Heat dissipation module and controller

Abstract

The invention discloses a heat dissipation module and a controller, and the heat dissipation module is used for carrying out the heat dissipation of an electronic device, and comprises a heat dissipation part, an impeller assembly, and a mounting structure. The heat dissipation piece comprises a substrate and a plurality of fins connected to one side of the substrate, the substrate is suitable for being connected with an electronic device in a heat conduction mode, every two adjacent fins are spaced to define an air channel, and at least part of the fins and the substrate jointly define a containing space communicated with the air channels. The impeller assembly is contained in the containing space and connected with the heat dissipation piece, and air inlet airflow and air outlet airflow generated by the impeller assembly both flow through the air channel. The mounting structure is connected with the heat dissipation piece and located on the side, away from the heat dissipation piece, of the impeller assembly, the mounting structure is suitable for being connected with an external structure in the locking state, and the mounting structure can be separated from the external structure in the unlocking state. According to the scheme, the heat dissipation module is small in size and convenient to use and transport, the flow speed and the flow rate of airflow flowing through the heat dissipation piece can be increased, and the heat dissipation effect is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of controller heat dissipation technology, and in particular to a heat dissipation module and controller. Background Technology

[0002] Spectrum controllers can precisely control related hardware, process spectral data, or manage light output, and can be applied in many fields such as agricultural lighting, industrial measurement, and astronomical observation. Spectrum controllers dissipate heat through a heat dissipation module. Specifically, the heat dissipation module includes spaced-apart fans and heat sink fins. The heat sink fins are thermally connected to the spectrum controller, and the fans direct airflow towards the heat sink fins, thereby achieving heat dissipation. Because the fans and heat sink fins are spaced apart, the overall volume of the heat dissipation module is relatively large, affecting its use and transportation. Summary of the Invention

[0003] The main objective of this invention is to propose a heat dissipation module and controller, which aims to solve the technical problem of the large space occupation of existing heat dissipation modules.

[0004] To achieve the above objectives, a first aspect of the present invention provides a heat dissipation module for dissipating heat from electronic devices, the heat dissipation module comprising: A heat sink includes a substrate and a plurality of fins connected to one side of the substrate. The substrate is adapted to thermally conduct the electronic device. Adjacent fins are spaced apart to define an airflow channel. At least a portion of the fins and the substrate together define a receiving space communicating with the airflow channel. An impeller assembly is housed within the receiving space and connected to the heat sink. The inlet and outlet airflows generated by the impeller assembly both flow through the air duct to dissipate heat from the electronic device. A mounting structure is connected to the heat sink and located on the side of the impeller assembly away from the heat sink. The mounting structure has a locked state and an unlocked state. In the locked state, the mounting structure is adapted to connect to an external structure. In the unlocked state, the mounting structure can be separated from the external structure.

[0005] In some embodiments, each of the fins extends along a first direction, which is perpendicular to the thickness direction of the substrate. The heat sink includes a first fin group and a second fin group opposite to each other along the first direction. The first fin group and the second fin group are spaced apart to form the receiving space together with the substrate. The inlet airflow and the outlet airflow generated by the impeller assembly both flow through the air duct along the first direction.

[0006] In some embodiments, the impeller assembly includes a fan and a guide vane connected to each other, the guide vane having a first air passage and a second air passage communicating with each other, the fan having an air inlet and an air outlet, the first air passage communicating with the air duct of the first fin assembly, and the second air passage communicating with the air inlet; The incoming airflow is adapted to enter the first air path along the first direction through the air duct of the first fin group, and then enter the air inlet along the second direction through the second air path. The outgoing airflow from the air outlet is adapted to enter the air duct of the second fin group along the first direction, and the second direction intersects the first direction.

[0007] In some embodiments, the first fin assembly includes a first stepped structure facing the receiving space, the air guide seat has a first seat portion and a second seat portion opposite to each other along the first direction, the second seat portion abutting the substrate, and the first seat portion abutting the first stepped structure and spaced apart from the substrate, so that the air duct of the first fin assembly is connected to the first air path.

[0008] In some embodiments, along the first direction, the air guide seat has an air guide hole on the side facing the second fin group, and the airflow from the air outlet is adapted to flow through the air guide hole to the air duct of the second fin group; and / or, the air guide seat has a cavity communicating with the second air duct, and the fan is housed in the cavity.

[0009] In some embodiments, the first fin group is located on the lower side of the heat sink, the second fin group is located on the upper side of the heat sink, the inlet airflow is adapted to flow through the air duct of the first fin group to enter the impeller assembly, and the outlet airflow from the impeller assembly is adapted to flow through the air duct of the second fin group.

