be diced on the work tray, which is the coordinate value of the center of the wafer to be diced in the world coordinate system of the dicing device.

[0057] For example, if the center of the worktable is located at (525, 109) in the world coordinate system of the dicing equipment, and the real-time coordinate of the center of the wafer to be diced is (-7, 6) in the rectangular coordinate system, then the real-time center position of the wafer to be diced on the worktable is the position corresponding to the coordinates (518, 115) in the world coordinate system of the dicing equipment.

[0058] Using the above method, it is possible to quickly determine the real-time center position of the wafer to be cut in the rectangular coordinate system while the work disk rotates, and at the same time, it is possible to quickly calculate the real-time center position of the wafer to be cut on the work disk. This greatly reduces the complexity and computational load of the real-time center position corresponding to the center of the wafer to be cut, making it possible to predict the real-time center position corresponding to the center of the wafer to be cut under the high-speed rotation of the work disk.

[0059] In some possible implementations, calculating the real-time predicted position of each edge point in the annular cut with the target radius, based on the real-time position of the center of the wafer to be cut on the work disk and the target radius, may include the following steps: S510. Based on the real-time center position of the wafer to be cut on the work disk and the target radius, arrange the edge points of the annular cut in a ring in a rectangular coordinate system with the center of the wafer to be cut as the target center and characterize them in real time.

[0060] In this step, based on the real-time center position of the wafer to be cut on the work disk, the real-time coordinate point corresponding to the center of the wafer to be cut is determined in the Cartesian coordinate system. Then, with the real-time coordinate point as the center and the target radius as the radius, a circle is drawn in the Cartesian coordinate system to obtain the real-time coordinate points corresponding to each edge point in the annular cut in the Cartesian coordinate system. This completes the real-time characterization of the annular cut edge points arranged in a ring in the Cartesian coordinate system.

[0061] S520. The real-time coordinates of each edge point in the circular cut within the rectangular coordinate system are taken as the real-time predicted positions of each edge point in the circular cut.

[0062] Since the real-time coordinates of each edge point in the annular notch in the Cartesian coordinate system are determined by taking the real-time coordinates of the point corresponding to the center of the wafer to be cut at that moment as the center and the target radius as the radius, the real-time coordinates of each edge point in the annular notch in the Cartesian coordinate system can be used as the real-time predicted position of each edge point in the annular notch. This allows for the accurate determination of the real-time predicted position of each edge point in the annular notch on the work plate at that moment.

[0063] Using the above method, based on the real-time center position of the wafer to be cut on the work plate and the target radius, the theoretical annular cut with the target radius can be represented in a rectangular coordinate system. Then, the real-time coordinates of each edge point in the annular cut in the rectangular coordinate system are used as the real-time predicted positions of each edge point in the annular cut. This ensures that no matter how the center of the wafer to be cut moves eccentrically with the work plate, the relative positional relationship between the annular cut and the wafer to be cut is always fixed and correct. This makes the annular cut cut based on the real-time predicted positions of each edge point infinitely close to the theoretical annular cut with the target radius, thereby improving the cutting accuracy of the wafer to be cut.

[0064] In some possible implementations, based on the real-time predicted position corresponding to the edge point in the annular cut, the working disk is controlled to move along the X-axis and the cutting axis is controlled to move along the Y-axis so that the cutting blade moves to the position corresponding to the edge point and cuts at that edge point. This may include the following steps: S610. When the wafer to be cut rotates with the work disk, the edge point with the largest distance between the annular cut and the center of the wafer to be cut on the Y-axis is taken as the real-time cutting point.

[0065] Since, on the Y-axis, among all the edge points in the annular cut, only the edge point with the largest distance from the center of the wafer to be cut has the target radius, in order to facilitate the cutting blade on the cutting axis to cut the wafer, the edge point with the largest distance from the center of the wafer to be cut on the Y-axis is taken as the real-time cutting point, so that the distance between the cutting blade and the center of the wafer to be cut is the target radius length, which makes it easier for the cutting blade to cut an annular cut with the target radius on the wafer to be cut.

[0066] S620. Calculate motion compensation information based on the real-time predicted position corresponding to the real-time cutting point.

[0067] The motion compensation information includes a first motion compensation amount on the X-axis and a second motion compensation amount on the Y-axis.

