Micro-fluidic chip temperature control device

Abstract

The invention discloses a temperature control device for a micro-fluidic chip. The temperature control device comprises a base, a constant temperature module, a dynamic temperature circulation module, an opening and closing driving module and a position switching module, the constant-temperature module comprises at least one pair of constant-temperature heating units; the dynamic temperature circulation module comprises at least one pair of dynamic temperature control units; the constant temperature module is arranged in a first area of the base, and the dynamic temperature circulation module is arranged in a second area of the base; the opening and closing driving module is configured to be capable of controlling the opening and closing states of the constant-temperature heating unit and the dynamic temperature control unit; the position switching module is arranged on the base and is used for conveying the micro-fluidic chip; when the micro-fluidic chip is positioned in the first area, the micro-fluidic chip is clamped by the constant-temperature heating unit and is kept at a constant temperature; and when the micro-fluidic chip is positioned in the second area, the micro-fluidic chip is clamped by the dynamic temperature control unit and dynamic temperature circulation is realized. The device is compact in structure, cooperative in control and high in adaptability, breaks through the limitation of a traditional temperature control mode, and provides a brand new solution for rapid, stable and portable molecular detection.

Description

Technical Field

[0001] This invention relates to the intersection of biomedical detection equipment and microfluidic technology, and in particular to a microfluidic chip temperature control device for nucleic acid amplification. Background Technology

[0002] Polymerase chain reaction (PCR) is a core technology in modern molecular diagnostics. Through precise cycling of three temperature stages—denaturation (95–98°C), annealing (50–65°C), and extension (70–75°C)—it achieves exponential amplification of target DNA fragments and is widely used in rapid disease screening, pathogen detection, genotyping, and forensic identification. However, traditional PCR instruments are limited by thermal conductivity and system heat capacity, with a single amplification cycle typically requiring 1–2 hours, making it difficult to meet the urgent needs of emergency departments, on-site testing, and large-scale screening for "rapid, portable, and high-throughput" PCR.

[0003] Currently, mainstream PCR temperature control protocols can be mainly divided into the following two categories:

[0004] One method is the fixed reaction module heating method, which involves periodically heating and cooling the entire reaction module using electric heating elements. This method has the advantages of flexible programming and relatively high temperature control accuracy. However, due to the thermal inertia of the module and the liquid, the heating and cooling rates are generally low, resulting in long cycle times, delayed thermal response, and signal drift caused by temperature fluctuations during real-time fluorescence detection, affecting quantitative accuracy.

[0005] The second method is the multi-temperature zone movement method, which involves setting multiple temperature zones (such as denaturation, annealing, and extension zones) and using a mechanical transmission system to drive the microfluidic chip to move between different temperature zones to achieve temperature switching. While this method significantly improves the cycle rate, it has significant drawbacks: First, it has a complex structure and large size, making miniaturization difficult; second, the temperature zones are fixed, making it impossible to switch between three-step and two-step methods according to the requirements of different reagents; third, to achieve fluorescence detection, an additional optical detection area is required, which usually necessitates moving the chip again, further increasing system complexity and time delay, severely limiting overall detection efficiency.

[0006] In summary, existing technologies struggle to balance speed and flexibility, lacking an integrated temperature control solution that achieves high-speed temperature switching while also being compact, programmable, and compatible with fluorescence detection. Therefore, there is an urgent need to develop a novel microfluidic chip temperature control device to overcome the technical bottlenecks of traditional PCR systems in terms of response speed, structural complexity, and functional integration. Summary of the Invention

[0007] This invention addresses the technical problems existing in the prior art by providing a microfluidic chip temperature control device. By combining the movement of the second region and the first region as well as the temperature range, it breaks through the bottlenecks of limited amplification speed and large instrument size, and provides a stable temperature environment for high-sensitivity fluorescence detection, thereby achieving faster, more accurate and flexible nucleic acid amplification detection.

[0008] The technical solution adopted by the present invention to solve its technical problem is: a microfluidic chip temperature control device, including a base, a constant temperature module, a dynamic temperature circulation module, an opening and closing drive module and a position switching module;

[0009] The constant temperature module includes at least one pair of oppositely arranged and openable / closeable constant temperature heating units, and the dynamic temperature circulation module includes at least one pair of oppositely arranged and openable / closeable dynamic temperature control units; the constant temperature module is located in the first region of the base, and the dynamic temperature circulation module is located in the second region of the base.

[0010] The opening and closing drive module is configured to control the opening and closing states of the constant temperature heating unit and the dynamic temperature control unit.

[0011] The position switching module is disposed on the base and is used to transport the microfluidic chip between the first region and the second region. When the microfluidic chip is located in the first region, it is clamped by at least one pair of constant temperature heating units and maintained at a constant temperature. When the microfluidic chip is located in the second region, it is clamped by at least one pair of dynamic temperature control units and achieves dynamic temperature cycling.