[0010] In some embodiments, the heat sink is further provided with a second stepped structure on the side facing the receiving space, the mounting structure abuts against the second stepped structure, and the mounting structure is housed within the receiving space.

[0011] In some embodiments, the mounting structure includes a first fixing part and a second fixing part that are movably connected to each other. The first fixing part and the second fixing part can be brought relatively close to the external structure to switch to the locked state, and the first fixing part and the second fixing part can be moved relatively away from the external structure to switch to the unlocked state.

[0012] In some embodiments, the first fixing portion is elastically connected to the second fixing portion to create a tendency for the first fixing portion and the second fixing portion to move closer together; and / or, The first fixing part includes a first hook, and the second fixing part includes a second hook. In the locked state, the first hook and the second hook are adapted to hook onto the opposite sides of the external structure, respectively.

[0013] A second aspect of the present invention provides a controller, the controller including the heat dissipation module described in the above embodiments; wherein the substrate of the heat dissipation component is thermally connected to the controller body to dissipate heat from the controller body.

[0014] Compared with the prior art, the beneficial effects of the present invention include: In the technical solution of this invention, the heat dissipation module includes a heat sink, an impeller assembly, and a mounting structure. The heat sink includes a substrate and multiple fins connected to one side of the substrate. The substrate is suitable for heat conduction connection of electronic devices. Adjacent fins are spaced apart to define an air outlet duct, and at least some fins and the substrate together define the accommodating space of the air outlet duct. In the prior art, the fan and heat dissipation fins of the heat dissipation module are arranged alternately, resulting in a large overall space ratio of the heat dissipation module. In this solution, the impeller assembly is housed within the accommodating space of the heat sink and connected to the heat sink, meaning that the overall space ratio of the heat dissipation module in this solution is smaller, which can optimize the spatial structure layout of the heat dissipation module and facilitate the assembly, use, and transportation of the heat dissipation module.

[0015] Compared to designs where the fan and heat sink are separated and airflow is directed towards the heat sink, this design places the impeller assembly within the heat sink's housing space. Furthermore, both the inlet and outlet airflow generated by the impeller assembly flows through an air duct. This effectively shortens the airflow guide distance, reduces airflow loss, ensures sufficient airflow velocity through the heat sink, and improves heat dissipation. Conversely, compared to designs where the fan and heat sink are separated and only the outlet airflow is directed towards the heat sink, this design ensures both the inlet and outlet airflows flow through an air duct. This effectively increases the airflow rate through the heat sink, further enhancing heat dissipation.

[0016] Furthermore, the mounting structure of this solution connects to the heat sink and is located on the side of the impeller assembly away from the heat sink. The mounting structure has a locked state and an unlocked state. In the locked state, the mounting structure is suitable for connecting to an external structure. In the unlocked state, the mounting structure can be separated from the external structure. That is, the mounting structure facilitates the assembly and disassembly of the heat sink module from the external structure, realizing the rapid assembly and disassembly of the heat sink module and meeting the heat dissipation requirements of mass electronic devices. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the controller in one embodiment of the present invention; wherein, the heat dissipation module and the controller body are shown; Figure 2 This is a cross-sectional view of the controller in one embodiment of the present invention; Figure 3 for Figure 2 A partially enlarged schematic diagram at point A in the middle; showing the fan's air inlet and outlet, air guide seat, mounting structure, first fin group and second fin group, etc. Figure 4 This is an exploded view of a controller according to an embodiment of the present invention; wherein, the controller body, heat sink, fan, air guide seat and mounting structure are shown; Figure 5 This is a schematic diagram of an impeller assembly according to an embodiment of the present invention; wherein the fan is housed in the cavity of the air guide seat; Figure 6 This is a schematic diagram of the air guide seat in one embodiment of the present invention; showing the first air path, the second air path, the first seat portion, the second seat portion, and the cavity; Figure 7 This is a schematic diagram of the heat sink in one embodiment of the present invention; wherein, a substrate, fins, air duct, accommodating space, first stepped structure, second stepped structure and third stepped structure are shown.

[0019] Explanation of icon numbers: Controller 1; Heat dissipation module 10; Heat sink 100; substrate 110; fins 120; air duct 130; housing space 140; first fin group 150; first stepped structure 151; second fin group 160; second stepped structure 170; third stepped structure 180; Impeller assembly 200; fan 210; air inlet 211; air outlet 212; air guide seat 220; first air passage 221; second air passage 222; first seat 223; second seat 224; air guide hole 225; cavity 226; Mounting structure 300; first fixing part 310; first hook 311; first groove 312; second fixing part 320; second hook 321; Controller body 20; First direction X; second direction Y.

