Built-in water channel-free power supply module based on top heat dissipation device and assembly process

Abstract

The invention relates to a built-in water channel-free power supply module based on a top heat dissipation device and an assembly process. The built-in water channel-free power supply module comprises a heat dissipation plate, a plurality of PCBA (Printed Circuit Board Assembly) plates and a plurality of heat conduction pieces, through the staggered stacking design between the heat dissipation plate and the PCBA plate, the PCBA plate comprises the power module plate, and the power semiconductor of the power module plate adopts top heat dissipation packaging, so that the size is effectively reduced and the power density is improved while effective heat dissipation is realized; the heat dissipation plate is provided with the plurality of profiling grooves and the plurality of profiling bosses, the PCBA plate comprises the plurality of heating components, the heating components abut against the bottoms of the profiling grooves or the upper surfaces of the profiling bosses through the heat conduction pieces, and the heating components transmit heat to the heat dissipation plate through the heat conduction pieces. The bottom of the heat dissipation plate abuts against an external high heat dissipation device after being polished to be smooth, so that efficient heat dissipation is achieved, a built-in water channel is omitted, the sealing technology is omitted, the technology is effectively simplified, cost is reduced, and meanwhile the risk of liquid leakage is fundamentally avoided.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, and more specifically, to a power module without built-in water channels based on a top heat dissipation device and its assembly process. Background Technology

[0002] With the rapid development of the new energy vehicle industry, the industry has placed increasingly higher expectations on the power density of all-in-one powertrain products. The integration width and depth of powertrain products are constantly increasing, with the aim of reducing the size and weight of powertrain products and helping to improve the driving range of vehicles. In other words, all-in-one powertrain products for new energy vehicles are developing towards miniaturization, lightweighting and integration.

[0003] Powertrain all-in-one products include a combined OBC (On-Board Charger) and DCDC (Direct-to-DC Converter) product. The traditional approach is to first install independent water channels inside the OBC and DCDC combination product to dissipate heat from the internal heat-generating components, and then perform an initial sealing of the water channels (referred to as the built-in water channel solution). Then, during the installation of the OBC and DCDC combination product into the all-in-one chassis, the water channel openings of the combination product and the powertrain all-in-one product are sealed a second time. This approach has drawbacks such as complex manufacturing processes, long cycle times, large size, heavy weight, high cost, and a high risk of coolant leakage. Summary of the Invention

[0004] The technical problem to be solved by this invention is that the liquid-cooled power module is large in size, complex in process, high in cost and has the risk of leakage. In view of the above-mentioned defects of the existing liquid-cooled power module with built-in water channel layout and sealed installation, this invention provides a power module without built-in water channel based on top heat dissipation device and assembly process.

[0005] The technical solution adopted by this invention to solve its technical problem is: A power module without built-in water channels based on a top heat dissipation device is constructed, comprising a heat sink, multiple PCBA boards, multiple connectors, and multiple thermal conductive components. The PCBA boards are parallel to each other and stacked alternately, and are electrically connected through the connectors. The heat sink is placed below the PCBA boards in parallel stacks and is provided with multiple contoured grooves and multiple contoured bosses. Each PCBA board includes multiple heat-generating components, and each heat-generating component abuts against the bottom of the contoured groove or the contoured boss through the thermal conductive component, so that the heat sink dissipates heat from the heat-generating component.

[0006] Furthermore, the PCBA board includes a control motherboard, a power module board, an HVAC filter board, and an HVDC filter board. The control motherboard is located on the top layer, and the power module board, the HVAC filter board, and the HVDC filter board are all located between the control motherboard and the heat sink.

[0007] Furthermore, it also includes a fixing component, through which the control motherboard, the module board, the HVAC filter board, and the HVDC filter board are fixedly connected to the heat sink.

[0008] Furthermore, the heat-generating components on the power module board include multiple power semiconductors, each of which is top-heat-dissipating packaged, and the top of the power semiconductor abuts against the contoured boss through the heat-conducting component.

[0009] Furthermore, the size and shape of the contoured boss and the contoured groove correspond to the heating element.

[0010] Furthermore, the groove wall is made of a thermally conductive metal material, which is used for heat dissipation and interference shielding.

[0011] Furthermore, the heat-conducting component is made of an insulating heat-conducting material.

[0012] Furthermore, the connector includes at least one or more of the following: connector, copper post, copper busbar, and pin header.

[0013] Furthermore, the bottom of the heat sink is smooth.

