Composite substrate multi-chip liquid cooling heat dissipation system

Abstract

The system comprises a multi-chip heat dissipation packaging device of the composite substrate, a first liquid supply and return module, a liquid return branch, a heat exchange module, a driving module, a liquid supply branch and a second liquid supply and return module which are sequentially communicated to form a cooling circulation loop; the multi-chip heat dissipation packaging device of the composite substrate comprises a substrate, comprising a multi-chip heat dissipation packaging structure with a composite substrate, a multi-chip heat dissipation assembly arranged on the multi-chip heat dissipation packaging structure of the composite substrate, and a supporting assembly which is arranged on the multi-chip heat dissipation packaging structure of the composite substrate and surrounds the periphery of the multi-chip heat dissipation packaging structure of the composite substrate. According to the system, the multi-chip heat dissipation assembly which is in a new structural form and is easy to maintain and high-expandability components of the multi-chip heat dissipation assembly are adopted for installation, and rapid and high-precision building of the system is achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a liquid cooling heat dissipation system for a multi-chip composite substrate. Background Technology

[0002] With the advancement of intelligent semiconductors, chips are rapidly evolving towards higher power, higher integration, higher performance, and smaller size. This places higher demands on the heat dissipation performance of chips. Due to the high power, high integration, high performance, and miniaturization characteristics of chips, more heat will be generated per unit volume; the chips will reach their threshold temperature more quickly, thereby reducing chip performance, reliability, and lifespan, and may even lead to system crashes.

[0003] Therefore, on the one hand, how to quickly and efficiently conduct heat away from the chip is the key to ensuring the normal operation of the chip. On the other hand, how to quickly build a suitable server cooling system that can dissipate heat from the server equipped with multiple chips on a composite substrate in a timely manner to ensure the normal operation of the entire server is also an urgent problem to be solved. Summary of the Invention

[0004] Therefore, it is necessary to address the shortcomings of existing technologies by providing a liquid cooling system for multi-chip composite substrates. This system comprises a multi-chip heat dissipation packaging device for a composite substrate, a first liquid supply and return module, a liquid return branch, a heat exchange module, a drive module, a liquid supply branch, and a second liquid supply and return module, connected in sequence to form a cooling circulation loop. The multi-chip heat dissipation packaging device includes a multi-chip heat dissipation packaging structure for the composite substrate, a multi-chip heat dissipation component disposed on the multi-chip heat dissipation packaging structure, and a support component disposed on and surrounding the multi-chip heat dissipation packaging structure. The multi-chip heat dissipation packaging structure includes a multi-chip packaging substrate, at least one three-dimensional integrated memory chip, a composite substrate chip die, and a basic logic layer disposed on the multi-chip packaging substrate.

[0005] The first / second supply and return fluid module includes at least one supply and return fluid assembly. Each supply and return fluid assembly is provided with a liquid distribution through hole and a liquid distribution interface communicating with the liquid distribution through hole. Two adjacent supply and return fluid assemblies are detachably connected and sealed together so that each liquid distribution through hole is sequentially connected to form a liquid distribution channel. A first terminal module is sealed and installed at one end of the liquid distribution channel and is provided with a main interface communicating with the liquid distribution channel. A second terminal module is sealed and installed at the other end of the liquid distribution channel and is used to close the liquid distribution channel.

[0006] In one embodiment, the multi-chip heat dissipation packaging structure of the composite substrate includes a multi-chip packaging substrate, at least one three-dimensional integrated memory chip disposed on the multi-chip packaging substrate, a composite substrate chip die, and a basic logic layer.

[0007] The composite substrate chip die includes a polishing layer, a diamond layer, a diamond / silicon composite bonding layer, a silicon layer, and a circuit layer.

[0008] The thickness of the polishing layer ranges from 1% to 7% of the total thickness of the composite substrate chip die; the thickness of the diamond layer ranges from 70% to 90% of the total thickness of the composite substrate chip die.

[0009] Preferably, the thickness of the polishing layer ranges from 5 μm to 20 μm.

[0010] In one embodiment, the liquid dispensing device further includes a locking component, which is configured to fix the first terminal module, the second terminal module, and each of the liquid dispensing modules into a single unit when each of the liquid dispensing through holes is sequentially connected to form the liquid dispensing channel, and the first terminal module and the second terminal module are respectively installed at both ends of the liquid dispensing channel.

[0011] In one embodiment, each of the supply and return fluid components is provided with a first mounting through hole spaced apart from the liquid distribution through hole, the first terminal module is provided with a second mounting through hole corresponding to the first mounting through hole, and the second terminal module is provided with a third mounting through hole corresponding to the first mounting through hole. The locking component includes a fastener, which is configured to pass through the third mounting through hole, each of the first mounting through holes, and the second mounting through hole in sequence when the liquid distribution through holes are connected in sequence to form the liquid distribution channel, and the first terminal module and the second terminal module are respectively installed at both ends of the liquid distribution channel, thereby fixing the first terminal module, the second terminal module, and each of the supply and return fluid components into one unit.

[0012] In one embodiment, the number of first mounting through holes in the supply and return fluid assembly is at least two, and each of the first mounting through holes is evenly arranged around the axis of the liquid distribution through hole. The number of second mounting through holes, the number of third mounting through holes, and the number of fasteners are all the same as the number of first mounting through holes in the liquid distribution module. Each of the second mounting through holes, each of the third mounting through holes, and each of the fasteners are set in a one-to-one correspondence with each of the first mounting through holes in the supply and return fluid assembly.

[0013] In one embodiment, the two ends of the liquid dispensing through hole extend to the two ends of the liquid dispensing module, the liquid dispensing interface is disposed on the side wall of the liquid dispensing through hole, and the two ends of the liquid dispensing module are respectively provided with a first positioning part and a second positioning part. One of the first terminal module and the second terminal module is provided with the first positioning part, and the other is provided with the second positioning part. The first positioning part is used to position and cooperate with the second positioning part.

[0014] In one embodiment, the first positioning part is configured as a positioning groove, and the second positioning part is configured as a positioning post. The outer contour shape of the positioning post is adapted to the inner contour shape of the positioning groove. One end of the liquid dispensing through hole in the liquid dispensing module is connected to the positioning groove, and the other end of the liquid dispensing through hole extends to the end face of the positioning post.

