Conductive paste and preparation method of attached conductive diaphragm structure

Abstract

The invention discloses a preparation method of a conductive patch and an attached conductive diaphragm structure, and the preparation method of the conductive patch comprises the following steps: arranging a conductive layer on one side of an adhesive layer to form a conductive sheet, cutting the conductive sheet into a plurality of conductive patches, and each conductive patch is provided with at least one conductive path. A conductive sheet comprising an adhesive layer and a conductive layer is prepared, a conductive patch cut into a preset pattern is applied to a conductive diaphragm, the conductive patch is attached to the diaphragm through the adhesive layer, and the attached conductive diaphragm structure is obtained after curing forming. The conductive layer is uniform and is transited through the adhesive layer, so that the problems of uneven thickness, stress concentration, poor adhesive force and the like of the conductive layer, which are easily caused by directly constructing the conductive layer on the vibrating diaphragm, are solved; meanwhile, the outer surface of the conductive layer is coated with the protective layer, so that the electrical property consistency and environmental reliability of the conductive structure are ensured.

Description

Technical Field

[0001] This invention relates to the field of conductive adhesive technology, specifically to a conductive adhesive and a method for preparing an adhesive conductive diaphragm structure. Background Technology

[0002] With the miniaturization and portability of electronic devices, higher requirements are placed on materials, structural design, and manufacturing processes. Among these, conductive diaphragms for loudspeakers can replace conventional FPCs, offering advantages such as space saving, improved sensitivity, and noise reduction. A conductive diaphragm involves fabricating conductive lines on its surface to achieve conductivity between the voice coil leads and external pads. In existing technologies, conductive lines are often formed by directly spraying, printing, or coating conductive silver paste onto the diaphragm surface.

[0003] However, diaphragms used in practical applications often have a folded ring structure or a locally undulating structure. The conductive lines of the conductive diaphragm need to cross this folded ring structure or locally undulating structure. This type of structure is prone to causing the following problems during the spraying or printing process:

[0004] (1) The conductive paste flows unevenly in the undulating area of ​​the fold ring, which easily forms local accumulation or thinning. Specifically, it accumulates at the bottom of the fold ring, while the conductive film on the vertical wall of the fold ring cannot adhere to the wall. The uneven thickness causes stress concentration, and shear stress is easily generated during vibration, which leads to the initiation of cracks and the final fatigue fracture.

[0005] (2) Uneven distribution of conductive layer thickness and resistance results in poor consistency of conductivity;

[0006] (3) The conductive layer generates stress concentration in the folded area, which is prone to high-frequency vibration. Under reliability test conditions, it is prone to cracking, falling off or significant resistance drift.

[0007] (4) The film quality stability is poor under different diaphragm batches, different spraying angles or tooling conditions, which is not conducive to large-scale production;

[0008] (5) The conductive coating has poor adhesion on low surface energy substrates;

[0009] (6) After the conductive coating is directly applied to the diaphragm, the curing process leads to stress concentration and the curing shrinkage causes deformation of the diaphragm substrate. These problems will affect the vibration of the diaphragm and thus affect the acoustic performance.

[0010] (7) The modulus and thermal expansion coefficient of the conductive coating and the diaphragm are very different. Directly coating the conductive layer has no transition between the two, resulting in stress mismatch and poor product reliability.

[0011] Therefore, there is an urgent need for a conductive diaphragm structure that can avoid the influence of the diaphragm ring undulation structure on the quality of the conductive layer, while taking into account both conductivity and mechanical reliability. Summary of the Invention

[0012] This invention addresses the shortcomings of existing technologies by providing a method for preparing a conductive patch and an attached conductive diaphragm structure. The conductive patch comprises an adhesive layer and a conductive layer. By pre-preparing the conductive layer into a film material and then attaching it to the diaphragm surface using the adhesive layer, problems such as unevenness, stress concentration, and poor adhesion caused by directly applying conductive paste to the diaphragm are avoided. Simultaneously, a protective layer is coated on the outer surface of the conductive layer to ensure the consistency of the electrical performance and environmental reliability of the conductive structure.

