Rotary test fixture for liquid cooling high and low temperature chip

Abstract

The invention relates to the technical field of chip function testing, in particular to a rotary test fixture for a liquid-cooled high-low temperature chip, which comprises a test mechanism, the test mechanism comprises a spinning assembly, a shell assembly, a heat supply assembly, a cold supply assembly and a fixture assembly, the fixture assembly is positioned below the spinning assembly, and the shell assembly is positioned below the shell assembly. The heat supply assembly and the cold supply assembly are located between the clamp assembly and the spinning assembly, and the outer side of the clamp assembly is sleeved with the shell assembly. The clamp assembly comprises a chip function test circuit board used for detecting and supporting, a double-end spring probe, a tested chip positioning frame, a clamp needle die, a clamp upper cover, a clamp base and a clamp upper cover tray, the spinning assembly comprises a spinning handle, an elastic bolt and a lifting flange, and the heat supply assembly comprises a thermoelectric coupler. According to the invention, stable electrical signal connection is realized, and a good electrical performance test loop is constructed.

Description

Technical Field

[0001] This invention relates to the field of chip functional testing technology, specifically to a rotary test fixture for liquid-cooled high and low temperature chips. Background Technology

[0002] Used for testing the functionality of semiconductor chips under simulated high and low temperature environments, allowing the chip to be tested under a specified temperature condition within the temperature range of -60℃ to +150℃; or setting any low or high temperature, and testing whether the chip's various functional parameters can meet the design requirements under temperature cycling conditions.

[0003] To test the functionality of a chip under high and low temperature conditions, a high and low temperature environment chamber is typically used. The environment chamber contains a chip test fixture, and test cables pass through the insulation wall of the environment chamber to connect to the test function board or test system. When the chip is positioned and clamped in the test fixture, the chip pins are physically connected to the test cables. That is, the chip pins are electrically connected to the test function board or test system through the cables, thus constructing a test circuit for the electrical parameters of the chip under high and low temperature conditions.

[0004] With the development of chip technology, many chips now contain high-speed signals or radio frequency wireless signals. In traditional chip testing solutions, when chip signals pass through test cables, the cables cause excessive attenuation of the signals. This severe attenuation leads to distorted or incorrect test data, or even makes data sampling tests impossible.

[0005] Therefore, a rotary test fixture for liquid-cooled high and low temperature chips is proposed to solve the problems mentioned above. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a rotary test fixture for liquid-cooled high and low temperature chips, which can solve the problems of excessive signal attenuation caused by cables, severe signal attenuation, resulting in distorted or erroneous test data, or the inability to perform data sampling tests.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a testing mechanism comprising a spinning assembly, a housing assembly, a heating assembly, a cooling assembly, and a clamping assembly; The clamping assembly is located below the spinning assembly, the heating assembly and the cooling assembly are located between the clamping assembly and the spinning assembly, and the outer shell assembly is sleeved on the outside of the clamping assembly; The fixture assembly includes a chip functional test circuit board for testing support, a double-headed spring probe, a chip positioning frame under test, a fixture pin mold, a fixture top cover, a fixture base, and a fixture top cover tray; The spinning assembly includes a spinning handle, a resilient bolt, and a lifting flange; The heating component includes a thermocoupler, and the cooling component includes a cold air inlet pipe A, a cold air pipe B, and a cold air pipe C. An air-cooled heat exchanger is provided between the heating component and the cooling component.

[0008] Preferably, the upper cover of the clamp has a connecting hole in the middle, and the connecting hole has an internal thread. The lower half of the spinning handle has an external thread on the outside of the connecting shaft, and the spinning handle is threadedly connected to the upper cover of the clamp.

[0009] Preferably, the upper surface of the clamp cover is provided with elastic bolt mounting holes evenly distributed on the side, and an elastic bolt is provided in the elastic bolt mounting hole. The bottom end of the elastic bolt is fastened to the upper end of the lifting flange, and the lifting flange is located inside the clamp cover.

