Electrical plug connector contact and terminal element having electrical plug connector contact

Abstract

An electrical plug connector contact (101, 201) has a terminal section (102, 202) for contacting with another complementary electrical plug connector contact (201, 101). A first galvanic nickel layer (107, 207) is positioned on top of the terminal section (102, 202). A second galvanic nickel layer (108, 208) is positioned on top of the first galvanic nickel layer (107, 207).

Description

Technical Field

[0001] This invention relates to an electrical plug connector contact and a terminal element having an electrical plug connector contact. Background Technology

[0002] The prior art discloses electrical plug connector contacts. Summary of the Invention

[0003] The object of this invention is to provide an improved electrical plug connector contact and a terminal element having the electrical plug connector contact. This object is achieved by having an electrical plug connector contact and a terminal element. Advantageous improvements are given in preferred embodiments.

[0004] The electrical plug connector contacts have terminal sections for contacting complementary additional electrical plug connector contacts. A first galvanic nickel layer is positioned on top of the terminal section. A second galvanic nickel layer is positioned on top of the first galvanic nickel layer.

[0005] In one embodiment, the electrical plug connector contact has a solder section fixedly bonded to a terminal section. The terminal section and the solder section are arranged opposite each other with respect to the assembly direction of the electrical plug connector contact. The solder bond may be positioned on top of the solder section. A first electrolytic nickel layer is positioned on top of both the terminal section and the solder section. A second electrolytic nickel layer is positioned only in the region of the terminal section above the first electrolytic nickel layer. The solder section remains clear and is not covered by the second electrolytic nickel layer. For optimized layer hardness tribology, the second nickel layer is electrolyzed only in the region of the terminal section.

[0006] Electrical plug connector contacts can be in the form of male or female connectors. Electrical plug connector contacts can be designed to be installed in or part of a panel plug or socket. Electrical plug connector contacts can be, for example, part of or provided for a so-called backplane bus. This means that electrical plug connector contacts can be used, for example, in control cabinets.

[0007] The terminal section is designed to connect the contacts of an electrical plug connector to complementary contacts of another electrical plug connector. Electrical contact is thus established within the terminal section with the other electrical plug connector.

[0008] The solder section is designed to connect the electrical plug connector contacts to a printed circuit board (PCB). The solder section has a solder area opposite the terminal section in the assembly direction. The solder section can also be referred to as a solder leg. The solder section is therefore positioned away from the terminal section within the solder area for connecting the electrical plug connector contacts to the PCB. Solder bonding between the solder section and the PCB can be performed, for example, using surface mount technology (SMT) or, for example, using so-called through-hole reflow (THR) technology. The PCB can also be referred to as the PCB for plug assembly.

[0009] The contacts of the electrical plug connector include a base material, such as a copper alloy. However, the base material may alternatively include zinc, tin, silicon, nickel, iron, and / or steel alloys. A first current-energized nickel layer is positioned on top of the base material. The first current-energized nickel layer preferably completely covers the terminal section. A second current-energized nickel layer is positioned on top of the first current-energized nickel layer and preferably completely covers the first current-energized nickel layer, meaning, for example, that the second current-energized nickel layer completely covers the first current-energized nickel layer in the terminal section including its current-energized layer outlet.

[0010] In one embodiment, a third electrolytic nickel layer is positioned on top of a second electrolytic nickel layer. The third electrolytic nickel layer is in the form of an adhesion promoter layer. In one embodiment, the third electrolytic nickel layer is disposed on top of a first electrolytic nickel layer in a region of the solder section.

[0011] The third electrolytic nickel layer can be referred to as the electrolytic nickel contact layer. The third electrolytic nickel layer is designed to remove nickel oxide from the solder sections of the first electrolytic nickel layer and the terminal sections of the second electrolytic nickel layer. Therefore, the third nickel layer advantageously achieves an additional layer structure with improved adhesion.

[0012] In one embodiment, a fourth electrolytic nickel layer is positioned above the second electrolytic nickel layer. The fourth electrolytic nickel layer comprises phosphorus. In one embodiment, the fourth electrolytic nickel layer has a phosphorus content of 11-16% by weight. If a third electrolytic nickel layer is provided, the fourth electrolytic nickel layer is positioned on top of the third electrolytic nickel layer. If a third electrolytic nickel layer is not provided, the fourth electrolytic nickel layer is positioned on top of the second electrolytic nickel layer.

[0013] In one embodiment, the first electrolytic nickel layer is in the form of a matte nickel layer. The second electrolytic nickel layer is in the form of a medium-gloss or high-gloss nickel layer.

[0014] In one embodiment, the second electrostatic nickel layer includes a fine-grained additive. In one embodiment, the first electrostatic nickel layer does not include a fine-grained additive. In one embodiment, the fine-grained additive includes, for example, ionic and / or anionic and / or nonionic surfactants and / or derivatives of ionic and / or anionic and / or nonionic surfactants and / or mixtures of said surfactants. The surfactant may also be referred to as a wetting agent component. The surfactant can be in cationic or anionic form. Nonionic surfactants are uncharged. In one embodiment, the first electrostatic nickel layer does not include any fine-grained additive.

[0015] For simplicity, the electrolytic nickel layer will also be referred to as the nickel layer below. The nickel layer can be electrolytically deposited on the contacts of an electrical plug connector. The nickel layer can be deposited by electrolytic deposition or by chemical reduction at the contacts of the electrical plug connector without an external current. For example, a nickel layer can be electrolytically deposited using a nickel sulfamate bath. The nickel layer produced in this way is of high purity (e.g., at least 99% by weight), has high hardness, and provides corrosion protection for the contacts of the electrical plug connector. The electrolytic nickel layer is in the form of matte, medium-gloss, or high-gloss nickel layers, each of which can be deposited using a nickel sulfamate bath. Nickel sulfamate can also be referred to as nickel(II) amide sulfate. Alternatively, instead of the nickel sulfamate bath type, an electrolytic watt nickel bath or an electrolytic nickel contact bath can be used for electrolytic deposition of the corresponding nickel layer. However, the nickel layer can also optionally be electrolytically deposited by adding a fine-grained additive.

[0016] Each of these nickel layers functions as a barrier layer against the substrate material and also provides leveling and stress relief. On the substrate material of the electrical plug connector contacts, the first electrolytic nickel layer is preferably electrolytically deposited as a matte nickel layer, which is free of fine-grained additives and therefore malleable. The second electrolytic nickel layer preferably includes fine-grained additives, thus taking the form of a medium-gloss to glossy nickel layer, and is electrolytically deposited onto the first matte nickel layer.

[0017] The third electrostatic nickel layer is a nickel contact layer used to promote adhesion, which is preferably fully electrostatically applied to the terminal region and the solder bonding region. The subsequent fourth electrostatic nickel layer is a nickel-phosphorus layer, which is also preferably fully metallized in the terminal region and the solder bonding region.

