Preparation and transfer method of suspended LED structure
By fabricating suspended Micro-LED structures on sapphire substrates and combining this with an elastic colloidal stamp transfer method, the problem of suspended Micro-LED structures on sapphire substrates was solved, reducing transfer costs and improving transfer efficiency.
CN121908711APending Publication Date: 2026-04-21ANHUI POLYTECHNIC UNIV +1
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ANHUI POLYTECHNIC UNIV
- Filing Date
- 2025-12-30
- Publication Date
- 2026-04-21
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Figure CN121908711A_ABST
Abstract
The invention relates to the technical field of micro light-emitting diodes, in particular to a preparation and transfer method of a suspended LED structure, which is characterized in that for a prepared Micro-LED device, the suspension of the Micro-LED structure is realized through selective metal deposition, intermediary layer bonding, substrate stripping and etching and thinning of a local area; and then the suspended structure is broken in a vacuum glue pressing mode, and transfer is completed after selective adhesion. According to the method, preparation of the suspended Micro-LED structure is achieved, selective batch transfer can be achieved by combining glue pressing and seal sticking pressing, and the existing operation complexity and cost based on laser transfer are greatly reduced.
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