[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] The first aspect of this invention provides a heat dissipation module 10 for dissipating heat from electronic devices, ensuring effective heat dissipation. It should be noted that the electronic devices can be a spectrum controller, processor, inverter, motor controller, LED light source, or laser diode, etc. This embodiment uses the heat dissipation module 10 to dissipate heat from a controller 1 as an example for explanation. The following refers to... Figures 1 to 7 The following describes the heat dissipation module 10 according to an embodiment of this application. Specifically, the heat dissipation module 10 includes a heat sink 100, an impeller assembly 200, and a mounting structure 300.

[0023] Reference Figures 1 to 4 The heat sink 100 can work in conjunction with the impeller assembly 200 to dissipate heat from electronic components. The heat sink 100 includes a substrate 110 and multiple fins 120, the specific number of which can be determined according to actual needs. The multiple fins 120 can be connected to one side of the substrate 110 along its thickness direction, as shown in the figure. Figure 1 In terms of orientation, multiple fins 120 can be connected to the front side of the substrate 110. The substrate 110 can thermally conduct electronic devices. Specifically, the substrate 110 can achieve thermal conduction connections using thermal grease or thermal pads.

[0024] Reference Figure 1 , Figure 4 and Figure 7 Adjacent fins 120 are spaced apart to define an air duct 130, through which airflow passes. At least a portion of the fins 120 and the substrate 110 together define a receiving space 140, which can accommodate the impeller assembly 200, etc. The specific location and spatial structure of the receiving space 140 on the heat sink 100 can be determined according to the actual situation. It can be understood that the receiving space 140 can be connected to the air duct 130, so that the airflow generated by the impeller assembly 200 flows through the air duct 130.

[0025] Reference Figures 1 to 3The impeller assembly 200 generates airflow and directs it to the heat sink 100. The impeller assembly 200 is housed within the receiving space 140 and connected to the heat sink 100. It should be noted that the impeller assembly 200 can be detachably connected to the heat sink 100 for easy maintenance. Both the inlet and outlet airflow generated by the impeller assembly 200 flows through the air duct 130 of the heat sink 100, thereby achieving heat dissipation for the electronic components.

[0026] Reference Figure 1 and Figure 4 The mounting structure 300 is used to enable a detachable connection between the heat sink 100 and the external structure, allowing the heat sink module 10 to be easily positioned for heat dissipation. The external structure can be a guide rail or a frame, etc. The mounting structure 300 can connect to the heat sink 100; specifically, it can directly connect to the heat sink 100 or indirectly connect to the heat sink 100 via the impeller assembly 200. The mounting structure 300 is located on the side of the impeller assembly 200 facing away from the heat sink 100, as shown in the figure. Figure 1 Orientation: Mounting structure 300 can be located on the front side of impeller assembly 200.

[0027] The mounting structure 300 has a locked state and an unlocked state. When locked, the mounting structure 300 can be connected to an external structure, allowing the heat dissipation module 10 to be installed at a designated location relative to the electronic device for heat dissipation. When unlocked, the mounting structure 300 can be separated from the external structure, allowing the heat dissipation module 10 to be detached.

[0028] In the technical solution of this invention, the heat dissipation module 10 includes a heat sink 100, an impeller assembly 200, and a mounting structure 300. The heat sink 100 includes a substrate 110 and a plurality of fins 120 connected to one side of the substrate 110. The substrate 110 is suitable for thermally conducting electronic devices. Adjacent fins 120 are spaced apart to define an air outlet 130, and at least some of the fins 120 and the substrate 110 together define a receiving space 140 for the air outlet 130. In the prior art, the fan and heat sink fins of the heat dissipation module are arranged alternately, resulting in a large overall space ratio of the heat dissipation module. In this solution, the impeller assembly 200 is housed within the receiving space 140 of the heat sink 100 and connected to the heat sink 100, that is, the overall space ratio of the heat dissipation module 10 in this solution is smaller, which can optimize the spatial structure layout of the heat dissipation module 10 and facilitate the assembly, use, and transportation of the heat dissipation module 10.

[0029] Compared to designs where the fan and heat sink are separated and the fan blows air onto the heat sink, this design places the impeller assembly 200 within the housing space 140 of the heat sink 100. Furthermore, both the inlet and outlet airflow generated by the impeller assembly 200 flows through the air duct 130. This design effectively shortens the airflow guide distance, reduces airflow loss, ensures the airflow velocity through the heat sink 100, and improves the heat dissipation effect. Compared to designs where the fan and heat sink are separated and only the outlet airflow flows towards the heat sink, this design ensures both the inlet and outlet airflows flow through the air duct 130. This effectively increases the airflow rate through the heat sink 100, thus significantly improving the heat dissipation effect.