[0012] In a preferred embodiment, the constant temperature heating unit includes a heat insulation element, a heating element, and a first heat-conducting element. One side surface of the heating element is attached to the first heat-conducting element, and the other side surface is attached to the heat insulation element. The side of the first heat-conducting element facing away from the heating element is used to contact the microfluidic chip to transfer heat.

[0013] In a preferred embodiment, the constant temperature heating unit is provided with an optical detection hole for inserting an optical fiber to detect the fluorescence signal inside the microfluidic chip; the optical detection hole penetrates the heat insulation element, the heating element and the first heat-conducting element.

[0014] In a preferred embodiment, the side of the first heat-conducting sheet facing the heating sheet is provided with a first limiting groove, and the heating sheet is at least partially embedded in the first limiting groove along its thickness direction; the first heat-conducting sheet and the heat insulation member are connected and fixed by a first fastener.

[0015] In a preferred embodiment, the heating element is a ceramic heating element, and the heat insulation element is heat-insulating bakelite.

[0016] In a preferred embodiment, the dynamic temperature control unit includes a Peltier, a second thermally conductive sheet, and a heat sink. One side of the Peltier is attached to the second thermally conductive sheet, and the other side is attached to the heat sink. The side of the second thermally conductive sheet facing away from the Peltier is used to contact the microfluidic chip to transfer heat. The dynamic temperature control unit also includes a fan located on the side of the heat sink facing away from the Peltier for forced heat dissipation or cooling of the heat sink.

[0017] In a preferred embodiment, the second heat-conducting sheet has a second limiting groove on the side facing the Peltier, and the Peltier is at least partially embedded in the second limiting groove along its thickness direction; the second heat-conducting sheet, the heat sink, and the fan are connected and fixed by a second fastener; the side of the heat sink facing the fan has a plurality of parallel heat dissipation fins.

[0018] In a preferred embodiment, the opening and closing drive module includes a power unit, which is mounted on the base and connected to a constant temperature heating unit and a dynamic temperature control unit via a connecting plate to drive the two to open and close synchronously; the power unit is an electric push rod.

[0019] In a preferred embodiment, the constant temperature module and the dynamic temperature circulation module are distributed along a preset direction, which is perpendicular to the opening and closing directions of the constant temperature module and the dynamic temperature circulation module, respectively. The position switching module includes a drive mechanism, a slide, and a moving bracket. The drive mechanism is mounted on the base and configured to drive the slide to move along the preset direction to switch the position of the microfluidic chip. The moving bracket is disposed on the slide and is used to support and position the microfluidic chip.

[0020] In a preferred embodiment, the movable support is provided with a slot for positioning the microfluidic chip.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. This invention employs a hybrid thermal cycling architecture consisting of a constant-temperature module and a dynamic temperature cycling module, and controls the microfluidic chip to switch between two temperature zones via a mechanical structure. The dynamic temperature cycling module provides the denaturation and extension temperatures required for amplification, possessing dynamic temperature adjustment capabilities. It allows for flexible setting of target temperatures according to different reagent requirements, supporting free switching between two-step and three-step PCR procedures, significantly improving the device's adaptability to various reagents and detection projects. The constant-temperature module not only provides a stable temperature environment for the annealing step but also serves as a dedicated area for fluorescence detection. Because the temperature remains constant, it effectively eliminates the interference of temperature fluctuations on the optical signal, facilitating high-sensitivity detection of low-concentration samples. While retaining the high efficiency advantages of temperature-switching amplification, this invention reduces the number of temperature zones to two through structural optimization, making the device more compact and smaller, better meeting the miniaturization requirements of on-site detection and portable applications. Furthermore, when the microfluidic chip is in the first zone for fluorescence detection, the dynamic temperature cycling module can utilize this time to preheat to the temperature required for the next cycle, achieving asynchronous parallel thermal cycling, further shortening the overall amplification time and improving detection efficiency.

[0023] 2. The constant temperature module adopts a three-layer composite structure consisting of a heating element, a first heat-conducting element, and a heat insulation component, with the first heat-conducting element directly contacting the microfluidic chip. This structure achieves efficient and uniform heat transfer to the surface of the microfluidic chip through the heat-conducting element, avoiding localized overheating; the heat insulation component blocks heat loss to the base and environment, concentrating heat energy on the microfluidic chip, significantly improving thermal efficiency, reducing energy consumption, and shortening temperature control response time. Simultaneously, it ensures that the temperature fluctuation in the first region is ≤±0.1°C, providing an ultra-stable thermal environment for fluorescence detection.