[0068] S630. Based on the first motion compensation amount, control the working disk to move along the X-axis so that the center of the wafer to be cut moves to the straight line where the axis of the cutting axis is located.

[0069] In this step, the working disk is controlled to move along the X-axis according to the first motion compensation amount until the center of the wafer to be cut moves to the straight line where the axis of the cutting axis is located, so that the real-time cutting point is located on the straight line where the axis of the cutting axis is located, thereby making the cutting blade on the cutting axis initially close to the real-time cutting point, so that step S640 can quickly move the cutting blade to the position corresponding to the real-time cutting point.

[0070] S640. Based on the second motion compensation amount, control the cutting axis to move along the Y-axis so that the cutting blade moves to the position corresponding to the real-time cutting point.

[0071] Using the above method, after determining the real-time cutting point, the two-dimensional coordinate compensation of the real-time cutting point is decomposed into two independent and clearly defined motion compensations: the X-axis movement of the work disk and the Y-axis movement of the cutting axis. The work disk is controlled to move along the X-axis so that the center of the wafer to be cut is moved to the straight line where the axis of the cutting axis is located. After the center of the wafer to be cut is aligned with the axis of the cutting axis, the cutting axis is then controlled to move along the Y-axis so that the cutting blade moves quickly to the position corresponding to the real-time cutting point, thereby enabling the cutting blade to cut the edge point corresponding to the real-time cutting point.

[0072] In some possible implementations, there are two cutting axes, which are arranged opposite each other above the worktable, and the axes of the two cutting axes are on the same straight line.

[0073] See Figure 5 In the dicing device provided in this embodiment, two cutting axes 1 are located on both sides of the working disk 2, and the working disk 2 is adsorbed with wafers 3 to be cut. The vision recognition system 4 is located on one side of the working disk 2.

[0074] Accordingly, based on the motion compensation amount of the cutting blade on the Y-axis, controlling the cutting axis to move along the Y-axis so that the cutting blade moves to the position corresponding to the real-time cutting point can include the following steps: S710. Based on the positional relationship between the two cutting blades and their respective real-time cutting points, determine the target movement direction of each cutting blade along the Y-axis.

[0075] It should be noted that the two cutting blades and their corresponding real-time cutting points can be understood as the two edge points on the Y-axis of the annular cut that are the furthest from the center of the wafer to be cut. That is, the two edge points whose distance from the center of the wafer to be cut is the target radius. Based on the positional relationship between the two cutting blades and the two edge points, the real-time cutting points corresponding to the two cuts are determined. That is, the real-time cutting point closest to each cutting blade is the corresponding real-time cutting point.

[0076] Taking the coordinate point (xisX, xisY) corresponding to the center of the wafer to be cut in the Cartesian coordinate system constructed in step S410 as an example, the coordinate points corresponding to the two real-time cutting points in the Cartesian coordinate system are (xisX-R, xisY) and (xisX+R, xisY), respectively, where R is the target radius.

[0077] To facilitate the dicing of the wafer by the dicing blade, the Cartesian coordinate system constructed in step S410 can be converted into the world coordinate system corresponding to each of the two dicing axes 1 in the dicing device, so that the two dicing axes 1 can be controlled separately. Specifically: a first world coordinate system is constructed by connecting the center of the worktable to the Y-axis of one of the two dicing axes 1. The coordinates of the center of the worktable in the first world coordinate system are (x1, y1), and the coordinates of the real-time dicing point of the dicing blade on the dicing axis 1 are (xisX-R+x1, xisY+y1). A second world coordinate system is constructed by connecting the center of the worktable to the Y-axis of the other dicing axis 1. The coordinates of the center of the worktable in the second world coordinate system are (x2, y2), and the coordinates of the real-time dicing point of the dicing blade on the dicing axis 2 are (xisX-R+x2, xisY+y2).

[0078] S720. Based on the motion compensation of the cutting blade on the Y-axis, control the two cutting axes to move along the Y-axis in their respective target directions, and make the distance between the two cutting blades and the center of the wafer to be cut the same.

[0079] Here, the two cutting axes move along the Y-axis in their respective target directions, which can be determined based on the position between the cutting blade on the cutting axis and its corresponding real-time cutting point.

[0080] In this step, by making the distance between the two cutting blades and the center of the wafer to be cut the same, the distance between the two cutting blades and the center of the wafer to be cut is the target radius length, so that the cutting blades can cut an annular slit with the target radius on the wafer to be cut.