[0014] The present invention also provides an assembly process for a power module without built-in water channels based on a top heat dissipation device, comprising the following steps: S1. Clean the surface of the preset heat sink; S2. Coat the bottom of the pre-set contoured groove and the pre-set contoured boss on the heat sink with a pre-set heat-conducting component. S3. The preset power module board is mounted parallel to the heat sink, and the power semiconductor of the preset top heat sink package on the power module board abuts against the contoured boss through the heat-conducting component. S4. The preset HVDC filter board and the preset HVAC filter board are respectively installed in parallel on the heat sink. The heat-generating components on the preset HVDC filter board and the preset HVAC filter board are all in contact with the bottom of the contoured groove or the contoured boss through the heat-conducting component. The HVDC filter board, the HVAC filter board and the power module board are stacked alternately and electrically connected to each other through the preset connector. S5. The preset control motherboard is installed in parallel above the heat sink, the power module board, the HVDC filter board, and the HVAC filter board. The preset heat-generating components on the control motherboard abut against the bottom of the contoured groove or the contoured boss through the heat-conducting component, and the control motherboard is electrically connected to the power module board, the HVDC filter board, and the HVAC filter board through the connector.

[0015] The beneficial effects of this invention are as follows: This invention employs a parallel staggered stacking design between a heat sink and multiple PCBA boards. Each PCBA board includes a power module board and multiple power semiconductors. Each power semiconductor is top-heat-dissipating and packaged, which effectively ensures heat dissipation while significantly reducing the size of the power module, thereby increasing the power density of the all-in-one powertrain.

[0016] This invention utilizes a heat sink with multiple contoured grooves and contoured bosses. The PCBA board includes multiple heat-generating components, which abut against the bottom of the contoured grooves or the upper surface of the contoured bosses via heat-conducting components. The heat-generating components transfer heat to the heat sink through the heat-conducting components. After the bottom of the heat sink is polished smooth, it abuts against an external high-heat-dissipation device, thereby achieving efficient heat dissipation. This invention not only eliminates the water channels inside the liquid-cooled power module but also eliminates the sealing process between the liquid-cooled power module's water channel inlet and the multi-functional water channel inlet, greatly simplifying the manufacturing process and reducing processing costs. It also significantly reduces the weight of the liquid-cooled power module, thereby reducing the weight of the powertrain multi-functional assembly and improving the vehicle's driving range. Furthermore, because the liquid-cooled power module in this patented technology eliminates the internal water channels, the risk of coolant leakage is reduced to zero. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is a perspective view of a power module without built-in water channels based on a top heat dissipation device according to an embodiment of the present invention. Figure 2 This is an exploded view of a power module without built-in water channels based on a top heat dissipation device according to an embodiment of the present invention. Figure 3 This is a perspective view of a power module board according to an embodiment of the present invention; Figure 4 This is a perspective view of a heat sink in one embodiment of the present invention; Figure 5This is a flowchart illustrating the assembly process of a power module without built-in water channels based on a top heat dissipation device according to the present invention.

[0018] Labeling Explanation: 1. Heat sink; 2. Control main board; 3. Power module board; 4. HVAC filter board; 5. HVDC filter board; 6. Connector; 7. Heat-conducting component; 8. Contouring groove; 9. Contouring boss; 10. Heating element; 11. Power semiconductor; 12. Fixing component. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] Please refer to the attached document. Figures 1-4 This invention proposes a power module without built-in water channels based on a top heat dissipation device, including a heat sink 1, multiple PCBA boards, multiple connectors 6, and multiple heat-conducting components 7. The PCBA boards are parallel to each other and stacked alternately, and are electrically connected through the connectors 6. The heat sink 1 is placed in parallel stacks below the PCBA boards and is provided with multiple contoured grooves 8 and multiple contoured bosses 9. Each PCBA board includes multiple heat-generating components 10, and each heat-generating component 10 abuts against the bottom of the contoured groove 8 or the contoured boss 9 through the heat-conducting component 7, so that the heat sink 1 dissipates heat from the heat-generating component 10.