[0015] In one embodiment, the liquid dispensing device further includes a seal mounted on the inner wall of the positioning groove and configured to seal the outer wall of the positioning post and the inner wall of the positioning groove when the positioning post is inserted into the positioning groove.

[0016] In one embodiment, the inner wall of the positioning groove is provided with an annular mounting groove, and the seal is installed in the annular mounting groove.

[0017] In one embodiment, the first terminal module and / or the second terminal module are provided with a drain port, which is connected to the liquid distribution channel and is used to drain and vent the liquid distribution channel. The liquid distribution device also includes a valve, which is installed at the drain port and is used to control the drain port to open or close.

[0018] In one embodiment, the multi-chip heat dissipation component includes:

[0019] A base, wherein the base is provided with a receiving groove, and the inner wall of the receiving groove is provided with a liquid outlet hole;

[0020] The jetting section has a jetting cavity, and the first inner wall of the jetting section has a plurality of jetting holes. The first inner wall covers the opening of the receiving groove, and the second inner wall of the jetting section has a liquid inlet hole.

[0021] The cooling section includes multiple needle ribs disposed on the bottom wall of the receiving groove.

[0022] The aforementioned composite substrate multi-chip liquid cooling system addresses the thermal conductivity issue of integrating multiple advanced packaging structures into a single package by employing a novel composite substrate chip die with high thermal conductivity and efficient thermal expansion capabilities in localized hot spots. This composite substrate chip die comprises a diamond layer, a diamond / silicon composite bonding layer, a silicon layer, and a circuit layer. Compared to existing designs, its heat dissipation performance is improved by at least two times, effectively shortening the distance between the heat-generating points of each chip die and its packaged multi-chip heat dissipation component. This facilitates rapid heat transfer from the high thermal conductivity diamond layer to the multi-chip heat dissipation component for rapid cooling, minimizing thermal resistance and ensuring the reliability of the composite substrate chip heat dissipation packaging structure. Furthermore, to quickly deploy a compatible server cooling system that dissipates heat from servers equipped with the composite substrate multi-chip, ensuring normal server operation, the system utilizes a novel, easily maintained multi-chip heat dissipation component and its highly scalable parts for rapid and high-precision system deployment. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a liquid cooling system for a multi-chip composite substrate provided in an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of a component structure provided in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of a component structure provided in an embodiment of this application.

[0026] Figure 4 This is a schematic diagram of a component structure provided in an embodiment of this application.

[0027] Figure 5 This is a schematic diagram of a component structure provided in an embodiment of this application.

[0028] Figure 6 This is a schematic diagram of a component structure provided in an embodiment of this application.

[0029] Figure 7 This is a schematic diagram of a component structure provided in an embodiment of this application.

[0030] Figure 8 This is a schematic diagram of a component structure provided in an embodiment of this application.

[0031] Figure label:

[0032] 1: Circuit layer;

[0033] 2: Composite substrate chip die; 21: Silicon layer; 22: Diamond / silicon composite bonding layer; 23: Diamond layer; 24: Polished layer;

[0034] 3A: First thermally conductive layer; 3B: Second thermally conductive layer;

[0035] 800A: Multi-chip heat dissipation component; 8100: Base; 8100a: Receiving tank; 8100b: Liquid outlet; 8100c: Third ring groove;

[0036] 8200: Jet section; 8200a: Jet cavity; 8200b: First inner wall; 8200c: Second inner wall; 8200d: Liquid inlet; 8200e: Jet hole; 8210: Body; 8211: Jet component; 8211a: Through hole; 8211b: Second annular groove; 8212: Jet plate; 8212a: First annular groove; 8220: Cover plate;

[0037] 8300: Cooling section;

[0038] 8400: First sealing ring; 8410: Second sealing ring; 8420: Third sealing ring;

[0039] OX - First direction;

[0040] 610 / 620: Multi-chip packaging substrate;

[0041] 1000A: Support component; 100: Multi-chip heat dissipation packaging device with composite substrate;

[0042] 12000, Liquid supply and return module; 12100, Liquid supply and return assembly; 12110, Liquid distribution through hole; 12120, Liquid distribution interface; 12130, First mounting through hole; 12200, First terminal module; 12210, Main interface; 12220, Second mounting through hole; 12300, Second terminal module; 12310, Third mounting through hole; 12400, Locking assembly; 12410, Fastener; 12510, First positioning part; 12511, Positioning groove; 12512, Annular mounting groove; 12520, Second positioning part; 12521, Positioning post; 12530, Seal; 123: Heat exchange module; 124: Drive module. Detailed Implementation

[0043] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0044] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0045] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0047] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0049] Example 1

[0050] like Figure 1 As shown, this embodiment provides a liquid cooling heat dissipation system for a multi-chip composite substrate. The liquid cooling heat dissipation system for a multi-chip composite substrate includes a multi-chip heat dissipation packaging device 100, a first liquid supply and return module 12000B, a liquid return branch, a heat exchange module 123, a drive module 124, a liquid supply branch, and a second liquid supply and return module 12000A connected in sequence to form a cooling circulation loop. The multi-chip heat dissipation packaging device 100 includes a multi-chip heat dissipation packaging structure for the composite substrate, a multi-chip heat dissipation component 800A disposed on the multi-chip heat dissipation packaging structure for the composite substrate, and a support component 1000A disposed on the multi-chip heat dissipation packaging structure for the composite substrate and surrounding the multi-chip heat dissipation packaging structure for the composite substrate. The multi-chip heat dissipation packaging structure for the composite substrate includes a multi-chip packaging substrate 610 / 620, and at least one three-dimensional integrated memory chip 200A disposed on the multi-chip packaging substrate, a composite substrate chip die 2, and a basic logic layer.

[0051] The first / second supply and return fluid module 12000A / B includes at least one supply and return fluid assembly 12100. Each supply and return fluid assembly 12100 is provided with a liquid distribution through hole 12110 and a liquid distribution interface 12120 communicating with the liquid distribution through hole 12110. Two adjacent supply and return fluid assemblies 12100 are detachably connected and sealed together so that each liquid distribution through hole 12110 is sequentially connected to form a liquid distribution channel. A first terminal module 12200 is sealed and installed at one end of the liquid distribution channel and is provided with a main interface communicating with the liquid distribution channel. A second terminal module 12300 is sealed and installed at the other end of the liquid distribution channel and is used to close the liquid distribution channel.