[0018] In this preferred embodiment, the first nickel layer is in the form of a matte nickel layer, while the second nickel layer is in the form of a medium-gloss or high-gloss nickel layer. However, it is also possible that the first nickel layer is in the form of a medium-gloss or high-gloss nickel layer, and the second nickel layer is in the form of a matte nickel layer. The first and second nickel layers may also both be in the form of a matte nickel layer, or a medium-gloss or high-gloss nickel layer. If the nickel layer is in the form of a medium-gloss or high-gloss nickel layer, it may include a fine-grained additive. Furthermore, the third and fourth nickel layers may each include a fine-grained additive or be deposited using a fine-grained additive, but this is not mandatory.

[0019] A first nickel layer and a second nickel layer can be deposited on, for example, blank punched strips or blank punched strip segments or individualized bulk material punched contacts. These current-current contacts or current-current contact strips are then assembled to the electrical plug connector. The substrate used for electroplating includes, for example, blank punched strips, blank punched strip segments, or individualized bulk material punched contacts. The current-current contacts or current-current contact strips, thus current-current in this manner, are assembled to the electrical plug connector in subsequent manufacturing steps.

[0020] The first and second nickel layers are polycrystalline and have microcrystals or grains separated by grain boundaries. In a preferred embodiment, the first and second nickel layers have different microstructures because, in this case, the second nickel layer includes fine-grained additives. The second nickel layer has a fine-grained structure compared to the first nickel layer, which has a coarse-grained structure. Therefore, it is only important that the second nickel layer has a fine-grained structure relative to the first nickel layer, or that the first nickel layer has a coarse-grained structure relative to the second nickel layer. For example, the absolute grain size is irrelevant and not explicitly considered.

[0021] In one embodiment, the grain size of the crystallites in the second electrostatic nickel layer is smaller than that in the first electrostatic nickel layer. The fact that the grain size of the crystallites in the second electrostatic nickel layer is smaller than that in the first electrostatic nickel layer means that at least some of the crystallites in the second electrostatic nickel layer have a smaller average grain size than those in the first electrostatic nickel layer, at least in one extension direction. It is possible that the grain sizes of the first and second nickel layers are similar or identical. The grain sizes of the first and second nickel layers can be determined, for example, according to standards ASTM E112 and DIN EN ISO 643.

[0022] In addition to grain size, the grain boundary density of the nickel layers can also be considered to distinguish the microstructures from each other. In one embodiment, the grain boundary density of the second nickel layer is greater than that of the first nickel layer. Compared to the second nickel layer, the first nickel layer exhibits isotropic layer growth with very few grain boundaries. The second nickel layer has a higher number of grain boundaries and a finer grain microstructure.

[0023] Compared to the first nickel layer, the second nickel layer has less ductility but higher hardness or layer hardness / hardness properties. The higher hardness of the second nickel layer compared to the first nickel layer can be caused, for example, by a higher grain boundary density, since cracks typically propagate along grain boundaries, and a higher density of grain boundaries reduces the probability of propagation.

[0024] Fine-grained additives act as inhibitors of anisotropic layer growth and are incorporated into the microstructure during electrostatic metallization, thus affecting the growth and growth rate along specific crystallization orientations of grains and grain boundaries. Fine-grained additives can reduce grain size and / or induce the formation of rounded grains. According to the voltage sequence, electrostatic nickel layers containing fine-grained additives are more basic and have a medium to high gloss compared to more expensive matte nickel layers without fine-grained additives.

[0025] The first nickel layer is visually characterized by having a matte appearance in its uncovered state, compared to the second nickel layer. Due to the described current-current multilayer nickel structure, the current-current contacts or electrical plug connector contacts assembled to the plug connector exhibit optimized tribological and abrasion characteristics, as well as optimized lifespan for the plug product. Therefore, due to the optimized nickel layer hardness of the second nickel layer, electrical plug connector contacts can be used in applications where the electrical plug connector contacts in the terminal area are subjected to relatively high mechanical stresses (e.g., vibration). Advantageously, the fourth nickel layer, particularly with its high phosphorus concentration of 11-16 wt%, further improves abrasion performance in the terminal section because the fourth nickel layer has exceptionally high hardness.

[0026] The fact that the second nickel layer includes fine-grained additives means that the deposited second nickel layer includes components of fine-grained additives that are incorporated into the second nickel layer during electrostatic deposition and thus affect the growth of microcrystals and grain boundaries.

[0027] In one embodiment, the fine-grained additive comprises a primary and / or secondary gloss-forming agent and / or derivatives of the primary and / or secondary gloss-forming agent, which also achieves a leveling effect for subsequent hydroelectric nickel metallization of the hydroelectric anisotropy and homogeneous layer structure.

[0028] Gloss-forming agents include a gloss carrier and / or at least one gloss additive. The gloss carrier, also known as the primary gloss agent, causes a significant reduction in the size of the deposited crystallites. The gloss additive, also known as the secondary gloss agent, contributes to a layer that already possesses high gloss but is typically brittle. Combined with the gloss carrier, a stable high gloss can be produced.

[0029] In one embodiment, the gloss forming agent comprises one of the following materials: sulfoxide imide, sulfonamide, benzenesulfonic acid, naphthalenesulfonic acid, alkylsulfonic acid, sulfinic acid and aryl sulfonate and / or aldehyde, thiocyanate, thiourea, acylthiourea, thioalkylalkyl sulfonic acid, disulfide, thiocarboxamide, thiocarbamate, thiocyanate and / or hydantoin.

[0030] By subjecting the fourth nickel layer to additional heat treatment within a temperature range, for example, from T=300℃ to a maximum of T=400℃, the fourth nickel layer can undergo a microcrystalline microstructure transformation. This heat treatment can transform the microstructure into a crystalline, semi-crystalline, and / or nanocrystalline structure. This results in layer hardening through the precipitation of nickel phosphide (e.g., nickel triphosphide (Ni3P)). Therefore, for the fourth nickel layer, a maximum microhardness of 1500 HV can be achieved in the region.

[0031] The fourth nickel layer can also be manufactured in such a manner that a dispersant additive for forming the layer hardness is added to the electrostatic nickel-phosphorus bath during the electrostatic deposition process. For example, silicon carbide, silicon oxide, boron nitride, and / or aluminum ceramics can be used as dispersants.

[0032] Therefore, the fourth nickel layer includes a dispersing additive that is incorporated into the fourth nickel layer during the deposition process. Compared to a pure electrolytic nickel (-phosphorus) coating without a dispersing additive, the fourth nickel layer produced in this way exhibits higher microhardness and improved tribological and wear properties.