[0030] Furthermore, the mounting structure 300 of this solution connects to the heat sink 100 and is located on the side of the impeller assembly 200 opposite to the heat sink 100. The mounting structure 300 has a locked state and an unlocked state. In the locked state, the mounting structure 300 is suitable for connecting to an external structure. In the unlocked state, the mounting structure 300 can be separated from the external structure. That is, the mounting structure 300 facilitates the assembly and disassembly of the heat sink module 10 from the external structure, realizing the rapid assembly and disassembly of the heat sink module 10 and meeting the heat dissipation requirements of a large number of electronic devices.

[0031] Reference Figure 1 , Figure 4 and Figure 7 The specific structure of the heat sink 100 is described below. In some embodiments, for ease of description and understanding of the specific structure of the heat sink 100, a first direction X is defined, which is perpendicular to the thickness direction of the substrate 110. (Refer to...) Figure 1 The orientation of the substrate 110 is such that its thickness direction points forward and backward; that is, the first direction X can point up and down, left and right, or any inclined direction perpendicular to the thickness direction of the substrate 110. This embodiment uses an up and down direction as an example. Each fin 120 extends along the first direction X, and the specific extension length of each fin 120 can be determined according to the actual situation. (Refer to...) Figure 1 Along the first direction X, the heat sink 100 includes a first fin group 150 and a second fin group 160 arranged opposite to each other. The first fin group 150 and the second fin group 160 are spaced apart to form a receiving space 140 together with the substrate 110, that is, the impeller assembly 200 can be accommodated in the receiving space 140. The inlet airflow and outlet airflow generated by the impeller assembly 200 both flow along the first direction X through the air duct 130.

[0032] In existing technologies, when a heat dissipation module is installed in an enclosed space such as a cabinet, and the end face of the fins facing away from the substrate is close to the side wall of the cabinet, the air inlet or outlet channel of the axial fan can be blocked by the cabinet, which will affect the normal airflow and the normal heat dissipation of the heat dissipation module. In this solution, the airflow generated by the impeller assembly 200 can flow along the first direction X through the air duct 130 extending along the first direction X. That is, the heat dissipation module 10 of this solution will not be affected by the enclosed space such as a cabinet, so that the airflow can flow normally within the air duct 130 of the heat dissipation component 100, and can ensure the heat dissipation effect of the heat dissipation module 10 on electronic devices.

[0033] Reference Figures 3 to 6 The specific configuration of the impeller assembly 200 is described below. In some embodiments, the impeller assembly 200 includes a fan 210 and a guide vane 220 connected to each other. Specifically, the fan 210 and the guide vane 220 can be arranged separately or integrally. This embodiment of the application uses the separate connection of the fan 210 and the guide vane 220 as an example for explanation. The guide vane 220 has a first air passage 221 and a second air passage 222 that are connected to each other. The structure of the first air passage 221 is different from that of the second air passage 222. Refer to... Figure 6 In terms of orientation, the airflow path on the right side of the air guide seat 220 can be the first airflow path 221, and the airflow path on the left side of the air guide seat 220 can be the second airflow path 222. The fan 210 has an air inlet 211 and an air outlet 212, as shown in the reference... Figure 3 In terms of orientation, the opening on the left side of the fan 210 can be an air inlet 211, and the opening on the upper side of the fan 210 can be an air outlet 212. The first air passage 221 can be connected to the air duct 130 of the first fin assembly 150, and the second air passage 222 can be connected to the air inlet 211. It should be noted that in some embodiments, the cross-sectional area of ​​the first air passage 221 can gradually decrease along the airflow direction. In other embodiments, the cross-sectional area of ​​the second air passage 222 can gradually decrease along the airflow direction. This solution can accelerate the airflow process and improve the heat dissipation effect.

[0034] Reference Figures 1 to 3 The flow process of the airflow generated by the impeller assembly 200 is described below. To facilitate description and understanding of the specific flow direction, a second direction Y is defined, which intersects the first direction X. Specifically, in some embodiments, the second direction Y may be perpendicular to the first direction X. In other embodiments, the second direction Y may also be at other angles of inclination than perpendicular to the first direction X. This application uses the example of the second direction Y being perpendicular to the first direction X for illustration. (Refer to...) Figure 2The orientation is as follows: the first direction X can point up or down, and the second direction Y can point left or right. The incoming airflow can enter the first air passage 221 through the air duct 130 of the first fin group 150 along the first direction X. Since the second air passage 222 is connected to the first air passage 221, the incoming airflow can flow from the first air passage 221 to the second air passage 222. Then, the incoming airflow can enter the air inlet 211 of the fan 210 along the second direction Y through the second air passage 222. The outgoing airflow from the air outlet 212 of the fan 210 can enter the air duct 130 of the second fin group 160 along the first direction X, thus completing the airflow circulation.