[0021] In this embodiment, a power module without built-in water channels based on a top heat dissipation device includes a heat sink 1, multiple PCBA boards, multiple connectors 6, multiple heat-conducting components 7, and multiple fixing components 12. The PCBA boards include a control motherboard 2, a power module board 3, an HVAC filter board 4, and an HVDC filter board 5, which are electrically connected to each other through the connectors 6. In this application, the connectors 6 include at least one or more of connectors, copper pillars, copper busbars, and pin headers. The control motherboard 2 is located on the top layer, and the heat sink 1 is located on the bottom layer, and they are stacked parallel to the control motherboard 2. The power module board 3, HVAC filter board 4, and HVDC filter board 5 are parallel to each other and stacked alternately, and are all located between the control motherboard 2 and the heat sink 1. The control motherboard 2, power module board 3, HVAC filter board 4, HVDC filter board 5, and heat sink 1 are all fixedly connected by the fixing components 12 to form a power module. In a specific embodiment, the fixing components 12 can be screws.

[0022] Furthermore, the heat sink 1 is provided with multiple contoured grooves 8 and multiple contoured protrusions 9. A heat-conducting element 7 is provided on the bottom of any contoured groove 8 and the upper surface of any contoured protrusion 9. In this application, the heat-conducting element 7 is made of an insulating thermally conductive material and is coated on the bottom of the contoured groove 8 and the upper surface of the contoured protrusion 9. The power module board 3 includes multiple power semiconductors 11. Each power semiconductor 11 is top-heat-dissipating encapsulated, and the top of the power semiconductor 11 abuts against the upper surface of the contoured protrusion 9 through the heat-conducting element 7. In addition, the control motherboard 2, the HVAC filter board 4, and the HVDC filter board 5 also include multiple heat-generating components 10. In this application, the heat-generating components 10 include transformers, inductors, capacitors, and various chips, etc., and respectively abut against the bottom of the contoured groove 8 or the upper surface of the contoured protrusion 9 through the heat-conducting element 7. The bottom of the heat sink 1 is polished smooth, which is conducive to close contact with the external high heat dissipation device. The power semiconductor 11 and the heat-generating component 10 transfer heat to the heat sink 1 through the heat conduction component 7. The heat sink 1 then transfers the heat to the external high heat dissipation device, which achieves efficient heat dissipation of the power module.

[0023] This invention utilizes a parallel staggered stacking design between a heat sink 1 and multiple PCBA boards. Each PCBA board includes a power module board 3 and multiple power semiconductors 11. Each power semiconductor 11 is top-heat-dissipating packaged, which effectively ensures heat dissipation while significantly reducing the size of the power module, thereby improving the power density of the all-in-one powertrain. This invention utilizes a heat sink 1 with multiple contoured grooves 8 and multiple contoured bosses 9. The PCBA board includes multiple heat-generating components 10, which abut against the bottom of the contoured grooves 8 or the upper surface of the contoured bosses 9 via heat-conducting components 7. The heat-generating components 10 transfer heat to the heat sink 1 through the heat-conducting components 7. After the bottom of the heat sink 1 is polished smooth, it abuts against an external high-heat-dissipation device, thereby achieving efficient heat dissipation. This invention not only eliminates the water channels inside the liquid-cooled power module but also eliminates the sealing process between the water channel inlet of the liquid-cooled power module and the water channel inlet of the multi-in-one powertrain, greatly simplifying the manufacturing process and reducing processing costs. It also significantly reduces the weight of the liquid-cooled power module, thereby reducing the weight of the multi-in-one powertrain and improving the overall vehicle range. Furthermore, since the liquid-cooled power module in this patented technology eliminates the water channels inside, the risk of coolant leakage is reduced to zero.

[0024] Please refer to Figures 1-4 The PCBA board includes a control motherboard 2, a power module board 3, an HVAC filter board 4, and an HVDC filter board 5, which are electrically connected to each other through connectors 6.

[0025] In practical implementation: PCBA board (Printed Circuit Board) A PCBA (Printed Circuit Board Assembly) is a functional component formed on a bare PCB board by precisely soldering, installing, and testing electronic components through surface mount technology (SMT) or dual in-line package (DIP) technology. The PCBA board includes a control motherboard 2, a power module board 3, an HVAC filter board 4, and an HVDC filter board 5. In this application, the control motherboard 2 is used to achieve precise control, status monitoring, and fault protection of the power module under all operating conditions, while also completing signal linkage between the various functional boards. The HVAC filter board 4 is a high-voltage AC filter board used to suppress electromagnetic interference and purify power on the high-voltage AC side of the power module, and is connected to the AC mains through a high-voltage DC input port. The power module board 3 is the core of the power module's power conversion, used to complete AC-DC (alternate current to direct current) rectification and DC-DC (direct current to direct current) step-down dual conversion, and outputs low-voltage DC power through a low-voltage DC output port. The HVDC filter board 5 is a high-voltage DC filter board used to suppress ripple and stabilize voltage on the high-voltage DC side of the power module, and outputs high-voltage DC power through a high-voltage DC output port.