[0024] 3. This invention directly sets an optical detection hole on the constant temperature module, eliminating the need for additional optical windows or external optical paths, thus avoiding fluorescence signal attenuation caused by optical path deflection, lens contamination, or temperature gradients. Fluorescence is collected directly under constant temperature conditions, completely eliminating the interference of temperature fluctuations on fluorescence intensity, significantly improving the detection signal-to-noise ratio and quantitative accuracy of low-concentration nucleic acid samples, and achieving interference-free synergy of amplification-detection integration.

[0025] 3. The setting of the first limiting groove ensures that there is no relative displacement between the heating element and the heat-conducting element, significantly reducing the contact thermal resistance and stabilizing the heat conduction efficiency; the use of the first fastener connection enhances the structural rigidity, prevents delamination or poor contact caused by thermal expansion and contraction during long-term use, and improves the reliability of long-term system operation and the repeatability of temperature control.

[0026] 4. The dynamic temperature control unit adopts a Peltier, second heat-conducting plate, heat sink, and forced air cooling structure. The second heat-conducting plate directly contacts the microfluidic chip. The Peltier enables rapid bidirectional temperature control, and the heat sink and fan work together to achieve efficient heat dissipation, which significantly improves the temperature switching rate of the second region, far exceeding the traditional resistance heating method. Forced air cooling ensures a stable temperature difference at the cold end of the Peltier, avoiding performance degradation caused by heat accumulation, and allowing the denaturation and extension stages to be completed in a very short time, greatly compressing the PCR cycle.

[0027] 5. The second limiting groove ensures that the Peltier and the second heat-conducting plate are tightly fitted, with low thermal resistance between them, thus improving heat transfer efficiency; the second fastener design prevents components from loosening and enhances vibration resistance; the parallel heat dissipation fins significantly increase the heat dissipation surface area, enhance air cooling efficiency, and enable the Peltier to maintain stable temperature control performance under high-frequency switching conditions.

[0028] 6. This invention uses only one power unit to complete the synchronous clamping and release of dual modules, which simplifies the structure, reduces costs, simplifies control logic, and avoids uneven chip force caused by asynchronous multiple power units. Moreover, the synchronous action ensures that the microfluidic chip has no risk of "suspending" or "squeezing" at the moment of switching, thus improving operational reliability and system life.

[0029] 7. The two modules are arranged linearly perpendicular to the opening and closing direction. The position switching module adopts linear drive of the slide table, and the moving bracket carries the microfluidic chip. This structural design makes the layout compact, avoids motion interference, and enables high-speed linear displacement of the microfluidic chip between the two zones, achieving precise positioning. This ensures that the microfluidic chip is in complete contact with the heating / cooling surface every time it enters the temperature zone, avoiding uneven temperature or amplification failure due to misalignment.

[0030] 8. The mobile bracket adopts a slot design, which enables the microfluidic chip to be "plug and play", improving the ease of operation and system automation compatibility.

[0031] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments; however, the microfluidic chip temperature control device of the present invention is not limited to the embodiments. Attached Figure Description

[0032] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0033] Figure 2 This is a top view of the invention (excluding the movable support);

[0034] Figure 3 This is an exploded view of the constant temperature module of the present invention;

[0035] Figure 4 This is a three-dimensional structural diagram of the constant temperature module of the present invention;

[0036] Figure 5 This is an exploded view of the dynamic temperature cycling module of the present invention;

[0037] Figure 6 This is a three-dimensional structural schematic diagram of the dynamic temperature circulation module of the present invention;

[0038] Figure 7 This is an exploded view of the base, opening and closing drive module, and position cutting module of the present invention;

[0039] Figure 8 This is a schematic diagram of the combination of the base, opening and closing drive module, and position cutting module of the present invention;

[0040] Figure 9 This is an exploded view of the base of the present invention;

[0041] In the diagram, 1. Base; 11. Base plate; 12. First bracket; 121. First upright plate; 122. First support plate; 123. First baffle; 13. Second bracket; 131. Second upright plate; 132. Second support plate; 14. Third bracket; 141. Third upright plate; 142. Third support plate; 143. Second baffle; 144. Third opening; 15. Mounting plate; 151. Second opening; 2. Constant temperature module; 21. Ceramic heating element; 211. Second optical detection hole; 22. First heat-conducting element; 221. Third optical detection hole; 222. First limiting groove; 223. First through hole ; 23. Heat-insulating bakelite; 231. First optical detection hole; 232. First threaded hole; 3. Dynamic temperature circulation module; 31. Peltier; 32. Second heat-conducting sheet; 321. Second limiting groove; 322. Second through hole; 33. Heat sink; 331. Heat sink fins; 332. Third through hole; 34. Fan; 341. Second threaded hole; 4. Opening and closing drive module; 41. Electric push rod; 42. Connecting plate; 421. First opening; 43. Double-ended bolt; 5. Position switching module; 51. Slide table; 52. Motor; 53. Lead screw; 54. Base frame; 56. Moving frame; 561. Slot. Detailed Implementation

[0042] In this invention, the terms "first," "second," etc., are used only to distinguish similar objects, not to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" refers to two or more.

