Air-liquid mixing type heat dissipation system and electronic equipment applying air-liquid mixing type heat dissipation system

Abstract

The invention provides a wind-liquid mixing type heat dissipation system and electronic equipment applying the same, and relates to the technical field of electronic equipment heat management, and the wind-liquid mixing type heat dissipation system adopts a partition independent heat dissipation strategy for equipment comprising a high-heating multi-layer stacked chip and other electronic devices. The system is provided with a liquid immersion jet cooling assembly, a plurality of layers of stacked chips are wrapped by a sealing shell, and cooling liquid directly impacts the surfaces of the chips through array jet holes by utilizing an internal flow channel distribution component so as to perform efficient heat exchange; meanwhile, an air cooling heat dissipation assembly comprising heat dissipation fins and a fan is arranged, and forced convection heat dissipation is carried out on other electronic devices. And internal flow channels of the two assemblies are physically isolated from air channels. According to the invention, the thermal island problem of the three-dimensional stacked chip and the collaborative heat dissipation problem of the hybrid power consumption device are effectively solved, and the system has the advantages of strong heat dissipation capability, low system energy consumption and high integration level.

Description

Technical Field

[0001] This invention relates to the field of thermal control technology for electronic devices, and more particularly to a wind-liquid hybrid heat dissipation system and an electronic device using the same. Background Technology

[0002] Integrated communication and navigation devices and modules are rapidly developing towards miniaturization, high integration, low power consumption, and intelligence. Through heterogeneous integration of silicon-based and compound semiconductors and multi-functional chip design, communication, navigation, and sensing functions are integrated into a single chip or module. The system achieves significant optimization in terms of size, cost, and collaborative efficiency, and is gradually evolving towards multi-band, multi-mode compatibility, and software reconfigurability.

[0003] On the one hand, technologies such as heterogeneous integration and microsystem packaging have further advanced Moore's Law, reducing system size, improving packaging efficiency, shortening interconnect length, alleviating interconnect latency, and improving system performance. At the same time, communication, navigation, and sensing functions are deeply integrated into a single chip or module, achieving high hardware integration and performance synergy, and making it possible to build highly complex systems that combine multiple technologies. On the other hand, through software-defined radio, artificial intelligence algorithms, and other technologies, systems are gradually acquiring dynamic reconfiguration, autonomous cognition, and anti-interference capabilities to adapt to complex electromagnetic environments and diverse application scenarios, covering fields such as the Internet of Things, 5G / 6G communication, and low-orbit satellite internet.

[0004] However, with the increase in integration density, the power density increases significantly. Furthermore, with the application of third-generation semiconductor materials such as GaN, the local heat flux density at hotspots can reach as high as 250 W / cm². 2 Furthermore, by stacking multiple layers of carrier plates and cores along the axial direction, the internal high heat flux density devices have fewer components in direct vertical contact, lacking direct heat dissipation paths. Heat cannot be dissipated to the outside of the module via conventional large-area metal heat-conducting plates, leading to heat accumulation. This causes the device temperature to exceed its normal operating temperature, accelerating electrode degradation, reducing device lifespan, and even causing malfunction. The heat dissipation problems associated with high integration, miniaturization, multiple heat sources, and high heat flux density have become one of the main factors restricting the further development and performance improvement of integrated conduction / interference devices and modules, urgently requiring breakthroughs in new structures, materials, and processes.

[0005] Currently, cooling technology has gradually evolved from traditional long-distance conduction heat dissipation to near-junction heat dissipation of chips. This shifts the cold end from the traditional metal cold plate to the adjacent position of the power chip (package shell or substrate), shortening the heat transfer path and thus reducing thermal resistance. At the same time, direct cooling is gradually replacing traditional indirect cooling, reducing the heat transfer interface and thus reducing interface thermal resistance to improve heat dissipation performance.

[0006] Patent CN106356344A discloses a wind-cooled heat dissipation structure and manufacturing method based on three-dimensional stacked packaging. Air carries away heat through through holes and air channels that penetrate each substrate layer, solving the problem of overheating of low-power chips in the inner layer of three-dimensional stacked packaging. However, the wind-cooled heat dissipation technology using air as the cooling medium cannot meet the high heat flux density heat dissipation requirements of high-power chips under future highly integrated packaging structures.

[0007] Patent CN114783970A discloses a three-dimensional heterogeneous microfluidic cooling device for high-power radio frequency arrays. It uses a substrate with embedded microfluidic channels to achieve liquid cooling of high-power array chips, which solves the heat dissipation requirements of single-layer single-point or array heat-generating chips. However, its heat dissipation design is mainly based on the chip layout on the same plane, which cannot solve the three-dimensional heat dissipation bottleneck caused by the stacking of multiple high-power heat-generating chips under three-dimensional stacked packaging.