[0026] Furthermore, the PCBA boards are electrically connected via connectors 6. In this application, connector 6 includes at least one or more of connectors, copper pillars, copper busbars, and pin headers. In one specific embodiment, when connectors are selected as connectors, a male connector is soldered onto one PCBA board and a female connector is soldered onto the other PCBA board at the location where electrical connection is required between the two PCBA boards. The electrical connection is achieved by inserting the male and female connectors. When copper pillars are selected as connectors, a copper pillar with an internal threaded hole is soldered onto one PCBA board, and a conductive through hole is reserved on the other PCBA board. The conductive through hole and the copper pillar are then connected by a copper pin with a thread. When copper busbars or pin headers are selected as connectors, a copper busbar or pin header is soldered onto one PCBA board, and a conductive through hole is reserved on the other PCBA board. The copper busbar or pin header is soldered into the conductive through hole to achieve electrical connection.

[0027] Please refer to Figures 1-4 The heat sink 1 is stacked in parallel below the PCBA board. The control motherboard 2, power module board 3, HVAC filter board 4, HVDC filter board 5 and heat sink 1 are all fixedly connected by fasteners 12 to form a power module.

[0028] In specific implementation: the control motherboard 2 is located on the top layer, the heat sink 1 is stacked in parallel below the PCBA board, the power module board 3, HVAC filter board 4 and HVDC filter board 5 are parallel to each other and stacked in a staggered manner, and are all located between the control motherboard 2 and the heat sink 1; in this application, the shape and size of the PCBA board are not limited, the PCBA boards are staggered and parallel but do not overlap at all, which is conducive to reserving space for each heat-generating device on the PCBA board to contact the heat sink 1, thereby effectively improving the heat dissipation effect; the stacked design can effectively increase the space utilization rate inside the power module, which is conducive to improving the power density of the power module.

[0029] Furthermore, the control motherboard 2, power module board 3, HVAC filter board 4, HVDC filter board 5, and heat sink 1 are all fixedly connected by fasteners 12. In one specific embodiment, the fasteners 12 can be screws. When two PCBA boards need to be fixed, a connecting post with an internal thread hole is provided on one PCBA board, and a corresponding mounting hole is reserved on the other PCBA board. The mounting hole and the connecting post are connected by screws to form a fixed connection. When one PCBA needs to be fixed to the heat sink 1, a connecting post with an internal thread hole is provided on the heat sink 1, and a corresponding mounting hole is reserved on the PCBA board. The mounting hole and the connecting post are connected by screws to form a fixed connection.

[0030] Please refer to Figures 1-4 The heat sink 1 has multiple contoured grooves 8 and multiple contoured protrusions 9. The bottom of any contoured groove 8 and the surface of any contoured protrusion 9 are provided with heat-conducting elements 7. The power module board 3 includes multiple power semiconductors 11. Each power semiconductor 11 adopts a top heat dissipation package, and the top of the power semiconductor 11 abuts against the upper surface of the contoured protrusion 9 through the heat-conducting elements 7. In addition, the control motherboard 2, HVAC filter board 4 and HVDC filter board 5 also include multiple heat-generating components 10, which abut against the bottom of the contoured groove 8 or the upper surface of the contoured protrusion 9 through the heat-conducting elements 7 respectively. The bottom of the heat sink 1 is polished smooth to achieve heat dissipation.

[0031] In specific implementation: The PCBA board includes multiple heat-generating components 10. In this application, the main heat-generating components 10 on the power module board 3 include multiple power semiconductors 11. Each power semiconductor 11 adopts a top heat dissipation package. In a specific embodiment, the power semiconductor 11 includes at least one or more of silicon carbide (SiC), insulated gate bipolar transistor (IGBT), gallium nitride (GaN), and metal oxide semiconductor field-effect transistor (MOSFET). The top heat dissipation package adopts a double-sided heat dissipation path. The bottom of the power semiconductor 11 contacts the circuit board for partial heat dissipation. The top of the power semiconductor 11 is encapsulated with a metal top cover. The heat generated by the power semiconductor 11 is directly transferred upward to the top encapsulated metal top cover through the internal insulating thermally conductive material (such as ceramic substrate, high-performance thermally conductive adhesive), thereby achieving efficient heat dissipation. In addition, the control motherboard 2, HVAC filter board 4 and HVDC filter board 5 also include multiple heat-generating components 10. In a specific embodiment, the heat-generating components 10 also include transformers, inductors and capacitors. It is worth noting that the heat-generating components 10 mentioned in this application refer to components with large heat generation. For components with small heat generation, the low heat generated does not affect the performance, so they are not treated separately.