[0043] Please see Figures 1-9As shown, a microfluidic chip temperature control device for nucleic acid amplification according to the present invention includes a base 1, a thermostatic module 2, a dynamic temperature cycling module 3, an opening / closing drive module 4, and a position switching module 5. The thermostatic module 2 includes at least one pair of relatively opposite and operable thermostatic heating units, used to provide a stable thermal environment for the microfluidic chip during the nucleic acid amplification annealing stage, assisting in primer binding within the amplification system solution. It can also cooperate with a photoelectric detection module during the annealing stage of each PCR cycle to collect the fluorescence intensity within the solution reaction chamber, laying a good foundation for subsequent quantitative evaluation of detection results. The dynamic temperature cycling module 3 includes at least one pair of relatively opposite and operable dynamic temperature control units, whose main function is to conduct heat to the amplification system within the amplification chip during the denaturation and extension stages of nucleic acid amplification, accurately and in real-time completing the high-temperature denaturation stage and the new strand synthesis stage. The opening / closing drive module 4 is configured to control the opening and closing states of the thermostatic heating units and the dynamic temperature control units.

[0044] The constant temperature module 2 is located in the first region of the base 1, and the dynamic temperature circulation module 3 is located in the second region of the base 1. The two are arranged along a preset direction, and their respective opening and closing directions are perpendicular to the arrangement direction, forming a compact spatial layout and a structural system without motion interference. The position switching module 5 is located on the base 1 and is used to transport the microfluidic chip between the first region and the second region. When the microfluidic chip is located in the first region, it is clamped by at least one pair of constant temperature heating units and maintained at a constant temperature. When the microfluidic chip is located in the second region, it is clamped by at least one pair of dynamic temperature control units and achieves dynamic temperature circulation.

[0045] In this embodiment, the constant temperature module 2 is an example of a pair of symmetrically arranged constant temperature heating units, and the dynamic temperature circulation module 3 is also an example of a pair of symmetrically arranged dynamic temperature control units. Both of them have mirror-symmetric structures to ensure uniform clamping force and balanced heat transfer on the microfluidic chip.

[0046] like Figure 3 , Figure 4As shown, each constant-temperature heating unit includes a heat insulation component, a heating element, and a first heat-conducting element 22. The heating element is preferably a ceramic heating element 21, which can rapidly heat to a preset target temperature after being powered on. One surface of the ceramic heating element 21 is tightly attached to the first heat-conducting element 22, and the other surface is attached to the heat insulation component. The side of the first heat-conducting element 22 facing away from the heating element directly contacts the microfluidic chip, used to efficiently and uniformly conduct heat to the surface of the microfluidic chip, achieving stable amplification temperature control without localized overheating. The heat generated by the ceramic heating element 21 is uniformly diffused by the first heat-conducting element 22 and then acts on the microfluidic chip. The two first heat-conducting elements 22 sandwich the microfluidic chip, forming a stable thermal contact surface, significantly improving temperature uniformity. Simultaneously, the heat insulation component effectively prevents heat loss to the base 1 and the surrounding environment, concentrating heat energy on the microfluidic chip, greatly improving thermal efficiency and reducing system energy consumption.

[0047] Preferably, the heat insulation component is made of heat-insulating bakelite 23, which has an extremely low thermal conductivity and can effectively suppress heat conduction loss. It, together with the first heat-conducting sheet 22, clamps the ceramic heating element 21, forming a stable and compact three-layer structure. Specifically, the first heat-conducting sheet 22 has a first limiting groove 222 on the side facing the heating element. The ceramic heating element 21 is at least partially embedded in this limiting groove along its thickness direction, achieving precise positioning and mechanical fixation of the heat source and the heat-conducting surface, avoiding poor thermal contact caused by relative displacement. The first heat-conducting sheet 22 and the heat insulation component are connected and fixed by multiple first fasteners (preferably first screws, not shown in the figure). The screw shank passes through the first through hole 223 of the first heat-conducting sheet 22 and is screwed into the pre-set first threaded hole 232 on the heat-insulating bakelite 23. The head of the first screw is accommodated in a corresponding recess at one end of the first through hole 223. To ensure the reliability and structural strength of the threaded connection, the heat-insulating bakelite 23 protrudes in the area with the threaded hole in the direction away from the ceramic heating element 21 to form a columnar structure. This structure not only provides sufficient depth space for the threaded hole, but also enhances the compressive and deformation resistance of the heat insulation component and improves the long-term stability of the overall structure.