[0010] Preferably, the air-cooled heat exchanger is installed on the lower side of the lifting flange, and an electric heating plate is installed on the lower side of the air-cooled heat exchanger. The electric heating plate is located above the test chip. The thermocouple is installed inside the electric heating plate. A thermocouple socket is provided on one side of the thermocouple, and an electric heating socket is provided on one side of the electric heating plate. The lifting flange is provided with a thermocouple plug that mates with the thermocouple socket and an electric heating plug that mates with the electric heating socket.

[0011] Preferably, a heat exchanger insulation shell is installed on the lower side of the lifting flange, and the air-cooled heat exchanger and the electric heating pressure plate are both located inside the heat exchanger insulation shell.

[0012] Preferably, the fixture base is located above the chip functional test circuit board, the fixture pin mold is fixedly disposed on the upper end of the chip functional test circuit board, the fixture pin mold has a built-in chip positioning frame for positioning the chip under test, the chip positioning frame is used for positioning the chip under test, the fixture pin mold has a probe mounting hole in the middle, the probe mounting hole is located in the middle of the chip positioning frame, the probe mounting hole is provided with a double-ended spring probe, the double-ended spring probe includes an upper elastic probe and a lower elastic probe, the chip functional test circuit board is provided with circuit contacts that contact the lower elastic probe, there are several circuit contacts, and the upper elastic probe is located below the chip under test.

[0013] Preferably, a control pipeline flange is installed on the rear side of the fixture base, and an insulation layer flange is installed on the rear side of the control pipeline flange.

[0014] Preferably, the clamp cover has a drying hood A and a drying hood B on opposite sides. The drying hood A has a drying air nozzle A on its lower side, and the drying hood B has a drying air nozzle B on its lower side. A drying air pipe is provided on one side of the drying hood A, and the other end of the drying air pipe is connected to the control pipeline flange and the insulation layer flange. An LED indicator light is provided on one side of the drying hood A. The electrical signals of the LED indicator light, the electric heating plate, and the thermocouple electrical components are connected to a control cable via wires.

[0015] Preferably, a cold air pipe insulation layer is provided on one side of the insulation layer flange, and the cold air insulation layer is connected to the insulation layer flange by a drying auxiliary air pipe and a cold air pipe A. A cold air pipe B and a cold air pipe C are provided inside the clamp base, a cold air inlet pipe A is provided inside the heat exchanger protective shell, a cold air inlet pipe B is provided on one side of the air-cooled heat exchanger, and a cold air nozzle A and a cold air nozzle B are provided on the lower side of the air-cooled heat exchanger.

[0016] Preferably, the clamp top cover is provided with hooks on both sides, and the clamp base and the clamp top cover tray are provided with corresponding hook positions on both sides.

[0017] Compared with the prior art, the present invention provides a rotary test fixture for liquid-cooled high and low temperature chips, which has the following advantages: 1. The chip pins are connected to the chip functional test circuit board via double-ended spring probes, achieving a stable electrical signal connection and constructing a good electrical performance test circuit.

[0018] 2. To achieve testability of high-frequency signal chips and radio frequency chips in high and low temperature environments, and to achieve non-destructive testing of high-frequency and radio frequency chips in high and low temperature environments.

[0019] 3. Improved product testing efficiency for chip manufacturers and reduced production costs. Attached Figure Description

[0020] Figure 1 This is an exploded view of the overall structure of the present invention; Figure 2 This is a schematic diagram of the lower half of the three-dimensional structure of the present invention; Figure 3 This is an enlarged schematic diagram of the structure at point A of the present invention; Figure 4 This is an enlarged schematic diagram of the structure at point B in this invention; Figure 5 This is a schematic diagram of the temperature regulation part of the present invention; Figure 6 This is a schematic diagram of the overall structure of the present invention.