[0008] Patent CN116913872A discloses an embedded microchannel liquid cooling heat dissipation architecture for multi-layer stacked high-power chips. It designs planar and three-dimensional flow channels according to the heat dissipation requirements of different chips, achieving efficient heat dissipation of multi-layer stacked chips. However, the three-dimensional flow channels are processed on silicon wafers using dry etching or wet etching, which results in high processing costs. The substrates are connected to achieve watertight connections between layers through eutectic bonding, silicon-silicon bonding, or sealant, which requires high process standards.

[0009] In summary, the main problems existing in the patents and designs include: (1) Forced air convection cooling technology cannot meet the high heat flux density cooling requirements of high-power chips under future high-integration packaging structures, and has disadvantages such as high energy consumption and high noise. Replacing traditional air-cooled heat sinks with liquid cooling plates to cool high-power chips often requires the use of heat conduction pipes to transfer the heat of the chip to the liquid cooling plate, which is not conducive to the planning and layout of other devices on the chip substrate, nor is it conducive to improving the system integration. (2) Existing indirect liquid cooling heat dissipation technology requires heat to be transferred to the coolant through intermediate media such as cold plates. The coolant and the heat-generating element do not come into direct contact. Instead, the cold plate is used as the heat transfer component between the two. In addition, the thermal grease and other materials coated on the cold plate have large thermal resistance and contact thermal resistance, which limits the heat dissipation efficiency. For high-power application scenarios, more complex cold plate design, higher coolant flow rate or larger system may be required to meet the heat dissipation requirements. (3) Existing technologies mainly address the heat dissipation needs of single-layer, single-point, or array-heating chips. The heat dissipation design is mainly based on the chip layout on the same plane, which cannot solve the three-dimensional heat dissipation bottleneck and "thermal island" problem caused by the stacking of multiple high-power heat-generating chips under three-dimensional stacked packaging. Furthermore, the three-dimensional flow channel for heat dissipation of multi-layer stacked chips has problems such as high process requirements and high processing costs. Summary of the Invention

[0010] The technical problem to be solved by this invention is how to achieve reasonable and effective heat dissipation for high-power multilayer stacked chips and low-power devices that coexist in highly integrated electronic devices with huge differences in power consumption and heat flux density. This invention proposes to provide a wind-liquid hybrid heat dissipation system and an electronic device that uses it.

[0011] According to an embodiment of the present invention, a hybrid air-liquid cooling system is applied to an electronic device comprising multilayer stacked chips and electronic components. The hybrid air-liquid cooling system includes: A liquid immersion jet cooling assembly includes a housing and an inlet and an outlet disposed on the housing. The housing is sealed and mounted on a substrate that carries the multilayer stacked chip to form a sealed cavity covering the multilayer stacked chip. Coolant introduced into the sealed cavity through the inlet impacts the multilayer stacked chip to dissipate heat. An air-cooled heat dissipation assembly includes a heat dissipation base plate, heat dissipation fins disposed on the heat dissipation base plate, and a fan. The fan drives airflow through the heat dissipation fins to dissipate heat from the electronic device. The internal flow channels of the liquid immersion jet cooling component are isolated from the internal air channels of the air-cooled heat dissipation component.

[0012] According to some embodiments of the present invention, the heat flux density of the multilayer stacked chip is greater than that of the electronic device.

[0013] In some embodiments of the present invention, the liquid immersion jet cooling assembly further includes: a flow channel distribution member disposed within the housing, the flow channel distribution member dividing the sealed cavity into: The jet cavity is located between the bottom wall of the multilayer stacked chip and the flow channel distribution component; The liquid inlet chamber is located between the top wall of the housing and the top wall of the flow channel distribution component, and the liquid inlet chamber is connected to the liquid inlet. The flow channel distribution component is provided with an array of jet holes, which connect the liquid inlet chamber and the jet chamber, and are used to spray coolant onto the surface of the multilayer stacked chip.

[0014] According to some embodiments of the present invention, the flow channel distribution member internally defines a liquid outlet cavity communicating with the liquid outlet, and the bottom wall of the flow channel distribution member is provided with a return groove communicating with the liquid outlet cavity and the jet cavity.

[0015] In some embodiments of the present invention, the array arrangement of the jet holes is configured to correspond to the hot spot locations of the active regions of the multilayer stacked chip.

[0016] According to some embodiments of the present invention, the liquid immersion jet cooling assembly is manufactured using integrated 3D printing technology.

[0017] In some embodiments of the present invention, the surface of the heat dissipation base plate of the air-cooled heat dissipation assembly is provided with a heat-conducting protrusion, and the electronic device is attached to the heat-conducting protrusion through a heat-conducting interface material.

[0018] According to some embodiments of the present invention, the multilayer stacked chip is a three-dimensional stacked packaged chip.

[0019] An electronic device according to an embodiment of the present invention includes the air-liquid hybrid heat dissipation system as described above, wherein the air-cooled heat dissipation component constitutes the housing or part of the housing of the electronic device.

[0020] According to some embodiments of the present invention, the electronic device is an integrated anti-interference communication module, the air-cooled heat dissipation component is the upper cover plate of the integrated anti-interference communication module, and the integrated anti-interference communication module is further provided with a heat-conducting partition, which separates the inner cavity of the integrated anti-interference communication module and conducts the heat of the electronic device to the air-cooled heat dissipation component.