[0033] In one embodiment, as an alternative to the second electrolytic nickel layer, a fourth electrolytic nickel layer is positioned above the second electrolytic nickel layer. The fourth electrolytic layer comprises a palladium-nickel alloy, particularly a palladium-nickel alloy having 80 wt% palladium and 20 wt% nickel. Therefore, the fourth electrolytic layer can be used as a substitute for the second electrolytic nickel layer in the layer structure. If a third electrolytic nickel layer is provided, the fourth electrolytic nickel layer is positioned on top of the third electrolytic nickel layer. If no third electrolytic nickel layer is provided, the fourth electrolytic nickel layer is positioned on top of the second electrolytic nickel layer.

[0034] In one embodiment, a fourth liquid nickel layer or a fourth liquid layer is positioned on top of a third liquid nickel layer or on top of a second liquid nickel layer in the region of a terminal segment. In another embodiment, a fourth liquid nickel layer or a fourth liquid layer is positioned on top of a third liquid nickel layer or on top of a first liquid nickel layer in the region of a solder segment.

[0035] The second electrolytic nickel layer is not positioned in the solder section area because this could lead to delamination of the fourth electrolytic nickel layer. To prevent this, the fourth electrolytic nickel layer is positioned in the solder section above the first electrolytic nickel layer, providing improved adhesion compared to an arrangement above the second electrolytic nickel layer. This advantageously prevents delamination of the fourth electrolytic nickel layer in the solder section. Advantageously, the fourth electrolytic nickel layer may have improved adhesion to the first, second, or third nickel layers compared to the first, second, or third nickel layers.

[0036] In one embodiment, a first electrolytic nickel layer completely covers the terminal segment and the solder segment, and a second electrolytic nickel layer completely covers the first electrolytic nickel layer in the region of the terminal segment, and / or a third electrolytic nickel layer completely covers the first electrolytic nickel layer in the region of the solder segment and the second electrolytic nickel layer in the region of the terminal segment, and / or a fourth electrolytic nickel layer completely covers the third electrolytic nickel layer in both the terminal segment and the solder segment. Alternatively, it is possible to selectively or partially selectively cover the aforementioned layers in each case.

[0037] In one embodiment, the first electrolytic nickel layer has a layer thickness of 0.5 μm to 3 μm and / or the second electrolytic nickel layer has a layer thickness of 0.5 μm to 3 μm and / or the third electrolytic nickel layer has a layer thickness of 100 nm to 1000 nm and / or the fourth electrolytic nickel layer or fourth electrolytic layer has a layer thickness of 0.2 μm to 2 μm. For example, the fourth electrolytic nickel layer may have a nominal layer thickness of 1 μm. The corresponding ranges of the layer thickness values ​​of the first, second, third, and fourth electrolytic nickel layers or fourth electrolytic layers are merely illustrative and should be considered non-limiting. Conversely, variations from specific values ​​may also occur without altering the concept beneath the electrical plug connector contacts.

[0038] In one embodiment, a gold layer is positioned on top of a fourth electroplated nickel layer or on top of a fourth electroplated layer. Advantageously, the fourth electroplated nickel layer or fourth electroplated layer is positioned between more expensive layers because the first electroplated nickel layer, the second electroplated nickel layer, and the gold layer are each more expensive than the third nickel layer. For example, the gold layer can be electroplated. The gold layer can also be referred to as a gold scintillator layer.

[0039] The gold layer may completely cover the fourth electrolytic nickel layer in the terminal section, although this is not absolutely necessary. For example, the gold layer may have a thickness of 0.05 μm to 0.1 μm, but is not limited to the specified value range. Since the fourth electrolytic nickel layer or the fourth electrolytic nickel layer and the third electrolytic nickel layer are only optional, the gold layer may also alternatively be positioned on top of the second electrolytic nickel layer and, for example, completely cover the second electrolytic nickel layer.

[0040] In one embodiment, the terminal section of the electrical plug connector contact is in the form of a plug, and the gold layer is entirely located in the area of ​​the second electroplated nickel layer. In another embodiment, the terminal section of the electrical plug connector contact is in the form of a plug-type connection, and the gold layer is entirely located in the area of ​​the second electroplated nickel layer. However, it is not absolutely necessary for the gold layer to be entirely located in the area of ​​the second nickel layer, i.e., entirely in the area of ​​the terminal section. For example, the terminal section of the electrical plug connector contact may be in the form of a spring connector, and the gold layer may be located only in the area of ​​the tulip-shaped portion of the spring connector.

[0041] Advantageously, the contacts of the electrical plug connector are particularly corrosion resistant. The first and second electroplated nickel layers can each be more expensive than the base material of the electrical plug connector contact, and the terminal sections and solder sections are formed or shaped from this contact. Even so, the base material is protected from corrosion. Furthermore, the first electroplated nickel layer is protected by the second electroplated nickel layer.

[0042] In the preferred embodiment, the second electrolytic nickel layer is in the form of a medium- or high-gloss nickel layer, and is therefore less expensive than the first electrolytic nickel layer, which is in the form of a matte nickel layer. However, the second electrolytic nickel layer is more expensive than the fourth electrolytic nickel layer or fourth electrolytic layer, which is beneficial to the corrosion resistance of the first and second electrolytic nickel layers, especially when the fourth electrolytic nickel layer or fourth electrolytic layer is located in the terminal section between the second electrolytic nickel layer and the gold layer and in the solder section between the first electrolytic nickel layer and the gold layer; it is the most expensive of all the aforementioned layers. The third electrolytic nickel layer (nickel contact layer) is provided only as an adhesion promoter layer for the fourth electrolytic nickel layer or fourth electrolytic layer. The third electrolytic nickel layer and the fourth electrolytic nickel layer or fourth electrolytic layer are merely optional and can even be omitted.

[0043] The second electrolytic nickel layer provides cathodic corrosion protection in the layered microstructure of the preferred embodiment. If the second electrolytic nickel layer is not present in the electrical plug connector contacts, the first electrolytic nickel layer will act as a sacrificial anode, particularly in the presence of a fourth electrolytic nickel layer or a fourth electrolytic layer and a gold layer. Corrosion of the first electrolytic nickel layer can occur, for example, especially when the fourth electrolytic nickel layer or the fourth electrolytic layer has cracks and fractures. In general, the likelihood of corrosion of the first electrolytic nickel layer will increase, and therefore the first electrolytic nickel layer may detach from the electrical plug connector contacts.

[0044] However, in the preferred embodiment, the presence of a second electrolytic nickel layer, which is less expensive than the first electrolytic nickel layer, and a fourth electrolytic nickel layer or fourth electrolytic layer, which is less expensive than the first and second electrolytic nickel layers, protects the first electrolytic nickel layer. Even if the fourth electrolytic nickel layer or fourth electrolytic layer has cracks, the first electrolytic nickel layer is protected from corrosion in the presence of the second nickel layer.