[0021] In the diagram: 1. Fixture base; 2. Fixture top cover; 3. Fixture pin mold; 4. Chip functional test circuit board; 5. Fixture top cover tray; 6. Spinning handle; 7. Elastic bolt; 8. Elastic bolt mounting hole; 9. Lifting flange; 10. Air-cooled heat exchanger; 11. Heat exchanger insulation shell; 12. Electric heating pressure plate; 13. Thermocouple; 14. Thermocouple socket; 1401. Thermocouple plug; 15. Electric heating socket; 1501. Electric heating plug; 16. Test chip positioning frame; 17. Probe mounting hole; 18. Double-ended spring probe; 19. Circuit. Contact point; 20. Upper elastic probe; 21. Lower elastic probe; 22. Drying hood A; 23. Drying hood B; 24. Drying air nozzle A; 25. Drying air nozzle B; 26. Hook; 27. Control pipe flange; 28. Insulation layer flange; 29. ​​Cold air pipe insulation layer; 30. Control cable; 31. Drying air pipe; 32. Hook mounting position; 33. Cold air pipe A; 34. Cold air pipe B; 35. Cold air pipe C; 36. Cold air inlet pipe A; 37. Cold air inlet pipe B; 38. Cold air nozzle A; 39. Cold air nozzle B. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example: Please see Figure 1 - Figure 6 The rotary test fixture for liquid-cooled high and low temperature chips in this embodiment includes a test mechanism, which includes a spinning assembly, a housing assembly, a heating assembly, a cooling assembly, and a fixture assembly. The clamping assembly is located below the spinning assembly, the heating assembly and the cooling assembly are located between the clamping assembly and the spinning assembly, and the housing assembly is fitted onto the outside of the clamping assembly; The fixture assembly includes a chip function test circuit board 4 for testing support, a double-headed spring probe 18, a test chip positioning frame 16, a fixture pin mold 3, a fixture top cover 2, a fixture base 1, and a fixture top cover tray 5. The spinning assembly includes a spinning handle 6, a resilient bolt 7, and a lifting flange 9; The heating component includes a thermocoupler 13, and the cooling component includes a cold air inlet pipe A36, a cold air pipe B34, and a cold air pipe C35. An air-cooled heat exchanger 10 is installed between the heating component and the cooling component.

[0024] First, the overall structure of the testing mechanism is existing equipment, and its specific operation control and wiring connections are all well-known technologies in the field. The corresponding fixing, installation, rotation and other methods in this application can all adopt conventional processing methods in the mechanical field. Since they are all existing conventional technologies, they are not described in detail in this embodiment. The fixture consists of a top cover 2, a base 1, a pin mold 3, a chip functional test circuit board 4, and a top cover tray 5, forming an air-cooled high and low temperature test fixture. The test chip placed in the test chip positioning frame 16 on the pin mold 3 is subjected to electrical performance testing under specified high and low temperature constant temperature conditions within a temperature range of -60℃ to +150℃. Therefore, by constructing a small high and low temperature environment on the test fixture, high and low temperature testing of the chip can be achieved without an environmental chamber. Without an environmental chamber, the pins of the test chip do not require test cables and can be directly connected to the functional test circuit board via double-ended spring probes, or connected to a measuring instrument using an extremely short test cable. In this way, the electrical circuit of chip testing is minimized, so as to optimize the test circuit and achieve good data acquisition and functional testing of high-speed signal chips and radio frequency signal chips under high and low temperature conditions.

[0025] Please see Figure 1 The upper cover 2 of the fixture has a connecting hole in the middle, and the connecting hole has an internal thread. The lower half of the spinning handle 6 has an external thread on the outside of the connecting shaft, and the spinning handle 6 is threadedly connected to the upper cover 2 of the fixture.

[0026] The upper surface of the fixture cover 2 is evenly provided with elastic bolt mounting holes 8. Elastic bolts 7 are installed in the elastic bolt mounting holes 8. The bottom end of the elastic bolts 7 is fastened to the upper end of the lifting flange 9, which is located inside the fixture cover 2.

[0027] The lifting flange 9 is lifted upward by a spring on the elastic bolt 7, and the spinning handle 6 is engaged in the external thread on the upper side of the clamp cover 2. Rotating the spinning handle 6 to lower it can stop the lifting flange 9 from moving downward.