[0021] The present invention has the following beneficial effects: This invention employs a heterogeneous, partitioned, independent heat dissipation architecture using liquid immersion jets for direct impact cooling of multi-layered stacked chips. This eliminates conduction and interfacial thermal resistance, significantly reducing chip junction temperature and effectively solving the "thermal island" problem of three-dimensional stacked structures. Simultaneously, air cooling is only applied to low-power devices, avoiding redundant power consumption and cost associated with full-system liquid cooling, and significantly improving cooling medium utilization and system energy efficiency. The liquid cooling component is integrally sealed using 3D printing, completely decoupled from the air-cooled heatsink in both physical and thermal paths. This achieves deep integration with the electronic device housing structure while providing the system with superior compactness and device compatibility. Furthermore, the jet aperture array can target hot spots for enhanced heat dissipation, and the coolant supports flexible single-phase / two-phase selection, resulting in comprehensive technological advancements in heat dissipation performance, integration, energy consumption, and scenario adaptability. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the installation of the liquid immersion jet cooling assembly in a wind-liquid hybrid heat dissipation system according to an embodiment of the present invention; Figure 2 This is a schematic internal cross-sectional view of the liquid immersion jet cooling component of the air-liquid hybrid heat dissipation system according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the internal array of jet holes and return channels of the liquid immersion jet cooling component of the air-liquid hybrid heat dissipation system according to an embodiment of the present invention; Figure 4This is a schematic diagram of the air-cooled heat dissipation component of the air-liquid hybrid heat dissipation system according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the heat-conducting partition of the air-liquid hybrid heat dissipation system according to an embodiment of the present invention; Figure 6 A schematic diagram of an anti-interference integrated communication module for a hybrid air-liquid cooling system according to an embodiment of the present invention; Figure 7 A schematic diagram of the sealed housing of the anti-interference communication and conduction integrated module of the air-liquid hybrid heat dissipation system according to an embodiment of the present invention; Figure 8 This is a schematic diagram showing the installation positions of the internal digital PCB board, RF PCB board, and thermally conductive partition of the anti-interference communication and conduction integrated module of the air-liquid hybrid heat dissipation system according to an embodiment of the present invention. Figure 9 This is a schematic diagram of the structure of the air-cooled radiator that uses only forced air convection for heat dissipation; Figure 10 This is a schematic diagram of the temperature distribution simulation results of an RF PCB board using only forced air convection cooling. Figure 11 This is a schematic diagram of the simulation results of the temperature distribution on the radio frequency PCB board of the air-liquid hybrid heat dissipation system of the present invention.

[0023] Figure label: The liquid immersion jet cooling assembly 1 includes a housing 101, a flow channel distribution component 102, a liquid inlet 11, a liquid outlet 12, a liquid inlet chamber 13, a liquid outlet chamber 14, a jet chamber 15, a jet orifice 16, a return groove 17, and a sealing groove 18. 2. Multilayer stacked chip; 3. Substrate; 4. Sealing ring. Air-cooled heat dissipation assembly 5, first fan 51, second fan 52, first set of heat dissipation fins 53, second set of heat dissipation fins 54, mounting boss 55, third fan 56, third set of heat dissipation fins 57. Thermal conductive partition 6, Anti-interference integrated communication and conduction module 7, module frame 71, lower cover plate 72, digital PCB board 73, RF PCB board 74. Thermally conductive boss 8. Detailed Implementation

[0024] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0025] The steps described in the specification and the flowcharts in the accompanying drawings of this invention are not necessarily to be strictly followed according to the step numbers; the execution order of the steps can be changed. Furthermore, certain steps can be omitted, multiple steps can be combined into one step, and / or one step can be broken down into multiple steps.

[0026] Forced air convection or indirect liquid cooling represent traditional heat dissipation methods, while hybrid air-liquid cooling is a novel approach for high-power devices. This invention provides a hybrid air-liquid cooling system based on forced air convection and liquid immersion jet cooling: a liquid immersion jet cooling structure is designed for high-power multilayer stacked chips with high heat generation, while a forced air convection cooling structure is designed for other low-power devices with lower heat generation. This addresses the problems existing in the prior art, achieving efficient cooling for both high-power multilayer stacked chips and low-power devices. Simultaneously, it reduces the additional space occupied within the device and improves the integration of the cooling system.

[0027] like Figure 1 As shown, the air-liquid hybrid heat dissipation system according to an embodiment of the present invention is applied to an electronic device comprising a multilayer stacked chip 2 and electronic components. The term "electronic components" here can be understood as other heat-generating devices in the electronic device besides the multilayer stacked chip 2. Typically, the multilayer stacked chip 2 generates a larger amount of heat, while the electronic components generate relatively less heat.

[0028] Combination Figure 6 As shown, the air-liquid hybrid heat dissipation system includes: a liquid immersion jet cooling component 1 and an air-cooled heat dissipation component 5.