[0045] In one embodiment, a sealing layer is positioned on top of the gold layer. The sealing layer comprises an inorganic or organic material. For example, the sealing layer may comprise a thiol. The sealing layer is designed to fill cracks in the gold coating and, additionally advantageously, protect the electrical connector contacts in the terminal section. The sealing layer preferably completely covers the gold layer.

[0046] In one embodiment, the tin layer is positioned on top of the fourth current-electrode nickel layer in a region opposite to the terminal segment, based on the assembly orientation. The tin layer is therefore not fully positioned within the region of the solder segment, but only in the region opposite to the terminal segment. The tin layer defines the solder region for connection to the solder segment on the printed circuit board. The fourth current-electrode nickel layer or fourth current-electrode layer advantageously forms a diffusion barrier layer against the tin layer. For example, the tin layer can have a thickness of 2 μm to 6 μm, but is not limited to the specified range. The tin layer may also be referred to as solder metal.

[0047] In one embodiment, the lubricant layer is positioned on top of the gold layer or the sealing layer. The lubricant layer preferably completely covers the gold layer or the sealing layer. The lubricant layer may, for example, comprise perfluoropolyether (PFPE). However, the lubricant layer may also comprise different materials. The lubricant layer may also be referred to as current contact lubricant. The lubricant layer can be applied particularly uniformly to the gold layer or the sealing layer. Advantageously, the lubricant layer further reduces wear on the electrical connector contacts when they connect to complementary contacts. If no gold layer is provided, the lubricant layer is positioned on top of the fourth current-energized nickel layer or the fourth current-energized layer, and preferably completely covers it. Furthermore, if no fourth current-energized nickel layer or the fourth current-energized layer is provided either, the lubricant layer is positioned on top of the second current-energized nickel layer, and preferably completely covers it.

[0048] The lubricant layer can also be positioned within the solder section, preferably entirely on top of the electrical plug connector contacts. In this case, the lubricant layer may optionally cover a tin layer, a fourth current-energized nickel layer, or a fourth current-energized layer or a first current-energized layer. When no fourth current-energized nickel layer or fourth nickel layer is provided (this is only optional), the lubricant layer covers the first current-energized nickel layer. Therefore, when no fourth current-energized nickel layer or fourth current-energized layer is provided, the tin layer may be positioned on top of the first current-energized nickel layer.

[0049] According to one embodiment, the terminal element includes a housing, a printed circuit board positioned on top of the housing, and at least one electrical plug connector contact positioned within the housing and connected to the printed circuit board. The terminal element is configured for connection to a complementary additional terminal element having at least one additional plug connector contact complementary to the electrical plug connector contact. Attached Figure Description

[0050] The electrical plug connector contacts are explained in detail below with reference to the accompanying diagrams. The diagrams show:

[0051] Figure 1a : The electrical plug connector contacts in the first embodiment having a layer sequence;

[0052] Figure 1b :along Figure 1a The cross-sectional view of the cutting plane AA passing through the layer sequence is shown;

[0053] Figure 1c :along Figure 1a The cross-sectional view of the cutting plane BB passing through the layer sequence shown;

[0054] Figure 2a : The electrical plug connector contacts in the second embodiment having a layer sequence;

[0055] Figure 2b :along Figure 2a The cross-sectional view of the cutting plane AA passing through the layer sequence is shown;

[0056] Figure 2c :along Figure 2a The cross-sectional view of the cutting plane BB passing through the layer sequence shown;

[0057] Figure 3 : Perspective view of a terminal element with electrical plug connector contacts;

[0058] Figure 4 Results of stress tests on the contacts of electrical plug connectors;

[0059] Figure 5a Based on the results of further stress tests on the contacts of existing electrical plug connectors;

[0060] Figure 5b : In accordance with Figures 1a to 1c Or 2a to 2c and Figure 5b According to the layer order Figures 1a to 1c Or the results of further stress tests on the contacts of the electrical plug connectors 2a to 2c;

[0061] Figure 6a Scanning electron micrograph of the layer sequence of electrical plug connector contacts without fine grain additives in a cross-sectional view;

[0062] Figure 6b Scanning electron micrograph of a layer sequence of electrical plug connector contacts with fine-grained additives in a cross-sectional view;

[0063] Figure 6c : Figure 6a Magnified images of the layer sequence without fine-particle additives and Figure 6bEnlarged views of the layer sequence with fine-particle additives, and cross-sectional views in each case;

[0064] Figure 7a Current density diagram of unipolar current electrodeposition of phosphorus-containing nickel layers; and

[0065] Figure 7b Current density diagram of bipolar current electrodeposition of phosphorus-nickel layer. Detailed Implementation

[0066] Figure 1a A schematic diagram of three electrical plug connector contacts 101 in the first embodiment is shown. The electrical plug connector contacts 101 are exemplarily shown in a state in which they are part of a blank stamping strip section.

[0067] The electrical plug connector contact 101 has a terminal section 102 and a solder section 103, which may also be referred to as a solder leg 103. The terminal section 102 and the solder section 103 are fixedly connected to each other. In other words, the electrical plug connector contact 101 is monolithic, meaning that the terminal section 102 and the solder section 103 are formed from different parts of a single body. The terminal section 102 and the solder section 103 are arranged such that they are opposite each other in the main extension direction 104 of the electrical plug connector contact 101, which may also be referred to as the assembly direction 104.

[0068] The contact 101 of the electrical plug connector according to Figure 1 is exemplary designed as a plug. In this case, the terminal section 102 takes the form of a contact pin and is designed to engage in a complementary coupling or receptacle contact. Of course, the terminal section 102 can also be in the form of a receptacle and is designed to receive a plug contact that is complementary or accordingly designed.

[0069] The electrical plug connector contact 101 has a base material 106 and a layer sequence 105 positioned on top of the base material 106, the layer sequence being positioned on the top surface of the base material 106. The arrangement of the layer sequence 105 and the extension of each layer of the layer sequence 105 in the main extension direction 104 are targeted at... Figure 1a One of the contacts 101 of the electrical plug connector is schematically shown.

[0070] Figure 1b It shows along Figure 1a The cross-sectional view shown is a cross-sectional view of the cutting plane AA passing through layer sequence 105. Figure 1c It shows along Figure 1a The cross-sectional plane BB shown passes through the cross-sectional view of layer sequence 105. The first cross-sectional plane AA extends in the region of terminal section 102, while the second cross-sectional plane BB extends on the opposite side of terminal section 102 in the region of solder section 103.

[0071] Each layer of the layer sequence 105 preferably completely or at least partially surrounds the electrical connector contact 101 around the main extension direction 104 azimuth angle.