[0052] Specifically, the liquid cooling system for multi-chip composite substrates described in this embodiment addresses the thermal conductivity issue of integrating multiple advanced packaging structures into a single package. It employs a novel composite substrate chip die with high thermal conductivity and efficient thermal expansion capabilities in localized hot spots. The composite substrate chip die 2 includes a diamond layer 23, a diamond / silicon composite bonding layer 22, a silicon layer 21, and a circuit layer 1. Compared to existing designs, its heat dissipation performance is improved by at least two times, effectively shortening the distance between the heat-generating points of each chip die and its packaged multi-chip heat dissipation component 800A. This facilitates rapid heat transfer from the highly thermally conductive diamond layer to the multi-chip heat dissipation component 800A for rapid cooling, minimizing thermal resistance and ensuring the reliability of the composite substrate chip heat dissipation packaging structure. On the other hand, in order to quickly build a suitable server heat dissipation system that can dissipate heat from the server or motherboard equipped with a multi-chip composite substrate in a timely manner and ensure the normal operation of the entire server or motherboard, the system adopts a new structural form and easy-to-maintain multi-chip heat dissipation component 800A and its highly scalable components for installation, so as to achieve rapid and high-precision system construction.

[0053] Specifically, such as Figures 2 to 3 As shown, to further meet the needs of artificial intelligence and AI scenarios, it is necessary to package different types of chips, such as the 3D integrated memory chip 200A (full name High Bandwidth Memory, abbreviated as HBM) and composite substrate chip dies, into a single package to further improve integration and miniaturization, thereby adapting to high-performance computing applications. On the other hand, since the diamond layer 23 of the existing composite substrate chip die 2 is extremely difficult to grind when packaging multi-chip heat dissipation components, it will lead to new problems such as unevenness on the contact surface between the diamond layer 23 and the heat dissipation component, resulting in excessive contact thermal resistance. This embodiment provides a novel composite substrate multi-chip heat dissipation packaging structure, which includes a multi-chip packaging substrate 610 / 620, and at least one 3D integrated memory chip 200A, a composite substrate chip die 2, and a basic logic layer disposed on the multi-chip packaging substrate 610 / 620.

[0054] The composite substrate chip die 2 includes a polishing layer 24, a diamond layer 23, a diamond / silicon composite bonding layer 22, a silicon layer 21, and a circuit layer 1.

[0055] The thickness of the polishing layer 24 ranges from 1% to 7% of the total thickness of the composite substrate chip die 2; the thickness of the diamond layer 23 ranges from 70% to 90% of the total thickness of the composite substrate chip die 2.

[0056] The thickness of the polishing layer 24 ranges from 1% to 7% of the total thickness of the composite substrate chip die (in other words, the thickness of the polishing layer 24 ranges from 1% / 2% / 3% / 4% / 5% / 6% / 7% of the total thickness of the composite substrate chip die, etc. Examples are not provided here). The thickness of the diamond layer 23 ranges from 70% to 90% of the total thickness of the composite substrate chip die 2 (in other words, the thickness of the diamond layer 23 can be 70% / 75% / 80% / 85% / 90% of the total thickness of the composite substrate chip die 2, etc. Examples are not provided here). The total thickness of the other diamond / silicon composite bonding layer 22, silicon layer 21, and circuit layer 1 ranges from 3% to 21% of the total thickness of the composite substrate chip die; (in other words, the total thickness of the other diamond / silicon composite bonding layer 22, silicon layer 21, and circuit layer 1 ranges from 3% / 5% / 8% / 10% / 13% / 15% / 18% / 20% / 21% of the total thickness of the composite substrate chip die, etc. These are not listed here individually).

[0057] Specifically, the thickness of the polishing layer 24 ranges from 5µm to 20µm; its material can be, but is not limited to, single metals such as silicon, aluminum, tin, copper, silver, gold, and indium, or their metal alloys or metal composites, which are easy to polish and thus ensure the flatness of the contact interface with the heat dissipation component. This achieves the goal of easily dissipating the heat of a multi-chip package containing at least one three-dimensional integrated memory chip 200A, a composite substrate chip die 2, and a basic logic layer 500 to the outside through the heat dissipation component without affecting the high thermal conductivity and excellent heat dissipation performance of the novel composite substrate chip die. It can also further reduce the contact thermal resistance between the composite substrate chip die and the heat dissipation component, as well as the packaging cost of the multi-chip overall package.

[0058] The thickness of the diamond / silicon composite bonding layer 22 ranges from 2 nm to 10 nm.

[0059] Specifically, the composite substrate chip die 2 described in this embodiment adopts a novel composite substrate with high thermal conductivity and efficient thermal expansion in local hot spots. The core part of this novel composite substrate includes a diamond layer 23, a diamond / silicon composite bonding layer 22, a silicon layer 21, and a circuit layer 1. The diamond / silicon composite bonding layer 22 is a bonding layer with high thermal conductivity and stable bonding between the atoms on the two solid surfaces, formed by bonding the diamond layer 23 and the silicon layer 21 at room temperature.

[0060] First, compared with the silicon substrate in the prior art, the heat dissipation performance of the core part of the new composite substrate is improved by at least 2 times, the reliability of the chip die is significantly improved, and the service life is significantly extended; wherein, the chip die (or chip DIE, or DIE) mentioned in this embodiment is an unpackaged semiconductor chip cut out individually from the wafer.

[0061] Secondly, because the core of the novel composite substrate uses a diamond layer 23 with a strong crystal structure and a diamond / silicon composite bonding layer 22 formed by bonding as the core of the chip substrate, it effectively blocks the penetration of metal ions, ensuring that the circuit layer 1 is not damaged by externally penetrated metal ions, thereby extending the service life of the chip die; it solves the problem that existing chip dies are damaged and fail due to the penetration of metal ions into the substrate by the upper structure.