[0081] By using the above method, it is possible to achieve coordinated control of the two relatively set cutting axes for cutting the wafer to be cut, thereby improving the cutting efficiency of the dicing equipment for the wafer to be cut.

[0082] In some possible implementations, before obtaining the initial offset data of the wafer to be cut on the work disk based on the center position of the wafer to be cut and the center position of the work disk, the method further includes: S810. After the wafer to be cut is placed on the work tray, the visual recognition system is used to identify the positions of four recognition points that are evenly distributed on the edge of the wafer to be cut, so as to obtain the position information of each recognition point on the wafer to be cut.

[0083] Here, a vision recognition system is installed above the worktable and can visually recognize the edges of the wafer to be cut.

[0084] It should be noted that before using the vision recognition system to identify the positions of the identification points on the edge of the wafer to be cut, the process includes: determining, based on the radius of the wafer to be cut, the target arc corresponding to the positions of two adjacent identification points on the edge of the wafer to be cut, and the arc length corresponding to the target arc; when using the vision recognition system to identify the positions of the four identification points evenly distributed on the edge of the wafer to be cut, the vision recognition system identifies any one edge point on the edge of the wafer to be cut, and takes that point as the first identification point; then, the worktable is controlled to rotate, and the vision recognition system performs real-time identification of the edge of the wafer to be cut, and when the arc length corresponding to the arc between the currently identified edge point and the first identification point is the same as the arc length corresponding to the target arc, the edge point is designated as... The first identification point is designated as the second identification point. The worktable is then rotated, and the edge of the wafer to be cut is identified in real time using a vision recognition system. When the arc length between the currently identified edge point and the second identification point matches the arc length of the target arc, this edge point is designated as the third identification point. The worktable continues to rotate, and the vision recognition system continues to identify the edge of the wafer to be cut in real time. When the arc length between the currently identified edge point and the third identification point matches the arc length of the target arc, this edge point is designated as the fourth identification point. This completes the identification of the four evenly distributed identification points on the edge of the wafer to be cut, representing the respective positions of the first, second, third, and fourth identification points. The first identification point can be the location of the notch on the edge of the wafer to be cut.

[0085] For example, when the radius of the wafer to be cut is R, the circumference length corresponding to the edge of the wafer to be cut is 2πR. Then, the target arc corresponding to the positions of two adjacent recognition points on the edge of the wafer to be cut is one-quarter of the circumference corresponding to the edge of the entire wafer to be cut. Therefore, the arc length corresponding to the target arc is 2πR / 4. Thus, while controlling the rotation of the work disk, the edge of the wafer to be cut is recognized in real time using the vision recognition system. When it is determined that the arc length corresponding to the arc between the edge point currently recognized by the vision recognition system and the recognition point is 2πR, the edge point is used as another recognition point.

[0086] S820. Determine the center position of the wafer to be cut based on the position information of the four identification points on the wafer to be cut.

[0087] Here, when determining the center position of the wafer to be cut, the two mutually spaced identification points can be connected by the position information of the four identification points on the wafer to be cut, resulting in two straight lines. Since these two straight lines can be regarded as coinciding with the diameter of the wafer to be cut, the center position of the wafer to be cut can be determined by the intersection of these two straight lines.

[0088] It should be noted that the center position of the wafer to be cut can be the coordinate position in a rectangular coordinate system established with the center of the work disk as the origin.

[0089] Using the above method, the visual recognition system can quickly and accurately identify the center position of the wafer to be cut, thereby improving the calculation efficiency and accuracy of the initial offset data of the wafer to be cut on the work disk.

[0090] Figure 7 This is a schematic diagram of a cutting control device according to an embodiment of the present invention, as shown below. Figure 7 As shown, this device is applied to a dicing apparatus, which includes a working disc and a dicing shaft. The working disc drives the wafer to be diced to rotate, so that the dicing blade on the dicing shaft performs a circular cut on the wafer. The working disc can move along the X-axis, and the dicing shaft can move along the Y-axis. The device includes: The initial offset data acquisition module 910 is used to obtain the initial offset data of the wafer to be cut on the work disk based on the center position of the wafer to be cut and the center position of the work disk. The initial offset data includes the initial offset of the center of the wafer to be cut from the center of the work disk on the X-axis after the wafer to be cut is placed on the work disk, the initial offset of the center of the wafer to be cut from the center of the work disk on the Y-axis, and the initial center offset angle of the wafer to be cut on the work disk. The real-time prediction position determination module 920 is used to determine the real-time predicted position of each edge point in the annular cut with the target radius as the wafer to be cut rotates with the work plate, based on the target radius and the initial offset data of the wafer to be cut on the work plate. The motion control module 930 is used to control the working disc to move along the X-axis and the cutting axis to move along the Y-axis according to the real-time predicted position corresponding to the edge point in the annular cut, so that the cutting blade moves to the position corresponding to the edge point and cuts the edge point.