[0072] Layer sequence 105 includes a first electrolytic nickel layer 107, a second electrolytic nickel layer 108, a third electrolytic nickel layer 109, a fourth electrolytic nickel layer 110, a gold layer 111, a sealing layer 112, and a lubricant layer 113 in terminal section 102. Electrolytic nickel layers 7, 8, 9, and 10 are also referred to as nickel layers 7, 8, 9, and 10 in the following description. For simplicity, in Figure 1a The third nickel layer 109, the sealing layer 112, and the lubricant layer 113 are not shown. The third nickel layer 109, the fourth nickel layer 110, and / or the gold layer 111, and / or the sealing layer 112, and / or the lubricant layer 113 may also be omitted.

[0073] The substrate material 106 includes, for example, a copper alloy. However, the substrate material 106 may also include zinc, tin, silicon, nickel, iron, and / or steel alloys. A first nickel layer 107 is positioned on top of the substrate material 106. The first nickel layer 107 is positioned on top of the substrate material 106 in both the terminal section 102 and the solder section 103. The first nickel layer 107 preferably sufficiently covers the substrate material 106.

[0074] A second nickel layer 108 is positioned on top of the first nickel layer 107 in the terminal section 102. The second nickel layer 108 preferably completely covers the first nickel layer 107 in the terminal section 102. The second nickel layer 108 can also be, for example, electrodeposited. The second nickel layer 108 is omitted in the solder section 103.

[0075] The first nickel layer 107 and the second nickel layer 108 are each polycrystalline, meaning they each have multiple microcrystals separated from each other by grain boundaries. In the preferred embodiment according to FIG1, as an example, the first nickel layer 107 is in the form of a matte nickel layer. For example, the second nickel layer 108 is in the form of a medium-gloss or high-gloss nickel layer. Compared to the first nickel layer 107, the second nickel layer 108 can have a fine-grained structure. Conversely, compared to the second nickel layer 108, the first nickel layer 107 can have a coarse-grained structure.

[0076] Therefore, the second nickel layer 108 is harder than the first nickel layer 107. Consequently, the electrical plug connector contact 101 has improved wear characteristics in the terminal section 102 area. Thus, the corrosion resistance of the nickel and layer sequence 105 can be maintained for a long time. Furthermore, corrosion resistance can be maintained even under high loads acting on the electrical plug connector contact 101.

[0077] For example, the second nickel layer 108 may have microcrystals with an average grain size smaller than the average grain size of the microcrystals of the first nickel layer 107.

[0078] The effect of having a smaller grain size in the second nickel layer 108 than in the first nickel layer 107 can be achieved, for example, by using a fine-grained additive in the deposition of the second nickel layer 108. In this case, the second nickel layer 108 includes a fine-grained additive because the fine-grained additive is incorporated into the second nickel layer 108 during the deposition process. These residues of the fine-grained additive alter the crystal growth within the second nickel layer 108 in such a way that it can have a finer grain structure compared to the first nickel layer 107.

[0079] The third nickel layer 109 is positioned on top of the second nickel layer 108 in the region of the terminal section 102, and on top of the first nickel layer 107 in the region of the solder section 3.

[0080] The third nickel layer 109 preferably completely covers the second nickel layer 108 in the region of the terminal section 102. Furthermore, the third nickel layer 109 preferably completely covers the first nickel layer 107 in the region of the solder section 103. The third nickel layer 109 can also be referred to as a nickel contact layer. The third nickel layer 109 is intended to provide improved adhesion to the fourth nickel layer 110. The third nickel layer 109 may also be omitted.

[0081] A fourth nickel layer 110 is positioned over the second nickel layer 108 and on top of the third nickel layer 109 in the terminal section 102 region, and over the first nickel layer 107 and on top of the third nickel layer 109 in the solder section 103 region. If no third nickel layer 109 is provided to facilitate adhesion, the fourth nickel layer 110 is positioned directly on top of the second nickel layer 108 in the terminal section 102 region, and directly on top of the first nickel layer 107 in the solder section 103 region. The fourth nickel layer 1010 preferably completely covers the second nickel layer 108 or optionally the third nickel layer 109 in the terminal section 102 region. Furthermore, the fourth nickel layer 109 preferably sufficiently covers the first nickel layer 107 or optionally the third nickel layer 109 in the solder section 3 region.

[0082] In addition to nickel, the fourth nickel layer 110 also includes phosphorus. For example, the phosphorus content of the fourth nickel layer 110 may be eleven to sixteen percent by weight. As an alternative to the phosphorus-containing fourth nickel layer 110, the layer sequence may include the fourth layer 110, which, although also including nickel, should not be described as a nickel layer because it includes a PdNi alloy having, for example, a mass ratio of 80 wt% Pd and 20 wt% Ni.

[0083] The fourth nickel layer 110 is more brittle and less expensive than the second nickel layer 108. The fact that the second nickel layer 108 is located only in the terminal section 102 and not in the solder section 103 also has the advantage of preventing the fourth nickel layer 110 in the solder section 103 from delaminating under high temperatures and loads. Compared to the phosphorus-containing fourth nickel layer 110, the PdNi alloy fourth layer 110 has improved adhesion to the first nickel layer 107 and the optional third nickel layer 910 in the region of the solder section 103.

[0084] In the region of terminal section 102, a gold layer 111 is positioned on top of the fourth nickel layer 110 or the fourth layer 110. The terminal section 102 of the electrical plug connector contact 101 is designed as a plug in the embodiment of FIG. 1. The gold layer 111 is preferably positioned entirely within the region of the second nickel layer 109 or entirely within the region of terminal section 102, and radially covers it outwardly based on the main extension direction 104. The gold layer 111 further protects the electrical plug connector contact 101 and the nickel layers 107, 108, 109, and 1010 from environmental influences. Furthermore, the third nickel layer 109 in terminal section 102 is positioned between two less expensive layers, namely between the second nickel layer 108 and the gold layer 111, which has a positive impact on the corrosion balance of the electrical plug connector contact 101.

[0085] A lubricant layer 113, which may include, for example, PFPE, is positioned on top of the gold layer 111. A sealing layer 112 may be positioned between the gold layer 111 and the lubricant layer 113. Although the gold layer 111, the sealing layer 112, and the fabric layer 113 are optional, they improve corrosion protection and additionally reduce wear on the electrical plug connector contacts 1 during use.

[0086] To connect the electrical plug connector contact 101 to the (printed) circuit board, a solder layer 114 is positioned in the area of ​​the solder section 103 and opposite the terminal section 102. However, the solder layer 114 may be omitted.

[0087] Figure 2a A schematic diagram of four electrical plug connector contacts 201 in the second embodiment is shown. Figure 2b Show along Figure 2a The cross-sectional view shown is a cross-sectional view of the cutting plane AA passing through layer sequence 5. Figure 2c Show along Figure 2a The cross-sectional view shown is a plane BB passing through layer sequence 5. The first plane AA extends in the region of terminal section 202, while the second plane BB extends in the region of solder section 203 on the side opposite to terminal section 202.