[0062] Furthermore, relying on the high thermal conductivity and excellent electrical insulation of the core portion of the novel composite substrate, the product scalability of the chip die 2 is improved, and it is applicable to more scenarios.

[0063] Finally, compared with existing chip packaging, which uses a barrier layer in the thermally conductive layer to reduce the penetration of metal ions, this embodiment uses the novel composite substrate core, which not only has high thermal conductivity and a dense and stable crystal structure, but also effectively reduces the number of thermally conductive layers. This can effectively shorten the distance between the heat-generating point of the chip die and the heat dissipation component, which is conducive to quickly conducting the heat of the high thermal conductivity diamond layer 23 to the multi-chip heat dissipation component for rapid cooling, minimizing thermal resistance, and ensuring the reliability of the liquid cooling system of the composite substrate multi-chip.

[0064] Example 2

[0065] like Figure 2 and Figure 3As shown, the difference between this embodiment and Embodiment 1 is that, in order to further improve the system's heat dissipation efficiency and enable it to meet the heat dissipation requirements of more chip packages or multiple chips operating simultaneously at high clock frequencies under extreme conditions, this embodiment also designs a novel second heat dissipation component 800A. This further breaks through the heat dissipation performance of the multi-chip heat dissipation packaging structure on the composite substrate described in this embodiment, and can meet more extreme packaging and usage scenarios. Specifically, the multi-chip heat dissipation packaging structure also includes a second thermally conductive layer 3A and a second heat dissipation component sequentially disposed on the side of the three-dimensional integrated memory chip and the polished layer away from the diamond layer, as well as a support component disposed on the multi-chip packaging substrate and surrounding the three-dimensional integrated memory chip and the composite substrate chip die. The support component is disposed on the multi-chip packaging substrate to protect the three-dimensional integrated memory chip and the composite substrate chip die within the package from being squeezed by the second heat dissipation component.

[0066] Specifically, such as Figure 3 As shown in the exploded view, the second heat dissipation component 800A provided in this embodiment includes: a base 8100, a jet section 8200, and a cooling section 8300.

[0067] In the aforementioned second heat dissipation assembly 800A, the base 8100 has a receiving groove 8100a, and the inner wall of the receiving groove 8100a has a liquid outlet hole 8100b. The jetting section 8200 has a jetting cavity 8200a, the first inner wall 8200b of the jetting section 8200 has a plurality of jetting holes 8200e, the first inner wall 8200b covers the opening of the receiving groove 8100a, and the second inner wall 8200c of the jetting section 8200 has a liquid inlet hole 8200d. The cooling section 8300 includes a plurality of pin ribs 8320, and the pin ribs 8320 are disposed on the bottom wall of the receiving groove 8100a.

[0068] In the process of cooling at least one three-dimensional integrated memory chip 200A and composite substrate chip die in the chip heat dissipation packaging structure of the composite substrate, the second heat dissipation component 800A first attaches the side of the base 8100 away from the jet section 8200 to the upper surface of the second thermally conductive layer 3A of at least one three-dimensional integrated memory chip 200A and composite substrate chip die in the chip heat dissipation packaging structure of the composite substrate. Then, coolant is injected into the liquid inlet 8200d, the coolant enters the jet cavity 8200a, and then passes through the narrow jet hole 8200e to the needle ribs in the receiving groove 8100a at a high speed. The jet impingement enhances heat transfer. After the coolant completes heat transfer, it is discharged through the outlet hole 8100b. The jet section 8200 and the base 8100 are designed as separate units. Similarly, the cooling section 8300, which houses the tank 8100a, is also designed as a separate unit. When the pins in the cooling section 8300 become misaligned, bent, or damaged, the base 8100 and the jet section 8200 can be directly separated. The cooling section 8300 can then be removed for repair or replacement, thereby improving the utilization rate of the base 8100 and the jet section 8200. Furthermore, cooling sections 8300 with pins of different arrangements and shapes can be placed according to the actual needs of multi-chip packages.

[0069] like Figure 3 As shown in the exploded view, in one embodiment, the jet section 8200 includes a body 8210 and a cover plate 8220. The body 8210 has a jet cavity 8200a, the bottom wall of which is a first inner wall 8200b. The cover plate 8220 covers the opening of the jet cavity 8200a, and the side wall of the cover plate 8220 near the body 8210 is a second inner wall 8200c. The second inner wall 8200c has a liquid inlet hole 8200d, thereby making the liquid inlet hole 8200d and the jet hole 8200e... With parallel axes, the coolant enters the jet chamber 8200a through the inlet hole 8200d for buffering, and then directly impacts the jet hole 8200e on the bottom wall of the body 8210. Through the narrow jet hole 8200e, the coolant impacts the needle ribs in the receiving tank 8100a at a high speed to enhance heat exchange. After completing the heat exchange, the coolant is discharged through the outlet hole 8100b. The cover plate 8220 is designed separately from the body 8210, so the inside of the jet chamber can be cleaned or repaired by opening the cover plate 8220.

[0070] In one embodiment, the body 8210 includes a jetting element 8211 and a jetting plate 8212. The jetting element 8211 has a through hole 8211a. The side of the jetting plate 8212 near the jetting element 8211 is a first inner wall 8200b. The jetting plate 8212 has a plurality of jetting holes 8200e. The jetting plate 8212 and the cover plate 8220 respectively cover the openings at both ends of the through hole 8211a.

[0071] In this embodiment, the jetting component 8211 and the jetting plate 8212 are designed separately, so that the jetting plate 8212 with different specifications of jetting holes 8200e can be replaced. After the jetting plate 8212 and the cover plate 8220 cover the openings at both ends of the through hole 8211a respectively, the structure of the through hole 8211a is enclosed as the jetting cavity 8200a.

[0072] In one embodiment, the second heat dissipation assembly 800A further includes a first sealing ring 8400. The jet plate 8212 has a first annular groove 8212a, which surrounds a plurality of through holes 8211a. The first sealing ring 8400 is partially located in the first annular groove 8212a and abuts against one end face of the jet member 8211 away from the cover plate 8220. The first sealing ring 8400 seals the gap between the jet plate 8212 and the jet member 8211.