[0013] To solve the above-mentioned technical problems, the first aspect of the present invention provides a method for preparing a conductive sticker, comprising the following steps: disposing a conductive layer on one side of an adhesive layer to form a conductive sheet, cutting the conductive sheet into a plurality of conductive stickers, each of the conductive stickers having at least one conductive path.

[0014] This invention prepares a conductive sheet comprising an adhesive layer and a conductive layer, which is cut into a predetermined pattern. When applied to a conductive diaphragm, the conductive sheet is attached to the diaphragm through the adhesive layer and cured to obtain an attached conductive diaphragm structure. The conductive layer is uniform and transitions through the adhesive layer, avoiding problems such as uneven conductive layer thickness, stress concentration, and poor adhesion that are easily caused by directly applying the conductive layer to the diaphragm.

[0015] Furthermore, a protective layer is coated on the side of the conductive layer away from the adhesive layer to ensure the consistency of the electrical performance and environmental reliability of the conductive structure.

[0016] Furthermore, the conductive layer is a metallic or non-metallic conductive film layer, a conductive wire layer, or is formed by coating and curing a conductive paste.

[0017] Furthermore, when the conductive layer is formed by coating and curing a conductive paste, the method for preparing the conductive sheet is as follows:

[0018] (1) A conductive paste is coated on the release film and cured to form a conductive layer;

[0019] (2) After covering the predetermined area of ​​the conductive layer with a mask, a protective layer is applied; wherein, the predetermined area is the two ends of the conductive sticker obtained after cutting, which serve as the conductive part after the mask is removed;

[0020] (3) After removing the release film, an adhesive layer is coated on the conductive layer, and then a new release film is attached to obtain the conductive sheet.

[0021] Furthermore, when the conductive layer is a metallic or non-metallic conductive film layer, the method for preparing the conductive sheet is as follows:

[0022] (1) After coating the release film with an adhesive layer, attach a metal or non-metal conductive film layer as a conductive layer.

[0023] (2) After covering the predetermined area of ​​the conductive layer with a mask, apply a protective layer.

[0024] Furthermore, when the conductive layer is a conductive wire layer, the method for preparing the conductive sheet is as follows:

[0025] (1) After coating an adhesive layer on the release film, several conductive wires are attached in parallel as a conductive layer; wherein each conductive sticker obtained after cutting contains at least one conductive wire;

[0026] (2) After covering the predetermined area of ​​the conductive layer with a mask, apply a protective layer.

[0027] Furthermore, the adhesive layer material includes one or more of the following: two-component polyurethane, moisture-curing polyurethane, waterborne polyurethane adhesive, UV polyurethane, solvent-based polyurethane adhesive, modified acrylic elastic adhesive, silicone adhesive, and RTV rubber. After pre-drying the coated adhesive layer, an adhesive layer with adhesion is obtained. At this point, the adhesive layer is not fully cured and possesses a certain initial tack. After S2 curing, the adhesive layer exhibits flexible cushioning properties, strong bending and fatigue resistance, and excellent environmental reliability, while also demonstrating high adhesion to the conductive layer and diaphragm.