[0028] Please see Figure 1 and Figure 5 An air-cooled heat exchanger 10 is installed on the lower side of the lifting flange 9. An electric heating plate 12 is installed on the lower side of the air-cooled heat exchanger 10. The electric heating plate 12 is located above the test chip. A thermocoupler 13 is installed inside the electric heating plate 12. A thermocoupler socket 14 is provided on one side of the thermocoupler 13. An electric heating socket 15 is provided on one side of the electric heating plate 12. A thermocoupler plug 1401 that mates with the thermocoupler socket 14 and an electric heating plug 1501 that mates with the electric heating socket 15 are provided on the lifting flange 9.

[0029] The heat exchanger insulation shell 11 is installed on the lower side of the lifting flange 9. The air-cooled heat exchanger 10 and the electric heating pressure plate 12 are all located inside the heat exchanger insulation shell 11.

[0030] Among them, the thermocouple socket 14 and the electric heating socket 15 are connected to the thermocouple plug 1401 and the electric heating plug 1501 on the lifting flange 9 to ensure the stability of their connection status. The heat exchanger insulation shell 11 is installed on the lower side of the lifting flange 9, surrounding the air-cooled heat exchanger 10 and the electric heating pressure plate 12 for insulation.

[0031] Please see Figure 3 and Figure 4 The fixture base 1 is located above the chip functional test circuit board 4. The fixture pin mold 3 is fixedly set on the upper end of the chip functional test circuit board 4. The fixture pin mold 3 has a built-in test chip positioning frame 16, which is used to position and place the test chip. The fixture pin mold 3 has a probe mounting hole 17 in the middle, which is located in the middle of the test chip positioning frame 16. A double-headed spring probe 18 is set in the probe mounting hole 17. The double-headed spring probe 18 includes an upper elastic probe 20 and a lower elastic probe 21. The chip functional test circuit board 4 is provided with circuit contacts 19 that contact the lower elastic probe 21. There are several circuit contacts 19. The upper elastic probe 20 is located below the test chip.

[0032] The fixture base 1 secures the fixture needle mold 3 onto the chip functional test circuit board 4. The double-headed spring probe 18 is positioned and installed in the probe mounting hole 17 of the fixture needle mold 3, and the lower elastic probe 21 of the double-headed spring probe 18 is pressed into contact with the circuit contact 19 of the test board to achieve circuit conduction. When the test chip is placed in the test chip positioning frame 16 on the needle mold and pressed onto the double-headed spring probe 18 by the electrically heated pressure plate 12, the elastic probe 20 on the upper side of the spring needle is pressed to contact the pin of the test chip, thus realizing the conduction of the circuit.

[0033] Please see Figure 1 and Figure 2 A control pipeline flange 27 is installed on the rear side of the fixture base 1, and an insulation layer flange 28 is installed on the rear side of the control pipeline flange 27.

[0034] The clamp cover 2 is provided with drying hoods A22 and B23 on opposite sides. Drying air nozzles A24 are provided on the lower side of drying hood A22 and B25 are provided on the lower side of drying hood B23. Drying air pipe 31 is provided on one side of drying hood A22. The other end of drying air pipe 31 is connected to the control pipeline flange 27 and the insulation layer flange 28. An LED indicator light is provided on one side of drying hood A22. The electrical signals of the LED indicator light, the electric heating plate 12, and the thermocouple electrical components are connected to the control cable 30 through wires. A cold air pipe insulation layer 29 is provided on one side of the insulation layer flange 28. The cold air insulation layer is connected to the insulation layer flange 28 by a drying auxiliary air pipe and a cold air pipe A33. A cold air pipe B34 and a cold air pipe C35 are provided inside the fixture base 1. A cold air inlet pipe A36 is provided inside the heat exchanger protective shell. A cold air inlet pipe B37 is provided on one side of the air-cooled heat exchanger 10. A cold air nozzle A38 and a cold air nozzle B39 are provided on the lower side of the air-cooled heat exchanger 10.

[0035] The clamp cover 2 is provided with hooks 26 on both sides, and the clamp base 1 and the clamp cover tray 5 are provided with corresponding hook positions 32 on both sides.