[0073] In one embodiment, the second heat dissipation assembly 800A further includes a second sealing ring 8410. The body 8210 has a second annular groove 8211b, that is, the jet component 8211 has a second annular groove 8211b. The second annular groove 8211b surrounds the opening of the jet cavity 8200a. The second sealing ring 8410 is partially located in the second annular groove 8211b. The second sealing ring 8410 abuts against the cover plate 8220, and seals the gap between the cover plate 8220 and the jet component 8211 through the second sealing ring 8410.

[0074] In one embodiment, the second heat dissipation assembly 800A further includes a third sealing ring 8420. The base 8100 has a third annular groove 8100c, which surrounds the opening of the receiving groove 8100a and the plurality of jet holes 8200e. The third sealing ring 8420 is partially located in the third annular groove 8100c and abuts against the jet portion 8200. Specifically, the third sealing ring 8420 abuts against the end of the jet plate 8212 away from the jet member 8211, and seals the gap between the jet plate 8212 and the base 8100 through the third sealing ring 8420.

[0075] In one embodiment, the liquid outlet 8100b is formed on the side wall of the receiving tank 8100a, and the first inner wall 8200b and the second inner wall 8200c are arranged opposite each other along the axial direction of the jet hole 8200e, so that the axis of the liquid inlet 8200d and the jet hole 8200e is perpendicular to the axis of the liquid outlet 8100b, so that the liquid can fully cool the cooling section 8300 and then be discharged through the liquid outlet 8100b.

[0076] In one embodiment, there are two sets of outlet holes 8100b, located on opposite sidewalls of the receiving tank 8100a along a first direction OX, which is perpendicular to the axial direction of the jet hole 8200e. There are also two sets of inlet holes 8200d, located at opposite ends of the second inner wall 8200c along the first direction OX. In this embodiment, the first direction OX is the length direction of the second heat dissipation component 800A. This allows the two sets of inlet holes 8200d and the two sets of outlet holes 8100b to respectively allow liquid to enter and exit at opposite ends of the second heat dissipation component 800A along the first direction OX, increasing the coolant flow rate and improving the cooling efficiency of the composite substrate chip heat dissipation packaging structure.

[0077] In one embodiment, the cooling section 8300 further includes a connecting plate. A plurality of pin ribs are evenly distributed on one side of the connecting plate, and the other side of the connecting plate abuts against the bottom wall of the receiving groove 8100a, so that the pin ribs are indirectly disposed on the bottom wall of the receiving groove 8100a. Both the pin ribs and the connecting plate have a three-period minimal curved surface structure. Alternatively, the pin ribs can be directly disposed within the receiving groove 8100a of the base 8100, without the connecting plate.

[0078] Preferably, the pin rib and the connecting plate are integrally formed. In other embodiments, the pin rib is separately disposed on the connecting plate and connected by snap-fit, welding, bonding, or other methods. In this embodiment, the pin rib and the connecting plate are integrally formed during processing after the shape is designed, thereby facilitating the removal and replacement of the cooling section 8300.

[0079] Specifically, the projection of the needle rib along the 8200e axis of the jet hole onto the connecting plate is trapezoidal, wavy, or other shapes. The porosity, cell unit size, and other parameters of the three-period minimal surface and TPMS structure can be designed separately according to the actual operating conditions. Specifically, the cell unit structure of the needle rib can be the Primitive (P-type) unit, which has good mechanical properties in the oblique diagonal direction, such as the (111) direction. The cell unit structure of the needle rib can also be I-WP (I-type), which has outstanding mechanical properties in the (100) axial direction and weaker performance in the oblique diagonal direction. The pore structure and fluid permeability of the I-type unit are suitable for the biomedical field, such as in artificial bone scaffolds, which can provide a suitable environment for tissue fluid flow and bone cell growth. It can also be used in heat exchanger structures that require fluid flow. The cell unit structure of the needle rib can also be Gyroid (G-type), which is a typical three-dimensional continuous double-connected structure with a smooth surface and no obvious edges. The advantages of this structure lie in its moderate specific surface area, balanced mechanical properties, and a combination of toughness and permeability. The cell unit structure of the needle-ribbed structure can also be Neovius (N-type), possessing a unique multi-connected 8211a gap structure, which often exhibits strong anisotropy in monoclinic crystal system designs. This characteristic makes it suitable for applications requiring directional control of mechanical properties. The cell unit structure of the needle-ribbed structure can also be one or more of the following: topological hybrid units, symmetric deformation units, and hierarchical units within the derived hybrid cell unit structure.

[0080] Specifically, the above components are connected by connecting members that are sequentially inserted through the cover plate 8220, the jetting member 8211, the jetting plate 8212 and the base 8100, so as to achieve tight contact and seal the gap between the components.

[0081] In the process of cooling at least one three-dimensional integrated memory chip 200A and the composite substrate substrate chip die in the chip heat dissipation packaging structure of the aforementioned second heat dissipation component 800A, the base 8100 is first attached to the surface of the part to be cooled on the side opposite to the jet section 8200. Then, coolant is injected into the liquid inlet 8200d through the cold source. The coolant enters the jet cavity 8200a and then passes through the narrow jet hole 8200e at a high speed to jet-impact the needle ribs in the receiving groove 8100a to enhance heat transfer. After the coolant completes the heat transfer, it exits through the outlet. Liquid is discharged from the orifice 8100b and returned to the cold source. Thus, through the separate design of the jet section 8200 and the base 8100, the cooling section 8300 that accommodates the tank 8100a is also separated from the base 8100. When the needle ribs in the cooling section 8300 are displaced, bent, or damaged, the base 8100 and the jet section 8200 can be directly separated, and then the cooling section 8300 can be taken out for repair and replacement. This improves the utilization rate of the base 8100 and the jet section 8200, and cooling sections 8300 with different arrangements and shapes of needle ribs can be placed according to actual cooling needs.