[0028] Furthermore, the conductive paste is a polymer conductive paste or a composite conductive paste. The composite conductive paste includes conductive filler, resin matrix, additives, and solvent. The resin matrix is ​​selected from one or more of silicone rubber, fluorosilicone rubber, polyurethane elastomer, polyester elastomer, polyimide elastomer, fluoropolymer elastomer, and elastic acrylic resin. The conductive filler is selected from one or more of flake silver powder, spherical silver powder, silver nanowires, graphene, carbon nanotubes, conductive carbon black, carbon nanofibers, spiral carbon nanofibers, and carbon nanoangles. The additives include one or more of the following: dispersants, wetting agents, defoamers, thickeners, and coupling agents; the dispersants are selected from one or more of the following: triethanolamine, arabic resin, oleic acid, gelatin, sodium lauryl sulfate, and polyvinyl alcohol; the wetting agents are selected from one or more of the following: TIG4100, TIG270, BYK-348, Evonik 3100, Huntsman OT-75, and Evonik 360; the defoamers are usually selected from one or more of the following: BYK-011, BASF ST2454, BYK-019, and TIG810. The thickener is selected from one or more of inorganic thickeners, cellulose thickeners, polyacrylate thickeners, and associative polyurethane thickeners, such as Dow RM-8w, Arkema Coapur 2025, Deqian WT-105A, and Evonik TAFIGEL® PUR62; the solvent is selected from one or more of IPA, toluene, xylene, butyl acetate, MEK, DBE, DPM, DPGMEA, and deionized water.

[0029] Furthermore, the raw materials of the protective layer include one or more of silicone rubber, fluorosilicone rubber, elastic polyurethane resin, polyester elastomer, polyimide elastomer, fluoropolymer elastomer, and acrylic acid.

[0030] Furthermore, the release film is selected from PET film, PEN film, PI film, PP film, PE film, PVC film or silicone paper.

[0031] Furthermore, the thickness of the adhesive layer is 1-20 μm; the thickness of the conductive layer is 2-50 μm; and the thickness of the protective layer is 1-30 μm.

[0032] A second aspect of the present invention provides a method for preparing an attached conductive diaphragm structure, comprising the following steps:

[0033] Support members that mate with the diaphragm surface are arranged on the side facing the diaphragm during installation to support the diaphragm and prevent deformation of the flexible diaphragm during the attachment process. Then, at least one conductive patch prepared by the method described in the first aspect is attached to the diaphragm from the inner attachment area outwards via an adhesive layer; wherein, the conductive patch located in the diaphragm fold area is attached to the diaphragm surface along the undulating structure of the diaphragm in the fold area. Preferably, when the conductive patch contains a release film, the release film is removed before attachment.

[0034] Furthermore, the diaphragm material is selected from polyetheretherketone (PEEK), nitrile rubber, thermoplastic polyurethane elastomer (TPU), polyurethane (PU), silicone rubber substrate, acrylate rubber (ACM), ethylene acrylate rubber (AEM), thermoplastic elastomer (TPE), thermoplastic polyester elastomer (TPEE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethacrylamide (PMI), ACF (epoxy resin and carbon fiber composite substrate), or polyimide (PI).

[0035] Furthermore, the adhesive layer is attached to the diaphragm from the innermost area outwards, specifically by maintaining the original natural state of the diaphragm's surround area during attachment.

[0036] First attach one end, then use a silicone stick or miniature roller to gradually attach it to the other end;

[0037] Alternatively, conductive stickers can be placed using visual or laser positioning, and then attached using vacuum adsorption or air compression molding methods.

[0038] Furthermore, the process before attachment includes: cleaning the diaphragm surface to remove impurities, as well as plasma treatment and irradiation treatment, to make the diaphragm surface dyn value > 48 dyn / cm.

[0039] Furthermore, the attachment process also includes a curing step, which is accomplished by one or more of heating, light irradiation, ion irradiation, and moisture.

[0040] The beneficial effects of this invention are:

[0041] This invention prepares a conductive sheet comprising an adhesive layer and a conductive layer, which is cut into conductive patches of a predetermined pattern. When applied to a conductive diaphragm, the adhesive layer adheres to the diaphragm, solving the problems of uneven conductive layer formation caused by directly applying conductive paste to the diaphragm, accumulation at the bottom of the folded ring, and inability of the conductive film to adhere to the vertical walls of the folded ring. This uneven thickness leads to stress concentration, easily generating shear stress during vibration, thus causing crack initiation and eventual fatigue fracture. The adhesive layer also solves the problem of poor adhesion of the conductive coating on low surface energy substrates. Furthermore, it addresses the stress concentration caused by curing the conductive coating directly onto the diaphragm, as well as the deformation of the diaphragm substrate due to curing shrinkage. These problems affect diaphragm vibration and consequently acoustic performance. The flexible adhesive layer facilitates a smooth transition between the large difference in modulus and thermal expansion coefficient between the conductive coating and the diaphragm, thus resolving stress mismatch and improving product reliability.