[0048] In a preferred embodiment, each thermostatic heating unit is provided with an optical detection hole for inserting an optical fiber to detect the fluorescence signal inside the microfluidic chip. This optical detection hole penetrates the heat insulation component, the heating element, and the first heat-conducting element 22. Specifically, the heat insulation component (i.e., heat-insulating bakelite 23) has a first optical detection hole 231, the heating element (i.e., the ceramic heating element 21) has a second optical detection hole 221, and the first heat-conducting element 22 has a third optical detection hole 221. The first, second, and third optical detection holes 231 are coaxially aligned, forming an unobstructed, thermally gradient-free direct optical path. This optical detection hole is centrally located at the center of the thermostatic heating unit, ensuring that the fluorescence signal acquisition path coincides with the center of the thermal field, minimizing optical path deviation and thermal interference. Both thermostatic heating units of the thermostatic module 2 are provided with this optical detection hole, and the two are coaxially arranged, allowing the optical fiber to simultaneously or sequentially detect the reaction areas on the upper and lower surfaces of the chip, improving detection efficiency and signal consistency.

[0049] like Figure 5 , Figure 6 As shown, each dynamic temperature control unit includes a Peltier 31, a second heat-conducting plate 32, and a heat sink 33. When powered on, the Peltier 31 creates a temperature difference on both sides, enabling bidirectional temperature regulation for both cooling and heating, thus meeting the different temperature requirements of the denaturation (high temperature) and extension (medium temperature) stages during nucleic acid amplification. One surface of the Peltier 31 is tightly attached to the second heat-conducting plate 32, and the other surface is attached to the heat sink 33. The side of the second heat-conducting plate 32 facing away from the Peltier 31 directly contacts the microfluidic chip for efficient heat transfer. Each dynamic temperature control unit also includes a fan 34, mounted on the side of the heat sink 33 facing away from the Peltier 31, used for forced air cooling or forced heat dissipation of the heat sink 33 to enhance the heat exchange capacity of the Peltier 31.

[0050] During the heating process, the chip side of the Peltier 31 (the surface in contact with the second heat-conducting plate 32) acts as the heating surface, transferring heat to the second heat-conducting plate 32, thereby heating the microfluidic chip. At the same time, the other side of the Peltier 31 (the surface in contact with the heat sink 33) becomes the cooling surface. The fan 34 and the heat sink 33 work together to quickly dissipate the waste heat generated on this side, thereby improving the temperature difference efficiency of the Peltier 31 and indirectly assisting the second heat-conducting plate 32 to heat up faster. During the cooling process, the chip side of the Peltier 31 becomes the cooling surface, actively absorbing heat from the second heat-conducting plate 32 to achieve rapid cooling of the microfluidic chip. At this time, the side in contact with the heat sink 33 becomes the heating surface, and the fan 34 and the heat sink 33 quickly dissipate the heat generated on this side through forced heat dissipation, thereby maintaining the high-efficiency cooling capacity of the Peltier 31.

[0051] It is evident that the fan 34 and heat sink 33 are not only used for heat dissipation, but also dynamically participate in bidirectional thermal management of "auxiliary heating" or "auxiliary cooling" according to the working mode of the Peltier 31, significantly improving the temperature switching rate and temperature control accuracy.

[0052] In this embodiment, the side of the second heat-conducting plate 32 facing the Peltier 31 is provided with a second limiting groove 321. The Peltier 31 is at least partially embedded in the second limiting groove 321 along its thickness direction, achieving circumferential limiting and precise centering of the Peltier 31, preventing it from shifting or rotating during thermal cycling, and ensuring stable and reliable thermal contact. The second heat-conducting plate 32, the heat sink 33, and the fan 34 are connected and fixed by multiple second fasteners (preferably second screws, not shown in the figure) to form an integrated thermal management component. The screw of the second screw passes through the second through hole 322 of the second heat-conducting plate 32 and the third through hole 332 of the heat sink 33 in sequence, and is threadedly connected to the second threaded hole 341 on the fan 34 to achieve rigid locking. This structure not only enhances the mechanical strength and vibration resistance of the overall component, but also ensures a long-term stable heat conduction path between the Peltier 31, the second heat-conducting plate 32, the heat sink 33, and the fan 34, avoiding increased thermal resistance or temperature control failure due to loosening.

[0053] Furthermore, the heat sink 33 has multiple parallel heat dissipation fins 331 on the side facing the fan 34 to significantly increase the effective heat dissipation area, enhance air convection efficiency, and greatly improve heat dissipation capacity. This ensures that the Peltier 31 can maintain a stable operating temperature difference under high-frequency temperature cycling conditions, achieving rapid, continuous, and reliable temperature rise and fall control.