[0029] Among them, such as Figure 1 As shown, the liquid immersion jet cooling assembly 1 includes a housing 101 and a liquid inlet 11 and a liquid outlet 12 disposed on the housing 101. The housing 101 is sealed and mounted on a substrate 3 that supports the multilayer stacked chips 2 to form a sealed cavity covering the multilayer stacked chips 2. Coolant introduced into the sealed cavity through the liquid inlet 11 impacts the multilayer stacked chips 2 to dissipate heat. For example, the liquid inlet 11 and the liquid outlet 12 can be opened on the side wall of the housing 101. Both the liquid inlet 11 and the liquid outlet 12 are provided with internal threads, which can achieve a reliable connection with a fluid connector, which helps to form a reliable sealed connection with an external cold source or liquid supply system, and can improve the operation of rapid connection.

[0030] It should be noted that, as Figure 1 and Figure 2As shown, the liquid immersion jet cooling assembly 1 of the present invention is specifically designed for immersion jet cooling of high-power multilayer stacked chips 2. A sealing groove 18 is provided on the bottom surface, and a sealing ring 4 is arranged during use to form a reliable sealed connection. A detachable connection is formed between the assembly and the substrate 3 surface via bolts. The multilayer stacked chip 2 can be a bare chip or a packaged chip, and the substrate 3 can be an organic substrate, a ceramic substrate, or a PCB board.

[0031] Coolants include, but are not limited to, water-based coolants (such as deionized water, mixtures of water and ethylene glycol / propylene glycol), fluorinated fluids (such as chlorofluorocarbons, hydrofluorocarbons, etc.), and insulating oils (such as mineral oil, silicone oil, etc.), all possessing insulating, low-corrosive, and high thermal conductivity properties. The coolant within the liquid-immersed jet cooling assembly 1 can flow in a single phase or undergo a phase change to flow in a two-phase manner, utilizing the latent heat of the coolant to further enhance heat dissipation capacity and adapt to application requirements under higher heat flux densities.

[0032] The air-cooled heat dissipation component 5 is specifically designed for forced air convection cooling of low-power electronic devices. For example... Figure 4 As shown, the air-cooled heat dissipation assembly 5 includes a heat dissipation base plate, heat dissipation fins disposed on the heat dissipation base plate, and a fan. The heat dissipation base plate is thermally connected to the electronic device, and the fan drives airflow through the heat dissipation fins to dissipate heat from the electronic device. The internal flow channels of the liquid immersion jet cooling assembly 1 are isolated from the internal airflow channels of the air-cooled heat dissipation assembly 5.

[0033] According to an embodiment of the present invention, a liquid immersion jet cooling component 1 is designed for multi-layer stacked chips 2 that generate a large amount of heat. This component encloses the multi-layer stacked chips 2 in a sealed space, allowing for direct heat dissipation through the impact of coolant, thus improving the heat dissipation effect of the multi-layer stacked chips 2. For electronic devices that generate relatively less heat, air cooling is used to ensure their heat dissipation requirements are met. This invention combines the advantages of forced air convection and liquid immersion jet cooling, significantly improving the heat dissipation efficiency and cooling medium utilization rate of the liquid immersion jet cooling system, and reducing the limitations of a single heat dissipation method.

[0034] According to some embodiments of the present invention, the heat flux density of the multilayer stacked chip 2 is greater than that of the electronic device. That is, the heat generated by the multilayer stacked chip 2 is greater than that generated by the electronic device, requiring a stronger cooling and heat dissipation effect.

[0035] In some embodiments of the present invention, such as Figure 2 As shown, the liquid immersion jet cooling assembly 1 further includes a flow channel distribution member 102 disposed in the housing 101, which divides the sealed cavity into a jet cavity 15 and a liquid inlet cavity 13.

[0036] Among them, such as Figure 2As shown, the jet cavity 15 is located between the bottom wall of the multilayer stacked chip 2 and the flow channel distribution member 102, and the liquid inlet cavity 13 is located between the top wall of the housing 101 and the top wall of the flow channel distribution member 102. The liquid inlet cavity 13 is connected to the liquid inlet 11. The flow channel distribution member 102 is provided with an array of jet holes 16, which connect the liquid inlet cavity 13 and the jet cavity 15, for spraying coolant onto the surface of the multilayer stacked chip 2.

[0037] It should be noted that, referring to Figure 1 and Figure 2 As shown, the multilayer stacked chip 2 is enclosed in a sealed cavity within the housing 101. Furthermore, a certain space for coolant flow exists between the sidewall of the multilayer stacked chip 2 and the housing 101. Through the arrayed jet holes 16, the insulating coolant directly impacts the high-power multilayer stacked chip 2 for direct cooling and heat dissipation, eliminating the interfacial thermal resistance of the heat transfer interface of the multilayer stacked chip 2. This significantly improves the convective heat transfer coefficient, uniformizes the temperature of the multilayer stacked chip 2, and reduces thermal stress. In addition, less cooling fluid is required, resulting in improved heat dissipation efficiency, reduced pump power consumption, and lower system energy consumption, thus enhancing system reliability. Moreover, the coolant in the space between the sidewall of the multilayer stacked chip 2 and the housing 101 also immerses the multilayer stacked chip 2 in the coolant, achieving cooling and heat dissipation of the sidewall of the multilayer stacked chip 2. Therefore, not only is surface heat dissipation of the multilayer stacked chip 2 achieved, but also axial immersion heat dissipation of each layer of the multilayer stacked chip 2 is realized, thereby greatly improving the heat dissipation effect of the multilayer stacked chip 2.