[0082] Example 3

[0083] like Figures 4 to 8 As shown, in order to improve the scalability of key components in the liquid cooling system of multi-chip composite substrates and achieve high-precision rapid assembly and stable operation of the system, this embodiment provides a modular, high-precision liquid supply and return module, specifically, as shown in... Figure 1 As shown, a cooling circulation loop is formed by connecting the multi-chip heat dissipation packaging device with the composite substrate, a first liquid supply and return module 12000B, a liquid return branch, a heat exchange module 123, a drive module 124, a liquid supply branch, and a second liquid supply and return module 12000A. In the multi-chip heat dissipation packaging device with the composite substrate, a low-temperature cooling medium in the multi-chip heat dissipation component 800A absorbs the heat generated by each chip within the multi-chip heat dissipation packaging structure of the composite substrate to form a high-temperature cooling medium. The high-temperature cooling medium flows into the heat exchange module 123 via the first liquid supply and return module 12000B for cooling and cooling down to form a low-temperature cooling medium. The cooled low-temperature cooling medium is then driven by the drive module 124 to the second liquid supply and return module 12000A, which then supplies liquid to each of the required multi-chip heat dissipation components 800A for circulating heat dissipation.

[0084] Specifically, the supply and return liquid module 12000 includes a supply and return liquid assembly 12100, a first terminal module 12200, and a second terminal module 12300. The supply and return liquid assembly 12100 is at least one. Each supply and return liquid assembly 12100 is provided with a liquid distribution through-hole 12110 and a liquid distribution interface 12120 communicating with the liquid distribution through-hole 12110. Adjacent supply and return liquid assemblies 12100 are detachably connected and sealed together, so that the liquid distribution through-holes 12110 are sequentially connected to form a liquid distribution channel. The first terminal module 12200 is sealed and installed at one end of the liquid distribution channel and is provided with a main interface 12210 communicating with the liquid distribution channel. The second terminal module 12300 is sealed and installed at the other end of the liquid distribution channel and is used to close the liquid distribution channel.

[0085] In the above embodiment, the supply and return fluid module 12000, including the supply and return fluid components 12100, the first terminal module 12200, and the second terminal module 12300, are all modular structures that can be pre-fabricated in the factory. This allows users to select different numbers of supply and return fluid components 12100 according to actual site layout requirements. Each supply and return fluid component 12100 is then assembled with the first terminal module 12200 and the second terminal module 12300 to obtain a compatible supply and return fluid module 12000. This eliminates the need for one-time mold manufacturing and customized complex dispensing structures for each heat-generating device, saving costs. It offers flexible installation and can be adapted to servers from different manufacturers or rack layouts, improving the adaptability and scalability of the supply and return fluid module 12000. Furthermore, when a dispensing branch or valve malfunctions, only the corresponding module needs to be replaced, reducing maintenance costs, shortening maintenance cycles, and enhancing the practicality of the supply and return fluid module 12000.

[0086] It should be noted that different types and sizes of connectors or devices can be installed at the liquid distribution interface 12120 to meet different needs. Specifically, in this embodiment, a pagoda connector can be installed at the liquid distribution interface 12120, which connects the supply and return liquid assembly 12100 and the liquid distribution pipe. Similarly, a chuck can be installed at the main interface 12210, which connects the first terminal module 12200 and the main flow channel. In other embodiments, valve modules, flow meters, temperature control devices, etc., can also be installed at the liquid distribution interface 12120.

[0087] The two adjacent supply and return fluid assemblies 12100 can be connected by screwing, plugging, snapping, or other detachable means. The first terminal module 12200 can be installed at one end of the distribution channel by screwing, plugging, snapping, or other detachable means. The second terminal module 12300 can be installed at the other end of the distribution channel by screwing, plugging, snapping, or other detachable means.

[0088] Furthermore, the supply and return fluid module 12000 also includes a locking component 12400. The locking component 12400 is configured to fix the first terminal module 12200, the second terminal module 12300, and each supply and return fluid component 12100 as a single unit when the various dispensing through holes 12110 are sequentially connected to form a dispensing channel, and the first terminal module 12200 and the second terminal module 12300 are respectively installed at both ends of the dispensing channel. Thus, no relative movement occurs between the first terminal module 12200 and the supply and return fluid component 12100, between two adjacent supply and return fluid components 12100, or between the supply and return fluid component 12100 and the second terminal module 12300, ensuring the dispensing channel remains continuous and stable, and improving the reliability of the supply and return fluid module 12000.

[0089] The locking component 12400 can be configured as a snap-fit ​​locking structure, a binding locking structure, a clamping locking structure, or other locking structures.

[0090] Optionally, each supply and return fluid assembly 12100 is provided with a first mounting through hole 12130 spaced apart from the dispensing through hole 12110. The first terminal module 12200 is provided with a second mounting through hole 12220 corresponding to the first mounting through hole 12130. The second terminal module 12300 is provided with a third mounting through hole 12310 corresponding to the first mounting through hole 12130. The locking assembly 12400 includes a fastener 12410. The fastener 12410 is configured to pass through the third mounting through hole 12310, each of the first mounting through holes 12110 and forming a dispensing channel, and the first terminal module 12200 and the second terminal module 12300 are respectively installed at both ends of the dispensing channel, thereby fixing the first terminal module 12200, the second terminal module 12300 and each supply and return fluid assembly 12100 into one unit. Thus, after the first terminal module 12200, each fluid supply and return component 12100 and the second terminal module 12300 are aligned and assembled into one unit, the fasteners 12410 are passed through the first mounting through hole 12130, each first mounting through hole 12130 and the second mounting through hole 12220 respectively for fastening, thereby achieving the effect of limiting and locking, and improving the reliability of the fluid supply and return module 12000.

[0091] Specifically, in this embodiment, the fastener 12410 includes a bolt and a first nut. One end of the bolt abuts against the third terminal module, and the other end of the bolt passes sequentially through the third mounting through hole 12310, each of the first mounting through holes 12130 and the second mounting through hole 12220, and is threadedly connected to the first nut. The first nut is located on the side of the first terminal module 12200 away from the second terminal module 12300, and abuts against the first terminal module 12200.

[0092] In other embodiments, the fastener 12410 may also include a screw, a second nut, and a third nut. The screw passes sequentially through the third mounting through hole 12310, each of the first mounting through holes 12130, and the second mounting through hole 12220. Both ends of the screw are threadedly connected to the second nut and the third nut, respectively. The second nut and the third nut are located on opposite sides of the first terminal module 12200 and the second terminal module 12300, respectively, and engage in corresponding abutment with the first terminal module 12200 and the second terminal module 12300.