[0032] Furthermore, the heat sink 1 is provided with multiple contoured grooves 8 and multiple contoured protrusions 9 according to the type, quantity, size, shape and position of the heat-generating components 10. In a specific embodiment, the heat sink 1 forms contoured grooves 8 through protrusions. The size of the contoured grooves 8 should be able to accommodate the heat-generating components 10. The protrusions, as the groove walls of the contoured grooves 8, are made of metal thermally conductive material. On the one hand, they have a certain heat dissipation effect, and on the other hand, they have a shielding effect on magnetic components such as transformers and inductors, that is, they have a certain shielding effect on electromagnetic interference. In addition, the shape of the upper surface of the contoured protrusions 9 should correspond to the contact surface of the heat-generating components 10. For example, when the heat-generating component 10 is a top-heat-dissipating packaged power semiconductor 11, the shape of the upper surface of the contoured protrusions 9 can be directly a plane; when the heat-generating component 10 is a ring-shaped inductor, the shape of the upper surface of the contoured protrusions 9 should be a corresponding curved surface, which is beneficial to improving the heat transfer effect.

[0033] Furthermore, a heat-conducting element 7 is provided on the bottom of any contoured groove 8 and the upper surface of any contoured boss 9. The heat-generating components 10 abut against the bottom of the contoured groove 8 or the upper surface of the contoured boss 9 via the heat-conducting element 7. In one specific embodiment, the heat-conducting element 7 is made of an insulating heat-conducting material and is coated on the bottom of the contoured groove 8 and the upper surface of the contoured boss 9. Magnetic heat-generating components 10, such as transformers and inductors, are located inside the contoured groove 8 and abut against the bottom of the contoured groove 8 via the heat-conducting element 7. Semiconductors and other non-magnetic heat-generating components 10 with top heat dissipation encapsulation can directly abut against the upper surface of the contoured boss 9 via the heat-conducting element 7. The heat-generating components 10 transfer heat to the heat sink 1 via the heat-conducting element 7. The bottom of the heat sink 1 is polished smooth and designed for close contact with an external high-efficiency heat dissipation device, which achieves efficient heat dissipation for the power module.

[0034] Please refer to the attached document. Figure 5 The present invention also provides a control method for a power module without built-in water channels based on a top heat dissipation device, comprising the following steps: S1. Clean the surface of the preset heat sink 1; S2. Apply a pre-set heat-conducting component 7 to the bottom of the pre-set contoured groove 8 and the pre-set contoured boss 9 on the heat sink 1. S3. The preset power module board 3 is installed parallel to the heat sink 1, and the preset top heat sink packaged power semiconductor 11 on the power module board 3 abuts against the contoured boss 9 through the heat conduction component 7. S4. The preset HVDC filter board 5 and the preset HVAC filter board 4 are respectively installed in parallel on the heat sink 1. The preset heat-generating components 10 on the HVDC filter board 5 and the HVAC filter board 4 are all in contact with the bottom of the contoured groove 8 or the contoured boss 9 through the heat-conducting component 7. The HVDC filter board 5, the HVAC filter board 4 and the power module board 3 are stacked alternately and electrically connected to each other through the preset connector 6. S5. The preset control motherboard 2 is installed in parallel above the heat sink 1, power module board 3, HVDC filter board 5 and HVAC filter board 4. The preset heat-generating components 10 on the control motherboard 2 abut against the bottom of the contoured groove 8 or the contoured boss 9 through the heat-conducting component 7, and the control motherboard 2 is electrically connected to the power module board 3, HVDC filter board 5 and HVAC filter board 4 through the connector 6.