[0038] According to some embodiments of the present invention, such as Figure 2 As shown, the flow distribution component 102 also defines an outlet chamber 14 that communicates with the outlet 12. The bottom wall of the flow distribution component 102 is provided with a return groove 17 that connects the outlet chamber 14 and the jet chamber 15. Thus, the coolant after heat exchange can flow into the outlet chamber 14 through the return groove 17 and then flow out from the outlet 12, realizing the flow and renewal of the coolant.

[0039] In some embodiments of the present invention, the array arrangement of the jet holes 16 is configured to correspond to the hot spot locations of the active area of ​​the multilayer stacked chip 2. It is understood that by using a custom-designed jet hole array to achieve directional cooling of the hot spot in the active area of ​​the high-power multilayer stacked chip, localized overheating can be effectively avoided; by setting the jet holes 16 to correspond to the hot spot locations, the coolant can be sprayed to more precise heat dissipation locations, improving the heat dissipation effect.

[0040] According to some embodiments of the present invention, the liquid immersion jet cooling assembly 1 is manufactured using integrated 3D printing technology. It should be noted that the liquid immersion jet cooling assembly 1 of the present invention has a relatively complex structure, making direct processing difficult, complex, and costly. The present invention employs an integrated design and utilizes 3D printing technologies such as selective laser sintering, photopolymerization, direct metal powder laser sintering, and laser cladding rapid manufacturing for direct processing. This ensures that the overall sealing performance meets requirements without causing excessive internal structural deformation, thus guaranteeing that its performance meets design requirements. Furthermore, the integrated design helps improve the integration of the air-liquid hybrid cooling system.

[0041] In some embodiments of the present invention, such as Figure 4 As shown, the surface of the heat dissipation base plate of the air-cooled heat dissipation assembly 5 is provided with thermally conductive protrusions 8, and electronic components are attached to the thermally conductive protrusions 8 through a thermally conductive interface material. This allows the heat from the electronic components to be conducted to the thermally conductive protrusions 8, thereby achieving heat dissipation through air cooling.

[0042] like Figure 4 As shown, the air-cooled heat dissipation assembly 5 includes a first set of heat dissipation fins 53 and a second set of heat dissipation fins 54 located on its upper surface, as well as a first fan 51 and a second fan 52 fixed to the mounting boss 55 on the upper surface of the heat dissipation base plate by fasteners.

[0043] According to some embodiments of the present invention, the multilayer stacked chip 2 is a three-dimensional stacked packaged chip.

[0044] like Figure 6 As shown, the electronic device according to an embodiment of the present invention includes the above-described air-liquid hybrid heat dissipation system, wherein the air-cooled heat dissipation component 5 constitutes the housing or part of the housing of the electronic device. It should be noted that, in the electronic device of the present invention, the heat dissipation base plate 3 of the air-cooled heat dissipation component 5 can be designed as the housing or part of the housing of the electronic device, thereby improving the integration and miniaturization of the electronic device.

[0045] According to some embodiments of the present invention, such as Figure 6 As shown, the electronic device is an anti-interference communication and conduction integrated module 7, and the air-cooled heat dissipation component 5 is the upper cover plate of the anti-interference communication and conduction integrated module 7. The anti-interference communication and conduction integrated module 7 is also provided with a heat-conducting partition 6. The heat-conducting partition 6 separates the inner cavity of the anti-interference communication and conduction integrated module 7 and conducts the heat of the electronic device to the air-cooled heat dissipation component 5.

[0046] The present invention will now be described in detail with reference to the accompanying drawings and three specific embodiments. It should be understood that the following description is merely exemplary and should not be construed as a specific limitation of the present invention.

[0047] Example 1: This embodiment describes a hybrid air-liquid cooling system.

[0048] See Figure 1 and Figure 2 As shown, the liquid immersion jet cooling assembly 1 is specifically designed for immersion jet cooling of high-power multilayer stacked chips 2. It has a sealing groove 18 on its bottom surface, and a sealing ring 4 is installed during use to form a reliable sealed connection. It can also form a detachable connection with the surface of the substrate 3. Figure 1 As shown, threaded connections can be achieved through fasteners such as bolts. The high-power multilayer stacked chip 2 can be a bare chip or a packaged chip, and the substrate 3 can be an organic substrate, a ceramic substrate, or a PCB board.