[0054] like Figure 1 , Figure 2 , Figure 7 , Figure 8 As shown, the opening / closing drive module 4 includes a power unit mounted on the base 1. This power unit is connected to a constant-temperature heating unit and a dynamic temperature control unit via the same connecting plate 43, driving both units to synchronously perform opening and closing actions. In this embodiment, the power unit is preferably an electric push rod 42, which has a compact structure, rapid response, stable thrust, and can precisely control the clamping force and stroke. Of course, the power unit can also be a linear motor, a pneumatic push rod, or other actuators with equivalent driving capabilities, and is not limited to the forms listed in this embodiment. The movable end of the electric push rod 42 is fixedly connected to the connecting plate 43 using a double-ended bolt 43.

[0055] The connecting plate 43 is composed of three fixed plates (preferably aluminum plates) connected together, forming a horizontal "U"-shaped structure with good rigidity and uniform heat conduction. The two fixed plates on the outer side are respectively fixedly connected to a constant temperature heating unit and a dynamic temperature control unit, realizing the synchronous action control of the two by the drive module; wherein, the outer fixed plate corresponding to the dynamic temperature control unit has a first opening 421, which is used to provide a heat dissipation / cooling channel for the fan 34 on that side, ensuring that the heat of the hot end of the Peltier 31 can be efficiently discharged, avoiding heat accumulation that affects the temperature control performance.

[0056] The base 1 has a mounting plate 15 arranged opposite to the connecting plate 43. Its structure is completely identical to that of the connecting plate 43, shaped like a "ㄣ", and also composed of three aluminum plates. This mounting plate 15 is used to fix another constant temperature heating unit and another dynamic temperature control unit, forming a temperature control actuator symmetrical to the connecting plate 43 on the other side. The mounting plate 15 also has a second opening 151 that matches the corresponding position of the dynamic temperature control unit, so as to cooperate with the fan 34 to achieve a symmetrical heat dissipation / cooling path, ensuring that the temperature control units on both sides are consistent in thermal management, and improving the uniformity and stability of the temperature field of the whole machine. This symmetrical double-sided structural design not only realizes the synchronous operation of dual-channel temperature control, but also effectively offsets thermal deformation and mechanical stress through structural symmetry, further improving the long-term reliability and positioning accuracy of the system under high-frequency cyclic conditions.

[0057] like Figure 1 , Figure 2 , Figure 7 , Figure 8 As shown, the position switching module 5 includes a drive mechanism, a slide table 51, and a moving bracket 56. The drive mechanism is mounted on the base 1 and configured to drive the slide table 51 to move along a preset direction (i.e., the arrangement direction of the constant temperature module 2 and the dynamic temperature circulation module 3) to switch the position of the microfluidic chip. The moving bracket 56 is fixed on the slide table 51 and is used to support and position the microfluidic chip, ensuring that it moves without deviation or vibration, and that it can reliably contact the heating or cooling surface each time it enters the temperature zone. In this embodiment, the drive mechanism includes a motor 52 and a transmission component. The output shaft of the motor 52 is connected to the slide table 51 through the transmission component to achieve linear motion output. Preferably, the transmission component is a lead screw 53, which is rotatably mounted on a base frame 54, which is mounted on the base 1. The lead screw 53 and the slide table 51 are threaded together, which has the advantages of high precision, low friction, and high repeatability, and can meet the positioning stability requirements of the microfluidic chip during high-speed switching.

[0058] In this embodiment, the movable support 56 is provided with a slot 561 that matches the shape of the microfluidic chip, for quick, non-destructive, and repeatable positioning of the chip. This slot 561 structure not only facilitates chip loading by manual or automated devices, but also effectively prevents the microfluidic chip from rotating or sliding during movement, significantly improving operational convenience and system automation compatibility.

[0059] like Figure 7 , Figure 8 As shown, the base 1 includes a base plate 11, and a first bracket 12, a second bracket 13, and a third bracket 14 disposed on the base plate 11. The first bracket 12 is used to install the opening and closing drive module 4 (preferably an electric push rod 42); the second bracket 13 is located between the first bracket 12 and the third bracket 14, and its main function is to guide the linear movement of the connecting plate 43, ensuring that it does not deviate or wobble during opening and closing; the third bracket 14 is used to fix the mounting plate 15, forming a symmetrical support structure with the connecting plate 43. The position switching module 5 is disposed on the base plate 11 and located between the second bracket 13 and the third bracket 14, and is used to realize the precise displacement of the microfluidic chip between the first region and the second region.