[0035] In specific implementation: First, the surface of the preset heat sink 1 is cleaned, including maintenance operations such as cleaning dust, oil, lint, and other impurities from the heat sink; then, the bottom of the preset contoured groove 8 and the contoured protrusion 9 on the heat sink 1 are coated with a preset heat-conducting component 7, wherein the heat-conducting component 7 is an insulating and thermally conductive material; next, the preset power module board 3 is stacked parallel on the heat sink 1, and the preset top heat-dissipating packaged power semiconductor 11 on the power module board 3 is abutted against the contoured protrusion 9 through the heat-conducting component 7; next, the preset HVDC filter board 5 and the preset HVAC filter board 4 are stacked parallel on the heat sink 1, and the preset heat-generating components 10 on the HVDC filter board 5 and the HVAC filter board 4 are abutted against the bottom of the contoured groove 8 or the contoured protrusion 9 through the heat-conducting component 7. In one specific embodiment, the installation order of the HVDC filter board 5 and the HVAC filter board 4 is not limited, and they are stacked in parallel and staggered with the power module board 3. Then, the preset control motherboard 2 is installed in parallel above the heat sink 1, the power module board 3, the HVDC filter board 5 and the HVAC filter board 4, and the preset heat-generating components 10 on the control motherboard 2 are connected to the bottom of the contoured groove 8 or the contoured boss 9 through the heat-conducting component 7. The control motherboard 2, the power module board 3, the HVDC filter board 5 and the HVAC filter board 4 are electrically connected through the connector 6, and the control motherboard 2, the power module board 3, the HVDC filter board 5, the HVAC filter board 4 and the heat sink 1 are fixedly connected through the fastener 12, thereby completing the assembly of the entire power module.

[0036] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0037] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A power module without built-in water channels based on a top heat dissipation device, characterized in that, The device includes a heat sink, multiple PCBA boards, multiple connectors, and multiple thermal conductive components. The PCBA boards are parallel to each other and stacked alternately, and are electrically connected through the connectors. The heat sink is placed below the PCBA boards in parallel stacks and has multiple contoured grooves and multiple contoured bosses. Each PCBA board includes multiple heat-generating components, and each heat-generating component abuts against the bottom of the contoured groove or the contoured boss through the thermal conductive component, so that the heat sink dissipates heat from the heat-generating component.

2. A power module without built-in water channels based on a top heat dissipation device according to claim 1, characterized in that, The PCBA board includes a control motherboard, a power module board, an HVAC filter board, and an HVDC filter board. The control motherboard is located on the top layer, and the power module board, the HVAC filter board, and the HVDC filter board are all located between the control motherboard and the heat sink.

3. A power module without built-in water channels based on a top heat dissipation device according to claim 2, characterized in that, It also includes a fixing component, through which the control motherboard, the module board, the HVAC filter board and the HVDC filter board are fixedly connected to the heat sink.

4. A power module without built-in water channels based on a top heat dissipation device according to claim 2, characterized in that, The heat-generating components on the power module board include multiple power semiconductors, each of which is top-heat-dissipating packaged, and the top of the power semiconductor abuts against the contoured boss through the heat-conducting component.

5. A power module without built-in water channels based on a top heat dissipation device according to claim 1, characterized in that, The size and shape of the contoured boss and the contoured groove correspond to the heating element.

6. A power module without built-in water channels based on a top heat dissipation device according to claim 5, characterized in that, The groove wall is made of thermally conductive metal and is used for heat dissipation and interference shielding.

7. A power module without built-in water channels based on a top heat dissipation device according to claim 1, characterized in that, The heat-conducting component is made of an insulating and thermally conductive material.

8. A power module without built-in water channels based on a top heat dissipation device according to claim 1, characterized in that, The connector includes at least one or more of the following: connector, copper post, copper busbar, and pin header.

9. A power module without built-in water channels based on a top heat dissipation device according to claim 1, characterized in that, The bottom of the heat sink is smooth.

10. An assembly process for a power module without built-in water channels based on a top heat dissipation device, characterized in that, Includes the following steps: S1. Clean the surface of the preset heat sink; S2. Coat the bottom of the pre-set contoured groove and the pre-set contoured boss on the heat sink with a pre-set heat-conducting component. S3. The preset power module board is mounted parallel to the heat sink, and the power semiconductor of the preset top heat sink package on the power module board abuts against the contoured boss through the heat-conducting component. S4. The preset HVDC filter board and the preset HVAC filter board are respectively installed in parallel on the heat sink. The heat-generating components on the preset HVDC filter board and the preset HVAC filter board are all in contact with the bottom of the contoured groove or the contoured boss through the heat-conducting component. The HVDC filter board, the HVAC filter board and the power module board are stacked alternately and electrically connected to each other through the preset connector. S5. The preset control motherboard is installed in parallel above the heat sink, the power module board, the HVDC filter board, and the HVAC filter board. The preset heat-generating components on the control motherboard abut against the bottom of the contoured groove or the contoured boss through the heat-conducting component, and the control motherboard is electrically connected to the power module board, the HVDC filter board, and the HVAC filter board through the connector.

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