[0049] See Figure 2 To facilitate the circulation of coolant in the liquid immersion jet cooling assembly 1, its side wall has a coolant inlet 11 and an outlet 12, both of which are provided with internal threads to achieve a reliable connection with the fluid connector. This helps to form a reliable sealed connection with an external cold source or liquid supply system, removes heat through the circulation of coolant, and also improves the operation of rapid connection.

[0050] See Figure 2 and Figure 3 The flow distribution component 102 inside the liquid immersion jet cooling assembly 1 divides the sealed cavity into three parts from top to bottom: liquid inlet chamber 13, liquid outlet chamber 14, and jet chamber 15. The liquid inlet chamber 13 is connected to the liquid inlet 11. An array of jet holes 16 are provided at the bottom of the liquid inlet chamber 13. The jet holes 16 penetrate the bottom of the liquid inlet chamber 13, the liquid outlet chamber 14, and the top of the jet chamber 15. A return channel 17 is arranged around the jet holes 16. The return channel 17 penetrates the top of the jet chamber 15 and the bottom of the liquid outlet chamber 14. The liquid outlet chamber 14 is connected to the liquid outlet 12.

[0051] The jet holes 16 are arranged in an 8×8 array. Furthermore, the customized jet hole 16 array design can realize the directional cooling of the hot spots in the active area of ​​the high-power multilayer stacked chip 2, which can greatly improve the heat dissipation efficiency of the cooling system and effectively avoid the occurrence of local overheating.

[0052] The liquid immersion jet cooling component 1 adopts an integrated design and is directly processed using 3D printing technologies such as selective laser sintering, photopolymerization molding, direct metal powder laser sintering, and laser cladding rapid manufacturing. This ensures that the overall sealing and structural rigidity meet the usage requirements without causing excessive internal structural deformation, thus guaranteeing that its performance meets the design requirements.

[0053] Furthermore, the present invention provides a wind-liquid hybrid heat dissipation system based on forced air convection and liquid immersion jet, which uses liquid immersion jet to directly dissipate heat from the high-power multilayer stacked chip 2. The thermal conductivity of the liquid immersion jet cooling component 1 has little impact on the heat dissipation effect. It can be made of metal materials or alloys with high thermal conductivity, or non-metallic materials or polymer materials with low thermal conductivity.

[0054] See Figure 4 The air-cooled heat dissipation component 5 is specifically designed for heat dissipation of low-power devices. It includes a first set of heat dissipation fins 53 and a second set of heat dissipation fins 54 located on its upper surface, as well as a first fan 51 and a second fan 52. It is fixed to the mounting boss 55 on the upper surface of the air-cooled heat dissipation component 5 by fasteners, with a gap maintained between it and the upper surface to form an air intake channel.

[0055] Preferably, the first fan 51 and the second fan 52 are both axial fans, which are fixed to the first set of heat dissipation fins 53 and the second set of heat dissipation fins 54 respectively in relative positions. They have air intake at the top and air exhaust at the bottom, driving cold air to flow through the first set of heat dissipation fins 53 and the second set of heat dissipation fins 54 respectively to remove heat.

[0056] Preferably, the lower surface of the air-cooled heat dissipation component 5 is provided with a heat-conducting protrusion 8, the heat-generating device is attached to the heat-conducting protrusion 8, and a high thermal conductivity graphene heat-conducting pad is provided on the contact surface to reduce the contact thermal resistance and form an efficient heat conduction channel to conduct heat to the upper surface of the air-cooled heat dissipation component 5 and carry it away with the help of cold air.

[0057] See Figure 5 Thermally conductive protrusions 8 are provided on the upper (lower) surface of the thermally conductive partition 6. The heating device is attached to the thermally conductive protrusions 8. A high thermal conductivity graphene thermally conductive pad is provided on the contact surface to reduce the contact thermal resistance and form an efficient heat conduction channel.

[0058] Preferably, the air-cooled heat dissipation component 5 and the heat-conducting partition 6 are made of lightweight aluminum alloy or titanium alloy.

[0059] Example 2: This embodiment uses a wind-liquid hybrid heat dissipation system applied in the anti-interference communication and conduction integrated module 7 to further describe the working method of the present invention.

[0060] See Figures 6-8 The anti-interference communication and conduction integrated module 7 mainly includes an upper cover plate, a module frame 71, a lower cover plate 72, and a heat-conducting partition plate 6, an RF PCB board 74, and a digital PCB board 73 inside the module.

[0061] Preferably, such as Figure 6 As shown, the air-cooled heat dissipation component 5 is the upper cover plate of the anti-interference communication integrated module 7. Through the screws passing through it, it together with the module frame 71 and the lower cover plate 72 to form a sealed shell structure, forming a heat conduction channel.

[0062] See Figure 7 The heat-conducting partition 6 is located inside the sealed shell structure and is fixed in the middle of the module frame 71. It has a large contact area with the partition, increasing the heat conduction area.