[0060] like Figure 9 As shown, the first bracket 12 includes two opposing first upright plates 121, with a first support plate 122 and a first baffle 123 between the two first upright plates 121. The electric push rod 42 is mounted on the first support plate 122 and is enclosed by the two first upright plates 121 and the first baffle 123 to form a semi-closed mounting cavity, effectively limiting the radial displacement and vibration of the electric push rod 42 during operation and improving driving stability. The second bracket 13 includes two opposing second upright plates 131, with a second support plate 132 between the two second upright plates 131. The fixing plate in the connecting plate 43, which is connected to the dynamic temperature control unit, and the fixing plate in the middle are limited in the guide groove formed by the two second upright plates 131 and the second support plate 132, so that the connecting plate 43 can slide linearly in a preset direction, ensuring that its movement trajectory is accurate, without rotation, and without jamming. The third bracket 14 includes two opposing third upright plates 141, with a third support plate 142 and a second baffle 143 between the two third upright plates 141. A mounting plate 15 is fixed to the third support plate 142, its position symmetrical to the connecting plate 43, and is used to support and fix another constant-temperature heating unit and another dynamic temperature control unit. The second baffle 143 is located outside the mounting plate 15, with a gap between it and the mounting plate 15. It has a third opening 144 corresponding to the fan 34 of the dynamic temperature control unit, allowing the heat discharged by the fan 34 to be smoothly discharged, preventing heat accumulation from affecting the temperature control performance.

[0061] The base 1, through the coordinated layout of the first support 12, the second support 13, and the third support 14, achieves high-precision spatial positioning and mechanical support for the opening and closing drive module 4, the position switching module 5, the constant temperature module 2, and the dynamic temperature circulation module 3, forming a stable, compact, and vibration-resistant overall mechanical frame, providing structural protection for the long-term reliable operation of the system under high-frequency and continuous temperature control conditions.

[0062] The present invention discloses a microfluidic chip temperature control device, which achieves efficient, precise and flexible temperature control during nucleic acid amplification by constructing a dual-zone separation of a constant temperature zone (composed of a constant temperature module 2 and its first region) and a variable temperature zone (composed of a dynamic temperature circulation module 3 and its second region) and a chip-moving thermal circulation architecture.

[0063] During operation, the microfluidic chip is first delivered to the first region by the position switching module 5. At this time, the opening and closing drive module 4 drives the two isothermal heating units to close, clamping the microfluidic chip and ensuring close contact between the first heat-conducting plates 22 of each isothermal heating unit. The isothermal module 2 uses a ceramic heating plate 21 as a heat source, combined with a heat-insulating bakelite board 23 to achieve efficient heat preservation, maintaining the microfluidic chip at the annealing temperature (e.g., 55–65°C), providing a stable thermal environment for the specific binding of primers and templates. During this stage, an optical fiber is inserted through the optical detection hole penetrating the isothermal module 2 to directly detect the fluorescence signal within the microfluidic chip. Because the temperature in the isothermal region is constant and without fluctuations, the fluorescence detection process is not affected by thermal disturbances, significantly improving the detection sensitivity and quantitative accuracy of low-concentration samples.

[0064] While fluorescence detection is underway, the variable-temperature zone is simultaneously preheated: the Peltier 31 in the dynamic temperature control unit starts according to a preset program, rapidly raising its own hot end to the denaturation temperature (e.g., 95°C) or cooling it to the extension temperature (e.g., 72°C), and transferring the heat to the heat sink 33 side. The fan 34 and the heat sink fins work together to force heat dissipation, achieving efficient heat exchange. At this stage, although the variable-temperature zone does not come into contact with the microfluidic chip, it has already prepared for the temperature required for the next cycle.

[0065] After the isothermal detection is completed, the opening and closing drive module 4 reverses its action, driving the two isothermal units and two dynamic control units to open synchronously. The drive mechanism drives the slide 51 to move linearly, quickly transferring the microfluidic chip from the first region to the second region. Then, the opening and closing drive module 4 closes the two dynamic temperature control units, clamping the microfluidic chip between the two second heat-conducting plates 32. At this time, the Peltier 31 rapidly heats up (denaturation) or cools down (extension) according to the current cycle stage, completing the critical temperature step of PCR. The heat sink 33 and fan 34 continue to work, ensuring a stable temperature difference between the hot and cold ends of the Peltier 31, a high temperature switching rate, and significantly shortening the single-cycle time.

[0066] After completing the temperature change phase, the microfluidic chip is moved back to the first region to enter the next annealing and detection cycle. The entire process achieves thermal cycle optimization in the time dimension through an asynchronous parallel mechanism of "detection-preheating-switching-amplification", completing the multi-step amplification function that can only be achieved by traditional three-temperature-zone systems with only two temperature zones.