[0093] The number of first mounting through holes 12130 on the fluid supply and return assembly 12100, the number of second mounting through holes 12220 on the first terminal module 12200, the number of third mounting through holes 12310 on the second terminal module 12300, and the number of fasteners 12410 can all be flexibly adjusted according to actual usage needs.

[0094] like Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, specifically in this embodiment, the number of first mounting through holes 12130 in the supply and return fluid assembly 12100 is at least two, and each first mounting through hole 12130 is evenly arranged around the axis of the dispensing through hole 12110. The number of second mounting through holes 12220, the number of third mounting through holes 12310, and the number of fasteners 12410 are all the same as the number of first mounting through holes 12130 in the supply and return fluid assembly 12100. Each second mounting through hole 12220, each third mounting through hole 12310, and each fastener 12410 are all set in a one-to-one correspondence with each first mounting through hole 12130 in the supply and return fluid assembly 12100. In this way, there are multiple installation postures between two adjacent supply and return fluid assemblies 12100, making the orientation of the dispensing interface 12120 on the supply and return fluid assembly 12100 adjustable to meet the needs of different layout scenarios and improve the practicality of the supply and return fluid module 12000.

[0095] Specifically, the axis of the first mounting through hole 12130 is parallel to the axis of the dispensing through hole 12110. There are four first mounting through holes 12130, four second mounting through holes 12220, and four third mounting through holes 12310. The four first mounting through holes 12130 are correspondingly located at the four corners of the supply and return liquid assembly 12100, the four second mounting through holes 12220 are correspondingly located at the four corners of the first terminal module 12200, and the four third mounting through holes 12310 are correspondingly located at the four corners of the second terminal module 12300. Thus, each dispensing interface 12120 can face any of the four sides surrounding the supply and return liquid assembly 12100 as needed.

[0096] In one embodiment, the two ends of the liquid dispensing through-hole 12110 extend to the two ends of the liquid supply and return assembly 12100, respectively, and the liquid dispensing interface 12120 is disposed on the sidewall of the liquid dispensing through-hole 12110. The two ends of the liquid supply and return assembly 12100 are respectively provided with a first positioning part 12510 and a second positioning part 12520. One of the first terminal module 12200 and the second terminal module 12300 is provided with the first positioning part 12510, and the other is provided with the second positioning part 12520. The first positioning part 12510 is used for positioning and cooperating with the second positioning part 12520. Thus, the first positioning part 12510 and the second positioning part 12520 can play a positioning role when the first terminal module 12200 is assembled with the supply and return liquid assembly 12100, so as to ensure that the main interface 12210 can be sealed and connected to the liquid distribution channel. The first positioning part 12510 and the second positioning part 12520 can play a positioning role when two adjacent supply and return liquid assemblies 12100 are assembled, so as to ensure that two adjacent liquid distribution holes 12110 are aligned and sealed and connected. The first positioning part 12510 and the second positioning part 12520 can play a positioning role when the supply and return liquid assembly 12100 is assembled with the second terminal module 12300, so as to ensure that the second terminal module 12300 can close the liquid distribution channel, thereby improving the reliability of the supply and return liquid module 12000.

[0097] One of the first positioning part 12510 and the second positioning part 12520 can be configured as a positioning groove, a positioning hole or other positioning structure, and the other of the first positioning part 12510 and the second positioning part 12520 can be configured as a positioning protrusion, a positioning post or other positioning structure.

[0098] Furthermore, the first positioning part 12510 is configured as a positioning groove 12511. The second positioning part 12520 is configured as a positioning post 12521. The outer contour shape of the positioning post 12521 is adapted to the inner contour shape of the positioning groove 12511. One end of the liquid distribution through hole 12110 in the liquid supply and return assembly 12100 communicates with the positioning groove 12511, and the other end of the liquid distribution through hole 12110 extends to the end face of the positioning post 12521. In this way, the automatic alignment and anti-misalignment between modules are achieved through the cooperation of the positioning groove 12511 and the positioning post 12521, improving the assembly convenience and reliability of the liquid supply and return module 12000.

[0099] In this specific embodiment, the positioning groove 12511 has a circular cross-section perpendicular to its own axis.

[0100] like Figure 6 and Figure 8As shown, optionally, the supply and return fluid module 12000 also includes a seal 12530. The seal 12530 is mounted on the inner wall of the positioning groove 12511 and is configured to seal the outer wall of the positioning post 12521 and the inner wall of the positioning groove 12511 when the positioning post 12521 is inserted into the positioning groove 12511. Thus, the positioning post 12521 can deform the seal 12530 when inserted into the positioning groove 12511, enhancing the sealing performance between adjacent modules and forming a reliable liquid seal. This ensures that liquid in the distribution channel does not leak from the connection between adjacent modules, improving the reliability of the supply and return fluid module 12000.

[0101] Among them, the sealing element 12530 can be configured as a sealing ring, sealing sleeve or other sealing structure.

[0102] Specifically, in this embodiment, the inner wall of the positioning groove 12511 is provided with an annular mounting groove 12512, and the sealing member 12530 is installed in the annular mounting groove 12512. In this way, the sealing member 12530 can be pre-installed in the annular mounting groove 12512 to ensure that when the positioning post 12521 is inserted into the positioning groove 12511, the sealing member 12530 is stably and reliably filled between the outer wall of the positioning post 12521 and the inner wall of the positioning groove 12511, thereby improving the reliability of the fluid supply and return module 12000.

[0103] In this specific embodiment, two adjacent modules are in surface contact to further improve the sealing performance between them.

[0104] In one embodiment, the first terminal module 12200 and / or the second terminal module 12300 are provided with drain ports. The drain ports communicate with the liquid distribution channel and are used to drain and vent the liquid distribution channel. The supply and return liquid module 12000 also includes a valve installed at the drain port and used to control the opening or closing of the drain port. Thus, the supply and return liquid module 12000 can drain or vent liquid through the drain ports according to actual usage needs, thereby improving the practicality of the supply and return liquid module 12000.