[0042] This invention coats a protective layer on the outer surface of the conductive layer to ensure the consistency of the electrical performance of the conductive structure and its environmental reliability. Attached Figure Description

[0043] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the conductive patch structure of the present invention;

[0045] Figure 2 This is a schematic diagram of the attached conductive diaphragm structure according to Embodiment 1 of the present invention;

[0046] Figure 3 This is a cross-sectional view of the folded ring region of the attached conductive diaphragm structure obtained in Embodiment 1 of the present invention;

[0047] Figure 4 This is a schematic diagram of the attached conductive diaphragm structure obtained in Embodiment 2 of the present invention;

[0048] The labels in the diagram are as follows: 1. Conductive adhesive, 101. Adhesive layer, 102. Conductive layer, 103. Protective layer, 104. Conductive part, 105. Release film, 2. Diaphragm, 201. Folded ring, 202. In-line diaphragm. Detailed Implementation

[0049] The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] In this invention, unless otherwise stated, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," indicating orientation or positional relationships, are merely for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this patent can be understood according to the specific circumstances.

[0051] Example 1

[0052] This embodiment relates to a method for preparing a conductive patch and an attached conductive diaphragm structure, including the following steps:

[0053] (1) Apply conductive paste (by mass percentage, including 15% elastic acrylic resin, 25% nano silver wire, 45% flake silver powder, 8% deionized water, 2% thickener Dow RM-8w, 3% dispersant triethanolamine, 1% wetting agent DIG4100, 0.5% defoamer BYK-011, and 0.5% coupling agent) to the release film (PP) and cure to form a 15μm thick conductive layer;

[0054] (2) After covering the predetermined area of ​​the conductive layer with a mask, a protective layer (material: elastic polyurethane resin, thickness: 5μm) is applied; wherein, the predetermined area is the two ends of the conductive sticker obtained after cutting, which serve as the conductive part after the mask is removed;

[0055] (3) After removing the release film, an adhesive layer (silicone glue, 10μm) is coated on the conductive layer, and then a new release film is attached to obtain the conductive sheet;

[0056] (4) Cut the conductive sheet into strips of conductive adhesive, with the structure as follows: Figure 1As shown, the conductive sticker 1 includes a release film 105, an adhesive layer 101, a conductive layer 102, and a protective layer 103 arranged in sequence, and conductive portions 104 are provided at both ends; after the PEEK diaphragm is placed on the base for support, four conductive stickers are taken and the release film is peeled off. They are first attached to one end through the adhesive layer, and then gradually attached to the other end by rolling with a silicone rod. The conductive stickers are attached from the center of the diaphragm to the outer ring, thus completing the symmetrical attachment of the conductive stickers, and the conductive stickers cross the folds of the diaphragm;

[0057] (5) Heating and curing at 120℃ for 20 minutes to form a stable attached conductive diaphragm structure, such as Figure 2 As shown, the structure includes a diaphragm 2, a folded ring 201 on the diaphragm 2, a diaphragm inlay 202, and four conductive pads 1 spanning the folded ring 201. A cross-sectional view of the folded ring region of this conductive diaphragm structure is shown below. Figure 3 As shown, it includes a diaphragm 2, an adhesive layer 201, a conductive layer 202, and a protective layer 203 arranged in sequence.