[0067] This invention discloses a microfluidic chip temperature control device that innovatively employs a dual-zone structure consisting of a constant-temperature zone and a variable-temperature zone. Through mechanical switching, the chip can be precisely moved between different temperature zones, achieving spatiotemporal decoupling of amplification and detection functions. The variable-temperature zone dynamically adjusts the temperature to adapt to different PCR programs, while the constant-temperature zone stably maintains the annealing temperature and simultaneously performs high-precision fluorescence detection. Furthermore, during detection, the variable-temperature zone pre-prepares the temperature for the next cycle, significantly improving overall efficiency. The device features a compact structure, coordinated control, and strong adaptability, overcoming the limitations of traditional temperature control methods and providing a novel solution for rapid, stable, and portable molecular detection.

[0068] The present invention provides a microfluidic chip temperature control device. The parts not described herein are the same as or can be implemented using existing technologies.

[0069] The above embodiments are only used to further illustrate a microfluidic chip temperature control device of the present invention, but the present invention is not limited to the embodiments. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A microfluidic chip temperature control device, characterized in that: It includes a base, a constant temperature module, a dynamic temperature circulation module, an opening and closing drive module, and a position switching module; The constant temperature module includes at least one pair of oppositely arranged and openable / closeable constant temperature heating units, and the dynamic temperature circulation module includes at least one pair of oppositely arranged and openable / closeable dynamic temperature control units; the constant temperature module is located in the first region of the base, and the dynamic temperature circulation module is located in the second region of the base. The opening and closing drive module is configured to control the opening and closing states of the constant temperature heating unit and the dynamic temperature control unit. The position switching module is disposed on the base and is used to transport the microfluidic chip between the first region and the second region. When the microfluidic chip is located in the first region, it is clamped by at least one pair of constant temperature heating units and maintained at a constant temperature. When the microfluidic chip is located in the second region, it is clamped by at least one pair of dynamic temperature control units and achieves dynamic temperature cycling.

2. The microfluidic chip temperature control device according to claim 1, characterized in that: The constant temperature heating unit includes a heat insulation component, a heating element, and a first heat-conducting element. One side surface of the heating element is attached to the first heat-conducting element, and the other side surface is attached to the heat insulation component. The side of the first heat-conducting element facing away from the heating element is used to contact the microfluidic chip to transfer heat.

3. The microfluidic chip temperature control device according to claim 2, characterized in that: The constant temperature heating unit is provided with an optical detection hole for inserting an optical fiber to detect the fluorescence signal inside the microfluidic chip; the optical detection hole passes through the heat insulation component, the heating element and the first heat-conducting element.

4. The microfluidic chip temperature control device according to claim 2, characterized in that: The first heat-conducting sheet has a first limiting groove on the side facing the heating sheet, and the heating sheet is at least partially embedded in the first limiting groove along its thickness direction; the first heat-conducting sheet and the heat insulation member are connected and fixed by a first fastener.

5. The microfluidic chip temperature control device according to claim 2, characterized in that: The heating element is a ceramic heating element, and the heat insulation element is heat-insulating bakelite.

6. The microfluidic chip temperature control device according to claim 1, characterized in that: The dynamic temperature control unit includes a Peltier, a second heat-conducting plate, and a heat sink. One side of the Peltier is attached to the second heat-conducting plate, and the other side is attached to the heat sink. The side of the second heat-conducting plate facing away from the Peltier is used to contact the microfluidic chip to transfer heat. The dynamic temperature control unit also includes a fan, which is located on the side of the heat sink facing away from the Peltier, and is used to force heat dissipation or cooling of the heat sink.

7. The microfluidic chip temperature control device according to claim 6, characterized in that: The second heat-conducting sheet has a second limiting groove on the side facing the Peltier, and the Peltier is at least partially embedded in the second limiting groove along its thickness direction; the second heat-conducting sheet, the heat sink, and the fan are connected and fixed by a second fastener; the side of the heat sink facing the fan has a plurality of parallel heat dissipation fins.

8. The microfluidic chip temperature control device according to claim 1, characterized in that: The opening and closing drive module includes a power unit, which is installed on the base and connected to a constant temperature heating unit and a dynamic temperature control unit through a connecting plate to drive the two to open and close synchronously; the power unit is an electric push rod.

9. The microfluidic chip temperature control device according to claim 1, characterized in that: The constant temperature module and the dynamic temperature circulation module are distributed along a preset direction, which is perpendicular to the opening and closing direction of the constant temperature module and the dynamic stable circulation module respectively; the position switching module includes a drive mechanism, a slide table and a moving bracket, the drive mechanism is mounted on the base and configured to drive the slide table to move along the preset direction to switch the position of the microfluidic chip; The movable support is mounted on the slide and is used to support and position the microfluidic chip.

10. The microfluidic chip temperature control device according to claim 9, characterized in that: The movable support is provided with a slot for positioning the microfluidic chip.

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