[0063] See Figure 8 In the anti-interference communication and conduction integrated module 7, the digital PCB board 73 and the radio frequency PCB board 74 are respectively mounted close to the upper and lower sides of the thermally conductive partition 6, and form a signal connection through the BGA package surface mount connector. All low-power devices on the PCB board are attached to the lower surface of the adjacent air-cooled heat dissipation component 5 or the thermally conductive protrusions 8 on the upper (lower) surface of the thermally conductive partition 6.

[0064] Preferably, all contact surfaces are provided with graphene thermal pads with high thermal conductivity to reduce contact thermal resistance and form an efficient heat conduction channel to conduct heat to the upper surface of the air-cooled heat dissipation component 5 and carry it away with the help of cold air.

[0065] The working mode of the air-liquid hybrid heat dissipation architecture based on forced air convection and liquid immersion jet provided in this embodiment of the invention is as follows: The liquid inlet 11 of the liquid immersion jet cooling assembly 1 is reliably sealed to an external cold source or liquid supply system through a fluid connector. The coolant enters the inlet chamber 13 through the inlet 11. The bottom of the inlet chamber 13 is provided with an array of jet holes 16. After being sprayed out through the array of jet holes 16, the coolant branches into multiple streams and enters the jet chamber 15. The coolant impacts the high-power multilayer stacked chip 2 in the jet chamber 15 to achieve heat exchange. After heat exchange, the coolant enters the outlet chamber 14 through the return groove 17 at the top of the jet chamber 15 and flows out through the outlet 12 to complete the heat exchange cycle. The high-power multilayer stacked chip 2 is cooled by the liquid immersion jet.

[0066] The heat generated by the low-power devices on the digital PCB board 73 and the radio frequency PCB board 74 is conducted along the adjacent heat-conducting bosses 8 to the first set of heat dissipation fins 53 and the second set of heat dissipation fins 54 on the upper surface of the air-cooled heat dissipation assembly 5. The first fan 51 and the second fan 52 have their air intake surfaces facing upwards and their air outlet surfaces facing downwards. They draw air from the top and discharge air to the bottom, carrying the heat into the external environment with the air and dissipating heat from the low-power devices through forced air convection.

[0067] Example 3: This embodiment uses simulation experiments to compare the temperature distribution of the heating devices inside the anti-interference integrated communication module 7 using only forced air convection cooling and using the wind-liquid hybrid cooling architecture based on forced air convection and liquid immersion jet of the present invention, thus verifying the beneficial effects of the present invention: See Figure 9This is the structure of the air-cooled heat dissipation component 5 when only forced air convection is used for heat dissipation. At this time, the heat generated by the high-power multilayer stacked chip 2 is conducted along the adjacent heat-conducting protrusions 8 to the third set of heat dissipation fins 57 on the upper surface of the air-cooled heat dissipation component 5. The third fan 56 is a centrifugal fan with the air intake facing upward and the air outlet facing forward. It draws air from the top and exhausts it to the front, carrying the heat into the external environment with the air. The high-power multilayer stacked chip 2 is cooled by forced air convection.

[0068] See Figure 10 The figure shows the simulation results of the temperature distribution of the RF PCB board 74 when only forced air convection cooling is used. At this time, the cold air temperature is 15℃, the temperature of the high-power multilayer stacked chip 2 is 72.82℃, and the highest temperature of other low-power devices is 83.15℃. See Figure 11 The simulation results show the temperature distribution of the RF PCB board 74 when using the air-liquid hybrid heat dissipation architecture based on forced air convection and liquid immersion jet of the present invention. At this time, the cold air temperature is 25°C, the coolant supply temperature is 25°C, the temperature of the high-power multilayer stacked chip 2 is 39.48°C, and the highest temperature of other low-power devices is 62.38°C. The temperature of the high-power multilayer stacked chip 2 drops significantly, and the temperature of the low-power devices also drops significantly.

[0069] The liquid immersion jet cooling assembly 1 of the present invention requires a coolant flow rate of only 308.51 mL / min during operation, which is lower than the flow rate required by existing indirect liquid cooling plates with the same power consumption; the pressure difference between the inlet and outlet of the coolant is only 1.2 kPa, which improves heat dissipation efficiency while reducing pump power consumption and system energy consumption, thus helping to enhance system reliability; at the same time, room temperature air and coolant can be used for heat dissipation, eliminating the need to install complex heat exchange devices, reducing equipment costs and improving environmental adaptability.