[0058] Example 2

[0059] This embodiment relates to a method for preparing a conductive patch and an attached conductive diaphragm structure, including the following steps:

[0060] (1) A conductive paste (in mass percentage, including 18% elastic polyurethane resin, 65% flake silver powder, 3% graphene, 12% DPGMEA solvent, 1% triethanolamine dispersant, 0.8% wetting agent DIG4100, 0.2% defoamer BYK-011) is sprayed onto a release film (PET) and cured to form a 10μm thick conductive layer;

[0061] (2) After covering the predetermined area of ​​the conductive layer with a mask, a protective layer (material: elastic silicone, thickness: 5μm) is applied; wherein, the predetermined area is the two ends of the conductive sticker obtained after cutting, which serve as the conductive part after the mask is removed;

[0062] (3) After removing the release film, an adhesive layer (UV polyurethane, 5μm) is coated on the conductive layer, and then a new release film is attached to obtain the conductive sheet.

[0063] (4) Cut the conductive sheet into strips of conductive stickers. After placing the PU diaphragm on the base for support, take two conductive stickers and remove the release film. First attach one end of each sticker, and then gradually attach them to the other end by rolling with a silicone rod to complete the symmetrical attachment of the conductive stickers. The conductive stickers cross the folds of the diaphragm.

[0064] (5) Under UV irradiation at 1000 lux for 20 seconds, a stable attached conductive diaphragm structure is formed, such as Figure 4 As shown, it includes a diaphragm 2, a folded ring 201 on the diaphragm 2 and a diaphragm inlay 202, and two conductive adhesive strips 1 spanning the folded ring 201.

[0065] Example 3

[0066] This embodiment relates to a method for preparing a conductive patch and an attached conductive diaphragm structure, including the following steps:

[0067] (1) After coating an adhesive layer (UV polyurethane, 5μm) on a release film (PET), attach a conductive sheet (material: carbon nanotube film, 30μm thick) as a conductive layer.

[0068] (2) After covering the predetermined area of ​​the conductive layer with a mask, a protective layer (material: thermoplastic polyurethane, thickness: 5μm) is applied; wherein, the predetermined area is the two ends of the conductive sticker obtained after cutting, which serve as the conductive part after the mask is removed;

[0069] (3) Cut the conductive sheet into strips of conductive stickers. After placing the TPU diaphragm on the base for support, take two conductive stickers and remove the release film. At the center of the long axis of the diaphragm ring, attach one end first, and then gradually attach it to the other end by rolling with a silicone rod to complete the symmetrical attachment of the conductive stickers at the center of the two long axes. The conductive stickers cross the diaphragm ring.

[0070] (4) Under UV irradiation at 1000 lux for 20 seconds, a stable attached conductive diaphragm structure is formed.

[0071] Example 4

[0072] This embodiment relates to a method for preparing a conductive patch and an attached conductive diaphragm structure, including the following steps:

[0073] (1) After coating an adhesive layer (room temperature vulcanized RTV rubber, 10 μm) on a release film (PET), attach parallel conductive wires (material: silver-plated carbon fiber, diameter 20 μm) as a conductive layer.

[0074] (2) After covering the predetermined area of ​​the conductive layer with a mask, a protective layer (material: thermoplastic polyurethane, thickness: 5μm) is applied; wherein, the predetermined area is the two ends of the conductive sticker obtained after cutting, which serve as the conductive part after the mask is removed;

[0075] (3) Cut the parallel conductive wires into strip conductive stickers. After placing the AEM diaphragm on the base for support, take 4 conductive stickers and remove the release film. In the four corner areas of the folded ring, first attach one end, and then gradually attach to the other end by rolling with a silicone rod to complete the symmetrical attachment of the conductive stickers. The conductive stickers cross the folded ring of the diaphragm.

[0076] (4) Heat curing at 120℃ for 30 minutes to form a stable attached conductive diaphragm structure.