[0088] According to the second embodiment, the electrical plug connector contact 201 is substantially the same as... Figures 1a to 1cThe electrical plug connector contact 101 illustrated herein is the same. The following description will only illustrate the differences between the electrical plug connector contact 201 according to the second embodiment and the electrical plug connector contact 101 according to the first embodiment. Similar reference numerals will be used for similar or identical elements.

[0089] The electrical plug connector contact 201 according to Figure 2 additionally has a connection section 215 in addition to the terminal section 202 and the solder section 203. The connection section 215 is arranged between the terminal section 202 and the solder section 203 based on the assembly direction 205, and connects the terminal section 202 and the solder section 203 to each other.

[0090] Compared to the terminal section 102 of the electrical plug connector contact 1 according to FIG. 1, the terminal section 202 of the electrical plug connector contact 201 is designed as a spring coupling 216, that is, the electrical plug connector contact 201 according to FIG. 2 is designed to accommodate the electrical plug connector contact 101 according to FIG. 1. The spring coupling 216 has a tulip-shaped portion 217. For this reason, the gold layer 211 is positioned only in the region of the tulip-shaped portion 215 in the embodiment according to FIG. 2. However, it is not mandatory for the gold layer 211 to be positioned only in the region of the tulip-shaped portion 217. For example, the gold layer 211 can be positioned over the entire terminal section 202, that is, on Figure 2a In the illustrative embodiment, it is positioned above the entire spring coupling 216. Figure 3 Figure 1 shows the reception of the electrical plug connector contact 101 in the spring coupling 216.

[0091] Figure 3 A perspective view shows a schematic diagram of the first terminal element 301. The first terminal element 301 may also be referred to as a blade-side terminal element 301. The first terminal element 301 has a first housing 303, which may also be referred to as a blade housing 303. For example, the first terminal element 301 has according to... Figures 1a to 1c Multiple electrical plug connector contacts 101 are positioned within the first housing 303. It may also be sufficient if the first terminal element 301 has only one electrical plug connector contact 101 as shown in FIG. 1. The first terminal element 301 may, for example, be part of a backplane bus and thus used, for example, in a control cabinet.

[0092] Figure 3 A complementary second terminal element 302 is also shown, which has according to Figures 2a to 2cMultiple electrical plug connector contacts 201 are positioned within a second housing 304 of the second terminal element 302, which may also be referred to as a spring housing 304. It may also be sufficient for the second terminal element 302 to have only the electrical plug connector contacts 202 as shown in FIG. 2.

[0093] Figure 3 This illustrates the engagement of the second terminal element 302 within the first terminal element 301, wherein the first terminal element 301 is based on... Figures 1a to 1c The electrical plug connector contact 101 engages with the second terminal element 302 according to Figures 2a to 2c In the electrical plug connector contact 201. In principle, it is also possible for the first terminal element 301 to engage with the second terminal element 302, wherein the first terminal element 301 is based on... Figures 1a to 1c The electrical plug connector contact 101 engages with the second terminal element 302 according to Figures 2a to 2c The electrical plug connector contact 201.

[0094] The electrical plug connector contact 101 of the first terminal element 301 can be connected to the first printed circuit board positioned on the first housing. Figure 3 (Not shown in the image). Alternatively or additionally, the electrical plug connector contact 201 of the second terminal element 302 may be connected to a second printed circuit board positioned on the second housing (…). Figure 3 (Not shown in the diagram). The printed circuit boards can be positioned on the opposing housing walls of, for example, the first housing 303 and the second housing 304 based on the assembly orientation 104, 204, but this is not absolutely necessary, as the printed circuit boards can be arbitrarily positioned on the respective housings 303, 304. Alternatively, at least one or both printed circuit boards can be omitted. In this case, the electrical plug connector contacts 101, 201 are each designed to connect to one of the printed circuit boards.

[0095] Figure 4 A schematic diagram showing the results of stress tests on contacts 101 and 201 of the electrical plug connector according to Figure 1 or Figure 2 is presented. The horizontal axis shows the test duration in hours. The vertical axis shows the ohmic resistance of contacts 101 and 201 of the electrical plug connector in mΩ. Contacts 101 and 201 of the electrical plug connector were exposed to a temperature of 125°C (dry heat test). Figure 4 The resistance change after 1000 hours is shown to increase by less than 5 MΩ. This demonstrates the improved wear characteristics of the electrical plug connector contacts 101 and 201. Furthermore, no corrosion occurs despite a load.

[0096] Figure 5a and 5b Each of them showed further stress tests. Figure 5a Stress testing on contacts of an electrical plug connector according to the prior art is shown, while Figure 5b The stress test on the electrical plug connectors 101 and 201 shown in Figure 1 or Figure 2 is illustrated. In this case, the ohmic resistance in mΩ is shown as a function of the number of insertion cycles N.

[0097] The insertion cycle is defined as follows: the electrical plug connector contacts 101, 201 connect to the complementary plug connector contacts 201, 101, and move a defined distance in the assembly direction 104, 204 within a defined time period. For example, the electrical plug connector contacts 101, 201 may move ±25 μm in the assembly direction 104, 204 within one second in one cycle. Figure 5a and 5b The results after a total of 100,000 cycles are shown as an example. An enlarged view of the relevant portion of the diagram is also shown to better illustrate the change in resistance.

[0098] Although, according to existing technology, a significant change in resistance can be detected in the electrical plug connector contacts as the number of cycles increases, the resistance of the electrical plug connector contacts 101 and 202 does not increase substantially with the increase in the number of insertion cycles. This indicates that the improved wear resistance means that little or no diffusion occurs into the base materials 106 and 206 of the electrical plug connector contacts 101 and 201, and no intermetallic phases that adversely affect the quality of the electrical plug connector contacts 101 and 201 are formed. As a result, the electrical plug connector contacts 101 and 201 have a longer lifespan.

[0099] Figure 6a A schematic cross-sectional view of a scanning electron micrograph of layer sequences 105, 205 is shown, wherein the second electrolytic nickel layers 108, 208 do not include fine-grained additives. For example, Figure 6a The first electrolytic nickel layers 107, 207 and the fourth layers 110, 210 shown also do not include fine-particle additives. A fourth electrolytic nickel layer 110, 210 can also be provided instead of the fourth layer 110, 210. The third electrolytic nickel layers 109, 209 are... Figure 6a The difference is not obvious because it is too thin. As an example, the third electrolytic nickel layers 109 and 209 also do not have fine-grained additives.