[0036] Dry air enters the drying hoods A22 and B23 through the drying air duct 31 and is ejected from the drying air nozzles A24 and B25 to form a drying air curtain surrounding the fixture, isolating it from the humid air of the normal temperature environment; under low temperature conditions, it prevents condensation and frost formation on the fixture, the test chip, and surrounding electronic components; This enables a stable electrical test circuit connection between the pins of the test chip and the chip functional test circuit board 4 via the double-ended spring probe 18, so as to complete the data acquisition and functional testing of the chip's electrical signals under high and low temperature environments; The pass / fail information of the test chip is displayed by controlling the green and red LED lights on the fixture via control cable 30, reminding the operator to sort the test chips correctly. Remove the tested chip from the fixture; When the spinning handle 6 is rotated, the external thread rotates and lifts up, and the elastic bolt 7 lifts the lifting flange 9 upward.

[0037] As the electric heating plate 12 moves upward with the lifting flange, it releases the test chip pressed against the spring needle. At the same time, the electric heating plate 12 also unloads the upward spring force of the double-headed spring probe 18. At this time, the operator can open the upper cover hook 26 to remove the clamp upper cover 2 from the clamp base 1 and place it on the clamp upper cover tray 5.

[0038] In this way, the operator can remove the test chip from the test chip positioning frame 16 on the clamping pin mold 3 without the clamping cover 2. The chips are correctly sorted according to the green and red LED indicator lights.

[0039] Conversely, use an air-cooled high and low temperature fixture to test the chip: Place the test chip in the test chip positioning frame 16, move the fixture cover 2 on the fixture cover tray 5 to the fixture base 1, and make it fit with the cover positioning pin. The hook 26 hooks onto the hook position 32.

[0040] Press down the spinning handle 6 to rotate the external thread, causing it to descend and drive the pressing lifting flange 9 downward.

[0041] The electric heating plate 12 descends with the lifting flange 9, contacts and presses the test chip on the double-headed spring probe 18, and at the same time the pins of the test chip are well and accurately connected to the upper elastic probe 20. The accurate connection is due to the positioning and guidance between various parts, similar to the use of positioning pins, which is a conventional technical means to conduct electrical signals.

[0042] The chip pins are connected to the chip function test circuit board 4 via double-ended spring probes 18. Stable electrical signal connections were achieved, and a good electrical performance test circuit was constructed.

[0043] When conducting high-temperature tests as required, the electric heating plate 12 heats the test chip, and the thermocouple 13 provides feedback on the heating temperature of the test chip casing to achieve constant temperature control. Under specified high-temperature and constant-temperature conditions, the chip function test circuit board 4 collects and tests the electrical performance data of the test chip.

[0044] During low-temperature testing, cold air is controlled to enter the air-cooled heat exchanger 10 through cold air pipes A33, B34, A36, and B37, and is ejected from cold air nozzles A38 and B39. During this process, the air-cooled heat exchanger 10 cools the unheated electric heating plate 12 and the test chip. Thermocouple 13 provides feedback on the cooling of the test chip shell, achieving constant temperature control. At the same time, dry air enters the drying hoods A22 and B23 through the drying air pipes 31 and is ejected from the drying air nozzles A24 and B25 to form a drying air curtain around the fixture, isolating the humid air from the normal temperature environment and preventing condensation and frost on the fixture, test chip, and surrounding electronic components.

[0045] Under specified low-temperature constant temperature conditions, the chip function test circuit board 4 collects and tests the electrical performance data of the test chip.

[0046] The pass / fail status of the test chip is indicated by the green and red LED lights on the fixture via a control cable, reminding the operator to correctly sort the test chips.

[0047] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rotary test fixture for liquid-cooled high and low temperature chips, characterized in that: The test mechanism includes a spinning assembly, a housing assembly, a heating assembly, a cooling assembly, and a fixture assembly. The clamping assembly is located below the spinning assembly, the heating assembly and the cooling assembly are located between the clamping assembly and the spinning assembly, and the outer shell assembly is sleeved on the outside of the clamping assembly; The fixture assembly includes a chip function test circuit board (4) for testing support, a double-headed spring probe (18), a chip positioning frame (16), a fixture pin mold (3), a fixture top cover (2), a fixture base (1), and a fixture top cover tray (5). The spinning assembly includes a spinning handle (6), an elastic bolt (7), and a lifting flange (9); The heating component includes a thermocoupler (13), and the cooling component includes a cold air inlet pipe A (36), a cold air pipe B (34), and a cold air pipe C (35). An air-cooled heat exchanger (10) is provided between the heating component and the cooling component.

2. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 1, characterized in that: The clamp cover (2) has a connecting hole in the middle and an internal thread in the connecting hole. The lower half of the spinning handle (6) has an external thread on the outside of the connecting shaft. The spinning handle (6) is threadedly connected to the clamp cover (2).

3. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 2, characterized in that: The upper surface of the clamp cover (2) is uniformly provided with elastic bolt mounting holes (8), and elastic bolts (7) are provided in the elastic bolt mounting holes (8). The bottom end of the elastic bolts (7) is fastened to the upper end of the lifting flange (9), and the lifting flange (9) is located inside the clamp cover (2).

4. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 1, characterized in that: The air-cooled heat exchanger (10) is installed on the lower side of the lifting flange (9). An electric heating plate (12) is installed on the lower side of the air-cooled heat exchanger (10). The electric heating plate (12) is located above the test chip. The thermocouple (13) is installed inside the electric heating plate (12). A thermocouple socket (14) is provided on one side of the thermocouple (13). An electric heating socket (15) is provided on one side of the electric heating plate (12). A thermocouple plug (1401) that mates with the thermocouple socket (14) and an electric heating plug (1501) that mates with the electric heating socket (15) are provided on the lifting flange (9).

5. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 4, characterized in that: The lower side of the lifting flange (9) is equipped with a heat exchanger insulation shell (11), and the air-cooled heat exchanger (10) and the electric heating plate (12) are both located inside the heat exchanger insulation shell (11).

6. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 1, characterized in that: The fixture base (1) is located above the chip function test circuit board (4). The fixture needle mold (3) is fixedly set on the upper end of the chip function test circuit board (4). The fixture needle mold (3) has a chip positioning frame (16) inside. The chip positioning frame (16) is used to position and place the test chip. The fixture needle mold (3) has a probe mounting hole (17) in the middle. The probe mounting hole (17) is located in the middle of the chip positioning frame (16). A double-headed spring probe (18) is set in the probe mounting hole (17). The double-headed spring probe (18) includes an upper elastic probe (20) and a lower elastic probe (21). The chip function test circuit board (4) has a circuit contact (19) that contacts the lower elastic probe (21). There are several circuit contacts (19). The upper elastic probe (20) is located below the test chip.

7. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 4, characterized in that: A control pipeline flange (27) is installed on the rear side of the clamp base (1), and an insulation layer flange (28) is installed on the rear side of the control pipeline flange (27).

8. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 7, characterized in that: The clamp cover (2) is provided with drying hoods A (22) and B (23) on opposite sides. A drying air nozzle A (24) is provided on the lower side of the drying hood A (22), and a drying air nozzle B (25) is provided on the lower side of the drying hood B (23). A drying air pipe (31) is provided on one side of the drying hood A (22). The other end of the drying air pipe (31) is connected to the control pipeline flange (27) and the insulation layer flange (28). An LED indicator light is provided on one side of the drying hood A (22). The electrical signals of the LED indicator light, the electric heating plate (12), and the thermocouple electrical components are connected to a control cable (30) through wires.

9. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 7, characterized in that: A cold air pipe insulation layer (29) is provided on one side of the insulation layer flange (28). The cold air insulation layer is connected to the insulation layer flange (28) by a drying auxiliary air pipe and a cold air pipe A (33). A cold air pipe B (34) and a cold air pipe C (35) are provided in the fixture base (1). A cold air inlet pipe A (36) is provided in the heat exchanger protective shell. A cold air inlet pipe B (37) is provided on one side of the air-cooled heat exchanger (10). A cold air nozzle A (38) and a cold air nozzle B (39) are provided on the lower side of the air-cooled heat exchanger (10).

10. The rotary test fixture for liquid-cooled high and low temperature chips according to claim 1, characterized in that: The clamp cover (2) is provided with hooks (26) on both sides, and the clamp base (1) and the clamp cover tray (5) are provided with corresponding hook positions (32) on both sides.

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