[0077] Example 5

[0078] This embodiment relates to a method for preparing a conductive patch and an attached conductive diaphragm structure, including the following steps:

[0079] (1) Spray polymer conductive paste PEDOT (poly(3,4-ethylenedioxythiophene)) onto the release film (silicone paper), and after curing, a 30μm thick conductive layer is formed;

[0080] (2) After covering the predetermined area of ​​the conductive layer with a mask, a protective layer (material: elastic silicone, thickness: 5μm) is applied; wherein, the predetermined area is the two ends of the conductive sticker obtained after cutting, which serve as the conductive part after the mask is removed;

[0081] (3) After removing the release film, an adhesive layer (UV polyurethane, 5μm) is coated on the conductive layer, and then a new release film is attached to obtain the conductive sheet.

[0082] (4) Cut the conductive sheet into strips of conductive stickers. After placing the PU diaphragm on the base for support, take two conductive stickers and remove the release film. First attach one end of each sticker, and then gradually attach them to the other end by rolling with a silicone rod to complete the symmetrical attachment of the conductive stickers. The conductive stickers cross the folds of the diaphragm.

[0083] (5) Under UV irradiation at 1000 lux for 20 seconds, a stable attached conductive diaphragm structure is formed.

[0084] Comparative Example 1

[0085] This comparative example relates to a method for fabricating a conductive diaphragm structure, including the following steps:

[0086] (1) The conductive paste in Example 1 is directly sprayed onto the PEEK diaphragm by a spraying process;

[0087] (2) A conductive coating with a thickness of 15 μm is obtained after curing;

[0088] (3) Referring to Example 1, a mask is then placed over the conductive coating to apply a protective layer;

[0089] (4) A conductive diaphragm prepared by spraying process is obtained.

[0090] According to GB / T9286, the adhesion between the coating and the substrate was tested. The resistance of the conductive layer structure was tested using a resistance tester. The conductive diaphragm sample was cut and the uniformity of the coating thickness was observed under a microscope. The test results are shown in Table 1.

[0091] Table 1

[0092] As can be seen from the test results in Table 1, Comparative Example 1, which uses a spraying process, has poor coating thickness uniformity, poor adhesion, and its resistance performance is also worse than that of Example 1.

[0093] The shape of the cut is not limited to strips, and can also be other types of patterns, but it must be ensured that the attachment position is symmetrical on the diaphragm, and the axis of symmetry of the cut pattern must be on the same straight line as the center of the diaphragm.

[0094] One conductive sticker contains two unconnected conductive paths, which are connected to two voice coil leads and an external circuit, respectively; two conductive stickers each have one conductive path; of the four conductive stickers, only two are connected to the external circuit, while the other two are not connected and are used only for symmetrical and balanced diaphragms.

[0095] Conductive adhesive tape includes a conductive layer and an adhesive layer, and may also include a conductive layer, an adhesive layer and a protective layer, or a conductive layer, an adhesive layer, a protective layer and a release film.

[0096] This invention prepares a conductive sheet comprising an adhesive layer and a conductive layer, which is cut into conductive patches of a predetermined pattern. When applied to a conductive diaphragm, the adhesive layer adheres to the diaphragm, solving the problems of uneven conductive layer formation caused by directly applying conductive paste to the diaphragm, accumulation at the bottom of the folded ring, and inability of the conductive film to adhere to the vertical walls of the folded ring. This uneven thickness leads to stress concentration, easily generating shear stress during vibration, thus causing crack initiation and eventual fatigue fracture. The adhesive layer also solves the problem of poor adhesion of the conductive coating on low surface energy substrates. Furthermore, it addresses the stress concentration and diaphragm substrate deformation caused by curing after the conductive coating is directly applied to the diaphragm, both of which affect diaphragm vibration and thus acoustic performance. The flexible adhesive layer facilitates a smooth transition between the conductive coating and the diaphragm due to significant differences in modulus and coefficient of thermal expansion, resolving stress mismatch and improving product reliability. In addition, a protective layer is coated on the outer surface of the conductive layer to ensure the consistency of the electrical performance and environmental reliability of the conductive structure.