[0105] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0106] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A liquid cooling heat dissipation system for multi-chip composite substrates, characterized in that, The cooling loop comprises a multi-chip heat dissipation packaging device with a composite substrate, a first liquid supply and return module, a liquid return branch, a heat exchange module, a drive module, a liquid supply branch, and a second liquid supply and return module, which are connected in sequence; wherein... The multi-chip heat dissipation packaging device of the composite substrate includes a multi-chip heat dissipation packaging structure of the composite substrate, a multi-chip heat dissipation component disposed on the multi-chip heat dissipation packaging structure of the composite substrate, and a support component disposed on the multi-chip heat dissipation packaging structure of the composite substrate and surrounding the multi-chip heat dissipation packaging structure of the composite substrate; wherein, the multi-chip heat dissipation packaging structure of the composite substrate includes a multi-chip packaging substrate, and at least one three-dimensional integrated memory chip, a composite substrate chip die, and a basic logic layer disposed on the multi-chip packaging substrate. The first / second supply and return fluid module includes at least one supply and return fluid assembly. Each supply and return fluid assembly is provided with a liquid distribution through hole and a liquid distribution interface communicating with the liquid distribution through hole. Two adjacent supply and return fluid assemblies are detachably connected and sealed together so that each liquid distribution through hole is sequentially connected to form a liquid distribution channel. A first terminal module is sealed and installed at one end of the liquid distribution channel and is provided with a main interface communicating with the liquid distribution channel. A second terminal module is sealed and installed at the other end of the liquid distribution channel and is used to close the liquid distribution channel.

2. The liquid cooling heat dissipation system for multi-chip composite substrates according to claim 1, characterized in that, The multi-chip heat dissipation packaging structure of the composite substrate includes a multi-chip packaging substrate, at least one three-dimensional integrated memory chip disposed on the multi-chip packaging substrate, a composite substrate chip die, and a basic logic layer. The composite substrate chip die includes a polishing layer, a diamond layer, a diamond / silicon composite bonding layer, a silicon layer, and a circuit layer. The thickness of the polishing layer ranges from 1% to 7% of the total thickness of the composite substrate chip die; the thickness of the diamond layer ranges from 70% to 90% of the total thickness of the composite substrate chip die. Preferably, the thickness of the polishing layer ranges from 5 μm to 20 μm.

3. The liquid cooling heat dissipation system for multi-chip composite substrates according to claim 1, characterized in that, The liquid dispensing device further includes a locking component, which is configured to fix the first terminal module, the second terminal module, and each of the liquid dispensing modules into one unit when each of the liquid dispensing through holes is sequentially connected to form the liquid dispensing channel, and the first terminal module and the second terminal module are respectively installed at both ends of the liquid dispensing channel.

4. The liquid cooling heat dissipation system for multi-chip composite substrates according to claim 3, characterized in that, Each of the fluid supply and return components is provided with a first mounting through hole spaced apart from the fluid distribution through hole. The first terminal module is provided with a second mounting through hole corresponding to the first mounting through hole. The second terminal module is provided with a third mounting through hole corresponding to the first mounting through hole. The locking component includes a fastener. The fastener is configured to pass through the third mounting through hole, each of the first mounting through holes, and the second mounting through hole in sequence when the fluid distribution through holes are connected in sequence to form the fluid distribution channel, and the first terminal module and the second terminal module are respectively installed at both ends of the fluid distribution channel, thereby fixing the first terminal module, the second terminal module, and each of the fluid supply and return components into one unit.

5. The liquid cooling heat dissipation system for multi-chip composite substrates according to claim 4, characterized in that, The number of first mounting through holes in the fluid supply and return assembly is at least two, and each of the first mounting through holes is evenly arranged around the axis of the fluid distribution through hole. The number of second mounting through holes, the number of third mounting through holes, and the number of fasteners are all the same as the number of first mounting through holes in the fluid distribution module. Each of the second mounting through holes, each of the third mounting through holes, and each of the fasteners are set to correspond one-to-one with each of the first mounting through holes in the fluid supply and return assembly.

6. The liquid cooling heat dissipation system for multi-chip composite substrates according to any one of claims 1 to 5, characterized in that, The two ends of the liquid dispensing through hole extend to the two ends of the liquid dispensing module, and the liquid dispensing interface is disposed on the side wall of the liquid dispensing through hole. The two ends of the liquid dispensing module are respectively provided with a first positioning part and a second positioning part. One of the first terminal module and the second terminal module is provided with the first positioning part, and the other is provided with the second positioning part. The first positioning part is used to position and cooperate with the second positioning part.

7. The liquid cooling heat dissipation system for multi-chip composite substrates according to claim 6, characterized in that, The first positioning part is configured as a positioning groove, and the second positioning part is configured as a positioning post. The outer contour shape of the positioning post is adapted to the inner contour shape of the positioning groove. One end of the liquid dispensing through hole in the liquid dispensing module is connected to the positioning groove, and the other end of the liquid dispensing through hole extends to the end face of the positioning post.

8. The liquid cooling heat dissipation system for multi-chip composite substrates according to claim 7, characterized in that, The liquid separation device further includes a sealing element, which is installed on the inner wall of the positioning groove and configured to seal the outer wall of the positioning column and the inner wall of the positioning groove when the positioning column is inserted into the positioning groove.

9. The liquid cooling heat dissipation system for multi-chip composite substrates according to claim 8, characterized in that, The inner wall of the positioning groove is provided with an annular mounting groove, and the seal is installed in the annular mounting groove.

10. The liquid cooling heat dissipation system for multi-chip composite substrates according to any one of claims 1 to 5, characterized in that, The first terminal module and / or the second terminal module are provided with a drain port, which is connected to the liquid distribution channel and is used to drain liquid and vent air from the liquid distribution channel. The liquid distribution device also includes a valve, which is installed at the drain port and is used to control the opening or closing of the drain port.

11. The liquid cooling heat dissipation system for multi-chip composite substrates according to any one of claims 1 to 10, characterized in that, The multi-chip heat dissipation component includes: A base, wherein the base is provided with a receiving groove, and the inner wall of the receiving groove is provided with a liquid outlet hole; The jetting section has a jetting cavity, and the first inner wall of the jetting section has a plurality of jetting holes. The first inner wall covers the opening of the receiving groove, and the second inner wall of the jetting section has a liquid inlet hole. The cooling section includes multiple needle ribs disposed on the bottom wall of the receiving groove.

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