[0091] In some possible implementations, the real-time predicted location determination module 920 includes: The real-time center position calculation unit is used to calculate the real-time center position of the wafer to be cut on the work disk as the wafer rotates with the work disk, based on the initial offset data of the wafer to be cut on the work disk. The real-time prediction position calculation unit is used to calculate the real-time prediction position of each edge point in the annular cut with the target radius, based on the real-time center position of the wafer to be cut on the work disk and the target radius.

[0092] In some possible implementations, the real-time center position calculation unit includes: The coordinate system is established in a sub-unit, which is used to establish a rectangular coordinate system with the center of the work disk as the origin; The initial center point characterization sub-unit is used to characterize the center of the wafer to be cut as the initial center point in the rectangular coordinate system based on the initial offset data of the wafer on the work disk. The real-time center point calculation subunit is used to calculate the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system based on the real-time rotation angle of the work disk and the initial center point corresponding to the center of the wafer to be cut. The real-time center coordinate calculation subunit is used to determine the real-time coordinate value of the center of the wafer to be cut in the rectangular coordinate system based on the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates, and the initial center point of the center of the wafer to be cut in the rectangular coordinate system. The real-time center position calculation subunit is used to determine the real-time center position of the wafer to be cut on the work disk based on the real-time coordinates of the center of the wafer in the rectangular coordinate system and the center position of the work disk on the dicing device.

[0093] In some possible implementations, the real-time predicted location calculation unit includes: The real-time characterization subunit is used to arrange each edge point in the annular cut in a ring with the center of the wafer to be cut as the target center in a rectangular coordinate system and characterize it in real time, based on the real-time center position of the center of the wafer to be cut on the work disk and the target radius. The real-time prediction position determination sub-unit is used to determine the real-time coordinates of each edge point in the annular cut in the Cartesian coordinate system as the real-time predicted position of each edge point in the annular cut.

[0094] In some possible implementations, the motion control module 930 includes: The real-time cutting point determination unit is used to determine the edge point with the largest distance between the annular cut and the center of the wafer on the Y-axis as the wafer rotates with the work disk, and to use it as the real-time cutting point. The compensation amount determination unit is used to calculate motion compensation information based on the real-time predicted position corresponding to the real-time cutting point; the motion compensation information includes a first motion compensation amount on the X-axis and a second motion compensation amount on the Y-axis. The worktable movement control unit is used to control the worktable to move along the X-axis according to the first motion compensation amount, so that the center of the wafer to be cut moves to the straight line where the axis of the cutting axis is located. The cutting axis control unit is used to control the cutting axis to move along the Y-axis according to the second motion compensation amount, so that the cutting blade moves to the position corresponding to the real-time cutting point.

[0095] In some possible embodiments, there are two cutting axes, which are arranged opposite each other above the worktable, and the axes of the two cutting axes are on the same straight line; the cutting axis control unit includes: The movement direction determination subunit is used to determine the target movement direction of the two cutting blades along the Y-axis based on the positional relationship between the two cutting blades and their respective real-time cutting points. The cutting axis control subunit is used to control the two cutting axes to move along the Y-axis in their respective target directions according to the motion compensation amount of the cutting blade on the Y-axis, and to make the distance between the two cutting blades and the center of the wafer to be cut the same.

[0096] In some possible implementations, the apparatus further includes: The identification point identification module is used to identify the position of four identification points evenly distributed on the edge of the wafer to be cut after the wafer is placed on the work tray, using a vision recognition system, so as to obtain the position information of each identification point on the wafer to be cut.

[0097] The center recognition module is used to determine the center position of the wafer to be cut based on the position information of the four recognition points on the wafer to be cut.

[0098] Figure 8 This is a schematic block diagram of a dicing device 110 according to an embodiment of the present invention.