[0035] When the fan 210 starts working, the suction force generated by the rotation of the fan blades first acts on the second air passage 222 of the air guide seat 220. Since the second air passage 222 is connected to the first air passage 221, and the first air passage 221 is connected to the air duct 130 of the first fin group 150, this suction force can draw in cold air along the aforementioned path. Specifically, the incoming airflow first flows actively into each air duct 130 of the first fin group 150 along the first direction X, that is, the incoming airflow can have a first heat exchange with the heat conducted to the fins 120 via the substrate 110, carrying away some heat. Then, the incoming airflow continues to flow into the first air passage 221 of the air guide seat 220. Subsequently, the incoming airflow changes direction under the guidance of the air guide seat 220, and flows along the second direction Y, and is finally drawn into the air inlet 211 of the fan 210 through the second air passage 222. After the intake airflow enters the fan 210, it is pressurized by the impeller and blown out at high speed from the outlet 212 of the fan 210. Then, the outlet airflow flows along the first direction X into the air duct 130 of the second fin assembly 160, where it undergoes a second heat exchange with the fins 120, ultimately carrying the heat away from the heat dissipation module 10. In this solution, the air guide seat 220 of the impeller assembly 200 can guide the airflow generated by the fan 210, enabling the airflow to flow efficiently along a preset path. This effectively avoids airflow short-circuiting when the heat dissipation module 10 is installed in a narrow space, adapting to various application scenarios and ensuring heat dissipation performance.

[0036] Reference Figure 3 , Figure 6 and Figure 7 The assembly configuration of the air guide seat 220 and the heat sink 100 is described below. In some embodiments, the first fin group 150 includes a first stepped structure 151, which faces the receiving space 140. The air guide seat 220 includes a first seat portion 223 and a second seat portion 224 opposite to each other along the first direction X, as shown below. Figure 5In terms of orientation, the right side of the air guide seat 220 is the first seat 223, and the left side of the air guide seat 220 is the second seat 224. The second seat 224 abuts against the substrate 110, and the first seat 223 abuts against the first stepped structure 151 and is spaced apart from the substrate 110, so that the air duct 130 of the first fin assembly 150 is connected to the first air passage 221. In other embodiments, each fin 120 may extend to different heights along the thickness direction of the substrate 110 to form the first stepped structure 151, or a strip-shaped member may be provided to form a stepped support surface together with each fin 120. This application embodiment uses the example of each fin 120 extending to different heights along the thickness direction of the substrate 110 to form the first stepped structure 151 for illustration.

[0037] In this design, the first seat portion 223 and the second seat portion 224 of the air guide seat 220 abut against the first stepped structure 151 and the substrate 110, respectively, thus achieving the assembly and positioning of the air guide seat 220 and the heat sink 100, improving the accuracy and stability of their assembly connection. Furthermore, due to the height difference between the first stepped structure 151 and the substrate 110, when the first seat portion 223 abuts against the first stepped structure 151, the gap between the air guide seat 220 and the fins 120 forms an airflow channel, enabling efficient airflow. Additionally, because the first seat portion 223 abuts against the first stepped structure 151, the contact surface or contact line between the first seat portion 223 and the first stepped structure 151 can form a sealing structure, effectively preventing airflow leakage and ensuring heat dissipation.

[0038] Reference Figure 5 and Figure 6The air outlet configuration of the air guide seat 220 is described below. In some embodiments, the air guide seat 220 has an air guide hole 225 on the side facing the second fin 120 along the first direction X. The airflow from the air outlet 212 of the fan 210 can flow to the air duct 130 of the second fin group 160 through the air guide hole 225. That is, the air guide hole 225 of the air guide seat 220 enables the airflow to flow along the first direction X to the air duct 130 of the second fin group 160, thereby achieving heat dissipation. In other embodiments, along the first direction X, the cross-sectional dimension of the section of the air guide 225 facing away from the receiving space 140 can be larger than the cross-sectional dimension of the section of the air guide 225 facing the receiving space 140. This allows the exhaust airflow to flow fully at a large angle to each air duct 130 of the second fin group 160. The air guide 225 of this solution can effectively reduce the rotation component of the exhaust airflow, allowing the exhaust airflow to flow evenly along the first direction X to each air duct 130 of the second fin group 160. This effectively avoids uneven airflow distribution leading to local overheating of the heat sink 100 and reduces the impact noise caused by the airflow directly impacting the edge of the fin 120. In other embodiments, multiple rotatable guide vanes can be provided inside the air guide 225. The angle of each guide vane can be adjusted manually or automatically to change the direction of the exhaust airflow, adapting to different installation environments or meeting different heat dissipation requirements (for example, when a specific area needs to be cooled, the guide vanes can be adjusted to deflect the airflow towards that area).