[0100] Compared to the first electrolytic nickel layers 107 and 207, the second electrolytic nickel layers 108 and 208 exemplarily have smaller crystallites or grains. For example, the first electrolytic nickel layers 107 and 207, without fine-grained additives, substantially have crystallites with a size greater than 1 μm in at least one extension direction, while the crystallites of the second electrolytic nickel layers 108 and 208 have a predominant grain size, for example, in the submicron range. However, the grain sizes shown and indicated should not be considered limiting, but merely illustrative.

[0101] Figure 6b A schematic cross-sectional view of a scanning electron micrograph of layer sequences 105, 205 is shown, in which the second current-electrolyzed nickel layers 108, 208 include fine-grained additives. As an example, Figure 6a The first electrolytic nickel layers 107, 207 and the fourth layers 110, 210 shown do not include fine-particle additives. A fourth electrolytic nickel layer 110, 210 can also be provided instead of the fourth layer 110, 210. The third electrolytic nickel layers 109, 209 are similarly... Figure 6b The presence of fine-grained additives is not obvious because it is too thin. As an example, the third electrolytic nickel layers 109 and 209 also do not have fine-grained additives. The fine-grained additives in the second electrolytic nickel layers 108 and 208 are also not obvious because they are mainly located in the grain boundary regions of the second electrolytic nickel layers 108 and 208.

[0102] In principle, the first electroplated nickel layers 107, 207, the second electroplated nickel layers 108, 208, the optional third electroplated nickel layers 109, 209, and the optional fourth layers 110, 210 or 110, 210 may each individually include or exclude fine-grained additives. However, preferably, at least the second electroplated nickel layers 108, 208 include fine-grained additives.

[0103] like Figure 6a As shown, the second electrolytic nickel layers 108 and 208 have smaller crystallites than the first electrolytic nickel layers 107 and 207. However, in Figure 6b It is obvious that, Figure 6a and 6b The microstructure of the second electrolytic nickel layer 108 and 208 is different because it is different from that of the second electrolytic nickel layer 108 and 208. Figure 6a Compared to the second electrolytic nickel layer 108 and 208, Figure 6a The second electrolytic nickel layers 108 and 208 include fine-grained additives.

[0104] Figure 6c It shows Figure 6a and 6b A schematic enlarged view of the second electrolytic nickel layers 108 and 208. According to... Figure 6b The second flux-electric nickel layer 108, 208 with fine grain additives has a higher density than according to... Figure 6aThe second electrolytic nickel layers 108 and 208 without fine grain additives have smaller microcrystals. The fact that the grain size of the microcrystals of the second electrolytic nickel layers 108 and 208 with fine grain additives is smaller than that of the microcrystals of the second electrolytic nickel layers 108 and 208 without fine grain additives means that at least some of the microcrystals of the second electrolytic nickel layers 108 and 208 with fine grain additives have a smaller average grain size in at least one extension direction than the microcrystals of the second electrolytic nickel layers 108 and 208 without fine grain additives.

[0105] exist Figure 6c In the illustrative embodiments, for example, according to Figure 6b 25% to 75% of the microcrystals of the second flux-electric nickel layer 108, 208 with fine-grained additives may have an average grain size, for example, greater than 500 nm in at least one extension direction. For example, it is also possible, for example, according to... Figure 6a The microcrystals of the second electrolytic nickel layers 108, 208, which do not contain fine-grained additives, have an average grain size of, for example, less than 500 nm in at least one extension direction, comprising 25% to 75% of the microcrystals. These grain sizes should be considered as illustrative figures only and not as limitations on the electrical plug connectors 101, 201. Instead, possible embodiments are shown that have the described advantages of improved wear characteristics of the electrical plug connectors 101, 202.

[0106] In addition, according to Figure 6b The grain boundary density of the second flux-electric nickel layers 108 and 208 with fine-grained additives is higher than that according to Figure 6a The grain boundary density of the second electrolytic nickel layers 108 and 208 without fine-grained additives is higher. In other words, the microstructure with fine-grained additives is finer. Furthermore, the crystallites of the second electrolytic nickel layers 108 and 208 with fine-grained additives are more rounded than those without.

[0107] In addition to the first electroplated nickel layers 107 and 207 and the second electroplated nickel layers 108 and 208 Figure 6a and 6b Fourth electrostatic nickel layers 110 and 210 are also shown. Alternatively, fourth layers 110 and 210 may be provided instead of fourth electrostatic nickel layers 110 and 210. The fourth electrostatic nickel layers 110 and 210 may be electrostatically deposited, for example by DC deposition, like the first electrostatic nickel layers 107 and 207, the second electrostatic nickel layers 108 and 208, the third electrostatic nickel layers 109 and 209, and the fourth layer 110 and 210. However, the fourth electrostatic nickel layers 110 and 210 may also be deposited on the second or third electrostatic nickel layers 108, 208, 109, and 209 by pulsed current deposition.

[0108] Figure 7aA schematic diagram illustrating the current density of the fourth current-pulse current deposition of nickel layers 110 and 210 is shown. A curve of current density versus coating time is plotted here. Figure 7a The unipolar electrostatic deposition of the fourth electrostatic nickel layers 110 and 210 is shown.

[0109] The current density j has a square wave profile with a period T and a maximum value j. P The current density only exhibits values ​​greater than or equal to zero because the deposition is unipolar. During the time period T, the maximum current density j... P The time period is maintained at T1, while the current density value is zero for a duration of T0, such that T = T1 + T0. Figure 7a The median current density j is also shown. M .

[0110] Figure 7b A schematic diagram of another illustrative current density plot of the current pulse current deposition of the fourth current-electrode nickel layers 110, 210 is shown. Again, the current density versus coating time is plotted here. Figure 7b The bipolar electrodeposition of the fourth electrostatic nickel layers 110 and 210 is shown.

[0111] In contrast to unipolar deposition, the current density also exhibits a negative value within the period T, meaning that deposition is achieved through AC rather than DC. Figure 7b The current density distribution also exhibits a square wave distribution. Within the time period T, the maximum current density j... P1 Maintain the current density for time period T1. Then, the current density reaches its minimum value j during time period T2. P2 And its value is zero during the time period T0, such that T = T1 + T2 + T0.

[0112] Compared to DC deposition, the fourth current-electrode nickel layers 110 and 210 deposited using pulsed current parameters exhibit a more uniform and finer grain structure. Pulsed current deposition results in a smaller grain size, an increased gloss level, and higher layer hardness.

[0113] Compared to the fourth electrostatic nickel layers 110 and 210 deposited by DC deposition, the fourth electrostatic nickel layers 110 and 210 deposited using pulsed current parameters also have a higher phosphorus content. The local phosphorus distribution of the fourth electrostatic nickel layers 110 and 210 deposited by pulsed current is comparable to that of the nickel layers without electrostatic deposition.