[0070] The present invention has the following significant beneficial effects: This invention combines air cooling and liquid cooling technologies, applying the liquid immersion jet cooling method with better heat dissipation performance to the multi-layer stacked chip 2 with high heat generation. Correspondingly, forced air convection is used for other devices with lower heat generation to ensure that the heat dissipation performance matches the heat generation, avoids redundant design, greatly improves the heat dissipation efficiency of the cooling system and the utilization rate of the cooling medium, and reduces the limitations of a single heat dissipation method. This invention utilizes a liquid immersion jet to dissipate heat from a high-power multilayer stacked chip 2 that generates a large amount of heat. The coolant directly contacts the multilayer stacked chip 2, achieving a significant temperature reduction and good heat dissipation effect. This effectively solves the heat dissipation problem of the high-power multilayer stacked chip 2 and also avoids the occurrence of local overheating. This invention can use room temperature air and coolant for heat dissipation, eliminating the need for complex heat exchange devices, reducing equipment costs, and improving environmental adaptability; This invention utilizes a liquid immersion jet to dissipate heat from high-power multilayer stacked chips that generate a large amount of heat. The coolant is in direct contact with the chip, eliminating the need for heat pipes to transfer the heat from the multilayer stacked chip 2 to the liquid cooling plate. This saves installation space, facilitates the planning and layout of other devices on the chip substrate, and also helps improve system integration. This invention utilizes a liquid immersion jet structure to replace the traditional air-cooled heat sink for cooling high-power multilayer stacked chips 2 that generate a large amount of heat. It does not occupy additional internal space of the module and is fully compatible with existing module structures, making it highly applicable. The liquid immersion jet cooling structure of this invention is processed using 3D printing technologies such as selective laser sintering, photopolymerization molding, direct metal powder laser sintering, and laser cladding rapid manufacturing. The manufacturing process is relatively mature. In addition, the integrated design further improves the system integration. The liquid immersion jet cooling structure of the present invention requires a lower flow rate of coolant during operation than the existing indirect liquid cooling plate with the same power consumption. This improves heat dissipation efficiency while reducing pump power consumption and system energy consumption, thus enhancing system reliability. The coolant in the liquid immersion jet cooling structure of this invention can flow in a single phase or in a two-phase flow after a phase change. It utilizes the latent heat of the coolant to greatly improve heat dissipation capacity and adapt to application requirements under higher heat flux densities.

[0071] Through the description of specific embodiments, a more in-depth and specific understanding should be gained of the technical means and effects adopted by the present invention to achieve the intended purpose. However, the accompanying drawings are only provided for reference and illustration and are not intended to limit the present invention.

Claims

1. A wind-liquid hybrid heat dissipation system, characterized in that, The air-liquid hybrid cooling system is applied to electronic devices containing multi-layered stacked chips and electronic components. The air-liquid hybrid cooling system includes: A liquid immersion jet cooling assembly includes a housing and an inlet and an outlet disposed on the housing. The housing is sealed and mounted on a substrate that carries the multilayer stacked chip to form a sealed cavity covering the multilayer stacked chip. Coolant introduced into the sealed cavity through the inlet impacts the multilayer stacked chip to dissipate heat. An air-cooled heat dissipation assembly includes a heat dissipation base plate, heat dissipation fins disposed on the heat dissipation base plate, and a fan. The fan drives airflow through the heat dissipation fins to dissipate heat from the electronic device. The internal flow channels of the liquid immersion jet cooling component are isolated from the internal air channels of the air-cooled heat dissipation component.

2. The air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The heat flux density of the multilayer stacked chip is greater than that of the electronic device.

3. The air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The liquid immersion jet cooling assembly further includes: a flow channel distribution component disposed within the housing, the flow channel distribution component dividing the sealed cavity into: The jet cavity is located between the bottom wall of the multilayer stacked chip and the flow channel distribution component; The liquid inlet chamber is located between the top wall of the housing and the top wall of the flow channel distribution component, and the liquid inlet chamber is connected to the liquid inlet. The flow channel distribution component is provided with an array of jet holes, which connect the liquid inlet chamber and the jet chamber, and are used to spray coolant onto the surface of the multilayer stacked chip.

4. The air-liquid hybrid heat dissipation system according to claim 3, characterized in that, The flow channel distribution component defines a liquid outlet cavity that communicates with the liquid outlet, and the bottom wall of the flow channel distribution component is provided with a return groove that communicates the liquid outlet cavity and the jet cavity.

5. The air-liquid hybrid heat dissipation system according to claim 3 or 4, characterized in that, The array arrangement of the jet holes is configured to correspond to the hot spot locations of the active region of the multilayer stacked chip.

6. The air-liquid hybrid heat dissipation system according to claim 3 or 4, characterized in that, The liquid immersion jet cooling assembly is manufactured using integrated 3D printing technology.

7. The air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The surface of the heat dissipation base plate of the air-cooled heat dissipation assembly is provided with thermally conductive protrusions, and the electronic devices are attached to the thermally conductive protrusions through a thermally conductive interface material.

8. The air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The multi-layer stacked chip is a three-dimensional stacked packaged chip.

9. An electronic device, characterized in that, The system includes a hybrid air-liquid cooling system as described in any one of claims 1 to 8, wherein the air-cooled cooling component constitutes the housing or part of the housing of the electronic device.

10. The electronic device according to claim 9, characterized in that, The electronic device is an integrated anti-interference communication module, and the air-cooled heat dissipation component is the upper cover plate of the integrated anti-interference communication module. The integrated anti-interference communication module is also provided with a heat-conducting partition, which separates the inner cavity of the integrated anti-interference communication module and conducts the heat of the electronic device to the air-cooled heat dissipation component.

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