[0039] Reference Figure 5 and Figure 6 In some embodiments, the air guide seat 220 is provided with a cavity 226, the specific structure of which can be adapted to the arrangement of the fan 210. The cavity 226 is connected to the second air passage 222, and the fan 210 can be housed within the cavity 226. In other embodiments, the cavity structure and the air passage structure of the air guide seat 220 can be an integrated structure or a separate structure. This application embodiment uses an integrated structure of the cavity structure and the air passage structure as an example for explanation. Compared with the scheme of separately installing the air guide seat, the fan and the heat sink, the fan 210 of this scheme can be housed in the cavity 226 of the air guide seat 220. During the installation process, the fan 210 and the air guide seat 220 can be pre-assembled first, and then the air guide seat 220 and the fan 210 can be installed as a whole in the receiving space 140 of the heat sink 100. This can eliminate the errors caused by the series assembly of various components, improve the assembly accuracy, and ensure the smooth flow of air. Furthermore, since the fan 210 is enclosed by the air guide seat 220, the leakage loss of airflow can be effectively reduced. The air guide seat 220 can also absorb and disperse the vibration energy of the fan 210, protect the fan 210 from damage, and improve the reliability of the heat dissipation module 10 under harsh and complex working conditions.

[0040] Reference Figures 1 to 3 The specific assembly orientation of the heat sink 100 is described below. In some embodiments, for ease of understanding, refer to... Figure 1 In this embodiment, the upper and lower positions are referenced to the orientation of the heat dissipation module 10 in operation. The first fin group 150 is located on the lower side of the heat dissipation component 100, and the second fin group 160 is located on the upper side of the heat dissipation component 100. The incoming airflow can flow along the first direction X through the air duct 130 of the first fin group 150 to enter the impeller assembly 200, and the outgoing airflow from the impeller assembly 200 can flow along the first direction X through the air duct 130 of the second fin group 160. In this solution, the first fin group 150 and the second fin group 160 are located on the lower and upper sides of the heat dissipation component 100, respectively. That is, the incoming airflow can flow from bottom to top into the impeller assembly 200 through the air duct 130 of the first fin group 150, and the outgoing airflow flows from bottom to top from the impeller assembly 200 to the air duct 130 of the second fin group 160. Therefore, the airflow of this solution can carry lighter dust or impurities away from the heat sink 100 in each air duct 130, while heavier dust and impurities will naturally fall out of the air duct 130 when the equipment stops and the airflow stops. This can achieve auxiliary cleaning of the impeller assembly 200, prevent dust accumulation or blockage of the air duct 130, thus affecting heat dissipation and extending the maintenance cycle of the heat dissipation module 10. Furthermore, since air density decreases after being heated, it will naturally flow upward. The airflow provided by the fan 210 in this solution is in the same direction as natural convection. The combination of the two is equivalent to natural buoyancy assisting the fan 210 in exhausting air. Therefore, this solution can reduce the load on the fan 210 and obtain a larger ventilation flow at the same fan 210 power, thereby improving heat dissipation efficiency. In addition, compared with the bottom air intake layout, the hot air in the top air intake layout of this solution is directly discharged upward, away from the air intake 211, effectively avoiding the risk of heat backflow.

[0041] In other embodiments, the first fin group 150 may be located on the lower side of the heat sink 100, and the second fin group 160 may be located on the upper side of the heat sink 100, thus adapting to inclined installation spaces with limited space. In other embodiments, the impeller assembly 200 may rotate about an axis parallel to the thickness direction of the substrate 110, thereby switching the airflow direction (the airflow changes from the initial bottom-in, top-out design to a top-in, bottom-out design). When the humidity is high, the above-mentioned arrangement can effectively prevent water droplets from entering the fan 210 with the airflow.

[0042] Reference Figures 1 to 4 and Figure 7In some embodiments, the heat sink 100 is further provided with a second stepped structure 170 on the side facing the receiving space 140. The second stepped structure 170 can be single or multiple. This embodiment uses two second stepped structures 170 as an example. The two second stepped structures 170 are arranged opposite each other along the first direction X. The specific structures of the two second stepped structures 170 can be the same or different, depending on the actual mounting structure 300. The mounting structure 300 abuts against the second stepped structure 170 and is housed within the receiving space 140.

[0043] The mounting structure 300 of this design is housed within the accommodating space 140, which effectively reduces the space occupied by the heat dissipation module 10. This allows the heat dissipation module 10 to fit into various confined installation spaces such as server racks. Furthermore, it effectively prevents the mounting structure 300 from accidentally contacting other cables or components during connection or disconnection from external structures, improving the ease of installation and removal of the heat dissipation module 10 and ensuring its overall aesthetic appeal. In addition, because the mounting structure 300 abuts against the second-step structure 170, no further adjustments are required during assembly of the mounting structure 300 with the heat sink 100, ensuring assembly accuracy.