[0097] The present invention has been described in detail above with reference to specific embodiments and exemplary examples; however, these descriptions should not be construed as limiting the present invention. Those skilled in the art will understand that various equivalent substitutions, modifications, or improvements can be made to the technical solutions and embodiments of the present invention without departing from the spirit and scope of the invention, and all such modifications and improvements fall within the scope of the present invention. The scope of protection of the present invention is defined by the appended claims.

Claims

1. A method for preparing a conductive sticker, characterized in that, The process includes the following steps: depositing a conductive layer on one side of the adhesive layer to form a conductive sheet, cutting the conductive sheet into several conductive stickers, each of which has at least one conductive path.

2. The method for preparing the conductive sticker as described in claim 1, characterized in that, A protective layer is also provided on the side of the conductive layer away from the adhesive layer.

3. The method for preparing the conductive sticker as described in claim 2, characterized in that, The conductive layer is a metallic or non-metallic conductive film layer, a conductive wire layer, or is formed by coating and curing a conductive paste.

4. The method for preparing the conductive sticker as described in claim 3, characterized in that, When the conductive layer is formed by coating and curing a conductive paste, the method for preparing the conductive sheet is as follows: (1) A conductive paste is coated on the release film and cured to form a conductive layer; (2) After covering the predetermined area of ​​the conductive layer with a mask, a protective layer is applied; wherein, the predetermined area is the two ends of the conductive sticker obtained after cutting, which serve as the conductive part after the mask is removed; (3) After removing the release film, an adhesive layer is coated on the conductive layer, and then a new release film is attached to obtain the conductive sheet.

5. The method for preparing the conductive sticker as described in claim 3, characterized in that, When the conductive layer is a metallic or non-metallic conductive film layer, the method for preparing the conductive sheet is as follows: (1) After coating the release film with an adhesive layer, attach a metal or non-metal conductive film layer as a conductive layer. (2) After covering the predetermined area of ​​the conductive layer with a mask, apply a protective layer.

6. The method for preparing the conductive sticker as described in claim 3, characterized in that, When the conductive layer is a conductive wire layer, the method for preparing the conductive sheet is as follows: (1) After coating an adhesive layer on the release film, several conductive wires are attached in parallel as a conductive layer; wherein each conductive sticker obtained after cutting contains at least one conductive wire; (2) After covering the predetermined area of ​​the conductive layer with a mask, apply a protective layer.

7. A method for fabricating an attached conductive diaphragm structure, characterized in that, Includes the following steps: A support member that mates with the diaphragm surface is arranged on the side of the diaphragm construction surface, and at least one conductive patch prepared by the preparation method according to any one of claims 1-6 is attached to the diaphragm from the middle attachment area to the outer ring direction through an adhesive layer; wherein, the conductive patch located in the diaphragm fold area is attached to the diaphragm surface along the undulating structure of the diaphragm in the fold area.

8. The method for preparing the attached conductive diaphragm structure as described in claim 7, characterized in that, The adhesive layer is applied to the diaphragm from the innermost area outwards. Specifically, the diaphragm is attached while maintaining its original, natural state in the diaphragm surround area. First attach one end, then use a silicone stick or miniature roller to gradually attach it to the other end; Alternatively, conductive stickers can be placed using visual or laser positioning, and then attached using vacuum adsorption or air compression molding methods.

9. The method for preparing the attached conductive diaphragm structure as described in claim 7, characterized in that, The process before attachment also includes: cleaning the diaphragm surface to remove impurities, as well as plasma treatment and irradiation treatment, to make the diaphragm surface dyn value > 48 dyn / cm.

10. The method for preparing the attached conductive diaphragm structure as described in claim 7, characterized in that, The process after attachment also includes a curing and molding step, which is accomplished by one or more of heating, light irradiation, ion irradiation, and moisture.

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