[0114] List of reference numerals

[0115] 101 Electrical plug connector according to the first embodiment

[0116] 102 terminal section

[0117] 103 Solder Section

[0118] 104 Assembly direction / Main extension direction

[0119] 105-layer sequence

[0120] 106 Substrate Material

[0121] 107 First-line electrolytic nickel layer

[0122] 108 Second-stage electrolytic nickel layer

[0123] 109 Third-generation electrolytic nickel layer

[0124] 110 Fourth Current-Electrified Nickel Layer / Fourth Current-Electrified Layer

[0125] 111 Gold Layer

[0126] 112 Sealing layer

[0127] 113 Lubrication layer

[0128] 114 Tin layer / solder metal

[0129] 201 Electrical plug connector according to the second embodiment

[0130] 202 terminal section

[0131] 203 Solder Section

[0132] 204 Assembly direction / Main extension direction

[0133] 205-layer sequence

[0134] 206 Substrate Material

[0135] 207 First-line electrolytic nickel layer

[0136] 208 Second-stage electrolytic nickel layer

[0137] 209 Third-generation electrolytic nickel layer

[0138] 210 Fourth Current-Electrified Nickel Layer / Fourth Current-Electrified Layer

[0139] 211 Gold Layer

[0140] 212 Sealing layer

[0141] 213 Lubrication layer

[0142] 214 Tin layer / solder metal

[0143] 215 Connecting Section

[0144] 216 Spring Connector

[0145] 217 Tulip-shaped part of the spring connector

[0146] 301 First terminal element on the blade side

[0147] 302 Second terminal element on the spring side

[0148] 303 First Housing / Blade Housing

[0149] 304 Second Housing / Spring Housing

Claims

1. An electrical plug connector contact (101, 201). It has terminal sections (102, 202) for contacting with complementary electrical plug connector contacts (201, 101). The first electrolytic nickel layer (107, 207) is positioned on top of the terminal section (102, 202). The second electrolytic nickel layer (108, 208) is positioned on top of the first electrolytic nickel layer (107, 207).

2. The electrical plug connector contacts (101, 201) according to claim 1. The first electrolytic nickel layer (107, 207) is in the form of a matte nickel layer. The second electrolytic nickel layer (108, 208) is in the form of a medium-gloss or high-gloss nickel layer.

3. The electrical plug connector contacts (101, 201) according to any one of the preceding claims. It has solder sections (103, 203) that are fixedly bonded to the terminal sections (102, 202). in, The terminal sections (102, 202) and the solder sections (103, 203) are arranged opposite to each other relative to the assembly direction (104, 204) of the electrical plug connector contacts (101, 201). The solder bond can be positioned within the solder section (103, 203). The first electrolytic nickel layer (107, 207) is positioned on top of the terminal section (102, 202) and on top of the solder section (103, 203). The second electrolytic nickel layer (108, 208) is located only in the region of the terminal segment (102, 202) on top of the first electrolytic nickel layer (107, 207).

4. The electrical plug connector contacts (101, 201) according to any one of the preceding claims. The third electrolytic nickel layer (109, 209) is positioned on top of the second electrolytic nickel layer (108, 208). The third electrolytic nickel layer (9) is in the form of an adhesion promoter layer.

5. The electrical plug connector contacts (101, 201) according to any one of the preceding claims. The fourth electrolytic nickel layer (110, 210) is positioned above the second electrolytic nickel layer (108, 208). The fourth electrolytic nickel layer (110, 210) includes phosphorus, particularly 11-16% by weight of phosphorus.

6. The electrical plug connector contacts (101, 201) according to claim 5. The fourth electrolytic nickel layer (110, 210) includes dispersing additives. The dispersing additive comprises one or a combination of the following materials: Silicon carbide, silicon dioxide, boron nitride, aluminum ceramics.

7. The electrical plug connector contacts (101, 201) according to any one of claims 1 to 4. The fourth electrolytic nickel layer (110, 210) is positioned above the second electrolytic nickel layer (108, 208). The fourth current layer (110, 210) comprises a palladium-nickel alloy, particularly a palladium-nickel alloy with a mass ratio of 80 wt% palladium and 20 wt% nickel.

8. The electrical plug connector contacts (101, 201) according to any one of claims 3 and 4 and any one of claims 5 to 7. The fourth electrolytic nickel layer (110, 210) or the fourth electrolytic nickel layer (110, 210) is located in the region of the terminal segment (102, 202) on top of the third electrolytic nickel layer (9) or on top of the second electrolytic nickel layer (8), and / or The fourth electrolytic nickel layer (10) or the fourth electrolytic layer (10) is positioned on top of the third electrolytic nickel layer (109, 209) or in the area of ​​the solder section (103, 203) on top of the first electrolytic nickel layer (107, 207).

9. The electrical plug connector contacts (101, 201) according to any one of claims 4 to 8. The first electrolytic nickel layer (107, 207) completely covers the terminal section (102, 202) and the solder section (103, 203), and the second electrolytic nickel layer (108, 208) completely covers the first electrolytic nickel layer (107, 207) in the region of the terminal section (102, 202), and / or The third electrolytic nickel layer (109, 209) completely covers the first electrolytic nickel layer (107, 207) in the region of the solder section (103, 203) and the second electrolytic nickel layer (8) in the region of the terminal section (102, 202), and / or The fourth electrolytic nickel layer (110, 210) completely covers the third electrolytic nickel layer (109, 209) in the terminal section (102, 202) and the solder section (103, 203).

10. The electrical plug connector contact (101, 201) according to any one of claims 5 to 9. The gold layer (11) is positioned on top of the fourth electrolytic nickel layer (10) or on top of the fourth electrolytic layer (10).

11. The electrical plug connector contacts (101, 201) according to claim 10. The sealing layer (12) is positioned on top of the gold layer (11).

12. The electrical plug connector contacts (101, 201) according to any one of claims 10 and 11. The lubricant layer (15) is disposed on top of the gold layer (11) or on top of the sealing layer (12).

13. The electrical plug connector contacts (101, 201) according to any one of claims 4 to 12. in, In the region of the solder section (103, 203), in the region opposite to the terminal section (2) based on the assembly direction (104, 204), the tin layer (114, 214) is positioned on top of the fourth current-energized nickel layer (110, 210) or the fourth current-energized layer (110, 210).

14. The electrical plug connector contacts (101, 201) according to any one of the preceding claims. The second electrolytic nickel layer (108, 208) includes fine-particle additives.

15. A terminal element (301, 302). The device comprises a housing (303, 304), a printed circuit board positioned on the housing (303, 304), and at least one electrical plug connector contact (101, 201) as described in any of the preceding claims, positioned within the housing (303, 304) and connected to the printed circuit board. in, The terminal elements (301, 302) are configured for connection to a complementary terminal element (302, 301) having at least one other plug connector contact (201, 101) that is complementary to the electrical plug connector contacts (101, 201).

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