[0044] Reference Figure 3 and Figure 4 The specific configuration of the mounting structure 300 is described below. In some embodiments, the mounting structure 300 includes a first fixing part 310 and a second fixing part 320 that are movably connected to each other, as shown below. Figure 4 In terms of orientation, the first fixing part 310 can be the fixing part on the right side of the mounting structure 300, and the second fixing part 320 can be the fixing part on the left side of the mounting structure 300. When the mounting structure 300 needs to be locked, that is, when the mounting structure 300 needs to be connected to an external structure, the first fixing part 310 and the second fixing part 320 can be relatively close to connect to the external structure. In other words, the first fixing part 310 and the second fixing part 320 can clamp the external structure, which can ensure the stability and reliability of the connection between the mounting structure 300 and the external structure. When the mounting structure 300 needs to be unlocked, that is, when the mounting structure 300 needs to be separated from the external structure, the first fixing part 310 and the second fixing part 320 can be relatively far apart to separate from the external structure. That is, the external structure can be detached from between the first fixing part 310 and the second fixing part 320. The locking and unlocking operation of the mounting structure 300 in this solution is convenient and quick to switch.

[0045] Reference Figure 3 and Figure 4The specific structure of the mounting structure 300 is described below. In some embodiments, the first fixing part 310 is elastically connected to the second fixing part 320 to create a tendency for the first fixing part 310 and the second fixing part 320 to move closer together. It is understood that unlocking can be achieved by manually or mechanically driving the first fixing part 310 and the second fixing part 320 away from each other. This solution utilizes the spring force to bring the first fixing part 310 and the second fixing part 320 closer together for locking, making the overall operation convenient and quick. In other embodiments, the first fixing part 310 or the second fixing part 320 may be threadedly connected to a screw, and turning the screw will drive the first fixing part 310 and the second fixing part 320 closer or further apart. In other embodiments, the first fixing part 310 may be rotatably connected to the second fixing part 320, and rotating the first fixing part 310 or the second fixing part 320 about a rotation axis will cause the first fixing part 310 and the second fixing part 320 to move closer or further apart. The specific movable settings of the first fixing part 310 and the second fixing part 320 can be determined according to the actual situation. In this embodiment, the first fixing part 310 is elastically connected to the second fixing part 320 as an example for explanation.

[0046] Reference Figure 3 and Figure 4 In some embodiments, the first fixing part 310 includes a first hook 311, and the second fixing part 320 includes a second hook 321. The first hook 311 and the second hook 321 can be arranged opposite to each other along a first direction X. When in a locked state, the first hook 311 and the second hook 321 can respectively hook onto opposite sides of the external structure. This solution can effectively prevent the external structure from detaching from the mounting structure 300, further improving the stability and reliability of the assembly connection between the mounting structure 300 and the external structure. In other embodiments, the first hook 311 can be provided as a single hook or multiple hooks. This application embodiment uses two first hooks 311 as an example for explanation. It should be noted that the number of second hooks 321 can be the same as or different from the number of first hooks 311. The specific structure of the first hook 311 and the second hook 321 can be adapted to the external structure. This application embodiment uses a guide rail as an example for explanation.

[0047] Reference Figure 4 and Figure 7In some embodiments, the end of the first fixing part 310 facing away from the second fixing part 320 is also provided with a first groove 312. When the heat dissipation module 10 is in a confined space, it is difficult to manually drive the first fixing part 310 and the second fixing part 320 away from each other to unlock. Therefore, an external rod or screwdriver can be inserted into the first groove 312 to pry the first fixing part 310 and the second fixing part 320 away from each other. This solution improves the ease of assembling and disassembling the mounting structure 300. In other embodiments, the heat dissipation component 100 is also provided with a third stepped structure 180. The specific structure of the third stepped structure 180 can be determined according to the mounting structure 300. The third stepped structure 180 can provide movement space for the first fixing part 310, effectively preventing the mounting structure 300 from bumping against the fins 120 during unlocking or unlocking, thus extending the service life of the heat dissipation module 10.

[0048] Reference Figures 1 to 4 The second aspect of this invention provides a controller 1, which includes a heat dissipation module 10 and a controller body 20 as described in the above embodiments. It should be noted that the controller 1 can be a spectral controller, a processor, or a motor controller, etc. This embodiment uses a spectral controller as an example for explanation. The substrate 110 of the heat sink 100 is thermally connected to the controller body 20 to dissipate heat. The heat dissipation module 10 of this solution occupies a small overall volume, optimizes the spatial structure layout of the heat dissipation module 10, facilitates the assembly, use, and transportation of the heat dissipation module 10, reduces airflow loss, ensures the airflow velocity through the heat sink 100, and effectively increases the airflow rate through the heat sink 100, significantly improving the heat dissipation effect.