[0099] like Figure 8 As shown, the dicing device 110 may include: The system includes a memory 1101 and a processor 1102. The memory 1101 stores computer programs and transfers the program code to the processor 1102. In other words, the processor 1102 can retrieve and run the computer programs from the memory 1101 to implement the methods described in the embodiments of the present invention.

[0100] For example, the processor 1102 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0101] In some embodiments of the present invention, the dicing device 110 may include, but is not limited to: General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0102] In some embodiments of the present invention, the memory 1101 includes, but is not limited to: Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0103] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 1101 and executed by the processor 1102 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0104] like Figure 8 As shown, the dicing device 110 may further include: Transceiver 1103, which can be connected to processor 1102 or memory 1101.

[0105] The processor 1102 can control the transceiver 1103 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 1103 may include a transmitter and a receiver. The transceiver 1103 may further include antennas, and the number of antennas may be one or more.

[0106] It should be understood that the various components in the dicing device are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0107] The present invention also provides a computer storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0108] When implemented using software, it can be implemented entirely or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0109] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0110] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0111] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0112] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A cutting control method applied to a scribing apparatus, the scribing apparatus comprising a worktable and a cutting shaft, the worktable being used to drive a wafer to be cut to rotate, so that a cutting blade on the cutting shaft performs annular cutting on the wafer to be cut, wherein, The working disk is movable along the X-axis, and the cutting axis is movable along the Y-axis, characterized in that the method includes: Based on the center position of the wafer to be cut and the center position of the work disk, the initial offset data of the wafer to be cut on the work disk is obtained; the initial offset data includes the initial offset of the center of the wafer to be cut from the center of the work disk on the X-axis after the wafer to be cut is placed on the work disk, the initial offset of the center of the wafer to be cut from the center of the work disk on the Y-axis, and the initial center offset angle of the wafer to be cut on the work disk; Based on the target radius and the initial offset data of the wafer to be cut on the working disk, the real-time predicted position of each edge point in the annular cut with the target radius is determined when the wafer to be cut rotates with the working disk. Based on the real-time predicted position corresponding to the edge point in the annular cut, the working disc is controlled to move along the X-axis and the cutting axis is controlled to move along the Y-axis, so that the cutting blade moves to the position corresponding to the edge point and cuts the edge point; The step of controlling the working disc to move along the X-axis and the cutting axis to move along the Y-axis based on the real-time predicted position corresponding to the edge point in the annular cut, so that the cutting blade moves to the position corresponding to the edge point and cuts the edge point, includes: As the wafer to be cut rotates with the work disk, the edge point with the largest distance between the annular cut and the center of the wafer to be cut on the Y-axis is taken as the real-time cutting point. Based on the real-time predicted position corresponding to the real-time cutting point, motion compensation information is calculated; the motion compensation information includes a first motion compensation amount on the X-axis and a second motion compensation amount on the Y-axis. Based on the first motion compensation amount, the working disk is controlled to move along the X-axis so that the center of the wafer to be cut moves to the straight line where the axis of the cutting axis is located. Based on the second motion compensation amount, the cutting axis is controlled to move along the Y-axis so that the cutting blade moves to the position corresponding to the real-time cutting point.

2. The cutting control method according to claim 1, characterized in that, The step of determining the real-time predicted position of each edge point in the annular cut with the target radius as the wafer to be cut rotates with the work disk, based on the target radius and the initial offset data of the wafer to be cut on the work disk, includes: Based on the initial offset data of the wafer to be cut on the working disk, calculate the real-time center position of the center of the wafer to be cut on the working disk as the wafer to be cut rotates with the working disk; Based on the real-time center position of the wafer to be cut on the work disk and the target radius, the real-time predicted position of each edge point in the annular cut with the target radius is calculated.

3. The cutting control method according to claim 2, characterized in that, The step of calculating the real-time center position of the wafer to be cut on the work disk as the wafer rotates with the work disk, based on the initial offset data of the wafer to be cut on the work disk, includes: A rectangular coordinate system is established with the center of the work disk as the origin; Based on the initial offset data of the wafer to be cut on the work disk, the center of the wafer to be cut is characterized as the initial center point in the rectangular coordinate system; Based on the real-time rotation angle of the work disk and the initial center point corresponding to the center of the wafer to be cut, calculate the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as the work disk rotates. Based on the real-time coordinate angle of the center of the wafer to be cut in the rectangular coordinate system as it rotates with the worktable, and the initial center point of the center of the wafer to be cut in the rectangular coordinate system, the real-time coordinate value of the center of the wafer to be cut in the rectangular coordinate system is determined. Based on the real-time coordinates of the center of the wafer to be cut in the rectangular coordinate system and the center position of the worktable on the dicing device, the real-time center position of the center of the wafer to be cut on the worktable is determined.