[0049] It should be noted that if directional indications (such as up, down, left, right, front, back, etc.) are involved in the embodiments of the present invention, these directional indications are only used to explain the relative positional relationships and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly. When a direction reference is introduced in a specific embodiment, unless the direction is specifically limited to unidirectional, the direction can be unidirectional or bidirectional (two parallel and opposite directions). Whether it is unidirectional or bidirectional depends on what those skilled in the art can achieve. When the direction reference is bidirectional, it should be considered that two parallel and different embodiments have been introduced simultaneously.

[0050] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or," "and / or," or "and / or" throughout the text implies three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0051] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat dissipation module for dissipating heat from electronic components, characterized in that: The heat dissipation module includes: A heat sink includes a substrate and a plurality of fins connected to one side of the substrate. The substrate is adapted to thermally conduct the electronic device. Adjacent fins are spaced apart to define an airflow channel. At least a portion of the fins and the substrate together define a receiving space communicating with the airflow channel. An impeller assembly is housed within the receiving space and connected to the heat sink. The inlet and outlet airflows generated by the impeller assembly both flow through the air duct to dissipate heat from the electronic device. A mounting structure is connected to the heat sink and located on the side of the impeller assembly away from the heat sink. The mounting structure has a locked state and an unlocked state. In the locked state, the mounting structure is adapted to connect to an external structure. In the unlocked state, the mounting structure can be separated from the external structure.

2. The heat dissipation module as described in claim 1, characterized in that, Each of the fins extends along a first direction, which is perpendicular to the thickness direction of the substrate. The heat dissipation component includes a first fin group and a second fin group that are opposite each other along the first direction. The first fin group and the second fin group are spaced apart to form the receiving space together with the substrate. The inlet airflow and the outlet airflow generated by the impeller assembly both flow through the air duct along the first direction.

3. The heat dissipation module as described in claim 2, characterized in that, The impeller assembly includes a fan and a guide vane connected to each other. The guide vane has a first air passage and a second air passage that are connected to each other. The fan has an air inlet and an air outlet. The first air passage is connected to the air duct of the first fin assembly, and the second air passage is connected to the air inlet. The incoming airflow is adapted to enter the first air path along the first direction through the air duct of the first fin group, and then enter the air inlet along the second direction through the second air path. The outgoing airflow from the air outlet is adapted to enter the air duct of the second fin group along the first direction, and the second direction intersects the first direction.

4. The heat dissipation module as described in claim 3, characterized in that, The first fin assembly includes a first stepped structure facing the receiving space. The air guide seat has a first seat portion and a second seat portion opposite to each other along the first direction. The second seat portion abuts against the substrate, and the first seat portion abuts against the first stepped structure and is spaced apart from the substrate, so that the air duct of the first fin assembly is connected to the first air path.

5. The heat dissipation module as described in claim 3, characterized in that, Along the first direction, the air guide seat has an air guide hole on the side facing the second fin group, and the airflow from the air outlet is adapted to flow through the air guide hole to the air duct of the second fin group; and / or, the air guide seat has a cavity communicating with the second air duct, and the fan is housed in the cavity.

6. The heat dissipation module as described in claim 2, characterized in that, The first fin group is located on the lower side of the heat sink, and the second fin group is located on the upper side of the heat sink. The inlet airflow is adapted to flow through the air duct of the first fin group to enter the impeller assembly, and the outlet airflow from the impeller assembly is adapted to flow through the air duct of the second fin group.

7. The heat dissipation module as described in claim 1, characterized in that, The heat sink is further provided with a second stepped structure on the side facing the receiving space, the mounting structure abuts against the second stepped structure, and the mounting structure is housed within the receiving space.

8. The heat dissipation module as described in claim 1, characterized in that, The mounting structure includes a first fixing part and a second fixing part that are movably connected to each other. The first fixing part and the second fixing part can be relatively close to each other to connect to the external structure in order to switch to the locked state, and the first fixing part and the second fixing part can be relatively far away from each other to separate from the external structure in order to switch to the unlocked state.

9. The heat dissipation module as described in claim 8, characterized in that, The first fixing part is elastically connected to the second fixing part to create a tendency for the first fixing part and the second fixing part to move closer together; and / or, The first fixing part includes a first hook, and the second fixing part includes a second hook. In the locked state, the first hook and the second hook are adapted to hook onto the opposite sides of the external structure, respectively.

10. A controller, characterized in that, The heat dissipation module includes any one of claims 1-9; wherein the substrate of the heat dissipation component is thermally connected to the controller body to dissipate heat from the controller body.

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