4. The cutting control method according to claim 3, characterized in that, The step of calculating the real-time predicted position of each edge point in the annular cut with the target radius based on the real-time position of the center of the wafer to be cut on the work disk and the target radius includes: Based on the real-time center position of the center of the wafer to be cut on the working disk and the target radius, each edge point in the annular cut is arranged in a ring in the rectangular coordinate system with the center of the wafer to be cut as the target center and is characterized in real time. The real-time coordinates of each edge point in the annular cut within the Cartesian coordinate system are used as the real-time predicted positions of each edge point in the annular cut.

5. The cutting control method according to claim 4, characterized in that, There are two cutting axes, which are arranged opposite each other above the worktable, and the axes of the two cutting axes are on the same straight line; the step of controlling the cutting axis to move along the Y-axis according to the motion compensation amount of the cutting blade on the Y-axis, so that the cutting blade moves to the position corresponding to the real-time cutting point, includes: Based on the positional relationship between the two cutting blades and their respective real-time cutting points, the target movement direction of each of the two cutting blades along the Y-axis is determined. Based on the motion compensation amount of the cutting blade on the Y-axis, the two cutting axes are controlled to move along the Y-axis in their respective target directions, and the distance between the two cutting blades and the center of the wafer to be cut is the same.

6. The cutting control method according to claim 1, characterized in that, Before obtaining the initial offset data of the wafer to be cut on the working disk based on the center position of the wafer to be cut and the center position of the working disk, the method further includes: After the wafer to be cut is placed on the work tray, the visual recognition system is used to identify the position of four recognition points evenly distributed on the edge of the wafer to be cut, so as to obtain the position information of each recognition point on the wafer to be cut. The center position of the wafer to be cut is determined based on the position information of the four identification points on the wafer to be cut.

7. A cutting control device applied to a dicing apparatus, the dicing apparatus comprising a working disc and a cutting shaft, the working disc being used to drive a wafer to be cut to rotate, so that a cutting blade on the cutting shaft performs a circular cut on the wafer to be cut, wherein... The working disc is movable along the X-axis, and the cutting axis is movable along the Y-axis. The device comprises: The initial offset data acquisition module is used to obtain the initial offset data of the wafer to be cut on the work disk based on the center position of the wafer to be cut and the center position of the work disk; the initial offset data includes the initial offset of the center of the wafer to be cut from the center of the work disk on the X-axis after the wafer to be cut is placed on the work disk, the initial offset of the center of the wafer to be cut from the center of the work disk on the Y-axis, and the initial center offset angle of the wafer to be cut on the work disk; The real-time prediction position determination module is used to determine the real-time predicted position of each edge point in the annular cut with the target radius when the wafer to be cut rotates with the working disk, based on the target radius and the initial offset data of the wafer to be cut on the working disk. The movement control module is used to control the working disc to move along the X-axis and the cutting axis to move along the Y-axis according to the real-time predicted position corresponding to the edge point in the annular cut, so that the cutting blade moves to the position corresponding to the edge point and cuts the edge point; The mobility control module includes: The real-time cutting point determination unit is used to determine the edge point with the largest distance between the annular cut and the center of the wafer to be cut on the Y-axis as the wafer rotates with the work disk. The compensation amount determination unit is used to calculate motion compensation information based on the real-time predicted position corresponding to the real-time cutting point; the motion compensation information includes a first motion compensation amount on the X-axis and a second motion compensation amount on the Y-axis; The worktable movement control unit is used to control the worktable to move along the X-axis according to the first motion compensation amount, so that the center of the wafer to be cut moves to the straight line where the axis of the cutting axis is located. The cutting axis control unit is used to control the cutting axis to move along the Y-axis according to the second motion compensation amount, so that the cutting blade moves to the position corresponding to the real-time cutting point.

8. A dicing device, comprising: Memory is used to store processor-executable instructions; A processor is configured to execute executable instructions in the memory to implement the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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